JP2018081948A - Inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection apparatus capable of substantially uniformly and accurately irradiating a plurality of light receiving elements of a solid state imaging device to be inspected with light generated in a light source with a simple configuration.SOLUTION: An inspection apparatus (10) used for inspecting a solid state imaging device formed on a semiconductor wafer (100), includes: a light source 30 including an LED; a probe card 40 including a probe card substrate provided with a slit; and a plurality of optical fibers 50 installed between the light source and the probe card substrate for transmitting light from the light source and irradiating the solid-state imaging device through the slits.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an inspection device used for inspecting a solid-state imaging device such as an image sensor IC.

  For example, in a wafer inspection of an image sensor IC, an inspection apparatus in which a light source unit including a halogen lamp is installed in a test head is used. The light generated in the light source unit passes through a mechanical shutter, a lens, an attenuation filter, a color filter, and the like arranged on the optical path, and then passes through the opening of the probe card to be inspected. Irradiate.

  However, in such an inspection apparatus, a mechanism for driving a mechanical shutter or the like is also required, and the inspection apparatus becomes larger and dedicated, which makes maintenance difficult and increases the cost. In particular, when inspecting a plurality of inspection objects at the same time, the light source unit is increased, and the test head and the probe card are also increased, which further increases the size of the inspection apparatus.

  Further, since the operation speed of the mechanical shutter is slow, a high-speed response test of the image sensor IC cannot be performed. Furthermore, since the plurality of probe needles attached to the probe card are arranged on the light path, the position of the probe needle is adjusted so as not to affect the plurality of light receiving elements of the image sensor IC such as shadows and reflections. There is a need.

  As a related technique, Patent Document 1 discloses a light source device for color image sensor inspection. In this light source device, for example, red, green, and blue light are used instead of halogen lamps that are prone to temperature change and are easily affected by temperature, and the light spectrum that determines white balance is affected by changes in drive current. Three types of LEDs each generated are used.

  The light irradiation mechanism 5 shown in FIG. 1 and FIG. 3 of Patent Document 1 is connected to a rod lens 3 that mixes light emitted from a plurality of LEDs 1 to generate inspection light, and an output end of the rod lens 3. A plurality of optical fibers 4, a ring-shaped fiber holder 51 that holds the output end of the optical fiber 4, and a position facing the output end of the optical fiber 4, and reflects light emitted from these output ends. A ring-shaped reflector 52 having a reflecting surface 52a, and a diffuser having a hemispherical concave light diffusing surface 53a that receives the light reflected by the reflecting surface 52a, further reflects and diffuses it, and irradiates the imaging element W 53.

JP 2006-17689 A (paragraph 0037, FIGS. 1 and 3)

  According to Patent Document 1, it is possible to reduce the size by using an LED. However, as shown in FIG. 3 of Patent Document 1, the light emitted from the output end of the optical fiber 4 is reflected by the reflection surface 52a of the reflector 52 and then reflected by the light diffusion surface 53a of the diffuser 53. Since the image sensor is irradiated after being reflected and diffused, it is difficult to uniformly and accurately irradiate the plurality of pixels of the image sensor.

  Therefore, in view of the above points, the first object of the present invention is to irradiate a plurality of light receiving elements of a solid-state imaging device to be inspected substantially uniformly and accurately with a simple configuration. It is to provide an inspection apparatus capable of performing the above. The second object of the present invention is to make it easy to inspect a plurality of inspection objects simultaneously in such an inspection apparatus. Furthermore, a third object of the present invention is to prevent the probe needle from affecting the plurality of light receiving elements of the solid-state imaging device, such as shadows and reflections, in such an inspection apparatus.

  In order to solve at least a part of the above problems, an inspection apparatus according to one aspect of the present invention is an inspection apparatus used for inspecting a solid-state imaging device, and includes a light source including an LED and a slit. A probe card including a probe card substrate, and a plurality of optical fibers that are installed between the light source and the probe card substrate, transmit light from the light source, and irradiate the solid-state imaging device through the slit.

