CN108630832A - Metal shadow mask and preparation method thereof - Google Patents
Metal shadow mask and preparation method thereof Download PDFInfo
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- CN108630832A CN108630832A CN201810206279.7A CN201810206279A CN108630832A CN 108630832 A CN108630832 A CN 108630832A CN 201810206279 A CN201810206279 A CN 201810206279A CN 108630832 A CN108630832 A CN 108630832A
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- 239000002184 metal Substances 0.000 title claims abstract description 78
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 78
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 claims description 25
- 238000005530 etching Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 abstract description 9
- 238000005323 electroforming Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 35
- 230000000694 effects Effects 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011368 organic material Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- -1 drying procedure Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
This application discloses a kind of metal shadow mask, preparation method includes：There is provided template, press mold, exposed and developed, electroforming, press mold, it is exposed and developed, etch and move back film, obtain metal shadow mask with multiple perforation.Depth in preparation process middle punch can be controlled with angle, can obtain having the angled metal shadow mask of tool in high Aperture precision and opening, thus it is upper in application, vapor deposition shade can be reduced or eliminated.
Description
Technical field
This application involves organic light-emitting diode display technical fields, and in particular to a kind of metal shadow mask and its preparation side
Method.
Background technology
Organic light emitting diode (Organic Light-Emitting Diode, OLED) display device, which is a kind of utilizes, to be had
Machine semi-conducting material is made, with the thin film light emitting device of direct voltage drive.Since OLED display has, thickness is thin, weight
Gently, the advantages that high contrast, wide viewing angle, follow-on mainstream display technology is had been cited as.
The principle of luminosity of OLED display is when there is electric current by luminous organic material coating, i.e., by the organic light emission
Material coating emits beam.Industry OLED production fields at present, generally by the way of single layer vapor deposition shadow mask deposition, when vapor deposition
Organic material particles can pass through the opening of shadow mask from all angles and be attached on substrate.However, in general evaporation process, point
Opening zero draft of the cloth on shadow mask, when particle tilts directive opening, partial particulate can be blocked by perforated wall and can not be reached
Substrate causes the particle of oblique incidence to lack, and causes substrate vapor deposition uneven, and generate shadow effect, product briliancy is made to decline,
To affect the display characteristic of OLED device.
Industry is directed to shadow effect at present, when making OLED shadow masks, generally uses the side of two-sided etching metal coiled material
Formula makes, but such mode can not accurately control the uniformity of openings of sizes.Shadow mask is opened with the face indium tin oxide (ITO) contact surface
There are reversed cone angles for mouth, generate dead zone, influence evaporating quality.
Invention content
The application's is designed to provide a kind of metal shadow mask and preparation method thereof, to hold when solving glass substrate vapor deposition
The problem of being also easy to produce shadow effect.
To solve the above-mentioned problems, this application provides a kind of preparation methods of metal shadow mask, including：One template is provided；
One light-sensitive surface is set in the template；It is exposed and developed, so that the light-sensitive surface is formed multiple first structures in the template；
A metal layer is formed in the template；The light-sensitive surface is set on the metal layer；It is exposed and developed, make the light-sensitive surface
Multiple second structures are formed on the metal layer, wherein the multiple second structure and the multiple first structure staggered row
Row, and it is separated by a spacing between each second structure and adjacent first structure；Etch the metal layer；And it removes described more
First and second a structure, metal shadow mask of the acquisition with multiple perforation and etc..
The application provides a kind of metal shadow mask by made by above-mentioned preparation method simultaneously.
Compared with prior art, the application can be obtained including following technique effect：
The preparation method of metal shadow mask provided herein can all be carried out in preparation process split shed depth with angle
Control, therefore can obtain that there is the angled metal shadow mask of tool in high Aperture precision and opening, thus in evaporation application, it can
Vapor deposition shade is reduced or eliminated.Meanwhile in vapor deposition, the damage for the organic material particles for being incident to glass substrate can be reduced
It loses, promotes the vapor deposition uniformity and decline with product briliancy.
Description of the drawings
Attached drawing described herein is used for providing further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please do not constitute the improper restriction to the application for explaining the application.In the accompanying drawings：
Fig. 1 is the method flow diagram of the embodiment of the present application.
Fig. 2 to Fig. 8 is the schematic side view that the different production phases are corresponded in the embodiment of the present application.
