CN104363705A - Manufacturing process of high-precision microwave printed board - Google Patents
Manufacturing process of high-precision microwave printed board Download PDFInfo
- Publication number
- CN104363705A CN104363705A CN201410604427.2A CN201410604427A CN104363705A CN 104363705 A CN104363705 A CN 104363705A CN 201410604427 A CN201410604427 A CN 201410604427A CN 104363705 A CN104363705 A CN 104363705A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- copper
- manufacturing process
- board
- completing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a manufacturing process of a high-precision microwave printed board. The manufacturing process includes the steps of firstly, blanking; secondly, drilling; thirdly, performing hole metallization; fourthly, electroplating the whole board; fifthly, forming circuit patterns; sixthly, etching; seventhly, removing ink; eighthly, electroplating the patterns; ninthly, performing solder masking; tenthly, performing exposure; eleventhly, developing; twelfthly, machining appearance. The manufacturing process has the advantages that by the special finished product machining manner, the machining burrs during milling are avoided, production efficiency is increased, and manual repairing is avoided; overall product size is improved thoroughly while client assembling efficiency is increased, and client performance testing yield is increased; by the special electroplating process, cost is lowered, pollution is reduced, the flow is simplified, and the problem that traditional electro-tinning easily causes tin wire short circuit is solved.
Description
Technical field
The present invention relates to a kind of High-precision Microwave printed board manufacturing process.
Background technology
In recent years, high frequency microwave printed, as the requisite auxiliary products of electronic information high and new technology industry, obtains and develops rapidly.High frequency microwave printed is in the copper-clad plate with high-frequency microwave base material, the printed board that processing and manufacturing becomes, and this is a clock rigid printed board, is divided into one side, two-sided, multilayer high frequency microwave printed.The printed board that high frequency base material is formed with common FR-4 base material combined pressure, is called mixed type multilayer printed board; High-frequency microwave base material mixes the printed board that the base material that is pressed into is made with Metal Substrate, be called high-frequency metal base printed board.
Existing industry manufactures high-frequency microwave printed circuit plate, its some processes flow process is as follows: data process-sawing sheet-boring-heavy copper-electric plating of whole board-line pattern-graphic plating-go ink-etching-stripping tin-anti-welding-word-chemical plating stannum-CNC-to scrape burr, its shortcoming is that technological process is complicated: 15 road flow processs, cost of manufacture is high, production efficiency is low, and environmental pollution is high.
Summary of the invention
The technical problem to be solved in the present invention is: for overcoming the problems referred to above, provides a kind of and reduces costs, the High-precision Microwave printed board manufacturing process of decreasing pollution, simple flow.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of High-precision Microwave printed board manufacturing process, comprises the following steps:
(1) blank, gets PCB raw material and cuts into pcb board according to design size, then carry out edging and fillet, toast after completing, and toasts 3 hours under 160 DEG C of degree conditions;
(2) hole, hole on described pcb board according to the position preset, boring reprocessing burr;
(3) hole metallization, carries out surface activation process by sodium bitter edible plant Treatment Solution by the pcb board through above-mentioned process; In hole wall, adhere to one deck chemical copper, every sandwich circuit of pcb board is connected into, form the conducting connected between layers;
(4) electric plating of whole board, uses conductive clip to be clamped the pcb board completing above-mentioned process, after pcb board chemical copper surface increases the thick cathode copper of one deck 5-7um, take off conductive clip, by physics polish-brush mode by clean for pcb board surface cleaning;
(5) line pattern, by clean for the pcb board surface cleaning through above-mentioned process, at pcb board film on surface, by ultraviolet light by the Graphic transitions on the film on pcb board, unreacted dry film is cleaned by liquid medicine, makes pcb board form the figure of demand;
(6) etch, by etching solution by fail dry film protection copper sheet corrosion, the layers of copper at logicalnot circuit position is corroded;
(7) remove ink, use highly basic to be removed by the dry film be attached on the copper face of pcb board, make figure forms copper wire;
(8) graphic plating, pcb board is clipped on the fixture of conduction, by described fixture, pcb board is formed a conductor, by the method for pcb board and plating cylinder conducting by copper, tin electrolysis to completing on the pcb board of figure, the copper that plating needs is thick and tin is thick, is finally dried by the pcb board completing plating;
(9) anti-welding, by the polish-brush mode of physics, pcb board surface cleaning is clean, print one deck ink in the welding position of pcb board, toast afterwards;
(10) expose, expose in exposure machine, its wavelength of the light source selected is between 320-400nm;
(11) develop, utilize the alkalescent of sodium carbonate by the part without ultraviolet radiation on resist mucous membrane, dissolve with 1.0 ± 0.2% sodium carbonate liquors, the dry film of the exposure reservation of ultraviolet radiation and polymerization reaction take place;
(12) sharp processing, uses the tooling hole location of edges of boards, pcb board is divided into the size of demand, and the thickness of reserved overall thickness of slab 10% connects, and the pcb board completing numerical control V-CUT is separated into requirement product according to V-CUT groove, completes.
