CN103205683A - Easily weldable vapor plating mask plate and its preparation process - Google Patents
Easily weldable vapor plating mask plate and its preparation process Download PDFInfo
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- CN103205683A CN103205683A CN2012100106967A CN201210010696A CN103205683A CN 103205683 A CN103205683 A CN 103205683A CN 2012100106967 A CN2012100106967 A CN 2012100106967A CN 201210010696 A CN201210010696 A CN 201210010696A CN 103205683 A CN103205683 A CN 103205683A
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- mask plate
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Abstract
The invention relates to an easily weldable vapor plating mask plate, which is composed of a vapor plating layer and a thickening layer. Specifically, the vapor plating layer includes an opening pattern region, and the thickening layer includes the region around the opening pattern region. The preparation process of the vapor plating mask plate comprises: first electroforming, which includes core mold (substrate) pretreatment, film pasting, exposure, developing, electroforming and post-treatment; and second electroforming, which includes second film pasting, second exposure, second developing, second electroforming, film stripping, washing, drying and peeling. The vapor plating layer of the mask plate can be obtained through the first electroforming, and the thickening layer of the mask plate can be obtained through the second electroforming. The vapor plating mask plate obtained by the process has the advantages of: avoiding poor welding, such as non-through welding, penetrated welding and other phenomena; and improving the welding quality of a thin mask plate; meeting the requirements of welding and vapor plating at the same time, that is to say while meeting of the vapor plating requirements is ensured, the welding requirements of the mask plate and a mask frame are also met. Meanwhile, the electroforming technology is employed in the invention to prepare the mask plate so as to ensure the mask plate a smooth surface, no burr, scratch or other defects, low surface roughness and uniform thickness.
Description
Technical field
The present invention relates to a kind of mask plate and preparation technology thereof, be specifically related to a kind of evaporation that is easy to weld mask plate and preparation technology thereof for the manufacture of el display device (OLED), belong to material preparation and manufacture field.
Background technology
According to the materials classification difference of luminescent layer, el display device (OLED) can be divided into inorganic EL display unit and organic electroluminescence display device and method of manufacturing same.Owing to compare with the inorganic EL display unit, organic electroluminescence display device and method of manufacturing same can have higher brightness and time of response faster, and can color display, so in the field of organic electroluminescence display device and method of manufacturing same, obtained development at full speed in recent years.
Organic light-emitting display device comprises the organic luminous layer between anode and the negative electrode.To be hole and electronics remove to produce the exciton of excited state from anode and negative electrode to its principle of luminosity, and exciton reconfigures with luminous.As a rule, the formation method of the meticulous pattern of the film of formation organic light-emitting display device comprises photoetching method or the deposition method that uses patterned mask.
Because organic emission layer is to humidity sensitive, thereby use traditional photoetching method to be difficult to form organic emission layer.Therefore in photoresist layer and etching treatment procedure, the photoetching method that is exposed to moisture is unsuitable for depositing organic emission layer.In order to address this problem, the method for using the mask plate with certain patterns to deposit organic emissive material has in a vacuum obtained widespread use.
Because evaporation process require to use is thin mask plate, make it have better evaporation effect, so existing technology has been used the mask plate that is as thin as 10 μ m again.
But simultaneously because the size of mask plate is too thin, and brought new problem: present technology is by welding process mask plate to be fixed on the mask frame, thickness is more thin, more difficult welding, the phenomenon that occurs burn-through or not weld penetration easily, in general, if above-mentioned welding flaw can appear in the mask plate rack of fusion of thickness below 50 μ m.Because plate is more thin, just more difficult assurance parameters of welding for light gauge welding, if the laser energy of welding is higher, burn-through phenomenon (Fig. 4) will occur; If the laser energy of welding is on the low side, weldering will occurs and not wear phenomenon (Fig. 5).
So it is very urgent to prepare a kind of mask plate that can make thin plate be easy to weld to satisfy the evaporation requirement simultaneously.
