CN105798413A - Circuit board disassembling device - Google Patents
Circuit board disassembling device Download PDFInfo
- Publication number
- CN105798413A CN105798413A CN201610326468.9A CN201610326468A CN105798413A CN 105798413 A CN105798413 A CN 105798413A CN 201610326468 A CN201610326468 A CN 201610326468A CN 105798413 A CN105798413 A CN 105798413A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- rotating
- rotating device
- collecting
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 238000000926 separation method Methods 0.000 claims description 11
- 238000012216 screening Methods 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 18
- 238000005476 soldering Methods 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 10
- 238000004064 recycling Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 11
- 238000002485 combustion reaction Methods 0.000 description 4
- 238000011084 recovery Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003502 gasoline Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 239000002283 diesel fuel Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention provides a circuit board disassembling device. The circuit board disassembling device comprises a drive device, a heating device, a rotating device, a collecting device and a shell. The drive device, the heating device, the rotating device and the collecting device are connected with the shell. The drive device is connected with the rotating device. The heating device is connected with the rotating device. The collecting device is connected with the rotating device. Accordingly, soldering tin on a circuit board is melted by increasing temperature, and electronic elements attached to the circuit board are smoothly separated from the circuit board through centrifugal force generated through rotation. Meanwhile, the subsequent collecting device is used for independently collecting and recycling the electronic elements and the soldering tin, automatic operation of circuit board disassembling is achieved, the circuit board disassembling efficiency is improved, and the labor of operators is relieved. Meanwhile, the electronic elements and the soldering tin can be smoothly recycled, resources are saved, and the cost in the circuit board disassembling process is reduced as well. Various circuit boards can be disassembled, and the application range is wide.
Description
Technical Field
The invention relates to the field of circuit board disassembly, in particular to circuit board disassembly equipment.
Background
Along with the development of society, the use of electronic equipment is more and more, and the renewal of electronic equipment is very fast, therefore, can produce a large amount of circuit boards and need handle, and the mode of generally handling the circuit board is to disassemble the circuit board.
At present, the method for disassembling the circuit board mainly depends on manual disassembly, the soldering tin on a welding disc is melted one by using a manual handheld electric soldering iron, and electronic components are pulled out manually; therefore, the efficiency is very low, a large amount of labor is occupied, the cost is very high, and the disassembly needs of more and more circuit boards at present cannot be met.
Therefore, a high-efficiency and low-cost disassembling device is currently awaited.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a circuit board disassembling device which is used for realizing automatic disassembly of a circuit board, improving the efficiency of disassembling the circuit board, lightening the labor of an operator, smoothly recovering electronic components and soldering tin, saving resources, reducing the cost in the process of disassembling the circuit board, and being capable of disassembling various circuit boards and having wide application range; specifically, the present invention proposes the following specific examples:
the embodiment of the invention provides a circuit board disassembling device, which comprises: the device comprises a driving device, a heating device, a rotating device, a collecting device and a shell; wherein,
the driving device, the heating device, the rotating device and the collecting device are respectively connected with the shell;
the driving device is connected with the rotating device;
the heating device is connected with the rotating device;
the collecting device is connected with the rotating device.
Preferably, the driving device specifically includes: a motor and a traction belt; wherein,
the motor is fixedly connected with the shell;
the motor is connected with the traction belt;
the traction belt is connected with the rotating device.
Preferably, the heating device specifically includes: the furnace comprises a furnace core, a furnace end and a temperature sensor; wherein,
the furnace core is fixed inside the rotating device;
the temperature sensor is connected with the rotating device;
the furnace end is connected with the furnace core;
the furnace end is fixedly connected with the shell.
Preferably, the rotating device specifically includes: a hollow separating cylinder, a bearing and a rotating wheel; wherein,
the rotating wheel is connected with the hollow separation cylinder;
the bearing is connected with the hollow separation cylinder;
the bearing is fixedly connected with the shell.
Preferably, the surface of the hollow separation cylinder is of a grid-shaped structure;
the outer surface of the hollow separating cylinder is provided with a feed inlet which can be opened and closed.
Preferably, the collecting device specifically includes: separating and screening; wherein,
the separating screen is connected with the shell.
Preferably, the collecting device further comprises: a vibrator; wherein,
the vibrator is connected with the separating screen.
Preferably, the shell is provided with a feeding door and a discharging hole; wherein,
the feeding door corresponds to the rotating device;
the discharge port corresponds to the collecting device.
Preferably, a hydraulic device is further arranged on the shell; wherein,
the feeding door is connected with the hydraulic device.
Preferably, the circuit board disassembling apparatus further includes: a control device; wherein,
the control device is connected with the driving device;
the control device is connected with the heating device.
Compared with the prior art, the invention provides a circuit board disassembling device, wherein the circuit board disassembling device comprises: the device comprises a driving device, a heating device, a rotating device, a collecting device and a shell; wherein the driving device, the heating device, the rotating device and the collecting device are respectively connected with the shell; the driving device is connected with the rotating device; the heating device is connected with the rotating device; the collecting device is connected with the rotating device. With this soldering tin through raising the temperature messenger on the circuit board melts, and make the electronic components who adheres to on the circuit board separate with the circuit board smoothly through rotatory produced centrifugal force, still carry out the collection recovery respectively to electronic components and soldering tin through subsequent collection device simultaneously, the automation mechanized operation of disassembling the circuit board has been realized, the efficiency of disassembling the circuit board has been improved, the work of operator has been alleviateed, simultaneously can retrieve electronic components and soldering tin smoothly, the resource has been practiced thrift, the cost of circuit board disassembling in-process has also been reduced, and can disassemble to various circuit boards, wide application scope.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board disassembling apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a driving device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heating device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a rotating device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a collecting device according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a collecting device according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a housing according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a housing according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a circuit board disassembling apparatus according to an embodiment of the present invention;
fig. 10 is a three-view of a circuit board disassembling apparatus in a specific application environment according to an embodiment of the present invention, with a feed port of a housing in an open state;
fig. 11 is a three-view diagram of a circuit board disassembling apparatus in a specific application environment according to an embodiment of the present invention, where a feed port of a housing is closed;
fig. 12 is a schematic view of a combustion furnace core in a specific application environment according to an embodiment of the present invention.
Description of the figures
1: drive device
11: electric motor
12: traction belt
2: heating device
21: furnace core
22: furnace end
23: temperature sensor
3: rotating device
31: hollow separating cylinder
32: bearing assembly
33: rotating wheel
4: collecting device
41: separating screen
42: vibrator
5: shell body
51 feed door
52: discharge port
53: hydraulic device
6: control device
Detailed Description
Aiming at the defects in the prior art, the invention provides the circuit board disassembling equipment, which realizes the automatic operation of the circuit board disassembly, improves the efficiency of the circuit board disassembly, lightens the labor of an operator, can smoothly recover electronic components and soldering tin, saves resources, reduces the cost in the circuit board disassembling process, can disassemble various circuit boards and has wide application range; specifically, the present invention proposes the following specific examples:
example 1
Embodiment 1 of the present invention provides a circuit board disassembling apparatus, as shown in fig. 1, including: the device comprises a driving device 1, a heating device 2, a rotating device 3, a collecting device 4 and a shell 5; wherein,
the driving device 1, the heating device 2, the rotating device 3 and the collecting device 4 are respectively connected with the shell 5;
the driving device 1 is connected with the rotating device 3;
the heating device 2 is connected with the rotating device 3;
the collecting device 4 is connected with the rotating device 3.
