CN103286405B - Method for separating elements and solder from waste printed circuit board - Google Patents
Method for separating elements and solder from waste printed circuit board Download PDFInfo
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- CN103286405B CN103286405B CN201310180863.7A CN201310180863A CN103286405B CN 103286405 B CN103286405 B CN 103286405B CN 201310180863 A CN201310180863 A CN 201310180863A CN 103286405 B CN103286405 B CN 103286405B
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Abstract
The invention discloses a method for separating elements and solder from a waste printed circuit board. The method is characterized by including: using brown fused alumina particles as heating media, and using a flat-bottom electric furnace for heating the brown fused alumina particles; and placing a welding surface of the printed circuit board downwards, flatly placing the printed circuit board on the heated brown fused alumina particles, applying vertical downward force to an element surface of the printed circuit board to enable the welding surface to be in full contact with the heated brown fused alumina particles, taking out the printed circuit board after the solder is molten completely, placing the welding surface upwards and the element surface downwards, applying vertical impact force to the welding surface, and enabling the solder and the elements to be separated from the printed circuit board. The method is low in energy consumption, low in cost, high in separating efficiency and good in separating effect.
Description
Technical field
The present invention relates to a kind of method from resolution element discarded printed circuit boards and solder.
Background technology
Printed circuit board (PCB) is called for short PCB, is the indispensable part of electric equipment products.Along with the develop rapidly of electronics industry and the continuous application of new and high technology, superseded electronic apparatus quantity is increased sharply, and thereby produces a large amount of discarded printed circuit boards, if in addition unsuitable recycling, will bring serious threat to environmental protection.Experiment detection shows, the most of function of the element on discarded printed circuit boards is intact, still can continue to use; Simultaneously, owing to containing various poisonous and harmful substances and precious metal in electronic component, before carrying out circuit board recycling, if the element on it is removed, can greatly simplify follow-up recovery process, especially reduce the cost of investment of environmental protection equipment in subsequent treatment.Therefore, carry out being separated of element and solder for discarded printed circuit board (PCB), one is obtain the element that can reuse, and two is simplify follow-up recovery process.
The existing method from resolution element discarded printed circuit boards and solder mainly contains both at home and abroad:
1, air heat method: Chinese patent CN101417358A and CN1600458A, by firing equipment by air heat, hot-air is contacted with printed circuit board (PCB), utilizes the temperature difference between hot-air and printed circuit board (PCB), cause the transmission of heat thus make solder reach the temperature of thawing.But air conduction rate is low, and the heat time is long, and thermal loss is many; Element Yin Gaowen in heating process and produce poisonous and harmful substance, contaminated environment.
2, infrared heating method: US Patent No. 4270260 and US6301436B1, infrared heater is utilized to give off the infrared ray of certain wavelength to printed circuit board (PCB), circuit board, because absorbing infrared-ray thus causing its own molecular structure that fierce vibration occurs and produce heat energy, realizes the thawing of solder.The method complex process, firing equipment and auxiliary facility require higher, and often because look quick effect and Screen theory cause the temperature contrast between different elements in heating process; In addition, element internal easily produces higher thermal stress, thus reduces the service life of recycling member.
3, LASER HEATING method: European patent EP 13345-A, using laser as heating source, the directionality utilizing laser beam good and the high feature of power density, by optical system laser beam assembled and direct irradiation on the solder joint of element, make the instantaneous thawing of solder.The method needs complete set of equipments, and cost is high, complex process, and is point-to-point mode of heating, and removal efficiency is low.This method is suitable only for the element being separated indivedual high value.
4, silicone oil heating: Chinese patent CN1832663A, is immersed in printed circuit board (PCB) in the liquid silicone oil of high temperature, the solder of solder side is produced and melts.The method can produce poisonous, pernicious gas in a large number, comprises the gas of liquid silicone oil volatilization generation and the gas of substrate for printed circuit board and element generation.In addition, the element after separation and solder are attached with a large amount of silicone oil, bring a lot of trouble to follow-up cleaning.
5, solder heating: Chinese patent CN101695706A, first with tin stove, solid solder is melted, then not element-cont for printed circuit board (PCB) one side is fully contacted with liquid solder, upward by printed circuit board (PCB) solder side, adopt the mode of vibration to be separated by element finally.This method has two shortcomings, one is that liquid solder can produce a large amount of poisonous, harmful smoke (comprising the flue gas etc. of the heavy metal lead in solder, board substrate and element volatilization) in heating process, two is when taking circuit board away from liquid solder surface, solder side can take away expensive solder in tin stove, As time goes on, the solder in tin stove can be fewer and feweri.
Summary of the invention
The present invention is the weak point for avoiding existing for above-mentioned prior art, provides that a kind of energy consumption is low, cost is low, separative efficiency is high, the method from resolution element discarded printed circuit boards and solder of good separating effect.