Summary of the invention
The present invention is intended to solve above technical problem, invents a kind of bilayer structure that has, and comprises the evaporation mask plate of evaporation layer and thickening layer, when guaranteeing to satisfy the evaporation requirement, satisfies the welding requirements of mask plate and mask frame again.Simultaneously, the present invention uses electroforming process to carry out the preparation of mask plate, to guarantee defectives such as mask plate smooth surface, no burr, cut, has the size of lower surfaceness and thickness homogeneous.
A kind of evaporation mask plate that is easy to weld is made of two-layer, comprising: the first layer is the evaporation layer, and the second layer is thickening layer.
Wherein, the evaporation layer comprises the opening figure zone (Fig. 2) of satisfying the evaporation requirement.
Wherein, the zone of thickening layer be beyond the evaporation layer opening figure zone around (Fig. 2).
Preferably, the thickness of evaporation layer is 20-50 μ m.
Preferably, the thickness of thickening layer is 20-50 μ m.
Evaporation comprises the steps: with the preparation technology of mask plate
An electroforming of A: core (substrate) pre-treatment → pad pasting → exposure → development → electroforming → aftertreatment;
B secondary electroforming: secondary pad pasting → re-expose → second development → secondary electroforming → demoulding → washing → drying → peel off.
Specifically, the preparation were established of an electroforming of steps A is as follows:
(1) core (substrate) pre-treatment: selecting stainless steel plate is the core material, with core oil removing, pickling, sandblast;
(2) paste mould: the mandrel surface pad pasting;
(3) exposure: with the opening figure regional exposure;
(4) develop: unexposed area is developed, keep the exposed portion pad pasting;
(5) electroforming: adopt the method for electroforming that developing regional is arrived in metal plating, clone and the consistent opening of dry film figure that exposes;
(6) aftertreatment: electroforming evaporation layer is carried out sandblasting.
Specifically, the operational path of step B secondary electroforming is as follows:
(1) secondary pad pasting: at the electroformed layer surface pad pasting that an electroforming prepares;
(2) re-expose: the exposure area is the zone in addition, thickening layer zone of electroforming;
(3) second development: unexposed area is developed, keep the exposed portion pad pasting;
(4) secondary electroforming: the method that adopts electroforming with metal plating to developing regional, beyond in the graphics field around the electroforming deposition material, form thickening layer;
(5) demoulding: dry film is removed;
(6) washing: clean mask plate;
(7) drying: dry mask plate;
(8) peel off: core is peeled off.
Core technology of the present invention is to pass through pad pasting exposure imaging electroforming again on the basis that the last electroforming the first layer of core (substrate) is the evaporation layer, electroforming second layer thickening layer (Fig. 2) around the opening figure of evaporation layer is extra-regional, namely in the thickening of bond pad locations zone, to increase the metallic substance thickness of welding region, avoid the rack of fusion phenomenon.By technique scheme, the present invention has following advantage and beneficial effect at least:
(1) avoids bad welding, as phenomenons such as not weld penetration, burn-through (Fig. 4, Fig. 5);
(2) welding quality (Fig. 3) of the thin mask plate of raising;
(3) satisfy welding requirements and evaporation requirement simultaneously.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing.
Fig. 1. the single layer mask plate
1-opening figure zone
2-bond pad locations (around Mask)
The 3-mask plate
Fig. 2. double-deck mask plate
The thickening of 1-frame bond pad locations, the electroforming second layer
2-the first layer mask plate (evaporation layer)
3-opening figure zone
Fig. 3. weld good synoptic diagram:
Fig. 4. not weld penetration (high-energy) synoptic diagram:
The 1-mask plate
The 2-mask frame
The 3-scolder
Fig. 5. burn-through (low-yield) synoptic diagram:
The 1-mask plate
The 2-mask frame
The 3-scolder
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
The present invention discloses a kind of evaporation mask plate that is easy to weld, this mask plate is made of two-layer, as shown in Figure 2, comprise: the first layer is the evaporation layer, shown among Fig. 22, it comprises the opening figure zone, shown among Fig. 23, the second layer is thickening layer, and shown among Fig. 21, it is the second layer of electroforming, main purpose is that evaporation is thickeied with the position that is used for solder joint around the mask plate, under the assurance prerequisite suitable thin for the thickness of the evaporation layer (figure open area) of evaporated segment, increase the thickness of weld, to guarantee welding quality.
