CN203569176U - Mask plate and mask component for evaporation plating - Google Patents
Mask plate and mask component for evaporation plating Download PDFInfo
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- CN203569176U CN203569176U CN201320617777.3U CN201320617777U CN203569176U CN 203569176 U CN203569176 U CN 203569176U CN 201320617777 U CN201320617777 U CN 201320617777U CN 203569176 U CN203569176 U CN 203569176U
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- evaporation
- mask plate
- hole
- mask
- evaporation plating
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Abstract
The utility model discloses a mask plate for evaporation plating. The mask plate comprises a mask plate body and an evaporation plating hole formed in the mask plate body, wherein the evaporation plating hole penetrates through the mask plate body, the edge line of the evaporation plating hole on the cross section where the central axis of the evaporation plating hole is positioned is external-expansion horn-shaped, and the hole wall of the evaporation plating hole and the plate surface of the mask plate body form an included angle of 30-60 degrees. With the mask plate for evaporation plating, provided by the utility model, the blocking of the hole wall of the evaporation plating hole to evaporation plating materials is reduced in the evaporation plating process, evaporation plating process has no evaporation plating dead angle, the thickness of evaporation plating layers is uniform, and the evaporation plating quality is improved.
Description
Technical field
The utility model relates to a kind of evaporation mask plate, is specifically related to the mask plate that a kind of OLED evaporation is used.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode; OLED) indicating meter has a series of advantages such as independently luminous, low-voltage direct-current drives, entirely solidifies, visual angle is wide, color is abundant, compare with liquid-crystal display, OLED indicating meter does not need backlight, visual angle is large, power is low, its response speed can reach 1000 times of liquid-crystal display, and its manufacturing cost is but lower than the liquid-crystal display of equal resolving power.Therefore, OLED displaying appliance has broad application prospects, and becomes gradually the following 20 years the fastest novel technique of display of growth.
The making of the organic layer material in OLED structure need to be used the mask plate that evaporation is used, tradition is made mask plate by two-sided etch process, the schematic cross-section in mask plate evaporation hole as shown in Figure 1, 1 is the ito surface (one side contacting with ITO deposition substrate) of mask plate, 2 is the evaporation face one side of vapor deposition source (towards) of mask plate, 11 is the evaporation hole of mask plate, the cross section in evaporation hole 11 is calabash shaped, evaporation hole 11 is the bad control of size of the size L in deposition aperture effectively, cause the precision in evaporation hole not high, and the size in evaporation hole is difficult to accomplish less, utilize the dead angle of mask plate evaporation hole 12(mask plate of ito surface in evaporate process that two-sided etching makes simultaneously) locate to form the dead angle of evaporation layer, cause evaporation layer thickness uneven, affect evaporating quality.
The utility model is mainly to propose a kind of evaporation mask plate for above problem, solves preferably the above problem.
Utility model content
In view of this, main purpose of the present utility model is to provide a kind of evaporation mask plate, and the hole wall that reduces evaporation hole blocks deposition material, and in evaporate process, does not have the dead angle of evaporation, the even thickness of evaporation layer, thus improve evaporating quality.
The utility model provides a kind of evaporation mask plate, comprise mask plate body and be formed on the evaporation hole on described mask plate body, described mask plate body is run through in described evaporation hole, it is characterized in that: on the cross section at central axis place, described evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out.
Further, evaporation is 8～80 μ m with the thickness of mask plate.
Further, evaporation is 15～50 μ m with the thickness of mask plate.
Further, evaporation is 25～35 μ m with the thickness of mask plate.
Preferably, evaporation is 30 μ m with the thickness of mask plate.
Further, the plate face of the hole wall in evaporation hole and mask plate body is 30～60 ° of angles.
Further, evaporation hole is arranged on mask plate body in the mode of array, adapts with the organic membrane deposition region of deposition substrate.
Further, evaporation is prepared by electroforming mode with mask plate.
The utility model also provides a kind of mask assembly, comprises mask frame and evaporation mask plate described above, it is characterized in that, described evaporation is fixed on described mask frame with mask plate.
Further, mask plate is fixed on described mask frame by laser welding or bonding way.
The beneficial effects of the utility model are, on the cross section at central axis place, evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out, the plate face of the hole wall in evaporation hole and mask plate body is 30～60 ° of angles, can reduce hole wall the blocking deposition material in evaporation hole, and in evaporate process, there is not the dead angle of evaporation, the even thickness of evaporation layer.
