CN101521994B - Reflow soldering shield jig for flexible circuit board - Google Patents
Reflow soldering shield jig for flexible circuit board Download PDFInfo
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- CN101521994B CN101521994B CN2009100293980A CN200910029398A CN101521994B CN 101521994 B CN101521994 B CN 101521994B CN 2009100293980 A CN2009100293980 A CN 2009100293980A CN 200910029398 A CN200910029398 A CN 200910029398A CN 101521994 B CN101521994 B CN 101521994B
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- circuit board
- flexible circuit
- clamping plate
- reflow soldering
- shield jig
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Abstract
The invention discloses a reflow soldering shield jig for a flexible circuit board, and belongs to the technical field of clamping apparatuses used for producing electronic products. The reflow soldering shield jig comprises a pair of a first splint and a second splint; two sides in the length direction of a surface of the first splint facing the second splint are fixedly provided with a first insulating pad respectively; two sides in the length direction of a surface of the second splint facing the first splint are fixedly provided with a second insulating pad respectively; two sides of the length direction of the first splint are provided with a first patch corresponding hole at intervals respectively; two sides of the length direction of the second splint are provided with a second patch corresponding hole at intervals respectively; the first and second patch corresponding holes are through holes and correspond; and the first splint and the second splint are in locking fit by at least one locking mechanism. The reflow soldering shield jig has the advantages of reducing the temperature of a welding spot by 15 to 30 DEG C and avoiding tin fusing on the welding spot during reflow soldering.
Description
Technical field
The invention belongs to the clamping apparatus technical field of electronic product production usefulness, be specifically related to a kind of reflow soldering shield jig for flexible circuit board.
The English full name of flexible circuit board is Flexible Printed Circuit, is abbreviated as FPC, and it is the general designation of Flexible Printed Circuit, soft printed circuit board (PCB) and flex circuit application.The FPC wiring board has advantages such as line density height, in light weight and thin thickness and is widely used in the products such as mobile phone, notebook computer, PDA, digital camera, LCM.The FPC flexible printer circuit is a kind of printed circuit with the high and pliability excellence of reliability that is with polyimide film or polyester film that base material is made.
The course of processing of FPC plate is: printed circuit on aforesaid base material, by automatic placement machine (SMT) electronic devices and components are adhered on the base material then, sent into again in the stove (industry claimed stove or Reflow Soldering), the purpose of crossing stove is to make solvent evaporates, because the used wlding of chip mounter paster is a high temperature lead-free solder cream, it contains solvent, and the purpose of stove makes the solvent evaporates in the leadless soldering tin paste excessively, paste the tin fusing of element, use the paster position that makes electronic devices and components and combine with base material fully.Paste element but have on the same FPC plate, also have and not paste element, known to the industry, behind SMT, when the FPC plate was crossed stove, the temperature of crossing stove was usually about 235-250 ℃, yet the tin at the solder joint place on the FPC plate just can produce tin in the time of 225 ℃ molten, it is molten that the solder joint that need not paste element can produce tin, thereby gently then cause the FPC plate rosin joint phenomenon to occur when welding, heavy then cause the FPC blackboard newspaper to give up.Again, because being the temperature of Reflow Soldering, the mistake stove do not allow to be lower than 235 ℃, otherwise can influence the paster effect of electronic devices and components, therefore, there are differences between the heatproof degree of the welding material that does not paste element on the FPC plate and the Reflow Soldering temperature, and cause the scrappage of FPC plate high just because of this temperature contrast, make processing cost be difficult to be accepted by industry.Perhaps be based on above-mentioned tired element, the production of FPC plate is at present still taken as the leading factor with offshore company, perhaps in a large number from external high price import, thereby has influenced the process of China's autonomous production.Although the industry particularly FPC plate factory commercial city of China is being explored energetically, expectation is found to be unlikely when Reflow Soldering the solder joint on the FPC plate is caused the molten solution of tin, does not see the bibliographical information that achieving success is arranged up to now.In view of this, the applicant considers for the autonomous angle of industry and has done a large amount of examinations of repaying, and finds a way to resolve the problem, and technical scheme described below just produces under based on this background.
Summary of the invention
Task of the present invention is to provide a kind of can prevent effectively that the reflow soldering shield jig for flexible circuit board of fusing from appearring in the solder joint on the flexible circuit board when Reflow Soldering.
Task of the present invention is finished like this; a kind of reflow soldering shield jig for flexible circuit board; it comprises a pair of opposite each other and shape is identical first; second clamping plate; respectively be installed with first heat insulating mattress at first clamping plate towards the both sides of the length direction on a surface of second clamping plate; and equally respectively be installed with one second heat insulating mattress towards the both sides of the length direction on a surface of first clamping plate at second clamping plate; and each spaced apart first paster corresponding aperture that is provided with of both sides at the length direction of first clamping plate; and at the similarly spaced apart second paster corresponding aperture that is provided with in both sides of the length direction of second clamping plate; first; the second paster corresponding aperture is through hole and both are corresponding; wherein; first; second clamping plate are cooperated by at least one locking mechanism interlocking between the two; described first; second heat insulating mattress corresponds to each other, and in sealed both coincidences down of described locking mechanism.
In a specific embodiment of the present invention, described first, second paster corresponding aperture be with flexible circuit board on surface mount elements corresponding, and quantity is to equate with the quantity of surface mount elements on the flexible circuit board.
In another specific embodiment of the present invention, described first, second paster corresponding aperture is circular hole, square hole or irregularly-shaped hole.
In another specific embodiment of the present invention, described first, second heat insulating mattress is heatproof and heat insulating mattress that have flexibility.
Go back in the specific embodiment of the present invention, the thickness of described first, second heat insulating mattress is 1-3mm.
In another specific embodiment of the present invention, described heatproof and have flexible heat insulating mattress and make by nonmetallic materials.
More of the present invention and in specific embodiment, described nonmetallic materials are nonwoven fabrics or felt.
In of the present invention and then specific embodiment, the quantity of described locking mechanism has a pair of, is configured in the position placed in the middle of both sides of the Width of described first, second clamping plate respectively.
Of the present invention again more and in specific embodiment, described locking mechanism comprises a forcing piece seat, a location hole and a forcing piece, the forcing piece seat is fixed on the position placed in the middle of edge part of the Width of second clamping plate, location hole is opened in the position placed in the middle of edge part of Width of first clamping plate and corresponding with described forcing piece seat, forcing piece be insinuated into location hole in match with the forcing piece seat.
In of the present invention and then specific embodiment, described forcing piece seat is provided with thread, described location hole also extends formation and has a presser feet slotted eye that communicates with location hole, described forcing piece is a nut, match with described thread, and also be extended with a presser feet on forcing piece, presser feet matches with described presser feet slotted eye.
Technical scheme provided by the present invention; play the effect that the solder joint on the flexible circuit board is protected by first, second clamping plate; promptly flexible circuit board is in the state of seizing on both sides by the arms and is lowered to the stove Reflow Soldering by first, second clamping plate; the solvent at paster position can volatilize from first, second paster corresponding aperture in reflow process; solder joint on the flexible circuit board is then covered by first, second clamping plate; therefore can make the temperature at solder joint place reduce 15-30 ℃, it is molten to avoid making in reflow process the solder joint position tin to occur.
Description of drawings
Accompanying drawing is a specific embodiment structure chart of the present invention.
Embodiment
Embodiment 1:
Ask for an interview accompanying drawing, not ccontaining doubting, first, second clamping plate 1,2 are metallic plate, for example preferably adopt aluminium alloy plate, and the shape of first, second clamping plate 1,2 is generally cuboid, and what illustrate among the figure is cuboid.Both sides at the length direction of first clamping plate 1 respectively offer the first paster corresponding aperture 12, understanding for the ease of the public, the applicant also shows flexible circuit board 4 in the accompanying drawings, more particularly the both sides at the length direction of flexible circuit board 4 post the electronic devices and components paster 41 with solder joint 411 by automatic placement machine on flexible circuit board 4, and the aforesaid first paster corresponding aperture 12 is corresponding to electronic devices and components paster 41.According to managing in this, the quantity of the first paster corresponding aperture 12 is to equate with the quantity of electronic devices and components paster 41.The both sides of the length direction of second clamping plate 2 offer the second paster corresponding aperture 22 equally, if the first paster corresponding aperture 12 is corresponding to the front of electronic devices and components paster 4, the second paster corresponding aperture 22 is corresponding to the back side of electronic devices and components paster 4 so, as seen first, second paster corresponding aperture 12,22 should correspond to each other, and quantity equates.In the present embodiment, the shape of first, second paster corresponding aperture 12,22 is preferably circular port, but does not repel other shape for example oblong aperture or square hole or irregularly-shaped hole.
Please continue to see accompanying drawing, promptly each is to paste first heat insulating mattress 11 that fixing mode cementation one thickness is 0.15mm towards the both sides of the length direction on the surface of second clamping plate 2 at the back side of first clamping plate 1, and heat insulating mattress 11 adopts nonwoven fabrics.I.e. each second heat insulating mattress 21 identical with first heat insulating mattress 11 in the front of second clamping plate 2 so that to paste fixing mode cementation thickness be 1.5mm and material towards the both sides of the length direction on the surface of first clamping plate 1, first, second heat insulating mattress the 11, the 21st corresponds to each other, and down both can overlap in locking mechanism 3 sealed.
Still ask for an interview accompanying drawing, the quantity of locking mechanism 3 has a pair of, be positioned at first, second clamping plate 1, the edge of 2 Width and occupy in the middle of, preferred but not structure each locking mechanism 3 of being limited to is as follows, one piece of urgent firmware block 31 is to weld or to rivet or to be fixed on second clamping plate 2 in other similar mode, and on urgent firmware block 31, also be processed with thread 311, on first clamping plate 1, offer location hole 32 with aforesaid urgent firmware block 31 corresponding positions, location hole 32 also is extended with a presser feet slotted eye 321 that is narrower than the diameter of location hole 32, because the existence of this presser feet slotted eye 321, make location hole 32 show as the figure-six hole, after urgent firmware block 31 probes into location hole 32, screw thread on the urgent firmware of being filled the post of by nut 33 and the thread 311 on the urgent firmware block 31 spin and cooperate and make first, second clamping plate 1,2 seize flexible circuit board 4 on both sides by the arms, and the presser feet 331 of compeling on the firmware 33 is positioned at presser feet slotted eye 321 simultaneously.
Embodiment 2:
Only use first, second heat insulating mattress 11,21 instead felt material that thickness is 2.5mm, will compel firmware block 31 and change on first clamping plate 1, location hole 32 is changed on second clamping plate 2, all the other are with the description to embodiment 1.
Application examples 1:
After electronic devices and components paster 41 being adhered on the flexible circuit board 4 that is printed with circuit 42 by automatic placement machine, flexible circuit board 4 placed between first, second clamping plate 1,2 and sealed by locking mechanism 3, first, second paster corresponding aperture 12,22 on first, second clamping plate 1,2 is corresponding with electronic devices and components paster 41, and the solder joint 411 on the electronic devices and components paster 41 is taken first, second heat insulating mattress 11,21 by first, second clamping plate 1,2 and covered and protect.Flexible circuit board 4 is seized on both sides by the arms or claim to clamp to send under the state by first, second clamping plate 1,2 then and implement Reflow Soldering in the stove, the temperature of Reflow Soldering is 235-250 ℃, solvent in the high temperature lead-free solder cream in the reflow process is by 12,22 volatilizations of first, second paster corresponding aperture, and alleged here high temperature lead-free solder cream is to be used for electronic devices and components paster 41 is bonded to scolder on the flexible circuit board 4.Because in reflow process, solder joint 411 covers by first, second clamping plate 1,2 and by the one the second heat insulating mattresss 11,21 and protects, therefore solder joint 411 suffered temperature are lower than the temperature at paster corresponding aperture 12,22 places, more particularly be lower than the about 15-30 of temperature ℃ of electronic devices and components paster 41 places, thereby it is molten to make tin point 411 exempt from tin.
Through the applicant the present invention program and prior art (not adding first, second clamping plate 1,2) are contrasted, the result shockingly shows, utilize the present invention program that finished product (check of butt welding point 411 after the Reflow Soldering) qualification rate is brought up to more than 98%, and existing technology only is about 70%, and therefore technical scheme provided by the present invention is undoubtedly ultimate attainment.
