JP2004172595A - Photoirradiation apparatus, test apparatus of solid state imaging device, and relay device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photoirradiation apparatus that can inspect a plurality of photoelectric conversion characteristics of an imaging element at the same time, adjust independently the light to be irradiated to each imaging element, and irradiate a plurality of lights in the same conditions at the same time. <P>SOLUTION: The photoirradiation apparatus has a light source 2, a bunch of optical fibers 20 in which a plurality of optical fibers are bound in one bundle at its input end and bound in a plurality of bundles at its output end, and a luminous flux incident from the input end is branched into a plurality of luminous fluxes, and an optical system unit 30 that incorporates a plurality of optical systems which independently adjust a luminous flux that is outputted from the output end of the bunch of optical fibers 20 for introduction to the imaging element. <P>COPYRIGHT: (C)2004,JPO

Description

  The present invention relates to a light irradiation device that irradiates test light used for testing characteristics of an imaging device such as a charge coupled device (CCD) and a complementary metal oxide semiconductor (CMOS).

In a manufacturing process of an imaging device such as a CCD or a CMOS, it is necessary to irradiate the imaging device with light under various conditions and inspect its photoelectric conversion characteristics.
2. Description of the Related Art An imaging device such as a CCD or a CMOS has a large number of light receiving elements arranged two-dimensionally. In order to check whether the characteristics of these light receiving elements have the required ranges, it is necessary to irradiate each light receiving element with light having a uniform illuminance distribution. If the illuminance of the light applied to each light receiving element is not uniform, variations occur in the inspection, which also causes the yield to decrease. For this reason, in the inspection of the imaging device, the performance of a light irradiation device that irradiates light having a uniform illuminance distribution is important.

By the way, in order to improve the inspection efficiency of the image sensor, it is necessary to inspect a plurality of image sensors simultaneously. In order to measure a plurality of imaging devices at the same time, for example, light from a light source was irradiated to a large area including an unnecessary area in an enlarged manner, and a plurality of imaging elements were arranged in this area to perform an inspection. .
In this case, it is necessary to expand the light from the light source by using a predetermined optical system so that the illuminance distribution becomes uniform, so that the illuminance of the irradiated light is reduced, so that light with sufficient illuminance is required. Can not respond to the case.
In addition, since the plurality of image sensors are collectively irradiated with light, the F-number of the optical system can be independently adjusted for the plurality of image sensors, or the independent light pattern can be applied to the plurality of image sensors. Can not do. For this reason, it has been difficult to accurately and uniformly equalize the illuminance of light that is simultaneously applied to a plurality of image sensors.
Further, since a large number of boards are built in the test head for performing the test, the degree of freedom of the arrangement of the light source for generating the test light is restricted, which further increases the adjustment range of the F value of the optical system. It causes narrowing.

The present invention has been made in view of the above-described problems, and has as its object to improve the test efficiency of the photoelectric conversion characteristics of a solid-state imaging device and to easily improve the characteristics of light applied to the solid-state imaging device. Another object of the present invention is to provide a light irradiation device that can be adjusted with high accuracy.
Another object of the present invention is to provide a test apparatus capable of improving the test efficiency of the photoelectric conversion characteristics of a solid-state imaging device and easily and accurately adjusting the characteristics of light applied to the solid-state imaging device. It is in.
Still another object of the present invention is to provide a relay device such as a probe card or a motherboard suitable for use in the above-described test apparatus.

  The light irradiation device of the present invention is a light irradiation device capable of simultaneously irradiating a plurality of solid-state imaging devices with light, wherein a light source for emitting light, a plurality of optical fibers are bundled together at an input end, and an output end is provided. The splitting optical fiber bundle is divided into a plurality of light at the output end, and the light output from the output end of the splitting optical fiber bundle is divided into a plurality of lights at the output end. A plurality of independent optical systems that are independently adjusted and guided to each of the image sensors.

  Preferably, the light irradiation apparatus of the present invention further includes a common optical system that commonly adjusts light incident on the splitting optical fiber bundle from the light source.

  More preferably, the plurality of independent optical systems are arranged at positions symmetrical about a predetermined axis, are provided rotatably about the predetermined axis, and collectively configure the plurality of independent optical systems. And an optical component for changing.

  Further, the light irradiation device of the present invention optically links the guide optical fiber bundle for guiding the light from the light source to the splitting optical fiber bundle, and the guide optical fiber bundle and the splitting optical fiber bundle. It is also possible to further comprise a coupling means for coupling, wherein at least the guide optical fiber bundle is movable with respect to the division optical fiber bundle.

  The solid-state imaging device test device of the present invention is a test device for irradiating the solid-state imaging device with test light to test photoelectric conversion characteristics, and includes a test head, a solid-state imaging device to be tested, and the test head. A relay unit that is electrically connected and transmits a signal necessary for testing a photoelectric conversion characteristic of the solid-state imaging device, a light source provided outside the test head, and penetrates the test head; A guide optical fiber bundle for guiding light to the solid-state imaging device electrically connected to the relay means.

  Further, in the solid-state imaging device testing apparatus of the present invention, a plurality of optical fibers are bundled together at an input end and a plurality of optical fibers are bundled at an output end, and light from the guide optical fiber bundle incident from the input end is provided. And a splitting optical fiber bundle that splits the light into a plurality of lights at the output end and guides the light to the plurality of solid-state imaging devices in a state of being electrically connected to the relay unit.

  Furthermore, the test apparatus for a solid-state imaging device according to the present invention includes a coupling unit that optically couples the guide optical fiber bundle and the division optical fiber bundle, and the test head, the light source, and the guide optical fiber. The bundle is movable with respect to the splitting optical fiber bundle and the relay means.

  The relay device of the present invention electrically connects a test head of a test apparatus that irradiates a solid-state imaging device with test light to test photoelectric conversion characteristics with the solid-state imaging device, and performs photoelectric conversion characteristics of the solid-state imaging device. A relay device for transmitting a signal necessary for the test, a connecting means for electrically connecting to a plurality of solid-state imaging devices positioned at predetermined positions, and irradiating each of the solid-state imaging devices with the test light For the opening, a plurality of optical fibers are bundled into one at the input end and bundled into a plurality at the output end, splitting light from a light source incident from the input end into a plurality of lights at the output end, A splitting optical fiber bundle guided to each of the solid-state imaging devices through the opening.

  In the light irradiation device of the present invention, the light output from the light source enters from the input end of the splitting optical fiber bundle, and is split at the output end into a number of lights corresponding to the plurality of image sensors. Light from each output end is independently adjusted by each independent optical system, and is applied to the corresponding image sensor. Accordingly, the light output from the light source is efficiently used, and the illuminance distribution of the light applied to each solid-state imaging device is made uniform. Further, in the present invention, a plurality of independent optical systems are arranged at symmetrical positions about a predetermined axis, and the components of the plurality of independent optical systems are collectively arranged by optical components rotatably provided about the predetermined axis. Thus, the light whose conditions are variously changed is simultaneously applied to a plurality of image sensors.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to improve the utilization efficiency of the light from a single light source, the characteristic of the light irradiated with respect to a solid-state imaging device can be adjusted easily and accurately, and the solid-state imaging device The test efficiency of the photoelectric conversion characteristics can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First Embodiment FIG. 1 is a schematic configuration diagram of a light irradiation device according to an embodiment of the present invention.
The light irradiation device 1 according to the present embodiment is used to irradiate light to a light receiving surface of a solid-state imaging device in an inspection of electrical characteristics of a solid-state imaging device such as a CCD (Charge Coupled Device) and a CMOS.
The light irradiation device 1 according to the present embodiment includes a light source 2, a condensing lens 10, a mechanical slit 11, an ND filter turret 12, a color filter turret 13, a fly-eye lens 15, a split optical fiber bundle 20, , An optical system unit 30.