The present invention is that technical solution problem adopts following technical scheme:
The present invention from the feature of the method for resolution element discarded printed circuit boards and solder is: adopt Brown Alundum particle as heat medium, first utilize flat electric furnace to be heated by Brown Alundum particle; Then by the solder side of printed circuit board (PCB) down, lie in by the Brown Alundum particle that heats, and exert a force vertically downward at the component side of printed circuit board (PCB), solder side is fully contacted with the Brown Alundum particle of heating, after solder melts completely, printed circuit board (PCB) is taken out, solder side upward, component side down, applies vertical impact power to solder side, makes solder and element be able to be separated from printed circuit board (PCB).
The present invention is also to carry out as follows from the feature of the method for resolution element discarded printed circuit boards and solder:
A, the Brown Alundum particle of the different-grain diameter mixed is put into the flat electric furnace of controllable temperature, and make its surfacing;
B, utilize the flat electric furnace of controllable temperature by Brown Alundum heating particles to 350-390 DEG C, and remain on 350-390 DEG C;
C, by the solder side of printed circuit board (PCB) down, to lie on Brown Alundum particle, and exert a force vertically downward at the component side of printed circuit board (PCB), solder side is fully contacted with Brown Alundum particle, heats and within 3-4 minute, make the solder of solder side melt completely;
D, take out printed circuit board (PCB), make its solder side upward, component side down, vertical impact power is applied to solder side and makes it shake, make solder and element be able to be separated from printed circuit board (PCB).
The present invention is also from the feature of the method for resolution element discarded printed circuit boards and solder:
The Brown Alundum particle composition by mass percentage of described different-grain diameter is: particle diameter 2-3mm for 10-30%, particle diameter 1-2mm for 40-60%, that particle diameter is not more than 1mm is 10-40%.
Describedly vertical impact power is applied to solder side refer to: adopting reciprocal pneuamtic percussion mechanism to apply frequency to solder side is the vertical impact power of 5 times each second.
Compared with prior art, the present invention has the following advantages:
1, the inventive method energy consumption is low, and thermal loss is little.Brown Alundum main chemical is Al
2o
3, the coefficient of heat conduction is higher than air and liquid a lot.Heat Brown Alundum particle, temperature rises fast, and thermal loss is little;
2, the inventive method is with low cost.Adopt Brown Alundum particle as heat transfer medium, price is very cheap, and can Reusability, and character and quality all can not change, and heating by electric cooker cost is also very low;
3, the inventive method generation flue gas is few.The coefficient of heat conduction of Brown Alundum is high, fast to the firing rate of solder on circuit board, suitable control heating-up temperature and heat time, circuit board can not be burnt, element is also not easy damaged, relative to heating liquid and air heat, the flue gas of generation will lack a lot, and follow-up smoke gas treatment expense is also lower comparatively speaking;
4, the inventive method separative efficiency is high.Owing to being that the whole solder side of printed circuit board (PCB) fully contacts with Brown Alundum particle, so firing rate is fast, separative efficiency is all higher than air heat, infrared heating and LASER HEATING;
5, the inventive method good separating effect.The solder side of printed circuit board (PCB) fully contacts with Brown Alundum particle, and temperature rises fast, and solder side is that the pad surface tension force of molten state is little, and when imposing the vertical impact power of high frequency, element and solder come off from circuit board rapidly, good separating effect;
6, the inventive method handling safety.Adopt solid-state granular Brown Alundum to carry out heat transfer, can not produce the sputtering phenomenon of liquid heating medium in separation process, the safety of operator is guaranteed.
Detailed description of the invention
In concrete enforcement, from discarded printed circuit boards, the method for resolution element and solder is carried out as follows:
1, the Brown Alundum particle of the different-grain diameter mixed is put into the flat electric furnace of controllable temperature, and make its surfacing;
2, utilize the flat electric furnace of controllable temperature by Brown Alundum heating particles to 350-390 DEG C, and remain on 350-390 DEG C;
3, by the solder side of printed circuit board (PCB) down, lie on Brown Alundum particle, and exert a force vertically downward at the component side of printed circuit board (PCB), solder side is fully contacted with Brown Alundum particle, heat and within 3-4 minute, make the solder of solder side melt completely;
4, take out printed circuit board (PCB), make its solder side upward, component side down, vertical impact power is applied to solder side and makes it shake, make solder and element be able to be separated from printed circuit board (PCB).
In concrete enforcement, the Brown Alundum particle composition by mass percentage of different-grain diameter is: particle diameter 2-3mm for 10-30%, particle diameter 1-2mm for 40-60%, that particle diameter is not more than 1mm is 10-40%.
Apply vertical impact power to solder side to refer to: adopting reciprocal pneuamtic percussion mechanism to apply frequency to solder side is the vertical impact power of 5 times each second.