Preferably, following steps are also had between described step (11) and step (12):
Word, stamps corresponding word according to demand, the pcb board completing printing is cured baking on the pcb board of different solder joints, different model.
The invention has the beneficial effects as follows: the present invention is in cost, reduce by two operations, estimate that every square metre reduces costs 80 yuan, in efficiency, it is 8 plug-in units that client challengees plug-in unit change by oneself, raising efficiency 8 times, reduce by two operations in production process, can the activity duration be reduced, in quality, after the product plug-in unit paid, product quality performance relative uniformity increases, client's performance test Yield lmproved more than 30%, in other function aspects, reduces stripping tin, the heavy with serious pollution operation of tin twice of chemistry, reduce the pressure of PCB for environment, energy-conserving and environment-protective.
Embodiment
The embodiment of a kind of High-precision Microwave printed board manufacturing process of the present invention is provided below.
Embodiment 1
A kind of High-precision Microwave printed board manufacturing process, comprises the following steps:
(1) blank, get PCB raw material and cut into pcb board according to design size, carry out edging and fillet again, edging is by clean for the deburred on the pcb board limit after cutting, decreasing pollution, fillet is adopt conventional equipment that the corner of PCB is processed as fillet from right-angle side, toasts, toast 3 hours under 160 DEG C of degree conditions after completing;
(2) hole, choose suitable brill and chew, make drill spindle rotating speed and roll setting speed parameter, concrete selects according to actual needs, holes on described pcb board according to the position preset, boring reprocessing burr;
(3) hole metallization, by sodium bitter edible plant Treatment Solution, the pcb board through above-mentioned process is carried out surface activation process, can be clean by cleaning in hole, booster is active, and described sodium bitter edible plant Treatment Solution forms by waiting the sodium of material amount and the bitter edible plant dissolving or complexing in the tetrahydrochysene furan food in one's mouth, glycol dimethyl ether; There is redox reaction in described pcb board, form one deck chemical copper in hole wall in heavy copper cylinder, connected into by every sandwich circuit of pcb board, forms the conducting connected between layers;
(4) electric plating of whole board, conductive clip is used to be clamped the pcb board completing above-mentioned process, conductive clip is taken off after pcb board chemical copper surface increases the thick cathode copper of one deck 5-7um, due to chemical copper thickness low LCL, and easily oxidation cannot complete its intact conduction of continuation guarantee when subsequent job, the thick cathode copper of one deck 5-7um need be increased on chemical copper surface, can not have an impact to its conduction property when being convenient to subsequent handling operation, by physics polish-brush mode by clean for pcb board surface cleaning;
(5) line pattern, by clean for the pcb board surface cleaning through above-mentioned process, the diaphragm of one deck macromolecule polymeric material is pasted on pcb board surface, by ultraviolet light by the Graphic transitions on the film on pcb board, unreacted dry film is cleaned by liquid medicine, makes pcb board form the figure of demand;
(6) etch, by etching solution by fail dry film protection copper sheet corrosion, the layers of copper at logicalnot circuit position is corroded;
(7) remove ink, use highly basic to be removed by the dry film be attached on the copper face of pcb board, make figure forms copper wire;
(8) graphic plating, pcb board is clipped on the fixture of conduction, by described fixture, pcb board is formed a conductor, by the method for pcb board and plating cylinder conducting by copper, tin electrolysis to completing on the pcb board of figure, the copper that plating needs is thick and tin is thick, want the uniformity that copper in control hole is thick and tin is thick, adopt low current density long period parameter to produce, finally the pcb board completing plating is dried;
(9) anti-welding, by the polish-brush mode of physics, pcb board surface cleaning is clean, print one deck ink in the welding position of pcb board, toast afterwards;
(10) expose, expose in exposure machine, its wavelength of the light source selected is between 320-400nm;
(11) develop, utilize the alkalescent of sodium carbonate by the part without ultraviolet radiation on resist mucous membrane, dissolve with the sodium carbonate liquor of 1.0 ± 0.2% percents by volume, the dry film of the exposure reservation of ultraviolet radiation and polymerization reaction take place;
(12) sharp processing, use the tooling hole location of edges of boards, pcb board is divided into the size of demand, and the thickness of reserved overall thickness of slab 10% connects, and the pcb board completing numerical control V-CUT is separated into requirement product according to V-CUT groove, completes, the second best in quality profile General Requirements precision meets ± 0.05mm, impulse-free robustness, conduction band metal is without crimping, and medium is without visible deformation.
