CN104741724A - Method for separating soldering tin from waste circuit board in centrifugal mode - Google Patents
Method for separating soldering tin from waste circuit board in centrifugal mode Download PDFInfo
- Publication number
- CN104741724A CN104741724A CN201410160755.8A CN201410160755A CN104741724A CN 104741724 A CN104741724 A CN 104741724A CN 201410160755 A CN201410160755 A CN 201410160755A CN 104741724 A CN104741724 A CN 104741724A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- centrifuge container
- old circuit
- scolding tin
- hot liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Abstract
The invention discloses a method for separating soldering tin from a waste circuit board in a centrifugal mode. According to the method, the waste circuit board is placed into a hot liquid contained in a centrifugal container, the temperature of the hot liquid is between the soldering tin melting point and the decomposition temperature of the waste circuit board, and the soldering tin is melted and breaks away from the waste circuit board through rotation of the centrifugal container. The method for separating soldering tin from the waste circuit board in the centrifugal mode has the advantages of being environmentally friendly, saving energy, being low in cost, achieving large scale easily and the like, thereby being quite high in practicability.
Description
Technical field
The present invention relates to a kind of recovery technology of old circuit board, specifically, relate to the method for scolding tin on a kind of centrifugation old circuit board.
Background technology
Now improving constantly along with living standards of the people, the amount of waste household appliances is also increasing, can produce a large amount of old circuit boards in the disassembling of waste household appliances.Effectively to recycle old circuit board must first components and parts be separated with it.Although have a lot of technology to be separated with old circuit board components and parts now, if Patent Office of the People's Republic of China is in the inventive method of the patent No. disclosed in 2013.10.30 201210111599.7 denomination of invention " fine sand removing the electronic devices and components on substrate disassembles method ", the method for the method fine sand heating old circuit board is separated.Although this inventive method also can reach the object of separation, heat transfer efficiency is low, and aftertreatment technology is complicated, cost is high, owing to precise control of temperature, particularly old circuit board can not can produce a large amount of carcinogenic gas in atmosphere in separation process.From old circuit board, the key of separating component is separated by scolding tin, because components and parts are welded on above wiring board by scolding tin, as long as scolding tin can be separated from old circuit board, just can reach the object of separating component.Therefore, the method for scolding tin on the separating waste, worn wiring board being badly in need of now a kind of easy to operate, with low cost, environmental protection.
Summary of the invention
The object of the invention is to overcome above-mentioned shortcoming, provide that a kind of good separating effect, separating rate are fast, the method for scolding tin on the centrifugation old circuit board of environmental protection.
For achieving the above object, the present invention adopts following technical scheme:
The method of scolding tin on a kind of centrifugation old circuit board provided by the invention, comprise old circuit board, scolding tin, described method is in centrifuge container, make old circuit board in the hot liquid of temperature between scolding tin fusing point and old circuit board decomposition temperature, after making melts soldering tin by the rotation of centrifuge container, depart from old circuit board.
Preferably, the inwall of described centrifuge container is provided with screen cloth.
Preferably, described hot liquid is fuse salt.
As another kind of preferred version, described hot liquid is hot water, and described centrifuge container is pressure vessel.
As another kind of preferred version, described hot liquid is hot water salting liquid, and described centrifuge container is pressure vessel.
As further preferred version, in described pressure vessel, be full of hot water or hot water salting liquid.
As further preferred version, described pressure vessel is provided with air exhaust valve.
As further preferred version, described pressure vessel is provided with safety valve.
Preferably, described centrifuge container has heating or/and heat insulation function.
Preferably, described centrifuge container is also connected with the high-pressure pump needing the hot liquid recycled for pumping.
Compared with prior art, the present invention has following beneficial effect:
1, environmental protection: produce without waste water,waste gas and industrial residue in whole separation process;
2, save the energy: because hot liquid can recycle in separation process, save the energy;
3, cost is low: do not need to consume any chemicals in separation process, cost is low.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1 equipment therefor;
Fig. 2 is the structural representation of embodiment 2 equipment therefor;
Fig. 3 is the structural representation of embodiment 3 equipment therefor.
In figure: 1, centrifuge container; 1A, centrifugal high pressure container; 2, rotating shaft; 3, hot liquid; 4, old circuit board; 5, screen cloth; 6, ready-packaged joint; 7, high-pressure pump; 8, high-temperature water generator.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, technical scheme of the present invention is further elaborated:
The method of scolding tin on a kind of centrifugation old circuit board provided by the invention, comprise old circuit board, scolding tin, described method is in centrifuge container, make old circuit board in the hot liquid of temperature between scolding tin fusing point and old circuit board decomposition temperature, make the scolding tin after fusing depart from old circuit board by the rotation of centrifuge container.
Preferably, the inwall of described centrifuge container is provided with screen cloth.Due in the separation process of scolding tin, part components and parts also can come off from old circuit board, and these components and parts come off can mix with scolding tin.After the inwall of centrifuge container installs screen cloth, the scolding tin after fusing is thrown on inwall under the influence of centrifugal force, but the components and parts separated then are isolated by screen cloth.
Described hot liquid can select fuse salt.Because fuse salt at ambient pressure just can by melts soldering tin, thus make that the requirement of centrifugal device is low, structure simply, easily operates.
Described hot liquid also can select hot water, due to water at ambient pressure 100 DEG C will evaporate, therefore, when hot liquid selects hot water, centrifuge container needs for pressure vessel.In pressure vessel, make the temperature of water reach the fusing point of scolding tin, make melts soldering tin.Adopt water as the heat-conducting medium of melts soldering tin, there is the advantages such as environmental protection, operating cost are low.In addition, because the temperature of water and pressure also exist corresponding relation, the object accurately controlling water temperature can be realized.Described pressure vessel is preferably provided with air exhaust valve.Because pressure vessel also exists certain safety requirements in operation, therefore, after the air in centrifugal device being discharged by air exhaust valve, in described pressure vessel, be full of water, can safety problem be avoided.In addition, because the coefficient of expansion of water is much smaller than gas, even if so pressure vessel generation explosion also can, in moment pressure release, reduce dangerous.Described pressure vessel is preferably also provided with safety valve.Safety valve can ensure pressure vessel security in operation.
Described hot liquid also can select hot water salting liquid, because hot water salting liquid can reduce pressure at the same temperature, as: the boiling point of calcium chloride water is 160 degree.Therefore, adopt hot water salting liquid to reduce pressure, improve the security of operation.
Described centrifuge container preferably has heating or/and heat insulation function.Heating function can ensure the temperature of water in operation, and heat insulation function can save the energy.
Described centrifuge container is preferably also connected with the high-pressure pump needing the hot liquid recycled for pumping.The other end of high-pressure pump is connected with other centrifuge container or elevated temperature vessel.High-pressure pump is pumped into needing the hot liquid recycled in other centrifuge container or in elevated temperature vessel.In employing aqueous fusion scolding tin process, after operation terminates, the temperature of water is still very high, if directly discharged, poor stability on the one hand, the energy of water does not utilize fully on the other hand.The energy of the high-temperature water after use can be made full use of by the effect of high-pressure pump, reduce energy consumption, also can shorten the heat time of hot water simultaneously.
Embodiment 1
With reference to Fig. 1: be rotating shaft 2 in the centre of centrifuge container 1, centrifuge container 1 synchronous rotary can be driven when rotating shaft 2 rotates.In centrifuge container 1, be filled with hot liquid 3, old circuit board 4 is immersed in hot liquid 3 li.By the heat effect of hot liquid 3, the melts soldering tin on old circuit board 4 can be made to become liquid, be rotated the centrifugal force produced by rotating shaft 2, scolding tin old circuit board 4 being fused into liquid is got rid of, departs from from old circuit board 4.Because old circuit board 4 is planes, and the inwall of centrifuge container 1 is circular arc, and both can not coincide together, and will depart from as long as therefore rotate scolding tin.
Embodiment 2
With reference to Fig. 2: be rotating shaft 2 in the centre of centrifuge container 1, centrifuge container 1 synchronous rotary can be driven when rotating shaft 2 rotates.In centrifuge container 1, be filled with hot liquid 3, old circuit board 4 is immersed in hot liquid 3 li.By the heat effect of hot liquid 3, the melts soldering tin on old circuit board 4 becomes liquid, is rotated the centrifugal force produced, scolding tin old circuit board 4 being fused into liquid is got rid of, departs from from old circuit board 4 by rotating shaft 2.Owing to also can depart from when a part of components and parts on old circuit board 4 after scolding tin departs from, the components and parts after disengaging can mix with scolding tin, are unfavorable for separation below.Therefore on the inwall of centrifuge container 1, load onto screen cloth 5, screen cloth 5 can allow the scolding tin after melting pass through, but stops the components and parts departed from.So just can effectively scolding tin be separated.
Embodiment 3
With reference to Fig. 3: installed ready-packaged joint 6 on centrifugal high pressure container 1A.After centrifugal high pressure container 1A has been separated scolding tin, be connected with high-pressure pump 7 by ready-packaged joint 6, started high-pressure pump 7 and the high-temperature water of centrifugal high pressure container 1A is pumped in high-temperature water generator 8, thus the hot water in centrifugal high pressure container 1A can have been reclaimed make full use of.Certainly, also high-temperature water can be pumped into (this is not shown in FIG.) in another centrifugal high pressure container, to carry out another scolding tin lock out operation.
Finally be necessary described herein: above embodiment is only for being described in more detail technical scheme of the present invention; can not be interpreted as limiting the scope of the invention, some nonessential improvement that those skilled in the art's foregoing according to the present invention is made and adjustment all belong to protection scope of the present invention.
Claims (10)
1. the method for scolding tin on centrifugation old circuit board, comprises old circuit board, scolding tin; It is characterized in that: described method is in centrifuge container, make old circuit board in the hot liquid of temperature between scolding tin fusing point and old circuit board decomposition temperature, after making melts soldering tin by the rotation of centrifuge container, depart from old circuit board.
2. method according to claim 1, is characterized in that: on the inwall of described centrifuge container, be provided with screen cloth.
3. method according to claim 1, is characterized in that: described hot liquid is fuse salt.
4. method according to claim 1, is characterized in that: described hot liquid is hot water, and described centrifuge container is pressure vessel.
5. method according to claim 1, is characterized in that: described hot liquid is hot water salting liquid, and described centrifuge container is pressure vessel.
6. the method according to claim 4 or 5, is characterized in that: in described pressure vessel, be full of hot water or hot water salting liquid.
7. the method according to claim 4 or 5, is characterized in that: on described pressure vessel, be provided with air exhaust valve.
8. the method according to claim 4 or 5, is characterized in that: on described pressure vessel, be provided with safety valve.
9. method according to claim 1, is characterized in that: described centrifuge container has heating or/and heat insulation function.
10. method according to claim 1, is characterized in that: described centrifuge container is also connected with the high-pressure pump of the hot liquid recycled for pumping needs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410160755.8A CN104741724A (en) | 2013-12-26 | 2014-04-21 | Method for separating soldering tin from waste circuit board in centrifugal mode |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013107372509 | 2013-12-26 | ||
| CN201310737250 | 2013-12-26 | ||
| CN201410160755.8A CN104741724A (en) | 2013-12-26 | 2014-04-21 | Method for separating soldering tin from waste circuit board in centrifugal mode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104741724A true CN104741724A (en) | 2015-07-01 |
Family
ID=53582291
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410160755.8A Pending CN104741724A (en) | 2013-12-26 | 2014-04-21 | Method for separating soldering tin from waste circuit board in centrifugal mode |
| CN201410160701.1A Pending CN104741723A (en) | 2013-12-26 | 2014-04-21 | Method and device for separating soldering tin from waste print circuit board |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410160701.1A Pending CN104741723A (en) | 2013-12-26 | 2014-04-21 | Method and device for separating soldering tin from waste print circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN104741724A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113500051A (en) * | 2021-07-16 | 2021-10-15 | 兰州有色冶金设计研究院有限公司 | Circuit board soldering tin removing device and method |
| US20220354034A1 (en) * | 2014-08-06 | 2022-11-03 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105312705A (en) * | 2015-12-09 | 2016-02-10 | 清华大学 | Method for digesting soldering tin from waste circuit board |
| CN105818189B (en) * | 2016-06-12 | 2017-05-31 | 湖北金科环保科技股份有限公司 | A kind of printed circuit board (PCB) splitting machine |
| CN116921399B (en) * | 2023-08-07 | 2024-03-29 | 南京万舟发机电科技有限公司 | Automatic soldering tin processing device and efficient recycling method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3866893A (en) * | 1974-02-05 | 1975-02-18 | Richard Hoberman | Apparatus for desoldering scrap radiator cores and recovering separated metals |
| CN101014227A (en) * | 2007-02-02 | 2007-08-08 | 清华大学 | Method and equipment for disassembling circuit board using contacted impact |
| CN101362143A (en) * | 2008-09-19 | 2009-02-11 | 中南大学 | Technique and device for effectively recovering waste printed circuit boards solder |
| CN101623698A (en) * | 2009-08-13 | 2010-01-13 | 中南大学 | Method for synthetically recycling waste printed circuit board |
| CN202317353U (en) * | 2011-11-16 | 2012-07-11 | 苏州伟翔电子废弃物处理技术有限公司 | Removing device of electronic components and soldering tin of waste circuit board |
| JP2015018858A (en) * | 2013-07-09 | 2015-01-29 | 富士電機株式会社 | Electronic component separation apparatus of printed circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3799200B2 (en) * | 1999-09-22 | 2006-07-19 | キヤノン株式会社 | Solder recovery method and solder recovery device |
| CN2902550Y (en) * | 2005-11-17 | 2007-05-23 | 深圳市格林美高新技术有限公司 | Dewelding equipment of automobile and electron waste circuitboard |
| CN2904571Y (en) * | 2006-03-23 | 2007-05-23 | 合肥工业大学 | Unit of sealing off separating device for use in liquid heat conducting medium of printed circuit board |
| JP5262845B2 (en) * | 2009-03-04 | 2013-08-14 | 富士通株式会社 | How to remove electronic parts |
-
2014
- 2014-04-21 CN CN201410160755.8A patent/CN104741724A/en active Pending
- 2014-04-21 CN CN201410160701.1A patent/CN104741723A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3866893A (en) * | 1974-02-05 | 1975-02-18 | Richard Hoberman | Apparatus for desoldering scrap radiator cores and recovering separated metals |
| CN101014227A (en) * | 2007-02-02 | 2007-08-08 | 清华大学 | Method and equipment for disassembling circuit board using contacted impact |
| CN101362143A (en) * | 2008-09-19 | 2009-02-11 | 中南大学 | Technique and device for effectively recovering waste printed circuit boards solder |
| CN101623698A (en) * | 2009-08-13 | 2010-01-13 | 中南大学 | Method for synthetically recycling waste printed circuit board |
| CN202317353U (en) * | 2011-11-16 | 2012-07-11 | 苏州伟翔电子废弃物处理技术有限公司 | Removing device of electronic components and soldering tin of waste circuit board |
| JP2015018858A (en) * | 2013-07-09 | 2015-01-29 | 富士電機株式会社 | Electronic component separation apparatus of printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220354034A1 (en) * | 2014-08-06 | 2022-11-03 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
| CN113500051A (en) * | 2021-07-16 | 2021-10-15 | 兰州有色冶金设计研究院有限公司 | Circuit board soldering tin removing device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104741723A (en) | 2015-07-01 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150701 |