  The light source 2, the condensing lens 10, the mechanical slit 11, the ND filter turret 12, the color filter turret 13, and the fly-eye lens 15 are housed in a box OB, and these constitute one embodiment of the common optical system of the present invention. Make up. Further, the optical system unit 30 incorporates an optical system corresponding to a plurality of independent optical systems of the present invention, as described later.

  As the light source 2, for example, a halogen lamp, a xenon lamp, a metal halide lamp, or the like is used. The light source 2 includes a reflecting mirror (not shown) that reflects and condenses emitted light in a predetermined direction.

The condensing lens 10 concentrates the light from the light source 2 in the direction of the mechanical slit 11.
As shown in FIG. 1, the mechanical slit 11 is composed of two movable plates 11A and 11B, and by adjusting the movement of the movable plates 11A and 11B, the area of the opening 11C formed therebetween is adjusted. By adjusting the area of the opening 11C, the amount of light condensed by the condensing lens 10 is adjusted.

  The ND filter turret 12 is supported rotatably about a support shaft 14. The ND filter turret 12 holds a plurality of types of ND (Neutral Density) filters along the circumferential direction. The ND filter diminishes light from the light source 2 transmitted through the mechanical slit 11 at a predetermined ratio without changing the spectral composition. By rotating and rotating the ND filter turret 12, an ND filter having a desired reduced light amount is selected. Note that the ND filter turret 12 also has a simple opening, and when the light is not dimmed, the ND filter turret 12 passes through the opening as it is.

  The color filter turret 13 is supported rotatably about a support shaft 14. The color filter turret 13 holds a plurality of types of color filters along the circumferential direction. The light from the light source 2 passes through the color filter to generate light having a wavelength corresponding to the color of the color filter. By rotating and indexing the color filter turret 13, a desired color filter is selected. Note that the color filter turret 13 also has a simple opening, and when the wavelength is not selected, the color filter turret 13 passes through the opening as it is.

  The fly-eye lens 15 is an optical element in which single lenses are arranged vertically and horizontally in a matrix. The fly-eye lens 15 is provided to make the illuminance distribution of the light from the light source 2 uniform. The fly-eye lens 15 has a rectangular outer shape.

  The common optical system has a function of adjusting the amount of light from the light source 2, the illuminance, the illuminance distribution, the wavelength, and the like.

Here, FIGS. 2A and 2B are diagrams showing the structure of the splitting optical fiber bundle 20, wherein FIG. 2A is a side view, and FIG. 2B is a cross-sectional view taken along line AA shown in FIG. .
The splitting optical fiber bundle 20 is configured by a bundle of a large number of optical fibers. One end of the splitting optical fiber bundle 20 is supported by a support member 21. The support member 21 bundles, for example, optical fibers having a diameter of 50 μm so as to form a rectangle having a cross section of 20 mm × 20 mm. Note that the support member 21 is provided in the box OB.
The splitting optical fiber bundle 20 is divided and bundled into a plurality (four) bundles 20a from the middle, and an optical guide 23 is connected to an end of the divided plurality of optical fiber bundles 20a. I have.
The light guide 23 is connected to an optical system unit 30 described later, and guides light output from an end of the bundle 20a of the plurality of divided optical fibers to the optical system unit 30.

Further, the number of optical fibers constituting each optical fiber bundle 20a is equal.
The support member 21 side of the splitting optical fiber bundle 20 is an input end where light is incident, and the light guide 23 side of the splitting optical fiber bundle 20 is an output end.

  The input end of the splitting optical fiber bundle 20 has a rectangular cross section as described above. The shape of the input end substantially matches the outer shape of the fly-eye lens 15 described above. This is because the coupling efficiency with the fly-eye lens 15 can be higher than when the cross-sectional shape of the input end of the splitting optical fiber bundle 20 is circular.

  As shown in FIG. 1, the optical system unit 30 independently adjusts the characteristics of the light amount, the illuminance, the illuminance distribution, and the like of the light output from each output end of the splitting optical fiber bundle 20, and a plurality of independent optical fibers. The light RL is output. As will be described later, these lights RL irradiate light receiving surfaces of a plurality of solid-state imaging devices to be inspected, which are arranged at predetermined positions below the optical system unit 30.

FIG. 3A is a diagram illustrating an internal configuration of the optical system unit 30, and FIG. 3B is a diagram illustrating components of the optical system unit 30.
As shown in FIG. 3B, a stage 100 is provided below the optical system unit 30, and an image sensor 101 to be inspected is arranged at a predetermined position on the stage 100. These image sensors 101 are electrically connected to a test device (not shown).
A plurality of independent optical systems 31 are provided inside the optical system unit 30. The optical system 31 includes a lens 32, a fly-eye lens 33, a lens 34, a diffusion plate 35, a center filter 36, imaging lenses 37 and 38, and an iris retlet 39.
The optical systems 31 are provided corresponding to the four output ends of the splitting optical fiber bundle 20, and the iris retlets 39 are provided commonly to the four optical systems 31.

The fly-eye lens 33, the diffusion plate 35, and the center filter 36 are provided in order to equalize the illuminance distribution of light incident from each output end of the splitting optical fiber bundle 20 through the light guide 23. The center filter 36 prevents the illuminance distribution of the light from gradually decreasing toward the periphery of the cross section of the light, and gradually reduces the illuminance toward the center of the cross section so as to be uniform over the entire cross section. It is a filter with a higher degree.
Further, each of the diffusion plates 35 and each of the center filters 36 are independently selected such that the four finally output lights RL have a desired light amount, illuminance, illuminance distribution, and the like. For example, the diffusion plate 35 and the center filter 36 can be selected so that the four lights RL have the same light amount, illuminance, and illuminance distribution.

As shown in FIG. 3B, a plurality of types of openings OP <b> 1 to OP <b> 3 having different areas are formed at regular intervals along the circumferential direction. Each of the openings OP1 to OP3 is provided corresponding to each of the four optical systems 31.
The iris retlet 39 is provided to control the F-number of the optical system 31.
Further, the iris retlet 39 is provided so as to be rotatable about a rotation shaft 40. The rotating shaft 40 is driven to rotate by a driving device such as a motor. By controlling the driving device to determine the iris retlet 39, any one of the openings OP1 to OP3 is simultaneously selected for the four optical systems 31, and the F value (aperture ratio) of the four optical systems 31 is Changed all at once.

Next, an example of an inspection of an image sensor using the light irradiation device 1 having the above configuration will be described.
First, a plurality of (four) image sensors are arranged at predetermined positions with respect to the optical system unit 30, and light is emitted from the light source 2.
The light from the light source 2 is passed through a condensing lens 10, a mechanical slit 11, an ND filter turret 12, a color filter turret 13, and a fly-eye lens 15, and after the characteristics such as light quantity, illuminance, illuminance distribution, and wavelength are adjusted as desired, The light enters the splitting optical fiber bundle 20.

  In the splitting optical fiber bundle 20, light incident from the support member 21 side is split into a plurality of parts and output from the light guide 23. At this time, since the number of optical fibers at each output end of the splitting optical fiber bundle 20 connected to the light guide 23 is equal to each other, the amount of light incident on each light guide 23 and the illuminance are substantially equal.

  Each light that has entered each of the plurality of optical systems 30 through the splitting optical fiber bundle 20 is independently adjusted in characteristics such as light intensity and illuminance distribution through a fly-eye lens 33, a diffusion plate 35, a center filter 36, and an iris retlet 39. You. As a result, the lights output through the plurality of optical systems 30 have the same characteristics such as the amount of light and the illuminance, and the lights are respectively incident on the light receiving surfaces of the plurality of image sensors arranged on the stage 100.

  Accordingly, light whose characteristics are adjusted equally enters the light receiving surfaces of the plurality of solid-state imaging devices, so that the plurality of imaging devices can be inspected simultaneously under the same conditions.

  As described above, according to the present embodiment, the light from the single light source 2 is equally split into a plurality of lights by using the splitting optical fiber bundle 20, and the split lights are respectively separated into independent optical systems 30. And irradiates the corresponding solid-state imaging device. Therefore, the light from the light source 2 can be used effectively. In addition, even if an illuminance difference or the like occurs in the light incident on each optical system 30, this can be adjusted independently by each optical system 30, so that light under the same condition can be simultaneously transmitted to a plurality of solid-state imaging devices. Irradiation becomes possible.

  In addition, the plurality of optical systems 30 are arranged at symmetrical positions with respect to the rotation axis 40, and optical components such as an iris retlet 39 are rotatably provided around the rotation axis 40. By changing the configuration of the system 30 collectively, the conditions of the light to be applied to the plurality of solid-state imaging devices can be changed simultaneously.

In the present embodiment, the characteristic of the light incident on each optical system 30 is adjusted using the diffusion plate 35 and the center filter 36. However, an illuminance difference occurs in the light output from each optical system 30. There is a possibility, and in that case, fine adjustment is required.
For example, a filter having an antireflection film formed on both surfaces or one surface of a transparent substrate such as a glass plate can be arranged in the optical path of each optical system 30 to finely adjust the illuminance difference. In other words, by independently adjusting the number of filters on which the antireflection film is formed in each optical system 30, fine adjustment of the illuminance difference becomes possible.
Note that, in the present embodiment, the case where the light irradiation device 1 is used to irradiate a plurality of solid-state imaging devices with light under the same condition has been described. A configuration is also possible. In addition to the plurality of solid-state imaging devices, the light irradiation device 1 can be applied to any object that requires irradiation of light that is accurately adjusted.

Second Embodiment FIG. 4 is a diagram showing a configuration of a test device for a solid-state imaging device to which a light irradiation device according to another embodiment of the present invention is applied.
4, a test apparatus 200 inspects, for example, a photoelectric conversion characteristic of a solid-state imaging device (for example, a CCD) formed on a wafer 400. The test apparatus 200 includes a tester 201, a test head 201, a probe card 250, a moving stage 260, and the like.

  The tester 201 manages the test head 201 and inspects the solid-state imaging device 401 based on a signal obtained from the solid-state imaging device formed on the wafer 400 through the test head 201.

The test head 201 is installed on a base 205. The test head 201 is connected to a drive arm 202 provided on a base 205, and the test head 201 moves from the base 205 by turning the drive arm 202. The test head 201 is moved from the base 205 during, for example, maintenance.
The test head 201 is electrically connected to a probe card 250 described later by a wiring (not shown). The test head 201 includes, for example, a power supply applied to the solid-state imaging device 401 through the probe card 250, various signal generation units such as a timing generator and a pattern generator, and an input unit for acquiring a signal of the solid-state imaging device 401 measured through the probe card 250. And so on.

The probe card 250 is installed at a predetermined position below the test head 201. The probe card 250 includes a probe needle 251 that comes into contact with a pad of the solid-state imaging device 401, and electrically connects the test head 201 and the solid-state imaging device 401.
The probe card 250 has an opening 250a for irradiating a plurality of solid-state imaging devices 401 with light, and an optical module 30A described later is provided in the opening 250a. The optical module 30A is an embodiment of the modularized independent optical system of the present invention.

  The moving stage 260 chucks the wafer 400 and positions the wafer 400 with respect to the probe card 250. In addition, the moving stage 260 separates the wafer 400 from the probe card 250 after the inspection is completed.

The light irradiation device according to the present embodiment includes a light source 2, a common optical system 210, a guide optical fiber bundle 220, couplers 221A and 221B, a split optical fiber bundle 225, and an optical module 30A.
The light source 2 is provided on the test head 202 and has the same configuration as the light source 2 according to the first embodiment.
The common optical system 210 is provided in the test head 202 and has the same function as the common optical system according to the first embodiment.
The guide optical fiber bundle 220 is provided in the test head 202 and is composed of a bundle of a large number of optical fibers. For example, optical fibers having a diameter of 50 μm are bundled so as to have a rectangular shape having a cross-sectional dimension of 20 mm × 20 mm. Have been.
The guide optical fiber bundle 220 guides light from the light source 2 incident through the common optical system 210 to the splitting optical fiber bundle 225.
The couplers 221A and 221B are composed of optical components such as lenses, and couple the guide optical fiber bundle 220 and the splitting optical fiber bundle 225. The coupler 221A is provided on the guide optical fiber bundle 220 side. The coupler 221B is provided on the splitting optical fiber bundle 225 side.
The couplers 221A and 221B are one embodiment of the coupling means of the present invention.

  The splitting optical fiber bundle 225 is provided on the base 205 side, and is positioned with respect to the probe card 250. The splitting optical fiber bundle 225 has the same configuration as the splitting optical fiber bundle 20 according to the first embodiment, and the end on the coupler 221B side is bundled into one and the end on the probe card 250 side. The unit is divided into a plurality (four), and each is positioned with respect to the optical module 30A.

FIG. 5 is a cross-sectional view illustrating the structure of the optical module 30A.
As shown in FIG. 5, the optical module 30A has a flange 301, a condenser lens 302, a diffusion plate 303, and a pinhole plate 304. Although a plurality of optical modules 30A are provided, they have similar optical characteristics.
The flange 301 is formed of a cylindrical member and is fixed on the probe card 250. The flange 301 is formed of a material that does not transmit light, such as a metal.
The condenser lens 302, the diffusion plate 303, and the pinhole plate 304 are held on the inner periphery of the flange 301.

The condenser lens 302 collects the light L from the light source 2 guided from the optical fiber bundle 225 for division.
The diffusion plate 303 diffuses the light passing through the condenser lens 302 to control the light amount, the illuminance, and the illuminance distribution.
The pinhole plate 304 has a pinhole 304p formed on the optical axis, and irradiates the light passing through the diffusion plate 303 through the pinhole 304p. As a result, the inspection light L is applied to the solid-state imaging device 401 positioned below the pinhole 304p. The F value is defined by the diameter of the pinhole 304p.

In the test apparatus 200 having the above configuration, at the time of maintenance or the like, the test head 202 is moved from above the base 205 by rotating the drive arm 202 as shown in FIG.
In the present embodiment, the optical path from the light source 2 to the solid-state imaging device to be inspected is constituted by the guide optical fiber bundle 220 and the split optical fiber bundle 225, and both are separably coupled by couplers 221A and 221B. Thereby, the test head 202 can be moved. When simultaneously inspecting a plurality of solid-state imaging devices 401 as in the present embodiment, the positional relationship between the components of the light irradiation device is important from the viewpoint of making the optical characteristics uniform. The position of the independent optical system and the position of the splitting optical fiber bundle 225 are important. In the present embodiment, the condenser lens 302, the diffusion plate 303, and the pinhole plate 304 constituting the independent optical system of the present invention are integrated, so that the optical module 30A and the probe card 250 can be accurately positioned. it can.
In the present embodiment, the case where both the guide optical fiber bundle 220 and the splitting optical fiber bundle 225 are used has been described. For example, when a single solid-state imaging device 401 is tested without performing a plurality of simultaneous tests. It is also possible to adopt a configuration in which test light is guided to a single solid-state imaging device 401 using only the guide optical fiber bundle 220.

Further, according to the present embodiment, since the light source 2 and the common optical system 210 are provided outside the test head 202, the capacity of the test head 202 does not increase.
Further, since the light source 2 as a heat source is disposed outside the test head 202, various substrates in the test head 202 are not affected by heat.
Further, since the guide optical fiber bundle 220 penetrates the test head 202 and the light from the light source 2 is guided to the vicinity of the solid-state imaging device 401 by the guide optical fiber bundle 220, the light use efficiency can be improved. At the same time, the adjustment range of the F value of the light applied to each solid-state imaging device 401 can be expanded.

Third Embodiment FIG. 7 is a sectional view showing the structure of a relay device according to an embodiment of the present invention. In FIG. 7, the same components as those in the second embodiment are denoted by the same reference numerals.
In the relay device 500 shown in FIG. 7, the output end of the split optical fiber bundle 225 is fixed to each opening 250a formed in the probe card 250 via the optical module 30A.
Note that the probe needle 251 provided corresponding to each opening 250a is an embodiment of the connecting means of the present invention.
This relay device 500 is used in place of the probe card 250 and the splitting optical fiber bundle 225 of the test device 200 according to the second embodiment to perform a test of the solid-state imaging device.