The aspect that the utility model is additional and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage will become from the following description of the accompanying drawings of embodiments and obviously and easily understand, wherein:
Figure 1 shows that the schematic cross-section in traditional double facet etch making mask plate evaporation hole;
Figure 2 shows that mask plate integral planar structural representation;
Figure 3 shows that in Fig. 2 the schematic cross-section along A-A direction;
Figure 4 shows that 30 part enlarged diagrams in Fig. 3;
Figure 5 shows that mask plate integral planar structural representation;
Figure 6 shows that 50 part enlarged diagrams in Fig. 5;
Figure 7 shows that 50 part enlarged diagrams in Fig. 5;
Figure 8 shows that the cross section enlarged diagram in evaporation hole in Fig. 6 and Fig. 7;
Figure 9 shows that mask assembly two dimensional structure schematic diagram;
Figure 10 shows that evaporation schematic cross-section;
Figure 11 shows that the schematic cross-section after core pad pasting;
Figure 12 shows that exposure schematic cross-section;
Figure 13 shows that the schematic cross-section after development;
Figure 14 shows that the schematic cross-section after electroforming for the first time;
Figure 15 shows that the schematic cross-section after electroforming for the second time;
Figure 16 shows that the schematic cross-section that the electroformed layer of electroforming is for the second time peeled off;
Figure 17 shows that the enlarged diagram of 160 parts in Figure 16.
In Fig. 1,1 is ito surface, and 2 is evaporation face, the 11 evaporation holes that are mask plate, and 12 dead angles that are mask plate, L is the size that evaporation hole effectively deposits aperture;
In Fig. 2,20 is mask plate body, and 21 is evaporation hole, and 22 is evaporation mask plate, and A-A is for treating Anatomical observation direction;
In Fig. 3,3 is ito surface, and 4 is evaporation face, and 30 for waiting to amplify observation part;
In Fig. 4, θ is the angle of the hole wall in evaporation hole and the plate face of mask plate body;
In Fig. 5,50 amplify observation part for waiting, 51 is mask pattern;
In Fig. 6, B-B is for treating Anatomical observation direction;
In Fig. 7, C-C is for treating Anatomical observation direction;
In Fig. 9,90 is mask frame;
In Figure 10,101 is deposition substrate, and 102 is bracing frame, and 103 is vapor deposition source;
In Figure 11,110 is film, and 111 is core;
In Figure 12,120 is the film after exposure;
In Figure 13,130 is the core region of exposing after developing;
In Figure 14,140 is the electroformed layer of electroforming for the first time;
In Figure 16,160 for waiting to amplify observation part.
Embodiment
Describe below with reference to accompanying drawings embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the utility model, and can not be interpreted as restriction of the present utility model.
According to embodiment of the present utility model, shown in figure 2～Fig. 8, the evaporation that the utility model provides comprises mask plate body 20 and is formed on the evaporation hole 21 on mask plate body with mask plate 22, mask plate body is run through in described evaporation hole 21, on the cross section at 21 central axis places, evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out.
According to an embodiment of the present utility model, with reference to figure 2～the Figure 4 shows that evaporation mask plate in large size evaporation hole, Figure 2 shows that mask plate integral planar structural representation for evaporation, evaporation comprises mask plate body 20 and evaporation hole 21 with mask plate 22, Figure 3 shows that in Fig. 2 along A-A direction schematic cross-section, in Fig. 3,3 is ito surface, 4 is evaporation face, 30 part enlarged diagrams as shown in Figure 4, on the cross section at 21 central axis places, evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out, in Fig. 4, θ is the angle of the hole wall in evaporation hole 21 and the plate face of mask plate body 20, the scope at θ angle is 30 °～60 °.In Fig. 2, evaporation hole 21 is arranged on mask plate body 20 in the mode of array, and evaporation hole 21 adapts with the organic membrane deposition region of deposition substrate.
According to another embodiment of the present utility model, with reference to figure 5～the Figure 8 shows that evaporation mask plate in small size evaporation hole, Figure 5 shows that mask plate integral planar structural representation for evaporation, evaporation comprises mask plate body 20 with mask plate 22, mask plate body 20 is provided with mask pattern 51, is provided with the evaporation hole 21 arranging with array way in mask pattern 51.
Figure 6 shows that the enlarged diagram of a kind of structure of 50 part mask pattern ito surface in Fig. 5, in Fig. 6, evaporation hole 21 is arranged on mask plate body 20 for the mode of little opening with array, in Fig. 6 along the cross section enlarged diagram of B-B direction as shown in Figure 8.
Figure 7 shows that the enlarged diagram of the another kind of structure of mask pattern ito surface in Fig. 5, the opening that in Fig. 7, evaporation hole 21 is strip, along the cross section enlarged diagram of C-C direction as shown in Figure 8.
Be illustrated in figure 8 cross section, evaporation hole shown in Fig. 6 and Fig. 7 enlarged diagram, on the cross section at 21 central axis places, evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out, and θ is the angle of the hole wall in evaporation hole 21 and the plate face of mask plate body 20, and the scope at θ angle is 30 °～60 °.
According to embodiment more of the present utility model, evaporation is 8～80 μ m with the thickness of mask plate 22.
According to embodiment more of the present utility model, evaporation is 15～50 μ m with the thickness of mask plate 22.
According to embodiment more of the present utility model, evaporation is 25～35 μ m with the thickness of mask plate 22.
Preferably, evaporation is 30 μ m with the thickness of mask plate 22.
Evaporation can be arranged in 8～80 μ m scopes with the thickness of mask plate 22, for example 40 μ m, 35 μ m, 25 μ m, 50 μ m, 60 μ m, 80 μ m.Also can be arranged on beyond 8～80 μ m scopes, for example 90 μ m, 100 μ m.
According to embodiment more of the present utility model, evaporation is prepared by electroforming mode with mask plate, the relatively good control of size in effective deposition aperture in the mask plate evaporation hole that the relative etch process of mask plate of preparing by electrocasting method is made, evaporation is high by evaporation hole 21 dimensional precisioies of mask plate 22.
According to embodiment of the present utility model, the utility model also provides a kind of mask assembly, and as shown in Figure 9, mask assembly comprises mask frame 90 and mask plate 22 for evaporation described above, and evaporation is fixed on mask frame 90 with mask plate 22.
According to embodiment of the present utility model, evaporation is fixed on mask frame 90 by laser welding or bonding way with mask plate 22.
With reference to Figure 10, for evaporation schematic diagram, mask assembly is fixed on bracing frame 102, and evaporation is adjacent to deposition substrate 101 with the ito surface of mask plate 22, and the organic materials of vapor deposition source 103 transmitting is used the evaporation hole of mask plate 22 to be deposited on by evaporation and on substrate 101, formed predetermined organic material layer.
The invention also discloses a kind of preparation method of mask plate, preparation process is: core pad pasting → exposure → development → mono-time electroforming → aftertreatment 1 → secondary electroforming → aftertreatment 2, and concrete steps are as follows:
S1, core pad pasting: Figure 11 shows that the schematic cross-section that film 110 is overlayed or is coated to core 111 one sides, described core 111 passes through the processing such as sandblast, cleaning before step of membrane sticking, the impurity of removing core pad pasting one side, makes the one side of core pad pasting totally smooth;
S2, exposure: through step of exposure, by the film exposure of default evaporation bore region, as shown in figure 12,120 is the film (being exposed film) after exposure;
S3, development: Figure 13 shows that development schematic cross-section, through development step, developing solution and unexposed film reaction, remove unexposed film and expose core region 130, exposed film 120 continues to retain;
S4, an electroforming: after an electroforming step, form one deck electroformed layer 140, as shown in figure 14, the thickness of the thickness of electroformed layer 140 and film 110 is suitable, and preferably, the thickness of electroformed layer 140 equates with the thickness of film 110;
After S5,1: electroforming step of aftertreatment, carry out aftertreatment 1 step, aftertreatment 1 step can be standing or baking, by aftertreatment 1 step, can make the electroformed layer of twice electroforming have certain bonding force can make again the electroformed layer of secondary electroforming strip down from the electroformed layer of an electroforming, conventionally time of repose is 5～30min, and baking time is set according to specific environment;
S6, secondary electroforming: Figure 15 shows that the schematic cross-section after electroforming for the second time, the electroformed layer of secondary electroforming is the body 20 of mask plate, in secondary electroforming process, the evaporation hole 21 of mask plate forms at exposed film 120 places, the area of the one side that evaporation hole 21 contacts with exposed film 120 is less than the area of exposed film 120, on the cross section at central axis place, evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out.
S7, aftertreatment 2: aftertreatment 2 steps comprise peel off, cleaning step, through strip step, secondary electroformed layer 20 is stripped down from an electroformed layer 140, through cleaning step by secondary electroformed layer 20 wash cleans, Figure 16 shows that the schematic cross-section after second layer electroformed layer is peeled off, 160 amplifier section as shown in figure 17.
