CN101502903A - Method for dissembling and processing waste and old circuit board for reuse of component - Google Patents
Method for dissembling and processing waste and old circuit board for reuse of component Download PDFInfo
- Publication number
- CN101502903A CN101502903A CNA2009100797840A CN200910079784A CN101502903A CN 101502903 A CN101502903 A CN 101502903A CN A2009100797840 A CNA2009100797840 A CN A2009100797840A CN 200910079784 A CN200910079784 A CN 200910079784A CN 101502903 A CN101502903 A CN 101502903A
- Authority
- CN
- China
- Prior art keywords
- components
- parts
- wiring board
- chip
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 19
- 239000002699 waste material Substances 0.000 title abstract description 12
- 238000012545 processing Methods 0.000 title description 2
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 5
- 238000003672 processing method Methods 0.000 claims abstract description 5
- 238000011056 performance test Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 17
- 239000007789 gas Substances 0.000 claims description 11
- 238000011084 recovery Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 230000000007 visual effect Effects 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003792 electrolyte Substances 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000010926 purge Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 230000006378 damage Effects 0.000 abstract description 5
- 238000004064 recycling Methods 0.000 abstract description 3
- 230000008030 elimination Effects 0.000 abstract description 2
- 238000003379 elimination reaction Methods 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000009418 renovation Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a waste circuit board disassembling processing method for recycling components and pertains to the field of components recycling. The invention is characterized in that: according to the type of circuit board baseplate and the model of components, circuit boards of non-thermostable components without high electrolytic capacitance are respectively baked below 200 degrees so as to eliminate components connected in a non-welded way and straighten the pins of plug-in components to be eliminated; then according to the melting point of solders used by the circuit board, the heating temperature curve is designed under the set heating way and heating rate so as to fully melt the solders and separate the components from the circuit board under the external force. Meanwhile, integrated circuit chips to be recycled is subjected to appearance check, residual solder elimination, repair of pins or welding discs, appearance cleaning and baking and finally electric performance test. The invention effectively avoids the damages of disassembly at high temperature to the appearance, dimension and performance of components and ensures the reusability of components through appearance repair and performance test.
Description
Technical field
The present invention relates to harmless disassembling that components and parts are reclaimed based on function from the waste printed circuit board, and components and parts are carried out the treatment process of Performance Detection, belong to production, maintenance and waste recovery reutilization technology field.
Background technology
Printed substrate (Printed Circuit Board is called for short PCB, or Printed Wiring Board, is called for short PWB) is the important component part of electronics and IT products, household electronic products etc.Printed substrate normally is printed with the parts that the insulated substrate that is electrically connected conductive pattern and some components and parts are welded by low temperature solder mode by one.Substrate mostly is flame-proof phenolic paper-based copper-coated board, non-flame-proof phenolic paper-based copper-coated board or epoxy glass fiber fabricbase central layer etc., components and parts have two kinds of paster components and parts (SMD) and placing components (THD) usually, comprise various integrated circuits (IC), diode, triode, photoelectric device, capacitance resistance and various slot interface etc.
China is wiring board big producing country, has tens thousand of tons of waste printed circuit boards to produce in the annual production process; Along with the continual renovation of electric equipment products is regenerated, a large amount of electric equipment products are eliminated, and printed substrate is also abandoned thereupon.Because China does not adopt suitable recycling technology at present, waste printed circuit board has caused huge pressure for society and environment.
The analysis showed that after electric equipment products was scrapped, though the printed substrate on it is made as a whole its original function that lost, the components and parts overwhelming majority function on the printed substrate was intact, is far from termination its service life.The function reuse of realizing waste and old components and parts is for economizing on resources and protecting environment all to have important practical significance.Want to realize the function reuse of waste and old components and parts, must disassemble wiring board.And contain various poisonous and harmful substances, precious metal on components and parts and the wiring board substrate, printed substrate is carried out components and parts disassemble the difficulty that also can reduce separating substances.
Disassembling method to printed substrate has multiple mode classification.Divide selective dismounting and globality dismounting from the component number of once dismounting; Divide from the type of components and parts to be removed, dismounting at the paster components and parts is arranged, at the dismounting of placing components with at the dismounting of above two kinds of components and parts; In addition, existing disassembling method adopts certain mode of heating to make melts soldering tin more, and then by certain external force components and parts is broken away from.According to the mode of heating branch, infrared radiation heating is arranged, hot blast (air) heating, inert gas heating, liquid heat conduction heating, LASER HEATING, modes such as metal fever conduction heating.
Japan Patent JP4061191 adopts pipelining, and the circuit board that only contains single components and parts is disassembled, be heated to melts soldering tin after, draw components and parts and also place heating again on the metallic plate, remove the scolding tin that adheres to separate, components and parts can be re-used.
U.S. Pat 4270260 and WO96/01972 adopt infrared heating, use common hand tools to disassemble components and parts then.It is said, adopt this method to disassemble and surpass 300 about 1,000,000 components and parts of kind that after tested, the components and parts more than 90% can continue to use.
U.S. Pat 5148969 is fixed on the circuit board element installed surface under oblique sends into the heating of the infrared thermal treatment zone on the conveyer belt, after melts soldering tin, apply percussion vibration at the circuit board soldering tin face, and components and parts are come off.
Japan Patent JP9252177 adopts nitrogen heating components and parts, and the scolding tin that remains on the components and parts becomes spheroid because of the influence of oxidated film not.
Japan Patent JP10200255 and German patent DE 19525116A1 have designed a kind of equipment that adopts high temperature compressed gas to disassemble the paster components and parts respectively.The paster components and parts are required after melts soldering tin, and to disassemble power less, adopts high temperature compressed gas to disassemble the paster components and parts and can avoid it is caused mechanical damage.
Chinese patent CN1600458A adopts negative suction system that components and parts and solder alloy are inhaled down from substrate, and adopts mechanical round brush to improve the partition rate after waste and old circuit board evenly is heated to all solder joint fusings.Utilize high temperature compressed gas that components and parts and scolder are blowed to screen pack again, the scolder of solid-state components and parts and liquid state is separated immediately.
Existing old circuit board disassembling technology generally adopts the high temperature heating to make melts soldering tin, and the back adopts external force that components and parts are broken away from.High temperature is disassembled and had a common shortcoming: high temperature might cause moisture to components and parts, especially the destruction of Plastic IC Packages chip reliability.The wiring board that waste and old reuse of component technology is disassembled has generally all experienced long-term use or has deposited, Plastic IC Packages chip will inevitably absorb a large amount of moisture on it from air, and has reached wet saturation state (the saturated with moisture concentration of chip internal depends on the relative humidity and the temperature of outside air) already.Directly old circuit board is carried out high temperature when disassembling (temperature is higher than the scolding tin fusing point, can reach more than 200 ℃), cause the Plastic IC Packages chip on it layering to occur easily, thus the heavy damage chip reliability.
Summary of the invention
An object of the present invention is to provide a kind of waste printed circuit board (hereinafter to be referred as wiring board) of disassembling harmlessly and go up components and parts, and components and parts are carried out the treatment process of Performance Detection.Components and parts function and the performance disassembling are without prejudice substantially, and can be by function reuse after testing.
Another object of the present invention is that the natural environment that the elimination wiring board is disassembled in the process pollutes, and improves the working environment of old circuit board tear down operations, reduces labour intensity.
Method provided by the present invention is fit to form old circuit board and disassembles and detect the process for producing line.
Method provided by the invention is characterized in that, comprises following steps:
1) according to the type that comprises wiring board, the baking temperature that components and parts type should adopt in interior condition judgment on it carries out high-temperature baking or low-temperature bake to wiring board;
Described high-temperature baking is characterized in that: the temperature in the drying box should remain between 110～130 ℃, and relative air humidity is less than 5%, time is 20～30 hours, be applicable to the wiring board of this non-high-temperature resistant components and parts of no a large amount of electrolyte capacitance, such as TV SKD
Described low-temperature bake is characterized in that: the temperature in the drying box should remain between 60～80 ℃, and relative air humidity is less than 5%, and the time is 4～6 days, is applicable to the wiring board of this non-high-temperature resistant components and parts of a large amount of electrolyte capacitances, such as computer motherboard,
Described baking is at air dry oven but be not limited to carry out in the air dry oven, when the relative humidity in the drying box can't should be put into drier less than 5% the time in drying box;
2) remove the components and parts that snapping on the wiring board, the non-welding manner in being threaded in connect, placing components pin to be extractd on the wiring board is led directly as far as possible, make it to be basically perpendicular to the wiring board substrate, employing jig fixing circuit board;
3) basis comprises the type of wiring board substrate, the model of components and parts is roughly differentiated the melting temperature of the used scolder of wiring board in interior condition, and sets suitable heating-up temperature curve according to this, and wiring board is implemented heating,
Describedly add the thermal convection current of thermal recovery infra-red radiation and gas medium and heat with mode,
Or adopt the thermal convection current mode of gas medium to heat separately,
The heating rate of wiring board is no more than 2 ℃/s in whole heating process, final temperature is elevated to above 10～30 ℃ of scolder melting temperature, and be incubated till the chien shih scolder fully melts when enough, and the components and parts on the described wiring board are applied external force, in 1 hour, make components and parts break away from wiring board;
4) step 3) being disassembled the components and parts that get off classifies, select the IC chip that hope is reused, and place dry environment to preserve the IC chip that hope is reused, other components and parts are reclaimed according to raw material and other harmless treatment mode is classified
Described IC chip (IC chip) comprises the chip of each model surface mount and plug-in mounting,
So-called dry environment is characterized in that: relative air humidity is less than 5%, normal temperature;
5) adopt air draft or vacuum suction apparatus to be collected in the gas that produces in the step 4) process, after harmless treatment, discharge.
6) the IC chip that function reuse is carried out in hope carries out visual examination, only keeps the chip that outward appearance can be repaired,
Described visual examination is characterized in that: with the naked eye direct, or following assisting of other instruments, the outward appearance of components and parts is carried out hand inspection, the badly damaged chip that can't repair of superseded outward appearance;
7) hope is carried out the IC chip of function reuse, is removed its amount of residual solder, its pin or pad are repaired, and carried out appearance cleaning and baking:
7.1) components and parts are placed be higher than in about 10 ℃～20 ℃ close copper wire mesh grid of solder fusing temperature, and slightly exert pressure, solder fusing to be remained adopts gases at high pressure to purge components and parts,
7.2) under the protection of anti-static precautions, the serious diastrophic pin of repaired by hand uses the pin prosthetic appliance that pin is unified finishing then,
7.3) components and parts of GBA (BGA) encapsulation are planted ball again,
7.4) chip is placed on the vapor area of cleaning equipment, stopped 5～10 minutes, again with clean solvent spray chip, take out chip again after,
7.5) dry up with the solution of air gun with chip surface, in 35 ℃～45 ℃ air dry ovens, dry again;
8) carry out electric performance test with the chip of ASA (analog feature analysis) method after, should pack immediately detecting qualified chip to appearance repair.
9) wiring board substrate and other components and parts that can carry out the raw material recovery are stored classifiedly, handle to treat subsequent recovery; Other components and parts are carried out harmless treatment.
Method provided by the invention comprises part or all in the above step, wherein step 1)-4), 6) 8) basic step is absolutely necessary.In order to reach good implementation result, preferably comprise whole processing steps of described method.
Adopt process provided by the present invention, effectively avoid high temperature to disassemble, by the appearance repair of components and parts and Performance Detection being guaranteed the reusability of components and parts the apparent size of components and parts and the destruction of performance.
Description of drawings:
Fig. 1: the process chart of the inventive method.
The specific embodiment:
Below by embodiment the present invention is described.
Embodiment: the wiring board of one-side band components and parts disassemble technology
1) get a waste and old computer motherboard, have a large amount of alminium electrolytic condensers to distribute on it, it adopts low-temperature bake to judge reply, puts it in the air dry oven, places drier in the drying box, and dry the temperature inside the box is set at 80 ℃, toasts 6 days, takes out;
2) remove the components and parts that snapping on the wiring board, non-welding manner such as be threaded connect, placing components pin to be extractd on the wiring board is led directly as far as possible, make it to be basically perpendicular to the wiring board substrate, employing jig fixing circuit board;
3) adopt infra-red radiation wiring board to be implemented to heat with thermal convection current and with mode, wiring board gradually was warming up to 150～160 ℃ insulation 60ss with interior from room temperature at 1.5～2 minutes, then, wiring board was warming up to 190～210 ℃ and be incubated 2 minute scolding tin fully melted with interior from 150～160 ℃ at 0.5～1 minute, wiring board is applied external force such as vibration or impact, components and parts are broken away from;
4) will disassemble the components and parts that get off and be divided into 3 classes: IC chip, the connector of plug-in mounting class, the discrete component of plug-in mounting class, pick out 3 of the IC chips of wishing PQFP (the Plastic Quad Flat Package) encapsulation reuse, and place them the air drying case that is placed with drier to preserve;
5) adopt air draft or vacuum suction apparatus to be collected in step 3)-4) gas that produces in the process, discharge after harmless treatment.
