CN112004337A - Solder ball with coating, ball mounting method and packaging method - Google Patents
Solder ball with coating, ball mounting method and packaging method Download PDFInfo
- Publication number
- CN112004337A CN112004337A CN202010864721.2A CN202010864721A CN112004337A CN 112004337 A CN112004337 A CN 112004337A CN 202010864721 A CN202010864721 A CN 202010864721A CN 112004337 A CN112004337 A CN 112004337A
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- CN
- China
- Prior art keywords
- coating
- solder ball
- solder
- flux
- ball body
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Abstract
The application discloses a solder ball with a coating, a ball mounting method and a packaging method. When the ball is planted, the welding ball with the coating is firstly formed; placing the solder balls with the coating on the bonding pads of the substrate; and reflowing the solder balls with the coating and the pads. The spot welding link is saved, the solder ball implantation process is simplified, and the efficiency is higher.
Description
Technical Field
The present application relates generally to the field of semiconductor manufacturing technology, and more particularly to a solder ball with a coating, a ball mounting method, and a packaging method.
Background
In order to connect the solder balls, the soldering flux is arranged on the corresponding bonding pad of the printed circuit board, and the solder balls are placed after the soldering flux is subjected to spot welding. The solder balls are prevented from being separated from the corresponding bonding pads of the printed circuit board after falling down, and finally reflow is carried out to finish welding, so that the solder balls are attached to the corresponding bonding pads of the printed circuit board. However, the ball-mounting method of spot welding and reflow is inefficient.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a solder ball with a coating, a ball mounting method and a packaging method.
In a first aspect, the present invention provides a solder ball with a coating, including a solder ball body, the solder ball body has a flux coating outside, and the flux coating has a hot-melt protective coating outside.
In one embodiment, the hot-melt protective coating is a polymeric material.
In a second aspect, the present invention provides a ball mounting method for the above-mentioned solder ball with a coating, the method comprising:
forming the solder ball with the coating;
placing the solder balls with the coating on the bonding pads of the substrate;
and reflowing the solder balls with the coating and the pads.
In one embodiment, forming the solder ball with the coating layer comprises:
coating a layer of uniform soldering flux on the outer surface of the solder ball body;
and forming a hot-melt protective coating on the outer surface of the soldering flux coating layer.
In one embodiment, the hot-melt protective coating is a polymeric material.
In one embodiment, applying a uniform layer of flux to the outer surface of the solder ball body comprises:
immersing the solder ball body in a soldering flux bath;
spraying the flux onto the solder ball body, or dispensing the flux onto the solder ball.
In one embodiment, applying a uniform layer of flux to the outer surface of the solder ball body further comprises: and curing the soldering flux to form the soldering flux coating on the solder ball body.
In one embodiment, placing the solder balls with the coating on the pads of the substrate comprises:
the solder ball picking tool picks up the solder balls with the coating;
placing the solder balls with the coating on the bonding pads of the substrate;
and pressing down the solder ball with the coating so that the polymer layer of the contact part of the solder ball and the pad is pressed away.
In one embodiment, reflow soldering the coated solder balls and pads comprises: and melting the soldering flux coating outside the solder ball body to form a solder joint.
In one embodiment, the method further comprises: and cleaning the substrate implanted with the solder balls by using deionized water and drying.
In a third aspect, the present invention provides a packaging method comprising the steps of the above-described ball mounting method.
Compared with the prior art, the invention has the following advantages:
the solder ball with the coating comprises a solder ball body, wherein a soldering flux coating is arranged outside the solder ball body, and a hot-melt protective coating is arranged outside the soldering flux coating. When the ball is planted, the welding ball with the coating is firstly formed; placing the solder balls with the coating on the bonding pads of the substrate; and reflowing the solder balls with the coating and the pads. The spot welding link is saved, the solder ball implantation process is simplified, and the efficiency is higher.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a solder ball with a coating according to an embodiment of the present invention;
fig. 2 is a flowchart of a ball mounting method according to an embodiment of the present invention;
FIG. 3 is a flow chart of forming a flux coating on a solder ball body according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a solder ball pick tool provided by an embodiment of the invention picking up solder balls with a coating;
FIG. 5 is a schematic view of a solder ball with a coating disposed on a pad of a substrate according to an embodiment of the present invention;
FIG. 6 is a schematic view of a portion of a polymer layer of a solder ball having a coating layer contacting the pad being pressed away according to an embodiment of the present invention;
FIG. 7 is a schematic view of a coated solder ball and a solder pad after reflow soldering in accordance with an embodiment of the present invention;
fig. 8 is a schematic diagram illustrating a substrate implanted with solder balls after being cleaned and dried according to an embodiment of the present invention.
