CN105521983B - Dismounting processing unit for old circuit board - Google Patents
Dismounting processing unit for old circuit board Download PDFInfo
- Publication number
- CN105521983B CN105521983B CN201510898262.9A CN201510898262A CN105521983B CN 105521983 B CN105521983 B CN 105521983B CN 201510898262 A CN201510898262 A CN 201510898262A CN 105521983 B CN105521983 B CN 105521983B
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- CN
- China
- Prior art keywords
- processing unit
- circuit board
- dismounting
- accommodating chamber
- old circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 44
- 239000012141 concentrate Substances 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 38
- 230000005540 biological transmission Effects 0.000 claims description 11
- 239000012943 hotmelt Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000004064 recycling Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 238000003466 welding Methods 0.000 description 7
- 238000000227 grinding Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000008450 motivation Effects 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 230000007096 poisonous effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- PRPINYUDVPFIRX-UHFFFAOYSA-N 1-naphthaleneacetic acid Chemical compound C1=CC=C2C(CC(=O)O)=CC=CC2=C1 PRPINYUDVPFIRX-UHFFFAOYSA-N 0.000 description 1
- 208000033999 Device damage Diseases 0.000 description 1
- 208000028804 PERCHING syndrome Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000505 pernicious effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses one kind to dismantle processing unit, more particularly, to a kind of dismounting processing unit for old circuit board, belongs to electronic product recycling equipment design and manufacturing technology field.Disassemble efficient, the small dismounting processing unit for old circuit board of the secondary pollution that is produced during disassembling.The dismounting processing unit includes hot disassembly system and the supporting rack containing accommodating chamber, oscillating separator structure is internally provided with the accommodating chamber, the heat disassembles mechanism in the accommodating chamber above the oscillating separator structure, tail gas is provided with the top of the accommodating chamber and concentrates export structure, the lower part of the accommodating chamber is provided with material delivery outlet.
Description
Technical field
The present invention relates to one kind to dismantle processing unit, and dress is handled more particularly, to a kind of dismounting for old circuit board
Put, belong to electronic product recycling equipment design and manufacturing technology field.
Background technology
Wiring board is the basis of electronic product, is an indispensable part in each electronic product.China is world's electronics
The production and consumption big country of electric equipment products, regenerates with the continuous renewal of product, and substantial amounts of electric equipment products is eliminated, its electricity
Road plate is also discarded therewith.Containing a variety of poisonous and harmful substances, precious metal in component on circuit board, preferably to realize
The high value recycling and environmental protection processing of resource, it is necessary to which assist side carries out the broken preceding dismounting for carrying out component.
The assembly method of electronic component mainly has through-hole mounting welding THD and two kinds of SMD of surface mount welding.Wiring board
In component disassembly process, the mode of generally use heating tip-off or machinery dismounting.Wherein heating solution welding method is mainly from disassembling member
The integrality of device considers, is heated using medium, the mode such as laser heating or hot-air blowing, after component solder joint is melted again
Dismantled, have the advantages that dismounting integrality is good, but pernicious gas is also easy to produce in heating process and causes secondary pollution, disassemble energy
Effect is high, disassembles less efficient；It is entirely that destructiveness is disassembled that machinery, which disassembles rule, mainly using cutters such as perching knife, milling cutters by first device
The pin excision of part, has the advantages that to disassemble that efficient, to disassemble energy consumption low, but parts damage greatly, to disassemble noise big.At present,
It is directed to the dismounting of old circuit board component both at home and abroad, has carried out substantial amounts of experimental study, but should in specific production practices
Use and still suffer from some problems.
Chinese patent CN101010229A proposes a kind of method that globality is dismantled from old circuit board by component
With equipment.It first pre-processes old circuit board, removes non-solder and fixes component, then fixes wiring board, adopt
Wiring board solder joint is completely melt with hot air convection mode of heating, the component of postwelding will be solved from pcb board using mechanical shock
Separation, is collected with the elastic network(s) band with exciting device, sorts component and welding slag.But it uses hot air convection to heat, heating effect
Rate is relatively low, and energy consumption is big, is not suitable for mass production processing.
Chinese patent CN101112728A discloses a kind of efficiently separation, recycling solder and the first device of dismounting from wiring board
The method and device of part.It uses fusion welding to heat, utilize to the solder joint on welding circuit board face as heat medium
Special nozzle injection high temperature and high pressure gas make solder be separated with circuit board, make component and circuit by overturning vibration to circuit board
Plate plate separates.But this method is using fusion welding as heat medium, the poisonous and harmful substance in solder will be caused to be heated volatilization, made
Into secondary pollution.
Chinese patent CN101733631A discloses a kind of waste circuit board hook pulling and dismounting device.The device include cabinet,
Heating system, chain transport mechanism, hook pull out Agency rolling brush mechanism.Heating system is divided into preheating zone and high-temperature region, waits to tear open
Circuit board is placed on transmission chain after preheated area's preheating, and Agency rolling brush mechanism is pulled out by component and weldering by hook in high-temperature region
Material dismounting.The device damages the pin for causing component during hook drawing machine structure extracts component, and works as hook at the same time and pull out
When minor diameter component and larger diameter component, small component can not be extracted.
Chinese patent CN101537522A discloses a kind of printed circuit board electron component and disassembles and scolding tin recovery method
And equipment.It will face-up be placed in heating in the solder furnace of design temperature with component wiring board makes melts soldering tin, utilizes people
Work grips larger component, and the wiring board containing small component and scolding tin is sent to bottom added with automatic control electric heating heating apparatus
On conveyer belt, push down wiring board using hobboing cutter and convey forward, installation scraper rejects component and scolding tin on rear side of hobboing cutter, by more
The sequential engagement of group hobboing cutter and scraper realizes the separation of component and scolding tin.This method and the whole heating of equipment requirement wiring board,
High energy consumption, and the health of operating personnel will also be had an impact with manually gripping larger component.
Chinese patent CN102120222A discloses a kind of old circuit board Through-Hole Component disassembling apparatus and method.Should
Device is made of surface grinding machine, fixture and dust catcher, and surface grinding machine is universal plane grinding machine, and fixture is the adaptive spring dress in position
Put, fixture is fixed on the workbench of surface grinding machine, and the circuit board component pin to be disassembled is stuck on fixture upwards, flat stone mill
The emery wheel of bed and the component's feet Grinding Contact of wiring board, dust catcher are fixed on the front of emery wheel rotation direction.The device is adopted
Component leg is removed with grinding method, and production operation requires high, and there are that noise is big, dust is more, production efficiency is low etc. is numerous
Defect.
To sum up, circuit board component is disassembled, and key is that efficiency is disassembled in reduction, and raising disassembles efficiency, realizes mass
The secondary pollution problem disassembled processing mode and reduce environment.Up to the present, above-mentioned technology all fails to be fully solved above-mentioned
Problem.
The content of the invention
The technical problems to be solved by the invention are：One kind is provided and disassembles efficient, to be produced during disassembling secondary dirt
Contaminate the small dismounting processing unit for old circuit board.
Technical solution is used by solve above-mentioned technical problem：A kind of dismounting for old circuit board handles dress
Put, the dismounting processing unit includes hot disassembly system and the supporting rack containing accommodating chamber, is set in the inside of the accommodating chamber
Oscillating separator structure is equipped with, the heat disassembles mechanism in the accommodating chamber above the oscillating separator structure, described
Tail gas is provided with the top of accommodating chamber and concentrates export structure, the lower part of the accommodating chamber is provided with material delivery outlet.
The beneficial effects of the invention are as follows：By the way that the dismounting processing unit to be arranged to include hot disassembly system and contain
The structure of the supporting rack of accommodating chamber, and oscillating separator structure is internally provided with the accommodating chamber, on the top of the accommodating chamber
Portion is provided with tail gas and concentrates export structure, and the lower part of the accommodating chamber is provided with material delivery outlet, then tears the heat open
Solution system is installed in the accommodating chamber above the oscillating separator structure.In this way, the old circuit board can pass through institute
The hot disassembly system stated is disassembled, and make through the hot disassembly system disassemble dismounting after the completion of wiring board, pass through the vibration
From the dismounting processing unit that the material delivery outlet output is described after sorting mechanism classification, old circuit board is completed in closed-loop
Automation apparatus under the conditions of border disassembles work, achievees the purpose that to effectively improve and disassembles efficiency；And the tail set at the top of accommodating chamber
Gas concentrates export structure, is focused on after being collected to the harmful exhaust produced during disassembling, so as to avoid as far as possible
The possibility of secondary pollution is produced during disassembling.
