CN101014228B - Method and equipment for disassembling circuit board using non-contacted impact - Google Patents
Method and equipment for disassembling circuit board using non-contacted impact Download PDFInfo
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- CN101014228B CN101014228B CN2007100635103A CN200710063510A CN101014228B CN 101014228 B CN101014228 B CN 101014228B CN 2007100635103 A CN2007100635103 A CN 2007100635103A CN 200710063510 A CN200710063510 A CN 200710063510A CN 101014228 B CN101014228 B CN 101014228B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention relates to one method and device to process disable by contact impact on circuit board, which comprises the following steps: adopting u shape tank structure or card tank structure spring fix device circuit board; heating circuit board; through point or bar or plane impact structure to exert non-contact impact on circuit board; scripting, isolating, collection elements and welding; after cooling sorting the circuit board and elements. The invention device comprises the following parts: impact lever, point or bar or plane impact structure, compression spring, circuit board spring fix device, blower device and spring network.
Description
Technical field
The method and apparatus that adopts contactless impact that wiring board is disassembled relates to method and implement device with components and parts harmless dismounting (or excision) globality, that reclaim based on function from the printed substrate, belongs to circuit board disassembling technology field.
Background technology
Printed substrate (Printed Curcuit Board is called for short PCB, or Printed Wiring Board, is called for short PWB) is the important component part of electronics and IT products, household electronic products etc.China is world wiring board big producing country, has tens thousand of tons of waste printed circuit boards to produce in the annual production process; Along with the continual renovation of electric equipment products is regenerated, a large amount of electric equipment productss are eliminated, and printed substrate is also abandoned thereupon.Because China does not adopt suitable recycling technology at present, waste printed circuit board has caused huge pressure for society and environment.The analysis showed that though waste printed circuit board is made as a whole its original function that lost, the components and parts overwhelming majority function on it is intact, is far from termination its useful life.And, contain various poisonous and harmful substances, precious metal on the components and parts, in order to improve the efficient of separating these materials, reduce the technical difficulty of separating substances in the printed substrate subsequent treatment, before the printed substrate subsequent treatment, carry out the dismounting of components and parts or extract also being necessary.The importance that the waste and old electric electric equipment products that China increases day by day fast make old circuit board disassemble highlights, and original disassembling method based on the single components and parts that keep in repair can not satisfy current needs far away.
Printed substrate in the product such as electronics and IT products, household electrical appliance normally is covered with the insulated substrate of Copper Foil and the parts that some components and parts are welded by low temperature solder mode by a single or double.Substrate mostly is flame-proof phenolic paper-based copper-coated board, non-flame-proof phenolic paper-based copper-coated board or epoxy glass fiber fabricbase central layer etc., components and parts have two kinds of paster components and parts (SMD) and placing components (THD) usually, comprise various integrated circuits (IC), diode, triode, photoelectric device, capacitance resistance and various slot interface etc.
Dismounting (or excision) method to components and parts on the printed substrate has multiple mode classification.Divide selective dismounting and globality dismounting from the component number of once dismounting; From dismantling the purposes branch of back components and parts, the dismounting of reclaiming based on the components and parts function is arranged and based on the dismounting of material recovery; Divide from the type of components and parts to be removed, dismounting at the paster components and parts is arranged, at the dismounting of placing components with at the dismounting of above two kinds of components and parts; The arrangement form of components and parts divides from the wiring board to be removed, dismounting at one-side band components and parts wiring board is arranged, at the dismounting of double-sided belt components and parts wiring board with at the dismounting of above two kinds of wiring boards.At present existing many about the globality dismounting of the wiring board arranged at different components and parts types, at difference and the method for dismounting that reclaims based on the components and parts function.
Chinese invention patent CN1590032A has proposed a kind of electronic component carrier that electronic component on the circuit board is disassembled, comprising a clamper is fixed on the fixed frame, be used for circuit board is clamped in this fixed frame, when the temperature in reflow soldering is higher than predetermined temperature, shake electronic component on this circuit board with an impactor, carrier is used for carrying and shakes from this circuit board and fall electronic component.Its shortcoming is: circuit board can not provide the resilience force of uniformity for each position of circuit board because its material behavior (base material is mainly made by complex method by epoxy resin, glass fibre etc.) becomes softer under solder melting temperature; And in order to obtain enough resilience forces, the impactor support must push up wiring board very high, and this just can not realize effective dismounting for long placing components.
Chinese invention patent CN1600458A has proposed a kind of from printed circuit board (PCB) partition that is welded with electronic component and the method that reclaims electronic component and scolder.By the blowing mouth of device top the circuit board upper surface blown is higher than the hot-air of scolder fusing point, the solder alloy on the holding circuit plate is in molten condition.Mechanical round brush by being close to pending circuit board lower surface is along the printed circuit board (PCB) reciprocal rolling of moving, and the electronic component of circuit board is swept down and sucked electronics and solder alloy loosening and that be scattered by the powerful suction nozzle on round brush next door by the mechanical force of the bristle on the round brush.By regulating the power of this getter device, make to produce enough big negative pressure at the circuit board lower surface, under the help of mechanical round brush, can pull up electronic component and scolder come from printed circuit board (PCB).Its shortcoming is: can not seal well when installing in device owing to circuit board, add and itself have through holes such as many installing holes, pin jack on its substrate, constantly have under the situation that hot blast is blown at the circuit board upper surface, therefore the circuit board lower surface is not easy to produce bigger negative pressure, for the dismounting poor effect of placing components.
Japan Patent JP10270841-A has proposed a kind of method of dismantling circuit board component.At first wiring board is heated, make its solder joint fusing, then wiring board is made its upset by a substrate holding apparatus, one of band components and parts face down, and impact part in the another side rotation of wiring board again and implement to impact, and components and parts are disassembled.Its shortcoming is: wiring board need clamp by clamping device and make its upset, but generally there is not enough empty position can supply clamping on the wiring board, so just need pull out more components and parts in advance, make dismounting preparation waste time and energy, perhaps need to take grasping part and damage some components and parts; And because wiring board deliquescing at high temperature adopts the mode of rotating the impact part to implement to impact, impulsive force is less, to the dismounting poor effect of components and parts.
Japan Patent JP10209634-A, JP2000151094A, JP9083129A all shovel operations such as cutting, squeeze, scrape to the pin root that components and parts combine with the wiring board substrate, make its pin be subjected to squeeze and cut the disengagement substrate, thereby realize the globality dismounting of components and parts, but can make the components and parts pin be subjected to gross distortion or damage like this and lose and re-use function.
U.S. Pat 5927591A has proposed a kind of method of globality dismounting paster components and parts.One of the components and parts that are equipped with that only are welded with the assembly daughter board of paster components and parts are faced down, or the assembly daughter board hung, in heating environment after the melts soldering tin, adopt the mode of vibration that the paster components and parts are shaken, it is very near apart from the assembly daughter board that components and parts collect device, makes the unlikely upset of upspringing of the components and parts that come off.But because vibrational energy is not enough, this method can not be carried out the globality dismounting to the wiring board that is welded with placing components.
Japan Patent JP3243412-B2 has proposed a kind of method that reclaims scolder.One of circuit strip components and parts are faced up, and another side (following) is heated to melts soldering tin, and the round brush that adopts two wires to make is again brushed liquid scolding tin down from the pin of wiring board and placing components, relies on the gravity of scolding tin to fall into returnable.But because placing components do not taken off in advance, also go the scolding tin operation under the state in the jack at wiring board at its pin, effect can be subjected to very big the influence; And this method does not have, can not collect the scolding tin and the components and parts of wiring board upper surface.
German patent DE 19525116-A1 has proposed a kind of method that adopts paster components and parts on the heat of compression air dismounting wiring board.One of band paster components and parts on the wiring board are faced down, and heat of compression air is sprayed onto on the wiring board paster components and parts by banded nozzle.After solder melts, the paster components and parts are fallen on the following filter bag, and solder flux falls into the weldpool that melts below by filter bag.Its shortcoming is: can not dismantle placing components; Because banded nozzle area heated is limited, if paster components and parts area is bigger, will influence the dismounting effect; After the solder flux that falls can be bonded on the components and parts that fall earlier, make components and parts and solder flux not realize separating.
Japan Patent JP11314084-A has designed a kind of device that adopts mode of vibration to realize the components and parts integral demounting, adopt crank and rocker mechanism to be vibrated under free state by wiring board, the scolder that splits away off, components and parts and substrate drop out collection by the different hole of size respectively under the propelling movement of vibration force.But adopt the method for this free vibration,, can cause components and parts and pin damaged because of the strong collision between components and parts, the wiring board if vibrate excessively; If reduce the vibration, again usually deficiency so that the pin of placing components from the jack of wiring board, deviate from; And the pin of longer placing components is difficult to break away from simultaneously the jack on the wiring board under this free vibration effect, cause these placing components effectively not dismantle.
Paper " The printed circuit board-A challenge for automated disassembly and forthe design of recyclable interconnect devices " (K.Feldmann and H.Scheller, inConcept-Conf.Clean Electronic Products and Technol., 1995, IEE Conf.Publicationno.415, pp.186-190.) proposed the method that another kind of employing mode of vibration realizes the components and parts integral demounting, wiring board has been clamped apply vibration again.The paper author also thinks and obtains different power and acceleration by changing amplitude with frequency, and its effect can be disassembled components and parts in the circuit board.But adopt the method for vibration,,,, make its dismounting poor effect because the dismounting energy is big inadequately for some placing components and all very little paster components and parts of quality volume though can dismantle bigger paster components and parts.
Summary of the invention
One object of the present invention just provides harmless ground, globality dismounting (or excision) waste printed circuit board (hereinafter to be referred as wiring board) is gone up the method and apparatus of placing components and paster components and parts, the components and parts original function and the performance that disassemble are without prejudice substantially, are convenient to function reuse thereafter.
Another object of the present invention is the components and parts of disassembling before the printed substrate material recovery on it, reduces the technical difficulty of separating substances in printed wire base board and the components and parts material recovery, improves the efficient of separating poisonous and harmful substance, precious metal.
Another purpose of the present invention is that the natural environment that the elimination waste printed circuit board is disassembled in the process pollutes, and improves the operational environment of old circuit board disassembling section, reduces labour intensity.
Another purpose of the present invention is to adapt to the situation that China's old circuit board increases fast, and the needs of old circuit board recycling are satisfied in disassembling fast of the waste printed circuit board of realization.
The invention provides the method that a kind of contactless impact is disassembled wiring board, this method may further comprise the steps:
1) removes the components and parts that snapping, straight cutting, non-welding manner such as be threaded connect; Placing components pin to be extractd on the wiring board is led directly as far as possible, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.; The components and parts tip-off that individual influences wiring board on the wiring board is fixing is extractd, made wiring board have the every limit of two opposite side to have the margin of the wide no components and parts of 2-3mm at least;
Described indivedual components and parts tip-ofves on the wiring board are extractd, preferably, got two the shortest opposite side of opposite side distance on the wiring board, make its every limit that the margin of the above wide no components and parts of 2mm be arranged.
2) wiring board adopts the elastic fixing device of band U type groove structure or draw-in groove structure to fix;
The elastic fixing device of described employing band U type groove structure or draw-in groove structure, be a zone line to be set be empty pedestal, two be parallel to each other, spacing is adjustable, fixed mechanism with the relative U type groove structure of opening or draw-in groove structure is connected with pedestal by elastic construction, the width of U type groove or draw-in groove is adjustable and can lock according to the thickness of wiring board substrate on the fixed mechanism;
Fixed block one end of described band U type groove structure or draw-in groove structure is provided with the wiring board barrier structure, is used to stop wiring board to slide along U type groove or draw-in groove direction;
The upper surface level of the elastic fixing device of described band U type groove structure or draw-in groove structure, perhaps the upper surface of the fixed block of two bands U type groove structure or draw-in groove structures is on same horizontal plane, or the upper surface of the fixed structure of two band U type groove structures or draw-in groove structure is on same horizontal plane;
Two margins of wiring board are inserted in U type groove or the draw-in groove structure, and one of band placing components faces down;
3) determine the mode of heating and the thermal treatment zone of wiring board device for disassembling, set the heating-up temperature of the thermal treatment zone, implement heating according to the scolding tin of prejudging (soldering paste) melting temperature;
Described mode of heating adopts gas medium thermal convection mode to heat or adopts infrared radiation and thermal convection and heat with mode;
When adopting the thermal convection mode of described gas medium to heat, 1 or 1 above hot blast import are set, or and increase an even heat plate again in below the hot blast import and the space between above the wiring board, wiring board is heated evenly;
Described even heat plate is a metallic plate that has many through-hole structures.
The described thermal treatment zone is set to preheat district and two districts, the melts soldering tin thermal treatment zone; The perhaps described thermal treatment zone only is provided with a heat tracing zone;
In the described district that preheats, wiring board is implemented heating, wiring board rises to 140～160 ℃ and insulation gradually from room temperature in 2～3 minutes time;
In the described melts soldering tin thermal treatment zone, wiring board is implemented heating, wiring board temperature in 0.5～2 minute time rises to 195～240 ℃ and insulation from 140～160 ℃ rapidly; Wiring board keeps the time above the scolding tin melting temperature in the melts soldering tin thermal treatment zone be 0.5～3 minute, and scolding tin is fully melted;
Perhaps at described heat tracing zone, wiring board is implemented heating, wiring board temperature in 2.5～4 minutes time rises to 195～240 ℃ and insulation from room temperature; Wiring board surpasses the scolding tin melting temperature in heat tracing zone time is 0.5～3 minute, and scolding tin is fully melted.
4) adopting the length of spring compressed mode is the impact bar accumulation of energy, and impact bar is implemented contactless impact by connected point type impact structure or bar shaped impact structure or face shape impact structure on circuit board;
The accumulation of energy of described length of spring compressed mode adopts the mode of rotating cam to promote the impact bar motion by straight pin, makes length of spring compressed and accumulation of energy;
When adopting the mode of described rotating cam, can adopt the cam of two kinds of forms, first kind is adopted single lift cam, and the cam revolution moves a week, and spring is compressed once, and each decrement is identical; Second kind is adopted many lifts cam, and the cam revolution moves a week, and spring will be compressed more than twice, and decrement increases successively at every turn, thereby realizes the impact energy of increase successively.
When adopting the mode of described rotating cam, two cams are distributed in the impact bar both sides that spring is housed, make the impact bar stress equalization;
Described point type impact structure is meant that the end by the rod-like articles in a little various cross sections constitutes the impact structure of shock point;
Described bar shaped impact structure is the impact structure that is made of shock surface an above strip face;
Perhaps described shape impact structure is meant that the plane by one or more large area regions constitutes the impact structure of shock surface;
Described contactless impact be described point type impact structure or described bar shaped impact structure or described shape impact structure under the promotion of impact bar, impact on the elastic fixing device of band U type groove structure or draw-in groove structure, directly do not contact with wiring board; Under the oscillating action of percussion and elastic fixing device, the components and parts and the scolding tin of wiring board lower surface come off from wiring board, and the components and parts of wiring board upper surface separate with the wiring board substrate with scolding tin.
5) adopt purging device or sweep curette and sweep components and parts and the scolding tin of scraping the wiring board upper surface
Described purging device is installed in that wiring board moves ahead or the top of removing direction, the hot-air that blows out from the purging device tuyere purges the components and parts and the scolding tin of wiring board upper surface to the opposite direction of wiring board moving direction, components and parts and scolding tin are split away off from the wiring board substrate;
The described curette of sweeping is installed in that wiring board moves ahead or the top of removing direction, described sweep to be equipped with on the curette have certain flexible sweeping and scrape pin, sweep scraping article or sweep scraping blade.Sweep curette and rotate, sweeping on it scrape pin, sweep scraping article or sweep scraping blade and the components and parts of wiring board upper surface and scolding tin are swept to the opposite direction of wiring board moving direction scraped, and components and parts and scolding tin are split away off from the wiring board substrate;
Described purging device tuyere be one have with wiring board before the suitable long narrow slot structure of line direction cross-section width dimension, perhaps form side by side by row's pipe, the line direction cross-section width dimension is suitable before its width and the wiring board, is convenient to form enough blast or wind speed.
Employing collects components and parts and the scolding tin that splits away off by the elasticity guipure of vibrator exciting, scolding tin is realized enrichment and is come off from components and parts on the elasticity guipure of vibration, and falling into the dish that collects below the elasticity guipure by the guipure hole, components and parts then are retained on the elasticity guipure;
Described elasticity guipure is furnished with many tiny through-hole structures, and liquid solder splashes or solid-state scolding tin granule can pass through these through holes, and components and parts can not pass through;
The upper surface of described elasticity guipure is level and smooth, helps the accessible slip of components and parts thereon;
Described elasticity guipure moves or maintains static;
6) adopt air draft or vacuum suction apparatus to be collected in step 3)～5) flue gas that produces in the process, discharge after concentrated harmless treatment; Wiring board substrate and fixture thereof shift out the thermal treatment zone with transport sector, perhaps take out by manually operated unloading device, or artificial directly taking-up; Through natural cooling or blow cold wind, separated circuit boards substrate and components and parts are reduced to 120～80 ℃ gradually; To the letter sorting of classifying of wiring board substrate and components and parts.
According to said method, the present invention also provides the equipment that adopts contactless impact that wiring board is disassembled.
The equipment that adopts contactless impact that wiring board is disassembled, this equipment comprises: impact bar 2; Compression spring 3; Pin 4; Cam 5; Rotation axis 7; Chain 11; Elasticity guipure 13; Purging device 15; Vibration generator 17; Electric heating tube 18; Scolding tin catch tray 19; Stopper 20; Preheat district 21; The melts soldering tin thermal treatment zone 22; Fan 23; Heat insulation cord 25; Top board 26; Supporting guide 27; Body of wall 28; The fixture 31 of draw-in groove mode; Bar shaped impact structure 47.
Preheat the district 21 and the melts soldering tin thermal treatment zone 22, on two thermal treatment zone top boards 26 or the side fan 23 be installed strengthen thermal convections, the top and the bottom of chain 11 are furnished with electric heating tube 18 in two thermals treatment zone, wherein the right lower quadrant electric heating tube 18 of the melts soldering tin thermal treatment zone 22 is arranged along chain 11 directions, and the electric heating tube 18 of other position is along arranging with chain 11 horizontal vertical directions.
At the lower disposed elasticity guipure 13 of the melts soldering tin thermal treatment zone 22, the bottom of elasticity guipure 13 is provided with scolding tin catch tray 19, and the upside of elasticity guipure 13 or downside are provided with vibration generator 17, in order to 13 vibrations of excitation elasticity guipure.
The present invention also provides a kind of equipment that adopts contactless impact that wiring board is disassembled, and it is characterized in that, this equipment comprises impact bar 2; Compression spring 3; Pin 4; Many lifts cam 6; Rotation axis 7; Guide rail 12; Elasticity guipure 14; Sweep curette 16; Vibration generator 17; Scolding tin catch tray 19; High temperature airduct 24; Heat insulation cord 25; Top board 26; Heat tracing zone 29; Temperature sensor 30; The fixture 31 of draw-in groove mode; Many imports heating box 39; Hot blast import 40; Face shape impact structure 49; Components and parts collecting box 56.
The position is provided with temperature sensor 30 near the circuit board fixer in heat tracing zone 29; Heat tracing zone 29 by high temperature airduct 24, is introduced outside hot blast from the hot blast import 40 that many imports heating box 39 end faces are provided with, wiring board 1 and fixture 31 thereof are taked to blow from the top down the hot blast heating.High temperature airduct 24 links to each other with hot air source, and hot air source can be located at wiring board and disassemble the last or setting separately of equipment;
On this equipment, the bottom of heat tracing zone 29, arrange elasticity guipure 14, the bottom of elasticity guipure 14 is provided with scolding tin catch tray 19, the upside of elasticity guipure 14 or downside are provided with vibration generator 17, in order to 14 vibrations of excitation elasticity guipure; The right end of elasticity guipure 14 is provided with components and parts collecting box 56.
The present invention can dismantle the wiring board of single or double band components and parts.
The present invention can improve placing components and the paster components and parts are dismantled the efficient of (or excision) from wiring board, and can guarantee the function integrity and the apparent size integrity of institute's dismounting components and parts, realize effectively separating and collecting of components and parts and scolding tin, improve the operating environment condition, prevent that effectively the wiring board unloading process may pollution on the environment.
Description of drawings
Fig. 1: the inventive method flow chart;
Fig. 2: a kind of device for disassembling schematic diagram of the present invention;
Fig. 3: the another kind of device for disassembling schematic diagram of the present invention;
Fig. 4: four of the mode of fixing circuit board---draw-in groove mode fixing circuit board schematic diagram;
Fig. 5: wiring board heating box schematic diagram;
Fig. 6: the wiring board heating box schematic diagram of band even heat plate;
Fig. 7: adopt length of spring compressed mode accumulation of energy theory structure schematic diagram;
Fig. 8: point type impact structure schematic diagram;
Fig. 9: bar shaped impact structure schematic diagram;
Figure 10: face shape impact structure schematic diagram;
Figure 11: purging device work schematic diagram;
Figure 12: purging device contour structures axle is surveyed schematic diagram;
Figure 13: metal mesh belt structural representation.
Embodiment
Below by embodiment the present invention is described.
Embodiment 1 disassembles the old circuit board of double-sided belt components and parts according to method
Fig. 1: the inventive method flow chart.The method that a kind of contactless impact is disassembled wiring board, this method may further comprise the steps:
1) gets the old circuit board (hereinafter to be referred as wiring board) of double-sided belt components and parts, wiring board is carried out cleanings such as dedusting, decontamination dirt; The components and parts that non-welding manner such as remove snapping, straight cutting, be threaded connects; Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.; Get two the shortest opposite side of opposite side distance on the wiring board, indivedual components and parts tip-ofves on the wiring board are extractd, make its every limit that the margin of no components and parts wide more than the 2mm be arranged;
2) adopt the elastic fixing device fixing circuit board of being with U type groove structure or draw-in groove structure: a zone line is set is empty pedestal, two be parallel to each other, spacing is adjustable, fixed block with the relative U type groove structure of opening or draw-in groove structure is connected with pedestal by elastic construction, fixed block one end of band U type groove structure or draw-in groove structure is provided with the wiring board barrier structure, be used to stop wiring board to slide along U type groove or draw-in groove direction, the upper surface of the fixed block of two band U type groove structures or draw-in groove structure is on same horizontal plane; Two margins of wiring board are inserted in U type groove or the draw-in groove structure, and one of band placing components faces down;
3) mode of heating of wiring board device for disassembling adopts infrared radiation and thermal convection and heats with mode; Be set to preheat district and two districts, the melts soldering tin thermal treatment zone; Set the heating-up temperature of the thermal treatment zone according to the scolding tin of prejudging (soldering paste) melting temperature; In the described district that preheats, wiring board is implemented heating, wiring board rises to 140～160 ℃ and insulation gradually from room temperature in 2～3 minutes time; In the described melts soldering tin thermal treatment zone, wiring board is implemented heating, wiring board temperature in 0.5～2 minute time rises to 195～240 ℃ and insulation from 140～160 ℃ rapidly; Wiring board keeps the time above the scolding tin melting temperature in the melts soldering tin thermal treatment zone be 0.5～3 minute, and scolding tin is fully melted;
4) after scolding tin fully melts, adopt the mode of rotating many lifts cam, promote the impact bar motion by straight pin, make length of spring compressed and accumulation of energy; Many lifts cam revolution moves a week, and spring will be compressed 3 times, and decrement increases successively at every turn, thereby realizes the impact energy of increase successively; Impact bar provides enough and suitable impact energy for the bar shaped impact structure, the elastic fixing device of band U type groove structure or draw-in groove structure is implemented to impact, under the oscillating action of percussion and elastic fixing device, the components and parts and the scolding tin of wiring board lower surface come off from wiring board, and the components and parts of wiring board upper surface separate with the wiring board substrate with scolding tin; Described bar shaped impact structure is to constitute shock surface to wiring board by an above strip face;
5) adopt purging device to purge the scolding tin of wiring board upper surface
Wiring board move ahead or removing direction above, purging device is installed, the hot-air that purging device blows out purges the scolding tin of the wiring board upper surface opposite direction to the wiring board moving direction, and components and parts and scolding tin are split away off from the wiring board substrate;
The direction that purging device blows out hot-air move ahead with wiring board or removing direction relative, become 150 °～170 ° angle.The tuyere of purging device is a structure with the suitable slit of the preceding line direction cross sectional dimensions of 2～10mm height, width and wiring board.The purging device wind nozzle outlet is 20～80mm to the vertical range of wiring board upper surface.Temperature when hot-air is blown into PCB surface is at 195～240 ℃, scolding tin that its blast or wind speed enough adhere to upper surface and the components and parts of having thrown off the PCB surface of blowing off, and split away off from the wiring board substrate;
6) wiring board is being implemented impact and is being purged in the process of scolding tin, and components and parts and scolding tin come off, and fall following one and have on certain elasticity guipure.The elasticity guipure is by the vibrator exciting, make scolding tin in vibration, realize enrichment and come off, liquid solder splashes or solid-state scolding tin granule fall into the dish that collects below the elasticity guipure by the guipure hole, and components and parts then are retained on the elasticity guipure, realize that components and parts separate with scolding tin; The direction of motion of elasticity guipure is identical with the wiring board moving direction, and the upper surface of elasticity guipure keeps level; The elasticity guipure has the motion consistent with the wiring board moving direction;
7) adopt air exhausting device to be collected in step 3)～5) flue gas that produces in the process, discharge after concentrated harmless treatment; Wiring board and fixture thereof shift out the thermal treatment zone with transport sector; By blowing cold wind, separated circuit boards substrate and components and parts are reduced to 120～80 ℃ gradually; The wiring board substrate is taken off from fixture,, carry out scolding tin and collect, finish on the wiring board globality of components and parts and disassemble and extract the components and parts letter sorting of classifying.
Fig. 2 is a kind of device for disassembling schematic diagram of the present invention.This device for disassembling adopts draw-in groove mode fixture fixing circuit board, the thermal treatment zone is divided into preheating to be distinguished and two districts, the melts soldering tin thermal treatment zone, adopting cam mechanism and spring energy-storage mode is the impact bar accumulation of energy, impact bar is implemented contactless impact by connected bar shaped impact structure on circuit board, adopt purging device to carry out the purging of components and parts and scolding tin, adopt the metal mesh belt of horizontal movement to carry out separating and collection of components and parts and scolding tin, thereby realize that placing components and paster components and parts are extractd based on the globality of function on the wiring board.This device for disassembling can be dismantled the wiring board of single or double band components and parts.
For the convenience of narrating, the method step of disassembling processing according to wiring board is described the method and the basic structure of device for disassembling below.