Itself and common evaporation are that with the key distinction of mask plate the mask plate of common welding usefulness does not have thickening layer, as shown in Figure 1.In order to obtain better effect when the evaporation, logical producing adopted the mask plate that is as thin as 10 μ m.And the thickness of mask plate is more thin, and the phenomenon of burn-through or not weld penetration appears in more difficult welding easily, in general, if welding flaw can appear in the mask plate rack of fusion of thickness below 50 μ m.Because plate is more thin, just more difficult assurance parameters of welding for light gauge welding, if the laser energy of welding is higher, the burn-through phenomenon will occur, and as shown in Figure 4, namely scolder 3 is welded on the mask frame 2, and not bonding with mask plate 1.If the laser energy of welding is on the low side, weldering will occur and not wear phenomenon, be that scolder 3 still is trapped on the mask plate 1 as shown in Figure 5, and not bonding with mask frame.This dual mode all can cause the bonding bad of mask plate and mask frame, and can't reach the purpose of firm welding.
Generally, desirable welding should be as shown in Figure 3, namely scolder 3 mask plate 1 and mask frame 3 are carried out firm bonding, thereby mask plate 1 is defined on the mask frame 3.Therefore, the present invention has taked the evaporation zone treatment process different with the thickness of welding region, thereby when guaranteeing to satisfy the evaporation requirement, satisfies the welding requirements of mask plate and mask frame again.
Satisfy in the time of for assurance evaporation and welding requirements, the present invention also limits respectively the thickness of thickening layer and evaporation layer, and wherein, the thickness range of thickening layer is at 20-50 μ m, and the thickness range of evaporation layer is at 20-50 μ m.
The present invention discloses the preparation method that above-mentioned evaporation is used mask plate simultaneously, and evaporation comprises the steps: with the preparation technology of mask plate
An electroforming of A: core (substrate) pre-treatment → pad pasting → exposure → development → electroforming → aftertreatment;
B secondary electroforming: secondary pad pasting → re-expose → second development → secondary electroforming → demoulding → washing → drying → peel off.
Specifically, the preparation were established of an electroforming of steps A is: in the pre-treating technology of core (substrate), selecting stainless steel plate is the core material, with core oil removing, pickling, sandblast, the Impurity removal of mandrel surface is clean, simultaneously that the surface finish of core is smooth; The back is at the mandrel surface pad pasting, and with opening figure zone (among Fig. 2 shown in 3) regional exposure, and unexposed portion is developed, and keeps the dry film of exposed portion again, the protective membrane during as electroforming; Adopt electroforming process that developing regional is arrived in the metal plating electroforming, after metal plating carries out sandblasting, namely obtain the evaporation layer of electroforming.
Specifically, the operational path of step B secondary electroforming is: behind the evaporation laminating film for preparing, will be about to the thickening layer zone regional exposure (zone shown in 2 and 3 among Fig. 2) in addition of electroforming, and unexposed portion is developed, keep the exposed portion pad pasting, the protective membrane during as electroforming; Adopt electroforming process that developing regional is arrived in the metal plating electroforming, i.e. zone shown in 1 among Fig. 2; Dry film is removed, and washing is clean, after the mask plate drying, peels off from core, namely obtains this evaporation mask plate.
In the description of this specification sheets, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " illustrative examples ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.
Claims (10)
1. an evaporation mask plate that is easy to weld is made of two-layer, comprising: the first layer is the evaporation layer, and the second layer is thickening layer.
2. the evaporation mask plate that is easy to weld according to claim 1 is characterized in that, the evaporation layer comprises the opening figure zone of satisfying the evaporation requirement.
