JP3435157B1 - Holding and conveying jig and holding and conveying method - Google Patents

Abstract

Abstract: PROBLEM TO BE SOLVED: To join an electronic component or the like to a surface of a thin printed wiring board such as a flexible printed wiring board or to manufacture the printed wiring board.
An object of the present invention is to provide a holding / conveying jig that can suppress manufacturing defects and can be manufactured at low cost. SOLUTION: Conductive portions 12, 14 and non-conductive portions 13, 15 are provided.
A jig 1 for holding and transporting a printed wiring board 10 comprising a weakly-adhesive adhesive pattern 2 on the surface of a plate 3, wherein the weakly-adhesive adhesive pattern 2 comprises:
It is limitedly formed at a position corresponding to the non-conductive portions 13 and 15.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a thin printed wiring board surface including a flexible printed wiring board,
The present invention relates to a holding and carrying jig and a holding and carrying method that are suitable in a process of mounting electronic components or the like or a process of manufacturing the printed wiring board.

[0002]

2. Description of the Related Art At present, printed wiring boards are used for mass production equipment such as televisions and equipment requiring high reliability such as rockets for the purpose of improving productivity, ensuring mass production quality, and improving reliability. Used in all electronic devices. Generally, this printed wiring board has a structure in which a conductor pattern is provided on the surface of an insulating substrate, but in recent years, a conductor pattern is provided on the surface of a film-like insulating substrate in order to reduce the size and weight of electronic devices. Flexible printed wiring boards (hereinafter referred to as "FPC") are provided. This F
In the PC, a so-called surface mounting method of mounting an electronic component on the surface of the conductor pattern is widely adopted.

This surface mounting method is generally performed as follows. First, on the plate-shaped holding and conveying jig surface,
A plurality of FPCs are placed and heat-resistant adhesive tapes are attached to the peripheral portions of these FPCs to hold the FPCs. Then, according to the arrangement position of the electronic components to be mounted on this jig plate, after undergoing a cream solder coating step, etc., the electronic components are mounted on this cream solder coating section,
After that, these are heated to melt and cure the cream solder, and the above electronic component is bonded to the FPC. Then, the adhesive tape and the FPC are removed from the jig.

[0004]

By the way, according to the above-mentioned conventional jig for holding and carrying, when the FPC is removed from the jig, the above-mentioned adhesive tape must be removed. there were. Further, the above-mentioned pressure-sensitive adhesive tape has low durability and needs to be replaced after being used about once.

In order to solve these problems, a method has been proposed in which a weak adhesive layer such as a silicone resin layer is formed on the entire surface of the jig and an FPC is placed and held on the surface of the silicone resin layer. (For example, Japanese Patent Fairness 3
-262194). In this case, since the heat resistance and the peelability of the FPC are good, it is expected that the production can be performed with high efficiency and low cost. However, in this case, since the silicone resin layer is uniformly formed on the jig surface, cream solder is applied to the FPC surface held on the resin layer surface using a metal mask, and then the Metal mask F
When the metal mask is separated from the surface of the PC, the metal mask adheres to a portion (between the FPCs) of the resin layer where the FPC is not placed, which causes a manufacturing defect that the metal mask cannot be separated properly. There was a problem. In addition, when a cream solder coating process or the like is performed, a part of the silicone resin is melted and the melted part is transferred to the FPC surface to be adhered to the conductive portion formed on the FPC surface. There was a problem of poor bonding.

The present invention has been made in consideration of such circumstances, and a step of joining electronic parts or the like to the surface of a thin printed wiring board such as an FPC or a step of manufacturing the printed wiring board. In the above, it is an object of the present invention to provide a holding and conveying jig and a holding and conveying method capable of suppressing manufacturing defects and enabling low-cost production.

[0007]

In order to solve the above problems and achieve such an object, the present invention proposes the following means. According to a first aspect of the invention, a printed wiring board having a conducting portion and a non-conducting portion on the surface, or a plate surface on which a conductive material-clad laminate for manufacturing the printed wiring board is placed and held, has weak adhesion. A holding and transporting jig having a conductive adhesive pattern, characterized in that the weakly tacky adhesive pattern is formed at a position corresponding to the non-conducting portion.