In particular, the housing 5 is used to carry the driving means 1, the heating means 2, the rotating means 3 and the collecting means 4; the rotating device 3 is also respectively connected with a driving device 1, a heating device 2 and a collecting device 4; therefore, in a specific embodiment, the circuit board to be disassembled is placed into the rotating device 3, the heating device 2 is to raise the temperature of the space where the rotating device 3 is located, the specific temperature can be determined based on the components of the circuit board to be disassembled, and the temperature is indicated (generally, the temperature is within the range of 250 to 350 ℃) based on melting the soldering tin on the circuit board to be disassembled, in addition, the driving device 1 drives the rotating device 3 to rotate, since the soldering tin is melted, the circuit board body (for example, a PCB) is separated from the electronic components carried on the circuit board body through centrifugal force, and the subsequent collecting device 4 is used for respectively collecting the separated electronic components and the soldering tin.
In a specific embodiment, as shown in fig. 2, the driving device 1 specifically includes: a motor 11 and a traction belt 12; wherein,
the motor 11 is fixedly connected with the shell 5;
the motor 11 is connected with the traction belt 12;
the traction belt 12 is connected with the rotating device 3.
Specifically, there may be other devices to provide driving force, such as a gasoline engine, a diesel engine, etc., in addition to the motor.
While the specific traction belt 12 may be a traction belt, in a specific embodiment, taking the motor 11 as an example, the motor 11 is fixedly connected to the housing 5, and a driving wheel of the motor 11 is connected to the belt and connected to the rotating device 3 through the belt to drive the rotating device 3 to rotate.
In a specific embodiment, as shown in fig. 3, the heating device 2 specifically includes: a furnace core 21, a furnace end 22, and a temperature sensor 23; wherein,
the furnace core 21 is fixed inside the rotating device 3;
the temperature sensor 23 is connected with the rotating device 3;
the furnace end 22 is connected with the furnace core 21;
the burner 22 is fixedly connected to the housing 5.
Specifically, the burner 22 may be a fossil fuel burner such as a diesel fuel burner, a liquefied gas burner, a natural gas burner, a gasoline burner, a kerosene burner, an alcohol burner, or the like; besides, the electric furnace may be adopted, if the electric furnace is adopted (specifically, the electric furnace may also include an electric furnace wire and an electric heating pipe), the resistance heating pipe may be arranged at the furnace core 21 part, if the electric furnace is a fossil combustion furnace, the furnace end 22 generates flame through combustion, the flame reaches the furnace core 21, the furnace core 21 may be specifically in a cylindrical shape, one end of the furnace core is opened for connecting the furnace end 22, the generated flame enters the furnace core 21, and in order to perform better heating, the furnace core 21 adopts a grid structure or a structure with small holes uniformly distributed on the cylinder, so that the internal temperature of the circuit board disassembling equipment can be increased quickly and the temperature is uniform (the highest temperature can reach 600 ℃).
And whether in order to confirm the temperature in rotary device 3 has reached predetermined temperature, can be provided with temperature sensor 23, through being connected with rotary device 3, real time monitoring rotary device 3's temperature, whether reach predetermined temperature with the affirmation, make the temperature improve to predetermined temperature range fast (general temperature range can set up to 250 degrees centigrade-350 degrees centigrade between the time, in this temperature range, the tin point can melt), when the work of guarantee disassembling is gone on smoothly normally, also play energy saving's effect, can also avoid too high temperature to damage electronic components simultaneously. A control device can be arranged to monitor the temperature, and when the temperature is monitored to be insufficient, the heating device is controlled to continuously heat; and when the monitored temperature exceeds the preset temperature, the heating device is controlled, for example, the fossil combustion furnace can be controlled to extinguish the fire or burn in a small fire. In addition, the driving device can be controlled when the temperature is monitored to meet the requirement, so that the rotating device works.
In a specific embodiment, as shown in fig. 4, the rotating device 3 specifically includes: a hollow separation cylinder 31, a bearing 32, a rotating wheel 33; wherein,
the rotating wheel 33 is connected with the hollow separation cylinder 31;
the bearing 32 is connected with the hollow separation cylinder 31;
the bearing 32 is fixedly connected to the housing 5.
Specifically, the rotating wheel 33 may be a belt pulley, which is driven by a belt to further drive the rotating device to rotate, and the rotating device 3 is used to separate electronic components on the circuit board, so that the surface of the hollow separating cylinder 31 may be a grid structure, and specifically, the hollow separating cylinder 31 may be a polygonal structure or a cylindrical structure.
In addition, in order to add the circuit board to be disassembled conveniently, an openable feed inlet can be arranged on the outer surface of the hollow separation cylinder. In the specific use process, the feeding hole is in a closed state, and can be opened during feeding, and a locking device can be specifically arranged to control the opening and closing of the feeding hole.
In a specific embodiment, as shown in fig. 5, the collecting device 4 specifically includes: a separating screen 41; wherein,
the separating screen 41 is connected to the housing 5.
Specifically, the separating screen 41 may be a steel wire mesh, and the aperture of the steel wire mesh is smaller than that of the hollow separating cylinder 31 in the rotating device 3, so as to ensure that the melted solder can fall off, and the electronic components cannot remain on the separating screen 41, and in order to increase the separating effect, the separating screen 41 may have a certain angle, such as 30 degrees, with the horizontal plane when being installed.
In a specific embodiment, as shown in fig. 6, in order to more fully separate the electronic component from the solder, the collecting device 4 may further include: a vibrator 42; wherein,
the vibrator 42 is connected to the separating screen 41.
Specifically, the vibrator 42 is connected to the separating screen 41, so that the separating screen 41 vibrates when collecting, specifically, the vibrator can vibrate front and back or left and right, and the fused solder and the electronic component are better separated for respective collection.
In a specific embodiment, as shown in fig. 7, the housing 5 is further provided with a feeding gate 51 and a discharging gate 52; wherein,
the feeding door 51 corresponds to the rotating device 3 in position;
the discharge port 52 corresponds to the collecting device 4.
Specifically, in a specific application scenario, the feeding door 51 is openable and closable, and is generally disposed at the upper portion of the housing and corresponds to the rotating device 3, that is, the feeding door 51 is opened and can correspond to the feeding port of the hollow separating cylinder 31 in the rotating device 3, so that the circuit board to be disassembled can be smoothly placed in the feeding port.
The discharge opening 52 corresponds to the position of the collecting device 4, and the collecting device 4 is arranged below the discharge opening 52 due to gravity.
In a specific embodiment, as shown in fig. 8, the housing 5 is further provided with a hydraulic device 53; wherein,
the inlet gate 51 is connected to the hydraulic device 53.
Specifically, in order to control feed gate 51, especially when putting into the circuit board of waiting to disassemble, in order to avoid feed gate 51 to close, can set up a hydraulic means 53, specifically can be the hydraulic support pole, the one end of this hydraulic support pole is fixed in on the casing, feed gate 51 is connected to the other end, after this is opening, feed gate 51 can be propped by this hydraulic support pole, and then guarantee going on smoothly of feeding, and after the feeding is accomplished, then can control this hydraulic support pole shrink, make feed gate 51 close, make subsequent disassembling process go on smoothly.
In a specific embodiment, as shown in fig. 9, the circuit board disassembling apparatus further includes: a control device 6; wherein,
the control device 6 is connected with the driving device 1;
the control device 6 is connected with the heating device 2.
Specifically, in the process of disassembling, heating device 2 and drive arrangement 1 can be started respectively through controlling means 6, control the process of disassembling with this better, through a centralized controlling means, just can realize the effective control to whole device, reduce the degree of difficulty of using, it is specific, this controlling means 6 connects drive arrangement 1, control opening and closing to drive arrangement 1, this controlling means 6 still is connected with heating device 2, control opening and closing to heating device 2, and simultaneously, in order to control the temperature better, can also set up the display of a temperature, connect rotary device 3, thereby can show the temperature in the rotary device 3 in real time, provide suitable temperature for disassembling of circuit board, the normal clear of the work of recovery is disassembled in the guarantee.