In the figure: 1-solder ball with coating, 11-solder ball body, 12-soldering flux coating, 13-hot melt protective coating, 2-substrate, 3-pad.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As mentioned in the background art, the ball mounting method of spot welding and reflow is inefficient, and how to provide a ball mounting method with higher efficiency will become an improvement direction of the present application. Therefore, the present application provides a solder ball with a coating, a ball mounting method and a packaging method.
Referring to fig. 1, fig. 1 illustrates a solder ball with a coating provided by the present embodiment.
The solder ball with the coating comprises a solder ball body, wherein a soldering flux coating is arranged outside the solder ball body, and a hot-melt protective coating is arranged outside the soldering flux coating.
The hot-melt protective coating is made of polymer. The polymeric material includes, but is not limited to, a resin material, the primary purpose of which is to protect the flux coating. It is emphasized that the above-mentioned resin materials are melted under a high pressure or a high temperature.
Referring to fig. 2, fig. 2 shows the process of the ball mounting method provided in this embodiment, which is used for the solder ball with the coating layer described above.
In step 201, forming the solder ball with the coating;
in step 202, placing the solder balls with the coating on a pad of a substrate;
in step 203, the solder balls and the pads with the coating are reflowed.
Wherein forming the solder ball with the coating comprises:
coating a layer of uniform soldering flux on the outer surface of the solder ball body;
and forming a hot-melt protective coating on the outer surface of the soldering flux coating layer.
Further, the hot-melt protective coating is made of a polymer material.
The polymeric material includes, but is not limited to, a resin material, the primary purpose of which is to protect the flux coating. It is emphasized that the above-mentioned resin materials are melted under a high pressure or a high temperature.
Specifically, coating a layer of uniform flux on the outer surface of the solder ball body comprises:
immersing the solder ball body in a soldering flux bath;
spraying the flux onto the solder ball body, or dispensing the flux onto the solder ball.
Preferably, the step of applying a uniform layer of flux to the outer surface of the solder ball body further comprises: and curing the soldering flux to form the soldering flux coating on the solder ball body.
Referring to fig. 3, a flow chart of the operation of an exemplary method of forming a flux coating on a solder ball body is shown.
The solder ball bodies 11 may be placed on a tray that includes an opening at the bottom for exposing the solder ball bodies 11, step 301.
The exposed solder ball bodies placed on the tray may be immersed in a liquid of flux or a paste of flux to coat the solder balls with flux, step 302.
For example, depending on the composition of the flux, the solder ball body 1 may be placed in an oven (e.g., a reflow oven) at a temperature of about 140 ℃ to 160 ℃ for 4 minutes to 6 minutes. The oven temperature may be selected to be well below the solidus temperature of the solder ball body 11.
Although the method has been described with reference to forming a solid coating of flux on the solder ball body 11 using a dip coating process, it should be noted that other techniques may be used to coat the solder balls with a low activity flux prior to curing. In other implementations, the low activity flux may be sprayed or otherwise dispensed on the solder ball body 1 prior to curing.
As shown in fig. 4 to 6, the disposing the solder balls with the coating layer on the pads of the substrate includes:
the solder ball picking tool picks up the solder balls with the coating;
placing the solder balls with the coating on the bonding pads of the substrate;
and pressing down the solder ball with the coating so that the polymer layer of the contact part of the solder ball and the pad is pressed away.
It is mentioned above that the resin material melts under high pressure and thus the polymer in contact with the pad melts to expose the flux coating.
As shown in fig. 7, the reflow soldering the solder balls and the pads with the coating layer includes: and melting the soldering flux coating outside the solder ball body to form a solder joint. Flux may be disposed on the pads. For example, flux may be printed on each pad of the PCB. The fluxed solder ball bodies may be placed on the flux dispensed by the corresponding pads of the PCB to form an assembly. The assembly may be reflowed to form a solder joint. During reflow, the flux applied to the solder ball body and the flux on the solder pad melt simultaneously to form a solder joint.
Specifically, the solder ball with the coating and the substrate are placed into a reflow oven to be heated, the polymer layer on the solder ball body is completely melted by hot gas, the scaling powder coating is melted along with the heating time, the melted scaling powder flows between the solder ball body and the bonding pad, and the solder ball body is welded to the bonding pad position on the substrate.
As shown in fig. 8, the method further comprises: and cleaning the substrate implanted with the solder balls by using deionized water and drying. The excess cold solidified flux on the solder balls and pads disappears from the solder balls and pads after the ion cleaning.