3. the evaporation mask plate that is easy to weld according to claim 1 is characterized in that, the zone of thickening layer be beyond the evaporation layer opening figure zone around.
4. the evaporation mask plate that is easy to weld according to claim 1 is characterized in that, the thickness of evaporation layer is 20-50 μ m.
5. the evaporation mask plate that is easy to weld according to claim 1 is characterized in that, the thickness of thickening layer is 20-50 μ m.
6. the evaporation mask plate that is easy to weld according to claim 1 is characterized in that the preparation technology of mask plate comprises the steps:
An electroforming of A: core (substrate) pre-treatment → pad pasting → exposure → development → electroforming → aftertreatment;
B secondary electroforming: secondary pad pasting → re-expose → second development → secondary electroforming → demoulding → washing → drying → peel off.
7. the evaporation that is easy to weld according to claim 6 is characterized in that with the preparation technology of mask plate, and the purpose of an electroforming of steps A is to go up electroforming evaporation layer at core (substrate).
8. the evaporation that is easy to weld according to claim 6 is characterized in that with the preparation technology of mask plate the purpose of step B secondary electroforming is at evaporation layer electroforming thickening layer.
9. the evaporation that is easy to weld according to claim 6 is characterized in that with the preparation technology of mask plate the aftertreatment technology in the electroforming of steps A comprises sandblasting.
10. the evaporation that is easy to weld according to claim 6 is characterized in that with the preparation technology of mask plate the re-expose zone among the step B is the opening figure zone of evaporation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012100106967A CN103205683A (en) | 2012-01-16 | 2012-01-16 | Easily weldable vapor plating mask plate and its preparation process |
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| CN2012100106967A CN103205683A (en) | 2012-01-16 | 2012-01-16 | Easily weldable vapor plating mask plate and its preparation process |
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| CN103205683A true CN103205683A (en) | 2013-07-17 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105164320A (en) * | 2013-08-02 | 2015-12-16 | 欧姆龙株式会社 | Electroformed component and method for manufacturing same |
| CN110373629A (en) * | 2018-04-12 | 2019-10-25 | 上海和辉光电有限公司 | A kind of high-precision metal mask plate and manufacturing method, high-precision metal mask device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| CN101864552A (en) * | 2009-04-16 | 2010-10-20 | 三星移动显示器株式会社 | The mask frame and the methods involving that are used for thin film deposition |
| US20110168087A1 (en) * | 2010-01-11 | 2011-07-14 | Lee Choong-Ho | Mask frame assembly for thin film deposition |
| CN102569673A (en) * | 2010-12-20 | 2012-07-11 | 三星移动显示器株式会社 | Mask frame assembly, method of manufacturing the same, and method of manufacturing organic light-emitting display device using the mask frame assembly |
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2012
- 2012-01-16 CN CN2012100106967A patent/CN103205683A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| CN101864552A (en) * | 2009-04-16 | 2010-10-20 | 三星移动显示器株式会社 | The mask frame and the methods involving that are used for thin film deposition |
| US20110168087A1 (en) * | 2010-01-11 | 2011-07-14 | Lee Choong-Ho | Mask frame assembly for thin film deposition |
| CN102569673A (en) * | 2010-12-20 | 2012-07-11 | 三星移动显示器株式会社 | Mask frame assembly, method of manufacturing the same, and method of manufacturing organic light-emitting display device using the mask frame assembly |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105164320A (en) * | 2013-08-02 | 2015-12-16 | 欧姆龙株式会社 | Electroformed component and method for manufacturing same |
| CN105164320B (en) * | 2013-08-02 | 2016-08-31 | 欧姆龙株式会社 | The manufacture method of electroforming part |
| CN110373629A (en) * | 2018-04-12 | 2019-10-25 | 上海和辉光电有限公司 | A kind of high-precision metal mask plate and manufacturing method, high-precision metal mask device |
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Application publication date: 20130717 |