CN113825384B - Method for preventing SMT patch from secondarily melting tin - Google Patents
Method for preventing SMT patch from secondarily melting tin Download PDFInfo
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- CN113825384B CN113825384B CN202110905472.1A CN202110905472A CN113825384B CN 113825384 B CN113825384 B CN 113825384B CN 202110905472 A CN202110905472 A CN 202110905472A CN 113825384 B CN113825384 B CN 113825384B
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- cover plate
- fpc
- positioning
- carrier
- solder paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method for preventing secondary tin melting of an SMT patch, which comprises the steps of sequentially aligning and mounting a carrier, an FPC (flexible printed circuit) and a positioning cover plate on a base through positioning columns arranged on the base; and as a first processing body is placed on a conveying track of a solder paste printing machine; printing solder paste and pasting devices on the FPC in the first processed body through a solder paste printing machine; taking out the positioning cover plate above the FPC; the heat insulation cover plate is arranged above the FPC through the positioning column; and taking out the second processing body from the base and putting the second processing body into an inlet of a tunnel reflow furnace to process the high-temperature tin-melting welding device. According to the embodiment of the invention, through using the steel plate with better positioning during the operation of printing the solder paste and pasting the device and using the heat insulation cover plate with poor heat conduction capability during the high-temperature reflow operation, the accurate positioning during the operation of printing the solder paste and pasting the device can be completed, the relative stability of the FPC is maintained, and the phenomenon of secondary tin melting caused by heating of tin plating fingers on the FPC during the SMT welding process can be avoided.
Description
Technical Field
The invention relates to the technical field of FPC processing, in particular to a method for preventing secondary tin melting of an SMT patch.
Background
In recent years, along with the development of electronic products in a light and thin direction, more and more FPCs are applied in the electronic products to replace the original harness design so as to meet the requirements of the electronic product design, in the FPC production process, SMT paster operation is required, when the device is subjected to hot press welding through a reflow oven, the tin melting point is lower than the reflow oven welding temperature during SMT paster, the tin plating fingers on the FPCs can be heated for secondary tin melting phenomenon during SMT welding, tin paste aggregation bulges on the tin plating fingers after tin melting, and the thickness and uniformity of the tin surface change so as to cause the cold welding problem during hot press welding (the requirements on the thickness and the flatness of the tin plating fingers on the FPCs are higher, generally the requirements on the thickness of 15-30um are required, and conventionally, tin plating processing is performed during the FPC production stage so as to perform prefabricated tin processing, so that the requirements on tin thickness and flatness are met).
Disclosure of Invention
The invention aims to provide a method for preventing tin from being secondarily melted by an SMT (surface mount technology) patch, and aims to solve the problem that tin plating fingers on an FPC are heated to secondarily melt tin in the SMT welding process in the prior art.
The embodiment of the invention provides a method for preventing secondary tin melting of an SMT patch, which comprises the following steps:
sequentially aligning and mounting the carrier, the FPC and the positioning cover plate on the base through positioning columns arranged on the base;
taking out the carrier, the FPC and the positioning cover plate after alignment and placing the carrier, the FPC and the positioning cover plate on a conveying track of a printing solder paste machine as a first processing body;
performing solder paste printing and device pasting operation on the FPC in the first processing body through the solder paste printing machine;
taking out the first processed body attached with the device, mounting the first processed body on the base, and taking out a positioning cover plate above the FPC;
installing a heat insulation cover plate above the FPC through the positioning column;
and taking the carrier, the FPC and the heat insulation cover plate out of the base as a second processing body, putting the second processing body into an inlet of a tunnel reflow furnace, and processing a high-temperature tin melting welding device.
According to the embodiment of the invention, the cover plates in the operation of printing the solder paste and pasting the device and the high-temperature reflow operation are distinguished, the steel plate with better positioning is used in the operation of printing the solder paste and pasting the device, the heat insulation cover plate with poorer heat conduction capability is used in the high-temperature reflow operation, so that the accurate positioning in the operation of printing the solder paste and pasting the device can be finished, the relative stability of the FPC is maintained, the phenomenon that tin plating fingers on the FPC are heated and secondarily melted in the welding process of the SMT (surface mount technology) can be avoided, and the yield of the workpiece is high.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for preventing secondary tin melting of an SMT patch according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first processing body according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a second processing body according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of a heat insulation cover plate according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a second processing body according to an embodiment of the present invention mounted on a base.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1, a method for preventing tin from being secondarily melted by an SMT patch includes steps S101-S106.
Referring to fig. 2, S101: carrier 200, FPC400 and positioning cover 300 are sequentially aligned and mounted on base 710 via positioning posts 720 provided on base 710.
In this embodiment, the base 710 is provided with the positioning column 720, the positioning column 720 is used for positioning the relative positions of the carrier 200, the FPC400 and the positioning cover 300, that is, the carrier 200, the FPC400 and the positioning cover 300 are provided with positioning holes, when the three are installed on the base 710, the positioning holes need to be aligned with the positioning column 720 and fixed on the base 710 by passing through the positioning column 720 through the positioning holes, and when the carrier 200, the FPC400 and the positioning cover 300 are sequentially installed on the base 710, the relative positions of the three are just convenient for performing the device pasting and the solder paste printing operation.
