CN104647844A - Laminated waterproof circuit board and manufacturing method thereof - Google Patents
Laminated waterproof circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN104647844A CN104647844A CN201510040024.4A CN201510040024A CN104647844A CN 104647844 A CN104647844 A CN 104647844A CN 201510040024 A CN201510040024 A CN 201510040024A CN 104647844 A CN104647844 A CN 104647844A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- eva film
- film layer
- eva
- pasting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/73—Hydrophobic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a laminated waterproof circuit board. The laminated waterproof circuit board comprises a paster circuit board, wherein an EVA film layer is paved on the surface of the paster circuit board; PET film layers are paved on front and back surfaces of the paster circuit board; the paster circuit board is sealed inside by the EVA film layer and the PET film layers. The invention further relates to a manufacturing method for the laminated waterproof circuit board, wherein the manufacturing method comprises the following steps: paving the EVA films and attaching the EVA films on one surface or front and back surfaces of the paster circuit board so as to cover the paster circuit board by the EVA films; paving the PET films on the front and the back surfaces of the paster circuit board respectively so as to cover the two surfaces of the paster circuit board by the PET films; fusing and sealing, putting the paster circuit board into a laminating machine, heating a chamber of the laminating machine to a constant temperature of 120-130 DEG C, melting the EVA films, tightly adhering the EVA films on the surfaces of the paster circuit board, and fusing and sealing the EVA films together with the PET films; curing and cooling for curing the EVA film and the PET films.
Description
[technical field]
The present invention relates to a kind of laminated waterproof circuit board and manufacture method thereof.
[background technology]
Existing waterproof circuit board be usually all be everlasting circuit board control box in fill with resin glue or other silica gel, this structural volume is large, and cost is high.And permanent resin or the perishable implosion of other silica gel of using is intake, life of product is not long.
Therefore, be necessary to solve as above problem.
[summary of the invention]
Instant invention overcomes the deficiency of above-mentioned technology, provide a kind of good water-proof effect, volume is little, and thickness is thin, the laminated waterproof circuit board that the life-span is long.
Another object of the present invention there is provided good water-proof effect, and volume is little, and thickness is thin, the manufacture method of the laminated waterproof circuit board that the life-span is long.
For achieving the above object, present invention employs following technical proposal:
A kind of laminated waterproof circuit board, it is characterized in that including pasting circuit board 1, the surface of pasting circuit board 1 is equipped with EVA film layer 2, be equipped with PET film layer 3 at the tow sides of pasting circuit board 1, after described EVA film layer 2, PET film layer 3 heating and melting, pasting circuit board 1 be sealed in the inside and realize waterproof effect.
A kind of laminated waterproof circuit board as above, is characterized in that described EVA film layer 2 is laid on the tow sides of pasting circuit board 1 respectively.
A kind of laminated waterproof circuit board as above, it is characterized in that described EVA film layer 2 be placed in nexine and with pasting circuit board 1 surface directly contact, described PET film layer 3 be placed in skin and with EVA film layer 2 surface contact.
A kind of laminated waterproof circuit board as above, is characterized in that described EVA film layer 2, PET film layer 3 is transparent rete.
A preparation method for laminated waterproof circuit board, is characterized in that including following steps:
A, lay EVA film, stick EVA film in the one side of pasting circuit board or tow sides, make EVA film cover one side or the two sides of pasting circuit board;
B, laying PET film, the tow sides on the pasting circuit board laying EVA film re-lay PET film respectively, make PET film cover the two sides of pasting circuit board;
C, melting sealed, put the pasting circuit board laying EVA film and PET film into laminating machine, in the chamber of laminating machine by heating temperatures to constant temperature 120 DEG C-130 DEG C, EVA film is melted, with with simultaneously in chamber, be also in vacuum state, vacuum state keeps 5-7 minute, afterwards inflating pressure a few second in chamber, make EVA film be close to the surface of pasting circuit board and EVA film and PET film melting sealed;
D, solidification, open chamber cooling down, makes EVA film and PET film solidification, complete whole flow process.
The preparation method of a kind of laminated waterproof circuit board as above, is characterized in that in step C, and the heating temperatures in chamber is to 120 DEG C-130 DEG C, and the vacuum in chamber is at-95KPa to-100KPa.
The preparation method of a kind of laminated waterproof circuit board as above, is characterized in that in step C, and the heat time of pasting circuit board is 12-15 minute.
The invention has the beneficial effects as follows:
Be equipped with EVA film layer, PET film layer on the surface of pasting circuit board, EVA film and PET film are close on pasting circuit board, thus realize water-tight effect, and result of use is good, the life-span is long.
In addition, utilize certain temperature and certain vacuum state, realize EVA film and PET film to be close on pasting circuit board.The method manufactures simple and convenient, and cost of manufacture is low, its good product effect of making.
Have the present invention also to have output higher, efficiency is high, and cost reduces greatly, and cost at least reduces by 90% than traditional cost.
There is volume in addition little, the advantage that thickness is thin.
[accompanying drawing explanation]
Fig. 1 is structural representation of the present invention.
Fig. 2 is cut-away view of the present invention.
[detailed description of the invention]
Be described in further detail below in conjunction with accompanying drawing and embodiments of the present invention:
As shown in the figure, a kind of laminated waterproof circuit board, include pasting circuit board 1, the surface of pasting circuit board 1 is equipped with EVA film layer 2, be equipped with PET film layer 3 at the tow sides of pasting circuit board 1, after described EVA film layer 2, PET film layer 3 heating and melting, pasting circuit board 1 be sealed in the inside and realize waterproof effect.EVA film layer 2 is primary raw material with ethylene-vinyl acetate (English name: ethylenevinyl acetate, be called for short EVA), after adding modified additive, logically to extrude-curtain coating obtains the thermoplastic sheet flexible material that method obtains.Be the sticking glued membrane of a kind of thermosetting, it has good flexibility and elasticity.Long service life, effective.And PET film has another name called high temperature resistance polyester film.It has excellent physical property, chemical property and dimensional stability, the transparency.EVA film layer 2, PET film layer 3 all have high and low temperature resistance.
As the preferred embodiment of the present embodiment, described EVA film layer 2 is laid on the tow sides of pasting circuit board 1 respectively.The tow sides of pasting circuit board 1 are equipped with EVA film layer 2, make its sealing effectiveness better, and it is more lasting to use.
As the preferred embodiment of the present embodiment, described EVA film layer 2 be placed in nexine and with pasting circuit board 1 surface directly contact, described PET film layer 3 be placed in skin and with EVA film layer 2 surface contact.Described EVA film layer 2, PET film layer 3 are transparent rete.So also can see circuit and electronic component clearly, circuit board, being energized in use in the future, burns out if any components and parts appearance point of also can pinpointing the problems intuitively, is convenient to rapid-maintenance and changes components and parts.EVA film layer 2 of the present invention, PET film layer 3 also have the thin advantage of thickness, can be thinned to 3-4mm, and cost is very low.
A preparation method for laminated waterproof circuit board, includes following steps:
A, laying EVA film, stick EVA film in the front of pasting circuit board or tow sides, makes EVA film cover one side or the two sides of pasting circuit board.In the present embodiment, EVA film is layered on the tow sides of pasting circuit board.
B, laying PET film, the tow sides on the pasting circuit board laying EVA film re-lay PET film respectively, make PET film cover the two sides of pasting circuit board.
C, melting sealed, put the pasting circuit board laying EVA film and PET film into laminating machine, in the chamber of laminating machine by heating temperatures to 120 DEG C ~ 130 DEG C, EVA film is melted, with with simultaneously in chamber, be also in vacuum state, vacuum state keeps 5-7 minute, afterwards inflating pressure a few second in chamber, make EVA film be close to the surface of pasting circuit board and EVA film and PET film melting sealed.
D, solidification, open chamber cooling down, makes EVA film and PET film solidification, complete whole flow process.
As the preferred embodiment of the present embodiment, in step C, the heating temperatures in chamber is to 120 DEG C ~ 130 DEG C, and the vacuum in chamber is at-95KPa to-100KPa.In step C, the heat time of pasting circuit board is 12 ~ 15 minutes.In the temperature of these scopes, under the effect of vacuum and time, make the fusing better effects if of EVA film and PET film, fit tighter.Described EVA film can be dissolved temperature 120 degree, and lower than the molten point of scolding tin in control circuit board 160 ~ 180 degree, therefore scolding tin can not dissolve.
Claims (7)
1. a laminated waterproof circuit board, it is characterized in that including pasting circuit board (1), the surface of pasting circuit board (1) is equipped with EVA film layer (2), be equipped with PET film layer (3) at the tow sides of pasting circuit board (1), after described EVA film layer (2), PET film layer (3) heating and melting, pasting circuit board (1) be sealed in the inside and realize waterproof effect.
2. a kind of laminated waterproof circuit board according to claim 1, is characterized in that described EVA film layer (2) is laid on the tow sides of pasting circuit board (1) respectively.
3. a kind of laminated waterproof circuit board according to claim 2, it is characterized in that described EVA film layer (2) is placed in nexine and directly contacts with pasting circuit board (1) surface, described PET film layer (3) be placed in skin and with EVA film layer (2) surface contact.
4. a kind of laminated waterproof circuit board according to claim 2, is characterized in that described EVA film layer (2), PET film layer (3) is transparent rete.
5. a preparation method for laminated waterproof circuit board, is characterized in that including following steps:
A, lay EVA film, stick EVA film in the one side of pasting circuit board or tow sides, make EVA film cover one side or the two sides of pasting circuit board;
B, laying PET film, the tow sides on the pasting circuit board laying EVA film re-lay PET film respectively, make PET film cover the two sides of pasting circuit board;
C, melting sealed, put the pasting circuit board laying EVA film and PET film into laminating machine, in the chamber of laminating machine by heating temperatures to constant temperature 120 DEG C-130 DEG C, EVA film is melted, with with simultaneously in chamber, be also in vacuum state, vacuum state keeps 5-7 minute, afterwards inflating pressure a few second in chamber, make EVA film be close to the surface of pasting circuit board and EVA film and PET film melting sealed;
D, solidification, open chamber cooling down, makes EVA film and PET film solidification, complete whole flow process.
6. the preparation method of a kind of laminated waterproof circuit board according to claim 5, is characterized in that in step C, and the heating temperatures in chamber is to 120 DEG C-130 DEG C, and the vacuum in chamber is at-95KPa to-100KPa.
7. according to the preparation method of a kind of laminated waterproof circuit board according to claim 5, it is characterized in that in step C, the heat time of pasting circuit board is 12-15 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510040024.4A CN104647844B (en) | 2015-01-27 | 2015-01-27 | A kind of preparation method of laminated waterproof circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510040024.4A CN104647844B (en) | 2015-01-27 | 2015-01-27 | A kind of preparation method of laminated waterproof circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104647844A true CN104647844A (en) | 2015-05-27 |
| CN104647844B CN104647844B (en) | 2017-05-31 |
Family
ID=53239700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510040024.4A Active CN104647844B (en) | 2015-01-27 | 2015-01-27 | A kind of preparation method of laminated waterproof circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104647844B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111417269A (en) * | 2020-04-08 | 2020-07-14 | 中山市睿科智能电子有限公司 | Printed circuit board paster processing technology |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101916788A (en) * | 2010-04-23 | 2010-12-15 | 杭州索乐光电有限公司 | Solar panel and encapsulation process |
| CN101982886A (en) * | 2010-09-13 | 2011-03-02 | 东莞市华源光电科技有限公司 | Production process of PET laminated solar cell plate |
| CN201829514U (en) * | 2010-09-13 | 2011-05-11 | 东莞市华源光电科技有限公司 | Special solar-cell panel of swimming pool cleaning machine |
| KR101223887B1 (en) * | 2011-11-23 | 2013-01-17 | 주식회사 넥스필 | Sputter coated with boron compounds, thermal shutdown films manufacturing process that combines a transparent way |
| CN103002662A (en) * | 2012-10-22 | 2013-03-27 | 王新颖 | Waterproof circuit board production method |
| CN204488156U (en) * | 2015-01-27 | 2015-07-22 | 中山市索伦太阳能光电有限公司 | A kind of laminated waterproof circuit board |
-
2015
- 2015-01-27 CN CN201510040024.4A patent/CN104647844B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101916788A (en) * | 2010-04-23 | 2010-12-15 | 杭州索乐光电有限公司 | Solar panel and encapsulation process |
| CN101982886A (en) * | 2010-09-13 | 2011-03-02 | 东莞市华源光电科技有限公司 | Production process of PET laminated solar cell plate |
| CN201829514U (en) * | 2010-09-13 | 2011-05-11 | 东莞市华源光电科技有限公司 | Special solar-cell panel of swimming pool cleaning machine |
| KR101223887B1 (en) * | 2011-11-23 | 2013-01-17 | 주식회사 넥스필 | Sputter coated with boron compounds, thermal shutdown films manufacturing process that combines a transparent way |
| CN103002662A (en) * | 2012-10-22 | 2013-03-27 | 王新颖 | Waterproof circuit board production method |
| CN204488156U (en) * | 2015-01-27 | 2015-07-22 | 中山市索伦太阳能光电有限公司 | A kind of laminated waterproof circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111417269A (en) * | 2020-04-08 | 2020-07-14 | 中山市睿科智能电子有限公司 | Printed circuit board paster processing technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104647844B (en) | 2017-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103270618B (en) | The method of encapsulating electronic device | |
| WO2011156397A3 (en) | Solar cell interconnection, module, panel and method | |
| US20150173229A1 (en) | Waterproof box structure | |
| JP2015536265A5 (en) | ||
| WO2011047471A8 (en) | Method of melt bonding high-temperature thermoplastic based heating element to a substrate | |
| CN202873096U (en) | Novel electrothermal film | |
| CN204488156U (en) | A kind of laminated waterproof circuit board | |
| CN104647844A (en) | Laminated waterproof circuit board and manufacturing method thereof | |
| CN107833941B (en) | Processing method for eliminating bubbles at outlet of lead of dual-glass assembly | |
| CN208814940U (en) | A kind of waterproof and breathable membrane module | |
| JP6685663B2 (en) | Fever sheet | |
| CN106810088A (en) | Glyglass manufacture method and glyglass | |
| CN101091415B (en) | Soil-heating device particularly for soil covered by a synthetic surface | |
| CN202702766U (en) | Waterproof breathable film | |
| CN208675563U (en) | Carbon heat source composite membrane | |
| CN102231923A (en) | Method for preparing internal heating strengthened composite plate adhered by ultraviolet (UV) shadowless glue | |
| CN201762277U (en) | Traceless random laminating product | |
| CN205232478U (en) | Planar heater | |
| CN106817784A (en) | Plane heater and its manufacture method | |
| CN109661534B (en) | Outer skin material for vacuum insulation material | |
| CN110299419A (en) | A kind of coating technique of new type solar energy flexible unit | |
| CN102991052B (en) | A kind of 3D three-dimensional imaging film and application thereof | |
| CN111403513A (en) | Solar power supply clothes, and packaging method and device of solar cell module | |
| CN107796038A (en) | A kind of integrated electro-thermal ceramic tile | |
| CN219028794U (en) | Composite PVC high-barrier film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 528400 347 Cao two North East Road, Zhongshan, Guangdong Patentee after: Guangdong Sauron Au Optronics Co Address before: 528400 347 Cao two North East Road, Zhongshan, Guangdong Patentee before: Soren, Zhongshan city solar photoelectric Co., Ltd |