  According to one aspect of the present invention, a plurality of optical fibers installed between a light source including an LED and a probe card substrate transmit light from the light source and irradiate the solid-state imaging device through a slit of the probe card substrate. To do. Therefore, with a simple configuration, the light generated in the light source can be irradiated substantially uniformly to the plurality of light receiving elements of the solid-state imaging device to be inspected. Further, by keeping the probe card substrate and the solid-state imaging device in a predetermined positional relationship, it is possible to accurately irradiate the light receiving elements of the solid-state imaging device with the light generated in the light source.

  Here, the probe card may include a diaphragm portion that narrows a range in which light is irradiated from the end portions of the plurality of optical fibers through the slits. Thereby, it is possible to mainly extract straight light from the light emitted from the ends of the plurality of optical fibers and irradiate the light receiving elements of the solid-state imaging device in a concentrated manner. As a result, since a condensing lens and a diffusing lens are not required, the configuration of the inspection apparatus is simplified, and a plurality of inspection objects can be easily inspected simultaneously.

  In this case, end portions of the plurality of optical fibers are inserted into the first portion of the slit, and the aperture portion of the slit having a narrower width on the light exit side than the width of the first portion of the slit. You may make it comprise in 2 parts. Accordingly, it is possible to configure a diaphragm unit that narrows down the range irradiated with light only by changing the width of the slit of the probe card substrate at least in one place.

  Alternatively, the end portions of the plurality of optical fibers are inserted into the first portion of the slit, and the aperture portion of the slit having a width that gradually narrows from the first portion of the slit toward the light exit side. You may make it comprise in 2 parts. As a result, it is possible to configure a diaphragm unit that narrows the range irradiated with light by only gradually changing the width of the slit of the probe card substrate.

  Alternatively, the end portions of the plurality of optical fibers are inserted into the slit, and the probe card further includes an aperture plate disposed on the surface of the probe card substrate on the light exit side, and the aperture plate is larger than the width of the slit. An aperture having a narrow width may be provided to constitute the diaphragm portion. Accordingly, it is possible to configure a diaphragm unit that narrows the range irradiated with light without changing the width of the slit of the probe card substrate.

  In the above, the probe card may further include a plurality of probe needles that are supported by the probe card substrate and come into contact with the solid-state imaging device. Thereby, alignment of the light irradiated to the solid-state imaging device and alignment of a plurality of probe needles that exchange electric signals with the solid-state imaging device can be performed simultaneously.

  Alternatively, end portions of a plurality of optical fibers are inserted into the slits, and the probe card further includes a probe unit substrate disposed on the light exit side surface of the probe card substrate, and the probe unit substrate is a solid-state imaging device A plurality of probe needles that are in contact with each other may be supported, and an aperture having a width narrower than the width of the slit may be provided to constitute the diaphragm portion. Accordingly, it is possible to configure a diaphragm unit that narrows the range irradiated with light without changing the width of the slit of the probe card substrate.

  In that case, a plurality of probe needles may extend in a direction substantially parallel to the thickness direction of the probe unit substrate. Accordingly, a plurality of probe needles are arranged so as not to block the path of light emitted through the opening of the probe unit substrate, and the probe needles do not affect the plurality of light receiving elements of the solid-state imaging device, such as shadows and reflections. Can be.

  In the above, the ends of the plurality of optical fibers may be arranged in a two-dimensional array. Thereby, the light emitted from the ends of the plurality of optical fibers arranged in a two-dimensional array can be simultaneously irradiated onto the plurality of light receiving elements of the plurality of rows of solid-state imaging devices.

