CN211184474U - Sandwich press-fit jig of 5G intelligent machine - Google Patents
Sandwich press-fit jig of 5G intelligent machine Download PDFInfo
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- CN211184474U CN211184474U CN202020025773.6U CN202020025773U CN211184474U CN 211184474 U CN211184474 U CN 211184474U CN 202020025773 U CN202020025773 U CN 202020025773U CN 211184474 U CN211184474 U CN 211184474U
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Abstract
The utility model discloses a 5G intelligence machine sandwich press fitting jig, including bottom plate and gland, the gland is connected with the bottom plate pressfitting, is equipped with the region of placing the circuit board on the bottom plate, and it is equipped with the recess to place the regional edge, is equipped with the fixed block in the recess, is equipped with the fixed column on the fixed block, is equipped with a plurality of counter weight subassemblies on the gland, and the gland still is equipped with a plurality of inserted blocks with the one side of bottom plate pressfitting. The utility model discloses 5G intelligent machine sandwich press fitting jig will have the tin cream, the circuit board of components and parts is placed and is placed in the region, and fix a position and fix the circuit board through the fixed column on the fixed block, carry out the pressfitting to the circuit board through the counter weight subassembly of gland again, make gland and circuit board fix a position through the inserted block simultaneously, thereby make the press fitting jig can not take place to remove when passing through the reflow oven, and guarantee the level and smooth of circuit board, reduce the empty probability of welding, the circuit board that still can prevent to have crossed the reflow oven simultaneously produces warpage or the deformation condition, improve circuit board reflow soldering quality.
Description
Technical Field
The utility model relates to a welding technology field of circuit board, in particular to sandwich press fit jig of 5G intelligent machine.
Background
At present, in the field of SMT (surface mount technology) production, almost all circuit boards pass through a reflow soldering furnace after being mounted with components, and solder paste between the components and the circuit boards is melted through the reflow soldering furnace, so that the components and the circuit boards are stably connected. The circuit board is required to be kept flat in a reflow soldering furnace, otherwise empty soldering is caused, and the connection quality between the components and the circuit board is poor; because the plate thickness of the circuit board is thin, or the components on the plate are more and heavier, or the small plate connection part on the plate is weaker, the circuit board passing through the reflow oven is easy to warp or deform, the light person can influence the next assembly, and the serious person can cause the direct scrapping of the plate. Particularly, for module products, because the plate used by the module is thinner, the components on the single module are denser, and the connecting area between the single module and the surrounding plates is smaller, the circuit board is easy to warp when the module passes through a reflow oven, and therefore, a clamp for passing through the reflow oven is needed to be designed for clamping the circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an improve circuit board reflow soldering quality, prevent the sandwich pressing fixture of 5G intelligent machine of empty solder joint.
For solving the above technical problem, the utility model discloses can adopt following technical scheme to realize:
the utility model provides a 5G intelligence machine sandwich pressfitting tool, includes bottom plate and gland, the gland is connected with the bottom plate pressfitting, be equipped with the region of placing the circuit board on the bottom plate, it is equipped with the recess to place regional edge, be equipped with the fixed block in the recess, be equipped with the fixed column on the fixed block, be equipped with a plurality of counter weight subassemblies on the gland, the gland still is equipped with a plurality of inserted blocks with the one side of bottom plate pressfitting.
Further, the counter weight subassembly includes balancing weight and fixture block, balancing weight one end be equipped with fixture block matched with fastening groove, the gland is passed to the one end that the balancing weight was equipped with fastening groove to fix with the gland in the fastening inslot through the fixture block.
Furthermore, the bottom plate is provided with two layers which are integrally formed, and the size of one layer of the bottom is smaller than that of the other layer of the upper part.
Furthermore, a plurality of hollow parts are respectively arranged on the placing area and the gland.
Furthermore, the bottom plate, the gland and the counterweight component are all made of high-temperature resistant materials.