Embodiment 1:
The present embodiment from the method for resolution element discarded printed circuit boards and solder is:
By mass percentage, the Brown Alundum particle of the Brown Alundum particle of 10% particle diameter 2-3mm, 50% particle diameter 1-2mm and 40% particle diameter are mixed with being not more than the Brown Alundum uniform particles of 1mm and puts into electric furnace, and make its surfacing, utilize electric furnace by Brown Alundum heating particles to 350 DEG C, and keep this temperature-resistant.The solder side of printed circuit board (PCB) is lain on the Brown Alundum particle of heating down, and applies vertical force and make it fully contact with Brown Alundum particle.Heat after 4 minutes, on printed circuit board (PCB), solder melts completely, takes out printed circuit board (PCB), make its solder side upward, down, adopt reciprocal pneuamtic percussion mechanism to apply frequency to solder side is the vertical impact power of 5 times each second to component side, solder can be separated from printed circuit board (PCB) with element.In the present embodiment, shared by the bulky grain Brown Alundum that particle diameter is 2-3mm, percent mass is less, is 10%; Particle diameter mass percent shared by below 2mm granule Brown Alundum reaches 90%, so the interval between Brown Alundum particle is less, the solder side of printed circuit board (PCB) can fully contact with Brown Alundum particle, the thawing of solder is effective, and the components and parts rate of recovery can reach 96%, and the solder rate of recovery reaches 95%.
Embodiment 2:
The present embodiment from the method for resolution element discarded printed circuit boards and solder is:
By mass percentage, the Brown Alundum particle of the Brown Alundum particle of 30% particle diameter 2-3mm, 50% particle diameter 1-2mm and 20% particle diameter are mixed with being not more than the Brown Alundum uniform particles of 1mm and puts into electric furnace, and make its surfacing, utilize electric furnace by Brown Alundum heating particles to 370 DEG C, and keep this temperature-resistant.The solder side of printed circuit board (PCB) is lain on the Brown Alundum particle of heating down, and applies vertical force and make it fully contact with Brown Alundum particle.Heat after 3 minutes, on printed circuit board (PCB), solder melts completely, takes out printed circuit board (PCB), makes its solder side upward, and component side down, applies as the high frequency vertical impact power in embodiment 1 solder side, solder can be separated from printed circuit board (PCB) with element.Compared with embodiment 1, in the present embodiment, shared by the bulky grain Brown Alundum of particle diameter 2-3mm, mass percent increases to 30%, the interval between Brown Alundum particle is caused to increase, the contact of printed circuit board (PCB) solder side and Brown Alundum particle is not too abundant, the thawing effect of solder will be deteriorated relatively, the components and parts rate of recovery 92%, the solder rate of recovery 91%.
Embodiment 3:
In the present embodiment from the method for resolution element discarded printed circuit boards and solder be:
By mass percentage, the Brown Alundum particle of the Brown Alundum particle of 10% particle diameter 2-3mm, 60% particle diameter 1-2mm and 30% particle diameter are mixed with being not more than the Brown Alundum uniform particles of 1mm and puts into electric furnace, and make its surfacing, utilize electric furnace by Brown Alundum heating particles to 380 DEG C, and keep this temperature-resistant.The solder side of printed circuit board (PCB) is lain on the Brown Alundum particle of heating down, and applies vertical force and make it fully contact with Brown Alundum particle.Heat after 3.5 minutes, on printed circuit board (PCB), solder melts completely, takes out printed circuit board (PCB), makes its solder side upward, and component side down, applies as the high frequency vertical impact power in embodiment 1 solder side, solder can be separated from printed circuit board (PCB) with element.Compared with embodiment 1, in the present embodiment, shared by the Brown Alundum particle of particle diameter 1-2mm, mass percent increases to 60%, interval between Brown Alundum particle increases slightly, printed circuit board (PCB) solder side is relative with the contact adequacy of Brown Alundum particle to be reduced to some extent, solder melts effect and also decreases thereupon, the components and parts rate of recovery 95%, the solder rate of recovery 94%.
Embodiment 4:
The present embodiment from the method for resolution element discarded printed circuit boards and solder is:
By mass percentage, the Brown Alundum particle of 20% particle diameter 2-3mm, the Brown Alundum particle of 60% particle diameter 1-2mm, 20% particle diameter are mixed with being not more than the Brown Alundum uniform particles of 1mm and puts into electric furnace, and make its surfacing, utilize electric furnace by Brown Alundum heating particles to 390 DEG C, and keep this temperature-resistant.The solder side of printed circuit board (PCB) is lain on the Brown Alundum particle of heating down, and applies vertical force and make it fully contact with Brown Alundum particle.Heat after 3 minutes, on printed circuit board (PCB), solder melts completely, takes out printed circuit board (PCB), makes its solder side upward, and component side down, applies the vertical impact power as the high frequency in embodiment 1 to solder side, solder can be separated from printed circuit board (PCB) with element.Compared with embodiment 3, in the present embodiment, shared by the Brown Alundum particle of particle diameter 2-3mm, mass percent increases to 20%, interval between Brown Alundum particle increases slightly, printed circuit board (PCB) solder side is relative with the contact adequacy of Brown Alundum particle to be reduced to some extent, solder melts effect and also decreases, the components and parts rate of recovery 94%, the solder rate of recovery 93%.
