JP3529164B2 - Soldering method and apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for soldering electronic equipment materials, especially electronic equipment materials such as printed circuit boards.

Generally, as a method for soldering an electronic device material such as a printed circuit board, there are a trowel method, a reflow method and a flow method.

The troweling method is a method in which an operator applies a greasy solder wire held in one hand to a soldering portion and heats it with a trowel held in the other hand to perform soldering. is there. This troweling method is suitable for soldering uneven portions and repairing defects generated by other soldering methods, but has the problem of poor productivity because soldering is performed one by one.

In the reflow method, a solder paste composed of a paste-like flux and powdered solder is applied by printing on a printed circuit board with a screen and heated by a heating device such as a reflow furnace, a high temperature steam tank, a laser device, or a hot air device. Is a method of soldering. This reflow method is
It is excellent in productivity because it can apply solder paste to many soldering parts, but it is troublesome and costly because you have to procure screens that match the soldering parts of the printed circuit board and use expensive solder paste. There was a problem.

The flow method is a method of soldering with an automatic soldering device provided with a processing device such as a fluxer, a preheater, and a soldering tank. Like the reflow method, this flow method is also suitable for soldering at many places. It has the excellent feature of being able to In addition, the flow method does not require expensive screens or solder pastes, and therefore has an economical advantage that production can be performed at low cost.

In the conventional flow method, a flux obtained by dissolving solid contents such as pine resin and an activator in a low boiling point solvent such as isopropyl alcohol is applied by a foaming fluxer or a spray fluxer and preheated by a preheater. The soldering was carried out by contacting with the molten solder jetted from the solder bath.

For example, when soldering a printed circuit board by the flow method, a liquid flux is put in a foaming fluxer of an automatic soldering device, and the flux is foamed and applied to the soldering surface of the printed circuit board. Then, this printed board is preheated by a preheater to volatilize the solvent, and then is brought into contact with the molten solder in the jet solder bath for soldering. The flux applied to the printed circuit board is melted by the heat of the molten solder when the printed circuit board is brought into contact with the molten solder, and becomes active. This activated flux reduces and removes the oxide film adhering to the soldering surface to clean the soldering surface, and at the same time, reduces oxides on the surface of the molten solder to eliminate defective soldering.

The flux used in the conventional flow method is
Since it contains solids such as pine resin and activator that do not volatilize at the soldering temperature, the solids always adhere to the printed circuit board as flux residues after soldering.

[0009]

When the flux residue is attached to the soldering portion of the electronic device, it interferes with the contact between the pin and the soldering portion of the device for inspecting the soldering failure after the soldering, and the electrical conduction state is reached. This causes poor pin contact property that deteriorates the contact resistance.

If the flux residue is left attached, the insulation resistance of the printed circuit board may be reduced over a long period of time, and corrosion may occur, which may cause breakage of the conductor. there were. This is because the activator in the flux residue absorbs moisture in the air, or dust or dust adheres to the viscous pine resin component, and the dust or dust absorbs moisture.

For this reason, in printed boards used in electronic devices such as computers and communication devices where reliability is important, flux residues have been washed off after soldering. Solvents such as freon and trichlene, which dissolve pine resin and activator well, are suitable for cleaning the flux residue, but these solvents destroy the ozone layer surrounding the earth and a large amount of harmful ultraviolet rays from the sun. Its use has come to be regulated because it causes skin cancer to occur in humans.

Therefore, recently, a so-called "flux for cleaning water" which can be cleaned with water without using Freon or trichlene has also appeared. However, the water cleaning flux must use a large amount of water at the time of cleaning, the water treatment facility after the water cleaning requires a large amount of money, and further, the water enters the electronic parts to cause the function of the electronic parts. At present, it has not been put to practical use due to problems such as the possibility of deteriorating.

It is an object of the present invention to provide a soldering method and an apparatus therefor, in which no flux residue is left after soldering, so that cleaning of the flux residue is unnecessary.

[0014]

DISCLOSURE OF THE INVENTION The present inventors have noticed that a liquid having a reducing action on a metal oxide does not lose its reducing action even when it is vaporized and no residue remains. And completed the present invention.

According to the present invention, a liquid having a reducing action on metal oxides is vaporized by the heat of molten solder or the heat of a solder bath, and the vaporized gas is applied to a soldered part,
It is a soldering method characterized in that the soldered portion is brought into contact with molten solder to perform soldering, and a preheater and a jet solder bath are installed in the order in which the printed circuit board travels, and a liquid with a reducing action. The soldering device is characterized in that a supply pipe for flowing the solder is installed in front of a jet nozzle for jetting the solder.

Generally, the temperature of the solder melted in the solder bath is about 250 ° C., so that the boiling point of the liquid having a reducing action used in the present invention must be 250 ° C. or less.

Suitable reducing liquids for use in the present invention include formic acid (101 ° C.), acetic acid (119 ° C.), propionic acid (141 ° C.), caproic acid (206 ° C.), enanthic acid (223 ° C.). ), Caprylic acid (239 ° C), succinic acid (235 ° C), acrylic acid (141 ° C), diacetyl (87 ° C), acetylacetone (141 ° C), acetonylacetone (191 ° C), lactic acid (119 ° C), etc. Yes, any one of these or two or more thereof are mixed. * () Is boiling point.

In the case of soldering with the liquid gas having the reducing action, the soldering is possible even in an atmosphere containing oxygen, but in an atmosphere filled with an inert gas such as nitrogen, carbon dioxide, helium or argon. If the soldering is carried out with, the defects are further reduced and the solderability is improved.

In the present invention, as a method of vaporizing a liquid having a reducing action, the liquid may be dropped directly on the molten solder having a high temperature, or a supply pipe through which the liquid flows may be provided in a solder bath. You may heat indirectly from a supply pipe by contacting a wall surface or immersing in molten solder.

[0020]

[Function] Since the gas having a high concentration is formed immediately after the liquid having the reducing action is vaporized, the reducing action is strongly exerted on the soldered portion in the vicinity thereof. Further, when a liquid having a reducing action is dropped on the molten solder or a vaporized gas is sprayed, the surface of the molten solder is also cleaned, and the soldering can be performed in a state without an oxide.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. 1 is a front sectional view of a first embodiment of a soldering apparatus according to the present invention, FIG. 2 is a side view of an essential part of the first embodiment, FIG. 3 is a plan view of an essential part of the first embodiment, and FIG. FIG. 5 is a front view of a second embodiment of the soldering apparatus of FIG. 5, FIG. 5 is a side view of a main portion of the second embodiment, and FIG. 6 is a plan view of a main portion of the second embodiment.

First, the soldering apparatus of the first embodiment will be described. The soldering apparatus has a box-shaped main body 1 with a printed board carry-in port 2 on one side and a printed board carry-out port 3 on the other side.
There is. Outside air intrusion prevention devices 4 and 4 are installed at the carry-in port 2 and the carry-out port 3. The outside air intrusion prevention device is a device in which a large number of elastic films are erected in the upper and lower parts, and the printed circuit board enters and leaves the inside while contacting the elastic film, but the outside air is blocked by the elastic film. It is hard to get inside the body.

The printed circuit board P is a conveyor (one-dot chain line).
5 is conveyed in the direction of arrow A.

In the main body 1, a preheater 6, a jet solder bath 7 and a cooler 8 are installed in the order in which the printed circuit board travels.

The molten solder 9 is put in the jet solder bath 7, and a primary jet nozzle 10 and a secondary jet nozzle 11 are installed in the order of the printed board traveling direction. The primary jet nozzle 10 has a rough wave device (not shown) installed in the nozzle to make the molten solder jetted from the nozzle into a rough wave. The secondary jet nozzle 11 is designed to create a gentle flow as opposed to the primary jet nozzle.

In the jet solder bath, when soldering the printed circuit board, first, the molten solder is caused to enter the corners and through holes of the electronic component by the rough wave of the primary jet nozzle.
Try to get rid of unsoldered. However, rough waves tend to create bridges between the mounts of the printed circuit board and flicker on the lead tips. Therefore, the bridge or icicle is brought into contact with the gentle flow of the next secondary jet nozzle to correct it.

In front of the traveling direction of the primary jet nozzle 10,
As shown in FIG. 2, the supply pipe 12 is installed in a direction substantially orthogonal to the traveling direction of the conveyor. A dripping nozzle 13 for dripping the liquid onto the surface of the molten solder is provided at the tip of the supply pipe of the first embodiment. In the supply pipe 12, a liquid 1 having a reducing action and having a boiling point that is lower than the temperature of the solder 1
4 is sent from a tank (not shown) and dropped from the dropping nozzle 13 onto the surface of the molten solder 9.

In addition, as shown in FIG. 3, an inert gas ejection pipe 15 is installed near the solder bath 7, for example, on the side surface. The inert gas ejection pipe 15 is provided with a large number of ejection holes obliquely upward, from which an inert gas such as nitrogen, carbon dioxide, helium, or argon is ejected.

Next, a soldering method using the above soldering apparatus will be described.

The printed circuit board P is first preheated by the preheater 6. Preheating the printed circuit board is because when the printed circuit board at room temperature and the electronic components mounted on the printed circuit board are brought into rapid contact with the molten solder that has become hot,
This is because the printed circuit board may be greatly warped due to heat shock, or the functions of electronic components may deteriorate.

The preheated printed circuit board P is conveyed to the jet solder bath 7 by the conveyor 5. In the jet solder bath 7, a supply pipe 12 is installed in front of the primary jet nozzle 10, and a liquid 14 having a reducing action is dripped onto the surface of the molten solder 9 from a dropping nozzle 13 of the supply pipe. For example, when formic acid is used as a liquid having a reducing action and is dropped on the surface of the molten solder, the boiling point of formic acid is 101 ° C., so that it instantly becomes a gas and the gas rises upward.

When the printed circuit board P conveyed by the conveyor 5 reaches the solder bath, the reducing gas rising from below hits the back surface of the circuit board immediately before contacting the molten solder jetted from the primary jet nozzle 10. The reducing gas reduces and cleans the oxide film on the soldered portion of the printed board. The gas also hits the jetted molten solder to reduce and remove oxides floating on the surface of the molten solder. Since the printed circuit board having the clean soldering portion is brought into contact with the molten solder having no oxide, the soldering portion can be soldered without being unsoldered.

In the primary jet nozzle 10, no matter how the soldering portion or the surface of the molten solder is cleaned, the waves of the primary jet nozzle are rough, so that a bridge is formed between the conductors of the printed circuit board or a lead is flickered. Resulting in. Therefore, in order to correct these defects, the printed board is brought into contact with the molten solder jetted from the secondary jet nozzle that creates a gentle flow. A supply pipe may be installed in front of the secondary jet nozzle.

When 100 printed boards (ceramic boards of Ag-Pd conductors) were soldered by the soldering method of the present invention using the soldering apparatus of the first embodiment, the pin contactability was 0. %Met. The printed circuit board was left in a constant temperature and humidity chamber at a humidity of 85% and a temperature of 85 ° C for 500 hours, and the change in insulation resistance was measured. As a result, it was 1 × 10 ⁹ Ω before being left and 1 × after being left. 10 ⁹ Ω
There was no change at all.

Next, a second embodiment of the soldering apparatus of the present invention will be described with reference to FIGS. Here, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

Supply pipe 1 for flowing a liquid having a reducing action
As shown in FIGS. 5 and 6, 2 is laid in contact with the outer wall surface of the jet solder bath 7, and the temporary jet nozzle 10
Has been extended to the front. A blowing nozzle 16 for blowing gas upward is installed in the supply pipe.

A liquid having a low boiling point and having a reducing action, for example, a liquid such as diacetyl is made to flow through the supply pipe of the second embodiment. Then, since the supply pipe is in contact with the solder bath, the diacetyl in the supply pipe is indirectly heated through the supply pipe, vaporized in the supply pipe 12, and blown out from the blowing nozzle 16 as a reducing gas. Come on.

The gas blown out from the blowing nozzle 16 hits the printed circuit board P passing above to reduce and remove the oxide film of the soldering portion, and at the same time, to clean the molten solder 9 jetted from the primary jet nozzle 10. Perform unsoldered soldering.

The printed board 10 soldered by the soldering method of the present invention using the soldering apparatus of the second embodiment.
When the same test as in the first embodiment was performed on 0 sheets,
The defective rate of the pin contact property was 0%, and the insulation resistance was not reduced at all.

[0040]

Comparative Example Next, a comparative example will be described. In the comparative example, a conventional soldering device equipped with a foam fluxer, a preheater, and a jet solder bath was used as a soldering device, and 25 wt% of pine resin and 1 wt% of diethanolamine hydrobromide were used as isopropyl alcohol as a flux. The liquid flux which was melt | dissolved by was used.

A liquid flux is put in a foam fluxer to apply a foam to a printed circuit board and preheated by a preheater. Then, the molten solder jetted from the primary jet nozzle and the molten solder jetted from the secondary jet nozzle are applied. Contact was made and soldering was performed.

When the pin contact property of 100 printed circuit boards soldered by the conventional soldering apparatus and the soldering method was inspected, the defective rate was 45%. In addition, as a result of the insulation resistance test in the above-mentioned constant humidity and constant temperature tank, 1 × 10 before leaving
^The resistance value, which was ⁹ Ω, dropped to 1 × 10 ⁶ after standing.

[0042]

As described above, according to the present invention, after soldering, no flux residue remains on the soldered portion, so that the insulation resistance of the soldered portion is reduced and corrosion products are not generated as in the conventional case. It has excellent characteristics such as not causing wire breakage of the conductor and causing no contact failure in the pin contact property inspection after soldering.

[Brief description of drawings]

FIG. 1 is a front sectional view of a soldering device according to a first embodiment of the present invention.

FIG. 2 is a side view of the essential parts of the first embodiment of the soldering apparatus of the present invention.

FIG. 3 is a plan view of an essential part of a first embodiment of a soldering device of the invention.

FIG. 4 is a front sectional view of a second embodiment of the soldering apparatus of the present invention.

FIG. 5 is a side view of the essential parts of the second embodiment of the soldering apparatus of the present invention.

FIG. 6 is a plan view of an essential part of a second embodiment of the soldering device of the invention.

[Explanation of symbols]

1 Soldering machine body 5 conveyors 6 preheater 7 Jet solder bath 9 Molten solder 10 Primary jet nozzle 11 Secondary jet nozzle 12 Supply pipe 13 Dripping nozzle 14 Liquid with reducing action 16 blow nozzle P printed circuit board

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI B05D 7/24 301 B05D 7/24 301Z B23K 101: 42 B23K 101: 42 (72) Inventor Hidetoshi Ota Tsukagoshi, Kawasaki City, Kanagawa Prefecture 4-320 Nippon Oxygen Co., Ltd. (72) Inventor Nao Shibuya 4-320 Tsukoshi Tsukagoshi, Sachi-ku, Kawasaki-shi, Kanagawa Nihon Oxygen Co., Ltd. (56) Reference JP-A-57-137070 (JP, A) JP-A-6 -169164 (JP, A) International Publication 94/014563 (WO, A1) (58) Fields investigated (Int.Cl. ⁷ , DB name) B23K 1/08 B23K 1/20 H05K 3/34 B05D 3/04

Claims (3)

(57) [Claims] 1. A liquid having a reducing action on metal oxides is vaporized by heat of molten solder or heat of a solder bath,
After applying the vaporized gas to the part to be soldered, in a soldering device that performs soldering by bringing the part to be soldered into contact with molten solder, a preheater and a jet solder bath are installed in the order in which the printed circuit board travels. A supply pipe for flowing a liquid with a reducing action is installed in front of a jet nozzle for jetting solder, and a preheater
There are multiple inert gas ejection holes between the solder and the solder bath.
A soldering device characterized in that an inert gas ejection pipe is installed . 2. The supply pipe for flowing the liquid having the reducing action is provided with a dropping nozzle for dropping the liquid having the reducing action onto the surface of the molten solder in the solder bath. Soldering equipment. 3. A supply pipe for flowing a liquid having a reducing action is provided with a blowing nozzle for vaporizing the liquid having a reducing action by heat of a solder bath and blowing the vaporized gas to a soldered portion. The soldering apparatus according to claim 1, wherein: