CN100521873C - Method and equipment for disassembling circuit board using contacted impact - Google Patents
Method and equipment for disassembling circuit board using contacted impact Download PDFInfo
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- CN100521873C CN100521873C CNB2007100635067A CN200710063506A CN100521873C CN 100521873 C CN100521873 C CN 100521873C CN B2007100635067 A CNB2007100635067 A CN B2007100635067A CN 200710063506 A CN200710063506 A CN 200710063506A CN 100521873 C CN100521873 C CN 100521873C
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Abstract
The invention relates to one method and device to process disable by contact impact on circuit board, which comprises the following steps: fixing circuit board; heating on circuit board; adopting impact structure on circuit board for contact impact; adopting blower and collecting element parts and welding; after cooling processing the sort of circuit board and elements. The device comprises impact lever, compression spring, circuit board fix device, protruding wheel, guide rail, spring net band, and hot wind entrance hole.
Description
Technical field
Adopt contact to impact the method and apparatus that wiring board is disassembled, relate to method and implement device, belong to production, maintenance and waste recovery reutilization technology field components and parts harmless dismounting (or excision) globality, that reclaim based on function from the printed substrate.
Background technology
Printed substrate (Printed Curcuit Board is called for short PCB, or Printed Wiring Board, is called for short PWB) is the important component part of electronics and IT products, household electronic products etc.China is world wiring board big producing country, has tens thousand of tons of waste printed circuit boards to produce in the annual production process; Along with the continual renovation of electric equipment products is regenerated, a large amount of electric equipment productss are eliminated, and printed substrate is also abandoned thereupon.Because China does not adopt suitable recycling technology at present, waste printed circuit board has caused huge pressure for society and environment.The analysis showed that though waste printed circuit board is made as a whole its original function that lost, the components and parts overwhelming majority function on it is intact, is far from termination its useful life.And, contain various poisonous and harmful substances, precious metal on the components and parts, in order to improve the efficient of separating these materials, reduce the technical difficulty of separating substances in the printed substrate subsequent treatment, before the printed substrate subsequent treatment, carry out the dismounting of components and parts or extract also being necessary.The importance that the waste and old electric electric equipment products that China increases day by day fast make old circuit board disassemble highlights, and original disassembling method based on the single components and parts that keep in repair can not satisfy current needs far away.
Printed substrate in the product such as electronics and IT products, household electrical appliance normally is covered with the insulated substrate of Copper Foil and the parts that some components and parts are welded by low temperature solder mode by a single or double.Substrate mostly is flame-proof phenolic paper-based copper-coated board, non-flame-proof phenolic paper-based copper-coated board or epoxy glass fiber fabricbase central layer etc., components and parts have two kinds of paster components and parts (SMD) and placing components (THD) usually, comprise various integrated circuits (IC), diode, triode, photoelectric device, capacitance resistance and various slot interface etc.
Dismounting (or excision) method to components and parts on the printed substrate has multiple mode classification.Divide selective dismounting and globality dismounting from the component number of once dismounting; From dismantling the purposes branch of back components and parts, the dismounting of reclaiming based on the components and parts function is arranged and based on the dismounting of material recovery; Divide from the type of components and parts to be removed, dismounting at the paster components and parts is arranged, at the dismounting of placing components with at the dismounting of above two kinds of components and parts; The arrangement form of components and parts divides from the wiring board to be removed, dismounting at one-side band components and parts wiring board is arranged, at the dismounting of double-sided belt components and parts wiring board with at the dismounting of above two kinds of wiring boards.At present existing many about the globality dismounting of the wiring board arranged at different components and parts types, at difference and the method for dismounting that reclaims based on the components and parts function.
Chinese invention patent CN1590032A has proposed a kind of electronic component carrier that electronic component on the circuit board is disassembled, comprising a clamper is fixed on the fixed frame, be used for circuit board is clamped in this fixed frame, when the temperature in reflow soldering is higher than predetermined temperature, shake electronic component on this circuit board with an impactor, carrier is used for carrying and shakes from this circuit board and fall electronic component.Its shortcoming is: circuit board can not provide the resilience force of uniformity for each position of circuit board because its material behavior (base material is mainly made by complex method by epoxy resin, glass fibre etc.) becomes softer under solder melting temperature; And in order to obtain enough resilience forces, the impactor support must push up wiring board very high, and this just can not realize effective dismounting for long placing components.
Chinese invention patent CN1600458A has proposed a kind of from printed circuit board (PCB) partition that is welded with electronic component and the method that reclaims electronic component and scolder.By the blowing mouth of device top the circuit board upper surface blown is higher than the hot-air of scolder fusing point, the solder alloy on the holding circuit plate is in molten condition.Mechanical round brush by being close to pending circuit board lower surface is along the printed circuit board (PCB) reciprocal rolling of moving, and the electronic component of circuit board is swept down and sucked electronics and solder alloy loosening and that be scattered by the powerful suction nozzle on round brush next door by the mechanical force of the bristle on the round brush.By regulating the power of this getter device, make to produce enough big negative pressure at the circuit board lower surface, under the help of mechanical round brush, can pull up electronic component and scolder come from printed circuit board (PCB).Its shortcoming is: can not seal well when installing in device owing to circuit board, add and itself have through holes such as many installing holes, pin jack on its substrate, constantly have under the situation that hot blast is blown at the circuit board upper surface, therefore the circuit board lower surface is not easy to produce bigger negative pressure, for the dismounting poor effect of placing components.
Japan Patent JP10270841-A has proposed a kind of method of dismantling circuit board component.At first wiring board is heated, make its solder joint fusing, then wiring board is made its upset by a substrate holding apparatus, one of band components and parts face down, and impact part in the another side rotation of wiring board again and implement to impact, and components and parts are disassembled.Its shortcoming is: wiring board need clamp by clamping device and make its upset, but generally there is not enough empty position can supply clamping on the wiring board, so just need pull out more components and parts in advance, make dismounting preparation waste time and energy, perhaps need to take grasping part and damage some components and parts; And because wiring board deliquescing at high temperature adopts the mode of rotating the impact part to implement to impact, impulsive force is less, to the dismounting poor effect of components and parts.
Japan Patent JP10209634-A, JP2000151094A, JP9083129A all shovel operations such as cutting, squeeze, scrape to the pin root that components and parts combine with the wiring board substrate, make its pin be subjected to squeeze and cut the disengagement substrate, thereby realize the globality dismounting of components and parts, but can make the components and parts pin be subjected to gross distortion or damage like this and lose and re-use function.
U.S. Pat 5927591A has proposed a kind of method of globality dismounting paster components and parts.One of the components and parts that are equipped with that only are welded with the assembly daughter board of paster components and parts are faced down, or the assembly daughter board hung, in heating environment after the melts soldering tin, adopt the mode of vibration that the paster components and parts are shaken, it is very near apart from the assembly daughter board that components and parts collect device, makes the unlikely upset of upspringing of the components and parts that come off.But because vibrational energy is not enough, this method can not be carried out the globality dismounting to the wiring board that is welded with placing components.
Japan Patent JP3243412-B2 has proposed a kind of method that reclaims scolder.One of circuit strip components and parts are faced up, and another side (following) is heated to melts soldering tin, and the round brush that adopts two wires to make is again brushed liquid scolding tin down from the pin of wiring board and placing components, relies on the gravity of scolding tin to fall into returnable.But because placing components do not taken off in advance, also go the scolding tin operation under the state in the jack at wiring board at its pin, effect can be subjected to very big the influence; And this method does not have, can not collect the scolding tin and the components and parts of wiring board upper surface.
German patent DE 19525116-A1 has proposed a kind of method that adopts paster components and parts on the heat of compression air dismounting wiring board.One of band paster components and parts on the wiring board are faced down, and heat of compression air is sprayed onto on the wiring board paster components and parts by banded nozzle.After solder melts, the paster components and parts are fallen on the following filter bag, and solder flux falls into the weldpool that melts below by filter bag.Its shortcoming is: can not dismantle placing components; Because banded nozzle area heated is limited, if paster components and parts area is bigger, will influence the dismounting effect; After the solder flux that falls can be bonded on the components and parts that fall earlier, make components and parts and solder flux not realize separating.
