CN217588924U

CN217588924U - Novel Mini-COB light source

Info

Publication number: CN217588924U
Application number: CN202123396967.0U
Authority: CN
Inventors: 唐加良
Original assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Current assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-10-14
Anticipated expiration: 2031-12-30

Abstract

The utility model belongs to the technical field of SMD paster LED, especially a novel Mini-COB light source, including the base plate, the base plate upper end is provided with the pad, the pad is provided with printing ink all around, the base plate surface is surrounded by the circuit, the relative inboard that surrounds the circuit of base plate upper surface is the fretwork groove setting, the circuit is around surface drip-injected with the encapsulation glue, the encapsulation glue is internally provided with the wafer, the utility model discloses will be in parallel with the series circuit; designing a packaging and forming form and glue light; the finished product can be inserted into the baffle plate, and the distance between the product and the MINI-COB light source is small; the inner and outer ring light sources are designed to have high brightness, and a novel Mini-COB light source can be realized; the light source is applied to the insertion baffle of the packaging equipment; the thickness of the product is thin; optical design of inner and outer rings; the current input is adjustable; packaging colloid for condensing light on the surface; the method can improve the defect detection of whitish appearance, damage, uneven adhesive surface and the like of the product caused by insufficient light intensity due to too far external light source and poor PR recognition degree.

Description

Novel Mini-COB light source

Technical Field

The utility model belongs to the technical field of SMD paster LED, concretely relates to novel Mini-COB light source.

Background

SMD is one of SMT (Surface Mount Technology) components. In the initial stage of electronic circuit board production, via hole assembly is completed manually. After the first batch of automated machines was released, they could place some simple pin components, but complex components still required manual placement to allow reflow. Surface Mounted components (Surface Mounted components) mainly include rectangular chip components, cylindrical chip components, composite chip components, and irregular chip components.

The existing packaging machine platform uses an SMD (surface mounted device) patch light source; irradiating the outside of the mechanism with light to carry out CCD appearance inspection on products in the carrier tape; the light source is far away from the product; poor leakage such as poor penetrability (white product image, breakage, uneven glue surface) and the like to cause client; the lamp surface is whitish; the lamp surface consistency is poor; and defective abnormality such as broken and dead lamp.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems existing in the prior art, the utility model provides a novel Mini-COB light source, which has the characteristics of thin product thickness, adjustable current input, light condensation of surface-packaged colloid, and the like.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a novel Mini-COB light source, includes the base plate, the base plate upper end is provided with the pad, the pad is provided with printing ink all around, the substrate surface has the circuit in the surrounding, the inboard that the circuit was encircleed relatively to the substrate upper surface is the fretwork groove setting, the circuit is encircleed the surface and is dripped and have the encapsulation glue, the inside wafer that is provided with of encapsulation glue, the wafer lower surface is connected with the substrate and the lower surface both sides are still connected with the substrate surface through the tin cream.

As the utility model discloses a novel Mini-COB light source preferred technical scheme, the pad is provided with a plurality of at the base plate upper surface, and all switches on through the circuit.

As the utility model discloses a novel Mini-COB light source preferred technical scheme, the wafer passes through the welded mounting in the pad upper end.

As the utility model discloses a novel Mini-COB light source preferred technical scheme, the inside fretwork groove of base plate is used for the CCD camera lens to shoot.

As the utility model discloses a novel Mini-COB light source preferred technical scheme, the encapsulation is glued and is stereotyped with all component encapsulation in base plate upper end.

As the utility model discloses a novel Mini-COB light source preferred technical scheme, the base plate is BT/FR-4/FPC-4 substrate.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a parallel-serial circuit; designing a packaging and forming form and glue light; the finished product can be inserted into the baffle plate, and the distance between the product and the MINI-COB light source is small; the inner and outer ring light sources are designed to have high brightness, and a novel Mini-COB light source can be realized; the light source is applied to the insertion baffle of the packaging equipment; the thickness of the product is thin; optical design of inner and outer rings; the current input is adjustable; packaging colloid for condensing light on the surface; the method can improve the defect detection of whitish and damaged appearance, uneven glue surface and the like of the product caused by insufficient light intensity of an external light source and poor PR recognition.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention. In the drawings:

fig. 1 is a schematic structural view of the present invention from the top;