Schematic which shows the inspection system containing the inspection apparatus which concerns on one Embodiment of this invention. The partial cross section perspective view which shows a part of inspection apparatus which concerns on 1st Embodiment with a test object. The perspective view which shows the back surface of the probe card of the inspection apparatus which concerns on 1st Embodiment. The partial cross section perspective view which shows a part of test | inspection apparatus which concerns on 2nd Embodiment. The partial cross section perspective view which shows a part of test | inspection apparatus concerning 3rd Embodiment. The partial cross section perspective view which shows a part of test | inspection apparatus which concerns on 4th Embodiment. The partial cross section perspective view which shows a part of test | inspection apparatus which concerns on 5th Embodiment with a test object. The partial cross section perspective view which shows a part of test | inspection apparatus which concerns on 5th Embodiment. Schematic which shows the 1st modification of the inspection system shown in FIG. Schematic which shows the 2nd modification of the test | inspection system shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same referential mark is attached | subjected to the same component and the overlapping description is abbreviate | omitted.
<Inspection system>
FIG. 1 is a schematic diagram illustrating a configuration example of an inspection system including an inspection apparatus according to an embodiment of the present invention. This inspection system inspects photoelectric conversion characteristics and the like by irradiating light to a solid-state imaging device to be inspected. In the present embodiment, a case where a semiconductor chip of a plurality of image sensor ICs included in a semiconductor wafer 100 is inspected as a solid-state imaging device will be described.

  As shown in FIG. 1, the inspection system includes a tester 10, a test head 20, a light source 30, a probe card 40, a plurality of optical fibers 50, and a wafer transfer prober 60. Here, at least the light source 30 to the plurality of optical fibers 50 constitute an inspection device used for inspecting the image sensor IC.

  The tester 10 is electrically connected to the test head 20 and the light source 30, and controls the test head 20 and the light source 30 so as to measure the photoelectric conversion characteristics and the like of the image sensor IC. Further, the tester 10 determines pass or fail based on the measurement result output from the test head 20 as to whether or not an output voltage corresponding to the illuminance of the light irradiated to the image sensor IC is obtained, etc. The measurement result and the determination result are stored in an internal storage unit.

  The test head 20 includes a plurality of test units that respectively measure the characteristics of the plurality of image sensor ICs. Each test unit includes, for example, a test controller, pin electronics, a stabilized power supply circuit, a D / A converter, an A / D converter, and the like.

  The test controller controls each part of the test unit to measure the characteristics of the image sensor IC under the control of the tester 10. The pin electronics includes a plurality of connection pins (power supply terminals and signal terminals) for exchanging electrical signals with the image sensor IC in addition to the driver, the comparator, and the programmable measurement unit. The stabilized power supply circuit stabilizes the power supply voltage supplied from the power supply unit and supplies it to the image sensor IC through the power supply terminal.

  Further, a performance board electrically connected to the test head 20 and a ring-shaped connector called a frog ring electrically connected to the performance board are attached to the test head 20. The probe card 40 is attached to the frog ring and is electrically connected to the test head 20.

  The light source 30 includes an LED (light emitting diode). The tester 10 adjusts the illuminance of the light irradiated to the image sensor IC by controlling the current supplied to the LED of the light source 30. For example, the tester 10 controls on / off of light emission, light illuminance, and light emission timing at high speed with an accuracy of n seconds or μ seconds.

  As described above, the light source 30 is controlled in synchronization with the measurement timing by utilizing the feature of the LED light source that is superior in response speed than the conventional light source using a halogen lamp or a mechanical shutter. The high-speed response test of the image sensor IC can be performed.

  In the example shown in FIG. 1, since the space between the test head 20 and the probe card 40 is narrow, the light source 30 is installed outside the space between the test head 20 and the probe card 40. The plurality of optical fibers 50 are installed between the light source 30 and the probe card 40 and transmit light from the light source 30 to the probe card 40. By transmitting the light emitted from the LED light source through the plurality of optical fibers 50, the inspection apparatus can be reduced in size and cost, and the degree of freedom in the installation location of the light source 30 can be increased.

  The wafer transfer prober 60 is a positioning handling device for electrically and mechanically docking the semiconductor wafer 100 with the test head 20 via the probe card 40. The wafer transfer prober 60 transfers the semiconductor wafer 100 sucked and fixed to the wafer chuck, and positions the semiconductor wafer 100 so that a plurality of terminals (pads) provided on the semiconductor chip come into contact with the tips of the plurality of probe needles, respectively. Then, the semiconductor wafer 100 is pressed against the probe needle. By sequentially repeating this operation while moving the position of the semiconductor wafer 100 stepwise, a plurality of semiconductor chips contained in the semiconductor wafer 100 are inspected.