In preferred embodiments, following steps are also had between described step (11) and step (12):
Word, stamps corresponding word according to demand, the pcb board completing printing is cured baking on the pcb board of different solder joints, different model.
With above-mentioned according to desirable embodiment of the present invention for enlightenment, by above-mentioned description, relevant staff in the scope not departing from this invention technological thought, can carry out various change and amendment completely.The technical scope of this invention is not limited to the content on specification, must determine its technical scope according to right.
Claims (2)
1. a High-precision Microwave printed board manufacturing process, is characterized in that, comprises the following steps:
(1) blank, gets PCB raw material and cuts into pcb board according to design size, then carry out edging and fillet, toast after completing, and toasts 3 hours under 160 DEG C of degree conditions;
(2) hole, hole on described pcb board according to the position preset, boring reprocessing burr;
(3) hole metallization, carries out surface activation process by sodium bitter edible plant Treatment Solution by the pcb board through above-mentioned process; In hole wall, adhere to one deck chemical copper, every sandwich circuit of pcb board is connected into, form the conducting connected between layers;
(4) electric plating of whole board, uses conductive clip to be clamped the pcb board completing above-mentioned process, after pcb board chemical copper surface increases the thick cathode copper of one deck 5-7um, take off conductive clip, by physics polish-brush mode by clean for pcb board surface cleaning;
(5) line pattern, by clean for the pcb board surface cleaning through above-mentioned process, at pcb board film on surface, by ultraviolet light by the Graphic transitions on the film on pcb board, unreacted dry film is cleaned by liquid medicine, makes figure pcb board being formed demand;
(6) etch, by etching solution by fail dry film protection copper sheet corrosion;
(7) remove ink, use highly basic to be removed by the dry film be attached on the copper face of pcb board, make figure forms copper wire;
(8) graphic plating, pcb board is clipped on the fixture of conduction, by described fixture, pcb board is formed a conductor, by the method for pcb board and plating cylinder conducting by copper, tin electrolysis to completing on the pcb board of figure, the pcb board that finally will complete plating is dried;
(9) anti-welding, by the polish-brush mode of physics, pcb board surface cleaning is clean, print one deck ink in the welding position of pcb board, toast afterwards;
(10) expose, expose in exposure machine, the wavelength of selected light source is 320-400nm;
(11) develop, by the part without ultraviolet radiation on resist mucous membrane, dissolve with 1.0 ± 0.2% sodium carbonate liquors, the dry film of the exposure reservation of ultraviolet radiation and polymerization reaction take place;
(12) sharp processing, uses the tooling hole location of edges of boards, pcb board is divided into the size of demand, and the thickness of reserved overall thickness of slab 10% connects, and the pcb board completing numerical control V-CUT is separated into requirement product according to V-CUT groove, completes.
2. High-precision Microwave printed board manufacturing process according to claim 1, is characterized in that, also has following steps between described step (11) and step (12):
Word, stamps corresponding word according to demand, the pcb board completing printing is cured baking on the pcb board of different solder joints, different model.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410604427.2A CN104363705A (en) | 2014-10-30 | 2014-10-30 | Manufacturing process of high-precision microwave printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410604427.2A CN104363705A (en) | 2014-10-30 | 2014-10-30 | Manufacturing process of high-precision microwave printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104363705A true CN104363705A (en) | 2015-02-18 |
Family
ID=52530909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410604427.2A Pending CN104363705A (en) | 2014-10-30 | 2014-10-30 | Manufacturing process of high-precision microwave printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104363705A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163140A (en) * | 2016-07-20 | 2016-11-23 | 深圳市星扬化工有限公司 | A kind of upright opening metallization lines VCP electroplanting device and technique |
| CN113923868A (en) * | 2021-09-07 | 2022-01-11 | 德中（天津）技术发展股份有限公司 | Method for manufacturing high-frequency microwave board by using laser |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012044093A (en) * | 2010-08-23 | 2012-03-01 | Fujikura Ltd | Printed wiring board manufacturing method |
| CN103260361A (en) * | 2013-05-14 | 2013-08-21 | 金悦通电子（翁源）有限公司 | Method with simple process for processing HDI outer layer line negative film being |
| CN103957665A (en) * | 2014-04-29 | 2014-07-30 | 吉安市华阳电子有限公司 | High-frequency microwave PCB |
-
2014
- 2014-10-30 CN CN201410604427.2A patent/CN104363705A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012044093A (en) * | 2010-08-23 | 2012-03-01 | Fujikura Ltd | Printed wiring board manufacturing method |
| CN103260361A (en) * | 2013-05-14 | 2013-08-21 | 金悦通电子（翁源）有限公司 | Method with simple process for processing HDI outer layer line negative film being |
| CN103957665A (en) * | 2014-04-29 | 2014-07-30 | 吉安市华阳电子有限公司 | High-frequency microwave PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163140A (en) * | 2016-07-20 | 2016-11-23 | 深圳市星扬化工有限公司 | A kind of upright opening metallization lines VCP electroplanting device and technique |
| CN113923868A (en) * | 2021-09-07 | 2022-01-11 | 德中（天津）技术发展股份有限公司 | Method for manufacturing high-frequency microwave board by using laser |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104105361B (en) | A kind of method of circuit board selective electroplating conductive hole | |
| CN101951728B (en) | Production method for replacing flexible circuit board with rigid circuit board | |
| CN103391682B (en) | The processing method with the pcb board of step groove | |
| CN101730389B (en) | Method for manufacturing single-side hollow out flexible circuit board | |
| CN104411106B (en) | A kind of preparation method of printed circuit board fine-line | |
| CN110494936B (en) | Method for manufacturing circuit board by selective etching of seed layer | |
| CN103945648B (en) | A kind of high-frequency circuit board production technology | |
| CN101318401A (en) | Screen printing plate and manufacturing method thereof | |
| CN104202907B (en) | A kind of UV print processes make the technique that heavy copper electroplates via hole double-sided wiring board | |
| CN102143656B (en) | Manufacturing method of circuit board made of high-dielectric composite material | |
| CN104582319A (en) | Metallized semi-hole forming method and printed circuit board manufacturing method | |
| CN103140059B (en) | There is the working method of the multilayer circuit board of blind hole | |
| CN103957665A (en) | High-frequency microwave PCB | |
| CN106455345A (en) | Method of machining burr-free hole of PCB copper-based core board | |
| CN102638937A (en) | Preparation method of copper-base printed wiring board | |
| CN102137551A (en) | Production method of high-frequency four-layer circuit board | |
| CN104812178A (en) | Manufacturing method for circuit board with segmented metal pin | |
| CN106852033A (en) | High precision part very high current printed circuit board processing method | |
| CN104093277A (en) | Method for improving cutter breaking condition in hole drilling process of thick copper plate | |
| CN104363705A (en) | Manufacturing process of high-precision microwave printed board | |
| CN107734864A (en) | A kind of straight etching technique of pcb board | |
| CN105163503A (en) | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing | |
| CN105228357B (en) | A kind of preparation method of ladder wiring board | |
| CN103874331A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN104582293A (en) | Manufacturing method of ceramic-based circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150218 |
|
| RJ01 | Rejection of invention patent application after publication |