CN107833941B - Processing method for eliminating bubbles at outlet of lead of dual-glass assembly - Google Patents
Processing method for eliminating bubbles at outlet of lead of dual-glass assembly Download PDFInfo
- Publication number
- CN107833941B CN107833941B CN201711047827.8A CN201711047827A CN107833941B CN 107833941 B CN107833941 B CN 107833941B CN 201711047827 A CN201711047827 A CN 201711047827A CN 107833941 B CN107833941 B CN 107833941B
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- China
- Prior art keywords
- gasket
- dual
- lead
- glass assembly
- opening
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000011521 glass Substances 0.000 title claims abstract description 73
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- 238000010030 laminating Methods 0.000 claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000005452 bending Methods 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 230000009977 dual effect Effects 0.000 claims description 15
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 12
- 230000000873 masking effect Effects 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 description 9
- 230000005574 cross-species transmission Effects 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 5
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 235000015847 Hesperis matronalis Nutrition 0.000 description 1
- 240000004533 Hesperis matronalis Species 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Joining Of Glass To Other Materials (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a processing method for eliminating bubbles at a lead outlet of a dual-glass assembly, which comprises the following steps of: manufacturing a gasket with an opening in the middle and matched with the opening on the back of the dual-glass assembly; placing the gasket at the position of the opening on the back surface of the dual-glass assembly, and enabling the lead of the dual-glass assembly to penetrate out of the opening of the gasket; bending the lead wires towards two sides of the opening of the gasket until the lead wires are attached to the gasket; sealing the opening of the gasket by using the masking paper, and fixing the lead on the gasket; and laminating and packaging the sealed double-glass assembly in a laminator. The method can effectively remove gas in the glue, so that the dual-glass assembly is more attractive, longer in service life and very high in practicability.
Description
Technical Field
The invention relates to the technical field of dual-glass assembly manufacturing, in particular to a processing method for eliminating bubbles at a lead outlet of a dual-glass assembly.
Background
With the maturity and development of the photovoltaic industry market, the demand of the assembly is also bigger and bigger, and the dual-glass assembly becomes a new favorite of the industry due to the light transmission and the durability of the dual-glass assembly.
In the prior art, in the manufacture of the dual-glass assembly, glass is arranged above and below the outermost layer of the assembly, a battery piece assembly string is sandwiched by two layers of adhesive films in the middle, the glass-adhesive film-battery-adhesive film-glass is arranged in sequence, then a lead penetrates out of a glass hole of back glass and is bent to two sides, and then the assembly is packaged in a laminating machine in the process of heating, vacuumizing and pressurizing. Because the glass hole of the back glass is in an open state, the gas coming out of the inner part (between the upper layer of glass and the lower layer of glass) and the adhesive film are converged at the glass opening together to form a bubble group when the gas and the adhesive film are melted into a viscous state after being heated, the appearance of the glass hole of the component is unsightly, and the service life of the component is influenced by the existence of bubbles. Therefore, a method for eliminating the air bubbles at the outlet of the lead wire of the dual-glass assembly needs to be found.
Disclosure of Invention
Aiming at the technical problems, the invention provides a processing method for eliminating bubbles at the outlet of a dual-glass assembly lead wire, which can effectively eliminate the bubbles at the outlet of the dual-glass assembly lead wire and eliminate the accidental adhesive on the lead wire.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the processing method for eliminating bubbles at the outlet of the lead wire of the dual-glass assembly comprises the following steps:
manufacturing a gasket with an opening in the middle and matched with the opening on the back of the dual-glass assembly;
placing the gasket at the position of the opening on the back surface of the dual-glass assembly, wherein the lead of the dual-glass assembly penetrates out of the opening of the gasket;
bending the lead wire towards two sides of the opening of the gasket until the lead wire is attached to the gasket;
sealing the opening of the gasket by using textured paper, and fixing the lead on the gasket;
and laminating and packaging the sealed double-glass assembly in a laminator.
By adopting the technical scheme, the invention achieves the technical effects that: the gasket is placed through the position at dual glass assembly back open-ended, will lead to buckle to laminating with the gasket, use beautiful line paper to fix the lead wire on the gasket to seal the opening at gasket middle part, make dual glass assembly when the lamination, because dual glass assembly glass hole position is encapsulated situation, the space of dual glass assembly last glass hole position is crowded with by liquid glue, and liquid glue is extruded to gas, and liquid glue still can not spill over simultaneously. The method can effectively remove gas in the glue, so that the dual-glass assembly is more attractive, longer in service life and very high in practicability.
Preferably, in the above technical solution, the gasket is made of teflon.
Preferably, in the above technical solution, the damask paper is pasted along the direction in which the lead is bent.
Preferably, in the above technical solution, after the sealing of the dual glass assembly in the laminator, the method further includes:
and removing the pattern paper, restoring the lead to be in a vertical state, and recovering the gasket.
Preferably, in the above technical solution, during packaging and laminating, a vacuum state of the inner cavity of the laminator needs to be maintained, a heating temperature during laminating is 140 ℃, and a laminating time period is 12 minutes.
Drawings
The invention will be further described with reference to the accompanying drawings in which:
FIG. 1 is a schematic flow chart of a processing method for eliminating air bubbles at the exit of a lead of a dual glass assembly provided by the present invention;
fig. 2 is a schematic structural view of the dual glass assembly before lamination.
Detailed Description
As shown in FIG. 1, the processing method for eliminating bubbles at the outlet of the lead wire of the dual glass assembly provided by the invention comprises the following steps:
manufacturing a gasket with an opening in the middle and matched with the opening on the back of the dual-glass assembly;
placing the gasket at the position of the opening on the back surface of the dual-glass assembly, and enabling the lead of the dual-glass assembly to penetrate out of the opening of the gasket;
bending the lead wires towards two sides of the opening of the gasket until the lead wires are attached to the gasket;
sealing the opening of the gasket by using the masking paper, and fixing the lead on the gasket;
and laminating and packaging the sealed double-glass assembly in a laminator.
As an embodiment, the gasket is made of teflon.
As an implementation mode, the masking paper is pasted along the bending direction of the lead.
As an embodiment, after the sealed dual glass assembly is subjected to lamination packaging in a laminator, the method further comprises the following steps:
removing the masking paper, restoring the lead to be in a vertical state, and recycling the gasket.
In one embodiment, the vacuum state of the inner cavity of the laminating machine is maintained during packaging and laminating, the heating temperature during laminating is 140 ℃, and the laminating time is 12 minutes.
The method comprises the following specific steps:
laying a double-sided glass assembly, namely a double-glass assembly is shown in figure 2, the assembly materials are glass 1-adhesive film 2-battery pack string-adhesive film 3-perforated glass 4 from bottom to top, the laid double-glass assembly (a lead 6 is not bent towards two sides at first), polytetrafluoroethylene cloth is made into a gasket 5 with a middle opening suitable for the opening on the back of the glass, the lead 6 is sleeved with the gasket 5, the lead 6 is bent towards two sides as much as possible, the gasket 5 is fixed between the lead 6 and the glass, the gasket 5 does not move and is tightly attached to the glass, then a glass hole is adhered and sealed by schlieren paper 7 along the direction of the lead 6, and the schlieren paper 7 is required to completely seal the opening and tightly adhere the lead 6 and the teflon gasket 5 together. After the manufacture is finished, the assembly is sent into a laminating machine for lamination and packaging, and the lamination process comprises heating at 140 ℃, vacuumizing for 6 minutes and pressurizing and laminating for 12 minutes. In the laminating process, as the glass holes are sealed, the space at the glass holes is filled and squeezed by the liquid glue, and the gas is squeezed out by the liquid glue and becomes free of bubbles. Because glass hole department is sealed, the liquid glue can not openly spill over, lead wire 6 below because have the tetrafluoro cloth gasket 5 to keep apart, only can a small amount glue spill over or not spill over below gasket 5, and spill over glue can not glue on lead wire 6 because have the gasket 5 to keep apart. After the assembly is laminated, the seal masking paper 7 is removed, the lead 6 is recovered to be in a vertical state, and the gasket 5 is taken down for recycling.
By adopting the technical scheme, the invention achieves the technical effects that: the gasket is placed through the position at dual glass assembly back open-ended, will lead to buckle to laminating with the gasket, use beautiful line paper to fix the lead wire on the gasket to seal the opening at gasket middle part, make dual glass assembly when the lamination, because dual glass assembly glass hole position is encapsulated situation, the space of dual glass assembly last glass hole position is crowded with by liquid glue, and liquid glue is extruded to gas, and liquid glue still can not spill over simultaneously. The method can effectively remove gas in the glue, so that the dual-glass assembly is more attractive, longer in service life and very high in practicability.