According to the holding and transporting jig of the present invention,
The weakly adhesive adhesive pattern is formed so as to be limited to a portion where the non-conductive portion is placed. Thereby, in the state where the printed wiring board or the conductive material-clad laminate is held on the jig surface, when a predetermined step is performed, the melted portion of the weak adhesive adhesive pattern is transferred to the conductive portion. It becomes possible to suppress coating.
This makes it possible to suppress manufacturing defects in the step of joining electronic parts and the like to the surface of the printed wiring board, the step of manufacturing the printed wiring board, and the like. Further, since the weakly adhesive adhesive pattern is formed only on the non-conductive portion of the surface of the printed wiring board, the adhesive pattern exceeds the printed wiring board mounting area. Never formed. Thereby, for example, when the cream solder is applied to the surface of the printed wiring board held on the surface of the adhesive pattern using a metal mask, and then the metal mask is separated from the surface of the printed wiring board, the adhesive is applied. The metal mask does not adhere to a portion of the agent pattern where the printed wiring board is not placed. Therefore, the metal mask can be favorably separated from the surface of the printed wiring board, and the occurrence of manufacturing defects can be suppressed.

According to a second aspect of the present invention, a printed wiring board having a conducting portion and a non-conducting portion on the surface, or a plate surface on which a conductive material-clad laminate for manufacturing the printed wiring board is placed and held. A jig for holding and transporting a weakly tacky adhesive layer, wherein the weakly tacky adhesive is roughened at a position corresponding to the conducting portion on the surface of the weakly tacky adhesive layer. It is characterized in that a pattern is formed.

According to the holding and conveying jig of the present invention,
The surface of the weakly tacky adhesive layer is limited to a portion where the non-conducting portion is placed, and is roughened by scanning a laser or the like. Therefore, on the surface of the weakly tacky adhesive layer, the portion where the non-conducting portion is placed has a structure in which the adhesive force is limitedly reduced. As a result, the same action as the action of the holding and conveying jig according to the first aspect is exhibited.

The invention according to claim 3 is the holding and conveying jig according to claim 1 or 2, wherein the weak adhesive adhesive pattern has a plurality of thicknesses different in thickness from the plate surface. It is characterized by having a large area.

According to the holding and transporting jig of the present invention,
According to each thickness region of the printed wiring board to be mounted or the conductive material-clad laminate, the weak adhesive adhesive pattern is provided with different thickness dimensions from the plate surface. ing. This makes it possible to stably hold the printed wiring board or the conductive material-clad laminate on the surface of the jig.
It is possible to reliably process the printed wiring board or the conductive material-clad laminate.

The invention according to claim 4 is the holding and transporting jig according to any one of claims 1 to 3, wherein the weakly adhesive adhesive pattern includes a plurality of adhesive force regions having different adhesive forces. It is characterized by having.

According to the holding and conveying jig of the present invention,
The weakly tacky adhesive pattern has a plurality of adhesive force regions having different adhesive forces according to the respective adhesive force regions of the printed wiring board or the conductive material-clad laminate placed on the jig. It has a structure. Therefore, when the printed wiring board or the like held on the jig is processed, and when the printed wiring board or the like is removed from the jig after the processing, it can be favorably performed without causing any trouble. become.

The invention according to claim 5 is the holding and transporting jig according to claim 2, wherein a non-adhesive pattern is formed at a position corresponding to the conducting portion on the surface of the weakly adhesive adhesive layer. It is characterized by being.

According to the holding and conveying jig of the present invention,
Of the weakly sticky adhesive layer surface, limited to the portion where the non-conducting portion is placed, for example, a resist for printed wiring board, a non-sticky pattern such as an aluminum foil is formed. There is. Therefore, on the surface of the weakly adhesive adhesive layer, the portion on which the non-conducting portion is placed is limitedly masked. Therefore, the operation of the holding and conveying jig according to claim 1. It has the same effect as.