Fig. 9 is the diagrammatic cross-section of the metal shadow mask of the embodiment of the present application.
Specific implementation mode
Presently filed embodiment is described in detail below in conjunction with accompanying drawings and embodiments, thereby how the application is applied
Technological means solves technical problem and reaches the realization process of technical effect to fully understand and implement.
Some vocabulary has such as been used to censure specific components in specification and claim.Those skilled in the art answer
It is understood that hardware manufacturer may call the same component with different nouns.This specification and claims are not with name
The difference of title is used as the mode for distinguishing component, but is used as the criterion of differentiation with the difference of component functionally.Such as logical
The "comprising" of piece specification and claim mentioned in is an open language, therefore should be construed to " include but do not limit
In "." substantially " refer in acceptable error range, those skilled in the art can be described within a certain error range solution
Technical problem basically reaches the technique effect.In addition, " coupling " or " electric connection " word herein include it is any directly and
The electric property coupling means connect.Therefore, if it is described herein that a first device is coupled to a second device, then the first device is represented
The second device is can be directly electrically coupled to, or described second is electrically coupled to indirectly by other devices or coupling means
Device.Specification subsequent descriptions are to implement the better embodiment of the application, and so the description is to illustrate that the application's is general
For the purpose of principle, it is not limited to scope of the present application.The protection domain of the application is when regarding appended claims institute defender
Subject to.
It should also be noted that, the terms "include", "comprise" or its any other variant are intended to nonexcludability
Including so that process, method, commodity or system including a series of elements include not only those elements, but also wrap
Include the other elements being not explicitly listed, or further include for this process, method, commodity or system intrinsic want
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that wanted including described
There is also other identical elements in the process of element, method, commodity or system.
Embodiment describes
As shown in Figure 1, in the embodiment of the application, the preparation method of metal shadow mask includes：
Step S101：One template is provided.It can be the clean template by preprocessor, or before this step
First template is cleaned with acidic cleaner and alkaline cleaner, is then rinsed with deionized water, is then dried for standby.
Step S103：One light-sensitive surface is set in template.Mainly with the roller with certain temperature by light-sensitive surface 20 with one
Constant-pressure is depressed into template 10, and light-sensitive surface 20 is made fully to be bonded (as shown in Figure 2) with 10 surface of template.
Step S105：It is exposed and developed, so that light-sensitive surface is formed multiple first structures in template.Fig. 2 and Fig. 3 are please referred to,
In this step, the template 10 for being pressed with light-sensitive surface 20 is exposed, to form the first layer pattern according to exposing patterns；Then with certain
Template 10 after temperature baking exposure, makes the light-sensitive surface 20 through overexposure fully react；Later, the template 10 after exposure is carried out
Development, makes light-sensitive surface 20 form multiple first structures 30 (dry film i.e. after 20 exposure imaging of light-sensitive surface) on 10 surface of template, and
30 spaced-apart relation of multiple first structures.
Wherein, it is also an option that property carries out baking or UV program curings firmly to the template 10 with multiple first structures 30,
The template after development 10 is set to be toasted with higher temperature, multiple first structures 30 are firmer, attachment in template surface to allow
Power is stronger.
Step S107：A metal layer is formed in template.As shown in figure 4, to the template 10 with multiple first structures 30
It is electroplated, makes to be not provided with deposited metal layer 40 at the position of first structure 30 on the surface of template 10.
Step S109：Light-sensitive surface is set on metal layer.In this step, the template 10 for being provided with metal layer 40 is carried out
Light-sensitive surface 20 is mainly depressed into certain pressure on metal layer 40 with the roller with certain temperature, makes light-sensitive surface by press mold program
20 are fully bonded (as shown in Figure 5) with 40 surface of metal layer.In addition, before carrying out this step, can selectivity first to setting
There is the template 10 of metal layer 40 to be cleaned, drying procedure, such as rinsed well with deionized water, and template 10 is dried, so
Carry out the press mold program of light-sensitive surface 20 again afterwards.
