KR101651587B1 - Inspection equipment for led packaging burn-in test - Google Patents

Inspection equipment for led packaging burn-in test Download PDF

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Publication number
KR101651587B1
KR101651587B1 KR1020150038726A KR20150038726A KR101651587B1 KR 101651587 B1 KR101651587 B1 KR 101651587B1 KR 1020150038726 A KR1020150038726 A KR 1020150038726A KR 20150038726 A KR20150038726 A KR 20150038726A KR 101651587 B1 KR101651587 B1 KR 101651587B1
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KR
South Korea
Prior art keywords
pin
plate
blade pin
blade
pcb
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KR1020150038726A
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Korean (ko)
Inventor
신동원
Original Assignee
주식회사 애이시에스
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Priority to KR1020150038726A priority Critical patent/KR101651587B1/en
Application granted granted Critical
Publication of KR101651587B1 publication Critical patent/KR101651587B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2608—Circuits therefor for testing bipolar transistors
    • G01R31/2619—Circuits therefor for testing bipolar transistors for measuring thermal properties thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to an LED packaging burn-in test inspecting device. The device comprises a probe card assembly unit. The probe card assembly unit is combined by a base reinforcement plate, heat radiation films, a PCB plate, a frame plate, a ceramic plate, and a plurality of blade pins. Therefore, the device can individually and easily replace the blade pins.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED package,

The present invention relates to an LED package burn-in test inspecting apparatus, and more specifically, to a single lead frame of an LED packaging, an individual luminance inspection is performed for an LED packaging imprint test by a two-contact test, And an LED packaging multilayer test inspection apparatus having a possible structure.

In general, a light emitting diode (LED) is a kind of light emitting device using a semiconductor that converts electricity into light. It is small in size, has a long life span, consumes less power than a light source, and has advantages of high speed response. Accordingly, it is widely used as a backlight unit of various display devices requiring a light source, a light source of a small lamp and various instruments. Such an LED is manufactured in a small chip form using a semiconductor process. In general, an LED chip manufacturing process includes an epi process (EPI) in which an epi wafer is provided on a substrate as a base material, It is fabricated through a package process that packages LED chip manufactured in chip process and chip process in a lead frame, and it is tested while being packaged in lead frame. At this time, the test is performed by an electric light source test process in which a high temperature heat is injected to test a defect caused by a heat generated when a light is generated by a light source. In this test process, LEDs which are not normally operated are excluded, and LEDs which are normally operated are classified and sorted according to their performances.

Conventionally, the LED was tested at room temperature when testing the electric light source, and the LED package was analyzed one by one in a state where the LED packages were separated and classified according to the internal resistance and shipped. However, in the conventional one-by-one testing method, it takes a long time, and a problem that the light source is blurred or dies due to heat generated during use occurs, and a defect is not detected in the previous stage of the LED packaging module. There is a problem that cost is increased due to the necessity of a process of separating the packaging. In this connection, Korean Patent Registration No. 10-1213194 and Korean Patent Registration No. 10-1488488 are disclosed in the prior art documents.

The present invention has been proposed in order to solve the above-mentioned problems of the previously proposed methods. The present invention proposes a probe card assembly which is combined with a base reinforcement plate, a heat dissipation film, a PCB plate, a heat dissipation film, a frame plate and a ceramic plate and a plurality of blade pins Unit is solved to solve the problem of the inspection apparatus in the high temperature packaging test of the LED package and the individual luminance inspection for the efficient LED packaging is performed by the double contact test for one frame of the LED package, So that it is possible to replace individual pins in the event of a problem with the LED package.

It is another object of the present invention to provide a structure for early detection of defects due to LED package individual burn-in burn-in tests and to enable individual replacement of blade pins of an inspection apparatus, thereby improving reliability of customers, Another object of the present invention is to provide an LED packaging burn-in test inspecting apparatus which can effectively shorten the time.

According to an aspect of the present invention, there is provided an apparatus for testing an LED package,

1. An LED package inspecting apparatus for inspecting a plurality of LED packages mounted on an LED package lead frame,

A base reinforcement plate fixedly installed on an inspection apparatus main body to test the plurality of LED packages;

A heat dissipating film disposed on the base reinforcement plate and having a plurality of blade pin penetrating portions aligned in the longitudinal direction;

Wherein a plurality of blade pin press-fit holes are aligned and arranged in the longitudinal direction, and press-fit grooves are formed on both sides of the longitudinal direction to press-fit the reference pins, and the plurality of LED packages are tested A PCB plate constituting an electrical circuit for;

A heat dissipation film disposed on the PCB plate and having a plurality of blade pin penetrating portions aligned in the longitudinal direction;

A plurality of blade pin penetrating portions arranged and arranged in a longitudinal direction corresponding to the plurality of blade pin press-fit holes, and a plurality of blade pin penetrating portions arranged and disposed on the heat dissipating film, And a reference pin through hole corresponding to a press-fit groove into which the reference pin is press-fitted is formed;

A reference pin insertion hole corresponding to the reference pin passing through the reference pin through hole of the frame plate is formed and fixed to the frame plate, A ceramic plate having a plurality of blade pin alignment slits formed therein for determining contact accuracy and having a plurality of blade pin insertion holes formed on a line of the plurality of blade pin alignment slits to determine a Y axis contact accuracy; And

Through the blade pin insertion hole of the ceramic plate and the blade pin penetration portion of the frame plate, through the pin penetration portion of the heat dissipation film and inserted through the blade pin press-fit hole of the PCB plate to be electrically connected and connected, And includes a plurality of LED packages mounted on the frame and a plurality of blade pins contacting for contact inspection.

Preferably, the base reinforcing plate includes:

A plurality of heat exhaust through holes for exhausting heat generated in the heating plate are formed, and a forced cooling system is connected to one side in the longitudinal direction for suppressing thermal expansion, and forced cooling And a plurality of fastening bolt holes for fastening can be formed.

Preferably, the heat-radiating film is a heat-

The base reinforcement plate may be formed in a rectangular or rectangular shape and serves to convert direct heat transferred from the base reinforcement plate to the PCB plate into indirect heat and may form a plurality of holes for fastening the base plate reinforcement plate and the PCB plate bolt .

Preferably, the PCB plate comprises:

A plurality of fastening bolt holes for fastening and a plurality of fastening bolt holes for fastening are formed in a shape of a rectangular or rectangular plate corresponding to the base reinforcing plate and the heat radiation film, can do.

Preferably, the heat-radiating film is a heat-

A plurality of blade pin press-in holes (not shown) formed in the PCB plate so as to be arranged in the longitudinal direction of the PCB plate, And a plurality of holes for penetrating the blade pin can be formed.

Preferably, the frame plate includes:

A plurality of bolt holes for fastening are formed in a shape of a rectangular or rectangular plate provided in a plurality of blade pin press-fit hole regions formed in a longitudinal direction of the heat dissipation film disposed on the PCB plate, And heat dissipation through the blade pin penetrations and through holes may serve to prevent thermal deformation of the ceramic plate and blade pins.

Preferably, the ceramic plate further comprises:

A slit for fixing the blade pin to a through hole connectable with the PCB plate, and a plurality of fastening bolt holes for fastening are formed, And can be made of a ceramic or an engineering plastic material having easy processing.

Advantageously, the blade pin comprises:

A PCB inserting hole is formed at an upper portion of the PCB inserting portion, and a T-shaped hole is formed at an upper portion of the PCB inserting hole, And a fin portion formed by bending a blade pin tension portion on an upper portion of the pin body is formed.

More preferably,

A blade pin inserting hole for inserting the blade pin and confirming the height of the pin body, a blade pin removing hole for easily removing the blade pin, and an assembly of the blade pin on the T- And a blade pin pressing groove for facilitating the operation of the blade.

Still more preferably,

An R removal groove may be formed at both ends of the T shape of the pin body so that the blade pin can be completely inserted through the R removal groove.

According to the LED package burn-in test inspecting apparatus proposed in the present invention, the probe card assembly unit including the base reinforcement plate, the heat dissipation film, the PCB plate, the heat dissipation film, the frame plate, the ceramic plate and the plurality of blade pins, A single luminescence test for efficient LED packaging is performed with a two-contact test for one lead frame of the packaging, the heat generated at the heat plate affects the minimization of the constituent units, and the continuous individual luminescence In the event of a problem with the blade pin due to inspection, individual replacement of the blade pin can be facilitated.