According to a sixth aspect of the present invention, a printed wiring board having a conducting portion and a non-conducting portion on the surface is conveyed while being held on the surface of a holding and conveying jig having a weak adhesive adhesive pattern on the surface. A holding and conveying method for holding the printed wiring board on the holding and conveying jig surface, wherein the non-conducting portion is placed on the weakly adhesive pattern surface in a limited manner. To do.

According to the holding and conveying method of the present invention, when the printed wiring board is held on the surface of the jig, only the non-conducting portion is held on the surface of the weak adhesive adhesive pattern, and the conducting portion is Then, it is placed so as to be located in a portion where the weakly adhesive adhesive pattern is not formed. As a result, it becomes possible to realize good holding and conveyance that can suppress the occurrence of manufacturing defects.

According to a seventh aspect of the invention, a conductive material-clad laminate for producing a printed wiring board having a conducting portion and a non-conducting portion on a surface thereof is held and conveyed on a surface thereof with a weak adhesive adhesive pattern. A holding / conveying method in which the conductive material-clad laminate is held on the surface of the jig for holding, and when the conductive material-clad laminate is held on the surface of the jig for holding / conveying, a portion to be formed of the non-conducting portion is limited, It is characterized in that it is placed on the surface of the weakly adhesive adhesive pattern.

According to the holding and conveying method of the present invention, when holding the conductive material-clad laminate on the surface of the jig,
Only the planned part of the non-conductive part is held on the surface of the weak adhesive adhesive pattern, and the planned part of the conductive part is placed so as to be located in the part where the weak adhesive pattern is not formed. Will be placed. As a result, it becomes possible to realize good holding and conveyance that can suppress the occurrence of manufacturing defects.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 5 are schematic views of a holding and conveying jig shown as a first embodiment of the present invention. FIG. 1 is a schematic plan view of a jig for holding and carrying, FIG.
1 is a cross-sectional view of FIG. 1, FIG. 3 is a side view of a copper clad laminate for manufacturing a printed wiring board, and FIG. 4 is a plan view of the holding and conveying jig surface shown in FIGS. Printed wiring board to hold (flexible printed wiring board. "FPC"
FIG. 5 is a plan view of FIG. 5, and FIG. 5 is a positional relationship when the FPC shown in FIG. 4 is formed after holding the copper clad laminate shown in FIG. 3 on the surface of the jig for holding and conveying shown in FIGS. FIG.

Reference numeral 1 shown in FIG. 1 is a holding and conveying jig, and the jig 1 is composed of a plate 3 and a plurality of weakly adhesive adhesive patterns 2. These weakly adhesive adhesive patterns 2 are formed of, for example, a silicone resin or the like, and are formed on the surface of the plate 3 in a plurality, and as shown in FIG. Height regions A and B and a plurality of adhesive force regions C and D having different adhesive forces are provided. The height of the area A is larger than that of the area B, and the adhesive force of the area C is larger than that of the area D. As shown in FIG. 3, the copper-clad laminate held on the holding and conveying jig 1 configured as described above is
The film substrate 11, the copper foil 31 attached to one surface of the film substrate 11, and the convex portion 13 formed on the other surface of the film substrate 11. Here, the copper foil 31 is composed of a conduction portion formation scheduled portion 32 and a non-conduction portion formation scheduled portion 33 which will be described later. In the copper-clad laminate 30 thus configured, the projection 13 and the regions B and D formed on the jig 1 are aligned with each other, and the non-conduction part formation scheduled part 33 is limited. Then, it is placed and held on the surface of the weakly adhesive adhesive pattern 2 formed on the jig 1. In this state, a suitable method such as a subtractive method is applied to the surface of the copper foil 31, and only the copper foil 31 of the conductive portion formation scheduled portion 32 remains, and the copper foil 31 of the non-conductive portion formation scheduled portion 33 is removed. The FPC 10 shown in FIG. 4 is formed. That is,
The conductor pattern 12 and the terminal portion 14 are formed in the conduction portion formation-scheduled portion 32, whereby the FPC 10 including the conductor pattern 12, the terminal portion 14, and the convex portion 13 is formed on the surface of the film substrate 11. Formed (this film substrate 1
A portion of one surface excluding the conductor pattern 12, the convex portion 13, and the terminal portion 14 is hereinafter referred to as an insulating portion 15.).

On the surface of the holding and conveying jig 1, the FPC 10
FIG. 5 shows the positional relationship between the FPC 10 and the jig 1 when the ridges are formed. Only the convex portion 13 and the insulating portion 15, that is, the non-conductive portion are formed on the surface of the weak adhesive adhesive pattern 2, and the weak adhesive adhesive pattern 2 is formed in the conductor pattern 12 and the terminal portion 14, that is, the conductive portion. It is formed in the part which is not formed. That is, the weak adhesive pattern 2
Is limited to the non-conducting portion 1 on the surface of the plate 3.
It is formed at a position corresponding to Nos. 3 and 15.
The FPC 10 held on the surface of the jig 1 in the above-described positional relationship undergoes predetermined steps such as a step of applying cream solder to the surfaces of the conductive portions 12 and 14 and a step of joining electronic parts, It is removed from the jig 1.

As described above, according to the holding and transporting jig of this embodiment, the weakly adhesive adhesive pattern 2 is
The non-conductive portions 13 and 15 are formed so as to be limited to the portions where they are placed. As a result, with the FPC 10 held on the surface of the jig 1, the conducting portion 12,
14 Process such as applying cream solder to the surface, or F
It is possible to prevent the melted portion of the weakly adhesive adhesive pattern 2 from covering the conductive portions 12 and 14 when a process such as forming the PC 10 is performed. This allows
In the process of joining electronic parts to the surface of the FPC 10,
It is possible to suppress the occurrence of manufacturing defects such as defective bonding. In addition, the weak adhesive adhesive pattern 2 is FPC1.
Since it is limitedly formed at positions corresponding to the non-conducting portions 13 and 15 on the 0 surface, the adhesive pattern 2 on the surface of the jig 1 exceeds the area where the FPC 10 is placed. Never formed. As a result, the FPC 10 held on the surface of the adhesive pattern 2 is
After the cream solder is applied to the surface and the metal mask is separated from the surface of the FPC 10 after the cream solder is applied, the metal mask does not adhere to the adhesive pattern 2. Therefore, after the cream solder is applied to the surface of the FPC 10, the metal mask can be satisfactorily separated from the surface of the FPC 10, and it is possible to suppress the occurrence of manufacturing defects.

In addition, the adhesive pattern 2 is thicker than the surface of the plate 3 depending on the thickness of the laminated plate placed on the surface of the jig 1 or each thickness area of the FPC 10 (the convex portion 13 and other portions). The size is different. As a result, the FPC 10 can be stably held on the surface of the jig 1, so that the FPC 10 can be reliably processed on the jig 1.

Further, the weakly sticky adhesive pattern 2 has a different adhesive force depending on each of the laminated plates to be placed on the surface of the jig 1 or each of the adhered regions of the FPC 10 (the convex portions 13 and other portions). It is configured to include a plurality of different adhesive force regions C and D. Therefore, when the laminated plate or the FPC 10 placed on the surface of the jig 1 is processed, and when the laminated plate or the FPC 10 is removed from the jig 1 after the processing, it is good without causing a problem. It becomes possible to do it.

6 to 8 are views showing another embodiment of the present invention. The embodiment shown in these figures is based on FIG.
6 to 8, the same parts as those of FIGS. 1 to 5 are designated by the same reference numerals and the description thereof will be omitted. .

First, the second embodiment shown in FIG. 6 will be described. FIG. 6 is a cross-sectional view of the jig 1 shown in FIG. The present embodiment is different from the first embodiment shown in FIGS. 1 to 5 in that the conductive portion forming the FPC 10 shown in FIG. The point is that the non-adhesive pattern 24 is formed by subjecting the position 21 corresponding to 12 and 14 to the surface roughening treatment. Here, this roughening treatment includes, for example, a method of scanning the surface with a laser, a method of roughening the surface by sandblasting, a method of screen-printing a silicone resin on the surface in a mesh shape, and the like. With this configuration, the same operation and effect as those of the above-described embodiment can be obtained.

