CN112736180A - LED surface mounting technology - Google Patents
LED surface mounting technology Download PDFInfo
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- CN112736180A CN112736180A CN202011313249.XA CN202011313249A CN112736180A CN 112736180 A CN112736180 A CN 112736180A CN 202011313249 A CN202011313249 A CN 202011313249A CN 112736180 A CN112736180 A CN 112736180A
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- flexible circuit
- surface mounting
- mounting method
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- 238000005516 engineering process Methods 0.000 title description 2
- 238000000034 method Methods 0.000 claims abstract description 39
- 229910000679 solder Inorganic materials 0.000 claims abstract description 35
- 238000005476 soldering Methods 0.000 claims abstract description 23
- 238000007639 printing Methods 0.000 claims abstract description 10
- 238000007689 inspection Methods 0.000 claims description 50
- 239000000428 dust Substances 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 10
- 239000013072 incoming material Substances 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 11
- 238000009826 distribution Methods 0.000 abstract description 5
- 239000006071 cream Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005096 rolling process Methods 0.000 description 8
- 238000003466 welding Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses a method for mounting and pasting an LED surface. The LED surface mounting method comprises the steps of assembling the flexible circuit board on a flexible circuit board fixing clamp, printing solder paste on a bonding pad of the flexible circuit board, transferring an LED chip to an LED jig, wherein fixing grooves of the LED jig are distributed in an array mode, transferring the LED chip from the LED jig to the bonding pad of the flexible circuit board, and performing reflow soldering on the flexible circuit board. Through adopting steps such as assembly flexible line way board, seal tin cream, expand brilliant, LED chip transfer and backward flow to and have the LED tool that is array distribution fixed slot, make the LED chip when adorning and pasting, can once only adorn a plurality of LED chips of pasting, and then improve the efficiency that LED surface adorned and pasted.
Description
Technical Field
The invention relates to the technical field of LED production, in particular to an LED surface mounting method.
Background
The surface mounting of the LED is an indispensable part in the production of LED products, and the mounting efficiency of the LED has great influence on the efficiency of the whole LED production. When the LED surface mounting method is used for mounting and mounting, a large number of LED chips are required to be mounted and mounted on the flexible circuit board, and the mounting efficiency of the existing LED surface mounting method is low.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the LED surface mounting method, which improves the LED surface mounting efficiency.
According to the LED surface mounting method of the embodiment of the first aspect of the present invention, the LED surface mounting method includes the steps of:
assembling the flexible circuit board on a flexible circuit board fixing clamp;
printing solder paste on a bonding pad on the flexible circuit board;
transferring the LED chip to an LED jig, wherein the LED jig is provided with fixing grooves distributed in an array;
transferring the LED chip from the LED jig to the bonding pad;
and reflowing the flexible circuit board.
The LED surface mounting method provided by the embodiment of the invention at least has the following technical effects: through adopting steps such as assembly flexible line way board, seal tin cream, expand brilliant, LED chip transfer and backward flow to and have the LED tool that is array distribution fixed slot, make the LED chip when adorning and pasting, can once only adorn a plurality of LED chips of pasting, and then improve the efficiency that LED surface adorned and pasted.
According to some embodiments of the invention, the LED surface mounting method further comprises the step of removing dust from the flexible circuit board.
According to some embodiments of the invention, before the step of removing dust from the flexible wiring board, the method further comprises the steps of: and carrying out incoming material inspection on the flexible circuit board.
According to some of the embodiments of the invention, further comprising the step of: and carrying out solder paste inspection on the flexible circuit board.
According to some embodiments of the invention, before reflowing the flexible circuit board, the method further comprises: and performing stokehole spot inspection on the flexible circuit board.
According to some embodiments of the invention, after reflow soldering the flexible circuit board, the method further comprises the following steps: and carrying out optical inspection on the flexible circuit board.
According to some of the embodiments of the invention, after the optical inspection of the flexible wiring board, further comprising the steps of: and carrying out overall lighting and single lighting check on the LED chips on the flexible circuit board.
According to some embodiments of the present invention, a lighting pen is adopted to perform the overall lighting or the lighting of a single LED chip, a voltage of the lighting pen is adjusted to be 20 volts to 22 volts, and a current of the lighting pen is adjusted to be 0.4 milliampere to 0.6 milliampere.
According to some of the embodiments of the invention, the over-reflow soldering uses hot air reflow soldering.
According to some embodiments of the present invention, the step of transferring the LED chip to the LED fixture having the fixing grooves distributed in an array and the step of assembling the flexible wiring board are performed simultaneously.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of an LED fixture according to an embodiment of the present invention;
FIG. 2 is a front view of the LED fixture of FIG. 1;
FIG. 3 is a cross-sectional view of the LED fixture of FIG. 2;
FIG. 4 is a schematic flow chart of a method for surface mounting an LED in accordance with one embodiment of the present invention;
fig. 5 is a schematic flow chart of an LED surface mounting method according to an embodiment of the present invention.
Reference numerals:
the LED fixture 100, the fixing groove 200 and the vacuum suction hole 300.
Detailed Description
The concept and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments to fully understand the objects, features and effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention.
In the description of the embodiments of the present invention, if an orientation description is referred to, for example, the directions or positional relationships indicated by "up", "down", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, if a feature is referred to as being "disposed", "connected", or "mounted" to another feature, it can be directly disposed, fixed, or connected to the other feature or indirectly disposed, fixed, or connected to the other feature.
An LED surface mounting method according to an embodiment of the present invention is described below with reference to fig. 1 to 5.
The LED surface mounting method comprises the following steps:
assembling the flexible circuit board on a flexible circuit board fixing clamp;
printing solder paste on a bonding pad of the flexible circuit board;
transferring the LED chip to the LED fixture 100, wherein the fixing grooves 200 of the LED fixture 100 are distributed in an array;
transferring the LED chip from the LED jig 100 to a bonding pad of the flexible circuit board;
and reflowing the flexible circuit board.
Specifically, referring to fig. 1 to 3, the LED fixture 100 is substantially rectangular, the LED fixture 100 is provided with square fixing grooves 200 distributed in an array, the array distribution is rectangular, the depth of the fixing grooves 200 is smaller than that of the LED chips, and the bottom of the fixing grooves 200 is provided with vacuum suction holes 300. The working surface of the LED fixture 100 is the surface where the notches of the fixing groove 200 are located. When the wafer is expanded, the LED chip is mounted in the fixing groove 200 of the LED jig 100, and the vacuum suction hole 300 sucks the LED chip. Since the depth of the fixing groove 200 is smaller than that of the LED chip, the LED chip can contact the pad when the working surface of the LED fixture 100 is attached to the flexible circuit board. When the LED chips are required to be transferred, the LED jig 100 can be matched with the flexible circuit board, so that the LED chips are respectively aligned to the bonding pads, and then the LED chips are mounted and attached, and the effect of mounting and attaching the LED chips at one time is achieved.
Referring to fig. 4, in the LED chip surface mounting method, firstly, a flexible circuit board is fixed and assembled in a flexible circuit board fixing clamp, so as to prevent the flexible circuit board from deviating, secondly, solder paste is printed on the surface of a pad of the flexible circuit board, secondly, an LED chip is placed in a fixing groove 200 of an LED fixture 100 according to product requirements, and then, the LED fixture 100 is integrally mounted, so that the LED chips in the LED fixture 100 correspond to the pad with the solder paste on the flexible circuit board one by one, the LED chips are mounted, and finally, the LED chips are bonded to the flexible circuit board by using a reflow soldering method. Therefore, the LED chips are mounted and attached at one time, and the LED surface mounting and attaching efficiency is improved.
It can be understood that the shape of the fixing groove 200 may be triangular, circular, etc., thereby satisfying LED chips of different specifications and serving to prevent the LED chips from being positionally displaced in the fixing groove 200. The depth of the fixing groove 200 and the shape, interval, etc. of the array distribution can be set, thereby satisfying the requirements of different LED products.
In some embodiments, the LED surface mount method further comprises de-dusting the flexible wiring board. Specifically, referring to fig. 4, the flexible circuit board needs to be dedusted before solder paste is printed. The dust removal is to manually use a dust removal rolling brush to remove dust on the surface of the flexible circuit board. When the dust removal rolling brush is used for removing dust, the rolling brush is conducted for multiple times, and the rolling brush is conducted along the length direction of the same flexible circuit board every time. It can be understood that the dust removal of the flexible circuit board can also be performed by a dust removal device.
In some embodiments, the method further comprises the step of, before dedusting the flexible wiring board: and (5) carrying out incoming material inspection on the flexible circuit board. Specifically, referring to fig. 4, before the flexible printed circuit board is dedusted, incoming inspection of the flexible printed circuit board is required. The incoming material inspection is carried out by the inspection of dents, abrasion or scratches, bubbles, gold plating and the like. The dent inspection standard is that the surface of the dent is indented within 0.1mm, and the flexible circuit board protective film cannot have sharp object scratches, cutting marks, cracks, adhesive separation and the like. The standard of the abrasion or scratch inspection is that the thickness of a brush or other brushing scratch on the flexible circuit board is more than 20% of the film thickness, and the characteristic of bending cannot be damaged by repeated bending parts.
The bubble inspection standard is that the length of the bubble is 10mm or less, the bubble between adjacent wires does not exceed about 25% of the line gap, the bending characteristics should not be lost in the repeatedly bent portion, and the edge of the PPC should not be allowed to have bubbles or delamination. The gold plating inspection standard is that the surface should not be greasy dirt, whitish and oxidized. Through carrying out multiple accurate detection, avoid flexible line way board to take place results such as fracture, surface drop and switch on badly from this. It will be appreciated that the criteria for incoming material inspection can be set by itself, thereby meeting the requirements of different production lines.
In some embodiments, the method further comprises the steps between the solder paste printing and the LED chip transferring: and (5) carrying out solder paste inspection on the flexible circuit board. Specifically, referring to fig. 4, after the step of printing solder paste on the flexible printed circuit board, before the LED chip is transferred, solder paste inspection needs to be performed on the flexible printed circuit board. If the solder paste deviates more than one third from the bonding pad, the solder paste is uneven, the solder paste is too thin, the solder connection phenomenon is generated between the solder pastes, impurities are generated between the bonding pads and the like, and the flexible circuit board is a defective product. Solder paste printing is offset by one third, and one third of the area on the pad is not covered by solder paste, which affects solder joint formation. The occurrence of tin-connecting phenomenon can cause short circuit after reflow. Through multiple inspections, the flexible circuit board after the soldering paste is prevented from being out of order in the use process. It will be appreciated that the contents and criteria of the inspection can be set by itself, thereby meeting the requirements of the production line.
In some embodiments, further comprising the step between the LED chip transfer and reflow: and performing stokehole spot inspection on the flexible circuit board. Specifically, referring to fig. 4, after the LED chip transferring step and before the reflowing step, the flexible printed circuit board needs to be subjected to a furnace-front spot check, and the flexible printed circuit board subjected to spot check needs to meet requirements of correct model specification of the components, correct position and direction of the components, correct mounting area of the components, correct interval between the components, full welding spots of the components, no missing welding, no soldering and too little soldering. The standard of too little soldering tin is that after the components are attached to the bonding pad, the tin of the welding spot is less than one fourth of the area of the components, and the bonding pad between the components has no residual tin slag and tin balls, so that the occurrence of bridging short circuit is avoided. It will be appreciated that the contents and criteria of the inspection can be set by itself, thereby meeting the requirements of the production line.
In some embodiments, the method further comprises, after the reflowing, the steps of: and carrying out optical inspection on the flexible circuit board. In particular, with reference to fig. 4, after the reflow step, the inspection needs to be performed by an automated optical inspection machine. Specifically, in the inspection contents, the inspection of the state of the LED chip mounted on the LED chip is performed by a wire, thereby preventing the occurrence of reverse, offset, and flip phenomena, and the worker wears an electrostatic device, thereby preventing the occurrence of static electricity. Thereby avoiding the LED chip in the flexible circuit board not meeting the production standard.
In some embodiments, the method further comprises the following steps after the optical inspection of the flexible circuit board: and carrying out overall lighting and single LED chip inspection on the flexible circuit board. Specifically, referring to fig. 4, after the optical inspection of the flexible printed circuit board, the flexible printed circuit board needs to be entirely lighted and the inspection of the single LED chip needs to be performed, so that the poor contact, short circuit and other poor phenomena of the LED chip in the flexible printed circuit board during actual operation are avoided.
In some embodiments, when the whole or single LED chip is lit, the voltage of the lighting pen is adjusted to be 20 v to 22 v, and the current of the lighting pen is adjusted to be 0.4 ma to 0.6 ma. Specifically, when the flexible circuit board is integrally lighted or a single LED chip is lighted, the ground voltage of the lighting pen should be adjusted to 20-22V, and the current of the lighting pen is adjusted to 0.4-0.6 mA, so that when the flexible circuit board is lighted, the ground light emitted by the LED chip is most suitable for observation and recording, and the LED chip is not easily blown.
In some embodiments, the over-reflow soldering employs hot air reflow soldering. Specifically, the over-reflow soldering method adopts hot air reflow soldering, the hot air reflow soldering transfers heat energy through the laminar flow motion of hot air, the air in the furnace is continuously heated and circulated by using a heater and a fan, and a workpiece to be soldered is heated by hot gas in the furnace, so that the soldering is realized. By adopting hot air type reflow soldering, the solder paste of the flexible circuit board is heated uniformly and has stable temperature, so that the yield of products after reflow soldering is improved.
In some embodiments, the die-up and the assembly of the flex circuit board are performed simultaneously. Specifically, referring to fig. 5, the crystal expansion and the flexible circuit board assembly can be performed simultaneously, and the time for mounting the LED surface is reduced by simultaneously performing the crystal expansion and the flexible circuit board assembly, thereby improving the efficiency of the LED surface mounting.
Referring to fig. 1 to 4, in the LED chip surface mounting method, firstly, a flexible circuit board is fixed and mounted in a flexible circuit board fixing clamp, so as to prevent the flexible circuit board from deviating, secondly, solder paste is printed on the surface of a pad of the flexible circuit board, secondly, an LED chip is placed in a fixing groove 200 of an LED fixture 100 according to product requirements, and then, the LED fixture 100 is integrally mounted, so that the LED chip in the LED fixture 100 corresponds to the pad with the solder paste on the flexible circuit board one by one, the LED chip is mounted, and finally, the LED chip is mounted with the flexible circuit board by using a reflow soldering method. Therefore, the LED chips are mounted and attached at one time, and the LED surface mounting and attaching efficiency is improved.
The LED fixture 100 is roughly cuboid, square fixing grooves 200 distributed in an array mode are arranged on the LED fixture 100, the array distribution is distributed in a rectangular array mode, the depth of each fixing groove 200 is smaller than that of an LED chip, and a vacuum suction hole 300 is formed in the bottom of each fixing groove 200. When the wafer is expanded, the LED chip is mounted in the fixing groove 200 of the LED jig 100, and the vacuum suction hole 300 sucks the LED chip. Since the depth of the fixing groove 200 is smaller than that of the LED chip, the LED chip can contact the pad when the working surface of the LED fixture 100 is attached to the flexible circuit board. When the LED chips are required to be transferred, the LED jig 100 can be matched with the flexible circuit board, so that the LED chips are respectively aligned to the bonding pads, and then the LED chips are mounted and attached, and the effect of mounting and attaching the LED chips at one time is achieved.
Before printing solder paste, the flexible circuit board needs to be dedusted. The dust removal is to manually use a dust removal rolling brush to remove dust on the surface of the flexible circuit board. When the dust removal rolling brush is used for removing dust, the rolling brush is conducted for multiple times, and the rolling brush is conducted along the length direction of the same flexible circuit board every time.
Before the flexible circuit board is dedusted, incoming inspection of the flexible circuit board is required. The incoming material inspection is carried out by the inspection of dents, abrasion or scratches, bubbles, gold plating and the like. The dent inspection standard is that the surface of the dent is indented within 0.1mm, and the flexible circuit board protective film cannot have sharp object scratches, cutting marks, cracks, adhesive separation and the like. The standard of the abrasion or scratch inspection is that the thickness of a brush or other brushing scratch on the flexible circuit board is more than 20% of the film thickness, and the characteristic of bending cannot be damaged by repeated bending parts.
The bubble inspection standard is that the length of the bubble is 10mm or less, the bubble between adjacent wires does not exceed about 25% of the line gap, the bending characteristics should not be lost in the repeatedly bent portion, and the edge of the PPC should not be allowed to have bubbles or delamination. The gold plating inspection standard is that the surface should not be greasy dirt, whitish and oxidized. Through carrying out multiple accurate detection, avoid flexible line way board to take place results such as fracture, surface drop and switch on badly from this. It will be appreciated that the criteria for incoming material inspection can be set by itself, thereby meeting the requirements of different production lines.
After the step of printing solder paste on the flexible circuit board, before the LED chip is transferred, solder paste inspection needs to be performed on the flexible circuit board. If the solder paste deviates more than one third from the bonding pad, the solder paste is uneven, the solder paste is too thin, the solder connection phenomenon is generated between the solder pastes, impurities are generated between the bonding pads and the like, and the flexible circuit board is a defective product. Solder paste printing is offset by one third, and one third of the area on the pad is not covered by solder paste, which affects solder joint formation. The occurrence of tin-connecting phenomenon can cause short circuit after reflow. Through multiple inspections, the flexible circuit board after the soldering paste is prevented from being out of order in the use process.
After the LED chip transferring step and before the refluxing step, the flexible circuit board needs to be subjected to in-furnace spot inspection, and the requirements to be met by the spot-inspected flexible circuit board include correct model specification of components, correct position and direction of the components, correct mounting and pasting area of the components, correct interval between the components, full welding spots of the components, no missing welding, empty welding and too little soldering tin. The standard of too little soldering tin is that after the components are attached to the bonding pad, the tin of the welding spot is less than one fourth of the area of the components, and the bonding pad between the components has no residual tin slag and tin balls, so that the occurrence of bridging short circuit is avoided.
After the reflow step, inspection by an automated optical inspection machine is required. Specifically, in the inspection contents, the inspection of the state of the LED chip mounted on the LED chip is performed by a wire, thereby preventing the occurrence of reverse, offset, and flip phenomena, and the worker wears an electrostatic device, thereby preventing the occurrence of static electricity. Thereby avoiding the LED chip in the flexible circuit board not meeting the production standard.
After the optical inspection of the flexible circuit board, the flexible circuit board is required to be integrally lighted and inspected by a single LED chip, so that the phenomena of poor contact, short circuit and the like of the LED chip in the flexible circuit board during actual operation are avoided. When the flexible circuit board is wholly lightened or a single LED chip is lightened, the ground voltage of the lightening pen should be adjusted to be 20-22V, and the current of the lightening pen is adjusted to be 0.4-0.6 mA, so that when the lightening is achieved, the ground light emitted by the LED chip is most suitable for observation and recording and is not easy to cause the LED chip to be burnt out.
In the description herein, references to the description of "some embodiments" mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
- The LED surface mounting method is characterized by comprising the following steps:assembling the flexible circuit board on a flexible circuit board fixing clamp;printing solder paste on a bonding pad on the flexible circuit board;transferring LED chips to LED fixture with fixing grooves distributed in arrayTransferring the LED chip from the LED jig to the bonding pad;and reflowing the flexible circuit board.
- 2. The LED surface mounting method according to claim 1, further comprising removing dust from the flexible circuit board.
- 3. The LED surface mounting method according to claim 2, further comprising, before the step of removing dust from the flexible wiring board: and carrying out incoming material inspection on the flexible circuit board.
- 4. The LED surface mounting method according to claim 1, further comprising the steps of: and carrying out solder paste inspection on the flexible circuit board.
- 5. The LED surface mounting method according to claim 1, further comprising, before reflowing the flexible wiring board, the steps of: and performing stokehole spot inspection on the flexible circuit board.
- 6. The LED surface mounting method according to claim 1, further comprising, after reflowing the flexible wiring board, the steps of: and carrying out optical inspection on the flexible circuit board.
- 7. The LED surface mounting method according to claim 6, further comprising, after the optical inspection of the flexible wiring board: and carrying out overall lighting and single lighting check on the LED chips on the flexible circuit board.
- 8. The LED surface mounting method according to claim 7, wherein a lighting pen is used for lighting the whole LED chip or the single LED chip, the voltage of the lighting pen is adjusted to be 20-22V, and the current of the lighting pen is adjusted to be 0.4-0.6 mA.
- 9. The LED surface mounting method according to claim 1, wherein the over-reflow soldering uses hot air reflow soldering.
- 10. The LED surface mounting method according to claim 1, wherein the steps of transferring the LED chips to the LED jig having the fixing grooves arranged in an array and assembling the flexible wiring board are performed simultaneously.
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| CN202011313249.XA CN112736180A (en) | 2020-11-20 | 2020-11-20 | LED surface mounting technology |
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| CN202011313249.XA CN112736180A (en) | 2020-11-20 | 2020-11-20 | LED surface mounting technology |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113727534A (en) * | 2021-09-01 | 2021-11-30 | 深圳市大族元亨光电股份有限公司 | LED display screen module and SMT mounting technology thereof |
| CN114630505A (en) * | 2022-02-11 | 2022-06-14 | 深圳市南极光电子科技股份有限公司 | Welding process of flexible circuit board and LED lamp |
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| CN105307420A (en) * | 2015-10-13 | 2016-02-03 | 惠州市蓝微电子有限公司 | PCB and FPC welding method and surface mounting jig |
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| CN113727534A (en) * | 2021-09-01 | 2021-11-30 | 深圳市大族元亨光电股份有限公司 | LED display screen module and SMT mounting technology thereof |
| CN113727534B (en) * | 2021-09-01 | 2023-03-03 | 深圳市大族元亨光电股份有限公司 | LED display screen module and SMT mounting technology thereof |
| CN114630505A (en) * | 2022-02-11 | 2022-06-14 | 深圳市南极光电子科技股份有限公司 | Welding process of flexible circuit board and LED lamp |
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