6) the IC chip that function reuse is carried out in hope carries out visual examination, only keeps the chip that outward appearance can be repaired;
7) hope is carried out the IC chip of function reuse, removed its amount of residual solder, its pin or pad are repaired, and cleaned, and in 40 ℃ of air dry ovens, dry with the Alpha2110 solvent;
8) chip after appearance repair is carried out ASA test, should carry out the carrier band packing according to the manner of packing of new product to it immediately after qualified after testing.
Claims (3)
1, towards the old circuit board disassembly processing method of reuse of component, it is characterized in that, contain following steps successively:
Step 1) adopts any in following two kinds of roasting modes according to components and parts kind on the type that comprises wiring board, this wiring board in interior condition judgment,
High-temperature baking: the temperature in the air dry oven remains between 110 ℃～130 ℃, and relative air humidity is less than 5%, and stoving time is 20 hours～30 hours, is applicable to the wiring board of this non-high-temperature resistant components and parts of no a large amount of dielectric capacitance,
Temperature in the low-temperature bake, air dry oven remains between 60 ℃～80 ℃, and relative air humidity is less than 5%, and the time of baking is 4 days～6 days, is applicable to the wiring board that has this non-high-temperature resistant components and parts of a large amount of electrolyte capacitances;
Step 2), remove the components and parts that comprise snapping on the aforementioned wiring board, are threaded in interior non-welding manner, the pin of placing components to be extractd on this wiring board is led directly as far as possible, make it to be basically perpendicular to this wiring board, fix the substrate of this wiring board again with jig;
Step 3), according to the type that comprises selected wiring board substrate, the components and parts type is at the melting temperature of the used scolder of this wiring board of interior condition judgment, and set the heating curves that to adopt according to this, heat described wiring board with the thermal convection current of infra-red radiation and gas medium and with mode: the heating rate at wiring board described in the whole heating process is no more than 2 ℃/s, final temperature is elevated to above 10 ℃～30 ℃ of described scolder melting temperature, and remain to described scolder is fully melted till, and the components and parts on the described wiring board are applied external force, in 1 hour, make components and parts break away from described wiring board;
Step 4), classify to disassembling the components and parts that get off in the step 3), pick out and wish the IC chip of reusing and place under the dry environment to preserve, other components and parts are classified according to raw material recovery and corresponding harmless treatment mode, its relative humidity of described dry environment is less than 5%, normal temperature.
2, the old circuit board disassembly processing method towards reuse of component according to claim 1 is characterized in that, after described step 5), also comprises following function reuse step:
Step 6) is carried out the chip of function reuse and is done visual examination to hope, only keep the chip that outward appearance can be repaired;
Step 7) to wishing the chip of function reuse, is removed amount of residual solder, pin or pad is repaired, and carried out appearance cleaning and baking:
Step 7.1), place components and parts temperature to be higher than more than the described scolder melting temperature in 10 ℃～20 ℃ the close copper cash mesh grid, and slightly exert pressure, when waiting to remain solder fusing, adopt gases at high pressure to purge described components and parts,
Step 7.2), under the anti-static precautions protection, the serious diastrophic pin of repaired by hand is unified to repair to pin with the pin prosthetic appliance then,
Step 7.3), the components and parts that encapsulate with BGA BGA are planted ball again,
Step 7.4), chip is placed on the vapor area of cleaning equipment, stopped 5～10 minutes, again with clean solvent spray chip, take out chip again after,
Step 7.5), the solution of chip surface is dried up, in 35 ℃～45 ℃ air dry ovens, dry again with air gun;
Step 8) is analyzed the chip of ASA method after to appearance repair with analog feature and is carried out electric performance test, packs immediately detecting qualified chip.
3, the old circuit board disassembly processing method towards reuse of component according to claim 1 is characterized in that, in described step 3), adopts the thermal convection current mode of gas medium to suppose separately.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100797840A CN101502903B (en) | 2009-03-11 | 2009-03-11 | Method for dissembling and processing waste and old circuit board for reuse of component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100797840A CN101502903B (en) | 2009-03-11 | 2009-03-11 | Method for dissembling and processing waste and old circuit board for reuse of component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101502903A true CN101502903A (en) | 2009-08-12 |
| CN101502903B CN101502903B (en) | 2011-05-11 |
Family
ID=40975346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100797840A Expired - Fee Related CN101502903B (en) | 2009-03-11 | 2009-03-11 | Method for dissembling and processing waste and old circuit board for reuse of component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101502903B (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101856664A (en) * | 2010-06-08 | 2010-10-13 | 上海卡美循环技术有限公司 | Device and method for nondestructively recycling chips |
| CN102069256A (en) * | 2010-12-20 | 2011-05-25 | 北京工业大学 | Electronic component removing device based on final treatment of waste circuit board |
| CN102120222A (en) * | 2010-12-17 | 2011-07-13 | 清华大学 | Device and method for disassembling plug-in mounted components of waste printed circuit board |
| CN102327891A (en) * | 2011-09-20 | 2012-01-25 | 北京工业大学 | Method and system for separating electron components in waste circuit board in electromagnetic induction |
| CN102554387A (en) * | 2012-01-16 | 2012-07-11 | 西南科技大学 | Method for automatically dismounting electronic device on abandoned printed circuit board by using industrial waste gas |
| CN103052461A (en) * | 2010-08-09 | 2013-04-17 | 英派尔科技开发有限公司 | Removing and segregating components from printed circuit boards |
| CN103402659A (en) * | 2011-12-15 | 2013-11-20 | 高级技术材料公司 | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
| CN103442524A (en) * | 2013-08-23 | 2013-12-11 | 深圳市创荣发电子有限公司 | Patch module disassembling and assembling method |
| WO2015113272A1 (en) * | 2014-01-29 | 2015-08-06 | Li Tong (H.K.) Telecom Company Limited | System and method for extracting electronic components |
| CN105521983A (en) * | 2015-12-08 | 2016-04-27 | 四川长虹电器股份有限公司 | Disassembling processing unit for waste circuit board |
| CN105710113A (en) * | 2016-03-22 | 2016-06-29 | 成都普诺科技有限公司 | Circuit board recovery equipment |
| CN103442524B (en) * | 2013-08-23 | 2016-11-30 | 深圳市创荣发电子有限公司 | Patch module assembly and disassembly methods |
| CN107624000A (en) * | 2017-09-06 | 2018-01-23 | 国营芜湖机械厂 | A kind of more pin placing components method for dismounting for the maintenance of aircraft electrical plate |
| CN109822174A (en) * | 2019-03-22 | 2019-05-31 | 清华大学 | The circuit board for reducing chip layering ratio disassembles hot wind fusion welding method |
| CN111940867A (en) * | 2020-09-04 | 2020-11-17 | 清远市东江环保技术有限公司 | Intelligent disassembling and sorting method for waste circuit board devices |
| CN115138938A (en) * | 2022-09-05 | 2022-10-04 | 江苏华频电子科技有限公司 | Conveying device for cleaning circuit board of angle grinder and working method thereof |
-
2009
- 2009-03-11 CN CN2009100797840A patent/CN101502903B/en not_active Expired - Fee Related
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101856664A (en) * | 2010-06-08 | 2010-10-13 | 上海卡美循环技术有限公司 | Device and method for nondestructively recycling chips |
| CN101856664B (en) * | 2010-06-08 | 2013-05-22 | 上海卡美循环技术有限公司 | Device and method for nondestructively recycling chips |
| CN103052461B (en) * | 2010-08-09 | 2016-03-30 | 英派尔科技开发有限公司 | Remove and resolution element from printed circuit board (PCB) |
| CN103052461A (en) * | 2010-08-09 | 2013-04-17 | 英派尔科技开发有限公司 | Removing and segregating components from printed circuit boards |
| CN102120222A (en) * | 2010-12-17 | 2011-07-13 | 清华大学 | Device and method for disassembling plug-in mounted components of waste printed circuit board |
| CN102120222B (en) * | 2010-12-17 | 2012-11-14 | 清华大学 | Device and method for disassembling plug-in mounted components of waste printed circuit board |
| CN102069256A (en) * | 2010-12-20 | 2011-05-25 | 北京工业大学 | Electronic component removing device based on final treatment of waste circuit board |
| CN102069256B (en) * | 2010-12-20 | 2012-09-05 | 北京工业大学 | Electronic component removing device based on final treatment of waste circuit board |
| CN102327891A (en) * | 2011-09-20 | 2012-01-25 | 北京工业大学 | Method and system for separating electron components in waste circuit board in electromagnetic induction |
| CN102327891B (en) * | 2011-09-20 | 2013-10-23 | 北京工业大学 | Method and system for separating electron components in waste circuit board in electromagnetic induction |
| CN103402659A (en) * | 2011-12-15 | 2013-11-20 | 高级技术材料公司 | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
| CN102554387A (en) * | 2012-01-16 | 2012-07-11 | 西南科技大学 | Method for automatically dismounting electronic device on abandoned printed circuit board by using industrial waste gas |
| CN103442524A (en) * | 2013-08-23 | 2013-12-11 | 深圳市创荣发电子有限公司 | Patch module disassembling and assembling method |
| CN103442524B (en) * | 2013-08-23 | 2016-11-30 | 深圳市创荣发电子有限公司 | Patch module assembly and disassembly methods |
| WO2015113272A1 (en) * | 2014-01-29 | 2015-08-06 | Li Tong (H.K.) Telecom Company Limited | System and method for extracting electronic components |
| CN105521983A (en) * | 2015-12-08 | 2016-04-27 | 四川长虹电器股份有限公司 | Disassembling processing unit for waste circuit board |
| CN105521983B (en) * | 2015-12-08 | 2018-04-20 | 四川长虹电器股份有限公司 | Dismounting processing unit for old circuit board |
| CN105710113A (en) * | 2016-03-22 | 2016-06-29 | 成都普诺科技有限公司 | Circuit board recovery equipment |
| CN107624000A (en) * | 2017-09-06 | 2018-01-23 | 国营芜湖机械厂 | A kind of more pin placing components method for dismounting for the maintenance of aircraft electrical plate |
| CN109822174A (en) * | 2019-03-22 | 2019-05-31 | 清华大学 | The circuit board for reducing chip layering ratio disassembles hot wind fusion welding method |
| CN111940867A (en) * | 2020-09-04 | 2020-11-17 | 清远市东江环保技术有限公司 | Intelligent disassembling and sorting method for waste circuit board devices |
| CN115138938A (en) * | 2022-09-05 | 2022-10-04 | 江苏华频电子科技有限公司 | Conveying device for cleaning circuit board of angle grinder and working method thereof |
| CN115138938B (en) * | 2022-09-05 | 2022-12-23 | 江苏华频电子科技有限公司 | Conveying device for cleaning circuit board of angle grinder and working method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101502903B (en) | 2011-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101502903B (en) | Method for dissembling and processing waste and old circuit board for reuse of component | |
| CN100521874C (en) | Method and equipment for disassembling components entirely from waste circuit board | |
| CN101014228B (en) | Method and equipment for disassembling circuit board using non-contacted impact | |
| CN101479311B (en) | Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition | |
| US20080187772A1 (en) | Electronic board incorporating a heating resistor | |
| CN103389319A (en) | Test method for rapidly exposing welding defects of printed circuit board, and test system thereof | |
| CN105899062A (en) | Automatic production technology with wired charger | |
| CN212371373U (en) | Intelligent disassembling and sorting system for waste circuit board devices | |
| CN202317353U (en) | Removing device of electronic components and soldering tin of waste circuit board | |
| TW201347634A (en) | Welding method | |
| CN102371412A (en) | Device and method for removing electronic devices/components and soldered tin from waste circuit boards | |
| CN1600458A (en) | Method and equipment for breaking down and reclaiming electronic components and solder of discarded circuit board | |
| CN113840472A (en) | Component repairing method for QFP (quad Flat Package) packaging | |
| CN111940867A (en) | Intelligent disassembling and sorting method for waste circuit board devices | |
| US7428979B2 (en) | Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process | |
| CN202162472U (en) | Equipment for separating electronic components of circuit board | |
| Xiang et al. | The disassembly process and apparatus of waste printed circuit board assembly for reusing the components | |
| CN107249260A (en) | A kind of processing welding technique of electronic component | |
| CN104780708B (en) | Injecting glue curing in PCB transplanting and the PCB implantation methods using this method | |
| CN106226310B (en) | A kind of failure analysis test method of wiring board through-hole expanded by heating | |
| CN205883729U (en) | PCB board pad laser cleaning device | |
| CN101856759B (en) | Component disassembling method on circuit board for failure analysis | |
| CN103286405B (en) | Method for separating elements and solder from waste printed circuit board | |
| KR100951648B1 (en) | Apparatus for reparing of ball gridarray | |
| CN202371974U (en) | PCBA (Printed Circuit Board Assembly) constant temperature hot air drying device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20200311 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |