CN111282970A - Component and tin soldering device for removing waste circuit board and removing method thereof - Google Patents
Component and tin soldering device for removing waste circuit board and removing method thereof Download PDFInfo
- Publication number
- CN111282970A CN111282970A CN202010194492.8A CN202010194492A CN111282970A CN 111282970 A CN111282970 A CN 111282970A CN 202010194492 A CN202010194492 A CN 202010194492A CN 111282970 A CN111282970 A CN 111282970A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- waste circuit
- waste
- solder
- removing components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/40—Destroying solid waste or transforming solid waste into something useful or harmless involving thermal treatment, e.g. evaporation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
- B07B1/28—Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
- B07B1/46—Constructional details of screens in general; Cleaning or heating of screens
- B07B1/4609—Constructional details of screens in general; Cleaning or heating of screens constructional details of screening surfaces or meshes
- B07B1/4663—Multi-layer screening surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
- B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention discloses a device for removing components and tin of a waste circuit board and a removing method thereof, wherein the device comprises a heating cylinder, a discharging hopper, a vibrating screen, a valve, a high-temperature pulse valve and a hot gas conveying pipe, wherein the left end and the right end of the heating cylinder are respectively provided with a waste circuit board discharging port and a waste circuit board feeding port, the upper part of the heating cylinder is connected with the hot gas conveying pipe, the lower part of the heating cylinder is provided with a screen, the screen is connected with the discharging hopper, the discharging hopper is connected with the vibrating screen, the hot gas conveying pipe is provided with the high-temperature pulse valve, and the middle of the heating cylinder is provided with an axial screw rod.
Description
Technical Field
The invention relates to a device and a method for removing components and soldering tin, in particular to a device and a method for removing components and soldering tin of a waste circuit board, and belongs to the field of comprehensive utilization of electronic wastes.
Background
The waste circuit board is a circuit board disassembled from waste electronic and electrical equipment, belongs to electronic waste with large quantity and wide range and easy environmental pollution, and mainly comprises 30% of plastic (calculated by mass fraction, the same below), 30% of inert oxide and 40% of metal.
Because the waste circuit board not only contains various metal materials, such as copper, iron, aluminum, tin, lead and the like, but also contains rare and precious metals, such as gold, silver and the like, the waste circuit board has high recycling value; and the heavy metals such as lead and the like contained in the composite material can permeate into environmental media such as soil, water and the like if the composite material is discarded or stacked randomly, and then the composite material can be circulated through food chains of plants, animals and people. If the waste circuit board is randomly burnt, a large amount of harmful gases such as dioxin and the like can be released, and the health of human beings is threatened.
Aiming at the waste circuit boards generated by disassembly of electronic appliances after the service lives of the electronic appliances are reached, because the circuit boards contain a large number of electronic components, the waste circuit boards need to be preprocessed before the crushing process is carried out, and the electronic components are disassembled. Most of the methods used at present are manual heating and disassembling, namely, the circuit board is integrally heated by a liquid heating medium manually until soldering tin is melted, then components are peeled off from the board by a manual collision method, and the disassembled components are classified and further classified. Because the circuit board needs to be heated in a continuous high-temperature environment, firstly, toxic substances are volatilized, the environment is polluted, and the labor safety cannot be guaranteed; secondly, the electronic components are damaged due to large thermal shock, and the reutilization rate is low; the production efficiency is low under the condition of manual disassembly, and the requirement of large-scale production cannot be met. In addition, the existing method for directly crushing the circuit board with the electronic component can reduce the circuit board to the maximum extent, but increases the difficulty of recycling, and the components of the crushed product are complex, so that heavy metals in the circuit board cannot be recycled and classified.
Disclosure of Invention
The purpose of the invention is as follows: the first purpose of the invention is to provide a component and soldering tin removing device for removing a waste circuit board, which is environment-friendly, safe, high in production efficiency and high in recycling of electronic components.