By positioning and fixing the splitting optical fiber bundle 225 to the probe card 250 in advance, it is easy to assemble the test apparatus, and the position of the splitting optical fiber bundle 225 and the probe card 250 are shifted even during the test. Absent.
Further, since the probe card 250 and the solid-state imaging device are positioned, the positional relationship between the solid-state imaging device and the splitting optical fiber bundle 225 is stabilized. As a result, it is possible to irradiate the solid-state imaging device with test light having stable characteristics.
In this embodiment, the output end of the splitting optical fiber bundle 225 is fixed to the probe card 250 via the optical module 30A. However, the output end of the splitting optical fiber bundle 225 is used without using the optical module 30A. May be directly fixed to the probe card 250.

Fourth Embodiment FIG. 8 is a view showing another embodiment of the coupling means in the test apparatus of the present invention.
In the second embodiment, a case has been described where couplers 221A and 221B made of optical components are used as coupling means for optically coupling the guide optical fiber bundle 220 and the split optical fiber bundle 225.
On the other hand, in order to irradiate the test light under uniform conditions to the solid-state imaging element 401, it is necessary to precisely match the optical axis Oa of the guide optical fiber bundle 220 with the optical axis Ob of the splitting optical fiber bundle 225.
However, since the test head 202 is movable, it is not easy to accurately align the optical axis Ob of the guide optical fiber bundle 220Oa with the optical axis Ob of the division optical fiber bundle 225.
For this reason, in the present embodiment, a fly-eye lens 221C is used between the optical components 221A and 221B. Since the fly-eye lens 221C acts to make the light intensity distribution uniform, even if the optical axis Ob of the guide optical fiber bundle 220Oa and the optical axis Ob of the splitting optical fiber bundle 225 are slightly shifted, the influence of this shift is absorbed. can do. As a result, it is possible to suppress the occurrence of variations in the characteristics of the test light emitted to the solid-state imaging device due to the displacement between the guide optical fiber bundle 220Oa and the optical axis Ob of the division optical fiber bundle 225.
The connecting means of the present invention is not limited to these embodiments, but can be variously modified.

The invention is not limited to the embodiments described above.
In the embodiment described above, the case of the probe card 250 has been described as the relay unit and the relay device of the present invention, but the present invention is not limited to this.
For example, those used when inspecting a packaged solid-state imaging device such as a socket board, and a motherboard connected to a probe card or a socket board are also included in the relay means and the relay device. In addition, a probe card or a socket board connected to a motherboard can be used as a relay unit and a relay device. If the splitting optical fiber bundle is fixed to these boards, the relay device of the present invention can be configured.
When the relay device is a socket board, for example, the connection means of the present invention is constituted by a socket.

  In the above-described embodiment, the case where the splitting optical fiber bundle is fixed to the probe card 250 has been described. It is not limited to a class. For example, the splitting optical fiber bundle is fixed to the table that holds the wafer of the prober that positions the probe card and the solid-state imaging device to be tested, or to the handler that is used to inspect the packaged solid-state imaging device. May be. With this configuration, the positional relationship between the solid-state imaging device and the splitting optical fiber bundle to be tested can be accurately maintained, and a more accurate test can be performed. Further, the test head of the present invention includes, in addition to general test heads for testing semiconductor devices, equivalents having functions similar to those of these test heads.

