CN202162472U - Equipment for separating electronic components of circuit board - Google Patents
Equipment for separating electronic components of circuit board Download PDFInfo
- Publication number
- CN202162472U CN202162472U CN2011201784427U CN201120178442U CN202162472U CN 202162472 U CN202162472 U CN 202162472U CN 2011201784427 U CN2011201784427 U CN 2011201784427U CN 201120178442 U CN201120178442 U CN 201120178442U CN 202162472 U CN202162472 U CN 202162472U
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- circuit board
- equipment
- components
- electronic devices
- circuit boards
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Abstract
The utility model relates to the technical field of electronic component unsoldering, and discloses a set of equipment for separating the electronic components of a circuit board. The equipment comprises a heating treatment box which is internally provided with the following components: a heating device which heats the circuit board for melting the solder on the circuit board, and a detaching device which is used for detaching the electronic components from a circuit board substrate. The detaching device comprises a plurality of detaching mechanisms which can successively perform detaching operation on the circuit board. Compared with the prior art, the equipment for separating the electronic components of the circuit board according to the utility model is provided with a plurality of detaching mechanisms which can successively perform unsoldering on the electronic components on the circuit board. Thus, a plurality of kinds of operation for aiming at the electronic components can be adopted thereby greatly improving unsoldering effect of the electronic components on the circuit board. Furthermore the equipment is simultaneously suitable for through-hole insertion components and surface mount components.
Description
Technical field
The utility model relates to the technical field of electronic component sealing-off, and it is effective and be applicable to the equipment of the separable circuit board electronic devices and components of perforation inserting element and element pasted on surface simultaneously to relate in particular to a kind of sealing-off.
Background technology
The equipment of separate circuit boards electronic devices and components is a kind ofly to remove the electronic devices and components on the circuit board and remove the equipment of the scolder on the circuit board through external influence power.
Electronic devices and components on the circuit board of existing circulation on the market are broadly divided into two big types: perforation inserting element (Through Hole Device; THD) and surface patch element (Surface Mounting Device; SMD); Wherein, the perforation inserting element is that electronic component is inserted in the guide hole of having accomplished fluently on the circuit board substrate one side, and the another side at circuit board substrate welds then; Element pasted on surface then is that surface mount is welded on the same surface of circuit board substrate at the electronic component on the circuit board substrate.At present, the perforation inserting element mainly exists older circuit board and more rudimentary circuit board, like older generation's television circuit plate; The peripheral accessory of computer main board etc.; Its value is lower, and element pasted on surface then mainly is present in installing of new-type circuit plate or acp chip, and its value is higher.
According to discovering, when the perforation inserting element is carried out sealing-off, mainly be that the vertical direction active force plays effect; And when surperficial surface mount elements was carried out sealing-off, then the active force of horizontal direction and vertical direction can both play effect, especially; When the pin of perforation pick-and-place components was crooked, during its sealing-off, necessary forces was just bigger; In general, the sealing-off of perforation pick-and-place components wants specific surface to mount the sealing-off difficulty of part.
Generally, the process of the equipment work of separate circuit boards electronic devices and components mainly was divided into for two steps:
The first step: the heating power tip-off, promptly remove scolder being connected to electronic component and circuit board substrate.
Second step: mechanical force dismounting, separating solder and components and parts from the circuit board mainly are to make electronic component separate with scolder through external force.
The equipment of separate circuit boards electronic devices and components of the prior art often only uses a kind of mechanical dismounting mode, for example in the step of utilizing mechanical force separating solder and electronic component; Vibration, impact and scraper brush; Mode of vibration is the simplest, but its sealing-off effect to the perforation inserting element is relatively poor, impacts to make the chadless inserting element at that time; But the sealing-off effect for the crooked electronic component of pin is just poor; The scraper brush can be so that perforation inserting element sealing-off still has certain damage to electronic component, generally speaking; Adopt single machinery dismounting mode to make that the equipment of separate circuit boards electronic devices and components of the prior art is relatively poor to the sealing-off effect of electronic component, can not be applicable to the sealing-off of perforation inserting element and element pasted on surface simultaneously.
The utility model content
The purpose of the utility model is to provide a kind of equipment of separate circuit boards electronic devices and components, the problem that the equipment that is intended to solve separate circuit boards electronic devices and components of the prior art is relatively poor to the sealing-off effect of electronic component, can not be applicable to perforation inserting element and element pasted on surface sealing-off simultaneously.
The utility model is to realize like this; A kind of equipment of separate circuit boards electronic devices and components; Comprise the heat treated case; Have in the said heat treated case and can heat so that the heater that the scolder on the circuit board dissolves and being used for disassembles electronic component from circuit board substrate provision for disengagement circuit board, said provision for disengagement comprises that several can carry out the disassembly mechanism of disassembling section in regular turn to circuit board.
Further; Said disassembly mechanism is respectively and can carries out the impact assembly of blasting operation and the brush assembly that can carry out brush to circuit board to circuit board; According to the direction of circuit board through the approach in the said heat treated case, said impact assembly and said brush assembly are placed in regular turn.
Further, have in the said heater and be used for ceramic Infrared Heating sheet that circuit board is heated.
Further, said ceramic Infrared Heating sheet is two, and said two ceramic Infrared Heating sheets are oppositely arranged.
Further; Said equipment has first gathering-device and second gathering-device that is used to collect the electronic component that comes off from circuit board; Said first gathering-device place said impact assembly under, said second gathering-device place said brush assembly under.
Further, said equipment has the transport that is used for transporting circuit board, and said transport runs through said heat treated case.
Further, said transport comprises Power Component and two tracks that are oppositely arranged that can be driven by said Power Component.
Further, said track is provided with and is used to the anchor clamps clamping circuit board and can on said track, move.
Further, said equipment has fume extracting device, and it is inner that said fume extracting device is communicated with said heat treated case.
Further, said equipment has and is used to control the control device that said heater and said provision for disengagement are opened or closed, and said control device is electrically connected at said heater and said provision for disengagement.
Compared with prior art; The equipment of the separate circuit boards electronic devices and components in the utility model has several disassembly mechanisms that can carry out sealing-off in regular turn to the electronic component on the circuit board; Like this, a plurality of disassembly mechanisms can adopt multiple operation to electronic component according to elements different on the circuit board; Improve the sealing-off effect of electronic component on the circuit board greatly, and be applicable to perforation inserting element and surface patch element simultaneously.
Description of drawings
Fig. 1 is that the master of the equipment that provides of the utility model embodiment looks sketch;
Fig. 2 is the diagrammatic top view of the equipment that provides of the utility model embodiment.
The specific embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The utility model provides a kind of equipment of separate circuit boards electronic devices and components; Comprise the heat treated case; Have in the said heat treated case and can heat so that the heater that the scolder on the circuit board dissolves and being used for disassembles electronic component from circuit board substrate provision for disengagement circuit board, said provision for disengagement comprises that several can carry out the disassembly mechanism of disassembling section in regular turn to circuit board.
In the utility model; Has several can carry out sealing-off in regular turn to the electronic component on the circuit board disassembly mechanism in the equipment of separate circuit boards electronic devices and components; Like this; Can adopt multiple operation, can improve the sealing-off effect of electronic component on the circuit board greatly, and be applicable to perforation inserting element and surface patch element simultaneously to electronic component.
Below in conjunction with concrete accompanying drawing detailed description is carried out in the realization of the utility model.
Shown in Fig. 1～2, a preferred embodiment that provides for the utility model.
In the present embodiment; Equipment 1 is in order to separate the electronic component on the circuit board 2 with circuit board substrate, they must be through two step process, and first step is the heating power tip-off; I.e. heating makes the scolder on the circuit board 2 dissolve, thereby removes the restriction of scolder to electronic component; Second step is the mechanical force dismounting, is about to electronic component and spins off basically from circuit board 2, makes scolder separate with electronic component.
Equipment 1 in the present embodiment comprises heat treated case 12; Have in this heat treated case 12 and be used for circuit board 2 is heated so that the heater 13 that the scolder of circuit board 2 dissolves, and be used for provision for disengagement that electronic component is disassembled from the substrate of circuit board 2, in order to make 1 pair of electronic component of this equipment have sealing-off effect preferably; Can simultaneous adaptation in the sealing-off of perforation inserting element and element pasted on surface; Have a plurality of disassembly mechanisms that can carry out disassembling section in regular turn to electronic component in this provision for disengagement, like this, circuit board 2 gets into after the heat treated case 12; Via heater 13 heating; Scolder on it is in melting state, carries out disassembling section in regular turn via a plurality of disassembly mechanisms again, can fully the electronic component on the circuit board substrate be disassembled; Its dismounting is effective, and is applicable to the sealing-off dismounting of perforation inserting element and element pasted on surface simultaneously.
Particularly; Disassembly mechanism in the provision for disengagement is respectively impact assembly 14 that can impact circuit board 2 and the brush assembly 15 that can carry out brush to circuit board 2; And, impact assembly 14 and be provided with in regular turn, like this with brush assembly 15 along the direction of the circulating pathway of circuit board 2 in heat treated case 12; Impact assembly 14 circuit board 2 relatively impacts; Thereby make the perforation inserting element and the element pasted on surface of pin class break away from from circuit board substrate, then, 15 of brush assemblies can carry out brush to circuit board 2; Feasible perforation inserting element and the circuit board 2 that remains in the clubfoot formula of the difficulty dismounting on the circuit board substrate breaks away from, thereby realizes the disengaging fully of electronic component and circuit board substrate.
Certainly, in practical operation, impacting assembly 14 also can be the vibration component that circuit board 2 is vibrated, and concrete design is decided by user's real needs.
In the present embodiment, above-mentioned impact assembly 14 can be the pneumatic striking mechanism of ting model, like this; Guarantee impacting assembly 14 can not give circuit board 2 excessive impulsive force; Thereby avoid circuit board 2 fracture, brush assembly 15 can be hobboing cutter, and it can be to the brush of rolling of the surface of circuit board 2.
Certainly, impact assembly 14 and also can be the pneumatic impact apparatus that can produce little impulsive force, brush assembly 15 also can other can carry out the cutter class apparatus of brush for scraper etc.
Scolder in the circuit board 2 is generally leaded scolding tin, and the fusing point of traditional leaded scolding tin is about 180 ℃, and novel scolder fusing point then reaches 250 ℃, so the temperature upper limit of the heater 13 in this equipment must reach 260 ℃, can not be lower than 200 ℃.
In the present embodiment, what heater 13 adopted is the Infrared Heating method, and it is fast that it has firing rate, Controllable Temperature, and good energy-conserving effect particularly, has ceramic Infrared Heating sheet in the heater 13.
Certainly, this heater 13 also can adopt multiple other heating means, and like the air heat method, liquid heat method and LASER HEATING method adopt different heating means, and its needed equipment that is used to heat is also just different.
Because the scolder that dissolves is easy to solidify, therefore, the ceramic Infrared Heating sheet in the present embodiment is two; Be that heater 13 comprises two ceramic Infrared Heating sheets, two ceramic Infrared Heating sheets are oppositely arranged, and circuit board 2 can be from passing through between them; Like this, being positioned at top ceramic Infrared Heating sheet is used for circuit board 2 heating are made that the scolder on the circuit board 2 dissolves; Be positioned at following ceramic Infrared Heating sheet and be used for circuit board 2 heat tracings, it does not need too high power, thereby; During through provision for disengagement, the scolder on the circuit board 2 can not solidify, in order to avoid influence the sealing-off effect.
During circuit board 2 process provisions for disengagement; Electronic component on the circuit board 2 is owing to impact assembly 14 and the effect of brush assembly 15; Can come off from circuit board substrate, for the collection to electronic component utilizes again, this equipment 1 also comprises first gathering-device 16 and second gathering-device 17 that is used to collect electronic component; This first gathering-device 16 be positioned at impact assembly 14 under; Be used to collect the electronic component that comes off owing to the effect of impacting assembly 14, second gathering-device 17 be positioned at brush assembly 15 under, be used to collect the electronic component that the effect owing to brush assembly 15 comes off.
This equipment 1 also has the 3rd gathering-device 18, and the end that it places the heat treated case is used to collect and carries out the circuit board that sealing-off is handled.
This equipment 1 is in the process of carrying out circuit board 2 sealing-offs, and for can automatic transport circuit board 2, this equipment 1 also has transport 11; This transport 11 is used for transporting circuit board 2, and it is through heat treated case 12, like this; Be placed on the circuit board 2 on the transport 11,, can get into heat treated case 12 along with the effect of transport 11; After the effect via heat treated case 12, from heat treated case 12, transport out.
This transport 11 comprises actuating unit 111 and the track 112 that is oppositely arranged by two of these actuating unit 111 drives; Be respectively equipped with the anchor clamps 19 that can on track 112, move and be used to clamp circuit board 2 on the track 112; For the circuit board 2 that is applicable to different size length, the relative position that is arranged on the anchor clamps 19 on two tracks 112 can be regulated.
In the present embodiment, track 112 is a steel track 112, and it can stand certain impact, and when when carrying out blasting operation, the circuit board 2 that can guarantee to be clamped on the anchor clamps 19 can be through can standing percussion.
When circuit board 2 heats and carries out the sealing-off operation in heat treated case 12; Whole heat treated case 12 is in sealing state, and for the flue gas that makes heater 13 produce can emit, this equipment 1 also has fume extracting device; This fume extracting device is communicated with heat treated case 12 inside; Like this, circuit board 2 is heated, sealing-off when operation, the flue gas that heat treated case 12 is inner etc. can smooth discharge come out.
In order to make heater 13 and the opening and closing of provision for disengagement in this equipment 1 all realize automation; This equipment 1 also has control device; Controlled refrigerating/heating apparatus 13 of this control device and provision for disengagement, it is electrically connected at heater 13 and control device, realizes its opening and closing.
In the present embodiment, this control device is the PLC control circuit.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.
Claims (10)
1. the equipment of separate circuit boards electronic devices and components; Comprise the heat treated case; Have in the said heat treated case and can heat so that the heater that the scolder on the circuit board dissolves and being used for disassembles electronic component from circuit board substrate provision for disengagement circuit board; It is characterized in that said provision for disengagement comprises that several can carry out the disassembly mechanism of disassembling section in regular turn to circuit board.
2. the equipment of a kind of separate circuit boards electronic devices and components as claimed in claim 1; It is characterized in that; Said disassembly mechanism is respectively and can carries out the impact assembly of blasting operation and the brush assembly that can carry out brush to circuit board to circuit board; According to the direction of circuit board through the approach in the said heat treated case, said impact assembly and said brush assembly are placed in regular turn.
3. the equipment of a kind of separate circuit boards electronic devices and components as claimed in claim 1 is characterized in that, has in the said heater to be used for ceramic Infrared Heating sheet that circuit board is heated.
4. the equipment of a kind of separate circuit boards electronic devices and components as claimed in claim 3 is characterized in that, said ceramic Infrared Heating sheet is two, and said two ceramic Infrared Heating sheets are oppositely arranged.
5. like the equipment of each described a kind of separate circuit boards electronic devices and components of claim 1 to 4; It is characterized in that; Said equipment has first gathering-device and second gathering-device that is used to collect the electronic component that comes off from circuit board; Said first gathering-device place said impact assembly under, said second gathering-device place said brush assembly under.
6. the equipment of a kind of separate circuit boards electronic devices and components as claimed in claim 5 is characterized in that, said equipment has the transport that is used for transporting circuit board, and said transport runs through said heat treated case.
7. the equipment of a kind of separate circuit boards electronic devices and components as claimed in claim 6 is characterized in that, said transport comprises Power Component and two tracks that are oppositely arranged that can be driven by said Power Component.
8. the equipment of a kind of separate circuit boards electronic devices and components as claimed in claim 7 is characterized in that, said track is provided with and is used to the anchor clamps clamping circuit board and can on said track, move.
9. the equipment of a kind of separate circuit boards electronic devices and components as claimed in claim 1 is characterized in that, said equipment has fume extracting device, and it is inner that said fume extracting device is communicated with said heat treated case.
10. the equipment of a kind of separate circuit boards electronic devices and components as claimed in claim 1; It is characterized in that; Said equipment has and is used to control the control device that said heater and said provision for disengagement are opened or closed, and said control device is electrically connected at said heater and said provision for disengagement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201784427U CN202162472U (en) | 2011-05-27 | 2011-05-27 | Equipment for separating electronic components of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201784427U CN202162472U (en) | 2011-05-27 | 2011-05-27 | Equipment for separating electronic components of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202162472U true CN202162472U (en) | 2012-03-14 |
Family
ID=45798323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201784427U Expired - Lifetime CN202162472U (en) | 2011-05-27 | 2011-05-27 | Equipment for separating electronic components of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202162472U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962672A (en) * | 2014-05-05 | 2014-08-06 | 苏玉琴 | Soldering tin separator |
| WO2015192335A1 (en) * | 2014-06-18 | 2015-12-23 | Empire Technology Development Llc | Apparatus, methods, and systems for removing components from a circuit board |
| CN111940867A (en) * | 2020-09-04 | 2020-11-17 | 清远市东江环保技术有限公司 | Intelligent disassembling and sorting method for waste circuit board devices |
-
2011
- 2011-05-27 CN CN2011201784427U patent/CN202162472U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962672A (en) * | 2014-05-05 | 2014-08-06 | 苏玉琴 | Soldering tin separator |
| WO2015192335A1 (en) * | 2014-06-18 | 2015-12-23 | Empire Technology Development Llc | Apparatus, methods, and systems for removing components from a circuit board |
| CN111940867A (en) * | 2020-09-04 | 2020-11-17 | 清远市东江环保技术有限公司 | Intelligent disassembling and sorting method for waste circuit board devices |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 336400 Jiangxi Yichun Fengcheng city resources recycling industry base Patentee after: JIANGXI GREEN ECO-MANUFACTURE RESOURCE CYCLE Co.,Ltd. Patentee after: GEM Co.,Ltd. Address before: 336400 Jiangxi Yichun Fengcheng city resources recycling industry base Patentee before: JIANGXI GREEN ECO-MANUFACTURE RESOURCE CYCLE Co.,Ltd. Patentee before: SHENZHEN GEM HIGH-TECH Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201104 Address after: 331100 Jiangxi Yichun Fengcheng city resources recycling industry base Patentee after: JIANGXI GREEN ECO-MANUFACTURE RESOURCE CYCLE Co.,Ltd. Address before: 336400 Jiangxi Yichun Fengcheng city resources recycling industry base Patentee before: JIANGXI GREEN ECO-MANUFACTURE RESOURCE CYCLE Co.,Ltd. Patentee before: GEM Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120314 |
|
| CX01 | Expiry of patent term |