CN105521983A - Disassembling processing unit for waste circuit board - Google Patents
Disassembling processing unit for waste circuit board Download PDFInfo
- Publication number
- CN105521983A CN105521983A CN201510898262.9A CN201510898262A CN105521983A CN 105521983 A CN105521983 A CN 105521983A CN 201510898262 A CN201510898262 A CN 201510898262A CN 105521983 A CN105521983 A CN 105521983A
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- CN
- China
- Prior art keywords
- dismounting
- circuit board
- treating apparatus
- disassembling
- old circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002699 waste material Substances 0.000 title abstract description 5
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims description 25
- 230000005540 biological transmission Effects 0.000 claims description 11
- 239000012141 concentrate Substances 0.000 claims description 8
- 230000008520 organization Effects 0.000 claims description 8
- 239000012943 hotmelt Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 21
- 230000008569 process Effects 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000011027 product recovery Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 238000000227 grinding Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 239000002912 waste gas Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 230000007096 poisonous effect Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PRPINYUDVPFIRX-UHFFFAOYSA-N 1-naphthaleneacetic acid Chemical compound C1=CC=C2C(CC(=O)O)=CC=CC2=C1 PRPINYUDVPFIRX-UHFFFAOYSA-N 0.000 description 1
- 208000028804 PERCHING syndrome Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000505 pernicious effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a disassembling processing unit, particularly relates to a disassembling processing unit for a waste circuit board, and belongs to the technical field of designing and manufacturing of electronic product recovery processing equipment. According to the disassembling processing unit for the waste circuit board, the disassembling efficiency is high, and the secondary pollution generated in the disassembling process is small. The disassembling processing unit comprises a heat disassembling system and a supporting frame comprising a containing cavity, a vibration sorting mechanism is arranged inside the containing cavity, and the heat disassembling system is installed at the position, above the vibration sorting mechanism, in the containing cavity; and a tail gas concentration output structure is arranged at the top of the containing cavity, and a material output opening is formed in the lower portion of the containing cavity.
Description
Technical field
The present invention relates to a kind of dismounting treating apparatus, especially relate to a kind of dismounting treating apparatus for old circuit board, belong to electronic product recycling equipment design and manufacturing technology field.
Background technology
Wiring board is the basis of electronic product, is parts indispensable in each electronic product.China is the production and consumption big country of world's electric equipment products, and along with the continuous renewal of product is regenerated, a large amount of electric equipment products is eliminated, and its circuit board also goes out of use thereupon.Containing multiple poisonous and harmful substance, precious metal in components and parts on circuit board, for the high value better realizing resource reclaims and environmental protection process, be necessary the dismounting carrying out components and parts before wiring board carries out fragmentation.
The assembling mode of electronic devices and components mainly contains through-hole mounting welding THD and surface mount welding SMD two kinds.In circuit board component unloading process, usually adopt the mode of heating tip-off or machinery dismounting.Wherein heating separates welding method mainly from the integrality consideration of disassembling components and parts, adopt the modes such as dielectric heating, LASER HEATING or hot-air blowing, dismantle again after components and parts solder joint is melted, there is the advantage that dismounting integrality is good, but easily produce pernicious gas in heating process and cause secondary pollution, disassemble efficiency high, disassemble efficiency lower; Rule disassembled by machinery is that destructiveness is disassembled completely, mainly adopts the cutter such as perching knife, milling cutter to be excised by the pin of components and parts, have disassemble efficiency high, disassemble the low advantage of energy consumption, but parts damage is large, to disassemble noise large.At present, both at home and abroad for the dismounting of old circuit board components and parts, carry out a large amount of experimental studies, but still there are some problems in concrete production practices application.