The carrier 200 is used for clamping and fixing the FPC400 by matching with the positioning cover plate 300, so that the FPC400 is prevented from moving relatively, and the influence on the subsequent manufacture caused by dislocation during device pasting and solder paste printing is avoided.
Wherein the positioning cover plate 300 is provided with a device attaching hole, the device attaching hole is aligned to a device attaching position on the FPC400, and a device can be inserted into the device attaching hole from one side of the positioning cover plate 300 away from the FPC400 and attached to the device attaching position.
The carrier 200 is made of synthetic stone, so that the heat conduction capability of the carrier is reduced, and the problem of secondary tin melting of the tin plating finger 410 caused by subsequent high-temperature reflow is avoided.
S102: taking out the carrier 200, the FPC400 and the positioning cover plate 300 after alignment and placing the carrier 200, the FPC400 and the positioning cover plate 300 on a conveying track of a solder paste printing machine as a first processing body;
in this embodiment, the carrier 200, the FPC400 and the positioning cover 300 need to be sent together to the solder paste printing machine for processing, wherein the carrier 200, the FPC400 and the positioning cover 300 are not removed one by one when being removed from the base 710, but are removed as a whole, i.e. the relative positions of the three are not changed when being removed.
S103: performing a solder paste printing and device attaching operation on the FPC400 in the first processed body by the solder paste printing machine;
in this embodiment, after the first processing body is placed on the transfer rail on the printing paste machine, the first processing body is transferred from the transfer rail to the processing station of the printing paste machine, and the device mounting position on the FPC400 is subjected to the operation of printing paste and device mounting through the device mounting hole on the positioning cover plate 300.
S104: taking out and mounting the first processed body after attaching the device on the base 710, and taking out the positioning cover plate 300 above the FPC 400;
in this embodiment, since the positioning cover 300 is a steel sheet, the temperature of the FPC400 may be too high during the high temperature reflow operation, so that the tin-plated fingers 410 on the FPC400 are heated and melted for the second time, and the tin paste is accumulated and swelled, so that the positioning cover 300 needs to be removed and replaced with other covers with poor heat conduction.
Referring to fig. 3-5, S105: mounting a heat insulation cover plate 600 above the FPC400 through the positioning posts 720;
in this embodiment, the heat insulating cover 600 is placed above the FPC400 as a positioning plate, wherein the heat insulating cover 600 is provided with the same hole sites as the device attaching holes and the positioning holes on the positioning cover 300, and when the heat insulating cover 600 is mounted on the FPC400 through the positioning posts 720, the device attaching holes on the heat insulating cover 600 align with the devices, so that the heat insulating cover 600 can be correctly mounted on the FPC 400.
In order to make the heat insulation cover plate 600 have a better heat insulation capability, the heat insulation cover plate 600 includes a synthetic stone layer 620 and a red silica gel layer 610 stacked in sequence, wherein the synthetic stone layer 620 is disposed on one surface of the heat insulation cover plate 600 close to the FPC 400; by arranging the synthetic stone layer 620 and the red silica gel layer 610 with poor heat conducting capability, the heat conducting capability of the heat insulation cover plate 600 can be greatly reduced, and the phenomenon that tin melting occurs due to the fact that the tinning finger 410 is heated by the high temperature at the outer side is avoided.
Wherein, in order to further avoid the excessive temperature at the tinning finger 410, a second sink 230 is disposed on the surface of the carrier 200 facing the FPC400 corresponding to the tinning finger 410; by avoiding direct contact between the tinning finger 410 and the carrier 200, there is a certain space between the tinning finger 410 and the carrier 200, and the space is filled with air, so that the efficiency of conducting outside high temperature from one side of the carrier 200 to the tinning finger 410 is greatly reduced, and the problem of secondary tin melting of the tinning finger 410 during high temperature reflow operation is avoided.
Wherein, in order to further avoid the excessive temperature at the tinning finger 410, a third sink is disposed on the surface of the heat insulation cover plate 600 facing the FPC400 corresponding to the tinning finger 410; by avoiding direct contact between the tin plating finger 410 and the heat insulating cover plate 600, a certain space is provided between the tin plating finger 410 and the heat insulating cover plate 600, and the space is filled with air, so that the efficiency of conducting outside high temperature from one side of the heat insulating cover plate 600 to the tin plating finger 410 is greatly reduced, and the problem of secondary tin melting of the tin plating finger 410 during high-temperature reflow operation is avoided.
S106: the carrier 200, FPC400, and insulating cover 600 are taken out of the base 710 as a second processing body and put into the entrance of a tunnel reflow oven, and high-temperature soldering device processing is performed.
In this embodiment, during the high-temperature reflow process, the second processed body needs to be taken out from the base 710 and put into the entrance of the tunnel reflow furnace, and the relative positions of the carrier 200, FPC400, and insulating cover 600 in the second processed body after the taking out are all the same as those before the taking out.