It is further that the hot disassembly system includes air heating arrangements and mechanism is disassembled in rotation, and the air adds
The output terminal that the hot melt of heat engine structure disassembles wind is connected with the chamber of disassembling that mechanism is disassembled in the rotation.
It is further that mechanism is disassembled in the rotation includes hollow shaft and the roller in the hollow shaft, described
Chamber of disassembling be made of the inner cavity of the roller, closable material input is provided with the axial side wall of the roller,
The output terminal that the hot melt of the air heating arrangements disassembles wind is connected by the hollow shaft with the chamber of disassembling.
It is further that the air heating arrangements include mounting bracket, heating tube and cut only valve, with exterior gas transmission system
The heating tube connected of uniting is installed on the rotation by the mounting bracket and disassembles in the hollow shaft of mechanism, and described cuts
Only valve is installed on the gas output end of the heating tube.
Such scheme it is preferable that, the roller further includes cover board, and the material input passes through described
Cover board is closed, and material-dropping hole is provided with the cover board.
It is further that the oscillating separator structure is the inclined vibrating screen being arranged in below the hot disassembly system
Subnetting, the material delivery outlet include tiny material delivery outlet and other material delivery outlets, the tiny material delivery outlet
Be arranged on the lower section of the vibrating screen subnetting, other material delivery outlets be arranged on the vibrating screen subnetting horizontal level compared with
In the receiving cavity wall of low side.
Such scheme it is preferable that, be additionally provided with material between the vibrating screen subnetting and the hot disassembly system
Collect bucket, closable feed inlet is additionally provided with the middle and upper part of support frame as described above.
It is further that the dismounting processing unit further includes driving mechanism, and the hot disassembly system is in the drive
Rotated under the driving of motivation structure around its central axis.
It is further that the driving mechanism includes motor, power-take-off pulley and power transmission belt, in the heat
Power input pulley is provided with disassembly system, the power-take-off pulley is installed on the power output shaft of the motor
On, the power input pulley is connected with the power-take-off pulley by the power transmission belt.
It is further that the dismounting processing unit further includes control mechanism, the hot disassembly system and the driving
The control line of mechanism is connected into the control mechanism.
Brief description of the drawings
Fig. 1 is the structure diagram for the dismounting processing unit that the present invention is used for old circuit board；
Fig. 2 is the left view of Fig. 1；
Fig. 3 be the present invention relates to air heating arrangements schematic diagram；
Fig. 4 be the present invention relates to rotation disassemble the schematic diagram of mechanism.
In figure mark for：Hot disassembly system 1, accommodating chamber 2, supporting rack 3, oscillating separator structure 4, tail gas concentrate export structure
5th, material delivery outlet 6, air heating arrangements 7, rotation disassemble mechanism 8, disassemble chamber 9, hollow shaft 10, roller 11, material input
12nd, mounting bracket 13, heating tube 14, cut only valve 15, cover board 16, material-dropping hole 17, vibrating screen subnetting 18, tiny material delivery outlet
19th, other material delivery outlets 20, material collect bucket 21, feed inlet 22, driving mechanism 23, motor 24, power-take-off pulley 25,
Power transmission belt 26, power input pulley 27, control mechanism 28.