Next, a third embodiment shown in FIG. 7 will be described. FIG. 7 is a cross-sectional view of the jig 1 shown in FIG. The present embodiment is different from the second embodiment shown in FIG. 6 in that the conductive parts 12, 14 constituting the FPC 10 shown in FIG. 4 are formed on the surface of the weakly viscous adhesive layer 20 formed on the surface of the plate 3. The point is that the non-adhesive pattern 22 is formed at a position corresponding to. Here, non-sticky pattern 2
2 includes, for example, resist ink for printed wiring boards, cover array / polyimide resin, aluminum foil, stainless foil, and the like. With this configuration, the same operation and effect as those of the above-described embodiment can be obtained.

Next, a fourth embodiment shown in FIG. 8 will be described. FIG. 8 is a cross-sectional view of the jig 1 shown in FIG. This embodiment is the second and third embodiments shown in FIGS. 6 and 7.
4 is different from that of the first embodiment in that the weakly viscous adhesive layer 20 formed on the surface of the plate 3 has a weak adhesive bond at a position corresponding to the non-conducting portions 13 and 15 constituting the FPC 10 shown in FIG. This is the point where the agent pattern 23 is formed. With this configuration, the same operation and effect as those of the above-described embodiment can be obtained.

In the embodiment shown in FIGS. 2 and 8 described above, when forming the weak adhesive adhesive pattern 2 on the surface of the plate 3, a manufacturing method such as a screen printing method, a machining process such as a counterbore process, or the like. Does not matter, as long as the weak adhesive adhesive pattern 2 is limitedly formed at the position corresponding to the non-conducting portions 13 and 15.

Further, in the embodiment shown in FIG. 6 described above, the weakly adhesive adhesive layer 2 formed on the surface of the plate 3 is used.
On the 0 surface, the conducting parts 12 and 14 constituting the FPC 10 are formed.
The non-adhesive pattern 24 was formed by subjecting the surface to a roughening treatment at a position corresponding to, but at a position corresponding to the conducting portions 12 and 14 on the contact surface of the FPC 10 with the surface of the jig 1.
Even if the surface is roughened, the same effect as described above can be obtained. Further, in the embodiment shown in FIG. 6, roughening treatment may be similarly performed between the non-adhesive patterns 24. With this configuration, after the cream solder is applied to the surface of the FPC 10 held on the surface of the jig 1 by using the metal mask described above, the metal mask is separated from the surface of the FPC 10 when the metal mask is separated from the surface of the FPC 10. It is possible to satisfactorily separate them without sticking to.

[0033]

As is apparent from the above description, according to the invention of claim 1, the weak adhesive adhesive pattern is formed at a position corresponding to the non-conducting portion. In the plate manufacturing process, it is possible to realize good conveyance capable of suppressing the occurrence of manufacturing defects.

According to the second aspect of the present invention, the roughening treatment is applied only to the portion of the surface of the weakly tacky adhesive layer on which the non-conductive portion is placed. The same effect as that of the holding and conveying jig described in No. 1 is exhibited.

According to the third aspect of the present invention, it is possible to stably hold the printed wiring board or the conductive material-clad laminate on the surface of the jig.
It is possible to reliably process the printed wiring board or the conductive material-clad laminate.

According to the invention of claim 4, when the printed wiring board or the conductive material-clad laminate held on the jig is processed, and after the processing, the jig is used to print the printed wiring board. Alternatively, when the conductive material-clad laminate is removed, it can be satisfactorily performed without causing a problem.

According to the invention of claim 5, the portion of the surface of the weakly tacky adhesive layer on which the non-conducting portion is placed is masked in a limited manner.
The same effect as that of the holding and conveying jig according to the first aspect is exhibited.

According to the invention of claim 6, only the non-conducting portion is held on the surface of the weakly adhesive adhesive pattern,
Since the conductive portion is placed so as to be positioned in a portion where the weak adhesive adhesive pattern is not formed, it is possible to hold and convey a good printed wiring board that can suppress the occurrence of a defect in manufacturing. Can be realized.

According to the seventh aspect of the present invention, only the portion where the non-conductive portion is to be formed is held on the surface of the weak adhesive adhesive pattern, and the portion where the conductive portion is to be formed is the weak adhesive adhesive. Since it is placed so as to be positioned in a portion where the agent pattern is not formed, it is possible to realize good holding and carrying of the conductive material-clad laminate, which can suppress the occurrence of manufacturing defects. .