In addition, according to the present invention, it is possible to eliminate defects generated during use by the customer (final consumer) through the LED package burn-in test individual luminance inspection, and to individually replace the defects caused by blade pin trouble due to continuous individual luminance inspection of the LED package burn- The reliability of the customer (final consumer) can be improved, and the blade pin repair time and repair waiting time of the LED package burn-in test inspection device can be effectively shortened.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram of a functional block of an LED packaging burn-in test test apparatus according to an embodiment of the present invention; FIG.
2 is a perspective view of an assembly of an LED packaging burn-in test test apparatus according to an embodiment of the present invention.
3 is a perspective view of a base reinforcement plate applied to an LED packaging burn-in test inspecting apparatus according to an embodiment of the present invention.
4 is a view illustrating a configuration of a heat dissipation film applied to an LED package burn-in test inspecting apparatus according to an embodiment of the present invention.
5 is a perspective view of a PCB plate applied to an LED package burn-in test inspecting apparatus according to an embodiment of the present invention.
6 is a view showing a configuration of a heat dissipation film applied to an LED package burn-in test inspecting apparatus according to an embodiment of the present invention.
7 is a perspective view of a frame plate applied to an LED package burn-in test inspection apparatus according to an embodiment of the present invention.
FIG. 8 is a perspective view of a ceramic plate applied to an LED package burn-in test inspecting apparatus according to an embodiment of the present invention. FIG.
9 is a view showing the configuration of a blade pin applied to an LED package burn-in test test apparatus according to an embodiment of the present invention.
10 is an exploded perspective view of an LED package burn-in test test apparatus according to an embodiment of the present invention.
11 is a cross-sectional view of a contact inspection process of an LED package burn-in test test device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, in order that those skilled in the art can easily carry out the present invention. In the following detailed description of the preferred embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In the drawings, like reference numerals are used throughout the drawings.

In addition, in the entire specification, when a part is referred to as being 'connected' to another part, it may be referred to as 'indirectly connected' not only with 'directly connected' . Also, to "include" an element means that it may include other elements, rather than excluding other elements, unless specifically stated otherwise.

FIG. 1 is a view showing the configuration of a functional block of an LED packaging burn-in test inspecting apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of an assembled state of the LED packaging burn-in test inspecting apparatus according to an embodiment of the present invention. 3 is a perspective view of a base reinforcement plate applied to an LED package burn-in test inspecting apparatus according to an embodiment of the present invention. FIG. 4 is a perspective view of a base reinforcement plate according to an embodiment of the present invention. FIG. 5 is a perspective view of a printed circuit board (PCB) applied to an LED package burn-in test inspecting apparatus according to an embodiment of the present invention, and FIG. 6 is a view showing a configuration of a heat dissipation film applied to an LED package burn-in test inspecting apparatus according to an embodiment of the present invention FIG. 7 is a perspective view of a frame plate applied to an LED package burn-in test inspecting apparatus according to an embodiment of the present invention. FIG. 8 is a cross- FIG. 9 is a view showing a configuration of a blade pin applied to an LED package burn-in test test apparatus according to an embodiment of the present invention. 1 to 9, an LED package burn-in test inspecting apparatus according to an embodiment of the present invention includes a base reinforcement plate 110, a heat dissipation film 120, a PCB plate 130, a heat dissipation film 140, a frame plate 150, a ceramic plate 160, and a plurality of blade pins 170. Here, the base reinforcement plate 110, the heat dissipation film 120, the PCB plate 130, the heat dissipation film 140, the frame plate 150, the ceramic plate 160, and the plurality of blade pins 170, The burn-in test is installed in the inspection apparatus and used as a probe card assembly unit.

The base reinforcing plate 110 has a rectangular or rectangular plate shape fixed to the inspection apparatus main body 10 for testing a plurality of LED packages 21. As shown in FIG. 3, the base reinforcing plate 110 includes a plurality of heat exhaust holes 111 for discharging heat generated in a heating plate 30, which will be described later, (Not shown) is connected to one side of the longitudinal direction, and a cooling path 112 is formed in the inside connected to the forced cooling system, and a plurality of fastening bolt holes 113 for fastening can be formed . Here, the base reinforcement plate 110 may be made of stainless steel (SUS304).

The heat dissipation film 120 is disposed and fixed to the upper portion of the base reinforcement plate 110, and has a structure in which a plurality of blade pin penetration portions 121 are aligned and arranged in the longitudinal direction. 4, the heat dissipation film 120 is formed in a rectangular or rectangular shape and serves to convert direct heat transferred from the base reinforcement plate 110 to the PCB plate 130 into indirect heat, A plurality of holes 122 for bolt fastening the base reinforcement plate 110 and the PCB plate 130 are formed.

A plurality of blade pin press-fit holes 131 are arranged and arranged in the longitudinal direction of the PCB plate 130. The reference pins 132 are press- And an electric circuit for testing a plurality of LED packages 21 is formed. As shown in FIG. 5, the PCB plate 130 may include a blade pin 170 and a blade pin 170 in a rectangular or rectangular plate shape corresponding to the base reinforcement plate 110 and the heat dissipation film 120, A plurality of fastening bolt holes 134 for fastening the blade pins 170, and a plurality of fastening bolt holes 134 for fastening the blade pins 170. The PCB plate 130 is formed with a blade pin press-fit hole 131 in which the same number of blade pins 170 as the blade pin insertion holes 163 of the ceramic plate 160 are installed.

The heat dissipation film 140 is disposed and fixed to the upper portion of the PCB plate 130, and has a structure in which a plurality of blade pin penetration portions 141 are aligned and arranged in the longitudinal direction. 6, the heat dissipation film 140 has a rectangular or rectangular plate shape and serves to convert direct heat transferred from the frame plate 150 to the PCB plate 130 into indirect heat. A plurality of holes 142 for passing through the blade pins 170 and a plurality of holes 142 formed in the base reinforcing plate 110 And a fastening hole 142 for bolt-fastening the frame plate 150 can be formed.

The frame plate 150 is disposed and fixed on the heat dissipation film 140 and has a plurality of blade pin penetrating portions 151 aligned and disposed in the longitudinal direction corresponding to the plurality of blade pin press- A heat exhaust hole 152 is formed along the bottoms of both edges coinciding with the pin penetration portion 151 and a reference fin penetration hole 153 corresponding to the press fit groove 133 into which the reference pin 132 is press- . 7, the frame plate 150 is installed in a plurality of blade pin press-fit holes 131 formed in the heat radiating film 140 arranged in the longitudinal direction in the PCB plate 130 A plurality of fastening bolt holes 154 for fastening are formed and the ceramic plate 160 and the blade pin 170 are connected to each other through the heat discharging through the blade pin penetrating portion 151. [ As shown in Fig. Here, the frame plate 150 may form a plurality of blade pin penetration portions 151, and may preferably be made of stainless steel (SUS304).

The ceramic plate 160 is disposed and fixed on the frame plate 150 and has a reference pin insertion hole corresponding to the reference pin 132 passing through the reference pin through hole 153 of the frame plate 150 A plurality of blade pin alignment slits 162 are formed to determine an X-axis contact accuracy that is orthogonal to the blade fin penetrations 151, and a plurality of blade pin alignment slits 162 And a plurality of blade pin insertion holes 163 for determining Y-axis contact accuracy are formed on the line. 8, the ceramic plate 160 is formed in a square or rectangular plate shape corresponding to the frame plate 150, and the blade pin 170 is inserted into the PCB plate 130, A plurality of fastening bolt holes 164 for fastening with slits to be fixed to the holes, and can be made of ceramic or engineering plastic material having an insulating function and easy to be machined. That is, the ceramic plate 160 secures the accuracy of alignment and alignment of the blade pin 170 by using the blade pin alignment slit 162 and the blade pin insertion hole 163, 163 of the blade pin 170 are easily inserted and the Y pin alignment of the blade pin 170 is facilitated and the X pin of the blade pin 170 using the blade pin alignment slit 162 Axis alignment and fixing of the blade pin 170 is facilitated. The assembly of the blade pin 170 can be facilitated in a one-to-one correspondence between the PCB plate 130 and the ceramic plate 160 using the reference pin 132.

The plurality of blade pins 170 pass through the blade pin insertion holes 163 of the ceramic plate 160 and the blade pin penetration portions 151 of the frame plate 150 and penetrate through the pin penetration portions 141 of the heat radiation film 140 Through the blade pin press-fit holes 131 of the PCB plate 130 to electrically connect and connect the plurality of LED packages 21 mounted on the LED package lead frame 20, . As shown in FIG. 9, the plurality of blade pins 170 are inserted into the blade pin press-fit holes 131 of the PCB plate 130 to form a PCB insertion portion 171 at the distal end thereof so as to be electrically connected and connected thereto. A PCB insertion hole 172 having a hollow is formed in the upper portion of the PCB insertion portion 171 and a T-shaped pin body 173 is formed at an upper portion of the PCB pressing hole 172. A pin body 173, And a fin portion 175 formed by a blade pin tension portion 174 is formed on an upper portion of the housing 150. The blade pin 170 also includes a blade pin insertion confirmation line 176 for inserting and inserting the blade pin 170 into the T shape of the pin body 173, A blade pin removing hole 177 and a blade pin pressing groove 178 for facilitating the assembly of the blade pin 170 on the T-shaped pin body 173. The blade pin 170 further includes an R removal groove 179 formed at both ends of the T shape of the pin body 173 to be bent, . That is, the blade pin 170 provides a function of electrically connecting and fixing the blade pin 170 using the PCB press-fit hole 172, and the insertion and height of the blade pin 170 using the blade pin insertion confirmation line 176 And the ease of assembling the blade pin 170 through the blade pin pressing groove 178 can be improved. The blade pin 170 can be completely inserted through the R removing groove 179 of the blade pin 170 and the blade pin press-fit hole 131 of the PCB plate 130 using the PCB inserting portion 171, And the blade pin 170 can be easily removed during repair of the blade pin 170 through the blade pin removing hole 177. [

10 is an exploded perspective view of an LED package burn-in test test apparatus according to an embodiment of the present invention. As shown in FIG. 10, the process of assembling the LED package burn-in test inspection apparatus according to an embodiment of the present invention can be performed as follows. First, the heat-radiating film 120 is placed on the base reinforcing plate 110, and the PCB plate 130 is bolted to the upper portion of the heat-radiating film 120. Next, the reference pin 132 is inserted into the press-fit groove 133 of the PCB plate 130 to press-fit. So that the blade pin insertion hole 131 of the PCB plate 130 and the blade pin insertion hole 163 of the ceramic plate 160 are accurately inserted at a ratio of 1: 1 when the final blade pin 170 is inserted after the structure is assembled . Next, another heat-radiating film 140 is placed on the PCB plate 130. The frame plate 150 is placed on the heat-radiating film 140 through the reference pin 132, and the frame plate 150 and the heat- The base reinforcement plate 110 is bolted to the PCB plate 130 using bolts. Next, the ceramic plate 160 is inserted into the PCB plate 130 and fitted to the reference pin 132 passing through the frame plate 150 using the reference pin insertion hole 161 of the ceramic plate 160, The frame plate 150 and the ceramic plate 160 are assembled using bolts. Next, a plurality of blade pins 170 are inserted and assembled through the blade pin insertion holes 163 formed on the line of the blade pin alignment slit 162 of the ceramic plate 160. Here, the blade pin 170 is inserted into the blade pin insertion hole 163 of the ceramic plate 160 downwardly. That is, the blade pins 170 are aligned so that the PCB insertion portion 171 of the blade pin 170 and the PCB press-fit hole 172 fit into the blade pin insertion hole 131 of the PCB plate 130. The wing portion of the T-shaped pin body 173 of the blade pin 170 is aligned with the blade pin alignment slit 162 of the ceramic plate 160 and the wing portion of the pin body 173 is aligned with the blade pin alignment slit 162 ), And the blade pin insertion confirmation line 176 is inserted to confirm the pressing. Assembly of the probe card assembly can be completed through this assembly process.

11 is a cross-sectional view of a contact inspection process of the LED package burn-in test test device according to an embodiment of the present invention. 11, the base reinforcement plate 110, the heat dissipation film 120, the PCB plate 130, the heat dissipation film 140, the frame plate 150, the ceramic plate 160, and the plurality of blade pins The LED package lead frame 20 in which a plurality of LED pins 21 are mounted in the heating plate 30 is disposed in the probe card assembly unit in which the plurality of blade pins 170 are assembled. At this time, the LED package lead frame 20 is mounted on the heating plate 30 for transferring heat in the contact inspection of the LED package 21, and the blade pin 170 is inserted into the through hole formed in the heating plate 30, And the pin portion 175 of the blade pin 170 comes into contact with the terminal of the LED package 21 as shown in the upper part of FIG. That is, the LED package burn-in test inspecting apparatus according to the present invention includes a plurality of LED packages 21 mounted on the inspection apparatus main body 10 and mounted on the LED package lead frame 20 while being moved along the X-axis, the Y- To perform the performance test.

The LED package burn-in test inspection apparatus according to an embodiment of the present invention performs an individual luminance inspection for efficient LED packaging by performing a contact test twice on one frame of LED packaging. In addition, LED packaging burn-in test improves customer's reliability due to individual brightness inspection, and also enables simple individual blade pin replacement when blade pin trouble caused by continuous testing, shortens repair time and shortens repair waiting time . That is, the LED package burn-in test inspecting apparatus according to the present invention can easily repair defective blade pins by the repair personnel of the blade pins.

The present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics of the invention.

110: Base reinforcing plate 111: Heat exhaust hole
112: cooling path 113: fastening bolt hole
120: Heat dissipation film 121: Blade pin penetration part
122: plural holes 130: PCB plate
131: blade pin press-fit hole 132: reference pin
133: press-fit groove 134: fastening bolt hole
140: Heat dissipation film 141: Blade pin penetration part
142: plural holes 150: frame plate
151: blade pin penetrating part 153: reference pin through hole
154: fastening bolt hole 160: ceramic plate
161: Reference pin insertion hole 162: Blade pin alignment slit
163: blade pin insertion hole 164: fastening bolt hole
170: blade pin 171: PCB inserting portion
172: PCB press-fitting hole 173: Pin body
174: blade pin tension portion 175: pin portion
176: Blade pin insertion confirmation line 177: Blade pin removal hole
178: blade pin pressing groove 179: R removing groove

Claims (10)

An LED package burn-in test inspecting apparatus for inspecting a plurality of LED packages (21) mounted on an LED package lead frame (20)
A base reinforcement plate 110 fixed to the inspection apparatus main body 10 for testing the plurality of LED packages 21;
A heat dissipation film 120 disposed on the base reinforcement plate 110 and having a plurality of blade pin penetration portions 121 aligned in the longitudinal direction;
A plurality of blade pin press-fit holes 131 are aligned and arranged in the longitudinal direction, a press-fit groove 133 in which the reference pin 132 is press-fitted into both side surfaces in the longitudinal direction, A PCB plate 130 forming an electrical circuit for testing the plurality of LED packages 21;
A heat dissipation film 140 disposed on the PCB plate 130 and having a plurality of blade pin penetrations 141 arranged in the longitudinal direction;
A plurality of blade pin penetrating portions 151 are aligned and disposed in the longitudinal direction corresponding to the plurality of blade pin press-fit holes 131, and the blade pin penetrating portions And a reference pin through hole 153 corresponding to the press-fit groove 133 in which the reference pin 132 is press-fitted is formed in the frame plate 151 150);
A reference pin insertion hole 161 corresponding to the reference pin 132 passing through the reference pin through hole 153 of the frame plate 150 is formed and fixed on the frame plate 150 A plurality of blade pin alignment slits 162 are formed to determine the X-axis contact accuracy that is orthogonal to the blade pin penetration portions 151, and a plurality of blade pin alignment slits 162 are formed on the lines of the plurality of blade pin alignment slits 162 A ceramic plate 160 on which a plurality of blade pin insertion holes 163 for determining Y-axis contact precision are formed; And
Passes through the blade pin insertion hole 163 of the ceramic plate 160 and the blade pin penetration portion 151 of the frame plate 150 and passes through the pin penetration portion 141 of the heat dissipation film 140, The plurality of LED packages 21 mounted on the LED package lead frame 20 are inserted and connected through the blade pin press-fit holes 131 of the plurality of LED packages 130, Pin 170,
The base reinforcement plate (110)
A plurality of heat exhausting through holes 111 for exhausting the heat generated in the heating plate 30 are formed in a rectangular or rectangular plate shape and forced cooling And a plurality of fastening bolt holes (113) for fastening the fastening bolt hole (113) are formed.
delete The heat sink according to claim 1, wherein the heat radiating film (120)
And serves to convert the direct heat transferred from the base reinforcement plate 110 to the PCB plate 130 into indirect heat. The base reinforcement plate 110 and the PCB plate 130 are formed of a rectangular or rectangular shape, And a plurality of holes (122) for bolt fastening are formed.
The PCB according to claim 1, wherein the PCB plate (130)
The blade pin 170 is electrically connected to the LED package 21 together with the blade pin 170 in a rectangular or rectangular plate shape corresponding to the base reinforcement plate 110 and the heat radiation film 120, , And a plurality of fastening bolt holes (134) for fastening are formed.
The method of claim 1, wherein the heat dissipation film (140)
The PCB plate 130 has a rectangular shape or a rectangular shape and serves to convert direct heat transferred from the frame plate 150 to the PCB plate 130 into indirect heat. A plurality of holes 142 for passing through the blade pins 170 are formed and the base reinforcement plate 110 and the frame plate 150 are fastened to each other. And a plurality of holes (142) for the plurality of holes (142).
The apparatus of claim 1, wherein the frame plate (150)
A plurality of blade pin press-fit holes 131 formed in the heat dissipation film 140 disposed on the PCB plate 130 in a lengthwise direction, the plate pins 130 having a rectangular or rectangular plate shape, A plurality of fastening bolt holes 154 are formed and thermal deformation of the ceramic plate 160 and the blade pin 170 is prevented through heat discharge through the blade pin penetrating portion 151 , LED packaging burn-in test inspection device.
The method of claim 1, wherein the ceramic plate (160)
And a slit for fixing the blade pin 170 to the through hole that can be connected to the PCB plate 130. The plurality of fasteners Wherein the bolt hole (164) is formed of ceramic or engineering plastic material having an insulating function and easy to be processed.
8. A method according to any one of claims 1 to 7, wherein the blade pin (170)
A PCB inserting portion 171 is formed at a distal end of the PCB inserting portion 171 so as to be inserted into the blade pin press-fit hole 131 of the PCB plate 130 so as to be electrically connected thereto. A T-shaped pin body 173 is formed at an upper portion of the PCB press-fit hole 172 and a blade pin tension portion 174 is bent at an upper portion of the pin body 173 And a fin portion (175) is formed on the surface of the pin portion (175).
9. The apparatus of claim 8, wherein the blade pin (170)
A blade pin insertion confirmation line 176 for inserting and inserting the blade pin 170 into the T shape of the pin body 173 and a blade pin removing hole 176 for easily removing the blade pin 170 177), and a blade pin pressing groove (178) for facilitating the assembly of the blade pin (170) on the T-shaped pin body (173). .
The method of claim 9, wherein the blade pin (170)
An R removal groove 179 is formed at both ends of the T shape of the pin body 173 so that the blade pin 170 can be completely inserted through the R removal groove 179 , The LED packaging burn-in test inspection device.
KR1020150038726A 2015-03-20 2015-03-20 Inspection equipment for led packaging burn-in test KR101651587B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220096959A (en) * 2020-12-31 2022-07-07 (주)마이크로컨텍솔루션 Separate apparatus and test socket
KR102602881B1 (en) * 2023-09-04 2023-11-15 박정선 Inspection Method of 7-segment Display Device

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Publication number Priority date Publication date Assignee Title
JP2006514289A (en) * 2003-02-28 2006-04-27 フィコム コーポレイション Interconnect for printed circuit board, method for manufacturing the same, and interconnect assembly having the same
KR20090022882A (en) * 2007-08-31 2009-03-04 (주) 미코티엔 Probe card
KR20090083530A (en) * 2008-01-30 2009-08-04 송광석 Electric conduction pin, method of manufacturing the electric conduction pin
KR101237140B1 (en) * 2012-02-08 2013-02-25 (주)씨에스이엔지 A faulty-tester of the led chip

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Publication number Priority date Publication date Assignee Title
JP2006514289A (en) * 2003-02-28 2006-04-27 フィコム コーポレイション Interconnect for printed circuit board, method for manufacturing the same, and interconnect assembly having the same
KR20090022882A (en) * 2007-08-31 2009-03-04 (주) 미코티엔 Probe card
KR20090083530A (en) * 2008-01-30 2009-08-04 송광석 Electric conduction pin, method of manufacturing the electric conduction pin
KR101237140B1 (en) * 2012-02-08 2013-02-25 (주)씨에스이엔지 A faulty-tester of the led chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220096959A (en) * 2020-12-31 2022-07-07 (주)마이크로컨텍솔루션 Separate apparatus and test socket
KR102511066B1 (en) 2020-12-31 2023-03-17 (주)마이크로컨텍솔루션 Separate apparatus and test socket
KR102602881B1 (en) * 2023-09-04 2023-11-15 박정선 Inspection Method of 7-segment Display Device

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