CN115568106B - Circuit board film-clamping treatment method and circuit board - Google Patents
Circuit board film-clamping treatment method and circuit board Download PDFInfo
- Publication number
- CN115568106B CN115568106B CN202211533978.5A CN202211533978A CN115568106B CN 115568106 B CN115568106 B CN 115568106B CN 202211533978 A CN202211533978 A CN 202211533978A CN 115568106 B CN115568106 B CN 115568106B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- film
- electroplating
- adhesive
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention relates to the technical field of PCBs (printed Circuit boards), in particular to a circuit board film clamping processing method and a circuit board, wherein the type of an electroplating film clamp of the current circuit board is firstly confirmed, the mode of processing the electroplating film clamp is selected according to the type of the electroplating film clamp of the current circuit board, when the type of the electroplating film clamp of the circuit board is the electroplating film clamp before etching or copper stripping, the mode of removing the electroplating film clamp by laser ablation or the mode of adhering and removing the electroplating film clamp by adhering substances is adopted, and when the type of the electroplating film clamp of the circuit board is the electroplating film clamp after etching or copper stripping, the mode of adhering and removing the electroplating film clamp by adhering substances is adopted. The invention can effectively treat the electroplating clamping film of the circuit board with smaller line width/line distance, has short time consumption and higher efficiency, avoids the pollution or damage of the circuit board and reduces the production cost. The method is flexible and convenient, and meets different production and processing requirements. The invention can not leave carbon black on the surface of the circuit board, can not influence the normal operation of other working procedures of the circuit board, and ensures the quality of the circuit board.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a circuit board film clamping processing method and a circuit board.
Background
PCB (printed circuit board) is one of the important parts of the electronic industry, almost every electronic device, as small as electronic watches, calculators, as large as computers, communication electronic devices, military weapon systems, and as long as there are electronic components such as integrated circuits, a printed board is used for electrically interconnecting the individual components. Common circuit boards generally include single-sided boards, double-sided boards, multi-layer boards, and the like, and as the circuit boards evolve toward high density, high integration, small aperture, fine wires, small pitch, multilayering, and the like, additive processes such as MSAP, SAP, and the like are beginning to be applied to the circuit boards. The circuit board manufactured by using the MSAP or SAP technology to manufacture the circuit can break through 50 mu m of line width/line distance and even reach 8 mu m. Under such a small line width/line spacing, the contact area of the liquid medicine for removing the film after electroplating with the dry film becomes small, and the dry film is easy to be clamped in a narrow space between lines in the swelling stage, so that electroplating clamping films are generated. For electroplating clamp removal, reworking is required, and a blade is often used in the industry to scrape, remove the electroplating clamp by ablation with a photoresist removal tank, or remove the electroplating clamp by using a plasma machine, such as a plasma clamp removal method disclosed in patent publication No. CN102883541a, i.e. using plasma to remove the clamp. However, the above method of scraping the electroplating clamp film by using the blade is not only easy to damage the circuit board, but also can not be used for removing the whole clamp film because the blade tip cannot enter the circuit when the line width/line distance is small, and the main component of the photoresist removing groove liquid medicine is potassium permanganate, has strong oxidizing property, and can remove the electroplating clamp film by using the photoresist removing groove ablation mode, but a large amount of black glue-like substances can be easily formed on the surface of the circuit board to pollute the board surface, in addition, the method of removing the clamp film by using the plasma machine has long time consumption, low operation efficiency and high cost, and can only be used for removing the whole clamp film because the biting amount of the plasma machine to the insulating medium is too large, and can not be used for treating the electroplating clamp film after etching or copper removal.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for treating a circuit board by clamping a film, and a circuit board using the method for treating a circuit board by clamping a film. The circuit board film-clamping processing method is suitable for circuit boards with smaller line widths/line distances, and removes electroplating films on the circuit boards.
The invention is realized by the following scheme:
a circuit board film-clamping processing method comprises the following steps: firstly, confirming the type of the electroplating clamp film of the current circuit board, selecting the mode of processing the electroplating clamp film according to the type of the electroplating clamp film of the current circuit board, wherein the type of the clamp film comprises the electroplating clamp film before etching or copper removal and the electroplating clamp film after etching or copper removal, when the type of the electroplating clamp film of the circuit board is the electroplating clamp film before etching or copper removal, adopting a mode of removing the electroplating clamp film by laser ablation or adopting an adhesive to adhere the electroplating clamp film, and when the type of the electroplating clamp film of the circuit board is the electroplating clamp film after etching or copper removal, adopting the adhesive to adhere the electroplating clamp film. The mode of removing the electroplating clamp film by laser ablation and bonding the adhesive to remove the electroplating clamp film can effectively treat the electroplating clamp film of the circuit board with smaller line width/line distance, and can be suitable for the electroplating clamp film before etching or decoppering and the electroplating clamp film after etching or decoppering.
Further, the removing the electroplating clamp film by laser ablation comprises: checking the electroplating film clamping condition of the circuit board, counting the electroplating film clamping position and marking, manufacturing laser data according to the marked electroplating film clamping position, ablating the electroplating film according to the laser data by a laser machine, and carrying out copper removal or etching on the circuit board after ablating the electroplating film clamping, wherein the copper removal or etching can be carried out by adopting a conventional process.
Further, the method for removing the electroplating clamp film by adopting laser ablation comprises the following steps:
step A1, checking the electroplating film clamping condition of the surface of a circuit board by adopting AOI equipment;
step A2, manually confirming the inspection result, counting and marking the positions of the electroplating clamping films, and adaptively dividing the areas according to the types of the circuit boards so as to be convenient for counting and marking the positions of the electroplating clamping films;
a3, manufacturing laser data comprising the position coordinates of the electroplating clamping film according to the marked electroplating clamping film position, wherein the laser data is data which can be read by laser equipment;
step A4, ablating the electroplating clamp film by using laser equipment according to the manufactured laser data, wherein the laser equipment can adopt a laser drilling machine, and parameters of the laser drilling machine are set according to the type of the dry film;
step A5, checking whether the ablated circuit board has carbon black, if so, executing step A6, and if not, executing step A7;
step A6, confirming the position of carbon black on the surface of the circuit board, and removing the carbon black on the surface of the circuit board;
step A7, copper removal or etching is carried out on the circuit board, and a conventional process is adopted for copper removal or etching;
in the step A6, the carbon black on the surface of the circuit board is removed by using a plasma machine.
Further, the adhering and removing the electroplating clamp film by using the adhesive comprises: checking the electroplating film clamping condition of the circuit board, counting the electroplating film clamping position, marking, attaching an adhesive on the marked electroplating film clamping position, hot-pressing, taking out the electroplating film after removing the adhesive, checking the circuit board, removing the adhesive, and finally carrying out subsequent treatment on the circuit board. The adhesive adopts a medium with hot melting property, and can enter a narrow space between the circuits after being heated and melted to be adhered with the electroplating clamp film, so that the electroplating clamp film can be taken out when the adhesive is removed.
Further, in the step B1, an AOI device is adopted to check the electroplating film clamping condition of the surface of the circuit board;
step B2, manually confirming the inspection result, counting and marking the positions of the electroplating clamping films, and adaptively dividing the areas according to the types of the circuit boards so as to be convenient for counting and marking the positions of the electroplating clamping films;
step B3, adhering an adhesive to the marked electroplating clamping film position;
step B4, hot-pressing the adhesive, wherein a hot-pressing glue machine can be adopted for the operation;
step B5, removing the adhesive, and taking out the electroplating clamping film;
step B6, checking the circuit board to determine whether residual adhesive exists, if so, turning to step B7, and if not, turning to step B8, wherein the adhesive possibly sticks to the surface of the circuit board in a molten state, so that the determination of whether the surface of the circuit board exists is required;
step B7, removing residual adhesive on the surface of the circuit board;
and step B8, carrying out subsequent processing on the circuit board.
