CN113825384A - Method for preventing secondary tin melting of SMT (surface mount technology) paster - Google Patents
Method for preventing secondary tin melting of SMT (surface mount technology) paster Download PDFInfo
- Publication number
- CN113825384A CN113825384A CN202110905472.1A CN202110905472A CN113825384A CN 113825384 A CN113825384 A CN 113825384A CN 202110905472 A CN202110905472 A CN 202110905472A CN 113825384 A CN113825384 A CN 113825384A
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- China
- Prior art keywords
- cover plate
- fpc
- positioning
- carrier
- tin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method for preventing secondary tin melting in SMT (surface mount technology) chip mounting, which comprises the steps of sequentially installing a carrier, an FPC (flexible printed circuit) and a positioning cover plate on a base in an aligned mode through positioning columns arranged on the base; and is used as a first processing body to be placed on a conveying track of a solder paste printing machine; carrying out solder paste printing and device pasting operations on the FPC in the first processing body through a solder paste printing machine; taking out the positioning cover plate above the FPC; installing a heat insulation cover plate above the FPC through a positioning column; and taking out the second processed body from the base, putting the second processed body into an inlet of a tunnel reflow furnace, and carrying out high-temperature tin melting soldering device treatment. According to the embodiment of the invention, the steel plate with better positioning is used during the operation of printing the solder paste and pasting the device, and the heat insulation cover plate with poorer heat conduction capability is used during the high-temperature reflow operation, so that the accurate positioning during the operation of printing the solder paste and pasting the device can be completed, the relative stability of the FPC can be kept, and the phenomenon of secondary tin melting caused by heating of a tin-plated finger on the FPC in the SMT welding process can be avoided.
Description
Technical Field
The invention relates to the technical field of FPC (flexible printed circuit) processing, in particular to a method for preventing secondary tin melting of SMT (surface mount technology) patches.
Background
In recent years, along with the development of electronic products towards a light and thin direction, more and more FPCs are applied to the electronic products to replace the original wiring harness design so as to meet the design requirements of the electronic products, in the process of finding the FPC, SMT (surface mount technology) mounting operation is needed, when devices are subjected to hot-press welding through a reflow oven, because the tin melting point is lower than the reflow oven welding temperature during SMT mounting, the tin-plated fingers on the FPC are heated to melt tin for the second time in the SMT welding process, tin paste of the tin fingers is gathered and bulges after tin melting, and the thickness and uniformity of a tin surface are changed so as to cause a virtual welding problem during hot-press welding (the thickness and the flatness of the tin-plated fingers on the FPC are high, the thickness is generally required to be 15-30um, and the tin surface is required to be flat, and the conventional tin plating processing is carried out in the FPC production stage to carry out prefabricated tin treatment so as to meet the requirements of the tin thickness and the flatness.
Disclosure of Invention
The invention aims to provide a method for preventing secondary tin melting of an SMT (surface mount technology) paster, aiming at solving the problem that tin-plated fingers on an FPC (flexible printed circuit) are subjected to secondary tin melting after being heated in the SMT welding process in the prior art.
The embodiment of the invention provides a method for preventing secondary tin melting of an SMT patch, which comprises the following steps:
sequentially installing the carrier, the FPC and the positioning cover plate on the base in an aligned mode through positioning columns arranged on the base;
taking out the carrier, the FPC and the positioning cover plate after alignment, and placing the carrier, the FPC and the positioning cover plate as a first processing body on a conveying track of a solder paste printing machine;
performing solder paste printing and device attaching operation on the FPC in the first processing body through the solder paste printing machine;
taking out the first processing body after the device is attached, installing the first processing body on the base, and taking out a positioning cover plate above the FPC;
installing a heat insulation cover plate above the FPC through the positioning columns;
taking the carrier, the FPC and the heat insulation cover plate as a second processing body out of the base and putting the second processing body into an inlet of a tunnel reflow oven for high-temperature tin melting soldering device treatment.
According to the embodiment of the invention, the cover plates in the solder paste printing operation, the device pasting operation and the high-temperature reflow operation are distinguished, the steel plate with better positioning is used in the solder paste printing operation and the device pasting operation, the heat insulation cover plate with poorer heat conduction capability is used in the high-temperature reflow operation, so that the accurate positioning in the solder paste printing operation and the device pasting operation can be completed, the relative stability of the FPC is kept, the phenomenon of secondary tin melting caused by heating of a tin-plated finger on the FPC in the SMT (surface mount technology) welding process can be avoided, and the yield of workpieces is high.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for preventing tin from being melted again in an SMT patch according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first processing body according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a second processing body according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an insulating cover panel according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a second processing body mounted on a base according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1, a method for preventing secondary tin melting of an SMT patch includes steps S101-S106.
Referring to fig. 2, S101: the carrier 200, the FPC400, and the positioning cover 300 are sequentially aligned and mounted on the base 710 through positioning posts 720 disposed on the base 710.
In this embodiment, the base 710 is provided with the positioning column 720, the positioning column 720 is used for positioning the relative positions of the carrier 200, the FPC400 and the positioning cover plate 300, that is, the carrier 200, the FPC400 and the positioning cover plate 300 are all provided with the positioning holes, when the three are installed on the base 710, the positioning holes need to be aligned with the positioning column 720, and pass through the positioning columns 720 through the positioning holes to be fixed on the base 710, when the carrier 200, the FPC400 and the positioning cover plate 300 are sequentially installed on the base 710, the relative positions of the three are just convenient for the operations of pasting devices and printing solder paste.
The carrier 200 is used for being matched with the positioning cover plate 300 to clamp and fix the FPC400, so that the FPC400 is prevented from moving relatively, and the phenomenon that dislocation occurs when devices are attached and solder paste is printed to affect subsequent manufacturing is avoided.
Wherein, the positioning cover plate 300 is provided with a device pasting hole, the device pasting hole is aligned with the device pasting position on the FPC400, and the device can be inserted into the device pasting hole from one side of the positioning cover plate 300 departing from the FPC400 and pasted on the device pasting position.
The carrier 200 is made of synthetic stone, so that the heat conduction capability of the carrier is reduced, and the problem that the tin-plated finger 410 melts tin for the second time in subsequent high-temperature backflow is avoided.
S102: taking out the carrier 200, the FPC400 and the positioning cover plate 300 after the alignment and placing the carrier, the FPC400 and the positioning cover plate 300 as a first processing body on a conveying track of a solder paste printing machine;
in this embodiment, the carrier 200, the FPC400, and the positioning cover 300 need to be fed into the printing solder paste machine together for processing, wherein when the carrier 200, the FPC400, and the positioning cover 300 are taken off from the base 710, they are not taken off one by one, but taken off as a whole, that is, the relative positions of the three are not changed when they are taken off.
S103: performing solder paste printing and device attaching operations on the FPC400 in the first processing body through the solder paste printing machine;
in this embodiment, after the first processing body is placed on the conveying track of the printing solder paste machine, the first processing body is conveyed from the conveying track to the processing station of the printing solder paste machine, and the solder paste printing and device attaching operations are performed on the device attaching position on the FPC400 through the device attaching hole on the positioning cover plate 300.
S104: taking out and installing the first processed body after the device is attached on the base 710, and taking out the positioning cover plate 300 above the FPC 400;
in this embodiment, since the positioning cover plate 300 is made of steel, the temperature of the FPC400 may be too high during the high-temperature reflow operation, which may cause the tin-plated fingers 410 on the FPC400 to be heated and melted for a second time, and the tin paste on the tin surface is accumulated and swelled, so that the positioning cover plate 300 needs to be removed and replaced with another cover plate with poor heat conductivity.
Referring to fig. 3-5, S105: installing a heat insulation cover plate 600 above the FPC400 through the positioning columns 720;
in this embodiment, the thermal insulation cover 600 is placed above the FPC400 as a positioning plate, wherein the thermal insulation cover 600 is provided with hole locations identical to the device attaching holes and the positioning holes on the positioning cover 300, and when the thermal insulation cover 600 is mounted on the FPC400 through the positioning posts 720, the device attaching holes on the thermal insulation cover 600 are aligned with the devices, so that the thermal insulation cover 600 can be correctly mounted on the FPC 400.