Claims (2)
1. from a method for resolution element discarded printed circuit boards and solder, it is characterized in that: adopt Brown Alundum particle as heat medium, first utilize flat electric furnace to be heated by Brown Alundum particle; Then by the solder side of printed circuit board (PCB) down, lie in by the Brown Alundum particle that heats, and exert a force vertically downward at the component side of printed circuit board (PCB), solder side is fully contacted with the Brown Alundum particle of heating, after solder melts completely, printed circuit board (PCB) is taken out, solder side upward, component side down, applies vertical impact power to solder side, makes solder and element be able to be separated from printed circuit board (PCB); The method of described resolution element and solder is carried out as follows:
A, the Brown Alundum particle of the different-grain diameter mixed is put into the flat electric furnace of controllable temperature, and make its surfacing; The Brown Alundum particle composition by mass percentage of described different-grain diameter is: particle diameter 2-3mm for 10-30%, particle diameter 1-2mm for 40-60%, that particle diameter is not more than 1mm is 10-40%;
B, utilize the flat electric furnace of controllable temperature by Brown Alundum heating particles to 350-390 DEG C, and remain on 350-390 DEG C;
C, by the solder side of printed circuit board (PCB) down, to lie on Brown Alundum particle, and exert a force vertically downward at the component side of printed circuit board (PCB), solder side is fully contacted with Brown Alundum particle, heats and within 3-4 minute, make the solder of solder side melt completely;
D, take out printed circuit board (PCB), make its solder side upward, component side down, vertical impact power is applied to solder side and makes it shake, make solder and element be able to be separated from printed circuit board (PCB).
2. the method from resolution element discarded printed circuit boards and solder according to claim 1, is characterized in that: describedly apply vertical impact power to solder side and refer to: adopting reciprocal pneuamtic percussion mechanism to apply frequency to solder side is the vertical impact power of 5 times each second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180863.7A CN103286405B (en) | 2013-05-15 | 2013-05-15 | Method for separating elements and solder from waste printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180863.7A CN103286405B (en) | 2013-05-15 | 2013-05-15 | Method for separating elements and solder from waste printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN103286405A CN103286405A (en) | 2013-09-11 |
| CN103286405B true CN103286405B (en) | 2015-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310180863.7A Expired - Fee Related CN103286405B (en) | 2013-05-15 | 2013-05-15 | Method for separating elements and solder from waste printed circuit board |
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| CN112025025A (en) * | 2020-09-03 | 2020-12-04 | 上海第二工业大学 | Desoldering and separating device for electronic components |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4270260A (en) * | 1978-10-10 | 1981-06-02 | Krueger Ellison F | Method for the salvage and restoration of integrated circuits from a substrate |
| US4769083A (en) * | 1986-01-27 | 1988-09-06 | Gould Inc. | Method for removing excess solder from printed circuit boards |
| US6301436B1 (en) * | 2000-10-12 | 2001-10-09 | Yu-Ju Hsiao | Photothermic desoldering unit |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
| CN101695706A (en) * | 2009-10-28 | 2010-04-21 | 合肥工业大学 | Equipment capable of industrially implementing entire dismantlement of waste and old circuit board component |
| CN103372697A (en) * | 2012-04-16 | 2013-10-30 | 中国科学院化学研究所 | Sand dismantling method for removing electronic components on substrate |
-
2013
- 2013-05-15 CN CN201310180863.7A patent/CN103286405B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4270260A (en) * | 1978-10-10 | 1981-06-02 | Krueger Ellison F | Method for the salvage and restoration of integrated circuits from a substrate |
| US4769083A (en) * | 1986-01-27 | 1988-09-06 | Gould Inc. | Method for removing excess solder from printed circuit boards |
| US6301436B1 (en) * | 2000-10-12 | 2001-10-09 | Yu-Ju Hsiao | Photothermic desoldering unit |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
| CN101695706A (en) * | 2009-10-28 | 2010-04-21 | 合肥工业大学 | Equipment capable of industrially implementing entire dismantlement of waste and old circuit board component |
| CN103372697A (en) * | 2012-04-16 | 2013-10-30 | 中国科学院化学研究所 | Sand dismantling method for removing electronic components on substrate |
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| CN103286405A (en) | 2013-09-11 |
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