Further, the performing the subsequent processing on the circuit board includes:
step B81, confirming the type of the electroplating clamp film, if the type of the electroplating clamp film is the electroplating clamp film before etching or copper removal, executing step B82, and if the type of the electroplating clamp film is the electroplating clamp film after etching or copper removal, executing step B83 and step B84;
step B82, copper removal or etching is carried out on the circuit board;
step B83, microetching the electroplating film clamping position of the circuit board, and removing the bottom copper of the electroplating film clamping position, wherein a cotton swab is adopted to dip microetching liquid to wipe the electroplating film clamping position until the bottom copper is microetched completely;
and step B84, washing the circuit board to remove residues on the surface of the circuit board, and then continuing other manufacturing processes of the circuit board.
In step B5, after removing the adhesive, it is necessary to check whether the plating film is left, and if the plating film is left, the operation of removing the plating film is repeated; the repeated operation of removing the plating resist is repeated from step B3 to step B5, or the residual plating resist is ablated using a laser.
Further, in the step B7, the residual adhesive on the surface of the circuit board is removed by using a plasma machine, or the residual adhesive on the surface of the circuit board is erased by using an eraser.
Further, the adhesive is tape or gummed paper, and other adhesives which can achieve the same effect as the tape or gummed paper can be adopted.
The invention also provides a circuit board, and the circuit board film-clamping processing method is applied.
Compared with the prior art, the invention has the following beneficial effects:
the invention adopts the mode of laser ablation electroplating clamping film or adhesion to remove the electroplating clamping film, can effectively treat the electroplating clamping film of the circuit board with smaller line width/line distance, has short time consumption and higher efficiency, avoids the pollution or damage of the circuit board and reduces the production cost. The invention is not only suitable for treating the electroplating clamp film after etching or before copper removal, but also can rapidly and effectively treat the tiny electroplating clamp film after etching or copper removal, is flexible and convenient, and meets different production and processing requirements. The invention can not leave carbon black on the surface of the circuit board, can not influence the normal operation of other working procedures of the circuit board, and ensures the quality of the circuit board.
Drawings
Fig. 1 is a flowchart of an embodiment 1 of a method for processing a circuit board by using a film.
Fig. 2 is a flowchart of an embodiment 2 of a method for processing a circuit board by using a film.
Fig. 3 is a flowchart of embodiment 3 of a method for processing a circuit board by using a film.
Detailed Description
In order to facilitate an understanding of the present invention by those skilled in the art, the present invention will be described in further detail with reference to specific examples and drawings.
Example 1
Referring to fig. 1, the invention provides a circuit board film-clamping processing method, which comprises the following steps: firstly, confirming the type of the electroplating clamp film of the current circuit board, selecting the mode of processing the electroplating clamp film according to the type of the electroplating clamp film of the current circuit board, wherein the type of the clamp film comprises the electroplating clamp film before etching or copper removal and the electroplating clamp film after etching or copper removal, when the type of the electroplating clamp film of the circuit board is the electroplating clamp film before etching or copper removal, adopting a mode of removing the electroplating clamp film by laser ablation or adopting an adhesive to adhere the electroplating clamp film, and when the type of the electroplating clamp film of the circuit board is the electroplating clamp film after etching or copper removal, adopting the adhesive to adhere the electroplating clamp film. The mode of removing the electroplating clamp film by laser ablation and bonding the adhesive to remove the electroplating clamp film can effectively treat the electroplating clamp film of the circuit board with smaller line width/line distance (which can reach 8 mu m), and can be suitable for the electroplating clamp film before etching or decoppering and the electroplating clamp film after etching or decoppering.
The technical scheme of the embodiment is used for removing the electroplating clamp film (after film removal) before etching or copper removal, and the electroplating clamp film is removed by laser ablation. The removing the electroplating clamp film by laser ablation comprises the following steps: checking the electroplating film clamping condition of the circuit board, counting the electroplating film clamping position and marking, manufacturing laser data according to the marked electroplating film clamping position, ablating the electroplating film according to the laser data by a laser machine, and carrying out copper removal or etching on the circuit board after ablating the electroplating film clamping, wherein the copper removal or etching can be carried out by adopting a conventional process.
The method for removing the electroplating clamp film by adopting laser ablation comprises the following steps:
step A1, checking the electroplating film clamping condition of the surface of a circuit board by adopting AOI equipment;
step A2, manually confirming the inspection result, counting and marking the positions of the electroplating clamp films, adaptively dividing the areas according to the model of the circuit board, facilitating counting and marking the positions of the electroplating clamp films, wherein the positions of the multi-point clamp films are relatively fixed because the electroplating clamp films are frequently arranged at the positions with smaller line width/line distance, and the adaptive dividing areas are more convenient for counting and subsequently manufacturing laser data;
step A3, according to the marked electroplating film clamping position, preparing laser data comprising the coordinate of the electroplating film clamping position, wherein the laser data is data which can be read by laser equipment, in the embodiment, the laser data in a corresponding range can be prepared at the counted film clamping position or area through software such as genes or CAM 350;
step A4, ablating the electroplating clamp film by using laser equipment according to the manufactured laser data, wherein the laser equipment can use a laser drilling machine, parameters of the laser drilling machine are set according to the type of a dry film, in the embodiment, the laser parameters are MASK 2.0-2.5mm, the energy is 2-3mj, the pulse gun number is 10-20us 2, the parameters are only one of the parameters, and the parameters are adjusted adaptively according to the type of the dry film in specific cases;
step A5, checking whether the ablated circuit board has carbon black, if so, executing step A6, if not, executing step A7, and generally, if CO is adopted 2 The laser drilling machine can generate trace carbon black at the ablation position, and if a UV laser machine is adopted, the carbon black can not be generated, so that the subsequent step of removing the carbon black can be omitted;
step A6, confirming the position of carbon black on the surface of the circuit board, and removing the carbon black on the surface of the circuit board;
step A7, copper removal or etching is carried out on the circuit board, and a conventional process is adopted for copper removal or etching;
in the step A6, the carbon black on the surface of the circuit board is removed by using a plasma machine, and in this embodiment, specific parameters of the plasma machine are as follows:
of course, the above parameters are only one of the setting modes, and the adaptive setting can be performed according to the actual situation during the implementation.
Example 2
Referring to fig. 2, the technical solution of this embodiment is used to remove the electroplating film (after film removal) before etching or copper removal, and the electroplating film is adhered by an adhesive. The adhering and removing the electroplating clamp film by adopting the adhesive comprises the following steps: checking the electroplating film clamping condition of the circuit board, counting the electroplating film clamping position, marking, attaching an adhesive on the marked electroplating film clamping position, hot-pressing, taking out the electroplating film after removing the adhesive, checking the circuit board, removing the adhesive, and finally carrying out subsequent treatment on the circuit board. The adhesive adopts a medium with hot melting property, and can enter a narrow space between the circuits after being heated and melted to be adhered with the electroplating clamp film, so that the electroplating clamp film can be taken out when the adhesive is removed.
Step B1, checking the electroplating film clamping condition of the surface of the circuit board by adopting AOI equipment;
step B2, manually confirming the inspection result, counting and marking the positions of the electroplating clamping films, and adaptively dividing the areas according to the types of the circuit boards so as to be convenient for counting and marking the positions of the electroplating clamping films;
step B3, adhering an adhesive to the marked electroplating clamping film position;
step B4, hot pressing the adhesive, namely, a hot pressing glue machine can be adopted to perform the operation, the hot pressing temperature is 120+/-10 ℃, the hot pressing speed is 0.8+/-0.1 m/min, the pressure is 0.7+/-0.1 Mpa, the hot pressing temperature is 120 ℃, the hot pressing speed is 0.8m/min, the pressure is 0.7Mpa, the adhesive has the characteristic of hot melting, after the adhesive is attached to a position with an electroplating clamping film on a circuit board, the adhesive is hot-pressed by the hot pressing glue machine to raise the temperature and is bonded with the electroplating clamping film, and after cooling, the bonded electroplating clamping film can be taken out together by uncovering the adhesive;
step B5, removing the adhesive, and taking out the electroplating clamping film;
step B6, checking the circuit board to determine whether residual adhesive exists, if so, turning to step B7, and if not, turning to step B8, wherein the adhesive possibly sticks to the surface of the circuit board in a molten state, so that the determination of whether the surface of the circuit board exists is required;
step B7, removing residual adhesive on the surface of the circuit board;
and step B8, carrying out subsequent processing on the circuit board.
In the step B5, after removing the adhesive, it is necessary to check whether the plating film is left, and if the plating film is left, the operation of removing the plating film is repeated; the repeated operation of removing the electroplating clamp film is that the steps B3 to B5 are repeated, namely, the adhesive is attached to the position with the electroplating clamp film, and then the hot pressing and the uncovering are performed again. In addition, a laser may be used to ablate the residual plating film or the plating film may be removed simultaneously during the removal of the residual glue using a plasma machine.
In the step B7, the residual adhesive on the surface of the circuit board is removed by adopting a plasma machine, or the residual adhesive on the surface of the circuit board is erased by using an eraser.
The adhesive is adhesive tape or adhesive paper, and other adhesives which can achieve the same effect as the adhesive tape or the adhesive paper can be adopted. In the embodiment, the red adhesive tape is used as a common material in the production and processing of the circuit board, is convenient to take, has large adhesive content and is not easy to generate residual adhesive.
The subsequent processing of the circuit board comprises the following steps:
and B81, confirming the type of the electroplating clamping film, and if the type of the electroplating clamping film is the electroplating clamping film before etching or copper stripping, executing the step B82 to strip copper or etch the circuit board.
Because the plating film is etched or removed before the copper plating film is etched, the conventional process of the circuit board is performed after the plating film is etched or removed before the copper plating film is identified.
Example 3
Referring to fig. 3, the technical solution of this embodiment is used to remove the electroplated coating after etching or copper removal (after film removal), and the electroplated coating is adhered and removed by using an adhesive. The adhering and removing the electroplating clamp film by adopting the adhesive comprises the following steps: checking the electroplating film clamping condition of the circuit board, counting the electroplating film clamping position, marking, attaching an adhesive on the marked electroplating film clamping position, hot-pressing, taking out the electroplating film after removing the adhesive, checking the circuit board, removing the adhesive, and finally carrying out subsequent treatment on the circuit board. The adhesive adopts a medium with hot melting property, and can enter a narrow space between the circuits after being heated and melted to be adhered with the electroplating clamp film, so that the electroplating clamp film can be taken out when the adhesive is removed.
Step B1, checking the electroplating film clamping condition of the surface of the circuit board by adopting AOI equipment;
step B2, manually confirming the inspection result, counting and marking the positions of the electroplating clamping films, and adaptively dividing the areas according to the types of the circuit boards so as to be convenient for counting and marking the positions of the electroplating clamping films;
step B3, adhering an adhesive to the marked electroplating clamping film position;
step B4, hot pressing the adhesive, namely, a hot pressing glue machine can be adopted to perform the operation, the hot pressing temperature is 120+/-10 ℃, the hot pressing speed is 0.8+/-0.1 m/min, the pressure is 0.7+/-0.1 Mpa, the hot pressing temperature is 120 ℃, the hot pressing speed is 0.8m/min, the pressure is 0.7Mpa, the adhesive has the characteristic of hot melting, after the adhesive is attached to a position with an electroplating clamping film on a circuit board, the adhesive is hot-pressed by the hot pressing glue machine to raise the temperature and is bonded with the electroplating clamping film, and after cooling, the bonded electroplating clamping film can be taken out together by uncovering the adhesive;
step B5, removing the adhesive, and taking out the electroplating clamping film;
step B6, checking the circuit board to determine whether residual adhesive exists, if so, turning to step B7, and if not, turning to step B8, wherein the adhesive possibly sticks to the surface of the circuit board in a molten state, so that the determination of whether the surface of the circuit board exists is required;
step B7, removing residual adhesive on the surface of the circuit board;
and step B8, carrying out subsequent processing on the circuit board.