<First Embodiment>
FIG. 2 is a partial cross-sectional perspective view showing a part of the inspection apparatus according to the first embodiment of the present invention together with an inspection object. In the example illustrated in FIG. 2, the image sensor IC 110 is a line sensor in which a plurality of light receiving elements having a photoelectric conversion function are arranged in one row and a subject is scanned in a direction orthogonal to the row of light receiving elements. The image sensor IC 110 includes a pixel portion 111, a circuit portion 112, and a plurality of terminals 113.

  The pixel unit 111 includes a plurality of light receiving elements that are arranged in one column and respectively constitute a plurality of pixels. Each light receiving element is configured by, for example, a photodiode, and generates and accumulates signal charges according to the illuminance of the irradiated light. The circuit unit 112 includes, for example, a read circuit and a control circuit, reads signal charges from a plurality of light receiving elements, converts the read signal charges into signal voltages, and serially outputs them. The plurality of terminals 113 include a power supply terminal, an output terminal, a control terminal, and the like.

  On the other hand, the probe card 40 includes a probe card substrate 41 provided with slits 41a and a plurality of probe needles 42 supported by the probe card substrate 41 and brought into contact with the image sensor IC 110. Further, FIG. 2 shows end portions 50a of the plurality of optical fibers 50 shown in FIG. The end portions 50a of the plurality of optical fibers are inserted into the slit 41a from the main surface (upper surface in the drawing) side of the probe card substrate 41.

  The image sensor IC 110 is positioned so that the plurality of light receiving elements face the slits 41 a of the probe card substrate 41 and the plurality of terminals 113 are in contact with the plurality of probe needles 42, respectively. The plurality of optical fibers 50 shown in FIG. 1 are installed between the light source 30 and the probe card substrate 41, transmit light from the light source 30, and irradiate the plurality of light receiving elements of the image sensor IC 110 through the slit 41a.

  As described above, the probe card 40 includes the probe card substrate 41 provided with the slits 41a and the plurality of probe needles 42, thereby aligning the light LT applied to the image sensor IC 110, and the image sensor IC 110. The positioning of the plurality of probe needles 42 that exchange electric signals between them can be performed simultaneously.

  For example, when the length L of the pixel portion 111 of the image sensor IC 110 is 2 cm and the length of each light receiving element is 0.02 mm, the end portion 50a of the optical fiber having a diameter of 1 mm is placed in the slit 41a. 20 or more are arranged in one row. Accordingly, the end portions 50a of the 20 or more optical fibers cover a plurality of light receiving elements of at least one image sensor IC 110, and the light LT can be irradiated to the light receiving elements substantially uniformly.

  In the example shown in FIG. 2, the end portions 50a of the optical fibers are arranged in a plurality of rows, so that the end portions 50a of the plurality of optical fibers are arranged in a two-dimensional array. Thereby, the light emitted from the end portions 50a of the plurality of optical fibers arranged in a two-dimensional array can be simultaneously irradiated to the plurality of light receiving elements of the plurality of rows of image sensor ICs 110.

  In that case, it is desirable that the arrangement pitch of the end portions 50a of the optical fibers in the direction orthogonal to the longitudinal direction of the slit 41a is substantially equal to an integral multiple of the arrangement pitch of the image sensor ICs 110 in the direction orthogonal to the row of the light receiving elements. Thereby, when simultaneously inspecting the plurality of rows of image sensor ICs 110, the illuminance of the light LT applied to the plurality of light receiving elements of the plurality of rows of image sensor ICs 110 can be made close to uniform.

  An image in which a set of probe needles 42 arranged corresponding to each slit 41a on the probe card substrate 41 is irradiated with light LT from the end portion 50a of a set of optical fibers inserted into the slit 41a through the slit 41a. The sensor IC 110 is in contact with a plurality of terminals 113.

  FIG. 3 is a perspective view showing the back surface of the probe card of the inspection apparatus according to the first embodiment of the present invention. As shown in FIG. 3, the plurality of probe needles 42 are fixed to a region outside the region 41 b where the plurality of slits 41 a are provided on the back surface (lower surface in the drawing) of the probe card substrate 41. It is electrically connected to the test head 20 shown in FIG.

  Each probe needle 42 passes between two adjacent slits 41a or outside the terminal slit 41a in plan view so as not to block the path of light emitted through the plurality of slits 41a. For this purpose, the fixed portion of the probe needle 42 fixed to the probe card substrate 41 is arranged in a direction substantially parallel to the longitudinal direction of the slit 41a. In the present application, the “plan view” means that each part is seen through from a direction perpendicular to the back surface of the probe card substrate 41.

  Referring again to FIG. 1, the power supply voltage and the control signal are supplied from the test head 20 to the image sensor IC 110 via the probe card 40, and the output voltage of the image sensor IC 110 is output to the test head 20 via the probe card 40. Is done. The test head 20 measures the photoelectric conversion characteristics of the image sensor IC 110 based on the output voltage of the image sensor IC 110 and outputs data representing the measurement result to the tester 10. The tester 10 determines pass or fail based on the measurement result supplied from the test head 20.

  As described above, by adopting the plurality of optical fibers 50 as the transmission path of the light generated in the light source 30, the optical path is released from the restriction of being arranged on a straight line. Since the length of the optical fiber 50 may be arbitrary, the optical fiber 50 may be extended to the outside of the space between the test head 20 and the probe card 40, and the light source 30 may be installed on the probe card 40. May be installed. Therefore, the shape of the test head 20 does not matter.

  Further, the uniformity of illuminance in the plurality of light receiving elements of the image sensor IC is improved by securing the total cross-sectional area of the optical fiber bundle that irradiates the image sensor IC with light. Layout is possible without being affected by As a result, a dedicated inspection apparatus is not required, and a compact inspection apparatus capable of simultaneously inspecting a plurality of inspection objects can be realized.

  The size and number of the light sources 30 are appropriately determined according to the area of the pixel portion 111 (FIG. 2) of the image sensor IC to be inspected and the total cross-sectional area of the optical fiber bundle corresponding to the number of image sensor ICs to be inspected simultaneously. May be. Further, the light emitted from the light source 30 may be supplied to the plurality of optical fibers 50 through an optical filter.

  For example, an ND (attenuation) filter is used to reduce the illuminance and reduce the resolution of the set illuminance. Further, since the light of the LED has a wavelength different from that of the light of the conventional halogen lamp, a band pass filter is used when correcting the spectral distribution of the light. Furthermore, a band pass filter is also used when only light of a specific wavelength such as red, green, and blue is desired to be transmitted.

  According to the present embodiment, the plurality of optical fibers 50 installed between the light source 30 including the LED and the probe card substrate 41 transmit light from the light source 30 and pass through the slit 41a of the probe card substrate 41, and the image sensor. The IC 110 is irradiated. Therefore, with a simple configuration, the light generated in the light source 30 can be irradiated substantially uniformly onto the plurality of light receiving elements of the image sensor IC 110 to be inspected. Further, by maintaining the probe card substrate 41 and the image sensor IC 110 in a predetermined positional relationship, the light generated by the light source 30 can be accurately irradiated to the plurality of light receiving elements of the image sensor IC 110.

<Second Embodiment>
FIG. 4 is a partial cross-sectional perspective view showing a part of the inspection apparatus according to the second embodiment of the present invention. Since the light emitted from the end portions 50a of the plurality of optical fibers is diffused light, the image sensor IC to be inspected and the probe needle other than the image sensor IC directly below the slit 41a in which the end portions 50a of the optical fibers are inserted. Irradiation may cause adverse effects.

  Therefore, in the second embodiment, the probe card 40 (FIG. 1) includes a diaphragm portion that narrows the range in which the light LT is irradiated from the end portions 50a of the plurality of optical fibers through the slit 41a. For example, the diaphragm unit can control the width, length, and position of the range irradiated with the light LT in the image sensor IC to be inspected.

  Accordingly, it is possible to mainly extract straight light from the light emitted from the end portions 50a of the plurality of optical fibers and irradiate the light receiving elements of the image sensor IC intensively. As a result, since a condensing lens and a diffusing lens are not required, the configuration of the inspection apparatus is simplified, and a plurality of inspection objects can be easily inspected simultaneously. Regarding other points, the second embodiment may be the same as the first embodiment.

  For example, as shown in FIG. 4, the end portions 50 a of the plurality of optical fibers are inserted into the first portions 411 a of the slits 41 a of the probe card substrate 41. The stop portion is configured by a second portion 412a of the slit 41a having a narrower width on the light exit side than the width of the first portion 411a of the slit 41a. That is, a step is provided between the first portion 411a and the second portion 412a of the slit 41a. As a result, it is possible to configure a diaphragm portion that narrows the range irradiated with the light LT only by changing the width of the slit 41a of the probe card substrate 41 at least in one place.

<Third Embodiment>
FIG. 5 is a partial cross-sectional perspective view showing a part of an inspection apparatus according to the third embodiment of the present invention. In the third embodiment, the shape of the throttle portion is different from that in the second embodiment. In other respects, the third embodiment may be the same as the second embodiment.

  As shown in FIG. 5, the end portions 50a of the plurality of optical fibers are inserted into the first portion 411a of the slit 41a. The diaphragm portion is configured by a second portion 412a of the slit 41a having a width that gradually decreases from the first portion 411a of the slit 41a toward the light exit side. That is, the second portion 412a of the slit 41a has a tapered shape. Thereby, it is possible to configure a diaphragm portion that narrows the range irradiated with the light LT simply by gradually changing the width of the slit 41a of the probe card substrate 41.

<Fourth Embodiment>
FIG. 6 is a partial cross-sectional perspective view showing a part of an inspection apparatus according to the fourth embodiment of the present invention. In the fourth embodiment, the configuration of the aperture portion is different from that in the second embodiment. Regarding other points, the fourth embodiment may be the same as the second embodiment.

  As shown in FIG. 6, end portions 50 a of the plurality of optical fibers are inserted into the slits 41 a of the probe card substrate 41. The probe card 40 (FIG. 1) further includes an opening plate 43 disposed on the light exit side surface (back surface) of the probe card substrate 41. The aperture plate 43 is provided with an aperture 43a having a width narrower than that of the slit 41a, and constitutes a diaphragm portion that narrows the range in which the light LT is irradiated from the end portions 50a of the plurality of optical fibers through the slit 41a. Thereby, even if it does not change the width | variety of the slit 41a of the probe card board | substrate 41, the aperture | diaphragm | squeeze part which restrict | squeezes the range irradiated with the light LT can be comprised.

  Since the light emitted from the end portion 50a of the optical fiber is diffused light, it is desirable not to bring the end portion 50a of the optical fiber and the opening plate 43 close to each other when the opening plate 43 is thin. The plurality of probe needles may be supported by the probe card substrate 41 or may be supported by the opening plate 43.

<Fifth Embodiment>
FIG. 7 is a partial cross-sectional perspective view showing a part of an inspection apparatus according to the fifth embodiment of the present invention together with an inspection object. In the fifth embodiment, the probe card 40 includes a probe card substrate 41, a probe unit substrate 44, and a plurality of probe needles 45. In other respects, the fifth embodiment may be the same as the first embodiment.

  FIG. 8 is a partial cross-sectional perspective view showing a part of an inspection apparatus according to the fifth embodiment of the present invention. As shown in FIGS. 7 and 8, the end portions 50 a of the plurality of optical fibers are inserted into the slits 41 a of the probe card substrate 41. The probe unit substrate 44 is disposed on the light exit side surface (back surface) of the probe card substrate 41 and supports a plurality of probe needles 45 that are in contact with the image sensor IC 110.

  Further, the probe unit substrate 44 is provided with an opening 44a having a width narrower than the width of the slit 41a of the probe card substrate 41, and narrows the range in which the light LT is irradiated from the end portions 50a of the plurality of optical fibers through the slit 41a. The aperture part is configured. Thereby, even if it does not change the width | variety of the slit 41a of the probe card board | substrate 41, the aperture | diaphragm | squeeze part which restrict | squeezes the range irradiated with the light LT can be comprised.