Claims (10)
1. reflow soldering shield jig for flexible circuit board; it is a pair of opposite each other and shape is identical first to it is characterized in that it comprises; second clamping plate (1; 2); respectively be installed with first heat insulating mattress (11) at first clamping plate (1) towards the both sides of the length direction on a surface of second clamping plate (2); and equally respectively be installed with one second heat insulating mattress (21) towards the both sides of the length direction on a surface of first clamping plate (1) at second clamping plate (2); and each spaced apart first paster corresponding aperture (12) that is provided with of both sides at the length direction of first clamping plate (1); and at the similarly spaced apart second paster corresponding aperture (22) that is provided with in both sides of the length direction of second clamping plate (2); first; the second paster corresponding aperture (12; 22) be through hole and both are corresponding; wherein; first; second clamping plate (1; 2) cooperate by at least one locking mechanism (3) interlocking between the two; described first; second heat insulating mattress (11; 21) correspond to each other, and in sealed both coincidences down of described locking mechanism (3).
2. reflow soldering shield jig for flexible circuit board according to claim 1; it is characterized in that described first, second paster corresponding aperture (11,12) be with flexible circuit board on surface mount elements corresponding, and quantity is to equate with the quantity of surface mount elements on the flexible circuit board.
3. reflow soldering shield jig for flexible circuit board according to claim 1 and 2 is characterized in that described first, second paster corresponding aperture (11,12) is circular hole, square hole or irregularly-shaped hole.
4. reflow soldering shield jig for flexible circuit board according to claim 1 is characterized in that described first, second heat insulating mattress (11,21) is heatproof and heat insulating mattress that have flexibility.
5. according to claim 1 or 4 described reflow soldering shield jig for flexible circuit board, it is characterized in that the thickness of described first, second heat insulating mattress (11,21) is 1-3mm.
6. reflow soldering shield jig for flexible circuit board according to claim 4 is characterized in that described heatproof and has flexible heat insulating mattress being made by nonmetallic materials.
7. reflow soldering shield jig for flexible circuit board according to claim 6 is characterized in that described nonmetallic materials are nonwoven fabrics or felt.
8. reflow soldering shield jig for flexible circuit board according to claim 1, the quantity that it is characterized in that described locking mechanism (3) has a pair of, is configured in the position placed in the middle of both sides of the Width of described first, second clamping plate (1,2) respectively.
9. according to claim 1 or 8 described reflow soldering shield jig for flexible circuit board; it is characterized in that described locking mechanism (3) comprises a forcing piece seat (31), a location hole (32) and a forcing piece (33); forcing piece seat (31) is fixed on the position placed in the middle of edge part of the Width of second clamping plate (2); location hole (32) is opened in the position placed in the middle of edge part of Width of first clamping plate (1) and corresponding with described forcing piece seat (31), forcing piece (33) be insinuated into location hole (32) in match with forcing piece seat (31).
10. reflow soldering shield jig for flexible circuit board according to claim 9; it is characterized in that described forcing piece seat (31) is provided with thread (311); described location hole (32) also extends formation and has a presser feet slotted eye (321) that communicates with location hole (32); described forcing piece (33) is a nut; match with described thread (311); and also be extended with a presser feet (331) on forcing piece (33), presser feet (331) matches with described presser feet slotted eye (321).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100293980A CN101521994B (en) | 2009-04-03 | 2009-04-03 | Reflow soldering shield jig for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100293980A CN101521994B (en) | 2009-04-03 | 2009-04-03 | Reflow soldering shield jig for flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101521994A CN101521994A (en) | 2009-09-02 |
| CN101521994B true CN101521994B (en) | 2011-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100293980A Expired - Fee Related CN101521994B (en) | 2009-04-03 | 2009-04-03 | Reflow soldering shield jig for flexible circuit board |
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| Country | Link |
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| CN (1) | CN101521994B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102665375B (en) * | 2012-05-31 | 2014-12-17 | 昆山市线路板厂 | System and method for welding flexible printed circuit made of polyester material at low temperature |
| CN103068159B (en) * | 2012-12-14 | 2015-12-09 | 意力(广州)电子科技有限公司 | A large FPC and composition method when making FPC |
| CN113825384B (en) * | 2021-08-06 | 2023-05-23 | 珠海景旺柔性电路有限公司 | Method for preventing SMT patch from secondarily melting tin |
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2009
- 2009-04-03 CN CN2009100293980A patent/CN101521994B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN101521994A (en) | 2009-09-02 |
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Granted publication date: 20110413 Termination date: 20140403 |