Embodiment
As shown in Figure 1, Figure 2, shown in Fig. 3 and Fig. 4 to be that one kind provided by the invention is disassembled efficient, is produced during disassembling
The small dismounting processing unit for old circuit board of secondary pollution.The dismounting processing unit includes hot 1 He of disassembly system
Supporting rack 3 containing accommodating chamber 2, is internally provided with oscillating separator structure 4, the heat disassembles mechanism 1 in the accommodating chamber 2
In the accommodating chamber 2 above the oscillating separator structure 4, tail gas is provided with the top of the accommodating chamber 2 and concentrates output
Structure 5, material delivery outlet 6 is provided with the lower part of the accommodating chamber 2.It is arranged to above by by the dismounting processing unit
The structure of supporting rack 3 including hot disassembly system 1 and containing accommodating chamber 2, and it is internally provided with vibration point in the accommodating chamber 2
Mechanism 4 is selected, tail gas is provided with the top of the accommodating chamber 2 and concentrates export structure 5, is provided with the lower part of the accommodating chamber 2
The hot disassembly system 1, is then installed in the accommodating chamber 3 of the top of oscillating separator structure 4 by material delivery outlet 6.This
Sample, the old circuit board can be disassembled by the hot disassembly system 1, and be made through the hot disassembly system 1
The wiring board after the completion of disassembling is heated, institute is exported from the material delivery outlet 6 after classifying by the oscillating separator structure 4
The dismounting processing unit stated, completes automation apparatus of the old circuit board under the conditions of enclosed environment and disassembles work, reach effective
Improve the purpose for disassembling efficiency；, can be to being produced during disassembling and the tail gas that the top of accommodating chamber 2 is set concentrates export structure 5
Harmful exhaust be collected after focus on so that as far as possible avoid during disassembling produce secondary pollution possibility.
In the above embodiment, in order to simplify the structure of herein described hot disassembly system 1, to reduce production cost
Under the premise of will not influence to disassemble efficiency again, while facilitate the tear down operations of postorder again.Hot disassembly system 1 described herein is set
It is set to and disassembles the structure of mechanism 8 including air heating arrangements 7 and rotation, and make the hot melt exhaust gas of the air heating arrangements 7
Output terminal is connected with the chamber 9 of disassembling that mechanism 8 is disassembled in the rotation.At this time, in order to improve the efficiency disassembled of automation, the application institute
The structure that mechanism 8 is arranged to include hollow shaft 10 and the roller 11 in the hollow shaft 10 is disassembled in the rotation stated, described
Disassembling chamber 9 can be made of the inner cavity of the roller 11, and closable thing is provided with the axial side wall of the roller 11
Expect input port 12, the output terminal of the hot melt exhaust gas wind of the air heating arrangements disassembles chamber by the hollow shaft and described
Connection；The air heating arrangements 7 are arranged to include mounting bracket 13, heating tube 14 and the structure for cutting only valve 15, it is and outer
The heating tube 14 of portion's gas transmission system connection is installed on the rotation by the mounting bracket 13 and disassembles the hollow of mechanism 8
On axis 10, the gas output end cut only valve 15 and be installed on the heating tube 14.In this way, heat ought be inputted to chamber 9 is disassembled
It is molten to disassemble after wind melts solder joint, then disassembling point for electronic component and circuit board substrate can be carried out by the rotation of roller
From.And in order to which chamber 9 will be disassembled described in the scolding tin dismantled initial stage and Miniature component output immediately, with reference to the roller
Need to set cover board 16, the design feature that the material input 12 is closed by the cover board 16, described on 11
Material-dropping hole 17 is provided with cover board 16.In this way, in the rotary course of roller, the scolding tin and Miniature component of dismounting at initial stage
With by disassembling chamber 9 described in the material-dropping hole 17 immediately output.
Further, in order to simplify the structure of the oscillating separator structure 4, convenient manufacture installation and postorder disassemble part
Classification, oscillating separator structure 4 described herein are the inclined vibrating screen subnetting for being arranged in the lower section of hot disassembly system 1
18, the material delivery outlet 6 includes tiny material delivery outlet 19 and other material delivery outlets 20, tiny material output
Mouth 19 is arranged on the lower section of the vibrating screen subnetting 18, and other material delivery outlets 20 are arranged on the vibrating screen subnetting 18
In the receiving cavity wall of the relatively low side of horizontal level.And in order to improve the classification quality of the object after disassembling, in the vibrosieve
Material is additionally provided between net 18 and the hot disassembly system 1 and collects bucket 21, and being additionally provided with the middle and upper part of support frame as described above 3 can
The feed inlet 22 of closing.
Meanwhile in order to drive the hot disassembly system to realize that work is disassembled in rotation, the application handles the dismounting
Device also includes driving mechanism 23, in this way, the hot disassembly system 1 can be under the driving by the driving mechanism 23
Rotated around its central axis.With reference to some design features of the prior art, the driving mechanism 23 is arranged to by the application
Include the structure of motor 24, power-take-off pulley 25 and power transmission belt 26, this on the hot disassembly system 1 into needing
Power input pulley 27 is provided with, the power-take-off pulley 25 is installed on the power output shaft of the motor 24,
In this way, the power input pulley 27 is connected with the power-take-off pulley 25 by the power transmission belt 26.
Equally, dismounting processing unit described herein also includes control mechanism 28, the hot disassembly system 1 and the drive
The control line of motivation structure 23 is connected into the control mechanism 28.
Concrete operations carry out as follows：
Before opening of device, cover board and rotation on opening supporting rack 3 disassemble the cover board 16 in mechanism 8, large-scale by having removed
The waste and old circuit board of capacitance and large-scale component is placed in the inner cavity of roller 11, and admission space is no more than the 2/3 of cavity volume.
The cover board on the cover board 22 and rack 1 on closed drum 11 is distinguished in order.
Equipment power supply is opened, is respectively started under the control of control mechanism (28) on air heating arrangements 7 and cuts only 15 He of valve
Heating tube (14), and it is 235~250 DEG C to set heating-up temperature, the air after heating is disassembled by rotation hollow in mechanism 8
Wiring board to be dismantled is heated the inner cavity that axis 10 enters roller 21.
Start driving motor 24 and screening mechanism 5, it is 20~30 minutes to set the motor duration of runs, is driving roller 11
Rotary motion is proceeded by under the action of motor 24.
After driving motor 24 to operate a period of time, the part circuit boards solder in roller (11) is material starts melting, part
Component also begins to come off from circuit board substrate, with the operating of driving motor (4), partial hybrid scolding tin and Miniature component
The material-dropping hole 17 of the material cover board (26) that begins through roller 11 be discharged to the outside of roller 21.
Oscillating separator structure 4 carries out vibration sorting to the mixed material of discharge.Wherein, the soldering tin material of small volume passes through
The sieve screen apertures of oscillating separator structure 4 fall into solder collection frame and recycle, and the larger component of volume is along oscillating separator structure 4
Sieve face rolls down in component collection frame and recycles.
After motor 24 and oscillating separator structure 4 to be driven complete operating according to the run time of setting, heating unit is closed down
On cut air-stopping valve 15 and heating tube 14, while start the emission-control equipment of peripheral hardware and discharge the exhaust gas in roller 11.
After the exhaust gas in roller 11 is drained, the cover board on supporting rack 3 is opened, the cover board 16 on roller (11) is arranged to
The cover board being re-closing off after opening on supporting rack 3.
Start driving motor 4, the surplus material in roller 22 is discharged.Start the sorting mechanism 4 that shakes at the same time, in roller 11
The surplus material of discharge carries out vibrosieve recycling.
After material in roller 11 is drained, driving motor 24 and oscillating separator structure 1 are closed down, disassembles process completion.
Claims (7)
- A kind of 1. dismounting processing unit for old circuit board, it is characterised in that：The dismounting processing unit is torn open including heat Solution system (1) and the supporting rack (3) containing accommodating chamber (2), oscillating separator structure is internally provided with the accommodating chamber (2) (4), the heat disassembles mechanism (1) in the accommodating chamber (2) above the oscillating separator structure (4), in the receiving Tail gas is provided with the top of chamber (2) and concentrates export structure (5), the lower part of the accommodating chamber (2) is provided with material delivery outlet (6),The hot disassembly system (1) includes air heating arrangements (7) and mechanism (8), the air heating arrangements are disassembled in rotation (7) output terminal that hot melt disassembles wind is connected with the chamber (9) of disassembling that mechanism (8) is disassembled in the rotation,Mechanism (8) is disassembled in the rotation includes hollow shaft (10) and the roller (11) in the hollow shaft (10), described Chamber (9) of disassembling be made of the inner cavity of the roller (11), be provided with the axial side wall of the roller (11) closable Material input (12), the output terminal that the hot melts of the air heating arrangements disassembles wind are torn open by the hollow shaft and described Chamber connection is solved,The air heating arrangements (7) include mounting bracket (13), heating tube (14) and cut only valve (15), with exterior gas transmission system The heating tube (14) connected of uniting disassembles the hollow shaft of mechanism (8) by the mounting bracket (13) installed in the rotation (10) on, the gas output end cut only valve (15) and be installed on the heating tube (14).
- 2. the dismounting processing unit according to claim 1 for old circuit board, it is characterised in that：The roller (11) cover board (16) is further included, the material input (12) is closed by the cover board (16), in the cover board (16) material-dropping hole (17) is provided with.
- 3. the dismounting processing unit according to claim 1 or 2 for old circuit board, it is characterised in that：Described shakes Dynamic sorting mechanism (4) is the inclined vibration vibrating screen subnetting (18) being arranged in below the hot disassembly system (1), the thing Material delivery outlet (6) includes tiny material delivery outlet (19) and other material delivery outlets (20), the tiny material delivery outlet (19) lower section of the vibrating screen subnetting (18) is arranged on, other material delivery outlets (20) are arranged on the vibrosieve In the receiving cavity wall of net (18) relatively low side of horizontal level.
- 4. the dismounting processing unit according to claim 3 for old circuit board, it is characterised in that：In the vibrating screen Material is additionally provided between subnetting (18) and the hot disassembly system (1) and collects bucket (21), in the middle and upper part of support frame as described above (3) It is additionally provided with closable feed inlet (22).
- 5. the dismounting processing unit according to claim 1 for old circuit board, it is characterised in that：At the dismounting Reason device further includes driving mechanism (23), and the hot disassembly system (1) is under the driving of the driving mechanism (23) around itself Center axis rotation.
- 6. the dismounting processing unit according to claim 5 for old circuit board, it is characterised in that：The driving machine Structure (23) includes motor (24), power-take-off pulley (25) and power transmission belt (26), is set on the hot disassembly system (1) Power input pulley (27) is equipped with, the power-take-off pulley (25) is installed on the power output shaft of the motor (24) On, the power input pulley (27) is connected with the power-take-off pulley (25) by the power transmission belt (26) Connect.
- 7. the dismounting processing unit according to claim 5 for old circuit board, it is characterised in that：At the dismounting Reason device further includes control mechanism (28), described in the control line of the hot disassembly system (1) and the driving mechanism (23) is connected into Control mechanism (28) in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510898262.9A CN105521983B (en) | 2015-12-08 | 2015-12-08 | Dismounting processing unit for old circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510898262.9A CN105521983B (en) | 2015-12-08 | 2015-12-08 | Dismounting processing unit for old circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105521983A CN105521983A (en) | 2016-04-27 |
| CN105521983B true CN105521983B (en) | 2018-04-20 |
Family
ID=55764704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510898262.9A Active CN105521983B (en) | 2015-12-08 | 2015-12-08 | Dismounting processing unit for old circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105521983B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798413A (en) * | 2016-05-16 | 2016-07-27 | 李晓勤 | Circuit board disassembling device |
| CN107219654A (en) * | 2017-07-31 | 2017-09-29 | 京东方科技集团股份有限公司 | The device for disassembling of printed substrate is disassembled from liquid crystal display module |
| CN108526639A (en) * | 2018-06-10 | 2018-09-14 | 河南巨峰环保科技有限公司 | Useless circuit board desoldering tin takes off electronic component device |
| CN114473105B (en) * | 2022-02-28 | 2024-02-23 | 环创(厦门）科技股份有限公司 | Disassembling platform for waste circuit board |
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| CN105521983A (en) | 2016-04-27 |
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