In addition, the present embodiment provides a packaging method, which includes the steps of the ball-mounting method described above. The packaging method is a flip-chip method.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of the above features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (11)
1. The solder ball with the coating is characterized by comprising a solder ball body, wherein a soldering flux coating is arranged outside the solder ball body, and a hot-melt protective coating is arranged outside the soldering flux coating.
2. A solder ball with a coating according to claim 1, wherein the thermal melting protective coating is a polymer material.
3. A method of ball implantation for the coated solder ball of claim 1, the method comprising:
forming the solder ball with the coating;
placing the solder balls with the coating on the bonding pads of the substrate;
and reflowing the solder balls with the coating and the pads.
4. The method of claim 3, wherein forming the coated solder balls comprises:
coating a layer of uniform soldering flux on the outer surface of the solder ball body;
and forming a hot-melt protective coating on the outer surface of the soldering flux coating layer.
5. A method for planting balls as claimed in claim 3, wherein the hot-melt protective coating is a polymer material.
6. The method of claim 4, wherein applying a uniform layer of flux to the outer surface of the solder ball body comprises:
immersing the solder ball body in a soldering flux bath;
spraying the flux onto the solder ball body, or dispensing the flux onto the solder ball.
7. The method of claim 4, wherein applying a uniform flux to the outer surface of the solder ball body further comprises: and curing the soldering flux to form the soldering flux coating on the solder ball body.
8. The method of claim 3, wherein placing the solder balls with the coating on the pads of the substrate comprises:
the solder ball picking tool picks up the solder balls with the coating;
placing the solder balls with the coating on the bonding pads of the substrate;
and pressing down the solder ball with the coating so that the polymer layer of the contact part of the solder ball and the pad is pressed away.
9. The method of claim 3, wherein reflowing the coated solder balls and pads comprises: and melting the soldering flux coating outside the solder ball body to form a solder joint.
10. A method of ball placement as defined in claim 3, further comprising: and cleaning the substrate implanted with the solder balls by using deionized water and drying.
11. A packaging method, characterized in that it comprises the steps of the ball-mounting method according to any one of claims 3 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010864721.2A CN112004337A (en) | 2020-08-25 | 2020-08-25 | Solder ball with coating, ball mounting method and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010864721.2A CN112004337A (en) | 2020-08-25 | 2020-08-25 | Solder ball with coating, ball mounting method and packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112004337A true CN112004337A (en) | 2020-11-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010864721.2A Pending CN112004337A (en) | 2020-08-25 | 2020-08-25 | Solder ball with coating, ball mounting method and packaging method |
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| Country | Link |
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| CN (1) | CN112004337A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010013653A1 (en) * | 1998-08-17 | 2001-08-16 | Kazutaka Shoji | Array of electrodes reliable, durable and economical and process for fabrication thereof |
| JP2004247358A (en) * | 2003-02-10 | 2004-09-02 | Sony Corp | Semiconductor device, its manufacturing method, and solder ball used in it |
| CN101733585A (en) * | 2010-02-10 | 2010-06-16 | 北京海斯迪克新材料有限公司 | Material for packaging bump protective layer of wafer-level chip |
| CN102969286A (en) * | 2012-12-19 | 2013-03-13 | 苏州晶方半导体科技股份有限公司 | Semiconductor chip packaging structure and method |
| CN106238949A (en) * | 2016-08-24 | 2016-12-21 | 浙江亚通焊材有限公司 | A kind of precise welded ball of band soldering flux coating and preparation method thereof |
| CN110557937A (en) * | 2018-05-31 | 2019-12-10 | 铟泰公司 | Flux effective to inhibit non-wetting opening in BGA assemblies |
-
2020
- 2020-08-25 CN CN202010864721.2A patent/CN112004337A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010013653A1 (en) * | 1998-08-17 | 2001-08-16 | Kazutaka Shoji | Array of electrodes reliable, durable and economical and process for fabrication thereof |
| JP2004247358A (en) * | 2003-02-10 | 2004-09-02 | Sony Corp | Semiconductor device, its manufacturing method, and solder ball used in it |
| CN101733585A (en) * | 2010-02-10 | 2010-06-16 | 北京海斯迪克新材料有限公司 | Material for packaging bump protective layer of wafer-level chip |
| CN102969286A (en) * | 2012-12-19 | 2013-03-13 | 苏州晶方半导体科技股份有限公司 | Semiconductor chip packaging structure and method |
| CN106238949A (en) * | 2016-08-24 | 2016-12-21 | 浙江亚通焊材有限公司 | A kind of precise welded ball of band soldering flux coating and preparation method thereof |
| CN110557937A (en) * | 2018-05-31 | 2019-12-10 | 铟泰公司 | Flux effective to inhibit non-wetting opening in BGA assemblies |
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Application publication date: 20201127 |