Japan Patent JP11314084-A has designed a kind of device that adopts mode of vibration to realize the components and parts integral demounting, adopt crank and rocker mechanism to be vibrated under free state by wiring board, the scolder that splits away off, components and parts and substrate drop out collection by the different hole of size respectively under the propelling movement of vibration force.But adopt the method for this free vibration,, can cause components and parts and pin damaged because of the strong collision between components and parts, the wiring board if vibrate excessively; If reduce the vibration, again usually deficiency so that the pin of placing components from the jack of wiring board, deviate from; And the pin of longer placing components is difficult to break away from simultaneously the jack on the wiring board under this free vibration effect, cause these placing components effectively not dismantle.
Paper " The printed circuit board-A challenge for automated disassembly and forthe design of recyclable interconnect devices " (K.Feldmann and H.Scheller, inConcept-Conf.Clean Electronic Products and Technol., 1995, IEE Conf.Publicationno.415, pp.186-190.) proposed the method that another kind of employing mode of vibration realizes the components and parts integral demounting, wiring board has been clamped apply vibration again.The paper author also thinks and obtains different power and acceleration by changing amplitude with frequency, and its effect can be disassembled components and parts in the circuit board.But adopt the method for vibration,,,, make its dismounting poor effect because the dismounting energy is big inadequately for some placing components and all very little paster components and parts of quality volume though can dismantle bigger paster components and parts.
Summary of the invention
One object of the present invention just provides harmless ground, globality dismounting (or excision) waste printed circuit board (hereinafter to be referred as wiring board) is gone up the method and apparatus of placing components and paster components and parts, the components and parts original function and the performance that disassemble are without prejudice substantially, are convenient to function reuse thereafter.
Another object of the present invention is the components and parts of disassembling before the printed substrate material recovery on it, reduces the technical difficulty of separating substances in printed wire base board and the components and parts material recovery, improves the efficient of separating poisonous and harmful substance, precious metal.
Another purpose of the present invention is that the natural environment that the elimination waste printed circuit board is disassembled in the process pollutes, and improves the operational environment of old circuit board disassembling section, reduces labour intensity.
Another purpose of the present invention is to adapt to the situation that China's old circuit board increases fast, and the needs of old circuit board recycling are satisfied in disassembling fast of the waste printed circuit board of realization.
The invention provides a kind of contact that adopts and impact the method that wiring board is disassembled, this method may further comprise the steps:
1) removes the components and parts that snapping, straight cutting, non-welding manner such as be threaded connect; Placing components pin to be extractd on the wiring board is led directly as far as possible, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.; The components and parts tip-off that individual influences wiring board on the edge of wiring board is fixing is extractd, made wiring board have the every limit of two opposite side to have the margin of the wide no components and parts of 2-3mm at least;
Individual metablocks device tip-off on the wiring board edge is extractd, preferably, got two the shortest opposite side of opposite side distance on the wiring board, make its every limit have the margin of the wide no components and parts of 2-3mm at least.
2) wiring board adopts the fixture of band support bar to fix, or adopts the fixture of band support bar and compressing tablet to fix
The wiring board fixture of described employing support bar fixedly is: on a pedestal, be provided with two be parallel to each other, support bar that spacing is adjustable, the margin of wiring board is put on support bar, one of band placing components faces down, and an end of wiring board leaned against on the wiring board barrier structure that is provided with on the support bar, skid off to the direction that is provided with barrier structure along support bar to stop wiring board;
The fixture of described employing band support bar and compressing tablet fixedly is: on a pedestal, be provided with two be parallel to each other, support bar that spacing is adjustable, the margin of wiring board is put on support bar, one facing down of band placing components is provided with on the every support bar and has certain flexible compressing tablet more than 1 or 1 and push down wiring board;
3) determine the mode of heating and the thermal treatment zone of wiring board device for disassembling, set the heating-up temperature of the thermal treatment zone, implement heating according to the scolding tin of prejudging (soldering paste) melting temperature
Described mode of heating adopts gas medium thermal convection mode to heat or infrared radiation and thermal convection and heat with mode;
When adopting described gas medium thermal convection mode to heat, 1 or 1 above hot blast import are set, or and increase an even heat plate again in below the hot blast import and the space between above the wiring board, wiring board is heated evenly;
Described even heat plate is a metallic plate that has many through-hole structures.
The described thermal treatment zone is set to preheat two districts in the district and the melts soldering tin thermal treatment zone or the described thermal treatment zone only is provided with a heat tracing zone;
In the described district that preheats, wiring board is implemented heating, wiring board rises to 140～160 ℃ and insulation gradually from room temperature in 2～3 minutes time;
In the described melts soldering tin thermal treatment zone, wiring board is implemented heating, wiring board temperature in 0.5～2 minute time rises to 195～240 ℃ and insulation from 140～160 ℃ rapidly; Wiring board keeps the time above the scolding tin melting temperature in the melts soldering tin thermal treatment zone be 0.5～3 minute, and scolding tin is fully melted;
At described heat tracing zone, wiring board is implemented heating, wiring board temperature in 2.5～4 minutes time rises to 195～240 ℃ and insulation from room temperature; Wiring board surpasses the scolding tin melting temperature in heat tracing zone time is 0.5～3 minute, and scolding tin is fully melted.
4) adopting the length of spring compressed mode is the impact bar accumulation of energy, and impact bar is by connected point type impact structure or bar shaped impact structure or face shape impact structure on circuit board for contact impact
The accumulation of energy of described length of spring compressed mode adopts the mode of rotating cam to promote the impact bar motion by straight pin, makes length of spring compressed and accumulation of energy, and the cam revolution moves a week, and spring is compressed once, and each decrement is identical;
Perhaps on the basis of described employing rotating cam mode, adopt many lifts cam, it is characterized in that, the cam revolution moves a week, and spring will be compressed repeatedly, and decrement increases successively at every turn, thereby realizes the impact energy of increase successively;
Perhaps on the basis of described employing rotating cam mode, adopt two cams to be distributed in the impact bar both sides that spring is housed, make the impact bar stress equalization;
Described impact structure adopts the point type impact structure, is the impact structure that is made of shock point the little plane of some surface areas or curved surface (such as the end of the rod-like articles in various cross sections);
Perhaps described impact structure adopts the bar shaped impact structure, is the impact structure that is made of shock surface or some strip faces;
Perhaps described impact structure adopts face shape impact structure, is the impact structure that is made of shock surface the plane in the big zone of one or more areas;
Described contact impact be described point type impact structure or described bar shaped impact structure or described shape impact structure under the promotion of impact bar, directly impact the wiring board substrate surface, perhaps impact the number of pins top of placing components on the wiring board;
5) adopt purging device or sweep curette and purge or sweep the scolding tin of scraping the wiring board upper surface
Described purging device is installed in that wiring board moves ahead or the top of removing direction, and the hot-air that blows out from the purging device tuyere purges the scolding tin of wiring board upper surface to the opposite direction of wiring board moving direction, scolding tin is split away off from the wiring board substrate;
The described curette of sweeping is installed in that wiring board moves ahead or the top of removing direction, described sweep to be equipped with on the curette have certain flexible sweeping and scrape pin, sweep scraping article or sweep scraping blade; Sweep curette and rotate, sweeping on it scrape pin, sweep scraping article or sweep scraping blade and the scolding tin of wiring board upper surface is swept to the opposite direction of wiring board moving direction scraped, and scolding tin is split away off from the wiring board substrate;
Described purging device tuyere be one have with wiring board before the suitable long narrow slot structure of line direction cross-section width dimension, perhaps form side by side by row's pipe, the line direction cross-section width dimension is suitable before its width and the wiring board, is convenient to form enough blast or wind speed.
Employing collects components and parts and the scolding tin that splits away off by the elasticity guipure of vibrator exciting, scolding tin is realized enrichment and is come off from components and parts on the elasticity guipure of vibration, and falling into the dish that collects below the elasticity guipure by the guipure hole, components and parts then are retained on the elasticity guipure;
Described elasticity guipure has many through-hole structures, and liquid solder splashes or solid-state scolding tin granule can pass through these holes, and components and parts can not pass through;
The upper surface of described elasticity guipure is level and smooth, helps the accessible slip of components and parts thereon;
Described elasticity guipure moves or maintains static;
6) adopt air draft or vacuum suction apparatus to be collected in step 3)～6) flue gas that produces in the process, discharge after concentrated harmless treatment; Wiring board substrate and fixture thereof shift out the thermal treatment zone with transport sector, perhaps take out by manually operated unloading device, or artificial directly taking-up; Through natural cooling or blow cold wind, separated circuit boards substrate and components and parts are reduced to below 120～80 ℃ gradually; To the letter sorting of classifying of wiring board substrate and components and parts.
