JP2009283959A - Assembled printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the following problem: when an inspection is performed in a state of an assembled printed circuit board formed by connecting a plurality of printed circuit boards and a failure of a certain specific electronic component among a plurality of electronic components is found, specification of the failed electronic component is difficult in the subsequent repair process. <P>SOLUTION: In the assembled printed circuit board formed by connecting the plurality of printed circuit boards aligned in line in the lateral direction with waste boards surrounding the plurality of printed circuit boards, pads or patterns for linearly fixing the electronic components in the longitudinal direction are formed on the surfaces of the printed circuit boards, signs for identifying individual printed circuit boards are provided at positions corresponding to the printed circuit boards on the surfaces of the waste boards along the lateral directions of the printed circuit boards, and signs for identifying individual electronic components to be fixed to the pads or patterns are provided at positions corresponding to the individual electronic components on the surfaces of the waste board along the longitudinal directions of the printed circuit boards. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a collective printed wiring board in which a plurality of printed wiring boards (bare boards) are connected.

  When a printed wiring board device is manufactured by fixing (mounting) electronic components on a relatively small printed wiring board, it takes time to position and transport the printed wiring board, resulting in a reduction in manufacturing efficiency. For this reason, the collective printed wiring board which connected the printed wiring board mutually using the connection piece etc. is used conventionally (for example, refer patent documents 1-6).

  This collective printed wiring board is generally handled as a single board in the manufacturing stage, and electronic components are generally fixed to pads or the like formed on the front surface and / or back surface thereof.

  Then, the printed wiring board is divided from the collective printed wiring board and each printed wiring board device is inspected, or each printed wiring board device is inspected as it is and the printed wiring board is removed from the collective printed wiring board. By dividing, a printed wiring board device as a finished product is completed.

Japanese Patent Laid-Open No. 04-320597 JP-A-11-176974 JP-A-11-163482 Japanese Patent Laid-Open No. 02-031490 Japanese Patent Laid-Open No. 03-250800 Japanese Patent Laid-Open No. 06-112600 Japanese Patent Laid-Open No. 06-169137

  As a result of the inspection of each printed wiring board device with the collective printed wiring board, if a defect of a specific electronic component in a plurality of electronic components is found, the defective electronic component is identified in a subsequent repair process There was a problem that was difficult. Such a problem becomes prominent when a plurality of the same electronic components are mounted on the collective printed wiring board.

  The present invention has been made to solve such a problem, and the repair work can be facilitated by a simple configuration in which a display capable of specifying an electronic component is provided on a discarded board constituting a part of the collective printed wiring board. The purpose is to do.

  The present invention relates to a collective printed wiring board in which a plurality of printed wiring boards that are aligned in a row in the lateral direction and connected to each other by connecting pieces and a discarded board that surrounds the plurality of printed wiring boards are connected by connecting pieces. is there.

  A pad or pattern for fixing electronic components in a straight line in the longitudinal direction is formed on the surface of the printed wiring board, and each of the printed boards is disposed on the surface of the discarded board along the short direction of the printed wiring board. A display for identifying the wiring board is provided at a position corresponding to the printed wiring board, and an individual electronic component fixed to the pad or pattern is identified on the surface of the discarded board along the longitudinal direction of the printed wiring board. A display for this purpose is provided at a position corresponding to each electronic component.

  With this configuration, even when a plurality of identical electronic components are fixed to each printed wiring board constituting the collective printed wiring board, defective electronic components to be repaired can be identified in a short time after the inspection is completed. .

  That is, in the inspection process, as a result of inspecting all the electronic components as a collective printed wiring board, if a defect of the electronic component is found, in the inspection process, the printed wiring board on which the defective electronic component is fixed, The defective electronic component specified by the display provided on the surface of the discarded board along the short side direction of the printed wiring board and fixed to the printed wiring board is displayed on the discarded board along the longitudinal direction of the printed wiring board. Inspection sheets, inspection data, and the like specified by the display provided on the surface can be created.

  In the next repair process, the printed circuit board on which the defective electronic component to be repaired is fixed along the short direction of the printed circuit board based on the information described in the inspection sheet, inspection data, etc. A defective electronic component to be repaired that is identified by a display provided on the surface of the board and is fixed to the printed wiring board is indicated by a display provided on the surface of the discarded board along the longitudinal direction of the printed wiring board. Can be identified in a short time.

  According to the present invention, a defective electronic component discovered in an inspection process among a plurality of electronic components fixed to individual printed wiring boards constituting the collective printed wiring board can be easily and reliably obtained in a subsequent process such as a repair process. Can be specified.

(Example 1) which is a top view of an assembly printed wiring board (Example 1) which is a top view of the collective printed wiring board which fixed the electronic component (mounting). (Example 1) which is a perspective view of the edge part of the assembly printed wiring board which fixed the electronic component (mounting) (Example 1) which is a top view of a printed wiring board apparatus. (Example 1) which is a perspective view of the edge part (W part of FIG. 4) of a printed wiring board apparatus. (Example 1) which is a side view of a printed wiring board apparatus. FIG. 3 is a plan view of the print head (Example 1). 1 is a perspective view of an end portion of a print head (Example 1). FIG. 1 is a cross-sectional view of a print head (Example 1). (Example 2) which is a top view of an assembly printed wiring board (Example 2) which is the enlarged view which looked at the part of V groove from the side surface (Example 3) which is a top view of an assembly printed wiring board

  Hereinafter, the present invention will be described in detail using examples.

A first embodiment according to the present invention will be described with reference to FIGS.
FIG. 1 is a plan view of the collective printed wiring board 1, FIG. 2 is a plan view of the collective printed wiring board in which electronic components 10 are fixed to the collective printed wiring board 1 shown in FIG. 1, and FIG. 3 is shown in FIG. FIG. 4 is a plan view of a printed wiring board device 11 obtained by dividing the aggregate printed wiring board shown in FIGS. 2 and 3, and FIG. 5 is shown in FIG. 6 is a side view of the printed wiring board device shown in FIG. 5, FIG. 7 is a plan view of the print head 20 using the printed wiring board device 11, and FIG. 7 is a perspective view of an end portion of the print head 20 shown in FIG. 7, and FIG. 9 is a cross-sectional view of the print head 20 shown in FIGS. In FIG. 3, the displays 7 and 8 shown in FIG. 2 are omitted.

[Aggregate printed wiring board]
As shown in FIG. 1, a collective printed wiring board 1 according to the present invention includes a plurality (five) of printed wiring boards 2 aligned in a short direction (X direction) and connected to each other by connecting pieces 4. The discarded boards 5 and 6 surrounding the five printed wiring boards 2 are connected by connecting pieces 4.

  A solid pattern 3 made of copper foil is formed on the surface of the printed wiring board 2 to fix an electronic component 10 to be described later in a straight line shape (straight line or staggered pattern) in the longitudinal direction (Y direction). Yes.

  In addition, on the surface of the discarded substrate 6 on one side (left side of the drawing) along the short direction (X direction) of the printed circuit board 2, a display 8 for identifying each printed circuit board 2 is displayed. It is provided directly beside, that is, at a position corresponding to each printed wiring board 2. In the first embodiment, since there are five printed wiring boards 2, letters A to E are formed of copper foil at the positions of the discard board 6 corresponding to each printed wiring board 2. The display 8 may be formed on the surface of the discarded substrate 6 that is both along the short side direction (X direction) of the printed wiring board 2 (the left side and the right side in the drawing).