Chinese patent CN101010229A proposes a kind of by the method and apparatus of components and parts from globality dismounting old circuit board.First it carry out pretreatment to old circuit board, remove non-solder and fix components and parts, subsequently wiring board is fixed, hot air convection mode of heating is adopted to be melted completely by wiring board solder joint, utilizing mechanical shock to be separated separating the components and parts of postwelding from pcb board, collecting with the elasticity guipure with exciting device, sorting components and parts and welding slag.But it adopts hot air convection to heat, and the efficiency of heating surface is lower, energy consumption is large, is not suitable for producing process in enormous quantities.
Chinese patent CN101112728A discloses a kind of method and the device that are separated from wiring board efficiently, reclaim solder and dismounting components and parts.It adopts fusion welding as heat medium, heats the solder joint on welding circuit board face, utilizes special nozzle to spray high temperature and high pressure gas and solder is separated with circuit board, by making components and parts be separated with circuit board to circuit board upset vibration.But the method is using fusion welding as heat medium, by causing the poisonous and harmful substance in solder to be heated volatilization, cause secondary pollution.
Chinese patent CN101733631A discloses a kind of waste circuit board hook pulling and dismounting device.This device comprises cabinet, heating system, chain connecting gear, hook pull out Agency rolling brush mechanism.Heating system is divided into preheating zone and high-temperature region, is placed on transmission chain after the preheating of preheating zone wait tearing circuit board open, pulls out Agency rolling brush mechanism components and parts and solder are dismantled in high-temperature region by hook.This device is extracted in the process of components and parts in Gou Ba mechanism, will the pin of components and parts be caused to damage, and when hook pulls out minor diameter components and parts and larger diameter components and parts simultaneously, little components and parts cannot be extracted.
Chinese patent CN101537522A discloses a kind of printed circuit board electron components and parts and disassembles and scolding tin recovery method and equipment.Its solder furnace heating being placed in design temperature that faced up by band components and parts wiring board makes melts soldering tin, utilize the components and parts that artificial gripping is larger, wiring board containing little components and parts and scolding tin is delivered to bottom to be added with on the conveyer belt of automatic control electric heating heating apparatus, hobboing cutter is utilized to push down wiring board and carry forward, scraper being installed on rear side of hobboing cutter and rejecting components and parts and scolding tin, realizing being separated of components and parts and scolding tin by organizing hobboing cutter and the sequential engagement of scraper more.The method and the heating of equipment requirement wiring board whole process, energy consumption is high, and also has an impact to the healthy of operating personnel with the larger components and parts of artificial gripping.
Chinese patent CN102120222A discloses a kind of old circuit board Through-Hole Component disassembling apparatus and method.This device is made up of surface grinding machine, jig and dust catcher, surface grinding machine is universal plane grinding machine, jig is position self adaptation spring assembly, jig is fixed on the workbench of surface grinding machine, the circuit board component pin disassembled upwards is stuck on jig, the emery wheel of surface grinding machine and the component's feet Grinding Contact of wiring board, dust catcher is fixed on the front of emery wheel rotation direction.This device adopts grinding method to remove components and parts leg, and production operation requires high, and there is numerous defects such as noise is large, dust is many, production efficiency is low.
To sum up, disassembling of circuit board component, key is that efficiency is disassembled in reduction, improves and disassembles efficiency, realizes disassembling processing mode and reducing the secondary pollution problem of environment of mass.Up to the present, above-mentioned technology all fails to solve the problem completely.
Summary of the invention
Technical problem to be solved by this invention is: provide one to disassemble efficiency high, disassembles the dismounting treating apparatus for old circuit board that the secondary pollution that produces in process is little.
For solving the problems of the technologies described above adopted technical scheme be: a kind of dismounting treating apparatus for old circuit board, described dismounting treating apparatus comprises hot disassembly system and the bracing frame containing container cavity, the inside of described container cavity is provided with oscillating separator structure, described heat is disassembled in the container cavity that mechanism is arranged on above described oscillating separator structure, the top of described container cavity is provided with tail gas and concentrates export structure, the bottom of described container cavity is provided with material delivery outlet.
The invention has the beneficial effects as follows: by being arranged to described dismounting treating apparatus comprise the structure of hot disassembly system and the bracing frame containing container cavity, and the inside of described container cavity is provided with oscillating separator structure, the top of described container cavity is provided with tail gas and concentrates export structure, the bottom of described container cavity is provided with material delivery outlet, then described hot disassembly system is arranged in the container cavity above described oscillating separator structure.Like this, described old circuit board just can be disassembled by described hot disassembly system, and make to disassemble the wiring board after having dismantled through described hot disassembly system, dismounting treating apparatus described in exporting from described material delivery outlet after being classified by described oscillating separator structure, complete the automation of old circuit board under enclosed environment condition and disassemble work, reach the object effectively improving and disassemble efficiency; And the tail gas that container cavity top is arranged concentrates export structure, focus on after can collecting disassembling the harmful exhaust produced in process, thus avoid disassembling in process the possibility producing secondary pollution as far as possible.
Further, described hot disassembly system comprises air heat mechanism and mechanism is disassembled in rotation, and the output that the hot melt of described air heat mechanism disassembles wind is communicated with the chamber of disassembling that mechanism is disassembled in described rotation.
Be further, described rotation is disassembled mechanism and is comprised hollow shaft and be arranged on the cylinder in this hollow shaft, described chamber of disassembling is made up of the inner chamber of described cylinder, the axial side wall of described cylinder is provided with closable material input, and the output that the hot melt of described air heat mechanism disassembles wind is communicated with described chamber of disassembling by described hollow shaft.
Be further, described air heat mechanism comprises mounting bracket, heating tube and cuts only valve, the described heating tube be communicated with outside gas transmission system is arranged on described rotation by described mounting bracket and disassembles in the hollow shaft of mechanism, and described cuts the gas output end that only valve is arranged on described heating tube.
The preferred embodiment of such scheme is, described cylinder also comprises cover plate, and described material input is closed by described cover plate, and described cover plate is provided with material-dropping hole.
Be further, described oscillating separator structure is the vibratory sieve subnetting be arranged in below described hot disassembly system tilted, described material delivery outlet comprises tiny material delivery outlet and other material delivery outlet, described tiny material delivery outlet is arranged on the below of described vibratory sieve subnetting, and other described material delivery outlet is arranged on the container cavity wall of the lower side of described vibratory sieve subnetting horizontal level.
The preferred embodiment of such scheme is, is also provided with material and collects bucket, be also provided with closable charging aperture in the middle and upper part of support frame as described above between described vibratory sieve subnetting and described hot disassembly system.
Further, described dismounting treating apparatus also comprises driving mechanism, and described hot disassembly system rotates around its central axis under the driving of described driving mechanism.
Be further, described driving mechanism comprises motor, power-take-off pulley and power transmission belt, described hot disassembly system is provided with power input pulley, described power-take-off pulley is arranged on the power output shaft of described motor, and described power input pulley is connected by described power transmission belt with described power-take-off pulley.
Further, described dismounting treating apparatus also comprises controlling organization, and the control line of described hot disassembly system and described driving mechanism is connected in described controlling organization.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention for the dismounting treating apparatus of old circuit board;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the schematic diagram of the air heat mechanism that the present invention relates to;
Fig. 4 is the schematic diagram that mechanism is disassembled in the rotation that the present invention relates to.
Be labeled as in figure: hot disassembly system 1, container cavity 2, bracing frame 3, oscillating separator structure 4, tail gas concentrates export structure 5, material delivery outlet 6, air heat mechanism 7, mechanism 8 is disassembled in rotation, disassemble chamber 9, hollow shaft 10, cylinder 11, material input 12, mounting bracket 13, heating tube 14, cut only valve 15, cover plate 16, material-dropping hole 17, vibratory sieve subnetting 18, tiny material delivery outlet 19, other material delivery outlet 20, material collects bucket 21, charging aperture 22, driving mechanism 23, motor 24, power-take-off pulley 25, power transmission belt 26, power input pulley 27, controlling organization 28.
Detailed description of the invention
As shown in Figure 1, Figure 2, shown in Fig. 3 and Fig. 4 to be that one provided by the invention disassembles efficiency high, disassembles the dismounting treating apparatus for old circuit board that the secondary pollution that produces in process is little.Described dismounting treating apparatus comprises hot disassembly system 1 and the bracing frame 3 containing container cavity 2, the inside of described container cavity 2 is provided with oscillating separator structure 4, described heat is disassembled in the container cavity 2 that mechanism 1 is arranged on above described oscillating separator structure 4, the top of described container cavity 2 is provided with tail gas and concentrates export structure 5, the bottom of described container cavity 2 is provided with material delivery outlet 6.Above by described dismounting treating apparatus being arranged to the structure comprising hot disassembly system 1 and the bracing frame 3 containing container cavity 2, and the inside of described container cavity 2 is provided with oscillating separator structure 4, the top of described container cavity 2 is provided with tail gas and concentrates export structure 5, the bottom of described container cavity 2 is provided with material delivery outlet 6, then described hot disassembly system 1 is arranged in the container cavity 3 above described oscillating separator structure 4.Like this, described old circuit board just can be disassembled by described hot disassembly system 1, and make the wiring board after described hot disassembly system 1 heating has been disassembled, by exporting described dismounting treating apparatus from described material delivery outlet 6 after the classification of described oscillating separator structure 4, complete the automation of old circuit board under enclosed environment condition and disassemble work, reach the object effectively improving and disassemble efficiency; And the tail gas that container cavity 2 top is arranged concentrates export structure 5, focus on after can collecting disassembling the harmful exhaust produced in process, thus avoid disassembling in process the possibility producing secondary pollution as far as possible.
In above-mentioned embodiment, in order to simplify the structure of hot disassembly system 1 described in the application, with under the prerequisite reducing production cost again unlikely impact disassemble efficiency, facilitate again the tear down operations of postorder simultaneously.Hot disassembly system 1 described in the application is arranged to comprise air heat mechanism 7 and rotate the structure disassembling mechanism 8, and the chamber 9 of disassembling making the output of the hot melt waste gas of described air heat mechanism 7 and described rotation disassemble mechanism 8 is communicated with.Now, in order to improve the efficiency that automation is disassembled, the structure that mechanism 8 is arranged to comprise hollow shaft 10 and be arranged on the cylinder 11 in this hollow shaft 10 is disassembled in rotation described in the application, described disassemble chamber 9 and just can be made up of the inner chamber of described cylinder 11, the axial side wall of described cylinder 11 is provided with closable material input 12, and the output of the hot melt waste gas wind of described air heat mechanism is communicated with described chamber of disassembling by described hollow shaft; Described air heat mechanism 7 is arranged to the structure comprising mounting bracket 13, heating tube 14 and cut only valve 15, the described heating tube 14 be communicated with outside gas transmission system is arranged on described rotation by described mounting bracket 13 and disassembles in the hollow shaft 10 of mechanism 8, and described cuts the gas output end that only valve 15 is arranged on described heating tube 14.Like this, when inputting hot melt disassemble after solder joint melts by wind to disassembling chamber 9, then electronic devices and components can be carried out by the rotation of cylinder and be separated with disassembling of circuit board substrate.And described disassemble chamber 9 in order to the scolding tin that dismantled at the initial stage and Miniature component export immediately, in conjunction with described in cylinder 11 on need to arrange cover plate 16, the design feature that described material input 12 is closed by described cover plate 16, described cover plate 16 is provided with material-dropping hole 17.Like this, in the rotary course of cylinder, described in the scolding tin of initial stage dismounting and Miniature component just immediately can be exported by described material-dropping hole 17, disassemble chamber 9.