FIG. 2 is a schematic side view of a partial cross-section of the present invention;

in the figure: 1. a substrate; 2. a pad; 3. hollowing out the grooves; 4. printing ink; 5. a line; 6. packaging glue; 7. a wafer; 8. and (7) solder paste.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-2, the present invention provides the following technical solutions: a novel Mini-COB light source comprises a substrate 1, wherein a bonding pad 2 is arranged at the upper end of the substrate 1, printing ink 4 is arranged on the periphery of the bonding pad 2, a circuit 5 is arranged on the surface of the substrate 1 in a surrounding mode, a hollow groove 3 is formed in the inner side, opposite to the circuit 5, of the upper surface of the substrate 1, packaging glue 6 is dripped on the surrounding surface of the circuit 5, a wafer 7 is arranged inside the packaging glue 6, the lower surface of the wafer 7 is connected with the substrate 1, the two sides of the lower surface are further connected with the surface of the substrate 1 through tin paste 8, in the embodiment, the inner circle of light source and the outer circle of light source synchronously irradiate to enable the light source to emit light on the inner side, and glare of the external light source is reduced, so that poor CCD identification is caused; the light transmission effect of the closely-spaced enhanced light source ensures that the surface of the internal material is clear; breakage; the problems of uneven rubber surface and the like are completely and clearly captured; can prevent the problems of lamp death caused by poor outflow and poor consistency of surface material.

Specifically, the bonding pads 2 are arranged on the upper surface of the substrate 1 and are all conducted through the lines 5.

Specifically, the wafer 7 is mounted on the upper end of the pad 2 by soldering.

Specifically, the hollow-out groove 3 inside the substrate 1 is used for taking a picture of the CCD lens, and in this embodiment, the light source directly enters the packaging machine to insert the baffle (the front surface of the baffle is opened) and the distance between the baffle and the surface of the material is only 1.5mm, so that the light source is used for taking a picture of the CCD lens.

Specifically, the packaging adhesive 6 encapsulates and shapes all components at the upper end of the substrate 1.

Specifically, the substrate 1 is a BT/FR-4/FPC-4 base material.

The utility model discloses a theory of operation and use flow: the substrate 1 of the utility model is BT/FR-4/FPC-material, 4 and 8 series LED circuit diagrams are designed on the substrate 1; designing the input current to be 10-30mA; the input voltage is 20-28v, and proper power supply is provided, so that the adjustability of the light source and the maximization of the brightness are met; the middle of the light source is designed to be hollow so as to facilitate the taking of the right CCD lens, and the surface packaging form is designed to be an arc raised head mode so as to facilitate the collection of light emission; designing a packaging and forming form and glue light; the finished product can be inserted into the baffle plate to light the MINI-COB light source and has small distance from the product; the inner and outer ring light sources have high design brightness; the problems of whitish and damaged surface and uneven rubber surface of the product can be detected by all tests, and the light source is directly inserted into a packaging machine to insert a baffle (the front of the baffle is provided with a groove) and the distance between the light source and the surface of the material is only 1.5mm glass; the center is hollowed out for the CCD lens to take a picture; the inner and outer circles of light sources of the new light source are synchronously irradiated, so that the light sources emit light on the inner side, and poor CCD identification caused by external light source glare is reduced; the light transmission effect of the light source is enhanced at a close interval, so that the surface of the internal material is clear; breakage; the problems of uneven glue surface and the like are completely and clearly captured; can prevent the problems of lamp death caused by poor outflow and poor consistency of surface material.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A novel Mini-COB light source comprises a substrate (1), and is characterized in that: base plate (1) upper end is provided with pad (2), pad (2) are provided with printing ink (4) all around, base plate (1) surface is around having circuit (5), the inboard that relative circuit (5) were encircleed to base plate (1) upper surface is hollow groove (3) setting, circuit (5) encircle the surface and drip and have encapsulation glue (6), encapsulation glue (6) inside be provided with wafer (7), wafer (7) lower surface and base plate (1) are connected and lower surface both sides still through tin cream (8) and base plate (1) surface connection.

2. The novel Mini-COB light source of claim 1, wherein: the bonding pads (2) are arranged on the upper surface of the substrate (1) and are all conducted through the lines (5).

3. The novel Mini-COB light source of claim 1, wherein: the wafer (7) is mounted on the upper end of the bonding pad (2) through welding.

4. The novel Mini-COB light source of claim 1, wherein: the hollow groove (3) in the substrate (1) is used for photographing the CCD lens.

5. The novel Mini-COB light source as claimed in claim 1, wherein: and the packaging adhesive (6) is used for packaging and shaping all components at the upper end of the substrate (1).

6. The novel Mini-COB light source of claim 1, wherein: the substrate (1) is a BT/FR-4/FPC-4 base material.