1) wiring board preliminary treatment
At first wiring board is carried out cleanings such as dedusting, decontamination dirt, and remove snapping, straight cutting, components and parts that non-welding manner such as be threaded connects, then individual metablocks device tip-off is extractd (if any), make the shortest every limit of two opposite side of opposite side distance on the wiring board that the margin of the above wide no components and parts of 2mm be arranged; Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.
2) fixing circuit board
A pedestal 32 is set, and two sliding shoes 33 of parallel placement on the pedestal 32 respectively have a sliding tray 34 on each sliding shoe 33.The upper surface of two fixed block 36, two fixed blocks 36 of parallel again placement is concordant on the sliding shoe 33, respectively has a U type groove 37 on each fixed block 36, and U type groove 37 is oppositely arranged, in order to insert wiring board 1.The groove depth of U type groove 37 is 2-3mm at least.Scrape action and move backward in order to prevent that the wiring board substrate from following to sweep in subsequent method step " components and parts and scolding tin are swept and scraped ", in the rear end of fixed block 36 traffic directions, U type groove 37 does not connect, and forms wiring board barrier structure 38.Two fixed blocks 36 are connected with two sliding shoes 33 by bolt, wing nut 35, and can slide on sliding tray 34 to adjust spacing, adapt to the wiring board of the different size of packing into.Wiring board 1 is inserted in the U type groove 37 of fixed block 36, and one of band placing components faces down.
3) implement heating
Setting preheats district 21 and 22 two districts, the melts soldering tin thermal treatment zone.All adopt infrared radiation and thermal convection two thermals treatment zone and heat with mode.The medium of thermal convection adopts air.Infrared radiation adopts quartz electric heating pipe 18, and quartz electric heating pipe 18 and fan 23 are adopted in thermal convection.Temperature sensor is set to be controlled following temperature.
(1) preheats
(2) melts soldering tin heating
Set the heating-up temperature of the melts soldering tin thermal treatment zone in advance according to scolding tin (soldering paste) melting temperature of judging in " wiring board preliminary treatment ".
4) implement to impact
After scolding tin fully melts, adopt cam 5---accumulation of energy of spring 3 mechanisms and enforcement are impacted.Rotation axis 7 is being with cam 5 to clockwise rotate, and cam 5 acts on the pin 4 of impact bar 2, and impact bar 2 and pin 4 are risen, and compresses spring 3 and accumulation of energy.When cam 5 turned over its bossing, under the effect of spring 3, impact bar 2 provided suitable momentum for bar shaped impact structure 47.Bar shaped impact structure 47 as shown in Figure 9.
Fig. 7 adopts length of spring compressed mode accumulation of energy theory structure schematic diagram.Fig. 8 is a point type impact structure schematic diagram.Fig. 9 is a bar shaped impact structure schematic diagram.Figure 10 is a face shape impact structure schematic diagram.
Bar shaped impact structure 47 is the structures that are made of some strip rectangular blocks 48.When wiring board was implemented to impact, the bottom surface of bar shaped impact structure 47 acted on the fixed block 36 of wiring board fixture 31.Because bar shaped impact structure 47 does not act directly on the wiring board of fixture 31, to wiring board enforcement is contactless impact, under the elastic vibration effect of percussion and fixture 31 self, the components and parts and the scolding tin of wiring board lower surface come off from wiring board, and the components and parts of wiring board upper surface separate with the wiring board substrate with scolding tin.Bar shaped impact structure 47 both can have been realized the impact to wiring board 1, did not hinder the heating of wiring board again.
The number of times that wiring board is implemented to impact can be once also can be continuous several times.
5) components and parts are swept with scolding tin and are scraped, separate and collect
After the enforcement impact was finished, under Artificial Control, stopper 20 was removed, and wiring board 1 and fixture 31 thereof continue right laterals with chain 11.Near the outlet of 22 the right, the melts soldering tin thermal treatment zone, a purging device 15 is arranged directly over the wiring board moving direction, purging device 15 concerns referring to Figure 11 with the position of wiring board 1 and fixture 31 thereof.The blow-off direction that purging device 15 blows out hot-air moves ahead with wiring board 1 or removing direction becomes 165 ° angle, and the vertical range that the tuyere 52 of purging device 15 exports to wiring board substrate 8 upper surfaces is 20mm.The contour structures of purging device 15 as shown in figure 12, purging device tuyere 52 is the structures with 4mm height, the wide slit of 300mm, for ease of the installing and locating of purging device 15 on heat insulation wall 51, the profile of the extension 53 of purging device 15 is made rectangular cross section structure.
Purging device blows out 210～220 ℃ hot-air, the scolding tin 10 of wiring board substrate 8 upper surfaces adhesion and the components and parts 9 of having thrown off is purged to the opposite direction of wiring board 1 motion, and split away off from wiring board substrate 8.
Sweep and scrape in two method steps wiring board 1 being implemented impact, components and parts and scolding tin, all have components and parts 9 and scolding tin 10 to come off.Components and parts 9 that split away off and scolding tin 10 are fallen one of 22 bottom, the melts soldering tin thermal treatment zone and are had on certain flexible metal mesh belt 13.Metal mesh belt 13 is by vibrating device 17 excitings, make scolding tin 10 in vibration, realize enrichment and come off, liquid solder splashes or solid-state scolding tin granule 10 fall into by the guipure hole and collect dish 19 below the metal mesh belt, and 9 of components and parts are retained on the metal mesh belt 13, realize that components and parts separate with scolding tin.
Figure 11 is the purging device structural representation.(Figure 12 is that purging device contour structures axle is surveyed schematic diagram.) Figure 13 is metal mesh belt surface configuration schematic diagram, as shown in figure 13, at the through hole 55 that is equipped with on the sheet metal 54 that a width is 500mm about many diameter phi 2～10mm, sheet metal thickness is at 1～2mm.
6) reprocessing
Adopt air exhausting device to be collected in the flue gas that produces in the above process, after concentrating harmless treatment, discharge.
Wiring board 1 and fixture 31 thereof continue to move ahead with conveyer chain 11, pass heat insulation cord 25 and leave the melts soldering tin thermal treatment zone 22.By blowing cold wind and natural cooling, separated circuit boards substrate and components and parts are reduced to 120～80 ℃ gradually.The wiring board substrate is taken off from fixture,, carry out scolding tin and collect, finish on the wiring board integral body of components and parts and disassemble and extract the components and parts letter sorting of classifying.
Fig. 3 is the another kind of device for disassembling schematic diagram of the present invention.This disassembling apparatus adopts draw-in groove mode fixing circuit board, a heat tracing zone is set, adopting cam mechanism and spring energy-storage mode is the impact bar accumulation of energy, impact bar is implemented contactless impact by connected bar shaped impact structure on circuit board, employing is swept curette and is carried out sweeping of components and parts and scolding tin and scrape, the metal mesh belt that employing is obliquely installed carries out separating and collection of components and parts and scolding tin, and placing components and paster components and parts are extractd based on the globality of function on the realization wiring board.This disassembling apparatus both can have been dismantled the wiring board of one-side band components and parts, also can dismantle the wiring board of double-sided belt components and parts.
For the convenience of narrating, the method step of disassembling processing according to wiring board is described the method and the basic structure of disassembling apparatus below.
1) wiring board preliminary treatment
At first wiring board is carried out cleanings such as dedusting, decontamination dirt, the components and parts that remove snapping, straight cutting then, non-welding manner such as be threaded connect, individual metablocks device tip-off is extractd, made wiring board have the every limit of two opposite side that the margin of no components and parts wide more than the 2mm is arranged; Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.
2) fixing circuit board
A pedestal 32 is set, and two sliding shoes 33 of parallel placement on the pedestal 32 respectively have a sliding tray 34 on each sliding shoe 33.The upper surface of two fixed block 36, two fixed blocks 36 of parallel again placement is concordant on the sliding shoe 33, respectively has a U type groove 37 on each fixed block 36, and U type groove 37 is oppositely arranged, in order to insert wiring board 1.The groove depth of U type groove 37 is 2mm at least.Scrape action and move backward in order to prevent that the wiring board substrate from following to sweep in subsequent method step " components and parts and scolding tin are swept and scraped ", in the rear end of fixed block 36 traffic directions, U type groove 37 does not connect, and forms wiring board barrier structure 38.Two fixed blocks 36 are connected with two sliding shoes 33 by bolt, wing nut 35, and can slide on sliding tray 34 to adjust spacing, adapt to the wiring board of the different size of packing into.Wiring board 1 is inserted in the U type groove 37 of fixed block 36, and one of band placing components faces down.
3) implement heating
A heat tracing zone 29 is set.Adopt the thermal convection mode to heat.The medium of thermal convection adopts air, and hot-air is introduced through hot blast import 40 from air-heater (not shown Fig. 3) by high temperature airduct 24.The temperature that 30 pairs of heat tracing zones 29 of temperature sensor are set is controlled.Heat tracing zone 29 be in the relieving attachment on import heating box 39 at the most, down to the heat affected zone between metal mesh belt 14 and the scolding tin catch tray 19.
Set the heating-up temperature of the melts soldering tin thermal treatment zone in advance according to scolding tin (soldering paste) melting temperature of judging in " wiring board preliminary treatment ".
Wiring board 1 and fixture 31 thereof are pushed heat tracing zone 29 along guide rail 12 heat, wiring board temperature in 2.5～4 minutes time rises to 195～240 ℃ and insulation from room temperature.Wiring board surpasses the scolding tin melting temperature in heat tracing zone time is 1～2 minute, and scolding tin is fully melted.
The structure of described many imports heating box 39 as shown in Figure 5.(Fig. 5 is a wiring board heating box schematic diagram.Fig. 6 is the wiring board heating box schematic diagram of band even heat plate.) 2 or 2 above hot blast imports 40 are set on many imports heating box 39.Impact bar 2 passes the end face of many imports heating box 39 and is connected with impact structure 47.
4) implement to impact
After scolding tin fully melts, adopt many lifts cam 6---accumulation of energy of spring 3 mechanisms and enforcement are impacted.Rotation axis 7 is being with many lifts cam 6 to clockwise rotate, and many lifts cam 6 acts on the pin 4 of impact bar 2, and impact bar 2 and pin 4 are risen, and compresses spring 3 and accumulation of energy.When many lifts cam 6 turned over a bossing, under the effect of spring 3, impact bar 2 moved downward rapidly, for face shape impact structure 49 provides momentum.Because the height of three bossings is different on many lifts cam 6, to rotate in all processes at rotation axis 7, three decrements of spring 3 increase successively, thereby realize the impulsive force of increase successively.
Bar shaped impact structure 47 is the structures that are made of some strip rectangular blocks 48.When wiring board was implemented to impact, the bottom surface of bar shaped impact structure 47 acted on the fixed block 36 of wiring board fixture 31.Because bar shaped impact structure 47 does not act directly on the wiring board of fixture 31, to wiring board enforcement is contactless impact, under the elastic vibration effect of percussion and fixture 31 self, the components and parts and the scolding tin of wiring board lower surface come off from wiring board, and the components and parts of wiring board upper surface separate with the wiring board substrate with scolding tin.Bar shaped impact structure 47 both can have been realized the impact to wiring board 1, did not hinder the heating of wiring board again.
The number of times that wiring board is implemented to impact can be once also can be continuous several times.
5) components and parts and scolding tin are swept and are scraped
Implement to impact finish after, under manual operation, wiring board fixture 31 is pulled out to the right along guide rail.Near heat tracing zone 29 outlets, there is one directly over the wiring board moving direction and sweeps curette 16, sweep curette 16 and clockwise rotate, on it scrape pin and the components and parts 9 of wiring board upper surface and scolding tin 10 are moved to sweep in the other direction to wiring board scrape with sweeping, and split away off from wiring board substrate 8.
6) components and parts and scolding tin separates and collection
Sweep and scrape in two method steps wiring board 1 being implemented impact, components and parts and scolding tin, all have components and parts 9 and scolding tin 10 to come off.Components and parts 9 that split away off and scolding tin 10 are fallen one of heat tracing zone 22 bottom and are had on certain flexible metal mesh belt 14.Metal mesh belt 14 is by vibrating device 17 excitings, make scolding tin 10 in vibration, realize enrichment and come off, liquid solder splashes or solid-state scolding tin granule 10 fall into scolding tin catch tray 19 below the metal mesh belt by the guipure hole, 9 of components and parts are retained on the metal mesh belt 14, under the effect of vibration generator 17, shift to components and parts collecting box 51 gradually, realize that components and parts separate with scolding tin.
The upper surface of metal mesh belt 14 along wiring board move or removing direction downward-sloping gradually.The surface configuration of metal mesh belt 14 is equipped with the through hole 55 about many diameter phi 2-10mm as shown in figure 13 on the sheet metal 54 that a width is 500mm, sheet metal thickness is at 2～3mm.
7) reprocessing
Adopt air exhausting device to be collected in the flue gas that produces in the above process, after concentrating harmless treatment, discharge.
Wiring board 1 and fixture 31 thereof are passed heat insulation cord 25 and are left heat tracing zone 29 by manually taking out by pulling device.Wiring board takes out after blow cold wind and natural cooling, and separated circuit boards substrate and components and parts are reduced to 120～80 ℃ gradually.The wiring board substrate is taken off from fixture,, carry out scolding tin and collect, finish on the wiring board integral body of components and parts and disassemble and extract the components and parts letter sorting of classifying.
Claims (5)
1. the method that adopts contactless impact that wiring board is disassembled is characterized in that, this method may further comprise the steps:
1) wiring board preliminary treatment
The components and parts that removal is connected with the wiring board substrate with non-welding manner;
The individual metablocks device tip-off of marginal portion wide more than the wiring board 2mm is extractd, convenient fixing;
Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate;
Roughly differentiate the melting temperature of the used scolding tin/soldering paste of wiring board according to the type of wiring board substrate, the model of components and parts;
2) fixing step 1) pretreated wiring board
Wiring board adopts the elastic fixing device of band U type groove structure or draw-in groove structure to fix;
The elastic fixing device of described employing band U type groove structure or draw-in groove structure is: a zone line is set is empty pedestal, two be parallel to each other, spacing is adjustable, fixed mechanism with the relative U type groove structure of opening or draw-in groove structure is connected with pedestal by elastic construction, the width of U type groove or draw-in groove is transferred and can be locked according to the thickness of wiring board substrate on the fixed mechanism;
Elastic fixing device one end of this band U type groove structure or draw-in groove structure is provided with the wiring board barrier structure, is used to stop wiring board to slide along U type groove or draw-in groove direction;
The upper surface level of the elastic fixing device of described band U type groove structure or draw-in groove structure, perhaps the upper surface of the fixed block of two bands U type groove structure or draw-in groove structures is on same horizontal plane, or the upper surface of the fixed structure of two band U type groove structures or draw-in groove structure is on same horizontal plane;
Two margins of wiring board are inserted in U type groove or the draw-in groove structure, and one of band placing components faces down;
3) to step 2) wiring board after fixing implements heating
Set heating-up temperature according to the scolding tin of prejudging/soldering paste melting temperature, wiring board is implemented to adopt the thermal convection mode of gas medium to heat or adopted infrared radiation and thermal convection and heat with mode; Make wiring board temperature in 2.5～4 minutes time rise to 195～240 ℃ and insulation from room temperature; The time that wiring board is heated above the scolding tin melting temperature is 0.5～3 minute, and scolding tin is fully melted;
This step is provided with two kinds of heat forms: preheat with melts soldering tin and heat; A kind of form perhaps only is set: heat tracing;
Described preheating refers to wiring board is implemented heating, and wiring board rises to 140～160 ℃ and insulation gradually from room temperature in 2～3 minutes time;
Described melts soldering tin heating is that wiring board is implemented heating, and wiring board temperature in 0.5～2 minute time rises to 195～240 ℃ and insulation from 140～160 ℃ rapidly; Wiring board keeps the time above the scolding tin melting temperature in the melts soldering tin thermal treatment zone be 0.5～3 minute, and scolding tin is fully melted;
Described heat tracing is that wiring board is implemented heating, and wiring board temperature in 2.5～4 minutes time rises to 195～240 ℃ and insulation from room temperature; Wiring board surpasses the scolding tin melting temperature in heat tracing zone time is 0.5～3 minute, and scolding tin is fully melted;
4) wiring board of the fixing heating of step 3) is implemented to impact
Adopting the length of spring compressed mode is the impact bar accumulation of energy, and impact bar is by connected point type impact structure or bar shaped impact structure
Or face shape impact structure on circuit board is implemented contactless impact;
The accumulation of energy of described length of spring compressed mode refers to that the rotation axis band cam rotation, and cam rises impact bar and pin on the pin of impact bar, compression spring and accumulation of energy;
Described point type impact structure is meant that the end by the rod-like articles in some various cross sections constitutes the impact structure of shock point;
Described bar shaped impact structure is meant the impact structure that is made of shock surface an above strip face;
Described shape impact structure is meant that the plane by one or more large area regions constitutes the impact structure of shock surface;
Described contactless impact be described point type impact structure or described bar shaped impact structure or described shape impact structure under the promotion of impact bar, impact on the elastic fixing device of band U type groove structure or draw-in groove structure, directly do not contact with wiring board; Under the oscillating action of percussion and elastic fixing device, the components and parts and the scolding tin of wiring board lower surface come off from wiring board;
5) sweeping of wiring board upper surface components and parts and scolding tin scraped, separated and collect
Adopt purging device or sweep curette and purge or sweep components and parts and the scolding tin of scraping the wiring board upper surface;
Described purging device is installed in that wiring board moves ahead or the top of removing direction, the hot-air that blows out from the purging device tuyere with the wiring board upper surface mount components and parts and scolding tin purges to the opposite direction of wiring board moving direction, make to mount components and parts and scolding tin splits away off from the wiring board substrate; Described purging device tuyere be one have with wiring board before the suitable long narrow slot structure of line direction cross-section width dimension, perhaps form side by side by row's pipe, the line direction cross-section width dimension is suitable before its width and the wiring board, is convenient to form enough blast or wind speed; The described curette of sweeping is installed in that wiring board moves ahead or the top of removing direction, described sweep to be equipped with on the curette have certain flexible sweeping and scrape pin, sweep scraping article or sweep scraping blade; Sweep curette and rotate, sweeping on it scrape pin, sweep scraping article or sweep scraping blade mount components and parts and the scolding tin of wiring board upper surface are swept to the opposite direction of wiring board moving direction and scraped, and makes to mount components and parts and scolding tin splits away off from the wiring board substrate;
Employing collects components and parts and the scolding tin that splits away off by the elasticity guipure of vibrator exciting, scolding tin is realized enrichment and is come off from components and parts on the elasticity guipure of vibration, and falling into the dish that collects below the elasticity guipure by the guipure hole, components and parts then are retained on the elasticity guipure;
Described elasticity guipure is furnished with many tiny through-hole structures, and liquid solder splashes or solid-state scolding tin granule can pass through these through holes, and components and parts can not pass through;
6) reprocessing
Adopt air draft or vacuum suction apparatus to be collected in step 3)～5) flue gas that produces in the process, discharge after concentrated harmless treatment; Take out wiring board substrate and fixture thereof, cooling is to the letter sorting of classifying of wiring board substrate and components and parts.
2. the method for wiring board being disassembled according to the contactless impact of the described employing of claim 1 is characterized in that, when adopting described length of spring compressed mode, two cams is distributed in the impact bar both sides that spring is housed, and makes the impact bar stress equalization.
3. the method that the contactless impact of employing according to claim 1 is disassembled wiring board, it is characterized in that, when adopting described length of spring compressed mode, can adopt the cam of two kinds of forms, first kind is adopted single lift cam, the cam revolution moves a week, and spring is compressed once, and each decrement is identical; Second kind is adopted many lifts cam, and the cam revolution moves a week, and spring will be compressed more than 1 time, and decrement increases successively at every turn, thereby realizes the impact energy of increase successively.
4. the equipment that adopts contactless impact that wiring board is disassembled is characterized in that, this equipment comprises: impact bar (2); Compression spring (3); Pin (4); Cam (5); Rotation axis (7); Chain (11); Elasticity guipure (13); Purging device (15); Vibration generator (17); Electric heating tube (18); Scolding tin catch tray (19); Stopper (20); Preheat district (21); The melts soldering tin thermal treatment zone (22); Fan (23); Heat insulation cord (25); Top board (26); Supporting guide (27); Body of wall (28); The fixture of draw-in groove mode (31); Bar shaped impact structure (47);
Impact bar (2) is by being formed by connecting more than 1 section or 1 section; Compression spring (3), pin (4) are installed on the impact bar (2), its lower end and bar shaped impact structure (47) or face shape impact structure (49) or point type impact structure (42) are assembled together, and impact bar (2) is by being assemblied in the axle sleeve structure guiding on the wiring board disassembly system top board (26); Cam (5) is installed on the rotation axis (7), and rotation axis (7) is by the may command motor-driven; Purging device (15) is installed on the right side body of wall (28) of the melts soldering tin thermal treatment zone (22); The wiring board fixture (31) that adopts the draw-in groove mode slips into and passes along supporting guide (27) with chain (11) and preheats district (21) and the melts soldering tin thermal treatment zone (22);
Preheat district (21) and the melts soldering tin thermal treatment zone (22), go up or the side is equipped with fan (23) and strengthens thermal convection at two thermal treatment zone top boards (26), the top and the bottom of chain (11) are furnished with electric heating tube (18) in two thermals treatment zone, wherein the right lower quadrant electric heating tube (18) of the melts soldering tin thermal treatment zone (22) is arranged along chain (11) direction, and the electric heating tube of other position (18) is along arranging with chain (11) horizontal vertical direction;
At the lower disposed elasticity guipure (13) of the melts soldering tin thermal treatment zone (22), the bottom of elasticity guipure (13) is provided with scolding tin catch tray (19), and the upside of elasticity guipure (13) or downside are provided with vibration generator (17), in order to excitation elasticity guipure (13) vibration.
5. the equipment that adopts contactless impact that wiring board is disassembled is characterized in that, this equipment comprises impact bar (2); Compression spring (3); Pin (4); Many lifts cam (6); Rotation axis (7); Components and parts (9); Scolding tin (10); Guide rail (12); Elasticity guipure (14); Sweep curette (16); Vibration generator (17); Scolding tin catch tray (19); High temperature airduct (24); Heat insulation cord (25); Top board (26); Heat tracing zone (29); Temperature sensor (30); The fixture of draw-in groove mode (31); Many imports heating box (39); Hot blast import (40); Face shape impact structure (49); Components and parts collecting box (56);
Impact bar (2) is by being formed by connecting more than 1 section or 1 section; Compression spring (3), pin (4) are installed on the impact bar (2), and vertically pass many imports heating box (39); Impact bar (2) and point type impact structure (44) or bar shaped impact structure (47) or face shape impact structure (49) are connected; Impact bar (2) is disassembled the axle sleeve structure guiding of equipping on top board (26) and the many imports heating box (39) by being assemblied in wiring board; The many lifts cam (6) that promotes pin (4) motion on the impact bar (2) is installed on the rotation axis (7), and rotation axis (7) is by artificial or motor-driven; Wiring board fixture (31) slips into or passes heat tracing zone (29) along guide rail (12); The one or both sides of heat tracing zone (29) are provided with heat insulation cord (25); Near the outlet of the right side of this equipment, be provided with and sweep curette (16) or purging device (15);
The position is provided with temperature sensor (30) near the circuit board fixer in heat tracing zone (29); Heat tracing zone (29) by high temperature airduct (24), is introduced outside hot blast from the hot blast import (40) that many imports heating box (39) end face is provided with, wiring board (1) and fixture (31) thereof are taked to blow from the top down the hot blast heating; High temperature airduct (24) links to each other with hot air source, and hot air source is located at wiring board and disassembles the last or setting separately of equipment;
Elasticity guipure (14) is arranged in bottom in heat tracing zone (29), and the bottom of elasticity guipure (14) is provided with scolding tin catch tray (19), and the upside of elasticity guipure (14) or downside are provided with vibration generator (17), in order to excitation elasticity guipure (14) vibration; The right end of elasticity guipure (14) is provided with components and parts collecting box (56).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100635103A CN101014228B (en) | 2007-02-02 | 2007-02-02 | Method and equipment for disassembling circuit board using non-contacted impact |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100635103A CN101014228B (en) | 2007-02-02 | 2007-02-02 | Method and equipment for disassembling circuit board using non-contacted impact |
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| Publication Number | Publication Date |
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| CN101014228A CN101014228A (en) | 2007-08-08 |
| CN101014228B true CN101014228B (en) | 2010-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007100635103A Expired - Fee Related CN101014228B (en) | 2007-02-02 | 2007-02-02 | Method and equipment for disassembling circuit board using non-contacted impact |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152042A (en) * | 2011-03-07 | 2011-08-17 | 苏州工业园区宏创科技有限公司 | Universal load device for loading single-side mainboard |
| CN104219885B (en) * | 2013-05-31 | 2017-05-10 | 国际商业机器公司 | Temperature trigger ejection system for lock pin welded component and repair method |
| CN104968463A (en) * | 2014-01-29 | 2015-10-07 | 俐通（香港）有限公司 | System and method for extracting electronic components |
| CN107716514B (en) * | 2017-10-30 | 2024-03-08 | 仁新设备制造（四川）有限公司 | De-tin equipment for circuit board components |
| CN108145698B (en) * | 2018-02-06 | 2023-11-10 | 上海诺亚木木机器人科技有限公司 | Robot with smooth outer wall |
| CN109332838B (en) * | 2018-11-29 | 2020-12-11 | 威创集团股份有限公司 | Chip disassembling method and device |
| CN109865735B (en) * | 2019-03-21 | 2020-01-10 | 张雨璠 | Waste circuit board recovery device |
| CN111924529B (en) * | 2020-06-02 | 2021-07-30 | 成都仁新科技股份有限公司 | Infrared heating and conveying device for waste circuit boards |
| CN112517601A (en) * | 2020-11-12 | 2021-03-19 | 逄中胜 | Decomposition and recovery device of automatic circuit board processor |
| CN113263236B (en) * | 2021-04-29 | 2023-03-21 | 四川航天燎原科技有限公司 | Pin grid array packaging component PGA desoldering process method |
| CN114147308A (en) * | 2021-12-03 | 2022-03-08 | 武汉航空仪表有限责任公司 | Multi-pin device desoldering device |
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| US5927591A (en) * | 1996-12-31 | 1999-07-27 | Mcms, Inc. | Salvage method and apparatus for recovering microelectronic components from printed circuit boards |
| CN1600458A (en) * | 2003-09-23 | 2005-03-30 | 张�杰 | Method and equipment for breaking down and reclaiming electronic components and solder of discarded circuit board |
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|---|---|---|---|---|
| US5927591A (en) * | 1996-12-31 | 1999-07-27 | Mcms, Inc. | Salvage method and apparatus for recovering microelectronic components from printed circuit boards |
| CN1600458A (en) * | 2003-09-23 | 2005-03-30 | 张�杰 | Method and equipment for breaking down and reclaiming electronic components and solder of discarded circuit board |
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| JP特开平11-314084A 1999.11.16 |
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