The technical scheme is as follows: the invention relates to a device for removing components and soldering tin of a waste circuit board, which comprises a heating cylinder, a discharging hopper, a vibrating screen, a valve, a high-temperature pulse valve and a hot gas conveying pipe, wherein the left end and the right end of the heating cylinder are respectively provided with a waste circuit board discharging port and a waste circuit board feeding port, the upper part of the heating cylinder is connected with the hot gas conveying pipe, the lower part of the heating cylinder is provided with a screen, the screen is connected with the discharging hopper, the discharging hopper is connected with the vibrating screen, the hot gas conveying pipe is provided with the high-temperature pulse valve, the middle of the heating cylinder is provided with an axial screw rod, the components and the soldering tin can be more easily removed by arranging the high.
Furthermore, the vibrating screen is provided with an upper vibrating screen and a lower vibrating screen, and the aperture of the two vibrating screens is adjusted according to the type of the waste circuit board and the size of the waste circuit board.
Preferably, the device is in a closed condition.
Further, the feeding roller is provided with fan blades, the outer diameter linear speed of the feeding roller is synchronous with the speed of the conveying belt, a waste gas outlet is formed in the bottom of the device, and the waste gas outlet is communicated with waste gas treatment equipment.
Furthermore, the hot gas conveying pipe is connected with an air heater, the air heater is connected with an air storage tank, the air storage tank is connected with an air compressor, and the outer wall of the device is provided with a heat insulation layer.
Preferably, the axial screw rod is driven by a motor.
The invention relates to a method for removing components and soldering tin of a waste circuit board, which utilizes a device for removing the components and the soldering tin of the waste circuit board and comprises the following steps:
feeding the waste circuit board into the heating cylinder through a waste circuit board feeding port; and opening the high-temperature pulse valve, conveying the waste circuit board to a discharge port of the waste circuit board by the axial screw rod in the middle of the heating cylinder, allowing the dropped electronic components and soldering tin to enter the vibrating screen through the screen and the discharging funnel, and conveying the waste circuit board without the electronic components and the soldering tin out of the discharge port of the waste circuit board.
Further, the temperature in the heating cylinder is 200-230 ℃.
Has the advantages that: compared with the prior art, the invention has the following remarkable advantages:
(1) because the electronic components on the circuit board are mainly disassembled by manually heating soldering tin and manually colliding, the method can solve the problems that the method has large workload and low efficiency, and toxic smoke harms the health of workers and the labor safety cannot be ensured;
(2) the invention adopts the modes of spiral lifting and high-temperature pulse, accelerates the falling off of electronic components by means of the rolling of the circuit board and the pulse shock force, and improves the removal efficiency of the components and soldering tin;
(3) according to the invention, the circuit board is uniformly heated by hot air, so that the problems of nonuniform heating, volatilization of harmful substances caused by overhigh local temperature and excessive toxic smoke caused by methods such as liquid medium heating and the like are avoided;
(4) the device can effectively separate the light plate, the large electronic component, the small electronic component and the soldering tin in the circuit board, and solves the problem of manual classification;
(5) the device can enable the efficiency of electronic components and soldering tin on the circuit board to reach more than 95 percent, and solves the problem that the prior manual disassembly can not meet the requirement of large-scale production.
Drawings
Fig. 1 is a schematic structural view of a device for removing components and solder of a waste circuit board according to the present invention.
Detailed Description
The technical scheme of the invention is further explained by combining the attached drawings.
As shown in figure 1, the whole device is positioned in a stainless steel shell, and an insulating layer 16 is arranged inside the shell. The waste circuit board with electronic components is conveyed into a heating cylinder 3 by a feeding roller 1 and a feeding conveying belt 2, the outer diameter linear velocity of the feeding roller 1 is the same as the conveying belt velocity, the dissipation of the heat and waste gas in the device in the feeding process is ensured, then the waste circuit board is driven to move forward by an axial spiral rod 4 under the driving of a rotary power motor 5, hot air is introduced into the heating cylinder 3 through a valve 21 to gradually heat the circuit board in the process, the temperature in the heating cylinder 3 is 200-230 ℃, soldering tin is gradually melted in the circuit board moving process, then the hot air is sprayed to the circuit board through a high-temperature pulse valve 22, the electronic components are removed by the pulse shock force of the circuit board and the rotation and rolling of the circuit board, and finally the light board with the electronic components removed is conveyed out from a discharging roller 8 and a discharging conveying. The height adjuster 7 can adjust the angle of the heating cylinder 3 and can adjust the angle according to the conditions required by different types of circuit boards. The electronic components who drops passes through in screen cloth 6 reachs unloading funnel 10, collect flow direction shale shaker 11, shale shaker 11 sets up two upper and lower shale shaker screen cloths, the electronic components and soldering tin that drop are divided into big electronic components, little electronic components and soldering tin in shale shaker 11 to discharge from big electronic components discharge gate 12, little electronic components discharge gate 13 and soldering tin discharge gate 14 respectively, waste gas is discharged from exhaust outlet 15, exhaust outlet intercommunication exhaust-gas treatment equipment.
In order to heat the circuit board in the heating cylinder 3 uniformly, the invention adopts hot air for heating, the heating device comprises an air compressor 17, an air storage tank 18 and an air heater 19, the generated hot air is conveyed into the heating cylinder 3 by a hot air conveying pipe 20, a valve 21 and a high-temperature pulse valve 22 control the inlet and outlet of the hot air, and the quantity of hot air pipelines introduced into the heating cylinder 3 can be increased according to the actual situation.
Claims (10)
1. The utility model provides a components and parts, soldering tin device of desorption abandonment circuit board which characterized in that: including cartridge heater (3), unloading funnel (10), shale shaker (11), valve (21), high temperature pulse valve (22) and hot gas conveyer pipe (20), both ends are equipped with abandonment circuit board discharge gate and abandonment circuit board feed inlet respectively about cartridge heater (3), cartridge heater (3) upper portion is connected with hot gas conveyer pipe (20), cartridge heater (3) lower part is equipped with screen cloth (6), screen cloth (6) are connected with unloading funnel (10), unloading funnel (10) are connected with shale shaker (11), wherein, set up high temperature pulse valve (22) on hot gas conveyer pipe (20), be axial hob (4) in the middle of cartridge heater (3).
2. A device for removing components and solder from a waste circuit board as claimed in claim 1, wherein: the vibrating screen (11) is provided with an upper vibrating screen mesh and a lower vibrating screen mesh.
3. A device for removing components and solder from a waste circuit board as claimed in claim 1, wherein: the feeding roller (1) is provided with fan blades, and the outer diameter linear speed of the feeding roller (1) is synchronous with the speed of the conveying belt.
4. A device for removing components and solder from a waste circuit board as claimed in claim 1, wherein: and a height regulator (7) is arranged at the lower part of the heating cylinder (3).
5. A device for removing components and solder from a waste circuit board as claimed in claim 1, wherein: the device bottom is provided with exhaust outlet (15), exhaust outlet (15) intercommunication exhaust-gas treatment equipment.
6. A device for removing components and solder from a waste circuit board as claimed in claim 1, wherein: the feeding roller (1) and the feeding conveyer belt (2) are connected to the discarded circuit board feeding port, and the discharging roller (8) and the discharging conveyer belt (9) are connected to the discarded circuit board discharging port.
7. A device for removing components and solder from a waste circuit board as claimed in claim 1, wherein: air heater (19) is connected in hot gas conveyer pipe (20), air heater (19) connection gas holder (18), air compressor (17) are connected in gas holder (18).
8. A device for removing components and solder from a waste circuit board as claimed in claim 1, wherein: the shell of the device is provided with an insulating layer (16).
9. A method for removing components and soldering tin of a waste circuit board, which is characterized in that the device for removing components and soldering tin of a waste circuit board, which is disclosed by claim 1, comprises the following steps:
feeding the waste circuit board into the heating cylinder (3) through a waste circuit board feeding port; and (3) opening the high-temperature pulse valve (22), conveying the waste circuit board to a waste circuit board discharge port by the axial screw rod (4) in the middle of the heating cylinder (3), enabling the dropped electronic components and soldering tin to enter the vibrating screen (11) through the screen (6) and the discharging hopper (10), and sending out the waste circuit board from the waste circuit board discharge port after the electronic components and the soldering tin are removed.