The invention provides also a kind of contact that adopts and impact the method that wiring board is disassembled, this method may further comprise the steps:
1) removes the components and parts that snapping, straight cutting, non-welding manner such as be threaded connect; Placing components pin to be extractd on the wiring board is led directly as far as possible, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.;
2) wiring board is by the fixture support fixation that adopts strong point mode;
The fixture of described employing strong point mode is characterized in that, arranges the support pillar of 4 or 4 above adjustable positions on the pedestal of a fenestral fabric; The pedestal of fenestral fabric both can allow the components and parts and the scolding tin that come off from wiring board pass through, and provided support the basis for supporting the pillar cone again simultaneously.Wiring board is placed on these supports on pillars, one of band placing components faces down, and the direction of the blank structure of length is consistent as far as possible and on the pedestal for the direction of extension of longer components and parts on the wiring board, is convenient to these components and parts and can passes pedestal and fall; Adjust to support the position of pillar, the tip of supporting pillar is withstood on the wiring board substrate rather than components and parts or its pin between the components and parts.And 2 or 2 above gear pillars are set at pedestal one end, slide to the direction that is provided with the gear pillar to stop wiring board.
3) determine the mode of heating and the thermal treatment zone of wiring board device for disassembling, set the heating-up temperature of the thermal treatment zone, implement heating according to the scolding tin of prejudging (soldering paste) melting temperature
Described mode of heating adopts gas medium thermal convection mode to heat or adopts infrared radiation and thermal convection and heat with mode;
When adopting the thermal convection mode of described gas medium to heat, 1 or 1 above hot blast import are set, or and increase an even heat plate again in below the hot blast import and the space between above the wiring board, wiring board is heated evenly; Even heat plate is a metallic plate that has many through-hole structures.
The described thermal treatment zone is set to preheat two districts in the district and the melts soldering tin thermal treatment zone or the described thermal treatment zone only is provided with a heat tracing zone;
In the described district that preheats, wiring board is implemented heating, wiring board rises to 140～160 ℃ and insulation gradually from room temperature in 2～3 minutes time;
In the described melts soldering tin thermal treatment zone, wiring board is implemented heating, wiring board temperature in 0.5～2 minute time rises to 195～240 ℃ and insulation from 140～160 ℃ rapidly; Wiring board keeps the time above the scolding tin melting temperature in the melts soldering tin thermal treatment zone be 0.5～3 minute, and scolding tin is fully melted;
Perhaps at described heat tracing zone, wiring board is implemented heating, wiring board temperature in 2.5～4 minutes time rises to 195～240 ℃ and insulation from room temperature; Wiring board surpasses the scolding tin melting temperature in heat tracing zone time is 0.5～3 minute, and scolding tin is fully melted.
4) adopting the length of spring compressed mode is the impact bar accumulation of energy, and impact bar is by connected point type impact structure or bar shaped impact structure or face shape impact structure on circuit board for contact impact
The accumulation of energy of described length of spring compressed mode adopts the mode of rotating cam to promote the impact bar motion by straight pin, makes length of spring compressed and accumulation of energy, and the cam revolution moves a week, and spring is compressed once, and each decrement is identical;
Perhaps on the basis of described employing rotating cam mode, adopt many lifts cam, it is characterized in that, the cam revolution moves a week, and spring will be compressed repeatedly, and decrement increases successively at every turn, thereby realizes the impact energy of increase successively;
Perhaps on the basis of described employing rotating cam mode, adopt two cams to be distributed in the impact bar both sides that spring is housed, make the impact bar stress equalization;
Described impact structure adopts the point type impact structure: the impact structure that is made of shock point the little plane of some surface areas or curved surface (such as the end of the rod-like articles in various cross sections);
Perhaps described impact structure adopts the bar shaped impact structure: the impact structure that is made of shock surface or some strip faces;
Perhaps described impact structure adopts face shape impact structure: the impact structure that is made of shock surface the plane in the big zone of one or more areas;
Described contact impact be described point type impact structure or described bar shaped impact structure or described shape impact structure under the promotion of impact bar, directly impact the wiring board substrate surface, perhaps impact the number of pins top of placing components on the wiring board.
5) adopt purging device or sweep curette and purge or sweep the scolding tin of scraping the wiring board upper surface
Described purging device is installed in that wiring board moves ahead or the top of removing direction, and the hot-air that blows out from the purging device tuyere purges the scolding tin of wiring board upper surface to the opposite direction of wiring board moving direction, scolding tin is split away off from the wiring board substrate;
The described curette of sweeping is installed in that wiring board moves ahead or the top of removing direction, described sweep to be equipped with on the curette have certain flexible sweeping and scrape pin, sweep scraping article or sweep scraping blade.Sweep curette and rotate, sweeping on it scrape pin, sweep scraping article or sweep scraping blade and the scolding tin of wiring board upper surface is swept to the opposite direction of wiring board moving direction scraped, and scolding tin is split away off from the wiring board substrate;
Described purging device tuyere be one have with wiring board before the suitable long narrow slot structure of line direction cross-section width dimension, perhaps form side by side by row's pipe, the line direction cross-section width dimension is suitable before its width and the wiring board, is convenient to form enough blast or wind speed.
Employing collects components and parts and the scolding tin that splits away off by the elasticity guipure of vibrator exciting, scolding tin is realized enrichment and is come off from components and parts on the elasticity guipure of vibration, and falling into the dish that collects below the elasticity guipure by the guipure hole, components and parts are then stayed on the elasticity guipure;
Described elasticity guipure has many through-hole structures, and liquid solder splashes or solid-state scolding tin granule can pass through these holes, and components and parts can not pass through;
The upper surface of described elasticity guipure is level and smooth, helps the accessible slip of components and parts thereon;
Described elasticity guipure has and moves with wiring board or removing direction is consistent or become the motion of fixed angle; Perhaps described elasticity guipure maintains static;
6) adopt air draft or vacuum suction apparatus to be collected in step 3)～6) flue gas that produces in the process, discharge after concentrated harmless treatment; Wiring board substrate and fixture thereof shift out the thermal treatment zone with transport sector, perhaps take out by manually operated unloading device, or artificial directly taking-up; Through natural cooling or blow cold wind, separated circuit boards substrate and components and parts are reduced to below 120～80 ℃ gradually; To the letter sorting of classifying of wiring board substrate and components and parts.
Method one provided by the present invention, method two are applicable to the wiring board of disassembling the one-side band components and parts.
According to method provided by the present invention, the present invention also provides the realization equipment with components and parts harmless dismounting (or excision) globality, that reclaim based on function from the waste printed circuit board.
Adopt contact to impact the equipment that wiring board is disassembled, this equipment comprises impact bar 2; Compression spring 3; Pin 4; Many lifts cam 5; Rotation axis 7; Chain 11; Elasticity guipure 13; Purging device 15; Vibration generator 17; Electric heating tube 18; Scolding tin catch tray 19; Stopper 20; Preheat district 21; The melts soldering tin thermal treatment zone 22; Fan 23; Heat insulation cord 25; The fixture 31 of support bar mode; Top board 45; Supporting guide 46; Bar shaped impact structure 47; Body of wall 51;
Adopt the wiring board fixture 31 of support bar mode, perhaps adopt the wiring board fixture 38 of support bar and compressing tablet mode, perhaps adopt the wiring board fixture 26 of strong point mode to slip into and to pass along supporting guide 46 and preheat district 21 and the melts soldering tin thermal treatment zone 22 with conveyer chain 11;
Setting preheats the district 21 and the melts soldering tin thermal treatment zone 22, fan 23 is installed on two thermal treatment zone top boards 45 or side strengthens thermal convection, the top and the bottom of chain 11 are furnished with electric heating tube 18 in two thermals treatment zone, wherein the right lower quadrant electric heating tube 18 of the melts soldering tin thermal treatment zone 22 is arranged along chain 11 directions, and the electric heating tube 18 of other position is along arranging with chain 11 horizontal vertical directions;
At the lower disposed elasticity guipure 13 of the melts soldering tin thermal treatment zone 22, the bottom of elasticity guipure 13 is provided with scolding tin catch tray 19, and the upside of elasticity guipure 13 or downside are provided with vibration generator 17, in order to 13 vibrations of excitation elasticity guipure.