  Furthermore, a display 7 for identifying individual electronic components 10 fixed to the solid pattern 3 is provided on the surface of the discarded substrate 5 on one side (downward in the drawing) along the longitudinal direction (Y direction) of the printed wiring board 2. It is provided at a position corresponding to each electronic component 10. In the first embodiment, as described later, 20 electronic components 10 are fixed to each printed wiring board 2, so that characters 1 to 20 are placed at the positions of the discard substrate 5 corresponding to the fixing positions of the electronic components 10. Is formed of copper foil. The display 7 may be formed on the surface of both of the discarded substrates 5 (upper side and lower side in the drawing) along the longitudinal direction (Y direction) of the printed wiring board 2.

  As shown in FIG. 1, a plurality of connecting pieces 4 that connect the printed wiring boards 2 and the printed wiring boards 2 and the discarded boards 5 and 6 penetrate in the plate thickness direction (Z direction perpendicular to the X direction and the Y direction). These are formed in the collective printed wiring board 1 by providing the long holes. In Example 1, all the five long printed wiring boards 2 were the same.

[Aggregated printed circuit board with electronic components fixed]
Next, in order to explain the effect of the collective printed circuit board 1, the collective printed circuit board with electronic components in which the electronic components are fixed to the collective printed circuit board 1 will be described.

  2 and 3, 20 electronic components (light emitting element arrays) 10 are fixed in a staggered manner with an adhesive to each of the solid patterns 3 of the five printed wiring boards 2 of the collective printed wiring board 1 of FIG. 1. This is a collective printed wiring board with electronic components.

  This collective printed wiring board with electronic components is set in the inspection device as it is, and a power source and an operation signal are sent to the printed wiring board device 11 by a probe, and all the electronic components fixed to the five printed wiring board devices 11 are sent. Ten operational tests are performed. Here, the printed wiring board device 11 is a device that becomes a product when 20 electronic components 10 are fixed to the printed wiring board 2 and divided as shown in FIGS. 4 to 6.

(Printed wiring board device)
An example of the printed wiring board device 11 will be described in more detail.
As shown in FIG. 5, the printed wiring board 11 has a light emitting element array 10 as an electronic component fixed in a staggered pattern on a solid pattern 3 formed on the surface of the printed wiring board 2. The pad 14 and the pad 15 connected to the wiring pattern 16 on the surface of the printed wiring board 2 are electrically connected by the gold wire 13. Note that although a plurality of pads 14, gold wires 13 and pads 15 are actually formed, only one set is shown in FIG. 5 for ease of explanation.

  A series of steps for manufacturing the printed wiring board 11 (application of adhesive to the solid pattern 3 → fixing the light emitting element array 10 → wire bonding) is a collective print in which the printed wiring board 2 is connected by the connecting pieces 4. This is performed on the wiring board 1.

  The printed wiring board 11 is used for a print head 20 used in an image forming apparatus or the like as shown in FIGS. The print head 20 includes a housing 23 in which a lens array 22 in which a plurality of rod lenses 21 are arranged and fixed is fixed with an adhesive or the like, and a housing 23 so that one lens surface of the lens array 22 faces the light emitting element array 10. And a printed wiring board device 11 fixed with an adhesive or the like.

  As shown in FIG. 9, when the light emitting point (LED) 26 of the light emitting element array 10 fixed to the surface of the printed wiring board device 11 emits light, the print head 20 emits light emitted from the light emitting point 26. The distance to the image formation point (focal position) converged (condensed) by the lens array 22 is set to be the conjugate length TC. The conjugate length TC is a distance L from the light emitting point to the lower surface (one lens surface) of the lens array 22, a distance L from the upper surface (the other lens surface) of the lens array 22 to the imaging point, and the lens array 22. And a relationship of TC = T + 2L is established.

(Inspection of printed wiring board equipment)
The inspection items of the printed wiring board device 11 described above include positional deviation of the light emitting element array 10, light quantity, and the like. These inspection items are inspected as a collective printed wiring board with electronic components in which the printed wiring board device 11 is connected by the connecting piece 4 using a known image processing technique using a CCD camera.