The foregoing embodiments are intended to illustrate that the invention may be implemented or used by those skilled in the art, and modifications to the above embodiments will be apparent to those skilled in the art, and therefore the invention includes, but is not limited to, the above embodiments, any methods, processes, products, etc., consistent with the principles and novel and inventive features disclosed herein, and fall within the scope of the invention.
Claims (3)
1. A processing method for eliminating bubbles at a lead wire outlet of a dual-glass assembly is characterized by comprising the following steps:
manufacturing a gasket with an opening in the middle and matched with the opening on the back of the dual-glass assembly;
placing the gasket at the position of the opening on the back surface of the dual-glass assembly, wherein the lead of the dual-glass assembly penetrates out of the opening of the gasket;
bending the lead wire towards two sides of the opening of the gasket until the lead wire is attached to the gasket;
sealing the opening of the gasket by using textured paper, and fixing the lead on the gasket;
laminating and packaging the sealed double-glass assembly in a laminating machine;
the pattern paper is pasted along the bending direction of the lead;
and removing the pattern paper, restoring the lead to be in a vertical state, and recovering the gasket.
2. The processing method for eliminating air bubbles at a lead outlet of a dual glass assembly as recited in claim 1, wherein the gasket is a gasket made of tetrafluoro cloth.
3. The processing method for eliminating air bubbles at the lead outlet of the dual glass assembly as recited in claim 1, wherein during packaging and laminating, the vacuum state of the inner cavity of the laminating machine is maintained, the heating temperature during laminating is 140 ℃, and the laminating time is 12 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711047827.8A CN107833941B (en) | 2017-10-31 | 2017-10-31 | Processing method for eliminating bubbles at outlet of lead of dual-glass assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711047827.8A CN107833941B (en) | 2017-10-31 | 2017-10-31 | Processing method for eliminating bubbles at outlet of lead of dual-glass assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107833941A CN107833941A (en) | 2018-03-23 |
| CN107833941B true CN107833941B (en) | 2020-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711047827.8A Expired - Fee Related CN107833941B (en) | 2017-10-31 | 2017-10-31 | Processing method for eliminating bubbles at outlet of lead of dual-glass assembly |
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| Country | Link |
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| CN (1) | CN107833941B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112063314B (en) * | 2019-05-24 | 2022-08-05 | 滁州隆基乐叶光伏科技有限公司 | Laminating method of photovoltaic module and equipment for sticking adhesive tape |
| CN111599897A (en) * | 2020-06-09 | 2020-08-28 | 山西潞安太阳能科技有限责任公司 | Method for solving problem of bubbles at hole positions of dual-glass outgoing line |
| CN114512562B (en) * | 2022-01-29 | 2024-07-19 | 福斯特(嘉兴)新材料有限公司 | Double-glass assembly, packaging method thereof and electronic component |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006021273A1 (en) * | 2006-05-05 | 2007-11-08 | Carl Freudenberg Kg | Separator for placement in batteries and battery |
| CN103367498B (en) * | 2012-04-09 | 2016-02-24 | 中电电气(上海)太阳能科技有限公司 | The two glass assembly of a kind of solar energy and method for packing thereof |
| CN202758908U (en) * | 2012-04-09 | 2013-02-27 | 中电电气(上海)太阳能科技有限公司 | Solar double-glass assembly |
| CN205319173U (en) * | 2016-01-06 | 2016-06-15 | 中节能太阳能科技（镇江）有限公司 | Dual glass assembly |
| CN206357771U (en) * | 2016-12-27 | 2017-07-28 | 阿特斯阳光电力集团有限公司 | The auxiliary element of double glass photovoltaic module laminations |
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- 2017-10-31 CN CN201711047827.8A patent/CN107833941B/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN107833941A (en) | 2018-03-23 |
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Effective date of registration: 20211122 Address after: 072550 no.4685, Changcheng North Street, Xushui District, Baoding City, Hebei Province Patentee after: Hebei Zhaoneng New Energy Technology Co.,Ltd. Address before: 072550 Xushui District, Baoding City, Hebei Province, Juli Road Patentee before: JULI NEW ENERGY Co.,Ltd. |
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