  The plurality of probe needles 45 may have a cantilever shape, or may have a cylindrical or prismatic shape. In the example shown in FIG. 7, the plurality of probe needles 45 extend in a direction substantially parallel to the thickness direction of the probe unit substrate 44 (preferably, in the optical axis direction of the end portion 50 a of the optical fiber). Accordingly, a plurality of probe needles 45 are arranged so as not to block the path of the light LT emitted through the opening 44a of the probe unit substrate 44, and the probe needles 45 are subjected to shadows, reflections, etc. on the plurality of light receiving elements of the image sensor IC 110. It can be made not to affect.

<Modification of inspection system>
The installation location of the light source 30 shown in FIG. 1 is preferably determined so that the plurality of optical fibers 50 are linearly arranged, but can be freely set within a range in which the required light amount and the uniformity of the illuminance in the inspection target can be obtained. It may be decided.

  FIG. 9 is a schematic diagram showing a first modification of the inspection system shown in FIG. In the first modification, the performance board and the frog ring are omitted, and the probe card 40 is directly docked to the test head 20. In that case, the light source 30 can be installed in or near the test head 20.

  FIG. 10 is a schematic diagram showing a second modification of the inspection system shown in FIG. In the second modification, a general-purpose test head 20 provided with a through hole 20a for a microscope or the like is used. In that case, the light source 30 can be installed on the top of the test head 20.

  The present invention is not limited to the embodiments described above, and many modifications can be made within the technical idea of the present invention by those having ordinary knowledge in the technical field. For example, it is possible to combine a plurality of embodiments selected from the embodiments described above.

  DESCRIPTION OF SYMBOLS 10 ... Tester, 20 ... Test head, 20a ... Through-hole, 30 ... Light source, 40 ... Probe card, 41 ... Probe card board, 41a ... Slit, 411a ... First part of slit, 412a ... Second part of slit , 41b ... area, 42, 45 ... probe needle, 43 ... aperture plate, 43a ... aperture, 44 ... probe unit substrate, 44a ... aperture, 50 ... optical fiber, 50a ... end of optical fiber, 60 ... wafer transfer prober, 100 ... Semiconductor wafer, 110 ... Image sensor IC, 111 ... Pixel part, 112 ... Circuit part, 113 ... Terminal, LT ... Light

Claims (9)

An inspection device used for inspecting a solid-state imaging device,
A light source including an LED;
A probe card including a probe card substrate provided with a slit;
A plurality of optical fibers installed between the light source and the probe card substrate, transmitting light from the light source, and irradiating the solid-state imaging device through the slit;
An inspection apparatus comprising:   The inspection apparatus according to claim 1, wherein the probe card includes a diaphragm portion that narrows a range in which light is irradiated from the end portions of the plurality of optical fibers through the slit. The ends of the plurality of optical fibers are inserted into the first portion of the slit;
The inspection apparatus according to claim 2, wherein the aperture portion is configured by a second portion of the slit having a narrower width on the light exit side than the width of the first portion of the slit. The ends of the plurality of optical fibers are inserted into the first portion of the slit;
The inspection apparatus according to claim 2, wherein the aperture portion is configured by a second portion of the slit having a width that gradually decreases from the first portion of the slit toward the light exit side. Ends of the plurality of optical fibers are inserted into the slits,
The probe card further includes an aperture plate disposed on a surface on the light exit side of the probe card substrate, and the aperture plate is provided with an opening having a width smaller than the width of the slit so that the aperture portion is provided. The inspection apparatus according to claim 2, which is configured.   The inspection apparatus according to claim 1, wherein the probe card further includes a plurality of probe needles supported by the probe card substrate and abutted against the solid-state imaging device. Ends of the plurality of optical fibers are inserted into the slits,
The probe card further includes a probe unit substrate disposed on a light exit side surface of the probe card substrate, and the probe unit substrate supports a plurality of probe needles that are in contact with the solid-state imaging device. The inspection apparatus according to claim 2, wherein an opening having a width narrower than a width of the slit is provided to constitute the diaphragm portion.   The inspection apparatus according to claim 7, wherein the plurality of probe needles extend in a direction substantially parallel to a thickness direction of the probe unit substrate.   The inspection device according to claim 1, wherein end portions of the plurality of optical fibers are arranged in a two-dimensional array.

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