The present invention also provides a kind of contact that adopts to impact the equipment that wiring board is disassembled, and it is characterized in that this equipment comprises impact bar 2; Compression spring 3; Pin 4; Cam 6; Rotation axis 7; Components and parts 9; Scolding tin 10; Guide rail 12; Metal mesh belt 14; Sweep curette 16; Vibration generator 17; Scolding tin catch tray 19; High temperature airduct 24; Heat insulation cord 25; The fixture 26 of strong point mode; Point type impact structure 42; Top board 45; Heat tracing zone 54; Many imports heating box 55; Hot blast import 56; Temperature sensor 57; Components and parts collecting box 58;
The position is provided with temperature sensor 57 near the circuit board fixer in heat tracing zone 54; Heat tracing zone 54 by high temperature airduct 24, is introduced outside hot blast from the hot blast import 56 that many imports heating box 55 end faces are provided with, wiring board 1 and fixture thereof are taked to blow from the top down the hot blast heating; High temperature airduct 24 links to each other with hot air source, and hot air source can be located at wiring board and disassemble the last or setting separately of equipment;
Near the outlet of the right side of this equipment, be provided with and sweep curette 16 or purging device 15;
On this equipment, the bottom of heat tracing zone 54, arrange elasticity guipure 14, the bottom of elasticity guipure 14 is provided with scolding tin catch tray 19, the upside of elasticity guipure 14 or downside are provided with vibration generator 17, in order to 14 vibrations of excitation elasticity guipure; The right end of elasticity guipure 14 is provided with components and parts collecting box 58.
Adopt wiring board disassembling method provided by the present invention and disassemble equipment, can improve placing components and paster components and parts efficient from wiring board dismounting (or excision), and can guarantee the function integrity and the apparent size integrity of institute's dismounting components and parts, realize effectively separating and collecting of components and parts and scolding tin, improve the operating environment condition, prevent that effectively the wiring board unloading process may pollution on the environment.
Description of drawings
Fig. 1: the flow chart of the inventive method one.
Fig. 2: the flow chart of the inventive method two.
Fig. 3: a kind of wiring board device for disassembling of the present invention schematic diagram.
Fig. 4: the another kind of wiring board of the present invention is disassembled the equipment schematic diagram.
Fig. 5: the wiring board fixture schematic diagram of band support bar.
Fig. 6: the wiring board fixture schematic diagram of band support bar and compressing tablet.
Fig. 7: adopt strong point mode to support the fixture schematic diagram of wiring board.
Fig. 8: adopt length of spring compressed mode accumulation of energy theory structure schematic diagram.
Fig. 9: adopt the point type impact structure to implement the structural representation that contact is impacted.
Figure 10: adopt the bar shaped impact structure to implement the structural representation that contact is impacted.
Figure 11: adopt face shape impact structure to implement the structural representation that contact is impacted.
Figure 12: purging device structural representation.
Figure 13: purging device contour structures axle geodesic structure schematic diagram.
Figure 14: many imports heating box structural representation.
Figure 15: many imports heating box structural representation of band even heat plate.
Figure 16: metal mesh belt structural representation.
Embodiment
Below by embodiment the present invention is described.
Fig. 1 is the flow chart of the inventive method one.Adopt contact to impact the method that wiring board is disassembled, this method may further comprise the steps:
1) gets the old circuit board (hereinafter to be referred as wiring board) of one-side band components and parts,, wiring board is carried out cleanings such as dedusting, decontamination dirt as computer motherboard; The components and parts that non-welding manner such as remove snapping, straight cutting, be threaded connects; Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.; Get two the shortest opposite side of opposite side distance on the wiring board, indivedual components and parts tip-ofves on the wiring board are extractd, make its every limit have the margin of the wide no components and parts of 2-3mm at least;
2) adopt the support bar mode to support wiring board: on a pedestal, be provided with two be parallel to each other, support bar that spacing is adjustable, the margin of wiring board is put on support bar, one of band placing components faces down, and an end of wiring board leaned against on the wiring board barrier structure that is provided with on the support bar, skid off to the direction that is provided with barrier structure along support bar to stop wiring board;
3) mode of heating of wiring board device for disassembling adopts infrared radiation and thermal convection and heats with mode; Be set to preheat district and two districts, the melts soldering tin thermal treatment zone; Set the heating-up temperature of the thermal treatment zone according to the scolding tin of prejudging (soldering paste) melting temperature; In the described district that preheats, wiring board is implemented heating, wiring board rises to 140～160 ℃ and insulation gradually from room temperature in 2～3 minutes time; In the described melts soldering tin thermal treatment zone, wiring board is implemented heating, wiring board temperature in 0.5～2 minute time rises to 195～240 ℃ and insulation from 140～160 ℃ rapidly; Wiring board keeps the time above the scolding tin melting temperature in the melts soldering tin thermal treatment zone be 0.5～3 minute, and scolding tin is fully melted;
4) after scolding tin fully melts, adopt the mode of rotating many lifts cam, promote the impact bar motion by straight pin, make length of spring compressed and accumulation of energy; Many lifts cam revolution moves a week, and spring will be compressed 3 times, and decrement increases successively at every turn, thereby realizes the impact energy of increase successively; Impact bar provides enough and suitable impact energy for the bar shaped impact structure, to circuit board for contact impact, impact is applied to the number of pins top of wiring board upper surface of base plate and placing components, the components and parts and the scolding tin of wiring board lower surface are come off, be positioned at components and parts and the scolding tin and the wiring board disengaging of wiring board upper surface;
5) adopt purging device to purge the scolding tin of wiring board upper surface
Wiring board move ahead or removing direction above, purging device is installed, the hot-air that purging device blows out purges the scolding tin of the wiring board upper surface opposite direction to the wiring board moving direction, and components and parts and scolding tin are split away off from the wiring board substrate;
The direction that purging device blows out hot-air move ahead with wiring board or removing direction relative, become 150 °～170 ° angle.The tuyere of purging device is a structure with the suitable slit of the preceding line direction cross sectional dimensions of 2～10mm height, width and wiring board.The purging device wind nozzle outlet is 20～80mm to the vertical range of wiring board upper surface.Temperature when hot-air is blown into PCB surface is at 195～240 ℃, scolding tin that its blast or wind speed enough adhere to upper surface and the components and parts of having thrown off the PCB surface of blowing off, and split away off from the wiring board substrate; Wiring board is being implemented impact and is being purged in the process of scolding tin, and components and parts and scolding tin come off, and fall following one and have on certain elasticity guipure.The elasticity guipure is by the vibrator exciting, make scolding tin in vibration, realize enrichment and come off, liquid solder splashes or solid-state scolding tin granule fall into the dish that collects below the elasticity guipure by the guipure hole, and components and parts then are retained on the elasticity guipure, realize that components and parts separate with scolding tin; The elasticity guipure has the motion that becomes fixed angle with the wiring board moving direction, and the upper surface of elasticity guipure keeps level;
6) adopt air exhausting device to be collected in step 3)～6) flue gas that produces in the process, discharge after concentrated harmless treatment; Wiring board and fixture thereof shift out the thermal treatment zone with transport sector; By blowing cold wind, separated circuit boards substrate and components and parts are reduced to below 120～80 ℃ gradually; The wiring board substrate is taken off from fixture,, carry out scolding tin and collect, finish on the wiring board globality of components and parts and disassemble and extract the components and parts letter sorting of classifying.
Fig. 2 is the flow chart of the inventive method two.Adopt contact to impact the method that wiring board is disassembled, this method may further comprise the steps:
1) gets the old circuit board (hereinafter to be referred as wiring board) of one-side band components and parts,, wiring board is carried out cleanings such as dedusting, decontamination dirt as computer motherboard; The components and parts that non-welding manner such as remove snapping, straight cutting, be threaded connects; Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.;
2) adopt strong point mode to support wiring board: the support pillar of on the pedestal of a fenestral fabric, arranging 4 or 4 above adjustable positions; The pedestal of fenestral fabric both can allow the components and parts and the scolding tin that come off from wiring board pass through, and provided support the basis for supporting the pillar cone again simultaneously.Wiring board is placed on these supports on pillars, one of band placing components faces down, and the direction of the blank structure of length is consistent as far as possible and on the pedestal for the direction of extension of longer components and parts on the wiring board, is convenient to these components and parts and can passes pedestal and fall; Adjust to support the position of pillar, the tip of supporting pillar is withstood on the wiring board substrate rather than components and parts or its pin between the components and parts.At pedestal one end 2 or 2 above gear pillars are set, slide to the direction that is provided with the gear pillar to stop wiring board.