Wherein, in an electroforming (S4) and secondary electroforming (S6) step, the concentration parameter of electroforming solution is as follows:
Single nickel salt 220～260g/L
Nickelous chloride 30～50g/L
Boric acid 40～50 g/L
Ferrous sulfate 35～45g/L
Electroforming material is magnetic nickel or nickel-bass alloy material.Nickel-bass alloy material is a kind of in Rhometal, nickel cobalt (alloy), Perminvar.
The additive of electroforming solution comprises:
Stablizer 0.5～5ml/L
Wetting agent 0.5～5ml/L
Agent 0.5～5ml/L walks
By mask plate provided by the utility model, on the cross section at central axis place, evaporation hole, it is horn-like that the edge line in evaporation hole 21 is the formula of extending out, the plate face of the hole wall in evaporation hole and mask plate body 20 is 30～60 ° of angles, can reduce hole wall the blocking deposition material in evaporation hole 21, and in evaporate process not at the dead angle of evaporation, the even thickness of evaporation layer.
Although embodiment of the present utility model is described in detail with reference to a plurality of illustrative examples of the present utility model, but it must be understood that, those skilled in the art can design multiple other improvement and embodiment, these improve and embodiment by within dropping on the spirit and scope of the utility model principle.Particularly, within the scope of aforementioned open, accompanying drawing and claim, can aspect the layout of component and/or subordinate composite configuration, make rational modification and improvement, and can not depart from spirit of the present utility model.Except modification and the improvement of component and/or layout aspect, its scope is limited by claims and equivalent thereof.
Claims (10)
1. an evaporation mask plate, comprise mask plate body and be formed on the evaporation hole on described mask plate body, described mask plate body is run through in described evaporation hole, it is characterized in that: on the cross section at central axis place, described evaporation hole, it is horn-like that the edge line in described evaporation hole is the formula of extending out.
2. evaporation mask plate according to claim 1, is characterized in that described evaporation is 8～80 μ m with the thickness of mask plate.
3. evaporation mask plate according to claim 1, is characterized in that described evaporation is 15～50 μ m with the thickness of mask plate.
4. evaporation mask plate according to claim 1, is characterized in that described evaporation is 25～35 μ m with the thickness of mask plate.
5. evaporation mask plate according to claim 1, is characterized in that described evaporation is 30 μ m with the thickness of mask plate.
6. according to the evaporation mask plate described in claim 2,3,4 or 5, it is characterized in that the hole wall in described evaporation hole and the plate face of described mask plate body are 30 °～60 ° angles.
7. evaporation mask plate according to claim 1, is characterized in that, described evaporation hole is arranged on described mask plate body in the mode of array, adapts with the organic membrane deposition region of deposition substrate.
8. evaporation mask plate according to claim 1, is characterized in that, described evaporation is prepared by electroforming mode with mask plate.
9. a mask assembly, comprises the evaporation mask plate described in mask frame and claim 1～8 any one claim, it is characterized in that, described evaporation is fixed on described mask frame with mask plate.
10. mask assembly according to claim 9, is characterized in that, described evaporation is fixed on described mask frame by laser welding or bonding way with mask plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320617777.3U CN203569176U (en) | 2013-10-09 | 2013-10-09 | Mask plate and mask component for evaporation plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320617777.3U CN203569176U (en) | 2013-10-09 | 2013-10-09 | Mask plate and mask component for evaporation plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203569176U true CN203569176U (en) | 2014-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320617777.3U Expired - Fee Related CN203569176U (en) | 2013-10-09 | 2013-10-09 | Mask plate and mask component for evaporation plating |
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| CN (1) | CN203569176U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103589997A (en) * | 2013-10-09 | 2014-02-19 | 昆山允升吉光电科技有限公司 | Evaporation mask plate |
| CN108630832A (en) * | 2018-03-13 | 2018-10-09 | 阿德文泰克全球有限公司 | Metal shadow mask and preparation method thereof |
-
2013
- 2013-10-09 CN CN201320617777.3U patent/CN203569176U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103589997A (en) * | 2013-10-09 | 2014-02-19 | 昆山允升吉光电科技有限公司 | Evaporation mask plate |
| CN108630832A (en) * | 2018-03-13 | 2018-10-09 | 阿德文泰克全球有限公司 | Metal shadow mask and preparation method thereof |
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| C14 | Grant of patent or utility model | ||
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Effective date of registration: 20190808 Granted publication date: 20140430 |
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| PD01 | Discharge of preservation of patent |
Date of cancellation: 20220808 Granted publication date: 20140430 |
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| PD01 | Discharge of preservation of patent | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140430 Termination date: 20191009 |
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| CF01 | Termination of patent right due to non-payment of annual fee |