JP2010249718A - Photodetector used for testing led - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To test a plenty of LEDs in several times without complexing and increasing a price of an apparatus, thereby reducing a time and labor required for testing. <P>SOLUTION: A photodetector for LEDs includes a support having a top surface and a bottom surface respectively penetrating the support in a vertical direction, and provided with a plurality of light passages allowing light emitted by the LEDs to enter from the downside and advance to the upside; a wiring board disposed above the support and having a plurality of internal wiring; and a plurality of photoreceptors disposed below the wiring board to receive light advancing through the light passages and generate an electric signal, and electrically connected to the internal wiring. The plurality of light passages and the plurality of photoreceptors are disposed at least in one row in the same direction at the same pitches. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light detection device used in an apparatus for testing a plurality of LEDs (light emitting diodes).

  In general, an inspection, that is, a test of whether an LED generates correct light is performed using a test apparatus that turns on an LED and detects light from the LED with a light receiver to determine whether the light is good or bad. Various types of this type of test apparatus have been proposed (Patent Documents 1, 2, and 3).

  However, in any of the above prior arts, the light detection device for detecting the light from the LED is merely configured as an optical device that guides the light emitted from one LED to the light receiver by the optical system. You can only test one by one. For this reason, when testing a plurality of LEDs provided on an LED substrate such as an LED wafer or a wiring substrate, the test must be performed for each LED, and the test requires time and labor.

  In order to solve the above-mentioned problem, it is conceivable to use a plurality of the above-described optical devices to make a light detection device capable of testing a large number of LEDs provided on the LED substrate at one time or divided into a plurality of times. However, in such a light detection device, since the size of the optical system and the light receiver when viewed in plan is very large compared to that of the LED, the optical system has to have a complicated shape. Complicated and expensive.

  An object of the present invention is to make it possible to test a large number of LEDs in a plurality of times without increasing the complexity and cost of the apparatus, thereby reducing the time and labor required for the test.

  The light detection device used for testing the LED according to the present invention is a support having an upper surface and a lower surface, each of which penetrates the support in the vertical direction, and light emitted from the LED is downward. A support body having a plurality of light paths that allow light to enter from the side and travel upward, a wiring board disposed on the upper side of the support body, the wiring board having a plurality of internal wirings, and the light path A plurality of light receivers disposed on the lower side of the wiring board to receive the traveling light and generate an electrical signal, the plurality of light receivers being electrically connected to the internal wiring. The plurality of light paths and the plurality of light receivers are arranged in at least one row in the same direction at the same pitch.

  The wiring board may include a plurality of connection terminals that are each connected to the internal wiring and connect the internal wiring to an external electric circuit.

  The photoreceptor may include a CCD sensor having a plurality of CCD elements. In addition, the light detection device may further include a heat radiating plate disposed on the upper side of the wiring board.

  The wiring board may further include a heat conduction path that transmits heat of the photoreceptor to the heat radiating plate. The wiring board may further include a thermo module that absorbs heat from a location on the CCD sensor side and releases the absorbed heat to the heat radiating plate side. The wiring board may close the optical path.

  The photodetecting device may further include a plurality of contacts disposed on the lower surface of the support body, the plurality of contacts including a needle tip positioned at a lower end portion of the light path.

  The support is a main substrate having the upper surface, the main substrate having a first opening penetrating the main substrate in the vertical direction, the lower surface, and disposed below the main substrate. An auxiliary substrate, which includes a second opening penetrating through the auxiliary substrate in a vertical direction and facing the first opening, may be included. The auxiliary board includes a plurality of second internal wirings and a plurality of probe lands each connected to the second internal wiring, each having the contact attached thereto. be able to.

  The support is further a plurality of cylindrical light shielding members that project downward from the auxiliary substrate through the first and second openings, and extend in the vertical direction to form the light path. A plurality of light shielding members having

  Instead of the above, the support is a main substrate having the upper surface, the main substrate having a first through hole penetrating the main substrate in the vertical direction, the lower surface, and the main substrate. An auxiliary board disposed on the lower side, the auxiliary board penetrating the auxiliary board in the vertical direction, and having a plurality of second through holes opposed to the first through holes, and the first board A light shielding plate disposed below the auxiliary substrate, the light shielding plate having a plurality of third through holes penetrating the light shielding plate in the vertical direction and communicating with the second through holes. be able to. The auxiliary board includes a plurality of second internal wirings and a plurality of probe lands each connected to the second internal wiring, each having the contact attached thereto. The first, second and third through holes may form the light path jointly.

  The support may further include a lens plate disposed between the main substrate and the auxiliary substrate, the lens plate crossing the light path so as to allow light to pass therethrough.

  The light detection device may further include a temperature sensor disposed on the wiring board.

  For example, when a plurality of LEDs are arranged in a plurality of rows on the LED substrate, the light detection device and the LED substrate are arranged such that the arrangement direction of the light paths coincides with the arrangement direction of the LEDs and each light path is from one LED. Maintained to accept the light. Thereby, each light path and LED correspond.

  When the LEDs are turned on in the above state, light from the plurality of LEDs enters the light receiver via the corresponding light path and is detected by each light receiver. The detection signal of each photoreceptor is used to determine the quality of the LED.

  In plan view, when the arrangement pitch of each light path is larger than that of the LED, the detection with the LED substrate is performed so that light from every other LED is guided to the photoreceptor in one simultaneous detection by the detection device. The device is moved by the arrangement pitch of the LEDs in the arrangement direction of the light path or in the direction crossing the arrangement direction, thereby changing the LED to be tested.

  In the present invention, a wiring board having a plurality of light paths and a plurality of light receiving bodies, a supporting body for supporting the light detection device on a frame of the test apparatus, that is, a test apparatus, and an internal wiring electrically connected to the light receiving body, respectively. In addition, the light emitted from the LED is incident on the light path from the lower side, and the support body and the wiring board are arranged in the same direction at the same pitch and in the same direction, and are positioned above the light path. In order to be incident on the photoreceptor, they are superposed in a vertical relationship.

  As a result, a large number of LEDs can be tested in a plurality of times, and the same number of light paths and photoreceptors as the number of LEDs that can be tested at the same time are not required. Compared to technology, the device is simplified and inexpensive.

  As a result of the above, the present invention significantly reduces the time and effort required for testing, despite the simplicity and cost of the apparatus.

It is a top view which shows one Example of the testing apparatus using the photon detection apparatus which concerns on this invention. It is a front view of the photon detection apparatus shown in FIG. It is sectional drawing obtained along the 3-3 line in FIG. It is an expanded sectional view which shows the relationship between the lower end part of a light path, and LED. FIG. 4 is a cross-sectional view similar to FIG. 3, showing another embodiment of the photodetecting device according to the present invention. FIG. 6 is an enlarged cross-sectional view illustrating a relationship between a lower end portion of a light path and LEDs in the light detection device illustrated in FIG. 5. It is a perspective view which shows one Example of the LED board tested by the photon detection apparatus shown in FIG. It is a perspective view which shows a part of LED array arrange | positioned at the LED board shown in FIG. It is a top view which shows one Example of one LED in the LED array shown in FIG.

  [Explanation of terms]

  In the present invention, in FIG. 2, the up and down direction is referred to as the up and down direction or the Z direction, the left and right direction is referred to as the left and right direction or the X direction, and the direction perpendicular to the paper surface is referred to as the front and back direction or the Y direction. However, these directions differ depending on the posture in which the LED substrate is arranged in the light detection device.

  Therefore, in the above direction, the plane (XY plane) including the left and right direction (X direction) and the front and rear direction (Y direction) is inclined with respect to the horizontal plane and the horizontal plane according to the posture of the LED substrate at the time of the test by the photodetector. It is determined to be in any one of the inclined surface and the vertical plane perpendicular to the horizontal plane.

  [Example of Photodetection Device]

  Referring to FIGS. 1 to 4, the light detection device 10 is a substrate 16 in which a large number of LEDs (light emitting diodes) 12 are arranged in a matrix on an LED substrate 14 such as an LED wafer, and these LEDs 12 are connected to each other. Test multiple times for each row.

  The LED substrate 14 has a large number of LEDs 12 arranged in a matrix as shown in FIG. 8 in an LED region 18 indicated by hatching in FIG. FIG. 8 shows only 3 rows × 6 LED arrays in the XY direction, but actually more LEDs 12 are arranged on the LED substrate 14.

  As shown in FIGS. 4, 8, and 9, each LED 12 has the light emitting unit 20, the positive electrode 22, and the negative electrode 24 in a state where the electrodes 22 and 24 are positioned on both sides of the light emitting unit 20. , And is disposed on the LED substrate 14 on the lower surface of the base portion 26.

  Referring again to FIGS. 1 to 4, the light detection device 10 is used in an LED testing device together with an inspection stage 28 (see FIG. 2) that receives the LED substrate 16 and an electric circuit (not shown).

  The photodetecting device 10 includes a support body 30 having an upper surface and a lower surface, a wiring board 32 assembled with a plurality of screw members above the support body 30, and a heat dissipation assembled with a plurality of screw members above the wiring board 32. A plurality of pairs of contacts disposed on the lower surface of the support 30 so as to be in contact with the plate 34, the plurality of CCD sensors 36 attached to the lower surface of the wiring board 32, and the electrodes 22 and 24 of the LED 12 received by the inspection stage 28. Child 38.

  The inspection stage 28 three-dimensionally moves the chuck top 40 in three directions of XYZ, and chucks the LED substrate 16 releasably on the upper surface, and angularly around the θ axis extending in the Z direction. It is a well-known thing provided with the stage moving mechanism 42 to rotate it.

  The support 30 is a rectangular main substrate 44 and a rectangular auxiliary substrate 46 disposed below the main substrate 44, and the auxiliary substrate 46 has the thickness direction of the main substrate 44 and the auxiliary substrate 46 set in the vertical direction. And a plurality of cylindrical light shielding members 48 that pass through the main substrate 44 and the auxiliary substrate 46 in the vertical direction and project downward from the auxiliary substrate 46.

  The main board 44 is made of a metal material having rigidity such as stainless steel, and has an opening 50 (see FIG. 3) that penetrates the main board 44 in the vertical direction and has a rectangular cross section that is long in the horizontal direction. Is provided.

  On the other hand, the auxiliary board 46 is formed in the shape of a multilayer wiring board with an electrically insulating material such as glass-filled epoxy, ceramic, polyimide resin, etc., and the auxiliary board 46 has an opening 52 that extends vertically in the XY direction. A plurality of internal wirings 54 (see FIGS. 3 and 4) electrically connected to the CCD sensor 36, and probe lands 56 (see FIG. 4) electrically connected to the internal wirings 54 of the auxiliary substrate 46, Is provided.

  The opening 52 is aligned with the opening 50 of the main substrate 44 and has the same cross-sectional shape as the opening 50. In the illustrated example, each of the openings 50 and 52 is formed in the form of a plurality of through holes aligned in one direction. The auxiliary board 46 is smaller than the main board 44.

  Each light shielding member 48 is aligned in the longitudinal direction of the openings 50 and 52, extends through the openings 50 and 52 in the vertical direction, protrudes downward from the auxiliary substrate 46, opens up and down, and opens at the upper end. Is supported by the main board 44 and the auxiliary board 46 in a state of being in contact with the lower surface of the wiring board 32.

  The internal space of each light shielding member 48 acts as a light path 58 (see FIGS. 3 and 4) in which light 60 (see FIG. 4) from the light emitting unit 20 of the LED 12 enters from below and travels upward.

  In the illustrated example, the four CCD sensors 36 and the four light shielding members 48 are merely shown as being arranged in a line in the left-right direction, but in reality, more light shielding members 48 are provided. They are arranged in a line aligned in the left-right direction.

  The arrangement pitch of the CCD sensor 36 and the light shielding member 48 in the left-right direction is a value that allows the LEDs 12 formed in the region 18 shown in FIG. 7 to be tested once in each row or multiple times, that is, in the row direction. The value is an integer multiple of the arrangement pitch of the LEDs 12 in FIG.

  Each light shielding member 48 has its upper end and lower end directed upward and downward, respectively, and allows light 60 (see FIG. 4) emitted from the LED 12 to enter from below and pass upward. , Preventing external light from entering the light path 58.

  The light incident portion 48a (see FIG. 4) at the lower end portion of each light shielding member 48 has a truncated cone shape or a truncated pyramid shape in which the area of the cross section perpendicular to the axis of each light shielding member 48 decreases toward the lower end side. .

  A bellows-shaped light shielding portion 62 (see FIG. 4) is provided at the lower end of each light shielding member 48. When the corresponding contactor 38 is pressed against the corresponding electrode 22 or 24, the light shielding unit 62 is pressed against the upper surface of the other LED 12 to prevent external light from entering the light path 58.

  Instead of providing the main substrate 44 and the auxiliary substrate 46 with the openings 50 and 52 each having a plurality of through holes communicating with each other, a plurality of independent through holes may be provided.

  The wiring board 32 is mainly composed of a material having an electrically insulating material such as glass-filled epoxy resin, and a plurality of internal wirings 64 (see FIGS. 3 and 4) each connected to the CCD sensor 36, and the CCD. A columnar heat conductor 66 (see FIGS. 3 and 4) that contacts both the sensor 36 and the heat radiating plate 34 is provided.

  The CCD sensor 36 is attached to the lower surface of the wiring board 32 so as to receive the light 60 passing through the light path 58 and transmit an electric signal corresponding to the amount of received light to the internal wiring 64. The CCD sensor 36 functions as a light receiver in this embodiment, but a single light receiving element such as a CCD element, or other single or plural light receiving elements may be used as the light receiving body.

  Each heat conductor 66 is made of a material having a high thermal conductivity such as copper, and forms a heat conduction path for transferring the heat of the CCD sensor 36 to the heat radiating plate 34.

  The heat radiating plate 34 is a known one having a plurality of heat radiating fins 34 b protruding upward from the upper surface of the plate-like base 34 a, and the lower surface of the heat radiating plate 66 is in contact with the upper surface of the heat conductor 66. It is arrange | positioned on the upper surface of.

  Each contactor 38 has a needle tip to which the electrode 22 or 24 of the LED 12 is pressed, and the lower end portion, that is, the needle tip portion, penetrates the light shielding portion 62 from the outside to the light path 58 from the outside, and the lower end, that is, the needle. At the upper end, the probe land 56 is coupled with a conductive bonding material such as solder so that the tip is located at the lower end of the optical path 58.

  The wiring board 32 also includes a plurality of connectors 70 on the upper surface. Each connector 70 includes a plurality of terminals (not shown), and is attached to the wiring board 32 with a plurality of screws so that the terminals face upward.

  The terminals of each connector 70 are electrically connected to the internal wiring 64 of the wiring board 32 and electrically connected to the above-described electric circuit so as to send and receive electrical signals to the CCD sensor 36.

  The auxiliary board 46 also includes a plurality of connectors 72 on the upper surface. Each connector 72 is provided with a plurality of terminals (not shown), and these terminals are attached to the auxiliary board 46 with a plurality of screws so that the terminals are exposed upward through openings 74 provided in the wiring board 32. It has been.

  The terminals of each connector 72 are electrically connected to the internal wiring 54 of the auxiliary substrate 46 so that electrical signals are transmitted to and received from the CCD sensor 36 via the contact 38, and the above-described test electrical circuit is used. Electrically connected to the circuit.

  Instead of the connector 70 or 72, another terminal portion such as a tester land may be provided on the wiring board 32 or the auxiliary board 46.

  The support 30 (the main board 44 and the auxiliary board 46), the wiring board 32, and the heat radiating plate 34 are assembled by a plurality of screw members in the above state in which the thickness direction thereof is the vertical direction. The support 30 is received by a holder 76 of a test apparatus (not shown) using the light detection device 10 on the main substrate 44 with the main substrate 44 on the upper side and the auxiliary substrate 46 on the lower side. A plurality of screw members are attached to a holder 76 (see FIG. 2) supported by the frame.

  In the light detection device 10, a temperature sensor (not shown) may be provided on the wiring board 32, and when the wiring board 32 exceeds the allowable temperature, the heat radiating plate 34 is blown to cool the heat radiating plate 34.

  [Test method using photodetection device]

  The device under test 16 is disposed on the chuck top 40, and the chuck top 40 is moved in the XY directions by the stage moving mechanism 42 in order to test a plurality of LEDs 12 (the same number as the CCD sensor 36) in the first row. , Is rotated angularly about the θ axis (step 101).

  Thus, the arrangement direction of the LEDs 12 is the arrangement direction of the CCD sensor 36, and the electrodes 22 and 24 of the LED 12 located at the leftmost end (or rightmost end) of the first row can contact the needle tip of the contact 38. In the state and in a state where the electrodes 22 and 24 of the other LEDs 12 in the same row can contact the needle tips of the other contacts 38, the same number of LEDs 12 as the CCD sensor 36 are maintained in the light detection device 10. The As a result, each LED 12 is opposed to the lower end of the light path 58.

  Next, the chuck top 40 is raised by the stage moving mechanism 42, and the needle tips of the contact 38 corresponding to the respective light paths 58 are pressed against the electrodes 22 and 24 of the predetermined LED 12 (step 102).

  Next, a lighting command signal is supplied to a driver (not shown) for the LED 12 facing the lower end of each light path 58, and the LED 12 is turned on (step 103). As a result, the light from the LED 12 facing each light passage 58 enters the corresponding light path 58 from below and reaches the CCD sensor 36.

  Each CCD sensor 36 generates a signal corresponding to the hue and intensity of the incident light, and outputs these signals to the test electrical circuit described above. The electrical signal from the CCD sensor 36 is used in the electrical circuit to determine whether or not the corresponding LED 12 generates light having the correct hue and intensity based on the input electrical signal (correctness of the LED 12). .

  When the test of the first plurality of LEDs 12 is finished, the chuck top 40 is lowered by the stage moving mechanism 42 to test the next plurality of LEDs 12 (the same number as the CCD sensor 36) in the same row, and then the chuck of the LEDs 12 is checked. The top 40 is moved to the right (or left) by the arrangement pitch (step 104).

  As a result, the electrodes 22 and 24 of the next plurality of LEDs 12 can be brought into contact with the needle tips of the contacts 38, and the next plurality of LEDs 12 are maintained in the light detection device 10. As a result, each next LED 12 is opposed to the lower end of the light path 58.

  Thereafter, the above steps 102 to 104 are repeated until the test of all the LEDs 12 in the same row is completed (step 105).

  When the test of all the LEDs 12 in one row is completed, the chuck top 40 is moved down in the XY direction by the stage moving mechanism 42 after the chuck top 40 is lowered by the stage moving mechanism 42 in order to test the LEDs 12 in the next row. (Step 106).

  Thereby, the arrangement direction of the next plurality of LEDs 12 is the arrangement direction of the CCD sensor 36, and the electrodes 22 and 24 of the LED 12 located at the leftmost end (or rightmost end) of the second row are the needle tips of the contactor 38. And the electrodes 22 and 24 of the other plurality of LEDs 12 in the same row can contact the needle tips of the other plurality of contacts 38, and the same number of LEDs 12 as the CCD sensor 36 is provided as the light detection device. 10 is maintained. As a result, each LED 12 is opposed to the lower end of the light path 58.

  Thereafter, the above steps 102 to 106 are repeated until the test of all the LEDs 12 is completed. The determination result of whether the LED 12 is correct or not in the above-described electric circuit is used to determine whether the test object 16, particularly the LED 12, is good or bad.

  As described above, instead of moving the inspection object 16 in the XYZ directions with respect to the CCD sensor 36 by the inspection stage 28, the CCD sensor 36 may be moved in the XYZ directions with respect to the inspection object 16 by another moving mechanism. Good.

  As described above, when the upper end of each light shielding member 48 is in contact with the lower surface of the wiring board 32, it is reliably prevented that external light enters the light path. can do.

  However, the light from the LED 12 may separate the support 30 and the wiring board 32 in the vertical direction. In particular, when the upper end of each light shielding member 48 is in contact with the lower surface of the wiring board 32, the support 30 and the wiring board 32 may be separated in the vertical direction. In the latter case, inclusions such as spacers and columns may be arranged between the support 30 and the wiring board 32.

  [Other Embodiments of Photodetection Device]

  5 and 6, the substrate 16 arranged in a matrix on the LED substrate 14 such as the LED wafer shown in FIGS. 7 to 9 is used as the inspected object 16, and the LEDs 12 are arranged multiple times for each row. Test separately.

  In the light detection device 80, the support 82 and the wiring substrate 84 are different from the support 30 and the wiring substrate 32 of the light detection device 10.

  In the support 82, a main substrate 86, a lens support plate 88, an auxiliary substrate 90, and a light shielding plate 92 are arranged so as to overlap each other in the thickness direction (vertical direction).

  The main board 86 includes a plurality of through holes 94 that penetrate the main board 86 in the thickness direction. The through holes 94 are aligned in a line in the left-right direction, like the light blocking member 48 of the light detection device 10.

  The lens support plate 88 is disposed between the main substrate 86 and the auxiliary substrate 90, and penetrates the lens support plate 88 in the thickness direction and is aligned with the lower end portion of the through hole 94 described above. A through hole 96 is provided.

  The auxiliary substrate 90 is disposed below the main substrate 86 via a lens support plate 88. The auxiliary substrate 90 penetrates the auxiliary substrate 90 in the vertical direction, and the through hole 94 of the lens support plate 88 is inserted into the through hole 94 of the main substrate 86. A plurality of through holes 98 aligned via 96 and the above-described plurality of probe lands 56 each connected to the internal wiring 54 described above are provided.

  The light shielding plate 92 is disposed on the lower surface of the auxiliary substrate 90, and includes a plurality of through holes 100 that vertically penetrate the light shielding plate 92 and are aligned with the through holes 98 of the auxiliary substrate 90.

  Each pair of the through holes 94, 96, 98 and 100 aligned with each other acts as the above-described light path through which light 60 from the light emitting unit 20 of the LED 12 enters from below and travels upward.

  The lens support plate 88 is located between the main substrate 86 and the auxiliary substrate 90 so that the lens plate 102 closes the through holes 96 of the lens support plate 88 at their upper end portions, and at the upper end portion of the lens support plate 88. Has been placed. The lens plate 102 has a condensing lens portion 102 a at each location corresponding to the through hole 96. Each condensing lens portion 102 a allows light to pass through the corresponding through hole 96.

  The wiring board 84 absorbs heat from the temperature sensor 104 that detects the temperature of the wiring board 84 and the CCD sensor 36 in addition to the plurality of internal wirings 64 described above, and releases the absorbed heat to the heat radiating plate 34 side. And a thermo module 106.

  The output signal of the temperature sensor 104 is supplied to the electric circuit described above. Based on the output signal of the temperature sensor 104, the electric circuit is a driver (not shown) so as to output a drive signal for operating the thermo module 106 so that the wiring board 84 reaches a predetermined temperature. To supply. The thermo module 106 is driven by a drive signal supplied from a driver, absorbs heat on the CCD sensor 36 side, and releases the absorbed heat to the heat radiating plate 34 side.

  Each CCD sensor 36 is disposed on the lower surface of the wiring board 84 so as to be positioned in the through hole 94 of the main board 82. The lens support plate 100 may not be provided.

  The light detection device 80 operates in the same manner as the light detection device 10 to test the LED 12.

  In any of the above-described embodiments, the CCD sensor 36 and the light path are arranged in a matrix like the LEDs 12, and a large number of LEDs 12 provided on the LED substrate 14 are tested at a time or in a plurality of times. You may make it do.

  In the present invention, not only the test of the LED 12 having the above-described shape and disposed on the LED substrate 14 but also a plurality of LEDs disposed on another substrate such as a wiring substrate, and both electrodes 22 and 24 are included in the base portion. The present invention can also be applied to LEDs having other shapes, such as LEDs provided on the same or different side surfaces of 26 or the lower surface.

  In addition, the present invention provides an LED having one electrode on the upper surface of the base portion and the other electrode on the lower surface of the base portion, and both electrodes are disposed on the lower surface of the base portion, and an electric signal is sent to both electrodes on the substrate. It can also be applied to other LED tests such as LEDs supplied from the side. In the case of the former LED, the contact for the other electrode is unnecessary. Further, in the case of the latter LED, a contact for both electrodes and an auxiliary substrate to which the contact is attached are unnecessary.

  Further, in the present invention, instead of moving the object 16 to be inspected in the XYZ direction by the inspection stage 28 with respect to the CCD sensor 36 as described above, the CCD sensor 36 is moved in the XYZ direction by another moving mechanism. You may make it move.

  As described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit described in the claims.

10, 80 Photodetector 12 LED
DESCRIPTION OF SYMBOLS 14 LED board 16 Test object 18 LED area 20 Light emission part 22,24 Electrode 26 Base part 28 Inspection stage 30,82 Support body 32,84 Wiring board 34 Heat sink 36 CCD sensor 38 Contact 40 Chuck top 42 Stage moving mechanism 44 , 86 Main board 46, 90 Auxiliary board 48 Light shielding member 50, 52 Opening 54, 64 Internal wiring 56 Probe land 58 Light path 60 Light from LED 62 Light shielding part 66 Thermal conductor 70, 72 Connector 74 Opening 76 Holder 88 Lens support Plate 92 Light-shielding plate 94, 96, 98, 100 Through hole 102 Lens plate 102a Condensing lens part 104 Temperature sensor 106 Thermo module

JP 2006-234497 A JP 2006-30153 A Japanese Patent No. 31008646

Claims (13)

A plurality of light paths, each having a top surface and a bottom surface, each passing through the support body in the vertical direction and allowing light emitted from the LED to enter from below and travel upward. A support comprising:
A wiring board disposed above the support, wherein the wiring board has a plurality of internal wirings;
A plurality of light receivers disposed on the lower side of the wiring board to receive light traveling through the light path and generate an electrical signal, the light receivers being electrically connected to the internal wiring; Including
The plurality of light paths and the plurality of light receivers are arranged in at least one row in the same direction at the same pitch, and are used for LED testing.   2. The wiring board according to claim 1, further comprising a plurality of connection terminals each connected to the internal wiring and connecting the internal wiring to an external electric circuit.   The apparatus according to claim 1, wherein each photoreceptor includes a CCD sensor having a plurality of CCD elements.   Furthermore, the apparatus of any one of Claim 1 to 3 containing the heat sink arrange | positioned above the said wiring board.   The apparatus according to claim 4, wherein the wiring board further includes a heat conduction path that transfers heat of the photoreceptor to the heat radiating plate.   The apparatus according to claim 4, wherein the wiring board further includes a thermo module that absorbs heat from a location on the CCD sensor side and releases the absorbed heat to the heat radiating plate side.   The device according to claim 1, wherein the wiring board closes the optical path.   Furthermore, it is several contactors arrange | positioned at the said lower surface of the said support body, Comprising: The contactor of any one of Claim 1 to 7 provided with the needle tip located in the lower end part of the said optical path. The device according to item. The support is a main substrate having the upper surface, the main substrate having a first opening penetrating the main substrate in the vertical direction, the lower surface, and disposed below the main substrate. An auxiliary substrate comprising a second opening penetrating the auxiliary substrate in the vertical direction and facing the first opening,
The auxiliary board includes a plurality of second internal wirings, and a plurality of probe lands each connected to the second internal wiring, each having a probe land attached thereto. Item 9. The apparatus according to Item 8.   The support is further a plurality of cylindrical light shielding members that project downward from the auxiliary substrate through the first and second openings, and extend in the vertical direction to form the light path. The apparatus according to claim 9, comprising a plurality of light shielding members having the following. The support is a main substrate having the upper surface, the main substrate having a first through hole penetrating the main substrate in the vertical direction, the lower surface, and disposed below the main substrate. An auxiliary board that penetrates the auxiliary board in the vertical direction and includes a plurality of second through holes opposed to the first through holes, and is disposed below the auxiliary board. A light shielding plate comprising a plurality of third through holes penetrating the light shielding plate in the vertical direction and communicating with the second through holes,
The auxiliary board includes a plurality of second internal wirings and a plurality of probe lands each connected to the second internal wiring, each having the contact attached thereto.
9. The apparatus of claim 8, wherein the first, second and third through holes jointly form the light path.   12. The apparatus according to any one of claims 1 to 11, wherein the support further comprises a lens plate that traverses the light path to allow light to pass therethrough.   Furthermore, the apparatus of any one of Claim 1 to 12 containing the temperature sensor arrange | positioned at the said wiring board.

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