3) mode of heating of wiring board device for disassembling adopts the thermal convection mode of air dielectric to heat; District of heat tracing zone is set; Set the heating-up temperature of heat tracing zone according to the scolding tin of prejudging (soldering paste) melting temperature; 4 hot blast imports are set, wiring board is heated evenly; Wiring board is implemented heating, and wiring board temperature in 2.5～4 minutes time rises to 195～240 ℃ and insulation from room temperature; Wiring board surpasses the scolding tin melting temperature in heat tracing zone time is 0.5～3 minute, and scolding tin is fully melted.
4) after scolding tin fully melts, adopt the mode of rotating cam, promote the impact bar motion by straight pin, make length of spring compressed and accumulation of energy, the cam revolution moves a week, and spring is compressed once, and each decrement is identical; In the impact bar both sides cam that shape is identical, phase place is identical is installed respectively, is made the impact bar stress equalization; Impact bar provides enough and suitable impact energy for the point type impact structure, to circuit board for contact impact, impact is applied to the number of pins top of wiring board upper surface of base plate and placing components, the components and parts and the scolding tin of wiring board lower surface are come off, and the scolding tin and the wiring board that are positioned at the wiring board upper surface break away from;
5) wiring board move ahead or removing direction above, be equipped with and sweep curette, sweep to be equipped with on the curette and have certain flexible scraping blade of sweeping.Sweep curette and rotate, the scraping blade of sweeping on it is swept the scolding tin of wiring board upper surface and is scraped to the opposite direction of wiring board moving direction, scolding tin is split away off from the wiring board substrate; Wiring board is being implemented impact and is being swept in the process of scraping scolding tin, and components and parts and scolding tin come off, and fall following one and have on certain elasticity guipure.The elasticity guipure is by the vibrator exciting, make scolding tin in vibration, realize enrichment and come off, liquid solder splashes or solid-state scolding tin granule fall into the dish that collects below the elasticity guipure by the guipure hole, and components and parts then are retained on the elasticity guipure, realize that components and parts separate with scolding tin; The elasticity guipure maintains static, and moves or removing direction declivity gradually along wiring board.
6) adopt air exhausting device to be collected in step 3)～6) flue gas that produces in the process, discharge after concentrated harmless treatment; Wiring board and fixture thereof are taken out by manually operated unloading device; Through natural cooling, separated circuit boards substrate and components and parts are reduced to below 120～80 ℃ gradually; The wiring board substrate is taken off from fixture,, carry out scolding tin and collect, finish on the wiring board globality of components and parts and disassemble and extract the components and parts letter sorting of classifying.
Fig. 3 is a kind of wiring board device for disassembling of the present invention schematic diagram.This device for disassembling adopts support bar mode fixing circuit board, the thermal treatment zone is divided into preheating to be distinguished and two districts, the melts soldering tin thermal treatment zone, the many lifts cam mechanism, spring energy-storage mode and the face shape impact structure that adopt impact energy to increase gradually, wiring board to the band components and parts carries out the contact impact, adopt purging device to carry out the purging of components and parts and scolding tin, adopt the metal mesh belt of horizontal movement to carry out separating and collection of components and parts and scolding tin, thereby realize that placing components and paster components and parts are extractd based on the globality of function on the wiring board.This device for disassembling can be dismantled the wiring board of one-side band components and parts.
For the convenience of narrating, the method step of disassembling processing according to wiring board is described the method and the basic structure of device for disassembling below.
1) wiring board preliminary treatment
At first wiring board is carried out cleanings such as dedusting, decontamination dirt, and remove snapping, straight cutting, components and parts that non-welding manner such as be threaded connects, then will be individually may influence the fixing components and parts tip-off of wiring board and extract (if any), and make the shortest every limit of two opposite side of opposite side distance on the wiring board have the margin of the wide no components and parts of 2-3mm at least; Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.
2) fixing circuit board
A pedestal 32 is set, and each fixedly connected support 36 of the two ends of pedestal 32 has sliding tray 37 on the support 36.33, two support bars of two support bars that are parallel to each other 33 are set on support 36 are connected with two supports 36, and can on sliding tray 37, slide, adapt to the wiring board of the different size of packing into to adjust spacing by bolt, wing nut 35.The supporting surface width of support bar 33 is 5mm, and ledge structure 34 is made in its supporting surface rear end, slides backward in subsequent method step " components and parts and scolding tin are swept and scraped " in order to stop wiring board 1.
Adjust the spacing between two support bars 33, the margin of the wiring board 1 of one-side band components and parts is put on the supporting surface of support bar 33, one of band components and parts face down.
3) implement heating
Setting preheats district 21 and 22 two districts, the melts soldering tin thermal treatment zone.All adopt infrared radiation and thermal convection two thermals treatment zone and heat with mode.The medium of thermal convection adopts air.Infrared radiation adopts quartz electric heating pipe 18, and quartz electric heating pipe 18 and fan 23 are adopted in thermal convection.Temperature sensor is set to be controlled following temperature.
(1) preheats
(2) melts soldering tin heating
Set the heating-up temperature of the melts soldering tin thermal treatment zone in advance according to scolding tin (soldering paste) melting temperature of judging in " wiring board preliminary treatment ".
4) implement to impact
After scolding tin fully melts, adopt many lifts cam 5---accumulation of energy of spring 3 mechanisms and enforcement are impacted.Fig. 8 adopts length of spring compressed mode accumulation of energy theory structure schematic diagram.Rotation axis 7 is being with many lifts cam 5 to clockwise rotate, and many lifts cam 5 acts on the pin 4 of impact bar 2, and impact bar 2 and pin 4 are risen, and compresses spring 3 and accumulation of energy.When many lifts cam 5 turned over a bossing, under the effect of spring 3, impact bar 2 moved downward rapidly, for bar shaped impact structure 47 provides momentum.Because the height of three bossings is different on many lifts cam 5, to rotate in all processes at rotation axis 7, three decrements of spring 3 increase successively, thereby realize the impulsive force of increase successively.
Lower end at impact bar 2 connects bar shaped impact structure 47, and bar shaped impact structure 47 is the structures that are made of some strip rectangular blocks 48, as shown in figure 10.(Fig. 9 adopts the point type impact structure to implement the structural representation that contact is impacted.Figure 10 adopts the bar shaped impact structure to implement the structural representation that contact is impacted.Figure 11 is that employing face shape impact structure is implemented the structural representation that contact is impacted.) when wiring board was implemented to impact, the bottom surface of bar shaped impact structure 47 acted on the part pin of wiring board substrate 8 and placing components.Bar shaped impact structure 47 both can have been realized the impact to wiring board 1, did not hinder the heating of wiring board again.
5) components and parts are swept with scolding tin and are scraped, separate and collect
After the enforcement impact was finished, under Artificial Control, stopper 20 was removed, and wiring board 1 and fixture 31 thereof continue right laterals with chain 11.Near the outlet of 22 the right, the melts soldering tin thermal treatment zone, a purging device 15 is arranged directly over the wiring board moving direction, purging device 15 concerns referring to Figure 12 with the position of wiring board 1 and fixture 31 thereof.The blow-off direction that purging device 15 blows out hot-air moves ahead with wiring board 1 or removing direction becomes 165 ° angle, and the vertical range that the tuyere 52 of purging device 15 exports to wiring board substrate 8 upper surfaces is 20mm.The contour structures of purging device 15 as shown in figure 13, purging device tuyere 52 is the structures with 4mm height, the wide slit of 300mm, for ease of the installing and locating of purging device 15 on 22 heat insulation walls 51 of the melts soldering tin thermal treatment zone, the profile of the extension 53 of purging device 15 is made rectangular cross section structure.
Purging device blows out 210～220 ℃ hot-air, the scolding tin 10 of wiring board substrate 8 upper surfaces adhesion and the components and parts 9 of having thrown off is purged to the opposite direction of wiring board 1 motion, and split away off from wiring board substrate 8.
Sweep and scrape in two method steps wiring board 1 being implemented impact, components and parts and scolding tin, all have components and parts 9 and scolding tin 10 to come off.Components and parts 9 that split away off and scolding tin 10 are fallen one of 22 bottom, the melts soldering tin thermal treatment zone and are had on certain flexible metal mesh belt 13.Metal mesh belt 13 is by vibrating device 17 excitings, make scolding tin 10 in vibration, realize enrichment and come off, liquid solder splashes or solid-state scolding tin granule 10 fall into by the guipure hole and collect dish 19 below the metal mesh belt, and 9 of components and parts are retained on the metal mesh belt 13, realize that components and parts separate with scolding tin.
(Figure 12 is the purging device structural representation to the surface configuration of metal mesh belt 13 as shown in figure 16.Figure 13 is that purging device contour structures axle is surveyed schematic diagram.Figure 14 is many imports heating box structural representation.Figure 15 is many imports heating box structural representation of band even heat plate.Figure 16 metal mesh belt structural representation.), on the sheet metal 61 that a width is 500mm, being equipped with the through hole 62 about many diameter phi 10mm, sheet metal thickness is at 1～2mm.
6) reprocessing
Adopt air exhausting device to be collected in the flue gas that produces in the above process, after concentrating harmless treatment, discharge.
The wiring board fixture continues to move ahead with conveyer chain 11, passes heat insulation cord 25 and leaves the melts soldering tin thermal treatment zone 22.By blowing cold wind and natural cooling, separated circuit boards substrate and components and parts are reduced to below 100 ℃ gradually.The wiring board substrate is taken off from fixture,, carry out scolding tin and collect, finish on the wiring board integral body of components and parts and disassemble and extract the components and parts letter sorting of classifying.
Fig. 4 is the another kind of wiring board device for disassembling of a present invention schematic diagram.This is disassembled equipment and adopts strong point mode fixing circuit board, a heat tracing zone is set, adopt cam mechanism, spring energy-storage mode and bar formula impact structure, employing is swept curette and is carried out sweeping of components and parts and scolding tin and scrape, the metal mesh belt that employing is obliquely installed carries out separating and collection of components and parts and scolding tin, and placing components and paster components and parts are extractd based on the globality of function on the realization wiring board.This disassembles the wiring board that equipment both can have been dismantled the one-side band components and parts, also can dismantle the wiring board of one-side band components and parts.
For the convenience of narrating, the method step of disassembling processing according to wiring board is described method and the basic structure of disassembling equipment below.
1) wiring board preliminary treatment
At first wiring board is carried out cleanings such as dedusting, decontamination dirt, the components and parts that remove snapping, straight cutting then, non-welding manner such as be threaded connect; Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate; Roughly differentiate the melting temperature of the used scolding tin of wiring board (soldering paste) according to the type of wiring board substrate, the model of components and parts etc.
2) fixing circuit board
Adopt wiring board fixture 26 to support wiring board.The structural representation of fixture 26 is referring to Fig. 7.Fixture 26 adopts strong point mode to support wiring board.
A latticed pedestal 27 is set, is formed by connecting by some square-sections bar, be convenient to like this can pass on the wiring board 1 from the heat of below, wiring board 1 installation site, the less components and parts of the size that disassembles can pass latticed pedestal 27 and fall.Arrange the break-through aperture 28 that several rules is arranged on the latticed pedestal 27.Can insert conicle or step cylinder (be called and support pillar) 29 in the break-through aperture 28.Insert the identical support pillar 29 of length in 3 of latticed pedestal 27 or 3 above apertures, wiring board 1 is placed on these again and supports on pillars 29, one of band components and parts face down.Put into different aperture 28 and adjust the position that these support pillars 29 by supporting pillar 29, make the tip of supporting pillar 29 withstand on the wiring board substrate 8 between the components and parts rather than withstand on components and parts 9 or its pin on.At latticed pedestal 27 1 ends 2 paxillas are set, are called gear pillar 30, in " components and parts and scolding tin are swept and scraped " process, move backward in order to stop wiring board.The length of gear pillar 30 is than supporting pillar 29 long 3～5mm.
3) implement heating
A heat tracing zone 54 is set.Adopt the thermal convection mode to heat.The medium of thermal convection adopts air, and hot-air is introduced through the hot blast import 56 of many imports heating box 55 from air-heater (not shown Fig. 4) by high temperature airduct 24.The temperature that 57 pairs of heat tracing zones 54 of temperature sensor are set is controlled.Heat tracing zone 54 be in the relieving attachment on import heating box 55 at the most, down to the heat affected zone between metal mesh belt 14 and the scolding tin catch tray 19.
Set the heating-up temperature of the melts soldering tin thermal treatment zone in advance according to scolding tin (soldering paste) melting temperature of judging in " wiring board preliminary treatment ".
The structure of described many imports heating box 55 as shown in figure 14.2 or 2 above hot blast imports 56 are set on many imports heating box 55, wiring board 1 is heated evenly.
4) implement to impact
After scolding tin fully melts, adopt cam 6---accumulation of energy of spring 3 mechanisms and enforcement are impacted.As shown in Figure 8, rotation axis 7 is being with cam 6 to clockwise rotate, and cam 6 acts on the pin 4 of impact bar 2, and impact bar 2 and pin 4 are risen, and compresses spring 3 and accumulation of energy.When cam 6 turns over its bossing, under the effect of spring 3, impact bar 2 provides suitable momentum for point type impact structure 42, point type impact structure 42 acts on the part pin of the upper surface of wiring board substrate 8 and placing components, to circuit board for contact impact, components and parts and scolding tin are come off.The number of times that wiring board is implemented to impact can be once also can be continuous several times.
Described impact structure is a point type impact structure 42, as shown in Figure 9.2 groups of impact blocks 44 are installed on impact frame 43, and every group of impact block 44 comprises two shock points; 2 groups of impact blocks 44 be arranged in parallel, and spacing is according to the width-adjustable of wiring board.Impact bar 2 passes the prolongation extending area of impact frame 43 also as a shock point, and the lower surface of shock point is concordant on its lower surface and the impact block 44.During impact, more than the lower surface of 5 shock points act on the upper surface of wiring board substrate 8.Point type impact structure 42 both can have been realized impacting, and did not hinder the heating of wiring board again.
5) components and parts are swept with scolding tin and are scraped, separate and collect
After the enforcement impact is finished, under manual operation, wiring board fixture 26 is pulled out to the right along guide rail 12.Near the outlet of heat tracing zone 54, there is one directly over the wiring board moving direction and sweeps curette 16, sweep curette 16 and clockwise rotate, on it scrape pin and the components and parts 9 of wiring board upper surface and scolding tin 10 are moved to sweep in the other direction to wiring board scrape with sweeping, and split away off from wiring board substrate 8.
Sweep and scrape in two method steps wiring board 1 being implemented impact, components and parts and scolding tin, all have components and parts 9 and scolding tin 10 to come off.Components and parts 9 that split away off and scolding tin 10 are fallen one of heat tracing zone 54 bottom and are had on certain flexible metal mesh belt 14.Metal mesh belt 14 is by vibrating device 17 excitings, make scolding tin 10 in vibration, realize enrichment and come off, liquid solder splashes or solid-state scolding tin granule 10 fall into by the guipure hole and collect dish 19 below the metal mesh belt, and 9 of components and parts are retained on the metal mesh belt 14, realize that components and parts separate with scolding tin.
The upper surface of metal mesh belt 14 along wiring board move or removing direction downward-sloping gradually.The surface configuration of metal mesh belt 14 is equipped with the through hole 62 about many diameter phi 10mm as shown in figure 16 on the sheet metal 61 that a width is 500mm, sheet metal thickness is at 2～3mm.
6) reprocessing
Adopt air exhausting device to be collected in the flue gas that produces in the above process, after concentrating harmless treatment, discharge.
Embodiment 5 other with embodiment 3 or 4, adopt the wiring board fixture fixing circuit board of support bar and compressing tablet mode.
A pedestal 32 is set, and a support 36 is respectively established at the two ends of pedestal 32, respectively has a sliding tray 37 on each support 36.The upper support face of 39, two dihedral support bars 39 of two dihedral support bars of parallel placement is concordant on support 36, and width is 5mm, in order to place wiring board 1.Two dihedral support bars 39 are connected with two supports 36 by bolt, wing nut 35, and can slide on sliding tray 37 to adjust spacing, adapt to the wiring board of the different size of packing into.On each dihedral support bar 39, connect two elastic pressuring plates 40 by bolt, wing nut 35 again, in order to wiring board 1 is pressed on the dihedral support bar 39.
The margin on wiring board 1 both sides is partly put on the upper surface of dihedral support bar 39, and one of band components and parts face down.Adopt compressing tablet that it is pressed on the dihedral support bar 39.
Claims (5)
1, adopt contact to impact the method that wiring board is disassembled, it is characterized in that this method may further comprise the steps:
1) wiring board preliminary treatment
The components and parts that removal is connected with the wiring board substrate with snapping, straight cutting, the non-welding manner that is threaded;
The individual metablocks device tip-off of wiring board marginal portion is extractd, convenient fixing;
Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate;
Roughly differentiate the melting temperature of the used scolding tin/soldering paste of wiring board according to the type of wiring board substrate, the model of components and parts;
2) fixing step 1) pretreated wiring board
Wiring board adopts the fixture of band support bar to fix or adopts the wiring board fixture of band support bar and compressing tablet to fix;
The fixture of described employing support bar fixedly be meant on a pedestal, be provided with two be parallel to each other, support bar that spacing is adjustable, the margin of wiring board is put on support bar, one of band placing components faces down, and an end of wiring board leaned against on the wiring board barrier structure that is provided with on the support bar, skid off along the direction that support bar is provided with barrier structure to stop wiring board;
The wiring board fixture of described employing band support bar and compressing tablet is fixed as: a pedestal is set, on this pedestal, be provided with two be parallel to each other, support bar that spacing is adjustable, the margin of wiring board is put on support bar, one facing down of band placing components is provided with on the every support bar and has certain flexible compressing tablet more than 1 and push down wiring board;
3) to step 2) wiring board after fixing implements heating
Set heating-up temperature according to the scolding tin of prejudging/soldering paste melting temperature, wiring board is implemented to adopt the thermal convection mode of gas medium to heat or adopted infrared radiation and thermal convection and heat with mode; Make wiring board temperature in 2.5～4 minutes time rise to 195～240 ℃ and insulation from room temperature; The time that wiring board is heated above the scolding tin melting temperature is 0.5～3 minute, and scolding tin is fully melted;
This step is provided with two kinds of heat forms: preheat with melts soldering tin and heat; A kind of form perhaps only is set: heat tracing;
Described preheating refers to wiring board is implemented heating, and wiring board rises to 140～160 ℃ and insulation gradually from room temperature in 2～3 minutes time;
Described melts soldering tin heating is that wiring board is implemented heating, and wiring board temperature in 0.5～2 minute time rises to 195～240 ℃ and insulation from 140～160 ℃ rapidly; Wiring board keeps the time above the scolding tin melting temperature in the melts soldering tin thermal treatment zone be 0.5～3 minute, and scolding tin is fully melted;
Described heat tracing is that wiring board is implemented heating, and wiring board temperature in 2.5～4 minutes time rises to 195～240 ℃ and insulation from room temperature; Wiring board surpasses the scolding tin melting temperature in heat tracing zone time is 0.5～3 minute, and scolding tin is fully melted;
4) wiring board of the fixing heating of step 3) is implemented to impact
Cam---spring mechanism is the impact bar accumulation of energy in employing, and impact bar is by connected point type impact structure or bar shaped impact structure or face shape impact structure on circuit board for contact impact;
Single lift cam is adopted in described cam---spring mechanism accumulation of energy, and the cam revolution moves a week, and spring is compressed once, and each decrement is identical; Many lifts cam is adopted in perhaps described cam---spring mechanism accumulation of energy, and the cam revolution moves a week, and spring will be compressed repeatedly, and decrement increases successively at every turn, thereby realizes the impact energy of increase successively;
Described point type impact structure is meant the impact structure that constitutes shock point by little plane of some surface areas or curved surface;
Described bar shaped impact structure is meant the impact structure that is made of shock surface or some strip faces;
Described shape impact structure is meant that the plane by the big zone of an above area constitutes the impact structure of shock surface;
Described contact impact be described point type impact structure or described bar shaped impact structure or described shape impact structure under the promotion of impact bar, directly impact the wiring board substrate surface, perhaps impact the number of pins top of placing components on the wiring board;
5) sweeping of wiring board upper surface scolding tin scraped, separated and collect
Adopt purging device or sweep curette and purge or sweep the scolding tin of scraping the wiring board upper surface;
Described purging device is installed in that wiring board moves ahead or the top of removing direction, and the hot-air that blows out from the purging device tuyere purges the scolding tin of wiring board upper surface to the opposite direction of wiring board moving direction, scolding tin is split away off from the wiring board substrate;
Described purging device tuyere be one have with wiring board before the suitable long narrow slot structure of line direction cross-section width dimension, perhaps form side by side by row's pipe, the line direction cross-section width dimension is suitable before its width and the wiring board, is convenient to form enough blast or wind speed;
The described curette of sweeping is installed in that wiring board moves ahead or the top of removing direction, described sweep to be equipped with on the curette have certain flexible sweeping and scrape pin, sweep scraping article or sweep scraping blade; Sweep curette and rotate, sweeping on it scrape pin, sweep scraping article or sweep scraping blade and the scolding tin of wiring board upper surface is swept to the opposite direction of wiring board moving direction scraped, and scolding tin is split away off from the wiring board substrate;
Employing collects components and parts and the scolding tin that splits away off in the aforesaid operations step by the elasticity guipure of vibration generator exciting, scolding tin is realized enrichment and is come off from components and parts on the elasticity guipure of vibration, and falling into the dish that collects below the elasticity guipure by the guipure hole, components and parts then are retained on the elasticity guipure;
Described elasticity guipure has many through-hole structures, and liquid solder splashes or solid-state scolding tin granule can pass through these holes, and components and parts can not pass through;
6) reprocessing
Adopt air draft or vacuum suction apparatus to be collected in step 3)～6) flue gas that produces in the process, discharge after concentrated harmless treatment; Take out wiring board substrate and fixture thereof, cooling is to the letter sorting of classifying of wiring board substrate and components and parts.
2, adopt contact to impact the method that wiring board is disassembled, it is characterized in that this method may further comprise the steps:
1) wiring board preliminary treatment
The components and parts that removal is connected with the wiring board substrate with snapping, straight cutting, the non-welding manner that is threaded;
Placing components pin to be extractd on the wiring board is led directly, make it to be basically perpendicular to the wiring board substrate;
Roughly differentiate the melting temperature of the used scolding tin/soldering paste of wiring board according to the type of wiring board substrate, the model of components and parts;
2) fixing step 1) pretreated wiring board
Wiring board is by the fixture support fixation that adopts strong point mode;
The fixture support fixation of described employing strong point mode is a support pillar of arranging 4 above adjustable positions on the pedestal of a fenestral fabric; Wiring board is placed on these supports on pillars, one of band placing components faces down, and adjusts the position of supporting pillar, and the tip of supporting pillar is withstood on the wiring board substrate rather than components and parts or its pin between the components and parts; At pedestal one end 2 above gear pillars are set, slide to the direction that is provided with the gear pillar to stop wiring board;
3) to step 2) wiring board after fixing implements heating
Set heating-up temperature according to the scolding tin of prejudging/soldering paste melting temperature, wiring board is implemented to adopt the thermal convection mode of gas medium to heat or adopted infrared radiation and thermal convection and heat with mode; Make wiring board temperature in 2.5～4 minutes time rise to 195～240 ℃ and insulation from room temperature; The time that wiring board is heated above the scolding tin melting temperature is 0.5～3 minute, and scolding tin is fully melted;
This step is provided with two kinds of heat forms: preheat with melts soldering tin and heat; A kind of form perhaps only is set: heat tracing;
Described preheating refers to wiring board is implemented heating, and wiring board rises to 140～160 ℃ and insulation gradually from room temperature in 2～3 minutes time;
Described melts soldering tin heating is that wiring board is implemented heating, and wiring board temperature in 0.5～2 minute time rises to 195～240 ℃ and insulation from 140～160 ℃ rapidly; Wiring board keeps the time above the scolding tin melting temperature in the melts soldering tin thermal treatment zone be 0.5～3 minute, and scolding tin is fully melted;
Described heat tracing is that wiring board is implemented heating, and wiring board temperature in 2.5～4 minutes time rises to 195～240 ℃ and insulation from room temperature; Wiring board surpasses the scolding tin melting temperature in heat tracing zone time is 0.5～3 minute, and scolding tin is fully melted;
4) wiring board of the fixing heating of step 3) is implemented to impact
Cam---spring mechanism is the impact bar accumulation of energy in employing, and impact bar is by connected point type impact structure or bar shaped impact structure or face shape impact structure on circuit board for contact impact;
Single lift cam is adopted in described cam---spring mechanism accumulation of energy, and the cam revolution moves a week, and spring is compressed once, and each decrement is identical; Many lifts cam is adopted in perhaps described cam---spring mechanism accumulation of energy, and the cam revolution moves a week, and spring will be compressed repeatedly, and decrement increases successively at every turn, thereby realizes the impact energy of increase successively;
Described point type impact structure is meant the impact structure that constitutes shock point by little plane of some surface areas or curved surface;
Described bar shaped impact structure is meant the impact structure that is made of shock surface or some strip faces;
Described shape impact structure is meant that the plane by the big zone of an above area constitutes the impact structure of shock surface;
Described contact impact be described point type impact structure or described bar shaped impact structure or described shape impact structure under the promotion of impact bar, directly impact the wiring board substrate surface, perhaps impact the number of pins top of placing components on the wiring board;
5) sweeping of wiring board upper surface scolding tin scraped, separated and collect
Adopt purging device or sweep curette and purge or sweep the scolding tin of scraping the wiring board upper surface;
Described purging device is installed in that wiring board moves ahead or the top of removing direction, and the hot-air that blows out from the purging device tuyere purges the scolding tin of wiring board upper surface to the opposite direction of wiring board moving direction, scolding tin is split away off from the wiring board substrate;
Described purging device tuyere be one have with wiring board before the suitable long narrow slot structure of line direction cross-section width dimension, perhaps form side by side by row's pipe, the line direction cross-section width dimension is suitable before its width and the wiring board, is convenient to form enough blast or wind speed;
The described curette of sweeping is installed in that wiring board moves ahead or the top of removing direction, described sweep to be equipped with on the curette have certain flexible sweeping and scrape pin, sweep scraping article or sweep scraping blade; Sweep curette and rotate, sweeping on it scrape pin, sweep scraping article or sweep scraping blade and the scolding tin of wiring board upper surface is swept to the opposite direction of wiring board moving direction scraped, and scolding tin is split away off from the wiring board substrate;
Employing collects components and parts and the scolding tin that splits away off in the aforesaid operations step by the elasticity guipure of vibration generator exciting, scolding tin is realized enrichment and is come off from components and parts on the elasticity guipure of vibration, and falling into the dish that collects below the elasticity guipure by the guipure hole, components and parts then are retained on the elasticity guipure;
Described elasticity guipure has many through-hole structures, and liquid solder splashes or solid-state scolding tin granule can pass through these holes, and components and parts can not pass through;
6) reprocessing
Adopt air draft or vacuum suction apparatus to be collected in step 3)～6) flue gas that produces in the process, discharge after concentrated harmless treatment; Take out wiring board substrate and fixture thereof, cooling is to the letter sorting of classifying of wiring board substrate and components and parts.