In the step B7, the residual adhesive on the surface of the circuit board is removed by adopting a plasma machine, or the residual adhesive on the surface of the circuit board is erased by using an eraser.
The subsequent processing of the circuit board comprises the following steps:
step B81, confirming the type of the electroplating clamping film, and if the type of the electroplating clamping film is the electroplating clamping film after etching or copper removal, performing electroplating clamping film position on the circuit boardMicroetching to remove the copper bottom at the position of the electroplating clamping film, wherein a cotton swab is used for dipping microetching liquid to wipe the position of the electroplating clamping film until the copper bottom is microetched completely, in the embodiment, the microetching liquid adopts 25% ammonia water and 10% H 2 O 2 The mixture is mixed in a ratio of 3:1, and other types of microetching solutions can be adopted in the implementation process, so that the actual requirement is adaptive. Since the plating film in this embodiment is etched or decoppered, there is still copper surface at the position covered by the plating film, so that microetching is required to remove the exposed copper surface after the plating film is removed. After the microetching is finished, the circuit board is washed by water to remove residues on the surface of the circuit board, and then other processes of the circuit board can be continued.
In the step B5, after removing the adhesive, it is necessary to check whether the plating film is left, and if the plating film is left, the operation of removing the plating film is repeated; the repeated operation of removing the electroplating clamp film is that the steps B3 to B5 are repeated, namely, the adhesive is attached to the position with the electroplating clamp film, and then the hot pressing and the uncovering are performed again. In addition, a laser may be used to ablate the residual plating film or the plating film may be removed simultaneously during the removal of the residual glue using a plasma machine.
The adhesive is adhesive tape or adhesive paper, and other adhesives which can achieve the same effect as the adhesive tape or the adhesive paper can be adopted. In the embodiment, the red adhesive tape is used as a common material in the production and processing of the circuit board, is convenient to take, has large adhesive content and is not easy to generate residual adhesive.
The invention also provides a circuit board, and the circuit board film-clamping processing method is applied.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings, and is merely for convenience in describing the present invention and simplifying the description, and does not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "connected," "fixed" and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
While the invention has been described in conjunction with the specific embodiments above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, all such alternatives, modifications, and variations are included within the scope of the appended claims.
Claims (3)
1. The circuit board film-clamping treatment method is characterized by comprising the following steps of: firstly, confirming the type of an electroplating clamp film of a current circuit board, and selecting a mode of processing the electroplating clamp film according to the type of the electroplating clamp film of the current circuit board, wherein the type of the clamp film comprises the electroplating clamp film before etching or copper removal and the electroplating clamp film after etching or copper removal, when the type of the electroplating clamp film of the circuit board is the electroplating clamp film before etching or copper removal, the mode of removing the electroplating clamp film by laser ablation or adhering an adhesive to remove the electroplating clamp film, and when the type of the electroplating clamp film of the circuit board is the electroplating clamp film after etching or copper removal, adhering the adhesive to remove the electroplating clamp film; the removing the electroplating clamp film by laser ablation comprises the following steps: checking the electroplating film clamping condition of the circuit board, counting and marking the electroplating film clamping position, manufacturing laser data according to the marked electroplating film clamping position, ablating the electroplating film according to the laser data by a laser machine, and decoppering or etching the circuit board after ablating the electroplating film; the adhering and removing the electroplating clamp film by adopting the adhesive comprises the following steps: checking the electroplating film clamping condition of the circuit board, counting and marking the electroplating film clamping position, attaching an adhesive on the marked electroplating film clamping position, hot-pressing, taking out the electroplating film after removing the adhesive, checking the circuit board, removing the adhesive, and finally carrying out subsequent treatment on the circuit board;
step B1, checking the electroplating film clamping condition of the surface of the circuit board by adopting AOI equipment;
step B2, manually confirming the inspection result, adaptively dividing the area according to the model of the circuit board, and counting and marking the position of the electroplating clamping film;
step B3, adhering an adhesive to the marked electroplating clamping film position;
step B4, hot-pressing the adhesive at the temperature of 120+/-10 ℃ at the hot-pressing speed of 0.8+/-0.1 m/min and the pressure of 0.7+/-0.1 Mpa;
step B5, removing the adhesive, and taking out the electroplating clamping film;
step B6, checking the circuit board to determine whether residual adhesive exists, if so, turning to step B7, and if not, turning to step B8;
step B7, removing residual adhesive on the surface of the circuit board;
step B8, carrying out subsequent processing on the circuit board;
in the step B5, after removing the adhesive, it is necessary to check whether the plating film is left, and if the plating film is left, the operation of removing the plating film is repeated; the operation of removing the electroplating clamp film is repeated from the step B3 to the step B5, or the residual electroplating clamp film is ablated by a laser machine;
in the step B7, removing residual adhesive on the surface of the circuit board by adopting a plasma machine, or erasing the residual adhesive on the surface of the circuit board by using an eraser;
the method for removing the electroplating clamp film by adopting laser ablation comprises the following steps:
step A1, checking the electroplating film clamping condition of the surface of a circuit board by adopting AOI equipment;
step A2, manually confirming the checking result, adaptively dividing the area according to the model of the circuit board, and counting and marking the position of the electroplating clamping film;
a3, manufacturing laser data comprising electroplating clamping position coordinates according to the marked electroplating clamping position;
step A4, ablating the electroplating clamp film by using laser equipment according to the manufactured laser data;
step A5, checking whether the ablated circuit board has carbon black, if so, executing step A6, and if not, executing step A7;
step A6, confirming the position of carbon black on the surface of the circuit board, and removing the carbon black on the surface of the circuit board;
step A7, copper removal or etching is carried out on the circuit board;
in the step A6, removing carbon black on the surface of the circuit board by using a plasma machine;
the subsequent processing of the circuit board comprises the following steps:
step B81, confirming the type of the electroplating clamp film, if the type of the electroplating clamp film is the electroplating clamp film before etching or copper removal, executing step B82, and if the type of the electroplating clamp film is the electroplating clamp film after etching or copper removal, executing step B83 and step B84;
step B82, copper removal or etching is carried out on the circuit board;
step B83, microetching the electroplating film clamping position of the circuit board, and removing the bottom copper of the electroplating film clamping position;
and step B84, washing the circuit board with water to remove residues on the surface of the circuit board.
2. The method of claim 1, wherein the adhesive is tape or gummed paper.
3. A circuit board, characterized in that the method for treating a circuit board by sandwiching a film according to any one of claims 1 to 2 is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211533978.5A CN115568106B (en) | 2022-12-02 | 2022-12-02 | Circuit board film-clamping treatment method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211533978.5A CN115568106B (en) | 2022-12-02 | 2022-12-02 | Circuit board film-clamping treatment method and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115568106A CN115568106A (en) | 2023-01-03 |
| CN115568106B true CN115568106B (en) | 2023-07-21 |
Family
ID=84770061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211533978.5A Active CN115568106B (en) | 2022-12-02 | 2022-12-02 | Circuit board film-clamping treatment method and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115568106B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05337661A (en) * | 1992-06-11 | 1993-12-21 | Hitachi Ltd | Method for removing metallic film by laser |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201537613U (en) * | 2009-07-23 | 2010-08-04 | 昆山博益鑫成高分子材料有限公司 | Cutting-free dust-sucking tumbling cylinder |
| US20110269269A1 (en) * | 2010-05-03 | 2011-11-03 | National Semiconductor Corporation | Laser ablation alternative to low cost leadframe process |
| CN101912859A (en) * | 2010-07-20 | 2010-12-15 | 昆山博益鑫成高分子材料有限公司 | Sticky dust cleaning roller, manufacturing method thereof and cut-to-length winder |
| CN101982248B (en) * | 2010-09-26 | 2012-05-23 | 昆山博益鑫成高分子材料有限公司 | Manufacturing method of suede cleaning roller |
| CN102883541B (en) * | 2012-10-17 | 2015-02-11 | 无锡江南计算技术研究所 | Plasma sandwiched film removing method |
| CN104883823A (en) * | 2015-05-22 | 2015-09-02 | 胜宏科技（惠州）股份有限公司 | Processing method of alkaline etching collapser |
| CN105799289B (en) * | 2016-03-11 | 2018-04-24 | 广州美维电子有限公司 | A kind of method for being posted film and preparation method thereof and film progress pad pasting is posted using this |
| CN108697002A (en) * | 2018-04-24 | 2018-10-23 | 深圳市斯普莱特激光科技有限公司 | A kind of laser processing formula high-precision circuit board manufacture craft |
| CN108650802A (en) * | 2018-06-29 | 2018-10-12 | 珠海杰赛科技有限公司 | A kind of reworking method of plating folder film defective products |
| CN216126245U (en) * | 2021-06-28 | 2022-03-25 | 珠海紫翔电子科技有限公司 | Titanium roller foreign matter adsorption device for circuit board glue-protecting and laminating engineering |
-
2022
- 2022-12-02 CN CN202211533978.5A patent/CN115568106B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05337661A (en) * | 1992-06-11 | 1993-12-21 | Hitachi Ltd | Method for removing metallic film by laser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115568106A (en) | 2023-01-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0071375B1 (en) | Method for manufacturing a circuit board with a through hole | |
| CN112490134B (en) | Packaging substrate processing method of double-sided OSP process | |
| US20060008970A1 (en) | Optimized plating process for multilayer printed circuit boards having edge connectors | |
| US4622097A (en) | Process for producing copper through-hole printed circuit board | |
| CN104284520A (en) | PCB surface treatment method | |
| CN113141723B (en) | Surface treatment method of printed circuit board and printed circuit board | |
| CN105163502A (en) | Low line width and line space etching control method of thick copper plate | |
| CN100471362C (en) | Method for manufacturing flexible circuit board | |
| CN115568106B (en) | Circuit board film-clamping treatment method and circuit board | |
| TW200304507A (en) | Method of stripping silver from a printed circuit board | |
| CN113710011A (en) | Method for manufacturing circuit board by laser etching pattern after electroplating thickening and weldability processing hole | |
| CN107135608B (en) | Method for etching laminate and method for manufacturing printed wiring board using same | |
| CN112654160A (en) | PCB processing technology | |
| CN109511225B (en) | Semi-metallized hole circuit board processing method | |
| CN114245589A (en) | Production process of PTFE high-frequency plate | |
| CN113692131A (en) | Method for manufacturing circuit board by using laser to process electroplating hole plating-resistant and conductive pattern | |
| CN113747673A (en) | Method for manufacturing circuit board by respectively processing electroplating hole, circuit mask and conductive pattern by laser | |
| CN104363705A (en) | Manufacturing process of high-precision microwave printed board | |
| CN113543481B (en) | 3D circuit board manufacturing method | |
| CN112218437B (en) | Method for removing electroplating connection line of thin film circuit pattern | |
| CN113727538A (en) | Method for manufacturing circuit board by laser-made conductive pattern after only electroplating thickening and weldability processing hole | |
| CN113709983B (en) | Circuit board manufacturing method for plating hole, bonding pad plating resistance and conductive pattern by laser processing | |
| CN103203943A (en) | Film mounting method for substrate | |
| CN113709986A (en) | Method for manufacturing circuit board by laser plating of plating-resistant pattern and conductive pattern after hole plating only | |
| EP0804865A1 (en) | Production of electrical circuit boards |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |