CN113333887A - Automatic maintenance system of MINI LED - Google Patents
Automatic maintenance system of MINI LED Download PDFInfo
- Publication number
- CN113333887A CN113333887A CN202110781415.7A CN202110781415A CN113333887A CN 113333887 A CN113333887 A CN 113333887A CN 202110781415 A CN202110781415 A CN 202110781415A CN 113333887 A CN113333887 A CN 113333887A
- Authority
- CN
- China
- Prior art keywords
- chip
- pcb
- tin
- soldering tin
- welding machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012423 maintenance Methods 0.000 title claims abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 45
- 238000005476 soldering Methods 0.000 claims abstract description 27
- 238000003466 welding Methods 0.000 claims abstract description 27
- 238000001514 detection method Methods 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 230000008439 repair process Effects 0.000 claims description 8
- 239000000428 dust Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000155 melt Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an automatic maintenance system of a MINI LED, which comprises a CCD detector, a chip performance detector, a laser welding machine and a tin dispensing machine; the CCD detector is used for shooting an image of the surface of the PCB; the chip performance detector is used for detecting the on-off of a circuit in the chip; the laser welding machine is used for welding the chip on the surface of the PCB; the tin dotting machine is used for adding soldering tin on the surface of the PCB. According to the automatic maintenance system for the MINI LED, firstly, the CCD detector is adopted for detection, and meanwhile, the chip performance detector is adopted for detecting the internal circuit of the chip, so that the comprehensiveness of chip detection can be improved; secondly, the chip is heated by adopting a laser welding machine, the heating accuracy of the chip can be improved, and meanwhile, the hot air guns and the suction guns are arranged on the two sides of the chip, so that the soldering tin between the chip and the PCB can be stably removed; and thirdly, tin is coated by a tin spot welding machine, and then the soldering tin is heated by a laser welding machine, so that the welding stability of the chip is improved.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to an automatic maintenance system for a MINI LED.
Background
At present, the size of a MICROLED chip is 60um to 60um, the positive and negative connecting circuit bonding pads are 20um to 50um, and the production precision requirement is high; in order to meet the requirements of high resolution and high brightness, 8K products are marked, the chip array arrangement density of the products is high, 20 ten thousand chips are required to be arranged on a 100 mm-100 mm PCB generally, nearly 8000 ten thousand LED chips are required to be arranged in a 1 square meter display product, manual maintenance of the chips with the density is difficult to adapt to a wider product surface, the reliability of maintenance is difficult to guarantee, manual lighting is used for judging bad point positions, manual or semi-automatic maintenance is carried out after the chips are removed by a hot air gun heating chip through tools such as tweezers, hard damage and electrostatic damage to the chips in the maintenance process are difficult to control in the traditional mode, and therefore, an MINI LED automatic maintenance system is provided.
Disclosure of Invention
The invention mainly aims to provide an automatic maintenance system for MINI LED, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
an automatic maintenance system of MINI LED, the system includes CCD detector, chip performance detector, laser welding machine, point tin machine; wherein,
the CCD detector is used for shooting an image of the surface of the PCB;
the chip performance detector is used for detecting the on-off of a circuit in the chip;
the laser welding machine is used for welding the chip on the surface of the PCB;
the tin dotting machine is used for adding soldering tin on the surface of the PCB.
Preferably, the system further comprises a heat gun and a suction gun, and the heat gun and the suction gun are respectively located at two sides of the chip, wherein,
the hot air gun is used for heating soldering tin between the PCB and the chip;
the suction gun is used for sucking the melted soldering tin.
Preferably, a method for using an automatic maintenance system for MINI LED, the method comprising the steps of:
automatic optical detection: firstly, detecting whether the outside of the chip is damaged or not by a CCD detector, and then detecting an internal circuit of the chip by a chip performance detector;
chip disassembly: firstly, overturning the PCB subjected to automatic optical detection, heating the chip by using a laser welding machine and a hot air gun, sucking soldering tin from the other end of the chip by using a suction gun after the soldering tin between the chip and the PCB is melted, and dropping the chip;
chip replacement: after the problem chip is disassembled, soldering tin is coated on the surface of the PCB by using a tin coating machine, a new chip is placed on the PCB, and then the chip is connected with the PCB by using a laser welding machine.
Preferably, in the automatic optical inspection, a fan is used to remove dust on the surface of the PCB.
Preferably, when the chip is replaced, the chip is blown from top to bottom by using a fan.
Compared with the prior art, the invention has the following beneficial effects:
firstly, the precision of chip detection can be improved by adopting the CCD detector for detection, and simultaneously, the human resources can be reduced, and the comprehensiveness of chip detection can be improved by adopting the chip performance detector for detecting the internal circuit of the chip;
secondly, the chip is heated by adopting a laser welding machine, the heating accuracy of the chip can be improved, and meanwhile, the hot air guns and the suction guns are arranged on the two sides of the chip, so that the soldering tin between the chip and the PCB can be stably removed;
and thirdly, tin is coated by a tin spot welding machine, and then the soldering tin is heated by a laser welding machine, so that the welding stability of the chip is improved.
Drawings
FIG. 1 is a schematic diagram of a CCD detector in an automated MINI LED repair system according to the present invention;
FIG. 2 is a schematic diagram of a chip performance detector in an automated MINI LED repair system according to the present invention;
FIG. 3 is a schematic diagram of an automatic repair system for MINI LED chip removal according to the present invention;
FIG. 4 is a schematic view of a PCB solder coating in an automatic maintenance system for MINI LED according to the present invention;
fig. 5 is a schematic diagram illustrating the chip mounting in an automatic repair system for MINI LED according to the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1-5, an automatic maintenance system for a MINI LED includes a CCD detector, a chip performance detector, a laser welder, a tin spot welder; wherein,
the CCD detector is used for shooting the surface image of the PCB;
the chip performance detector is used for detecting the electrical performance of the chip;
the laser welding machine is used for welding the chip on the surface of the PCB;
the tin dropping machine is used for adding soldering tin on the surface of the PCB.
Referring to fig. 3, the system further includes a heat gun and a suction gun, which are respectively located at both sides of the chip, wherein,
the hot air gun is used for heating soldering tin between the PCB and the chip;
the suction gun is used for sucking the melted soldering tin.
A method for using an automatic maintenance system for MINI LEDs, the method comprising the steps of:
automatic optical detection: firstly, detecting whether the outside of the chip is damaged or not by a CCD detector, then detecting an internal circuit of the chip by a chip performance detector, and firstly removing dust on the surface of the PCB by using a fan;
chip disassembly: firstly, overturning the PCB subjected to automatic optical detection, heating the chip by using a laser welding machine and a hot air gun, sucking soldering tin from the other end of the chip by using a suction gun after the soldering tin between the chip and the PCB is melted, and dropping the chip;
chip replacement: after the problem chip is disassembled, soldering tin is coated on the surface of the PCB by using a tin dispensing machine, a new chip is placed on the PCB, then the chip is connected with the PCB by using a laser welding machine, and the chip is blown by using a fan from top to bottom.
During the use, blow earlier in with the dust and the impurity on PCB board surface to using the fan, place the chip that needs to detect in CCD detector below again, later CCD detector shoots the chip, simultaneously with the picture contrast that has deposited in the database, detect whether the chip surface takes place to damage, detect and accomplish the back, again by chip performance detector to the chip circular telegram for the chip work, through input current, whether there is the emergence reaction of detection chip, and whether the reaction that takes place is correct, and record the result that detects.
After the chip detects and accomplishes, the laser-beam welding machine heats the chip of assigned position for soldering tin between chip and the PCB board melts, later by the hot-blast rifle of chip one side again, blows soldering tin to the opposite side, and the suction gun of opposite side absorbs soldering tin simultaneously, thereby gets rid of the soldering tin between chip and the PCB board.
During the chip mounting, solder tin is paintd at the assigned position PCB board to some tin machine earlier, later with new chip place the PCB board on, the laser welding machine heats the chip of assigned position for the solder tin between chip and the PCB board melts, with chip and PCB board adhesion, accomplishes the repair and the change of chip.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. An automatic maintenance system of MINI LED is characterized in that the system comprises a CCD detector, a chip performance detector, a laser welding machine and a tin point machine; wherein,
the CCD detector is used for shooting an image of the surface of the PCB;
the chip performance detector is used for detecting the on-off of a circuit in the chip;
the laser welding machine is used for welding the chip on the surface of the PCB;
the tin dotting machine is used for adding soldering tin on the surface of the PCB.
2. The automated repair system for MINI LEDs of claim 1, wherein: the system also comprises a hot air gun and a suction gun which are respectively positioned at the two sides of the chip, wherein,
the hot air gun is used for heating soldering tin between the PCB and the chip;
the suction gun is used for sucking the melted soldering tin.
3. Use of an automated maintenance system for MINI LEDs according to any of the claims 1-2, characterized in that: the method comprises the following steps:
automatic optical detection: firstly, detecting whether the outside of the chip is damaged or not by a CCD detector, and then detecting an internal circuit of the chip by a chip performance detector;
chip disassembly: firstly, overturning the PCB subjected to automatic optical detection, heating the chip by using a laser welding machine and a hot air gun, sucking soldering tin from the other end of the chip by using a suction gun after the soldering tin between the chip and the PCB is melted, and dropping the chip;
chip replacement: after the problem chip is disassembled, soldering tin is coated on the surface of the PCB by using a tin coating machine, a new chip is placed on the PCB, and then the chip is connected with the PCB by using a laser welding machine.
4. The method of claim 3 for using an automated repair system for MINI LEDs, wherein: when the automatic optical detection is carried out, a fan is used for removing dust on the surface of the PCB.
5. The method of claim 3 for using an automated repair system for MINI LEDs, wherein: when the chip is replaced, the fan is used for blowing air to the chip from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110781415.7A CN113333887A (en) | 2021-07-11 | 2021-07-11 | Automatic maintenance system of MINI LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110781415.7A CN113333887A (en) | 2021-07-11 | 2021-07-11 | Automatic maintenance system of MINI LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113333887A true CN113333887A (en) | 2021-09-03 |
Family
ID=77479436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110781415.7A Pending CN113333887A (en) | 2021-07-11 | 2021-07-11 | Automatic maintenance system of MINI LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113333887A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115156654A (en) * | 2021-11-15 | 2022-10-11 | 武汉帝尔激光科技股份有限公司 | Method and device for repairing MINI LED chip |
Citations (5)
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|---|---|---|---|---|
| CN104227168A (en) * | 2014-08-23 | 2014-12-24 | 华东光电集成器件研究所 | Device for detaching circuit with pins on four sides |
| CN107359134A (en) * | 2017-07-28 | 2017-11-17 | 湖北三江航天红峰控制有限公司 | A kind of method and apparatus for realizing that bga chip reprocesses using laser |
| CN109270436A (en) * | 2018-10-24 | 2019-01-25 | 甄建文 | A kind of PCB circuit board high efficient full automatic quality and appearance detect integrated equipment |
| CN109870463A (en) * | 2019-04-09 | 2019-06-11 | 深圳市阿赛姆电子有限公司 | A kind of electronic chip fault detection means |
| CN112453619A (en) * | 2020-12-02 | 2021-03-09 | 深圳市科昭科技有限公司 | Automatic chip laser welding dispensing equipment |
-
2021
- 2021-07-11 CN CN202110781415.7A patent/CN113333887A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227168A (en) * | 2014-08-23 | 2014-12-24 | 华东光电集成器件研究所 | Device for detaching circuit with pins on four sides |
| CN107359134A (en) * | 2017-07-28 | 2017-11-17 | 湖北三江航天红峰控制有限公司 | A kind of method and apparatus for realizing that bga chip reprocesses using laser |
| CN109270436A (en) * | 2018-10-24 | 2019-01-25 | 甄建文 | A kind of PCB circuit board high efficient full automatic quality and appearance detect integrated equipment |
| CN109870463A (en) * | 2019-04-09 | 2019-06-11 | 深圳市阿赛姆电子有限公司 | A kind of electronic chip fault detection means |
| CN112453619A (en) * | 2020-12-02 | 2021-03-09 | 深圳市科昭科技有限公司 | Automatic chip laser welding dispensing equipment |
Non-Patent Citations (2)
| Title |
|---|
| 候守军 等: "《电子技能训练项目教程》", 31 October 2011, 国防工业出版社 * |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115156654A (en) * | 2021-11-15 | 2022-10-11 | 武汉帝尔激光科技股份有限公司 | Method and device for repairing MINI LED chip |
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Application publication date: 20210903 |
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| RJ01 | Rejection of invention patent application after publication |