CN205789885U - A kind of illuminator of full-automatic bonder - Google Patents
A kind of illuminator of full-automatic bonder Download PDFInfo
- Publication number
- CN205789885U CN205789885U CN201620502205.4U CN201620502205U CN205789885U CN 205789885 U CN205789885 U CN 205789885U CN 201620502205 U CN201620502205 U CN 201620502205U CN 205789885 U CN205789885 U CN 205789885U
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- base plate
- full
- circuit board
- illuminator
- automatic bonder
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Abstract
This utility model relates to field of semiconductor package, a kind of illuminator of full-automatic bonder, including circuit board, LED group and shell, LED group is fixing on circuit boards, shell includes base plate and side panel, base plate centre is provided with manhole, and on the fixing base plate in the enclosure of circuit board, circuit board is 7 degree～10 degree with the angle R of base plate, shell aperture is fixed on the underface of the photographic head of described full-automatic bonder down, and the manhole of base plate is just to photographic head.The illuminator of a kind of full-automatic bonder of this utility model, adds side light source, it is ensured that the degree of accuracy of image recognition, it is to avoid manual operation, not only reduces cost, and improves productivity ratio while ensureing product quality.
Description
Technical field
This utility model relates to field of semiconductor package, the photograph of a kind of full-automatic bonder
Bright device.
Background technology
At present, in semiconductor packaging industry, the effect of full-automatic bonder is by tiny simple grain
Wafer takes off from whole sheet film, is then welded in semiconductor frame, in the process, needs
The simple grain wafer to be identified by the image identification function of full-automatic bonder, is taken the most again
Under weld, yet with full-automatic bonder photographic head shoot image definition the highest,
The degree of accuracy causing image recognition is the highest, is typically difficult to identify that the most black wafer of bad wafer；Existing
Way be, before sheet film puts the workbench of full-automatic bonder into, to need artificial whole
Block sheet film checks one time, with instrument, black wafer is rejected, or is coated with in bad wafer surface with oil pen
Upper color so that image identification function is capable of identify that out, not only adds workload, and
Human intervention easily produces error, and the wafer caused is the most damaged.
Summary of the invention
This utility model is for the problems referred to above, it is provided that the illuminator of a kind of full-automatic bonder,
Add side light source, it is ensured that the degree of accuracy of image recognition, it is to avoid manual operation, not only reduce
Cost, and improve productivity ratio while ensureing product quality.
Technical problem to be solved in the utility model is achieved by the following technical solution:
A kind of illuminator of full-automatic bonder, including circuit board, LED group and shell,
LED group is fixing on circuit boards, and shell includes that base plate and side panel, base plate centre are provided with
Manhole, circuit board is fixed on the base plate in described shell, circuit board and the angle R of base plate
Be 7 degree～10 degree, shell aperture be fixed on down the photographic head of described full-automatic bonder just under
Side, the manhole of base plate is just to photographic head.
Further, circuit board is 4 pieces, be separately fixed at described base plate manhole four
Week；Potentiometer is set on circuit boards.
Further, a diameter of Ф 3mm of the LED of LED group～Ф 5mm, the number of LED
Amount at least 15.
The illuminator of a kind of full-automatic bonder of this utility model, adds side light source, it is ensured that
The degree of accuracy of image recognition, it is to avoid manual operation, not only reduces cost, and ensures to produce
Productivity ratio is improve while quality.
With detailed description of the invention this utility model made further details of theory below in conjunction with the accompanying drawings
Bright.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the upward view of Fig. 1；
Fig. 3 is use state diagram of the present utility model.