[Brief description of drawings]

FIG. 1 is a schematic plan view of a holding and conveying jig shown as an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the jig for holding and conveying shown in FIG.

3 is a side view showing a copper-clad laminate held on the surface of the holding and conveying jig shown in FIG. 1. FIG.

4 is a plan view showing a printed wiring board formed and held on the surface of the holding and conveying jig shown in FIG. 1. FIG.

5 is a plan view showing a state where the printed wiring board shown in FIG. 4 is held on the surface of the holding and conveying jig shown in FIG.

FIG. 6 is a sectional view showing a holding and conveying jig shown as a second embodiment of the present invention.

FIG. 7 is a sectional view showing a holding and conveying jig shown as a third embodiment of the present invention.

FIG. 8 is a cross-sectional view showing a holding and conveying jig shown as a fourth embodiment of the present invention.

[Explanation of symbols]

1 Holding and transporting jig 2 Weak adhesive pattern 3 plates 10 FPC (printed wiring board) 12 Conductor pattern (conduction part) 13 Convex part (non-conductive part) 14 terminals (conduction part) 15 Insulation part (non-conduction part) 20 Weak adhesive layer 22 Non-stick pattern 30 Copper (conductive material) clad laminate 32 Conducting part formation planned part 33 Non-conductive part formation planned part A, B thickness area C, D adhesion area

─────────────────────────────────────────────────── --- Continuation of front page (56) References JP-A-1-98094 (JP, A) JP-A-4-342196 (JP, A) JP-A-2001-144430 (JP, A) JP-A-2000-261193 ( JP, A) JP 2001-210998 (JP, A) JP 2002-232197 (JP, A) JP 2002-374062 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 13/04 H05K 3/00 H05K 3/34 H05K 13/02

Claims (7)

(57) [Claims] 1. A weakly adhesive adhesive is applied to a surface of a plate on which a printed wiring board having a conducting portion and a non-conducting portion on the surface or a conductive material-clad laminate for manufacturing the printed wiring board is placed and held. A holding / transporting jig having a pattern, wherein the weakly adhesive adhesive pattern is formed at a position corresponding to the non-conductive portion. 2. A weakly adhesive adhesive on a surface of a plate on which a printed wiring board having conductive parts and non-conductive parts on the surface or a conductive material-clad laminate for manufacturing the printed wiring board is placed and held. A jig for holding and transporting a layer, wherein a weak tacky adhesive pattern subjected to a roughening treatment is formed at a position corresponding to the conducting portion on the surface of the weakly tacky adhesive layer. A holding and conveying jig characterized in that 3. The jig for holding and transporting according to claim 1, wherein the weak adhesive adhesive pattern has a plurality of thickness regions having different thickness dimensions from the plate surface. A holding and conveying jig characterized in that 4. The jig for holding and conveying according to claim 1, wherein the weakly adhesive adhesive pattern has a plurality of adhesive force regions having different adhesive forces. Hold and transfer jig. 5. The jig for holding and conveying according to claim 2, wherein a non-adhesive pattern is formed at a position corresponding to the conductive portion on the surface of the weakly adhesive adhesive layer. Hold and transfer jig. 6. A holding / conveying method for conveying a printed wiring board having a conducting portion and a non-conducting portion on the surface thereof while being held on a surface of a holding / conveying jig having a weak adhesive adhesive pattern on the surface. Then, when the printed wiring board is held on the surface of the jig for holding and carrying, the holding and carrying method is characterized in that the non-conductive portion is limitedly placed on the surface of the weakly adhesive adhesive pattern. 7. A conductive material-clad laminate for producing a printed wiring board having a conducting portion and a non-conducting portion on its surface is held on the surface of a holding and conveying jig having a weak adhesive adhesive pattern on its surface. A method of holding and transporting in a state where the conductive material-clad laminate is held on the surface of the jig for holding and transporting, the portion to be formed of the non-conducting portion is limited to the weak adhesive adhesive. A holding and conveying method characterized by placing on a pattern surface.