The utility model has the advantages that: the utility model discloses 5G intelligent machine sandwich pressing fixture installs the circuit board that has components and parts to the placing area of bottom plate, and fixes through the fixed block of placing the regional edge, later closes the gland box on the circuit board, cooperates with the circuit board through the inserted block on the gland, carries out weight pressfitting to the circuit board through the counter weight subassembly simultaneously, makes the circuit board keep level and smooth, prevents the circuit board through the empty welding that reflow soldering stove leads to because the circuit board unevenness; and through the press fit of the counterweight assembly on the circuit board, the connection between the circuit board and the component is not deformed or warped when the solder paste is melted due to the high temperature of the reflow oven when the circuit board passes through the reflow oven, so that the connection quality between the circuit board and the component is improved.
Drawings
FIG. 1 is a schematic structural view of a 5G intelligent machine sandwich pressing jig of the present invention;
FIG. 2 is a side view of the sandwich pressing jig of the 5G intelligent machine of the present invention;
FIG. 3 is a schematic view of the structure of the bottom plate of the sandwich pressing jig of the 5G intelligent machine of the present invention;
fig. 4 is a schematic structural view of the fixing block of the sandwich pressing jig of the 5G intelligent machine of the present invention;
FIG. 5 is a schematic view of the gland structure of the sandwich pressing jig of the 5G intelligent machine of the present invention;
fig. 6 is the utility model discloses 5G intelligent machine sandwich pressfitting tool counterweight group spare schematic structure.
As shown in the attached drawings: 1. a base plate; 2. a gland; 3. a groove; 4. a fixed block; 5. fixing a column; 6. a counterweight assembly; 7. inserting a block; 8. a hollowed portion; 61. a balancing weight; 62. a clamping block; 63. and (5) fastening the groove.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following provides a detailed description of the product of the present invention with reference to the embodiments and the accompanying drawings.
As shown in fig. 1 to 6, a sandwich press-fit jig of 5G intelligent machine comprises a bottom plate 1 and a gland 2, the gland 2 is connected with the press-fit of the bottom plate 1, a placing area for placing a circuit board is arranged on the bottom plate 1, a groove 3 is arranged at the edge of the placing area, a fixing block 4 is arranged in the groove 3, a fixing column 5 is arranged on the fixing block 4, a plurality of counterweight components 6 are arranged on the gland 2, and a plurality of inserting blocks 7 are further arranged on one side of the gland 2 pressed with the bottom plate 1.
In the embodiment, when the circuit board is reflowed, the base plate 1 is flatly laid on the track of the reflow oven, the circuit board is placed in the placement area of the base plate 1, a plurality of circuit boards can be placed in the placement area, so as to improve the reflow efficiency of the circuit board, the circuit board is positioned and fixed by matching the positioning holes with the positioning holes through the fixing columns 5 on the fixing blocks 4, so that the circuit board does not displace when moving on the track, meanwhile, the gland 2 is pressed on the circuit board, the circuit board is also provided with jacks which are matched with the insertion blocks 7 of the gland 2, and the circuit board is pressed by the counterweight component 6 on the gland 2, so that the circuit board is better fixed, so as to improve the stability of the circuit board when passing through the reflow oven, prevent the situations of warping deformation and empty soldering, and the reflow soldering quality of the circuit board is improved.
As shown in fig. 6, the weight assembly 6 includes a weight block 61 and a latch 62, a fastening groove 63 matching with the latch 62 is formed at one end of the weight block 61, and one end of the weight block 61 having the fastening groove 63 passes through the gland 2 and is fastened in the fastening groove 63 through the latch 62 to be fixed with the gland 2.
In this embodiment, carry out the pressfitting to the circuit board for better, set up a plurality of counter weight components 6 on gland 2, pass gland 2 with counter weight 61 one end of counter weight component 6, and fix counter weight 61 through fixture block 62 and fastening groove 63, make cooperation piece 61 can be fixed to gland 2 on, the cooperation through fixture block 62 and fastening groove 63 simultaneously, can conveniently change the counter weight 61 of different weight, carry out the pressfitting to the circuit board of difference, thereby improve circuit board reflow soldering's quality, prevent the condition such as circuit board warpage and empty solder.
As shown in fig. 2, the bottom plate 1 is formed by two layers and integrally formed, and the size of one layer of the bottom is smaller than that of the other layer of the top.
In this embodiment, because the bottom plate 1 is tiled on the track or the conveyor belt of the reflow oven, the bottom plate 1 is arranged into two layers, and the size of one layer at the bottom of the bottom plate is smaller than that of the upper layer, so that the bottom plate 1 is more stably connected with the track or the conveyor belt and is conveyed, and the quality of reflow soldering of the circuit board is improved.
As shown in fig. 1, a plurality of hollow portions 8 are respectively disposed on the placing area and the pressing cover 2.
In this embodiment, set up a plurality of fretwork portions 8 on placing region and gland 2, can make the interior warm area heat energy furthest's of reflow oven transmit the circuit board through fretwork portion 8 on, conveniently melt the tin cream, make the better welding of circuit board and components and parts to improve the reflow soldering quality.
In this embodiment, bottom plate 1, gland 2 and counter weight subassembly 6 are high temperature resistant material and make, and its high temperature resistant material can adopt including aluminium, steel or other high temperature resistant material, and this 5G intelligent machine sandwich pressfitting tool preferred selection aluminium is as the preparation material of bottom plate 1 and gland 2, and its reason lies in the nature of aluminium, and aluminium places in the air and can form the oxide film and make it no longer oxidize, can not damage the structure of circuit board. And the heat-conducting property of the aluminum is strong, so that the solder paste on the circuit board can be fully melted. Other high temperature resistant plasticity strong materials also can be regarded as the sandwich pressfitting tool of this 5G intelligent machine of preparation.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above. The present invention can be smoothly implemented by those skilled in the art according to the drawings and the above description; however, those skilled in the art should understand that changes, modifications and variations that are equivalent to those of the above-described embodiments may be made without departing from the scope of the present invention; meanwhile, any changes, modifications, evolutions, etc. of the above embodiments, which are equivalent to the actual techniques of the present invention, still belong to the protection scope of the technical solution of the present invention.
Claims (5)
1. The utility model provides a sandwich pressfitting tool of 5G intelligence machine, includes bottom plate and gland, the gland is connected its characterized in that with the bottom plate pressfitting: the bottom plate is provided with a placing area for placing the circuit board, the edge of the placing area is provided with a groove, a fixing block is arranged in the groove, the fixing block is provided with a fixing column, the gland is provided with a plurality of counterweight components, and a plurality of inserting blocks are further arranged on the press-fit surface of the gland and the bottom plate.
2. The sandwich pressing jig of the 5G intelligent machine according to claim 1, characterized in that: the counterweight assembly comprises a counterweight block and a clamping block, wherein one end of the counterweight block is provided with a fastening groove matched with the clamping block, and the end of the counterweight block, which is provided with the fastening groove, penetrates through the gland and is clamped into the fastening groove through the clamping block to be fixed with the gland.
3. The sandwich pressing jig of the 5G intelligent machine according to claim 2, characterized in that: the bottom plate is provided with two layers which are integrally formed, and the size of one layer at the bottom of the bottom plate is smaller than that of one layer at the upper part of the bottom plate.
4. The sandwich pressing jig of the 5G intelligent machine according to claim 3, characterized in that: the placing area and the gland are respectively provided with a plurality of hollow parts.
5. The sandwich pressing jig of the 5G intelligent machine according to claim 4, characterized in that: the bottom plate, the gland and the counterweight component are all made of high-temperature resistant materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020025773.6U CN211184474U (en) | 2020-01-07 | 2020-01-07 | Sandwich press-fit jig of 5G intelligent machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020025773.6U CN211184474U (en) | 2020-01-07 | 2020-01-07 | Sandwich press-fit jig of 5G intelligent machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211184474U true CN211184474U (en) | 2020-08-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020025773.6U Active CN211184474U (en) | 2020-01-07 | 2020-01-07 | Sandwich press-fit jig of 5G intelligent machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211184474U (en) |
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2020
- 2020-01-07 CN CN202020025773.6U patent/CN211184474U/en active Active
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