Detailed description of the invention
Fig. 1 is structural representation of the present utility model；Fig. 2 is the upward view of Fig. 1.In conjunction with figure
Shown in 1 and Fig. 2, the illuminator of a kind of full-automatic bonder, including circuit board 1, LED
Group 2 and shell 3, LED group 2 is fixing on the circuit card 1, and shell 3 includes base plate 3.1 He
Side panel 3.2, base plate 3.1 centre is provided with manhole 3.3, and circuit board 1 is fixed on shell 3
On interior base plate 3.1, circuit board 1 is 7 degree～10 degree with the angle R of base plate 3.1, this enforcement
The R of example is 10 degree, why needs to arrange angle, is because through repetition test, photographic head
Having lacked sidelight during shooting image causes definition the highest, so need increase is side light source,
Rather than straight irradiation source, shown in Figure 3, shell 3 is opening down is fixed on full-automatic die bond
The underface of the photographic head 12 of machine, the manhole 3.3 of base plate is just to photographic head 12.
Circuit board 1 is 4 pieces, is separately fixed at the surrounding of the manhole 3.3 of base plate；At electricity
Potentiometer 4 is set on road plate 1, for regulating the brightness of LED；The LED's of LED group 2
A diameter of Ф 3mm～Ф 5mm, the quantity of LED is at least 15, the LED of the present embodiment
A diameter of Ф 5mm, the quantity of LED is 28.
The power supply of 220V is on constant current source to circuit board, and LED turns on luminescence, passes through current potential
Device 4 regulates the brightness of LED, owing to adding side light source, makes the wafer images that photographic head shoots
High-visible, in sharp contrast.
Fig. 3 is use state diagram of the present utility model.As it is shown on figure 3, sheet film 11 is placed on work
In station 10, the photo of each wafer on photographic head 12 film stock film 11, when image is known
Other function feed back preferably wafer time, mechanical hand 13 picks up this wafer and is welded on semiconductor frame
On；When image identification function is fed back to bad wafer, mechanical hand 13 does not pick up this wafer, with
Time photographic head 12 continue to capture the photo of next wafer, by that analogy, until whole sheet film 11
On good die pick complete.
In a word, this utility model adds side light source, it is ensured that the degree of accuracy of image recognition, keeps away
Exempt from manual operation, not only reduce cost, and improve production while ensureing product quality
Rate, reliability is high, it is simple to promote.
Claims (4)
1. an illuminator for full-automatic bonder, is characterized in that, including circuit board, LED
Lamp group and shell, described LED group is fixed on described circuit board, and described shell includes base plate
And side panel, described base plate centre is provided with manhole, described circuit board be fixed on described outside
On base plate in shell, described circuit board is 7 degree～10 degree with the angle R of described base plate, described
Shell aperture is fixed on the underface of the photographic head of described full-automatic bonder, described base plate down
Manhole just to described photographic head.
The illuminator of full-automatic bonder the most according to claim 1, is characterized in that,
Described circuit board is 4 pieces, is separately fixed at the surrounding of the manhole of described base plate.
The illuminator of full-automatic bonder the most according to claim 2, is characterized in that,
Described circuit board arranges potentiometer.
The illuminator of full-automatic bonder the most according to claim 1, is characterized in that,
A diameter of Ф 3mm of the LED of described LED group～Ф 5mm, the quantity of described LED is extremely
It is 15 less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620502205.4U CN205789885U (en) | 2016-05-26 | 2016-05-26 | A kind of illuminator of full-automatic bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620502205.4U CN205789885U (en) | 2016-05-26 | 2016-05-26 | A kind of illuminator of full-automatic bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205789885U true CN205789885U (en) | 2016-12-07 |
Family
ID=59979889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620502205.4U Active CN205789885U (en) | 2016-05-26 | 2016-05-26 | A kind of illuminator of full-automatic bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205789885U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585351A (en) * | 2018-10-29 | 2019-04-05 | 苏州腾晖光伏技术有限公司 | A method of improving the back alum gate line alignment precision of crystal silicon double-side solar cell |
-
2016
- 2016-05-26 CN CN201620502205.4U patent/CN205789885U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585351A (en) * | 2018-10-29 | 2019-04-05 | 苏州腾晖光伏技术有限公司 | A method of improving the back alum gate line alignment precision of crystal silicon double-side solar cell |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |