JPH03214750A - Semiconductor chip measurement apparatus - Google Patents

Abstract

PURPOSE:To facilitate application of a measurement apparatus to various types of chips by a method wherein a plurality of sleeves which are so arranged as to be oriented toward the center of a substrate are provided and probes which are inserted into the sleeves and whose tip lengths protruding from the sleeves can be adjusted are provided. CONSTITUTION:A light projecting part 6 is composed of a light emitting device 8 and a condensing lens 11. A plurality of the light projecting parts 6 are arranged into a matrix formation and buried in the surface of a probe card substrate 1a which facing chips near the center part of the facing surface of the substrate 1a. A plurality of sleeves 3 which are so arranged as to surround the light projecting parts 6 and to have their longitudinal directions oriented toward the center of the substrate 1a are provided and probes 2a which are inserted into the sleeves 3 and whose tip lengths protruding from the sleeves 3 can be arbitrarily adjusted and fixed are provided. In accordance with the type of the chip, screws 4 and loosened to make the tips of the probes 2a forward and have the tips come to the positions of the object pads to be measured of the chip. With this constitution, even if various types of chips are to be measured, the measurement apparatus can be applied freely by the position adjustment of the probes 2a and selection of the light projecting parts 6 to which voltages are applied.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field in Icheon] The present invention relates to a semiconductor device measuring device for measuring the characteristics of a chip, which is a large number of electronic circuit areas formed in rows and columns on a wafer.

[Conventional technology]

In general, this type of semiconductor device measurement equipment has a stage on which the wafer is placed, and a contact pad (bonding pad) or measurement pad that is the input/output terminal of the chip, which is an electronic circuit area formed on the wafer. a probe card having a plurality of probes connected to the probe card, a probing device that is connected to the probe card, inputs the probe to the chip, and measures the output signal, and a control device that controls the blowbin device and controls the movement of the stage. It is composed of.

FIGS. 11 and 12 are a plan view and a side view of a probe card for explaining an example of a conventional semiconductor device measuring apparatus. The probe cart for this semiconductor device measuring device is
As shown in the figure, probes 2, which are measuring elements, are arranged around the circumference of a flat substrate 1 and housed therein.

When measuring the characteristics of a chip using this probe card, first, the stage is moved to bring the chip to be measured on the wafer under the probe card. Next, the probe card is lowered, the probes 2 are brought into contact with the bonding pads or measurement pads of the corresponding chips, and the probing device transmits and receives power, ground, and input/output signals, and measures the characteristics of the chips. Was.

[Problem to be solved by the invention]

However, one of the above-mentioned conventional semiconductor device measuring devices
In the case of a lobe card, the tip of the probe is formed into a needle shape and is thin, so when making contact with the pad of tip 1, it may damage the pad. Particularly, when this pad is a bonding pad, there is a drawback that a thin metal wire cannot be connected in a subsequent process. In addition, as the number of pins increases, the tip of the probe may bend, resulting in poor signal transmission due to contact uncertainty, or when power and ground potentials are applied, due to simultaneous operation of the output buffers in the chip. The disadvantage is that the level of the ground potential fluctuates, making it easy to malfunction and making accurate measurements impossible.

In addition, chips usually have a mixture of measurement pads to be measured and bonding pads connected to thin metal wires depending on the type of chip, and each chip has a different size, shape, pad position, and number. . Therefore, there is a drawback that a dedicated probe card is required for each chip. On the other hand, on the chip side, the large number of pads to be measured has the disadvantage that the chip cannot be integrated at a high density.

The purpose of the present invention is to eliminate such drawbacks, to provide a semiconductor that can be reliably measured without damaging the electrode pads of the chip and without any special pads to be measured, and that can be applied to a variety of chips. An object of the present invention is to provide an element measuring device.

[Means to solve the problem]

1. A first semiconductor device measuring apparatus of the present invention includes a stage on which a wafer is placed, a probe card having a plurality of probes that contact pads that are input/output terminals of chips formed on the wafer, and the probes. A semiconductor device measuring device comprising a probing device connected to a card to input a signal from a previous generation probe to a chip and measure the output signal, and a control device to control the probing device and to control movement of the stage. On the surface of the card substrate facing the chip, a plurality of pairs of light emitting parts each consisting of a light emitting element and a condensing lens are embedded in rows and columns near the center of the card, surrounding the light emitting part and extending along the length. A probe is provided with a plurality of sleeves whose direction is arranged toward the center of the substrate, and a probe that is inserted into the sleeve and whose tip protrudes from the sleeve is adjusted arbitrarily and fixed. Ru.

2. In the second semiconductor device measuring device of the present invention, contacts are selectively protruded from the substrate surface into insertion holes arranged in rows and columns in a matrix on the surface facing the chip of the substrate of the probe card. It is characterized in that a probe that can be retracted or retracted and the light projecting section 6 are provided in a mixed manner.

3. A third semiconductor device measuring device of the present invention includes insertion holes arranged side by side on the surface facing the chip of the substrate of the probe card, and probes that are contacts protruding from the substrate at several places in the insertion holes, The other insertion holes are characterized in that a pair of a photoelectric conversion element having a light passage hole and a light emitting element that generates light passing through the passage hole is inserted.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

1 and 2 are a bottom view and a partially sectional side view of a probe card for explaining a semiconductor device measuring device according to a first embodiment of the present invention, and FIG. 3 is a schematic diagram of the light projecting section of FIG. 1. 4 is a partially sectional side view of a probe card showing another structural example of the sleeve of FIG. 1. As shown in FIGS. 1 and 2, the probe card of this semiconductor device measuring device is a substrate on which a light projecting section 6 is arranged, in which a plurality of pairs of light emitting elements and condensing lenses are embedded in rows and columns near the center. 1a, and a substrate 1a surrounding the light projecting section 6 and extending in the longitudinal direction.
It consists of a plurality of sleeves 3 arranged toward the center of the probe 2a, and a probe 2a that is inserted into the sleeve 3 and has its tip protruded by a screw 4.

Further, as shown in FIG. 3, the light emitting section 6 of this probe card has light emitting elements 8, such as light emitting diodes or laser light emitting diodes, inserted into insertion holes arranged in a matrix near the center of the substrate 1a. etc., and a condensing lens 11 for condensing light is attached to the front surface of the condensing lens. Of course, this light emitting element 8 is provided with an input terminal 7 and a ground terminal 12 for applying voltage, respectively.

This probe card uses the probe 2a for the pad that applies power to the chip and the pad that receives the signal output from the chip, and when inputting the signal to the chip,
This light projecting section 6 generates light and irradiates it onto a predetermined active area of the logic element device of the chip, thereby creating a pseudo state in which an electrical signal is input to the logic element. Then, a signal output as a result of the input signal is detected by the probe 2a.

Therefore, depending on the tip, the probe 2a is moved forward by loosening the screw 4, and adjusted so that the tip of the probe is positioned at the measurement pad of a predetermined tip.

Also, if it is unnecessary, move the probe 2a back or
You can also remove it. Further, only the light projecting section 6 that requires input is operated, and no voltage is applied to the others. This structure has the advantage that even if the type of chip is different, it can be freely selected by adjusting the position of the probe 2a and whether or not to apply a voltage to the light projecting section 6. Also,
There is an advantage that pads for signals to be input can also be omitted from the chip.

As another example of adjusting the movement of the tip of the probe, for example, as shown in FIG. 4, instead of the screw 4 shown in FIG. 2, a thread is cut on the outer diameter of the probe 2d, and the sleeve 3a is inserted. Form a screw in the hole and blow 9? By rotating the tab 2d, the insertion and removal of the tip can be adjusted. This structure of the probe card is easier to adjust than the previous embodiments. Also, although not shown in this drawing, a lock nut is required to prevent loosening after adjustment.

5 and 6 are a bottom view and a partially sectional side view of a probe card for explaining a semiconductor device measuring apparatus according to a second embodiment of the present invention. As shown in the figure, this probe card has probes 2b (black dots), which are mechanical contacts, and light emitting parts 6 arranged in rows and columns in a matrix on the bottom surface of a substrate 1b. The probe 2b, which is a mechanical contact, is inserted into the insertion hole of the board 1b via a spring 13. The probe 2b is retracted. Compressed air is introduced from the boat 9 into the cylinder hole 10 only where necessary, and the probe 2b is protruded from the substrate 1b.

Further, the light projecting section 6 has the same structure as shown in FIG. 103 in the above-described embodiment, and a light emitting element 8 and a condensing lens 11 are embedded in each insertion hole.

FIG. 7 is a perspective view showing the probe card and chip shown in FIGS. 5 and 6. FIG. When using this probe card to measure the characteristics of a chip 15 having a large number of measurement pads, the substrate 1b is first positioned over the chip 15 at a predetermined position on the wafer.

In this drawing, for convenience, chips are shown temporarily separated from the wafer.

Further, the probe 2b corresponding to the pad 17 to which power is applied to be measured is inserted into the cylinder hole 10 which is the corresponding insertion hole.
By supplying compressed air to the probes, the probes are made to protrude from the substrate 1b, and the compressed air for the probes corresponding to other unnecessary pads is cut off, and the probes are drawn into the substrate 1b by a spring 13. Further, a voltage is applied only to the light projecting section 6 corresponding to the irradiation area 16 of the chip device to be irradiated.

Next, the probe card is lowered, the light projector 6 irradiates the irradiation area 16 to be irradiated with light to give a pseudo signal to the device, the probe 2b supplies power to the pad 17, and the probe 2b Obtaining the output signal of the chip 15,
The characteristics of the chip 15 are measured to determine whether it is good or bad.

This example probe card is compatible with chips with more measurement pads. In addition, the probe, which is a mechanical contact, and the light emitter, which inputs the input signal as light, can be selectively adjusted by external control without adjusting the probe card itself. This has the advantage that the positional accuracy of the parts can be maintained more easily. That is,
Even if the type of chip is changed, the one-lobe card can be maintained by controlling which position of the insertion hole, cylinder hole 10, is supplied with compressed air, or which insertion hole's light-emitting element is supplied with voltage. This is because the measurement point can be changed.

8 and 9 are a bottom view and a partial cross-sectional side view of a probe card for explaining a semiconductor device measuring apparatus according to a third embodiment of the present invention, and FIGS. 10(a) and (b) are an 8th 10A and 10B are a cross-sectional view of the probe section and a schematic cross-sectional view of the optical probe section shown in FIG.

This probe card is used especially when measuring integrated circuit chips made of compound semiconductors such as GaAs.

In addition, as shown in Figures 8 and 9, this one-lobe card has insertion holes lined up around a rectangle on a circular substrate IC, and contacts are made in several places in each corner of the insertion hole. A probe 2C, which is a child, is provided, and an optical probe 14, which converts light and electricity and measures the presence or absence of a signal, is inserted into the other insertion holes.

Here, the structure of the probe 2C is as shown in FIG.
is pressed with constant pressure.

Further, the nut 21 is used to adjust the pressing force of the spring 13a.

Further, as shown in FIG. 10(b), the structure of the optical probe 14 is such that a photoelectric conversion element 14a having a passage hole 23 is attached to the insertion hole as a window, and light is emitted through the passage hole 2-1-3-3. This is because the element 22 was inserted.

Here, for example, this photoelectric conversion element 14a is, for example,
Highly efficient silicon solar cells with broadband <400 nm to 1200 nm) spectral sensitivity are used.

Further, the light emitting element 22 uses a normal light emitting diode, a condensing lens, or a laser diode.

Furthermore, when the optical probe 14 receives an optical signal, the switch 18 is set to the photoelectric conversion element 14a side, and the light generated from the chip side is received, and if necessary, the weak photovoltaic current generated from this light is amplified. It is recommended to provide an amplifier. When using this optical probe as a light projecting section that provides a signal, the switch 18 is set to the light emitting element 22 side, the light emitting element 22 is operated to generate light, this light is passed through the passage hole 23, and the light emitting element 22 is operated to generate light. irradiate the required area.

When measuring a chip with this probe card, first, the one-lobe card is positioned over the chip of the wafer to be measured, lowered, and power is supplied to the pad of the chip by the probe 2C. At this time, the predetermined optical probe 14 irradiates light onto the active region of the device to be inputted to the chip, and directs the light generated from the predetermined region of the chip to any of the remaining optical probes 14. The photovoltaic current is amplified 5, and a predetermined signal level is determined and measured.

In the case of this embodiment, an optical probe can be used instead of the probe section that receives signals, so there is an advantage that there is more freedom in combinations. Further, if the optical probes are arranged in rows and columns in a matrix as in the second embodiment, there is an advantage that it can be applied to measurements of more types of chips. In addition, since the probe 2c is recessed into the substrate IC,
Since the probe card can be brought closer to the wafer, there is an advantage that optical loss due to distance is reduced.

Although the above three independent embodiments have been described, the present invention can produce a probe card by combining any mechanical contact probe and any optical probe.
Applicable to measurements of all types of chips.

〔Effect of the invention〕

As explained above, the present invention includes a probe that is a mechanical contact that contacts a power supply pad of a chip and supplies power to the chip, and a light emitting element that irradiates a device on the chip with light for inputting only a signal. Signal input is possible by providing a mixture of optical probes and optical probes, which are contacts or light-receiving elements, which are probes that receive electrical or optical signals output from the chip in response to these inputs, on the board of the probe card. By using these mechanical contact probes and optical probes, for example, placing an optical probe that irradiates the irradiation location of the device corresponding to this pad instead of a pad that is prone to scratches, You can freely change the arrangement in various ways.

Therefore, without damaging the pads of the chip, and
The present invention has the advantage that a semiconductor device measuring device can be obtained that can perform measurements reliably even without a special pad to be measured, and has a versatile probe card that can be applied to various chips.

[Brief explanation of drawings]

1 and 2 are a bottom view and a partially sectional side view of a probe card for explaining a semiconductor device measuring device according to a first embodiment of the present invention, and FIG. 3 is a schematic diagram of the light projecting section of FIG. 1. 4 is a partially sectional side view of a probe card showing another structural example of the sleeve of FIG. 1, and FIGS. 5 and 6 illustrate a semiconductor device measuring device according to a second embodiment of the present invention. 7 is a perspective view showing the probe card and chip shown in FIGS. 5 and 6, and FIGS. 8 and 9 are views showing the third embodiment of the present invention. FIGS. 10(a) and 10(b) are a bottom view and a partially sectional side view of a probe card for explaining the semiconductor device measuring apparatus of the embodiment, and FIGS. A schematic cross-sectional view of an optical probe, and FIGS. 11 and 12 are a plan view and a side view of a probe card for explaining an example of a conventional semiconductor device measuring apparatus. 1 7 1, 1a, 1b, 1 c-substrate, 2, 2a, 2b, 2c
, 2 d ... Probe, 3, 3a = Sleeve, 4
...Screw, 5...Lid, 6...Light emitter, 7...Input terminal, 8...Light emitting element, 9...Port, 10...
- Cylinder hole, 11... Condensing lens, 12... Earth terminal, 13, 13a... Spring, 14... Optical probe, 14a... Photoelectric conversion element, 15... Chip, 16... ...Irradiation area, 17...Pad, 18...
・Switch, 1...missing number, 20...color 21
... Nut, 22 ... Light emitting element, 23 ... Passing hole.

Claims (1)

[Claims] 1. A stage on which a wafer is placed, and a plurality of probes that come into contact with pads that are input/output terminals of semiconductor elements (hereinafter referred to as chips) that are electronic circuit areas formed on the wafer. Semiconductor device measurement comprising a probe card, a probing device connected to the probe card to input the signal from the probe to the chip and measure the output signal, and a control device to control the probing device and control the movement of the stage. In the apparatus, a plurality of pairs of light emitting sections each including a light emitting element and a condensing lens are embedded in a surface of the substrate of the probe card facing the chip near the center of the probe card, and the light emitting sections each include a light emitting element and a condensing lens. a plurality of sleeves surrounding the board and having their longitudinal directions directed toward the center of the substrate, the sleeve being inserted into the sleeve and the amount of protrusion of the tip of the sleeve being arbitrarily adjusted from the sleeve;
A semiconductor device measuring device comprising: a fixed probe; 2. A probe in which contacts are selectively protruded from or retracted from the substrate surface into insertion holes arranged in rows and columns in a matrix on the surface facing the chip of the substrate of the probe card; 2. The semiconductor device measuring device according to claim 1, further comprising a light projecting section. 3. Insertion holes are arranged side by side on the surface facing the chip of the substrate of the probe card, and probes, which are contacts that protrude from the substrate, are provided in several places in these insertion holes, and light passes through the other insertion holes. 2. The semiconductor device measuring apparatus according to claim 1, further comprising a pair of a photoelectric conversion element having a hole and a light emitting element that generates light passing through the passage hole.