  As a result, in the inspection process, for example, when it is determined that the light emitting element array 12 shown in FIGS. 2 and 3 has a low light quantity and is defective, the light emitting element array to be repaired on the inspection sheet or inspection data “B4” is recorded.

(Repair of printed circuit board equipment)
In the repair process of the next process, it is a short time that the light emitting element array 12 of “B4” should be replaced in the collective printed wiring board to which the electronic components are fixed based on the inspection sheet or the inspection data. Can be judged reliably. For this reason, the worker in the repair process can remove the light emitting element array 12 at the position “B4” and replace it with a non-defective light emitting element array 10 without making a mistake with the other light emitting element arrays 10.

  As described above, the collective printed wiring board 1 according to the present invention repairs defective electronic components 12 found in the inspection process from a plurality of electronic components 10 fixed to each printed wiring board 2. There exists an effect that it can specify easily and reliably at the following processes, such as a process.

Another embodiment of the present invention will be described with reference to FIGS.
10 is a plan view of the collective printed wiring board 41 according to the present invention, and FIG. 11 is a partially enlarged view of the V groove 17 shown in FIG. For easy understanding, the same portions as those in the first embodiment are denoted by the same reference numerals and detailed description thereof is omitted.

  The main difference between the second embodiment and the first embodiment is that the printed wiring boards 2 and the printed wiring boards 2 and the discarded boards 18 and 19 are connected to each other as shown in FIGS. Instead, it is a point that is a connecting portion 27 between the V grooves 17 formed on the front surface and the back surface. Even with this configuration, the same effects as those of the first embodiment can be obtained.

Another embodiment of the present invention will be described with reference to FIG.
FIG. 12 is a plan view of the collective printed wiring board 42 according to the present invention. For easy understanding, the same portions as those in the first embodiment are denoted by the same reference numerals and detailed description thereof is omitted.

  The main difference between the third embodiment and the first embodiment is that not the pattern 3 but the pad 24 is formed on the surface of the printed wiring board 25. That is, the pad 24 is formed at a position where the electronic component 10 is fixed. Even with this configuration, the same effects as those of the first embodiment can be obtained.

  The above-described embodiments have been illustrated for the purpose of explanation, and the present invention is not limited thereto. Those skilled in the art will recognize from the claims, the detailed description of the invention, and the drawings. Modifications and additions can be made without departing from the technical idea of the present invention.

  For example, in the above-described embodiment, the electronic component 10 is fixed to the printed wiring board 2 in a staggered manner, but may be fixed on a straight line. In the above-described embodiments, the same light emitting element array is used as the electronic component. However, different types of electronic components may be used.

  In the above-described embodiments, the printed wiring board is a collective printed wiring board having five sheets, but a plurality of printed wiring boards (two or more) may be used.

  The present invention is applied to an aggregate printed wiring board in which a plurality of printed wiring boards to which electronic components are fixed are connected.

DESCRIPTION OF SYMBOLS 1 Collective printed wiring board 2 Printed wiring board 3 Pattern 4 Connection piece 5 Throw away board (longitudinal direction)
6 Discarded substrate (short direction)
7 Display (longitudinal direction)
8 Display (short direction)
9 Penetration hole 10 Electronic component 11 Printed wiring board device 12 Defective electronic component

Claims (1)

A plurality of printed wiring boards arranged in a line in the lateral direction;
In a collective printed wiring board that is connected to a discarded board surrounding the plurality of printed wiring boards,
On the surface of the printed wiring board, a pad or pattern for fixing electronic components in a straight line in the longitudinal direction is formed,
On the surface of the discarded board along the short direction of the printed wiring board, a display for identifying each printed wiring board is provided at a position corresponding to the printed wiring board,
On the surface of the discarded substrate along the longitudinal direction of the printed wiring board, an indication for identifying each electronic component fixed to the pad or the pattern is provided at a position corresponding to each electronic component. Collective printed wiring board characterized by

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