CN113727534A - LED display screen module and SMT mounting technology thereof - Google Patents

LED display screen module and SMT mounting technology thereof Download PDF

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Publication number
CN113727534A
CN113727534A CN202111018593.0A CN202111018593A CN113727534A CN 113727534 A CN113727534 A CN 113727534A CN 202111018593 A CN202111018593 A CN 202111018593A CN 113727534 A CN113727534 A CN 113727534A
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led
display screen
inspection
smt
led display
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CN113727534B (en
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浦少勇
李祖雄
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SHENZHEN YAHAM OPTOELECTRONICS CO Ltd
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Yaham Optoelectronics Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses an LED display screen module and an SMT mounting process thereof, belonging to the technical field of LEDs, wherein the SMT mounting process comprises the following steps: s1, printing an LED surface on one surface of the PCB by using solder paste, then installing an LED element, and connecting the LED element with the LED surface by reflow soldering; and S2, printing the driving surface on the other surface of the PCB by using solder paste, then mounting the electronic component, and connecting the electronic component and the driving surface by reflow soldering. The SMT mounting process provided by the invention is suitable for mounting when the distance between LED display screens is small and the requirement on display effect is high; the printing precision, the surface mounting precision, the welding precision and the welding strength are high; the SMT mounting technology is applied, so that the product quality is obviously improved, the production efficiency of an SMT workshop and an assembly workshop is improved, the labor cost and the material cost are effectively reduced, and a better and clear high-definition display effect is provided.

Description

LED display screen module and SMT mounting technology thereof
Technical Field
The invention belongs to the technical field of LEDs, and particularly relates to an LED display screen module and an SMT (surface mount technology) mounting process thereof.
Background
The LED display screen is formed by assembling a plurality of modularized LED box bodies, and one display module comprises a driving surface (IC surface) and an LED surface. With the continuous development of the LED display screen industry, people pursue the improvement of the display effect, the dot pitch of the LED display screen is smaller and smaller, such as 0.4-1.0 pitch, and the bead size of the SMD package or other package of the LED display screen is smaller and smaller, such as (0606-. Therefore, the SMT mounting technology is also challenged.
The current SMT mounting process is to produce the driving surface and then produce the LED surface, and the process flow chart is shown in fig. 1. When the distance between the LED display modules is small, the current SMT mounting process cannot meet the requirements of LED surface printing precision, LED welding strength and LED welding flatness, and the problem of abnormal LED display effect can occur. The main reasons for the problems are that in the production process, a PCB bonding pad shrinks when passing through a furnace, the shrinking direction is not controllable, so that the printing precision is not enough, solder paste cannot be accurately printed on a specified position, the welding strength is poor, and the welding part of the LED and the PCB bonding pad is easy to fall off; when the LED face is assembled with the face mask, the LED lamp bead is not in the middle position of the face mask hole, so that the LED light source is shielded by the face mask, the display effect is influenced, the wavy stripes taking the module as a unit, the uneven light and shade (the shade and the sun face) and other bad phenomena occur, the LED lamp bead is tightly attached to the face mask for a long time, and the LED lamp bead is easy to fall off due to the action of force for a long time. The traditional SMT mounting technology is difficult to obtain a better LED mounting effect, so that the traditional technology is broken, the LED mounting effect is better realized, the precision, the welding strength and the welding flatness of the LED mounting are guaranteed, and the display effect of a display screen is improved, and the problem to be solved urgently at present is solved.
Disclosure of Invention
In order to overcome the defects of the prior art, the technical problems to be solved by the invention are as follows: how to solve the problem of PCB furnace shrinkage in the SMT mounting process.
In order to solve the technical problems, the invention adopts the technical scheme that: the SMT mounting process of the LED display screen module comprises the following steps:
s1, printing an LED surface on one surface of the PCB by using solder paste, then installing an LED element, and connecting the LED element with the LED surface by reflow soldering;
and S2, printing the driving surface on the other surface of the PCB by using solder paste, then mounting the electronic component, and connecting the electronic component and the driving surface by reflow soldering.
An LED display screen module prepared by the SMT mounting process of the LED display screen module is provided.
The utility model provides a LED display screen, is assembled by a plurality of LED boxes and forms, the LED box includes a plurality of display module, display module includes face guard, drain pan and sets up foretell LED display screen module between the two.
The invention has the beneficial effects that: the SMT mounting process of the LED display screen module breaks through the traditional process of firstly mounting the driving surface and then mounting the LED surface, firstly mounting the LED surface and then mounting the driving surface, and is suitable for mounting when the distance between the LED display screens is small and the requirement on the display effect is high; the printing precision, the surface mounting precision, the welding precision and the welding strength of the LED surface can be effectively controlled; meanwhile, the assembly precision of the LED module and the precision of the LED box body of the subsequent station are guaranteed, the quality of the whole product, the production efficiency of an SMT workshop and the production efficiency of an assembly workshop are obviously improved, the labor cost and the material cost are effectively reduced, and a better and clear high-definition display effect is provided.
Drawings
FIG. 1 is a flow chart of a conventional SMT mounting process;
FIG. 2 is a flow chart of an SMT bonding process according to an embodiment of the present invention;
fig. 3 is a diagram illustrating an object of an LED surface printed by an SMT mounting process according to example 1 of the present invention;
FIG. 4 is a schematic partial structure diagram of a display module according to an embodiment of the present invention;
FIG. 5 is an enlarged view of FIG. 4 at A;
FIG. 6 is an enlarged view of FIG. 4 at B;
fig. 7 is a diagram illustrating an actual object after the LED display screen of example 2 according to the embodiment of the present invention is lit;
fig. 8 is a diagram illustrating an actual object after the LED display screen of example 2 according to the embodiment of the present invention is lit;
fig. 9 is a schematic structural view of a jig according to an embodiment of the present invention;
FIG. 10 is an enlarged view of FIG. 9 at A;
FIG. 11 is a top view of a fixture according to an embodiment of the present invention;
FIG. 12 is a side view of a jig according to an embodiment of the present invention;
fig. 13 is a diagram illustrating an object of an LED surface printed by an SMT pick and place process according to comparative example 1 of the present invention;
FIG. 14 is a schematic diagram showing a partial structure of an LED display screen module according to comparative example 1 in accordance with an embodiment of the present invention;
FIG. 15 is a diagram showing an illuminated LED display screen of comparative example 2 in accordance with an embodiment of the present invention;
description of reference numerals: 1. a face mask; 2. a bottom case; 3. an LED display screen module; 31. an LED element; 4. a base plate; 5. an LED limit groove; 6. and (5) locking.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 2, the SMT mounting process of the LED display module of the present invention includes the following steps:
s1, printing an LED surface on one surface of the PCB by using solder paste, then installing an LED element, and connecting the LED element with the LED surface by reflow soldering;
and S2, printing the driving surface on the other surface of the PCB by using solder paste, then mounting the electronic component, and connecting the electronic component and the driving surface by reflow soldering.
From the above description, the beneficial effects of the present invention are: the SMT mounting process of the LED display screen module breaks through the traditional process of firstly mounting a driving surface and then mounting an LED surface, firstly mounting the LED surface and then mounting the driving surface, wherein solder paste can be accurately printed at a specified position by printing only according to the opening of a steel mesh related to the LED surface in the mounting process, the shrinkage parameter of an LED pad does not need to be measured firstly as in the traditional process, then an average value is obtained by calculation according to the shrinkage value and then the steel mesh is manufactured, so that the printing precision and the reflow soldering quality of the LED surface can be effectively ensured, an LED element can be accurately mounted at the specified position by a chip mounter, the problems of mounting offset, flying parts and the like can not occur, the soldering quality is ensured, and the problems of poor soldering such as insufficient soldering, false soldering, offset, poor strength and the like caused by insufficient printing precision and improper mounting of the chip are avoided; the assembly precision of the LED display screen module and the mask can be effectively ensured, the LED element is positioned in the middle position, and the problems that the light source is shielded and the LED element falls off due to pressurization are avoided; the whole good display effect of display screen can be guaranteed, and the problems of wavy stripes and uneven brightness in the display process are avoided.
The LED display screen module is prepared by the SMT mounting process of the LED display screen module.
The LED display screen is assembled by a plurality of LED boxes and is formed, the LED boxes comprise a plurality of display modules, and each display module comprises a face cover, a bottom shell and the LED display screen module arranged between the face cover and the bottom shell.
Further, the SMT mounting process specifically includes the following steps:
s1, printing an LED surface on one surface of the PCB by using solder paste, carrying out SIP inspection, mounting an LED element after the inspection is qualified, connecting the LED element with the LED surface by reflow soldering, and carrying out AOI inspection;
and S2, printing a driving surface on the other surface of the PCB by using solder paste, carrying out SIP inspection, mounting an electronic component after the inspection is qualified, connecting the electronic component with the driving surface by reflow soldering, carrying out AOI inspection, and lighting the LED module for detection after the inspection is qualified.
Further, the melting point of the solder paste in the S1 is 100-180 ℃.
Further, when the melting points of the solder pastes used in S1 and S2 are different, the LED surface is provided with a jig for preventing the LED element from falling off when the reflow soldering of S2 is performed.
Further, the jig comprises a bottom plate, wherein a plurality of LED limiting grooves which are parallel to each other and are arranged at equal intervals are formed in the bottom plate, and the LED limiting grooves are used for accommodating LED elements.
Furthermore, a plurality of lock catches are arranged on the bottom plate, the lock catches are arranged on the periphery of the LED limiting groove, and the lock catches are used for connecting the bottom plate with the PCB.
Example 1:
referring to fig. 2, the SMT mounting process for the LED display screen module includes the following steps:
s1, printing an LED surface on one surface of the PCB by using solder paste, carrying out SIP inspection, mounting the LED element 31 after the inspection is qualified, connecting the LED element 31 with the LED surface by reflow soldering, and carrying out AOI inspection;
s2, printing a driving surface on the other surface of the PCB by using solder paste, carrying out SIP inspection, mounting an electronic component after the inspection is qualified, connecting the electronic component with the driving surface by reflow soldering, carrying out AOI inspection, and lighting the LED module for detection after the inspection is qualified;
wherein the solder pastes used in S1 and S2 are medium temperature solder pastes with a melting point of 151 ℃.
The physical diagram of the LED surface printed in step S1 is shown in fig. 3, and it can be seen that the solder paste is accurately printed on the PCB.
Example 2:
referring to fig. 4-6, the LED display screen is formed by assembling LED boxes, the LED boxes include a plurality of display modules, and the display modules include a face mask 1, a bottom case 2, and the LED display screen module 3 of embodiment 1 disposed therebetween.
The LED display screen of the embodiment 2 is lightened, the real object image after lightening is shown in figures 7-8, and figures 7 and 8 show the same LED display screen, one is in left view and the other is in right view.
Example 3:
referring to fig. 2, the SMT mounting process for the LED display screen module includes the following steps:
s1, printing an LED surface on one surface of the PCB by using solder paste, carrying out SIP inspection, mounting the LED element 31 after the inspection is qualified, connecting the LED element 31 with the LED surface by reflow soldering, and carrying out AOI inspection;
s2, printing a driving surface on the other surface of the PCB by using solder paste, carrying out SIP inspection, mounting an electronic component after the inspection is qualified, connecting the electronic component with the driving surface by reflow soldering, carrying out AOI inspection, and lighting the LED module for detection after the inspection is qualified;
wherein the solder pastes used in S1 and S2 are low-temperature solder pastes with the melting point of 100-139 ℃.
Example 4:
referring to fig. 2, the SMT mounting process for the LED display screen module includes the following steps:
s1, printing an LED surface on one surface of the PCB by using solder paste, carrying out SIP inspection, mounting the LED element 31 after the inspection is qualified, connecting the LED element 31 with the LED surface by reflow soldering, and carrying out AOI inspection;
s2, printing a driving surface on the other surface of the PCB by using solder paste, carrying out SIP inspection, mounting an electronic component after the inspection is qualified, connecting the electronic component with the driving surface by reflow soldering, carrying out AOI inspection, and lighting the LED module for detection after the inspection is qualified;
wherein the solder paste used in S1 is medium temperature solder paste with melting point of 140-180 ℃, and the solder paste used in S2 is high temperature solder paste with melting point of 200-230 ℃;
when performing reflow soldering of S2, the LED surface is provided with a jig for preventing the LED element 31 from falling off, referring to fig. 9-12, the jig includes a bottom plate 4, and the bottom plate 4 is provided with a plurality of LED limiting grooves 5 arranged in parallel and at equal intervals, and a plurality of latches 6; the LED limiting groove 5 is used for accommodating the LED element 31, the lock catch 6 is arranged on the periphery of the LED limiting groove 5, and the lock catch 6 is used for connecting the bottom plate 4 with the PCB.
Example 5:
referring to fig. 2, the SMT mounting process for the LED display screen module includes the following steps:
s1, printing an LED surface on one surface of the PCB by using solder paste, carrying out SIP inspection, mounting the LED element 31 after the inspection is qualified, connecting the LED element 31 with the LED surface by reflow soldering, and carrying out AOI inspection;
s2, printing a driving surface on the other surface of the PCB by using solder paste, carrying out SIP inspection, mounting an electronic component after the inspection is qualified, connecting the electronic component with the driving surface by reflow soldering, carrying out AOI inspection, and lighting the LED module for detection after the inspection is qualified;
wherein the solder paste used in S1 is medium-temperature solder paste with a melting point of 100-138 ℃, and the solder paste used in S2 is medium-temperature solder paste with a melting point of 140-180 ℃;
when the reflow soldering of S2 is carried out, a jig is arranged on the LED surface, the jig is used for preventing the LED element 31 from falling off, the jig comprises a bottom plate 4, and a plurality of LED limiting grooves 5 which are parallel to each other and are arranged at equal intervals and a plurality of lock catches 6 are arranged on the bottom plate 4; the LED limiting groove 5 is used for accommodating the LED element 31, the lock catch 6 is arranged on the periphery of the LED limiting groove 5, and the lock catch 6 is used for connecting the bottom plate 4 with the PCB.
Example 6:
referring to fig. 2, the SMT mounting process for the LED display screen module includes the following steps:
s1, printing an LED surface on one surface of the PCB by using solder paste, carrying out SIP inspection, mounting the LED element 31 after the inspection is qualified, connecting the LED element 31 with the LED surface by reflow soldering, and carrying out AOI inspection;
s2, printing a driving surface on the other surface of the PCB by using solder paste, carrying out SIP inspection, mounting an electronic component after the inspection is qualified, connecting the electronic component with the driving surface by reflow soldering, carrying out AOI inspection, and lighting the LED module for detection after the inspection is qualified;
wherein the solder paste used in S1 is low-temperature solder paste with a melting point of 100-138 ℃, and the solder paste used in S2 is high-temperature solder paste with a melting point of 200-230 ℃;
when the reflow soldering of S2 is carried out, a jig is arranged on the LED surface, the jig is used for preventing the LED element 31 from falling off, the jig comprises a bottom plate 4, and a plurality of LED limiting grooves 5 which are parallel to each other and are arranged at equal intervals and a plurality of lock catches 6 are arranged on the bottom plate 4; the LED limiting groove 5 is used for accommodating the LED element 31, the lock catch 6 is arranged on the periphery of the LED limiting groove 5, and the lock catch 6 is used for connecting the bottom plate 4 with the PCB.
Comparative example 1:
referring to fig. 1, the SMT mounting process for the LED display screen module includes the following steps:
s1, printing a driving surface on one surface of the PCB by using solder paste, carrying out SIP inspection, mounting an electronic component after the inspection is qualified, connecting the electronic component with the driving surface by reflow soldering, carrying out AOI inspection,
s2, printing an LED surface on the other surface of the PCB by using solder paste, carrying out SIP inspection, mounting an LED element after the inspection is qualified, connecting the LED element with the LED surface by reflow soldering, carrying out AOI inspection, and lighting the LED module for detection after the inspection is qualified;
wherein the solder pastes used in S1 and S2 are medium temperature solder pastes with a melting point of 151 ℃.
The physical diagram of the LED surface printed in step S2 is shown in fig. 13, the obtained LED display screen module is shown in fig. 14,
it can be seen that, in the upper right position of fig. 13, the solder paste is not printed on the designated position, the test is performed during the preparation process, and the PCB boards before and after production shrink 0.108mm inward and shrink 0.033mm downward, so that the printing is shifted, and the solder paste cannot be accurately printed on the designated LED pads.
It can be seen that a problem of poor soldering strength leading to peeling of the LED element occurs in fig. 14.
Comparative example 2:
the LED display screen is assembled by the LED box body to form, the LED box body includes a plurality of display modules, display module includes face guard, drain pan and sets up the LED display screen module of comparative example 1 between the two.
The LED display screen of example 2 is lit, and the actual image after lighting is shown in fig. 15, and it can be seen that there are distinct dark and bright areas.
In summary, the SMT mounting process of the LED display module provided by the present invention breaks through the conventional process of mounting the driving surface first and then mounting the LED surface, and mounting the LED surface first and then mounting the driving surface, and is suitable for mounting when the LED display screen has a small distance and a high requirement for display effect; the SMT mounting technology is provided and used, and the problems that due to shrinkage of a PCB due to passing through a furnace, the printing precision is insufficient, and solder paste cannot be accurately printed on an appointed LED bonding pad are solved; the problems of welding strength of the LED component and welding flatness of the LED surface are solved; the problem that the LED component is not centered when the LED component is connected with the face mask is solved; the problems of poor display effect, wavy stripes and uneven brightness of the whole display screen are solved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.

Claims (8)

  1. The SMT mounting process of the LED display screen module is characterized by comprising the following steps of:
    s1, printing an LED surface on one surface of the PCB by using solder paste, then installing an LED element, and connecting the LED element with the LED surface by reflow soldering;
    and S2, printing the driving surface on the other surface of the PCB by using solder paste, then mounting the electronic component, and connecting the electronic component and the driving surface by reflow soldering.
  2. 2. An SMT mounting process for an LED display screen module according to claim 1, comprising the steps of:
    s1, printing an LED surface on one surface of the PCB by using solder paste, carrying out SIP inspection, mounting an LED element after the inspection is qualified, connecting the LED element with the LED surface by reflow soldering, and carrying out AOI inspection;
    and S2, printing a driving surface on the other surface of the PCB by using solder paste, carrying out SIP inspection, mounting an electronic component after the inspection is qualified, connecting the electronic component with the driving surface by reflow soldering, carrying out AOI inspection, and lighting the LED module for detection after the inspection is qualified.
  3. 3. An SMT mounting process for the LED display screen module according to claim 1, wherein the melting point of the solder paste in S1 is 100-180 ℃.
  4. 4. An SMT mounting process for LED display screen modules according to claim 1, wherein when the melting points of the solder pastes used in S1 and S2 are different, the LED surface is provided with a jig for preventing the LED elements from falling off when reflow soldering of S2 is performed.
  5. 5. An SMT mounting process for LED display screen modules according to claim 4, wherein the jig comprises a base plate, a plurality of LED limiting grooves are formed in the base plate, and the LED limiting grooves are used for accommodating LED elements.
  6. 6. An SMT mounting process for the LED display screen module according to claim 4, wherein a plurality of latches are disposed on the base plate, the latches are disposed at a periphery of the LED limiting groove, and the latches are used for connecting the base plate with the PCB.
  7. 7. The LED display screen module prepared by the SMT bonding process of the LED display screen module according to claim 1.
  8. The LED display screen is characterized in that the LED display screen is formed by assembling a plurality of LED box bodies, each LED box body comprises a plurality of display modules, and each display module comprises a face mask, a bottom shell and the LED display screen module in the claim 7, wherein the face mask and the bottom shell are arranged between the face mask and the bottom shell.
CN202111018593.0A 2021-09-01 2021-09-01 LED display screen module and SMT mounting technology thereof Active CN113727534B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114192915A (en) * 2021-12-27 2022-03-18 烟台台芯电子科技有限公司 IGBT welding process method

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101350160A (en) * 2008-09-05 2009-01-21 铁道部运输局 LED display screen and encapsulation method thereof
US20130057146A1 (en) * 2011-09-07 2013-03-07 Tsu-Min CHAO Concentrated light emitting device
CN103022318A (en) * 2012-12-14 2013-04-03 深圳市九洲光电科技有限公司 LED display screen package process based on COB (chip on board) technology and LED display screen
CN207410603U (en) * 2017-11-21 2018-05-25 惠州市蓝微电子有限公司 A kind of jig for attaching mounted for LED component with wiring board
CN108566741A (en) * 2018-06-15 2018-09-21 湖北匡通电子股份有限公司 A kind of high-new display module surface-mount type technique of LED and the technique using the module group assembling LED product
US20180358341A1 (en) * 2017-06-09 2018-12-13 Syndiant Inc. Micro LED Display Module and Manufacturing Method Thereof
CN208638812U (en) * 2018-02-07 2019-03-22 厦门鑫联信智能系统集成有限公司 LB patch position-limiting fixture
US20190360673A1 (en) * 2018-05-28 2019-11-28 Lumens Co., Ltd. Micro-led module and method for fabricating the same
CN111653210A (en) * 2020-04-27 2020-09-11 深圳市创显光电有限公司 Preparation method of COB integrated board and lamp panel and display module obtained by preparation method
CN112736180A (en) * 2020-11-20 2021-04-30 深圳市山本光电股份有限公司 LED surface mounting technology
CN113141730A (en) * 2021-04-14 2021-07-20 深圳市鸿岸电子科技有限公司 LED (light emitting diode) surface mounting method of FPC (Flexible printed Circuit)

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101350160A (en) * 2008-09-05 2009-01-21 铁道部运输局 LED display screen and encapsulation method thereof
US20130057146A1 (en) * 2011-09-07 2013-03-07 Tsu-Min CHAO Concentrated light emitting device
CN103022318A (en) * 2012-12-14 2013-04-03 深圳市九洲光电科技有限公司 LED display screen package process based on COB (chip on board) technology and LED display screen
US20180358341A1 (en) * 2017-06-09 2018-12-13 Syndiant Inc. Micro LED Display Module and Manufacturing Method Thereof
CN207410603U (en) * 2017-11-21 2018-05-25 惠州市蓝微电子有限公司 A kind of jig for attaching mounted for LED component with wiring board
CN208638812U (en) * 2018-02-07 2019-03-22 厦门鑫联信智能系统集成有限公司 LB patch position-limiting fixture
US20190360673A1 (en) * 2018-05-28 2019-11-28 Lumens Co., Ltd. Micro-led module and method for fabricating the same
CN108566741A (en) * 2018-06-15 2018-09-21 湖北匡通电子股份有限公司 A kind of high-new display module surface-mount type technique of LED and the technique using the module group assembling LED product
CN111653210A (en) * 2020-04-27 2020-09-11 深圳市创显光电有限公司 Preparation method of COB integrated board and lamp panel and display module obtained by preparation method
CN112736180A (en) * 2020-11-20 2021-04-30 深圳市山本光电股份有限公司 LED surface mounting technology
CN113141730A (en) * 2021-04-14 2021-07-20 深圳市鸿岸电子科技有限公司 LED (light emitting diode) surface mounting method of FPC (Flexible printed Circuit)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114192915A (en) * 2021-12-27 2022-03-18 烟台台芯电子科技有限公司 IGBT welding process method

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