3, employing contact according to claim 1 and 2 is impacted the method that wiring board is disassembled, it is characterized in that, described cam---spring mechanism accumulation of energy and enforcement are impacted, at described employing cam---on the basis of spring mechanism, adopt two cams to be distributed in the impact bar both sides that spring is housed, make the impact bar stress equalization.
4, adopt contact to impact the equipment that wiring board is disassembled, it is characterized in that this equipment comprises impact bar (2); Compression spring (3); Pin (4); Many lifts cam (5); Rotation axis (7); Chain (11); Elasticity guipure (13); Purging device (15); Vibration generator (17); Electric heating tube (18); Scolding tin catch tray (19); Stopper (20); Preheat district (21); The melts soldering tin thermal treatment zone (22); Fan (23); Heat insulation cord (25); The wiring board fixture (31) of support bar mode, perhaps the wiring board fixture (38) of support bar and compressing tablet mode, perhaps the wiring board fixture (26) of strong point mode; Top board (45); Supporting guide (46); Bar shaped impact structure (47); Body of wall (51);
Impact bar (2) is by being formed by connecting more than 1 section; Compression spring (3), pin (4) are installed on the impact bar (2), its lower end and bar shaped impact structure (47), or face shape impact structure (49), or point type impact structure (42) is assembled together, and impact bar (2) is by being assemblied in the axle sleeve structure guiding on the wiring board device for disassembling top board (19); Many lifts cam (5) is installed on the rotation axis (7), and rotation axis (7) is by the may command motor-driven; Purging device (15) is installed on the right side body of wall (51) of the melts soldering tin thermal treatment zone (22);
Adopt the wiring board fixture (31) of support bar mode, perhaps adopt the wiring board fixture (38) of support bar and compressing tablet mode, perhaps adopt the wiring board fixture (26) of strong point mode to slip into and to pass along supporting guide (46) and preheat district (21) and the melts soldering tin thermal treatment zone (22) with conveyer chain (11);
Setting preheats district (21) and the melts soldering tin thermal treatment zone (22), fan (23) is installed on two thermal treatment zone top boards (45) or side strengthens thermal convection, the top and the bottom of chain (11) are furnished with electric heating tube (18) in two thermals treatment zone, wherein the right lower quadrant electric heating tube (18) of the melts soldering tin thermal treatment zone (22) is arranged along chain (11) direction, and the electric heating tube of other position (18) is along arranging with chain (11) horizontal vertical direction;
At the lower disposed elasticity guipure (13) of the melts soldering tin thermal treatment zone (22), the bottom of elasticity guipure (13) is provided with scolding tin catch tray (19), and the upside of elasticity guipure (13) or downside are provided with vibration generator (17), in order to excitation elasticity guipure (13) vibration.
5, adopt contact to impact the equipment that wiring board is disassembled, it is characterized in that this equipment comprises impact bar (2); Compression spring (3); Pin (4); Cam (6); Rotation axis (7); Components and parts (9); Scolding tin (10); Guide rail (12); Metal mesh belt (14); Sweep curette (16) or purging device (15); Vibration generator (17); Scolding tin catch tray (19); High temperature airduct (24); Heat insulation cord (25); The wiring board fixture (31) of support bar mode, perhaps the wiring board fixture (38) of support bar and compressing tablet mode, perhaps the wiring board fixture (26) of strong point mode; Point type impact structure (42); Top board (45); Heat tracing zone (54); Many imports heating box (55); Hot blast import (56); Temperature sensor (57); Components and parts collecting box (58);
Impact bar (2) is by being formed by connecting more than 1 section; Compression spring (3), pin (4) are installed on the impact bar (2), and vertically pass many imports heating box (55); The lower end of impact bar (2) and point type impact structure (42) or bar shaped impact structure (47) or face shape impact structure (49) are connected; Impact bar (2) is disassembled the axle sleeve structure guiding of equipping on top board (45) and the many imports heating box (55) by being assemblied in wiring board; The cam (6) that promotes pin (4) motion on the impact bar (2) is installed on the rotation axis (7), and rotation axis (7) is by artificial or motor-driven;
The wiring board fixture (31) of support bar mode, the perhaps wiring board fixture (38) of support bar and compressing tablet mode, perhaps the wiring board fixture (26) of strong point mode slips into or passes heat tracing zone (54) along guide rail (12); The both sides of heat tracing zone (54) are provided with heat insulation cord (25);
The position is provided with temperature sensor (57) near the circuit board fixer in heat tracing zone (54); Heat tracing zone (54) by high temperature airduct (24), is introduced outside hot blast from the hot blast import (56) that many imports heating box (55) end face is provided with, wiring board (1) and fixture thereof are taked to blow from the top down the hot blast heating; High temperature airduct (24) links to each other with hot air source, and hot air source can be located at wiring board and disassemble the last or setting separately of equipment;
Near the outlet of the right side of this equipment, be provided with and sweep curette (16) or purging device (15);
On this equipment, the bottom of heat tracing zone (20), arrange elasticity guipure (14), the bottom of elasticity guipure (14) is provided with scolding tin catch tray (15), the upside of elasticity guipure (14) or downside are provided with vibration generator (17), in order to excitation elasticity guipure (14) vibration; The right end of elasticity guipure (14) is provided with components and parts collecting box (58).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100635067A CN100521873C (en) | 2007-02-02 | 2007-02-02 | Method and equipment for disassembling circuit board using contacted impact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100635067A CN100521873C (en) | 2007-02-02 | 2007-02-02 | Method and equipment for disassembling circuit board using contacted impact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101014227A CN101014227A (en) | 2007-08-08 |
| CN100521873C true CN100521873C (en) | 2009-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2007100635067A Expired - Fee Related CN100521873C (en) | 2007-02-02 | 2007-02-02 | Method and equipment for disassembling circuit board using contacted impact |
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| Country | Link |
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| CN (1) | CN100521873C (en) |
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| CN101014227A (en) | 2007-08-08 |
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