CN111940867A - Intelligent disassembling and sorting method for waste circuit board devices - Google Patents
Intelligent disassembling and sorting method for waste circuit board devices Download PDFInfo
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- CN111940867A CN111940867A CN202010918947.6A CN202010918947A CN111940867A CN 111940867 A CN111940867 A CN 111940867A CN 202010918947 A CN202010918947 A CN 202010918947A CN 111940867 A CN111940867 A CN 111940867A
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- 239000002699 waste material Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000004321 preservation Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 230000002950 deficient Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims description 3
- 230000035939 shock Effects 0.000 claims description 3
- 238000010408 sweeping Methods 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 17
- 230000008569 process Effects 0.000 abstract description 11
- 238000011084 recovery Methods 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 150000002739 metals Chemical class 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 5
- 231100000331 toxic Toxicity 0.000 abstract description 5
- 230000002588 toxic effect Effects 0.000 abstract description 5
- 229910052755 nonmetal Inorganic materials 0.000 abstract description 3
- 239000010970 precious metal Substances 0.000 abstract description 3
- 230000008929 regeneration Effects 0.000 abstract description 3
- 238000011069 regeneration method Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 238000004064 recycling Methods 0.000 description 7
- 230000006378 damage Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses an intelligent disassembling and sorting method for waste circuit board devices, which comprises the following steps: heating and disassembling the circuit board with the inserted components; heating and disassembling the circuit board of the surface mounted device; detecting the performance of the plug-in component and the patch component; and classifying the plug-in components and the patch components. The PCB is intelligently disassembled from the waste circuit board, so that the components can be recycled, toxic and harmful substances are easy to treat, the disassembled PCB is convenient to recycle precious metals and nonmetal materials, and the resource utilization efficiency of the waste circuit board is greatly improved; the invention carries out secondary crushing on the waste circuit board through the crusher, realizes the recovery of valuable metals of the waste circuit board through a high-voltage eddy current technology sorting technology, is automatic in the whole process and free from pollution, and realizes the environment-friendly recovery and high-utilization-rate regeneration of the valuable metals on the waste circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board disassembly, in particular to an intelligent disassembling and sorting method for waste circuit board devices.
Background
According to the investigation of relevant departments, 10 hundred million abandoned mobile phones are deposited in China at present, and other abandoned household appliances such as computers, televisions, refrigerators, air conditioners and the like which are replaced every year are not few. In 2016, the 14 products entering the subsidy list generate 1038 ten thousand tons of waste electronic products, and in 2020, the waste electronic products will reach 1550 ten thousand tons, and in 2030 or more than 2000 ten thousand tons. The average annual growth rate is about 7.5%, and the increase of waste electronic and electric products is accompanied by the sharp increase of waste circuit boards. At present, the total amount of the waste circuit boards in China reaches over 50 million tons every year, and the waste circuit boards are continuously increased at a rate of 13 percent, so that the waste circuit boards have a very wide market prospect of recycling renewable resources.
The waste circuit board is provided with a large number of high-value components, including a Surface Mounted Device (SMD) and a plug-in device (THD), such as various Integrated Circuits (ICs), diodes, triodes, photoelectric devices, capacitance resistors, various slot interfaces and the like, so that the waste circuit board is always the focus of resource utilization attention of waste electrical and electronic products.
The method for disassembling the waste PCB by adopting a high-temperature heating technology is a mainstream technology for efficiently and nondestructively disassembling components at present, and at present, more researches at home and abroad mainly focus on the aspects of various heating process flows and method principles, such as an infrared heating technology, a fluid heating technology, laser heating and the like. The principle of the disassembling technology is that high-temperature heating is adopted to melt soldering tin, and then external force is adopted to separate components. They share a common disadvantage: the plastic package IC chip on the component is easily layered due to moisture caused by directly disassembling the waste circuit board at high temperature, so that the reliability of the chip is seriously damaged. At present, more advanced nondestructive disassembly methods for components at home and abroad comprise an appearance size image recognition detection method, a component grinding self-adaptive disassembly method and the like.
In order to improve the disassembly and recovery efficiency of waste circuit board devices, an intelligent disassembly and sorting method of the waste circuit board devices is provided.
Disclosure of Invention
In order to solve the technical problems, the invention provides the following technical scheme:
the invention provides an intelligent disassembling and sorting method for waste circuit board devices, which comprises the following steps:
s1, heating and disassembling the circuit board with the inserted components;
s2, heating and disassembling the patch component circuit board;
s3, detecting the performance of the plug-in component and the patch component;
and S4, classifying the plug-in components and the chip components.
As a preferred technical solution of the present invention, the S1 specifically includes the following steps:
s1-1, baking and dehumidifying the circuit board of the plug-in component;
s1-2, removing components in a non-welding mode, and straightening pins of the plug-in components to be removed on the circuit board as far as possible;
s1-3, judging the melting point temperature of the solder used by the circuit board, and heating the solder until the solder is fully melted;
and S1-4, removing the solder by using an air knife to form compressed hot air and collecting the solder.
As a preferred technical solution of the present invention, the S2 specifically includes the following steps:
s2-1, baking and dehumidifying the patch component circuit board;
s2-2, judging the melting point temperature of the solder used by the circuit board, heating by hot air convection, and gradually raising the temperature and heating through three stages of preheating, high-temperature heating and heat preservation, so as to reduce thermal shock to the maximum extent until the solder is fully melted;
s2-3, disassembling the chip components by adopting a vibration impact disassembling method, and disassembling the inserted components by adopting a horizontal sweeping disassembling method.
As a preferred technical solution of the present invention, the S3 specifically includes the following steps:
s3-1, appearance inspection, and defective components and parts are removed; screening by adopting an image fuzzy recognition mode, and detecting the passing of normal component fuzzy set with membership degree greater than 0.9;
s3-2, performing impedance curve comparison on the electrical performance of the patch component;
s3-3, carrying out on-off test on the plug-in component;
and S3-4, testing capacitance and leakage resistance of the capacitor.
And S3-5, carrying out reliability detection on the tested components.
In a preferred embodiment of the present invention, in S1-1 and S2-1, the board on which the component is mounted and the board on which the component is mounted are dehumidified by an air-blowing dry box, respectively.
In a preferred embodiment of the present invention, in S1-2, the pins of the plug-in component are purged with high-pressure hot air.
In a preferred embodiment of the present invention, in S1-3, the solder is heated by an infrared tube.
As a preferred technical scheme of the invention, a zone temperature heating mode is adopted when the circuit board of the chip component is disassembled.
The invention has the beneficial effects that:
the intelligent disassembling and sorting method for the waste circuit board devices intelligently disassembles the components from the waste circuit boards, can realize the recycling of the components, is easy to treat toxic and harmful substances, is convenient for the disassembled PCB to realize the recycling of precious metals and non-metal materials, and greatly improves the resource utilization efficiency of the waste circuit boards.
The invention can carry out secondary crushing on the waste circuit board through the crusher, realize the recovery of valuable metals of the waste circuit board through a high-voltage eddy current technology separation technology, realize the whole process automation and no pollution, and realize the environment-friendly recovery and high-utilization-rate regeneration of the valuable metals on the waste circuit board.
Thirdly, the invention combines the structure and the assembly characteristic of the circuit board, researches and develops a technology for intelligently disassembling and sorting the components on the waste printed circuit board by aiming at reusing the components with high added value, solves the layering problem of the plastic package IC chip in the disassembling process, and carries out the performance detection process technology on the components, so that the functions and the performance of the disassembled components are not damaged basically.
The invention can realize the intelligent recycling of components, is easy to treat toxic and harmful substances, eliminates the natural environmental pollution in the circuit board disassembly process, improves the working environment of the waste circuit board disassembly operation, and has extremely high economic benefit and environmental significance.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of an intelligent disassembling and sorting method for waste circuit board devices according to the present invention;
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example (b): as shown in fig. 1, an intelligent disassembling and sorting method for waste circuit board devices includes the following steps:
s1, heating and disassembling the circuit board of the plug-in component, specifically:
s1-1, baking and dehumidifying the circuit board with the plugged components through a blast drying box; s1-2, removing components in a non-welding mode, straightening pins of the plug-in components to be removed on the circuit board as far as possible, purging the pins of the plug-in components by high-pressure hot air, and reducing damage of high temperature to the components to the maximum extent, wherein the heating part is a welding spot;
s1-3, judging the melting point temperature of the solder used by the circuit board, and heating the solder by adopting an infrared tube until the solder is fully melted; the infrared tube is adopted to heat the welding material, so that the problem of uneven heating caused by the difference of the sizes and the heat capacities of the components can be solved;
and S1-4, removing the solder by using an air knife to form compressed hot air and collecting the solder.
S2, heating and disassembling the patch component circuit board, specifically:
s2-1, baking and dehumidifying the patch component circuit board through a blast drying box;
s2-2, judging the melting point temperature of the solder used by the circuit board, heating by hot air convection, and gradually raising the temperature and heating through three stages of preheating, high-temperature heating and heat preservation, so as to reduce thermal shock to the maximum extent until the solder is fully melted; a subarea temperature heating mode is adopted when the circuit board of the surface mounted device is disassembled, the temperature control is accurate, the heating is uniform, and the damage of the device caused by overhigh local temperature is effectively prevented;
s2-3, disassembling the chip components by adopting a vibration impact disassembling method, and disassembling the inserted components by adopting a horizontal sweeping disassembling method.
S3, detecting the performance of the plug-in component and the patch component, specifically:
s3-1, appearance inspection, and defective components and parts are removed; screening by adopting an image fuzzy recognition mode, and detecting the passing of normal component fuzzy set with membership degree greater than 0.9;
s3-2, performing impedance curve comparison on the electrical performance of the patch component;
s3-3, carrying out on-off test on the plug-in component;
and S3-4, testing capacitance and leakage resistance of the capacitor.
And S3-5, carrying out reliability detection on the tested components.
And S4, classifying the plug-in components and the chip components.
In order to realize the reuse of components on the waste circuit board, the invention quantitatively analyzes the temperature distribution of the components on the circuit board mainly comprising the surface mounted components aiming at the unsoldering process on the basis of analyzing the assembly and the structural characteristics of the circuit board, and determines the heating process of the circuit board of the same type. Aiming at the connection mode of the circuit board and the components, models of component disassembly acceleration, separation displacement and disassembly energy are established, a component reuse-oriented waste circuit board disassembly process is provided, and corresponding disassembly equipment is developed respectively aiming at the circuit board mainly comprising the patch components and the circuit board mainly comprising the plug-in components.
The invention intelligently disassembles the components from the waste circuit board, can realize the recycling of the components, is easy to treat toxic and harmful substances, is convenient for the disassembled PCB to realize the recycling of precious metals and non-metal materials, and greatly improves the resource utilization efficiency of the waste circuit board.
The invention carries out secondary crushing on the waste circuit board by the crusher which is automatically researched, designed and optimized, realizes the recovery of valuable metals of the waste circuit board by a high-voltage eddy current technology separation technology, is automatic in the whole process and free from pollution, realizes the environment-friendly recovery and high regeneration utilization rate of the valuable metals on the waste circuit board, and has remarkable social benefit. In addition, the invention can realize the intelligent recycling of components, is easy to treat toxic and harmful substances, eliminates the natural environmental pollution in the circuit board disassembly process, improves the working environment of the waste circuit board disassembly operation, and has extremely high economic benefit and environmental significance.
The working principle is as follows: aiming at the defect that the plastic package IC chip is damaged in a layering way due to the circuit board disassembling process which is popular in the domestic industry at present, two key technologies, namely a waste circuit board heating process and a waste circuit board disassembling process which mainly use plug-in components and patch components, are researched respectively.
The infrared radiation heating technology of the waste circuit board comprises the following steps: the infrared tube is adopted to directly heat the solder, so that the damage of components due to uneven temperature rise or high temperature caused by large size and large heat capacity difference and uneven distribution of the components on the circuit board is avoided.
The hot air convection heating technology of the waste circuit board comprises the following steps: by adopting the partitioned temperature control, the temperature control is accurate and uniform, and the uniform distribution of the heating temperature of the surface mounted components packaged in different packages on the circuit board is ensured through the three-stage heating process of preheating, high-temperature heating and heat preservation, so that the problem that the IC chip is heated to generate the layering defect and the like is avoided.
The technology for intelligently tin-removing and disassembling components comprises the following steps: the removal and the collection of solder can be realized to the hot air that can adopt the air knife to form the compression, effectively avoids directly disassembling components and parts and needs too much energy, and furthest reduces and disassembles the energy consumption, can reduce the harm that high temperature disassembled the process and led to the fact components and parts effectively again, and then has effectively guaranteed the reusability of disassembling back components and parts.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. An intelligent disassembling and sorting method for waste circuit board devices is characterized by comprising the following steps:
s1, heating and disassembling the circuit board with the inserted components;
s2, heating and disassembling the patch component circuit board;
s3, detecting the performance of the plug-in component and the patch component;
and S4, classifying the plug-in components and the chip components.
2. The method for intelligently disassembling and sorting waste circuit board devices according to claim 1, wherein the step S1 specifically includes the steps of:
s1-1, baking and dehumidifying the circuit board of the plug-in component;
s1-2, removing components in a non-welding mode, and straightening pins of the plug-in components to be removed on the circuit board as far as possible;
s1-3, judging the melting point temperature of the solder used by the circuit board, and heating the solder until the solder is fully melted;
and S1-4, removing the solder by using an air knife to form compressed hot air and collecting the solder.
3. The method for intelligently disassembling and sorting waste circuit board devices according to claim 1, wherein the step S2 specifically includes the steps of:
s2-1, baking and dehumidifying the patch component circuit board;
s2-2, judging the melting point temperature of the solder used by the circuit board, heating by hot air convection, and gradually raising the temperature and heating through three stages of preheating, high-temperature heating and heat preservation, so as to reduce thermal shock to the maximum extent until the solder is fully melted;
s2-3, disassembling the chip components by adopting a vibration impact disassembling method, and disassembling the inserted components by adopting a horizontal sweeping disassembling method.
4. The method for intelligently disassembling and sorting waste circuit board devices according to claim 1, wherein the step S3 specifically includes the steps of:
s3-1, appearance inspection, and defective components and parts are removed; screening by adopting an image fuzzy recognition mode, and detecting the passing of normal component fuzzy set with membership degree greater than 0.9;
s3-2, performing impedance curve comparison on the electrical performance of the patch component;
s3-3, carrying out on-off test on the plug-in component;
and S3-4, testing capacitance and leakage resistance of the capacitor.
And S3-5, carrying out reliability detection on the tested components.
5. The intelligent disassembling and sorting method for the waste circuit board devices according to any one of claims 2 or 3, wherein in S1-1 and S2-1, the circuit boards with the components and the chip components are dehumidified by a blowing drying oven respectively.
6. The intelligent disassembling and sorting method for the waste circuit board devices according to claim 2, wherein in the step S1-2, the pins of the plug-in components are purged by high-pressure hot air.
7. The intelligent disassembly and sorting method for waste circuit board devices as claimed in claim 2, wherein in S1-3, the solder is heated by infrared tube.
8. The intelligent disassembling and sorting method for the waste circuit board devices according to claim 3, wherein in the step S2-2, a partition temperature heating mode is adopted when the chip component circuit boards are disassembled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010918947.6A CN111940867A (en) | 2020-09-04 | 2020-09-04 | Intelligent disassembling and sorting method for waste circuit board devices |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010918947.6A CN111940867A (en) | 2020-09-04 | 2020-09-04 | Intelligent disassembling and sorting method for waste circuit board devices |
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| CN111940867A true CN111940867A (en) | 2020-11-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112570839A (en) * | 2020-12-16 | 2021-03-30 | 国网江苏省电力有限公司营销服务中心 | Timing and fixed-point heating desoldering device and method for circuit board component |
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| CN212371373U (en) * | 2020-09-04 | 2021-01-19 | 清远市东江环保技术有限公司 | Intelligent disassembling and sorting system for waste circuit board devices |
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2020
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| CN101502903A (en) * | 2009-03-11 | 2009-08-12 | 清华大学 | Method for dissembling and processing waste and old circuit board for reuse of component |
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