It is a schematic structure figure of a light irradiation device concerning one embodiment of the present invention. It is a figure which shows the structure of the optical fiber bundle for division | segmentation, (a) is a side view, (b) is sectional drawing in the AA line direction shown to (a). (A) is a figure which shows the internal structure of an optical system unit, (b) is a component of an optical system unit. FIG. 9 is a diagram illustrating a configuration of a solid-state imaging device test device to which a light irradiation device according to another embodiment of the present invention is applied. It is sectional drawing which shows the structure of an optical module. FIG. 4 is a diagram illustrating a state where a test head of the test apparatus is moved. It is a sectional view showing the structure of one embodiment of the relay device of the present invention. It is a figure showing other embodiments of a connecting means in a test device of the present invention.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 ... Light irradiation apparatus 2 ... Light source 10 ... Condensed lens 11 ... Mechanical slit 12 ... ND filter 13 ... Color filter 15 ... Fly-eye lens 20 ... Dividing optical fiber bundle 30 ... Optical system unit 31 ... Optical system 100 ... Stage 101 ... Imaging device 200 Test device 201 Tester 202 Test head 207 Drive arm 220 Guide optical fiber bundle 500 Relay device

Claims (12)

A light irradiation device capable of simultaneously irradiating light to a plurality of solid-state imaging devices,
A light source for emitting light,
A plurality of optical fibers are bundled into one at an input end and bundled into a plurality at an output end, and a splitting optical fiber bundle for splitting light from the light source incident from the input end into a plurality of lights at the output end. ,
A light irradiation device comprising: a plurality of independent optical systems that independently adjust light output from an output end of the splitting optical fiber bundle and guide the light to each of the imaging elements.   The light irradiation device according to claim 1, further comprising a common optical system that commonly adjusts light incident on the splitting optical fiber bundle from the light source. The plurality of independent optical systems are arranged at positions symmetric about a predetermined axis,
The light irradiation device according to claim 1, further comprising an optical component rotatably provided around the predetermined axis and configured to collectively change the configuration of the plurality of independent optical systems. A guide optical fiber bundle for guiding light from the light source to the splitting optical fiber bundle,
Coupling means for optically coupling the guide optical fiber bundle and the splitting optical fiber bundle,
The light irradiation device according to claim 1, wherein at least the guide optical fiber bundle is movable with respect to the division optical fiber bundle. The light irradiation device according to claim 4, wherein the coupling unit includes a fly-eye lens. The light irradiation device according to claim 1, wherein each of the plurality of independent optical systems is modularized. A test apparatus for testing photoelectric conversion characteristics by irradiating test light to a solid-state imaging device,
A test head,
A relay unit that electrically connects a solid-state imaging device to be tested and the test head and transmits a signal necessary for testing a photoelectric conversion characteristic of the solid-state imaging device;
A light source provided outside the test head,
A guide optical fiber bundle for penetrating the test head and guiding the light from the light source to the solid-state imaging device electrically connected to the relay unit. A plurality of optical fibers are bundled together at an input end and bundled into a plurality at an output end, and the light from the guide optical fiber bundle incident from the input end is split into a plurality of lights at the output end, The solid-state imaging device test apparatus according to claim 7, further comprising a splitting optical fiber bundle that leads to the plurality of solid-state imaging devices in a state of being electrically connected to a relay unit. The solid-state imaging device testing device according to claim 8, wherein the splitting optical fiber bundle is fixed to one of objects to be positioned with respect to the solid-state imaging device to be tested. The solid-state imaging device testing device according to claim 9, wherein the splitting optical fiber bundle is fixed to the relay unit. Coupling means for optically coupling the guide optical fiber bundle and the splitting optical fiber bundle,
The solid-state imaging device test apparatus according to claim 8, wherein the test head, the light source, and the guide optical fiber bundle are movable with respect to the division optical fiber bundle and the relay unit. The solid-state imaging device is electrically connected to the test head of the test apparatus that irradiates the test light with the test light to test the photoelectric conversion characteristics and the solid-state imaging device, and outputs a signal necessary for testing the photoelectric conversion characteristics of the solid-state imaging device. A relay device for transmitting,
Connection means for electrically connecting the plurality of solid-state imaging devices positioned at predetermined positions,
An opening for irradiating the solid-state imaging device with the test light,
A plurality of optical fibers are bundled together at an input end and a plurality of bundled at an output end, and light from a light source incident from the input end is split into a plurality of lights at the output end, to each of the solid-state imaging devices. A splitting optical fiber bundle guided through the opening.

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