Step S111：It is exposed and developed, so that light-sensitive surface is formed multiple second structures, plurality of second knot on the metal layer
Structure is staggered with multiple first structures, and is separated by a spacing between each second structure and adjacent first structure.It please refers to
Fig. 5 and Fig. 6, operationally, the template 10 to being pressed with light-sensitive surface 20 expose, and make light-sensitive surface 20 according to exposing patterns in metal layer 40
The second layer pattern of upper formation.Then, with the template 10 after certain temperature baking exposure, keep the light-sensitive surface 20 through overexposure fully anti-
It answers.Later, the template 10 after exposure is developed, so that light-sensitive surface 20 is formed multiple second structures 50, (i.e. light-sensitive surface 20 exposes
Dry film after development).Multiple second structures 50 are staggered with multiple first structures 30, and each second structure 50 with it is adjacent
It is separated by a separation delta W between first structure 30, to the metal layer of the exposed portion between first structure 30 and the second structure 50
40。
In this step, due to using light-sensitive surface 20 carry out press mold, it is exposed and developed by the way of complete first structure 30 with
The setting of second structure 50, allow the separation delta W between first structure 30 and the second structure 50 control equal to or less than
In the range of 1.5um, and have high aligning accuracy, this aligning accuracy is higher, contribute in subsequent obtain depth with
The structural form that angle reaches unanimity.And the positional precision that can ensure opening in subsequent step, is conducive to make small open
The metal shadow mask of mouth.
Similarly with previous steps, after the procedure can selectivity to template 10 carry out firmly dry or UV program curings,
It allows the template 10 after development to toast at a higher temperature, makes that multiple second structures 50 are firmer, adhesive force is stronger.
Step S113：Etch metal layer.Fig. 6 and Fig. 7 are please referred to, using metal etch liquid medicine to being exposed to first structure 30
Metal layer 40 between the second structure 50 is etched, and controls the technological parameter of etching, can obtain expected etching
Depth and/or angle.Wherein, etch depth can approach or be equal to the thickness of metal layer 40, if for example, the thickness of metal layer 40
Degree is 8~100um, and the difference of etch depth and 40 thickness of metal layer can be equal to or less than 1um.Meanwhile passing through control first
Separation delta W sizes between structure 30 and the second structure 50 accurately control the angle of etching face with etch depth, in gold
Category layer 40, which corresponds at separation delta W, etches a groove 60 wide at the top and narrow at the bottom, and in metal layer 40 adjacent to first structure
Side forms a guiding face 41, this guiding face 41 can be inclined-plane or curved surface.
Step S115：First and second multiple structure are removed, the metal shadow mask with multiple perforation is obtained.Please refer to Fig. 7
And the template 10 with multiple first and second structures 30,50 is put into move back and carries out moving back film journey in film slot by Fig. 8 in this step
Light-sensitive surface in template 10 is removed totally, multiple first and second structures 30,50 is made to be removed from template 10 by sequence.Later, may be used
It is cleaned with selectivity to moving back the template 10 after film, drying procedure, metal shadow mask 70 is taken off again from template then, is solid
It is fixed.
Wherein after first structure 30 removes, corresponding to being formed and be alternatively arranged at the position of first structure 30 on metal layer 40
Multiple perforation 42, it is each perforation 42 metal layer 40 opposite two side faces formed communicate first opening 43 and second be open
44, the caliber size of opening is up to 10um or so.Also, due to previous etching step metal layer 40 and first structure 30 it
Between form groove 60 wide at the top and narrow at the bottom so that perforate 42 aperture along second opening 44 towards first opening 43 direction gradually
Contracting, and the bore for forming the second opening 44 is more than the structural form of the bore of the first opening 43.Meanwhile in the horizontal direction, golden
Belong to layer 40 perforation 60 in be formed by guiding face 41 can be along second opening 44 towards first be open 43 inclined inclined-planes, or
Curved surface of the person along 44 direction 43 indents of the first opening of the second opening.
It is above-mentioned move back film program after, being cleaned to moving back the template 10 after film of selectivity, drying procedure.Finally,
Metal shadow mask 70 is taken off from template 10 again, is fixed.
Fig. 8 and Fig. 9 are please referred to, in the embodiment of the application, the metal shadow mask 70 that is made by above-mentioned technique
Including a metal layer 40, the composition material of this metal layer 40 can be nickel alloy, dilval or teleoseal, but not with
This is limited.Metal layer 40 has multiple perforation 42, and each perforation 42 is through metal layer 40 opposite first surface 401 and the second table
Face 402, and form the first opening 43 in first surface 401 and form the second opening 44 in second surface 402.Second opening
44 are connected with the first opening 43, and the bore of the second opening 44 is more than the bore of the first opening 43.In addition, metal layer 40 is each
It is a perforation 42 in have a guiding face 41, guiding face 41 can be along second opening 44 towards first be open 43 inclined inclined-planes,
Or the curved surface for 43 indents that are open along 44 direction first of the second opening.Wherein, metal layer 40 first opening 43 edge and
Metal layer 40 has between the line at edge and the first surface 401 of metal layer 40 or second surface 402 of the second opening 44
There is an angle theta, the angle of this angle theta is between 30~60 °.It is preferable in vapor deposition, allow organic material particles that can have
Incidence angle, and reduce or eliminate shadow effect.
Several preferred embodiments of the application have shown and described in above description, but as previously described, it should be understood that the application
Be not limited to form disclosed herein, be not to be taken as excluding other embodiments, and can be used for various other combinations,
Modification and environment, and the above teachings or related fields of technology or knowledge can be passed through in the scope of the invention is set forth herein
It is modified.And changes and modifications made by those skilled in the art do not depart from spirit and scope, then it all should be in this Shen
It please be in the protection domain of appended claims.
Claims (15)
1. a kind of preparation method of metal shadow mask, which is characterized in that include the following steps：
One template is provided；
One light-sensitive surface is set in the template；
It is exposed and developed, so that the light-sensitive surface is formed multiple first structures in the template；
A metal layer is formed in the template；
The light-sensitive surface is set on the metal layer；
It is exposed and developed, so that the light-sensitive surface is formed multiple second structures on the metal layer, wherein the multiple second knot
Structure is staggered with the multiple first structure, and is separated by a spacing between each second structure and adjacent first structure；
Etch the metal layer；And
First and second the multiple structure is removed, the metal shadow mask with multiple perforation is obtained.
2. the method as described in claim 1, which is characterized in that also comprised the steps of after the exposed and developed step：
Program curing is carried out to the multiple first structure and/or the multiple second structure.
3. the method as described in claim 1, which is characterized in that it is described exposed and developed, make the light-sensitive surface in the template
In the step of upper formation multiple first structures, the multiple first structure is alternatively arranged.
4. the method as described in claim 1, which is characterized in that the step of first and second the multiple structure of the removal
Afterwards, further include the step that metal shadow mask is taken off from template, is fixed.
5. the method as described in claim 1, which is characterized in that described in the multiple first structure of the removal or the removal
After the step of multiple second structures, further include cleaned to moving back the template after film, baking step.
6. the method as described in claim 1, which is characterized in that be to the metal the step of etching metal layer
The partial metal layers that layer is exposed to the spacing are etched, and the thickness of etch depth and the metal layer matches.
7. method as claimed in claim 6, which is characterized in that the etch depth and the difference of the metal layer thickness are equal to
Or it is less than 1um.
8. the method as described in claim 1, which is characterized in that the spacing is equal to or less than 1.5um.
9. the method as described in claim 1, which is characterized in that opposite two side faces shape of each perforation in the metal layer
At the first opening communicated and the second opening, and the aperture of the perforation is along the side that second opening is open towards described first
To tapered.
10. method as claimed in claim 9, which is characterized in that the metal layer forms guiding face in each perforation,
The guiding face is inclined-plane or curved surface.
11. method as claimed in claim 9, which is characterized in that the metal layer is in the edge of first opening and institute
State metal layer has an angle between the line and the surface of the metal layer at the edge of second opening, the angle
Angle is 30~60 °.
12. a kind of metal shadow mask, which is characterized in that be prepared by the method as described in claim 1.
13. metal shadow mask as claimed in claim 12, which is characterized in that each perforation is opposite the two of the metal layer
Side forms the first opening and the second opening communicated, and the aperture of the perforation is opened along second opening towards described first
The direction of mouth is tapered.
14. metal shadow mask as claimed in claim 13, which is characterized in that the metal layer is formed in each perforation and led
Draw face, the guiding face is inclined-plane or curved surface.
15. metal shadow mask as claimed in claim 13, which is characterized in that the metal layer it is described first opening edge with
And the metal layer has an angle, the folder between the line and the surface of the metal layer at the edge of second opening
The angle at angle is 30~60 °.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810206279.7A CN108630832A (en) | 2018-03-13 | 2018-03-13 | Metal shadow mask and preparation method thereof |
| KR1020180110759A KR20190108030A (en) | 2018-03-13 | 2018-09-17 | Metal shadow mask and preparation method thereof |
| JP2018178151A JP2019157263A (en) | 2018-03-13 | 2018-09-21 | Metal shadow mask and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810206279.7A CN108630832A (en) | 2018-03-13 | 2018-03-13 | Metal shadow mask and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108630832A true CN108630832A (en) | 2018-10-09 |
Family
ID=63706235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810206279.7A Pending CN108630832A (en) | 2018-03-13 | 2018-03-13 | Metal shadow mask and preparation method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2019157263A (en) |
| KR (1) | KR20190108030A (en) |
| CN (1) | CN108630832A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116145078A (en) * | 2022-12-07 | 2023-05-23 | 达运精密工业股份有限公司 | Method for manufacturing metal shield and metal shield |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205695A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A mask plate for vapor plating and a production method thereof |
| CN103388121A (en) * | 2012-05-08 | 2013-11-13 | 昆山允升吉光电科技有限公司 | Hybrid preparation process of high-precision metal mask plate |
| CN203569176U (en) * | 2013-10-09 | 2014-04-30 | 昆山允升吉光电科技有限公司 | Mask plate and mask component for evaporation plating |
| CN104164647A (en) * | 2013-05-17 | 2014-11-26 | 昆山允升吉光电科技有限公司 | Manufacture technology of mask plate |
| CN104213071A (en) * | 2013-06-01 | 2014-12-17 | 昆山允升吉光电科技有限公司 | Preparation technology for mask plate |
| CN104988458A (en) * | 2015-07-07 | 2015-10-21 | 昆山允升吉光电科技有限公司 | Manufacturing method for mask plate with taper-angled opening |
| CN106350769A (en) * | 2016-09-22 | 2017-01-25 | 常州友机光显电子科技有限公司 | Metal shadow mask and preparation method thereof |
| WO2017045122A1 (en) * | 2015-09-15 | 2017-03-23 | Applied Materials, Inc. | A shadow mask for organic light emitting diode manufacture |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10330910A (en) * | 1997-06-04 | 1998-12-15 | Toray Ind Inc | Shadow mask and its production |
| US20180138408A1 (en) * | 2015-08-05 | 2018-05-17 | Applied Materials, Inc. | A shadow mask for organic light emitting diode manufacture |
-
2018
- 2018-03-13 CN CN201810206279.7A patent/CN108630832A/en active Pending
- 2018-09-17 KR KR1020180110759A patent/KR20190108030A/en not_active Application Discontinuation
- 2018-09-21 JP JP2018178151A patent/JP2019157263A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205695A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A mask plate for vapor plating and a production method thereof |
| CN103388121A (en) * | 2012-05-08 | 2013-11-13 | 昆山允升吉光电科技有限公司 | Hybrid preparation process of high-precision metal mask plate |
| CN104164647A (en) * | 2013-05-17 | 2014-11-26 | 昆山允升吉光电科技有限公司 | Manufacture technology of mask plate |
| CN104213071A (en) * | 2013-06-01 | 2014-12-17 | 昆山允升吉光电科技有限公司 | Preparation technology for mask plate |
| CN203569176U (en) * | 2013-10-09 | 2014-04-30 | 昆山允升吉光电科技有限公司 | Mask plate and mask component for evaporation plating |
| CN104988458A (en) * | 2015-07-07 | 2015-10-21 | 昆山允升吉光电科技有限公司 | Manufacturing method for mask plate with taper-angled opening |
| WO2017045122A1 (en) * | 2015-09-15 | 2017-03-23 | Applied Materials, Inc. | A shadow mask for organic light emitting diode manufacture |
| CN106350769A (en) * | 2016-09-22 | 2017-01-25 | 常州友机光显电子科技有限公司 | Metal shadow mask and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 周静: "《近代材料科学研究技术进展》", 31 December 2012 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116145078A (en) * | 2022-12-07 | 2023-05-23 | 达运精密工业股份有限公司 | Method for manufacturing metal shield and metal shield |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190108030A (en) | 2019-09-23 |
| JP2019157263A (en) | 2019-09-19 |
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