Further, in order to simplify the structure of described oscillating separator structure 4, making and installation and postorder is facilitated to disassemble the classification of part, oscillating separator structure 4 described in the application is the vibratory sieve subnetting 18 be arranged in below described hot disassembly system 1 tilted, described material delivery outlet 6 comprises tiny material delivery outlet 19 and other material delivery outlet 20, described tiny material delivery outlet 19 is arranged on the below of described vibratory sieve subnetting 18, and other described material delivery outlet 20 is arranged on the container cavity wall of the lower side of described vibratory sieve subnetting 18 horizontal level.And in order to improve the classification quality of the object after disassembling, being also provided with material between described vibratory sieve subnetting 18 and described hot disassembly system 1 collects bucket 21, be also provided with closable charging aperture 22 in the middle and upper part of support frame as described above 3.
Simultaneously, realize rotation to drive described hot disassembly system and disassemble work, described dismounting treating apparatus is also included driving mechanism 23 by the application, and like this, described hot disassembly system 1 just can by rotating around its central axis under the driving of described driving mechanism 23.In conjunction with design features more of the prior art, described driving mechanism 23 is arranged to the structure comprising motor 24, power-take-off pulley 25 and power transmission belt 26 by the application, this enters, described hot disassembly system 1 needs to be provided with power input pulley 27, described power-take-off pulley 25 is arranged on the power output shaft of described motor 24, like this, described power input pulley 27 is connected by described power transmission belt 26 with described power-take-off pulley 25.
Equally, the dismounting treating apparatus described in the application also comprises controlling organization 28, and the control line of described hot disassembly system 1 and described driving mechanism 23 is connected in described controlling organization 28.
Concrete operations are carried out as follows:
Before opening of device, open the cover plate on bracing frame 3 and rotate the cover plate 16 disassembled in mechanism 8, the waste and old circuit board having removed large-scale capacitor and large-scale components and parts is placed in the inner chamber of cylinder 11, admission space is no more than 2/3 of cavity volume.
Distinguish the cover plate 22 on closed drum 11 and the cover plate in frame 1 in order.
Opening device power supply, under the control of controlling organization (28), start cutting in air heat mechanism 7 respectively stop valve 15 and heating tube (14), and to arrange heating-up temperature be 235 ~ 250 DEG C, the inner chamber making the hollow shaft 10 of the air after heating on over-rotation disassemble machine structure 8 enter cylinder 21 heats wiring board to be dismantled.
Start drive motors 24 and screening mechanism 5, arranging the motor rotation time is 20 ~ 30 minutes, makes cylinder 11 start to carry out gyration under the effect of drive motors 24.
Drive motors 24 operates after a period of time, part circuit boards solder in cylinder (11) is material starts melting, part components and parts also start to come off from circuit board substrate, along with the running of drive motors (4), the material-dropping hole 17 that the material of partial hybrid scolding tin and Miniature component begins through the cover plate (26) of cylinder 11 is discharged to the outside of cylinder 21.
Oscillating separator structure 4 carries out vibration sorting to the mixed material of discharging.Wherein, the soldering tin material of small volume falls into solder by the sieve screen apertures of oscillating separator structure 4 and collects frame and reclaim, and the larger components and parts of volume tumble components and parts and collect in frame and reclaim along the screen cloth face of oscillating separator structure 4.
Motor 24 to be driven and oscillating separator structure 4 are according to after completing running the running time of setting, and close down and heater cuts air-stopping valve 15 and heating tube 14, the waste gas in cylinder 11 is discharged by the emission-control equipment simultaneously starting peripheral hardware.
After the waste gas in cylinder 11 is drained, open the cover plate on bracing frame 3, after the cover plate 16 on cylinder (11) is set to opening, again close the cover plate on bracing frame 3.
Start drive motors 4, the leftover materials in cylinder 22 are discharged.Start the sorting mechanism 4 that shakes simultaneously, vibrosieve recovery is carried out to the leftover materials of discharging in cylinder 11.
After material in cylinder 11 is drained, close down drive motors 24 and oscillating separator structure 1, the process of disassembling completes.
Claims (10)
1. the dismounting treating apparatus for old circuit board, it is characterized in that: described dismounting treating apparatus comprises hot disassembly system (1) and the bracing frame (3) containing container cavity (2), the inside of described container cavity (2) is provided with oscillating separator structure (4), described heat is disassembled mechanism (1) and is arranged in the container cavity (2) of described oscillating separator structure (4) top, the top of described container cavity (2) is provided with tail gas and concentrates export structure (5), the bottom of described container cavity (2) is provided with material delivery outlet (6).
2. the dismounting treating apparatus for old circuit board according to claim 1, it is characterized in that: described hot disassembly system (1) comprises air heat mechanism (7) and mechanism (8) is disassembled in rotation, the output that the hot melt of described air heat mechanism (7) disassembles wind is communicated with the chamber (9) of disassembling that mechanism (8) is disassembled in described rotation.
3. the dismounting treating apparatus for old circuit board according to claim 2, it is characterized in that: described rotation is disassembled mechanism (8) and comprised hollow shaft (10) and be arranged on the cylinder (11) in this hollow shaft (10), described chamber (9) of disassembling is made up of the inner chamber of described cylinder (11), the axial side wall of described cylinder (11) is provided with closable material input (12), and the output that the hot melt of described air heat mechanism disassembles wind is communicated with described chamber of disassembling by described hollow shaft.
4. the dismounting treating apparatus for old circuit board according to claim 3, it is characterized in that: described air heat mechanism (7) comprises mounting bracket (13), heating tube (14) and cuts only valve (15), the described heating tube (14) be communicated with outside gas transmission system is arranged on described rotation by described mounting bracket (13) and disassembles in the hollow shaft (10) of mechanism (8), and described cuts the gas output end that only valve (15) is arranged on described heating tube (14).
5. the dismounting treating apparatus for old circuit board according to claim 3, it is characterized in that: described cylinder (11) also comprises cover plate (16), described material input (12) is closed by described cover plate (16), and described cover plate (16) is provided with material-dropping hole (17).
6. according to claim 1, 2, 3, the dismounting treating apparatus for old circuit board described in 4 or 5, it is characterized in that: the vibration vibratory sieve subnetting (18) that be arranged in described hot disassembly system (1) below of described oscillating separator structure (4) for tilting, described material delivery outlet (6) comprises tiny material delivery outlet (19) and other material delivery outlet (20), described tiny material delivery outlet (19) is arranged on the below of described vibratory sieve subnetting (18), other described material delivery outlet (20) is arranged on the container cavity wall of the lower side of described vibratory sieve subnetting (18) horizontal level.
7. the dismounting treating apparatus for old circuit board according to claim 6, it is characterized in that: between described vibratory sieve subnetting (18) and described hot disassembly system (1), be also provided with material collect struggle against (21), be also provided with closable charging aperture (22) in the middle and upper part of support frame as described above (3).
8. the dismounting treating apparatus for old circuit board according to claim 1, it is characterized in that: described dismounting treating apparatus also comprises driving mechanism (23), described hot disassembly system (1) rotates around its central axis under the driving of described driving mechanism (23).
9. the dismounting treating apparatus for old circuit board according to claim 9, it is characterized in that: described driving mechanism (23) comprises motor (24), power-take-off pulley (25) and power transmission belt (26), described hot disassembly system (1) is provided with power input pulley (27), described power-take-off pulley (25) is arranged on the power output shaft of described motor (24), described power input pulley (27) is connected by described power transmission belt (26) with described power-take-off pulley (25).
10. the dismounting treating apparatus for old circuit board according to claim 1, it is characterized in that: described dismounting treating apparatus also comprises controlling organization (28), the control line of described hot disassembly system (1) and described driving mechanism (23) is connected in described controlling organization (28).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510898262.9A CN105521983B (en) | 2015-12-08 | 2015-12-08 | Dismounting processing unit for old circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510898262.9A CN105521983B (en) | 2015-12-08 | 2015-12-08 | Dismounting processing unit for old circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105521983A true CN105521983A (en) | 2016-04-27 |
| CN105521983B CN105521983B (en) | 2018-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510898262.9A Active CN105521983B (en) | 2015-12-08 | 2015-12-08 | Dismounting processing unit for old circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105521983B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798413A (en) * | 2016-05-16 | 2016-07-27 | 李晓勤 | Circuit board disassembling device |
| CN107219654A (en) * | 2017-07-31 | 2017-09-29 | 京东方科技集团股份有限公司 | The device for disassembling of printed substrate is disassembled from liquid crystal display module |
| CN108526639A (en) * | 2018-06-10 | 2018-09-14 | 河南巨峰环保科技有限公司 | Useless circuit board desoldering tin takes off electronic component device |
| CN114473105A (en) * | 2022-02-28 | 2022-05-13 | 环创(厦门）科技股份有限公司 | Platform is disassembled to useless circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101259555A (en) * | 2008-02-04 | 2008-09-10 | 徐志强 | Equipment for dissembling waste and old circuit board |
| CN101502903A (en) * | 2009-03-11 | 2009-08-12 | 清华大学 | Method for dissembling and processing waste and old circuit board for reuse of component |
| JP2009253163A (en) * | 2008-04-09 | 2009-10-29 | Fujitsu Ltd | Separation collection method and device for electronic component |
| CN102319723A (en) * | 2011-08-16 | 2012-01-18 | 西南科技大学 | The discarded printed circuit boards electronic devices and components are dismantled reclaimer automatically |
| CN103990879A (en) * | 2014-05-20 | 2014-08-20 | 上海交通大学 | Disassembling device of circuit board with components and parts and disassembling method of disassembling device |
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2015
- 2015-12-08 CN CN201510898262.9A patent/CN105521983B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101259555A (en) * | 2008-02-04 | 2008-09-10 | 徐志强 | Equipment for dissembling waste and old circuit board |
| JP2009253163A (en) * | 2008-04-09 | 2009-10-29 | Fujitsu Ltd | Separation collection method and device for electronic component |
| CN101502903A (en) * | 2009-03-11 | 2009-08-12 | 清华大学 | Method for dissembling and processing waste and old circuit board for reuse of component |
| CN102319723A (en) * | 2011-08-16 | 2012-01-18 | 西南科技大学 | The discarded printed circuit boards electronic devices and components are dismantled reclaimer automatically |
| CN103990879A (en) * | 2014-05-20 | 2014-08-20 | 上海交通大学 | Disassembling device of circuit board with components and parts and disassembling method of disassembling device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798413A (en) * | 2016-05-16 | 2016-07-27 | 李晓勤 | Circuit board disassembling device |
| CN107219654A (en) * | 2017-07-31 | 2017-09-29 | 京东方科技集团股份有限公司 | The device for disassembling of printed substrate is disassembled from liquid crystal display module |
| CN108526639A (en) * | 2018-06-10 | 2018-09-14 | 河南巨峰环保科技有限公司 | Useless circuit board desoldering tin takes off electronic component device |
| CN114473105A (en) * | 2022-02-28 | 2022-05-13 | 环创(厦门）科技股份有限公司 | Platform is disassembled to useless circuit board |
| CN114473105B (en) * | 2022-02-28 | 2024-02-23 | 环创(厦门）科技股份有限公司 | Disassembling platform for waste circuit board |
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| CN105521983B (en) | 2018-04-20 |
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