10. A method for removing components and solder from waste circuit boards as claimed in claim 9, wherein: the temperature in the heating cylinder (3) is 200-230 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010194492.8A CN111282970A (en) | 2020-03-19 | 2020-03-19 | Component and tin soldering device for removing waste circuit board and removing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010194492.8A CN111282970A (en) | 2020-03-19 | 2020-03-19 | Component and tin soldering device for removing waste circuit board and removing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111282970A true CN111282970A (en) | 2020-06-16 |
Family
ID=71023840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010194492.8A Pending CN111282970A (en) | 2020-03-19 | 2020-03-19 | Component and tin soldering device for removing waste circuit board and removing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111282970A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025025A (en) * | 2020-09-03 | 2020-12-04 | 上海第二工业大学 | Desoldering and separating device for electronic components |
| CN112620854A (en) * | 2020-12-10 | 2021-04-09 | 华中科技大学 | Soldering tin recovery and automatic disassembling device for waste circuit board |
| CN112719503A (en) * | 2020-12-21 | 2021-04-30 | 华南理工大学 | Disassembling device and disassembling method for waste circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202006328U (en) * | 2011-04-08 | 2011-10-12 | 凯天环保科技股份有限公司 | Integral separating device for substrate, electronic components and soldering tin of discarded printed circuit board |
| CN103599921A (en) * | 2013-11-19 | 2014-02-26 | 西南科技大学 | Automatic lossless dismounting recovery method and automatic lossless dismounting recovery device of discarded printed circuit board |
| CN103990879A (en) * | 2014-05-20 | 2014-08-20 | 上海交通大学 | Disassembling device of circuit board with components and parts and disassembling method of disassembling device |
| JP2015018858A (en) * | 2013-07-09 | 2015-01-29 | 富士電機株式会社 | Electronic component separation apparatus of printed circuit board |
| CN207547251U (en) * | 2017-11-26 | 2018-06-29 | 鸿泰（清远）铝业有限公司 | A kind of waste and old printed circuit board disassembles retracting device |
| CN108526639A (en) * | 2018-06-10 | 2018-09-14 | 河南巨峰环保科技有限公司 | Useless circuit board desoldering tin takes off electronic component device |
-
2020
- 2020-03-19 CN CN202010194492.8A patent/CN111282970A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202006328U (en) * | 2011-04-08 | 2011-10-12 | 凯天环保科技股份有限公司 | Integral separating device for substrate, electronic components and soldering tin of discarded printed circuit board |
| JP2015018858A (en) * | 2013-07-09 | 2015-01-29 | 富士電機株式会社 | Electronic component separation apparatus of printed circuit board |
| CN103599921A (en) * | 2013-11-19 | 2014-02-26 | 西南科技大学 | Automatic lossless dismounting recovery method and automatic lossless dismounting recovery device of discarded printed circuit board |
| CN103990879A (en) * | 2014-05-20 | 2014-08-20 | 上海交通大学 | Disassembling device of circuit board with components and parts and disassembling method of disassembling device |
| CN207547251U (en) * | 2017-11-26 | 2018-06-29 | 鸿泰（清远）铝业有限公司 | A kind of waste and old printed circuit board disassembles retracting device |
| CN108526639A (en) * | 2018-06-10 | 2018-09-14 | 河南巨峰环保科技有限公司 | Useless circuit board desoldering tin takes off electronic component device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025025A (en) * | 2020-09-03 | 2020-12-04 | 上海第二工业大学 | Desoldering and separating device for electronic components |
| CN112620854A (en) * | 2020-12-10 | 2021-04-09 | 华中科技大学 | Soldering tin recovery and automatic disassembling device for waste circuit board |
| CN112620854B (en) * | 2020-12-10 | 2022-03-18 | 华中科技大学 | Soldering tin recovery and automatic disassembling device for waste circuit board |
| CN112719503A (en) * | 2020-12-21 | 2021-04-30 | 华南理工大学 | Disassembling device and disassembling method for waste circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200616 |