In order to make the solder paste on the device easier to reach the melting temperature and solder during the high-temperature reflow operation, a first sink 220 is disposed on a surface of the carrier 200 away from the device, which corresponds to the device, and a plurality of through holes 210 are disposed in the first sink 220; through setting up first heavy groove 220 and setting up through-hole 210 between first heavy groove 220 and device on carrier 200 for the temperature conduction between solder paste on the device and the outside high temperature is more direct, can not receive carrier 200's influence and lead to solder paste unable melting and can not reach the effect of soldering the device.
In an embodiment, the depth of the first immersion groove 220 is 1.2-1.8mm, and the distance from each side of the first immersion groove 220 to the corresponding device side is greater than 5mm.
In one embodiment, the depth of the first sink 220 is 1.5mm.
In one embodiment, the depth of the second and third sink grooves 230 and 230 is 0.2-0.8mm, and the distance from each side of the second and third sink grooves to the side of the corresponding tin plating finger 410 is greater than 5mm.
In one embodiment, the second sink trough 230 and the third sink trough have a depth of 0.5mm.
While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (8)
1. A method for preventing tin from being secondarily melted by an SMT patch, which is characterized by comprising the following steps:
sequentially aligning and mounting the carrier, the FPC and the positioning cover plate on the base through positioning columns arranged on the base;
taking out the carrier, the FPC and the positioning cover plate after alignment and placing the carrier, the FPC and the positioning cover plate on a conveying track of a printing solder paste machine as a first processing body;
performing solder paste printing and device pasting operation on the FPC in the first processing body through the solder paste printing machine;
taking out the first processed body attached with the device, mounting the first processed body on the base, and taking out a positioning cover plate above the FPC;
installing a heat insulation cover plate above the FPC through the positioning column;
taking the carrier, the FPC and the heat insulation cover plate out of the base as a second processing body, putting the second processing body into an inlet of a tunnel reflow oven, and carrying out high-temperature tin melting welding device processing;
a first sinking groove is formed in one surface, far away from the device, of the carrier, corresponding to the device, and a plurality of through holes are formed in the first sinking groove;
and a second sinking groove is arranged on one surface of the carrier facing the FPC, which corresponds to the tinned finger.
2. The method for preventing tin from being secondarily melted by using the SMT patch according to claim 1, wherein the method comprises the following steps: and a third sinking groove is arranged on one surface of the heat insulation cover plate, which faces the FPC, corresponding to the tinned finger.
3. The method for preventing tin from being secondarily melted by using the SMT patch according to claim 1, wherein the method comprises the following steps: and device attaching holes are formed in the heat insulation cover plate and the positioning cover plate corresponding to the devices.
4. The method for preventing tin from being secondarily melted by using the SMT patch according to claim 1, wherein the method comprises the following steps: and positioning holes for the positioning columns to pass through are formed in the carrier, the FPC, the positioning cover plate and the heat insulation cover plate.
5. The method of claim 1, wherein the carrier is made of synthetic stone and the positioning cover plate is a steel plate.
6. The method of claim 1, wherein the heat-insulating cover plate comprises a synthetic stone layer and a red silica gel layer stacked in sequence, and the synthetic stone layer is arranged on the heat-insulating cover plate and close to one surface of the FPC.
7. The method of claim 1, wherein the first sink has a depth of 1.2-1.8mm and each side of the first sink is greater than 5mm from the corresponding device side.
8. The method of claim 2, wherein the depth of the second and third sink grooves is 0.2-0.8mm, and the distance from each side of the second and third sink grooves to the side of the corresponding tin plating finger is greater than 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110905472.1A CN113825384B (en) | 2021-08-06 | 2021-08-06 | Method for preventing SMT patch from secondarily melting tin |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110905472.1A CN113825384B (en) | 2021-08-06 | 2021-08-06 | Method for preventing SMT patch from secondarily melting tin |
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| Publication Number | Publication Date |
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| CN113825384A CN113825384A (en) | 2021-12-21 |
| CN113825384B true CN113825384B (en) | 2023-05-23 |
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| CN202110905472.1A Active CN113825384B (en) | 2021-08-06 | 2021-08-06 | Method for preventing SMT patch from secondarily melting tin |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001015907A (en) * | 1999-07-02 | 2001-01-19 | Toshiba Corp | Jig for reflow soldering of insertion mounting component |
| JP2002329956A (en) * | 2001-04-27 | 2002-11-15 | Ricoh Co Ltd | Soldering method and electronic circuit board and electronic apparatus using the soldering method |
| CN101521994B (en) * | 2009-04-03 | 2011-04-13 | 苏州市飞莱克斯电路电子有限公司 | Reflow soldering shield jig for flexible circuit board |
| CN105307420B (en) * | 2015-10-13 | 2019-04-30 | 惠州市蓝微电子有限公司 | A kind of PCB and FPC welding method and bonding tool |
| CN110650592A (en) * | 2019-09-29 | 2020-01-03 | 深圳市新宇腾跃电子有限公司 | Heat insulation jig |
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2021
- 2021-08-06 CN CN202110905472.1A patent/CN113825384B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
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| CN113825384A (en) | 2021-12-21 |
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