In order to enable the heat insulation cover plate 600 to have better heat insulation capability, the heat insulation cover plate 600 comprises a synthetic stone layer 620 and a red silica gel layer 610 which are sequentially stacked, wherein the synthetic stone layer 620 is arranged on one surface, close to the FPC400, of the heat insulation cover plate 600; through setting up the relatively poor synthetic stone layer 620 of heat conductivility and red silica gel layer 610, the heat conductivility of thermal-insulated apron 600 of reduction that can be very big has avoided tin-plated finger 410 to receive the heating of outside high temperature and lead to appearing melting tin.
In order to further avoid the over-high temperature at the position of the tinned finger 410, a second sinking groove 230 is arranged on one surface, facing the FPC400, of the carrier 200 corresponding to the tinned finger 410; through avoiding tin plating finger 410 and carrier 200 direct contact, have certain space interval between tin plating finger 410 and carrier 200 to fill in the air in this space, make outside high temperature conduct from carrier 200 one side to the efficiency on tin plating finger 410 reduce by a wide margin, avoid tin plating finger 410 to appear the secondary and melt tin problem when the high temperature reflow operation.
In order to further avoid the over-high temperature at the position of the tinned finger 410, a third sinking groove is arranged on the side, facing the FPC400, of the heat insulation cover plate 600 corresponding to the tinned finger 410; through avoiding tin-plated finger 410 and thermal-insulated apron 600 direct contact, have certain space interval between tin-plated finger 410 and thermal-insulated apron 600 to fill the air in this space, make outside high temperature reduce by a wide margin from thermal-insulated apron 600 one side conduction to the efficiency on tin-plated finger 410, avoid tin-plated finger 410 to appear the secondary and melt tin problem when the high temperature backflow operation.
S106: taking the carrier 200, the FPC400 and the heat insulation cover plate 600 as a second processing body out of the base 710 and putting the second processing body into the inlet of a tunnel reflow furnace for high-temperature tin melting soldering device treatment.
In this embodiment, during the high-temperature reflow process, the second processed body needs to be taken out from the base 710 and put into the entrance of the tunnel reflow furnace, where the relative positions among the carrier 200, the FPC400, and the heat insulating cover 600 in the taken-out second processed body are all the same as the relative positions before the taking-out.
In order to enable solder paste on the device to reach a melting temperature more easily during a high-temperature reflow operation and perform soldering, a first sinking groove 220 is formed in one surface, far away from the device, of the carrier 200 corresponding to the device, and a plurality of through holes 210 are formed in the first sinking groove 220; by arranging the first sinking groove 220 on the carrier 200 and arranging the through hole 210 between the first sinking groove 220 and the device, the temperature conduction between the solder paste on the device and the high temperature at the outer side is more direct, and the effect of soldering the device cannot be achieved due to the fact that the solder paste cannot be melted due to the influence of the carrier 200 is avoided.
In one embodiment, the depth of the first sinker 220 is 1.2-1.8mm, and the distance from each side of the first sinker 220 to the corresponding device side is greater than 5 mm.
In one embodiment, the depth of the first sinking groove 220 is 1.5 mm.
In one embodiment, the depth of the second sinking groove 230 and the third sinking groove is 0.2-0.8mm, and the distance from each side edge of the second sinking groove 230 and the third sinking groove to the side edge of the corresponding tinned finger 410 is greater than 5 mm.
In one embodiment, the depth of the second and third sinking grooves 230 and 230 is 0.5 mm.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A method for preventing tin from being melted again in SMT patch is characterized by comprising the following steps:
sequentially installing the carrier, the FPC and the positioning cover plate on the base in an aligned mode through positioning columns arranged on the base;
taking out the carrier, the FPC and the positioning cover plate after alignment, and placing the carrier, the FPC and the positioning cover plate as a first processing body on a conveying track of a solder paste printing machine;
performing solder paste printing and device attaching operation on the FPC in the first processing body through the solder paste printing machine;
taking out the first processing body after the device is attached, installing the first processing body on the base, and taking out a positioning cover plate above the FPC;
installing a heat insulation cover plate above the FPC through the positioning columns;
taking the carrier, the FPC and the heat insulation cover plate as a second processing body out of the base and putting the second processing body into an inlet of a tunnel reflow oven for high-temperature tin melting soldering device treatment.
2. An SMT patch according to claim 1 wherein the method for preventing re-melting of tin comprises: one side of the carrier, which is far away from the device, is provided with a first sinking groove corresponding to the device, and a plurality of through holes are formed in the first sinking groove.
3. An SMT patch according to claim 1 wherein the method for preventing re-melting of tin comprises: and a second sinking groove is formed in one surface of the carrier facing the FPC and corresponding to the tinned finger.
4. An SMT patch according to claim 3 wherein the method of preventing re-melting of tin comprises: and a third sinking groove is formed in one surface of the heat insulation cover plate, which faces the FPC, and corresponds to the tinned finger.
5. An SMT patch according to claim 1 wherein the method for preventing re-melting of tin comprises: and the heat insulation cover plate and the positioning cover plate are provided with device pasting holes corresponding to devices.
6. An SMT patch according to claim 1 wherein the method for preventing re-melting of tin comprises: and the carrier, the FPC, the positioning cover plate and the heat insulation cover plate are all provided with positioning holes for the positioning columns to penetrate through.
7. An SMT patch according to claim 1 wherein the carrier is made of synthetic stone and the locating cover plate is steel.
8. An SMT patch according to claim 1, wherein the thermal cover plate includes a synthetic stone layer and a red silica gel layer stacked in sequence, the synthetic stone layer being disposed on a side of the thermal cover plate adjacent to the FPC.
9. An SMT patch according to claim 2, wherein the first sinker has a depth of 1.2-1.8mm, and a distance from each side of the first sinker to a corresponding device side is greater than 5 mm.
10. An SMT patch according to claim 4, wherein the second and third recesses have a depth of 0.2-0.8mm, and a distance from each side of the second and third recesses to a side of a corresponding tinned finger is greater than 5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110905472.1A CN113825384B (en) | 2021-08-06 | 2021-08-06 | Method for preventing SMT patch from secondarily melting tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110905472.1A CN113825384B (en) | 2021-08-06 | 2021-08-06 | Method for preventing SMT patch from secondarily melting tin |
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| Publication Number | Publication Date |
|---|---|
| CN113825384A true CN113825384A (en) | 2021-12-21 |
| CN113825384B CN113825384B (en) | 2023-05-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110905472.1A Active CN113825384B (en) | 2021-08-06 | 2021-08-06 | Method for preventing SMT patch from secondarily melting tin |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114845543A (en) * | 2022-05-23 | 2022-08-02 | 湖南金康电路板有限公司 | Type printing SMT production carrier and application method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001015907A (en) * | 1999-07-02 | 2001-01-19 | Toshiba Corp | Jig for reflow soldering of insertion mounting component |
| CN1384699A (en) * | 2001-04-27 | 2002-12-11 | 株式会社理光 | Tin solder jointing method and electronic circuit base board and electronic equipment made in the said method |
| CN101521994A (en) * | 2009-04-03 | 2009-09-02 | 苏州市飞莱克斯电路电子有限公司 | Reflow soldering shield jig for flexible circuit board |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN105307420A (en) * | 2015-10-13 | 2016-02-03 | 惠州市蓝微电子有限公司 | PCB and FPC welding method and surface mounting jig |
| CN110650592A (en) * | 2019-09-29 | 2020-01-03 | 深圳市新宇腾跃电子有限公司 | Heat insulation jig |
-
2021
- 2021-08-06 CN CN202110905472.1A patent/CN113825384B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001015907A (en) * | 1999-07-02 | 2001-01-19 | Toshiba Corp | Jig for reflow soldering of insertion mounting component |
| CN1384699A (en) * | 2001-04-27 | 2002-12-11 | 株式会社理光 | Tin solder jointing method and electronic circuit base board and electronic equipment made in the said method |
| CN101521994A (en) * | 2009-04-03 | 2009-09-02 | 苏州市飞莱克斯电路电子有限公司 | Reflow soldering shield jig for flexible circuit board |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN105307420A (en) * | 2015-10-13 | 2016-02-03 | 惠州市蓝微电子有限公司 | PCB and FPC welding method and surface mounting jig |
| CN110650592A (en) * | 2019-09-29 | 2020-01-03 | 深圳市新宇腾跃电子有限公司 | Heat insulation jig |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114845543A (en) * | 2022-05-23 | 2022-08-02 | 湖南金康电路板有限公司 | Type printing SMT production carrier and application method thereof |
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| CN113825384B (en) | 2023-05-23 |
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