Specifically, as shown in fig. 10, 11 and 12, the circuit board disassembling apparatus according to the present invention may be applied in practical environments, and of course, in addition to the circuit board disassembling apparatus shown in fig. 10, 11 and 12, the circuit board disassembling apparatus may be configured as other specific embodiments according to needs, for example, a body or a housing of the circuit board disassembling apparatus may be configured as various shapes such as a cylindrical shape, a polygonal shape, a square shape, a rectangular shape, and the like; through inside promotion temperature (specific, can set up to between 250 degrees centigrade-350 degrees centigrade) at the circuit board disassembling equipment, after reaching the temperature that needs, the tin point begins to melt, through drive arrangement drive rotary device for the circuit board is disassembled rolling, beating that equipment is inside to the circuit board incessantly for electronic component breaks away from automatically, falls out from the inside screen cloth piece of fuselage, drops on the reciprocating sieve net, and the vibrations through the reciprocating sieve make electronic component and tin water separation.
Compared with the prior art, the invention provides a circuit board disassembling device, wherein the circuit board disassembling device comprises: the device comprises a driving device, a heating device, a rotating device, a collecting device and a shell; wherein the driving device, the heating device, the rotating device and the collecting device are respectively connected with the shell; the driving device is connected with the rotating device; the heating device is connected with the rotating device; the collecting device is connected with the rotating device. With this soldering tin through raising the temperature messenger on the circuit board melts, and make the electronic components who adheres to on the circuit board separate with the circuit board smoothly through rotatory produced centrifugal force, still carry out the collection recovery respectively to electronic components and soldering tin through subsequent collection device simultaneously, the automation mechanized operation of disassembling the circuit board has been realized, the efficiency of disassembling the circuit board has been improved, the work of operator has been alleviateed, simultaneously can retrieve electronic components and soldering tin smoothly, the resource has been practiced thrift, the cost of circuit board disassembling in-process has also been reduced, and can disassemble to various circuit boards, wide application scope.
Those skilled in the art will appreciate that the figures are merely schematic representations of one preferred implementation scenario and that the blocks or flow diagrams in the figures are not necessarily required to practice the present invention.
Those skilled in the art will appreciate that the modules in the devices in the implementation scenario may be distributed in the devices in the implementation scenario according to the description of the implementation scenario, or may be located in one or more devices different from the present implementation scenario with corresponding changes. The modules of the implementation scenario may be combined into one module, or may be further split into a plurality of sub-modules.
The above-mentioned invention numbers are merely for description and do not represent the merits of the implementation scenarios.
The above disclosure is only a few specific implementation scenarios of the present invention, however, the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (10)
1. An apparatus for disassembling a circuit board, comprising: the device comprises a driving device, a heating device, a rotating device, a collecting device and a shell; wherein,
the driving device, the heating device, the rotating device and the collecting device are respectively connected with the shell;
the driving device is connected with the rotating device;
the heating device is connected with the rotating device;
the collecting device is connected with the rotating device.
2. The circuit board disassembling apparatus according to claim 1, wherein the driving device specifically includes: a motor and a traction belt; wherein,
the motor is fixedly connected with the shell;
the motor is connected with the traction belt;
the traction belt is connected with the rotating device.
3. The circuit board disassembling apparatus according to claim 1, wherein the heating device specifically includes: the furnace comprises a furnace core, a furnace end and a temperature sensor; wherein,
the furnace core is fixed inside the rotating device;
the temperature sensor is connected with the rotating device;
the furnace end is connected with the furnace core;
the furnace end is fixedly connected with the shell.
4. The circuit board disassembling apparatus according to claim 1, wherein the rotating means specifically includes: a hollow separating cylinder, a bearing and a rotating wheel; wherein,
the rotating wheel is connected with the hollow separation cylinder;
the bearing is connected with the hollow separation cylinder;
the bearing is fixedly connected with the shell.
5. The circuit board disassembling apparatus according to claim 4, wherein a surface of the hollow separation cylinder is of a grid-like structure;
the outer surface of the hollow separating cylinder is provided with a feed inlet which can be opened and closed.
6. The circuit board disassembling apparatus according to claim 1, wherein the collecting means specifically includes: separating and screening; wherein,
the separating screen is connected with the shell.
7. The circuit board disassembling apparatus according to claim 6, wherein said collecting means further comprises: a vibrator; wherein,
the vibrator is connected with the separating screen.
8. The circuit board disassembling apparatus according to claim 1, wherein a feed gate and a discharge gate are provided on the housing; wherein,
the feeding door corresponds to the rotating device;
the discharge port corresponds to the collecting device.
9. The circuit board disassembling apparatus according to claim 8, wherein a hydraulic device is further provided on the housing; wherein,
the feeding door is connected with the hydraulic device.
10. The circuit board disassembling apparatus according to claim 1, further comprising: a control device; wherein,
the control device is connected with the driving device;
the control device is connected with the heating device.
Priority Applications (1)
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CN201610326468.9A CN105798413A (en) | 2016-05-16 | 2016-05-16 | Circuit board disassembling device |
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CN201610326468.9A CN105798413A (en) | 2016-05-16 | 2016-05-16 | Circuit board disassembling device |
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Cited By (6)
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CN108526639A (en) * | 2018-06-10 | 2018-09-14 | 河南巨峰环保科技有限公司 | Useless circuit board desoldering tin takes off electronic component device |
CN108580042A (en) * | 2018-07-09 | 2018-09-28 | 湖北金科环保科技股份有限公司 | A kind of copper and tin separator of waste and old circuit board |
CN108789945A (en) * | 2018-07-09 | 2018-11-13 | 湖北金科环保科技股份有限公司 | A kind of copper and tin separating technology of waste and old circuit board |
CN109877412A (en) * | 2019-03-14 | 2019-06-14 | 安徽天兵电子科技股份有限公司 | A kind of circuit board rapid disassembling equipment |
CN111346900A (en) * | 2020-03-12 | 2020-06-30 | 李福香 | Method for utilizing and processing electrical element of sub-chip PCB |
CN111715680A (en) * | 2020-07-22 | 2020-09-29 | 清远市东江环保技术有限公司 | Abandonment electronic product recovery unit |
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CN108526639A (en) * | 2018-06-10 | 2018-09-14 | 河南巨峰环保科技有限公司 | Useless circuit board desoldering tin takes off electronic component device |
CN108580042A (en) * | 2018-07-09 | 2018-09-28 | 湖北金科环保科技股份有限公司 | A kind of copper and tin separator of waste and old circuit board |
CN108789945A (en) * | 2018-07-09 | 2018-11-13 | 湖北金科环保科技股份有限公司 | A kind of copper and tin separating technology of waste and old circuit board |
CN108789945B (en) * | 2018-07-09 | 2021-02-02 | 湖北金科环保科技股份有限公司 | Copper-tin separation process for waste circuit board |
CN108580042B (en) * | 2018-07-09 | 2024-04-19 | 湖北金科环保科技股份有限公司 | Copper-tin separation device for waste circuit boards |
CN109877412A (en) * | 2019-03-14 | 2019-06-14 | 安徽天兵电子科技股份有限公司 | A kind of circuit board rapid disassembling equipment |
CN109877412B (en) * | 2019-03-14 | 2020-12-29 | 安徽天兵电子科技股份有限公司 | Circuit board quick disassembling equipment |
CN111346900A (en) * | 2020-03-12 | 2020-06-30 | 李福香 | Method for utilizing and processing electrical element of sub-chip PCB |
CN111715680A (en) * | 2020-07-22 | 2020-09-29 | 清远市东江环保技术有限公司 | Abandonment electronic product recovery unit |
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Application publication date: 20160727 |