WO2004040266A1

WO2004040266A1 - Optical lighting system, test device for solid-state imaging device, repeater

Info

Publication number: WO2004040266A1
Application number: PCT/JP2003/013915
Authority: WO
Inventors: Shingo Tamai
Original assignee: Inter Action Corporation
Priority date: 2002-10-31
Filing date: 2003-10-30
Publication date: 2004-05-13
Also published as: WO2004040266A8; AU2003280637A1; AU2003280637A8; TW200409987A

Abstract

An optical lighting system capable of improving the photoelectric conversion characteristics and the test efficiency of a solid-state imaging element, and easily and accurately regulating the characteristics of a light applied to the solid-state imaging element. The optical lighting system comprises a light source (2) for emitting light, a splitting optical fiber bundle having a plurality of optical fibers bundled into one group at the input end thereof and into a plurality of groups at the output end thereof, and splitting a light entered via the input end from the light source into a plurality of lights at the output end, and an optical system unit (30) incorporating a plurality of independent optical systems for independently regulating light fluxes output from the output end of the splitting optical fiber bundle (20) and introducing them to a solid-state imaging element.

Description

Akira Itoda Light irradiation device, solid-state imaging device test device, relay device

The present invention relates to a light irradiating device that irradiates inspection light used for inspecting characteristics of a solid-state imaging device such as a CCD (Charge Coupled Device) and a CMOS (Complementary Metal Oxide Semiconductor).

Background art

In the manufacturing process of an imaging device such as CCD and CMOS, it is necessary to irradiate the imaging device with light under various conditions and inspect its photoelectric conversion characteristics.

An imaging device such as CCD or CMOS has a large number of light receiving devices arranged two-dimensionally. In order to check whether the characteristics of these light receiving elements have the required range of characteristics, it is necessary to irradiate each light receiving element with light having a uniform illuminance distribution. If the illuminance of the light applied to each light receiving element is not uniform, the inspection will vary, which may cause a decrease in yield. Therefore, the performance of a light irradiation device that irradiates light with a uniform illuminance distribution is important in the inspection of an image sensor.

By the way, in order to improve the inspection efficiency of the image sensor, it is necessary to inspect a plurality of image sensors simultaneously. In order to measure multiple imaging devices at the same time, for example, light from a light source was expanded and radiated to a large area containing unnecessary areas, and multiple image sensors were placed in this area for inspection. .

In this case, it is necessary to expand the light from the light source using a predetermined optical system so that the illuminance distribution becomes uniform, so that the illuminance of the irradiated light decreases. Can not respond to the case.

In addition, since light is irradiated to a plurality of image sensors at once, the F-number of the optical system can be adjusted independently for the plurality of image sensors, Cannot irradiate the turn. For this reason, it has been difficult to accurately and uniformly equalize the illuminance of light that is simultaneously applied to a plurality of image sensors. Guidance of invention

An object of the present invention is to provide a light irradiating device capable of improving the test efficiency of the photoelectric conversion characteristics of a solid-state imaging device and easily and accurately adjusting the characteristics of light irradiated to the solid-state imaging device. It is in.

Another object of the present invention is to provide a solid-state imaging device that can improve the test efficiency of the photoelectric conversion characteristics of the solid-state imaging device and can easily and accurately adjust the characteristics of light applied to the solid-state imaging device. An object of the present invention is to provide a test device and a relay device used for the test device. The light irradiation device of the present invention is a light irradiation device capable of simultaneously irradiating a plurality of solid-state imaging devices with light, wherein a light source for emitting light, a plurality of optical fibers are bundled together at an input end, and an output is provided. An optical fiber bundle for splitting the light from the light source incident from the input end into a plurality of lights at the output end; and light output from an output end of the optical fiber bundle for splitting. And a plurality of independent optical systems for independently adjusting and guiding each of the imaging elements.

Preferably, the light irradiation device according to claim 1, wherein the light irradiation device of the present invention further includes a common optical system that commonly adjusts light incident on the splitting optical fiber bundle from the light source.

More preferably, the plurality of independent optical systems are arranged at positions symmetrical about a predetermined axis, are provided rotatably about the predetermined axis, and collectively configure the plurality of independent optical systems. Further having optical components to change

Further, the light irradiation device of the present invention comprises: a guide optical fiber bundle for guiding light from the light source to the splitting optical fiber bundle; and a guide optical fiber bundle and the splitting optical fiber bundle. A coupling means for optically coupling, wherein at least the guide optical fiber bundle is movable relative to the division optical fiber bundle. It is also possible.

A test apparatus for a solid-state imaging device according to the present invention is a test device for testing photoelectric conversion characteristics by irradiating a solid-state imaging device with test light, and includes a test head, a solid-state imaging device to be tested, and the test device. A relay for electrically connecting the head to the head and transmitting a signal necessary for testing a photoelectric conversion characteristic of the solid-state imaging device; a light source provided outside the test head; And a guide optical fiber bundle for guiding the light from the light source to the solid-state imaging device electrically connected to the relay means. In the solid-state imaging device testing apparatus according to the present invention, a plurality of optical fibers are bundled together at an input end and a plurality of optical fibers are bundled at an output end, and light from the guide optical fiber bundle incident from the input end is provided. And a splitting optical fiber bundle that splits the light into a plurality of lights at the output end and guides the lights to the plurality of solid-state imaging devices in a state of being electrically connected to the relay unit.

Further, the solid-state imaging device test apparatus of the present invention includes a coupling unit for optically coupling the guide optical fiber bundle and the division optical fiber bundle, wherein the test head, the light source, and The guide optical fiber bundle is movable with respect to the splitting optical fiber bundle and the middle joint stage.

The relay device of the present invention electrically connects a test head of a test device that irradiates a solid-state imaging device with test light to test photoelectric conversion characteristics with the solid-state imaging device, A relay device for transmitting a signal necessary for a test of a conversion characteristic, a connection means for electrically connecting to a plurality of solid-state imaging devices positioned at predetermined positions, and the solid-state imaging device An opening for irradiating the light, a plurality of optical fibers are bundled together at an input end and a plurality of optical fibers are bundled together at an output end, and the light from a light source incident from the input end is output to a plurality of lights at the output end. And a splitting optical fiber bundle that is guided to each of the solid-state imaging devices through the opening.

In the present invention, the light output from the light source enters from the input end of the optical fiber bundle for splitting, and is split at the output end into a number of lights corresponding to a plurality of image sensors. The light from each output end It is adjusted independently by each independent optical system and irradiates the corresponding image sensor. Thereby, the light output from the light source is efficiently used, and the illuminance distribution of the light applied to each solid-state imaging device is made uniform. Further, in the present invention, the plurality of independent optical systems are arranged at symmetrical positions about a predetermined axis, and the optical components rotatably provided about the predetermined axis form the plurality of independent optical systems. Are collectively changed, so that light whose conditions are variously changed is simultaneously applied to a plurality of imaging elements. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a schematic configuration diagram of a light irradiation device according to an embodiment of the present invention, and FIG. 2 is a diagram illustrating a structure of a splitting optical fiber bundle,

FIG. 3 is a diagram showing the internal configuration of the optical system unit and the components of the optical system unit.

FIG. 4 is a diagram illustrating a configuration of a test apparatus for a solid-state imaging device to which a light irradiation device according to another embodiment of the present invention is applied;

FIG. 5 is a cross-sectional view showing the structure of the optical module.

FIG. 6 is a diagram showing a state in which a test head of a test apparatus is moved, FIG. 7 is a cross-sectional view showing a structure of an embodiment of a relay device of the present invention, and FIG. It is a figure showing other embodiments of a connecting means in a test device of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

First embodiment

FIG. 1 is a schematic configuration diagram of a light irradiation device according to one embodiment of the present invention.

The light irradiation device 1 according to the present embodiment, for example, inspects the electrical characteristics of an image sensor such as a CCD (Charge Coupled Device) or CMOS, and applies light to the light receiving surface of the image sensor. Used to irradiate

The light irradiation device 1 according to the present embodiment includes a light source 2, a condensing lens 10, a mechanical slit 11, a ND filter overnight 12, a color filter sauce 13 and a fly. It has an eye lens 15, a splitting optical fiber bundle 20, and an optical system unit 30.

The light source 2, condensed lens 10, mechanical slit 11, ND filter evening and evening lettuce 12, color fill evening and evening lettuce 13 and fly-eye lens 15 are housed in the box OB. These constitute one embodiment of the common optical system of the present invention. Further, the optical system unit 30 incorporates an optical system corresponding to the plurality of independent optical systems of the present invention, as described later.

As the light source 2, for example, a halogen lamp, a xenon lamp, a metal halide lamp, or the like is used. The light source 2 includes a reflector (not shown) that reflects and condenses the emitted light in a predetermined direction.

The condensing lens 10 concentrates the light from the light source 2 in the direction of the mechanical slit 11.

As shown in Fig. 1, the mechanical slit 11 is composed of two movable plates 11A and 11B, and is formed between the movable plates 11A and 11B by adjusting the movement of the movable plates. The area of the opening 11C is adjusted. By adjusting the area of Sekiguchi 11 C, the amount of light collected by the condenser lens 10 is adjusted.

The ND file evening and evening lett 12 is supported rotatably about a support shaft 14. The ND filter turret 12 holds a plurality of types of ND (Neutral Density) filters along the circumferential direction. The ND filter 1 attenuates the light from the light source 2 transmitted through the mechanical slit 11 at a predetermined rate without changing the spectral composition. By rotating the ND filter 12 and rotating the index 12, an ND filter with a desired amount of light reduction is selected. Note that the ND filter 12 has a simple opening, and if the light is not dimmed, the opening is used as it is. The color fill evening and evening let 13 is supported rotatably about a support shaft 14. The color filter evening 13 has multiple types of color filters along the circumferential direction. The light from the light source 2 passes through the color filter to generate light having a wavelength corresponding to the color of the color filter. The desired color fill is selected by rotating the color fill evening 13 and indexing it. The color filter set 13 has a mere opening, and when no wavelength is selected, the light is passed through the opening as it is.

The fly-eye lens # 5 is an optical element in which single lenses are arranged vertically and horizontally in a matrix. The fly-eye lens 15 is provided to make the illuminance distribution of the light from the light source 2 uniform. The fly-eye lens 15 has a rectangular outer shape.

The above common optical system has a function of adjusting the amount of light from the light source 2, the intensity, the illuminance distribution, the wavelength, and the like.

Here, FIG. 2 is a view showing the structure of the splitting optical fiber bundle 20, FIG. 2A is a side view, and FIG. 2B is a cross-sectional view taken along the line A--A shown in FIG. 2A. is there.

The splitting optical fiber bundle 20 is composed of a bundle of many optical fibers. One end of the splitting optical fiber bundle 20 is supported by a support member 20. The support member 21 bundles, for example, optical fibers having a diameter of 50 m so as to have a rectangular shape having a cross-sectional dimension of 2 Omm x 2 Omm. The support member 21 is provided in the box 0B.

0

The splitting optical fiber bundle 20 is split from the middle into a plurality (four) of bundles 20a and bundled, and the end of the plurality of split optical fiber bundles 20a is provided with an optical guide. Mode 23 is connected.

The optical guide 23 is connected to an optical unit 30 described later, and guides light output from the end of the bundle of a plurality of divided optical fibers 20 a to the optical unit 30. o Further, the number of optical fibers constituting the bundle 2 0 a of each optical fiber is not equal respectively ₀

The support member 21 side of the splitting optical fiber bundle 20 is an input end to which light is incident, and the light guide 23 side of the splitting optical fiber bundle 20 is an output end.

As described above, the input end of the splitting optical fiber bundle 20 has a rectangular cross section. The shape of the input end substantially matches the outer shape of the fly-eye lens 15 described above. This is because the coupling efficiency with the fly-eye lens 15 can be higher than when the cross-sectional shape of the input end of the splitting optical fiber bundle 20 is circular. As shown in FIG. 1, the light output, illuminance, illuminance distribution, and other characteristics of each light output from each output end of the splitting optical fiber bundle 20 are independently adjusted to output a plurality of independent lights: RL. I do. As described later, these lights RL irradiate light receiving surfaces of a plurality of solid-state imaging devices to be inspected, which are arranged at predetermined positions below the optical system unit 30.

FIG. 3A is a diagram showing the internal configuration of the optical system unit 30, and FIG. 3B is a component of the optical system unit 30.

As shown in FIG. 3B, a stage 100 is provided below the optical system unit 30, and an image pickup device 101 to be inspected is arranged at a predetermined position on the stage 100. . These imaging devices 101 are electrically connected to a test device (not shown). A plurality of independent optical systems 31 are provided inside the optical system unit 30. The optical system 31 comprises a lens 32, a fly-eye lens 33, a lens 34, a diffuser 35, a center filter 36, imaging lenses 37, 38, and an iris lens 39. .

The optical system 31 is provided corresponding to the four output terminals of the splitting optical fiber bundle 20, and the irislet 39 is provided in common to the four optical systems 31. The fly-eye lens 33, the diffuser plate 35, and the sensor filter 36 are provided to equalize the illuminance distribution of light incident from each output end of the splitting optical fiber bundle 20 through the light guide 23. Have been. The center filter 36 prevents the illuminance distribution of the light from gradually decreasing toward the periphery of the cross section of the light, and gradually becomes uniform toward the center of the cross section so as to be uniform over the entire cross section. This filter increases the degree of dimming.

Further, each diffuser plate 35 and each sensor ^ filter 36 are independently selected such that the finally output four lights RL have desired light quantity, illuminance, illuminance distribution, etc. . For example, the diffuser 35 and the center filter 36 can be selected so that the four lights RL have the same light amount, illuminance, and illuminance distribution.

As shown in FIG. 3B, the iris retlet 39 is formed with a plurality of types of openings OP 1 to OP 3 having different areas at regular intervals along the circumferential direction. Each of the openings OP 1 to Ο 3 is provided corresponding to each of the four optical systems 31.

The irislet 39 is provided for controlling the F-number of the optical system 31.

Further, the iris sunset 39 is provided so as to be rotatable about a rotation axis 40. The rotating shaft 40 is rotationally driven by a driving device such as a motor. By controlling this driving device to determine the iris let 39, one of the apertures OP1 to OP3 is simultaneously selected for the four optical systems 31 and the four optical systems 31 are selected. The F value (caliber ratio) is changed collectively.

Next, an example of an inspection of an image sensor using the light irradiation device 1 having the above configuration will be described.

First, a plurality of (four) imaging elements are arranged at predetermined positions with respect to the optical system unit 30, and light is emitted from the light source 2.

The light from light source 2 is a condensing lens; I 0, mechanical slit 11, ND After the characteristics such as light intensity, illuminance, illuminance distribution, and wavelength are adjusted as desired through the Irk Nightlet 12, the Color Fill Nightlet 13 and the fly-eye lens 15, the splitting optical fiber bundle 2 Incident at 0.

In the splitting optical fiber bundle 20, the light incident from the support member 21 is split into a plurality of parts and output from the light guide 23. At this time, since the number of optical fibers at each output end of the splitting optical fiber bundle 20 connected to the light guide 23 is equal to each other, the amount of light and the illuminance of the light entering each optical guide 23 are substantially equal. .

Each light that has entered each of the plurality of optical systems 30 through the splitting optical fiber bundle 20 passes through a fly-eye lens 33, a diffusion plate 35, a center filter 36, and an iris evening light 39. Are independently adjusted. As a result, the respective lights output through the plurality of optical systems 30 have the same characteristics such as the amount of light and the illuminance, and this light is applied to the light receiving surfaces of the plurality of image sensors arranged on the stage 100. Each is incident.

This allows light whose characteristics are adjusted to be equal to the light receiving surfaces of the plurality of solid-state imaging devices, so that a plurality of imaging devices can be inspected simultaneously under the same conditions. As described above, according to the present embodiment, the light from the single light source 2 is equally split into a plurality of lights by using the splitting optical fiber bundle 20, and the split lights are respectively separated into independent optical systems. Adjust using 30 and irradiate the corresponding solid-state imaging device. Therefore, the light from the light source 2 can be used effectively. In addition, even if an illuminance difference or the like occurs in the light incident on each optical system 30, this can be adjusted independently by each optical system 30, so that the light under the same conditions can be transmitted to a plurality of solid-state imaging devices. At the same time.

Further, a plurality of optical systems 30 are arranged at positions symmetrical with respect to the rotation axis 40, and optical components such as an iris retlet 39 are rotatably provided around the rotation axis 40. By changing the configuration of the plurality of optical systems 30 collectively by the step 39, it is possible to simultaneously change the conditions of light to be applied to the plurality of solid-state imaging devices. it can.

In the present embodiment, the characteristic of the light incident on each optical system 30 is adjusted by using the diffusion plate 35 and the center filter 36. However, the illuminance is applied to the light output from each optical system 30. Differences can occur, in which case fine-tuning is required. For example, a filter having an antireflection film formed on both sides of a transparent substrate such as a glass plate or the like can be arranged in the optical path of each optical system 30 to finely adjust the illuminance difference. That is, by independently adjusting the number of filters on which the antireflection film is formed in each optical system 30, fine adjustment of the illuminance difference becomes possible.

In the present embodiment, the case where the light irradiation device 1 is used to irradiate a plurality of solid-state imaging devices with light under the same condition has been described. However, different conditions may be applied to the plurality of solid-state imaging devices. May be applied. In addition to the plurality of solid-state imaging devices, the light irradiation device 1 can be applied to any object that requires irradiation of light that is accurately adjusted.

Second embodiment

FIG. 4 is a diagram showing a configuration of a solid-state imaging device test device to which a light irradiation device according to another embodiment of the present invention is applied.

In FIG. 4, the test apparatus 200 inspects, for example, the photoelectric conversion characteristics of a solid-state imaging device (for example, CCD) formed on the wafer 400. The test apparatus 200 includes a tester 201, a test head 201, a probe card 250, a moving stage 260, and the like.

The tester 201 manages the test head 201, and based on the signal obtained from the solid-state image sensor formed on the wafer 400 through the test head 201, the solid-state imaging device 400 Perform the inspection of 1.

The test head 201 is set on a base 205. The test head 201 is connected to a drive arm 202 provided on a base 205, and by rotating the drive arm 202, the test head 201 is connected to the base 205. 0 Move from 5. test Moving the head 201 from the base 205 is performed, for example, during maintenance.

The test head 201 is electrically connected to a later-described program card 250 by wiring (not shown). The test head 201 is connected to, for example, the solid-state imaging device 401. Power supply applied through the probe card 250, various signal generation units such as a timing generator and a pattern generator, and an input unit that acquires the signal of the solid-state imaging device 401 measured through the probe card 250 Be composed.

The probe card 250 is set at a predetermined position below the test head 201. The probe card 250 includes a probe needle 251, which comes into contact with a pad of the solid-state imaging device 401, and electrically connects the test head 201 to the solid-state imaging device 401.

The probe card 250 has an opening 250a for irradiating a plurality of solid-state imaging elements 401 with light. The opening 250a has an optical module 3OA described later. Is provided. This optical module 3OA is one embodiment of the modularized independent optical system of the present invention.

The moving stage 260 chucks the wafer 400 and positions the wafer 400 with respect to the probe card 250. Further, the moving stage 260 separates the probe 400 from the probe card 250 after the end of the inspection.

The light irradiation device according to the present embodiment includes a light source 2, a common optical system 210, a guide optical fiber bundle 220, a coupler 22A, 2211B, and a split optical fiber bundle 222. The optical module consists of 3 OA.

The light source 2 is provided in the test head 202 and has the same configuration as the light source 2 according to the first embodiment.

The common optical system 210 is provided in the test head 202 and has the same function as the common optical system according to the first embodiment.

The optical fiber bundle 220 for the guide is provided in the test head 202, and a large number is provided. For example, an optical fiber having a diameter of 50 is bundled into a rectangular shape having a cross section of 20 mm × 20 mm.

The guide optical fiber bundle 220 guides the light from the light source 2 incident through the common optical system 210 to the splitting optical fiber bundle 222.

The couplers 22 A and 22 B are composed of optical components such as lenses, and couple the guide fiber bundle 220 and the splitting optical fiber bundle 22. The coupler 222 A is provided on the guide optical fiber bundle 220 side. The coupler 2 21 B is provided on the side of the splitting optical fiber bundle 2 25.

Couplers 22 A and 22 B are one embodiment of the coupling means of the present invention. The splitting optical fiber bundle 225 is provided on the base 205 side, and is positioned with respect to the probe card 250. The splitting optical fiber bundle 2 25 has the same configuration as the splitting optical fiber bundle 20 according to the first embodiment, and the end of the coupler 22 1 B side is bundled into one. The end on the probe card 250 side is divided into a plurality (four), and each is positioned with respect to the optical module 3 OA. FIG. 5 is a cross-sectional view showing the structure of the optical module 3 OA.

As shown in FIG. 5, the optical module 3OA includes a flange 301, a condenser lens 302, a diffusion plate 303, and a pinhole plate 304. Although a plurality of optical modules 3OA are provided, they have similar optical characteristics.

The flange 300 is made of a cylindrical member and is fixed on the probe card 250. The flange 301 is formed of a material that does not transmit light, such as a metal. The condenser lens 302, the diffusion plate 303, and the pinhole plate 304 are held on the inner periphery of the flange 301.

The condenser lens 302 condenses the light L from the light source 2 guided from the optical fiber bundle for division 222 described above.

The diffusing plate 303 diffuses the light that has passed through the condenser lens 302 so that the light amount, illuminance and And control the illumination distribution.

The pinhole plate 304 has a pinhole 304p formed on the optical axis, and irradiates the light passing through the diffusion plate 303 through the pinhole 304p. As a result, the light L for inspection is applied to the solid-state imaging device 401 positioned below the pinhole 304p. The F value is defined by the diameter of the pinhole 304p. In the test apparatus 200 having the above configuration, at the time of maintenance or the like, the test head 202 is moved from above the base 205 by rotating the drive arm 202 as shown in FIG.

In the present embodiment, the optical path from the light source 2 to the solid-state imaging device to be inspected is constituted by a guide optical fiber bundle 220 and a splitting optical fiber bundle 222, both of which are couplers 22A and 21A. The test head 202 can be moved by being separably connected by the 222B. When simultaneously inspecting a plurality of solid-state imaging devices 401 as in the present embodiment, from the viewpoint of making the optical characteristics uniform, the positional relationship between the components of the light irradiation device is important. The position of the independent optical system and the splitting optical fiber bundle 225 relative to the probe card 250 is important. In this embodiment, since the condenser lens 302, the diffusion plate 303 and the pinhole plate 304 constituting the independent optical system of the present invention are integrated, the optical module 3OA and the probe card are integrated. The alignment with 250 can be performed accurately.

In the present embodiment, the case where both the guide optical fiber bundle 220 and the splitting optical fiber bundle 222 are used has been described. For example, a single solid-state imaging device 40 In the case of testing 1, it is also possible to adopt a configuration in which test light is guided to a single solid-state imaging device 40 # using only the guide optical fiber bundle 220.

Further, according to the present embodiment, since the light source 2 and the common optical system 210 are installed outside the test head 202, the volume of the test head 202 does not increase.

In addition, since the light source 2, which is a heat source, is located outside the test head 202, Various substrates in the storage 202 are not affected by heat.

Further, the guide optical fiber bundle 220 is passed through the test head 202, and the light from the light source 2 is transmitted to the vicinity of the solid-state imaging device 401 by the guide optical fiber bundle 220. As a result, the light use efficiency can be improved, and the adjustment range of the F value of the light impinging on each solid-state imaging element 401 can be expanded.

Third embodiment

FIG. 7 is a sectional view showing the structure of one embodiment of the relay device of the present invention. In FIG. 7, the same components as those of the second embodiment are denoted by the same reference numerals.

In the relay device 500 shown in FIG. 7, the output end of the splitting optical fiber bundle 222 is fixed to each opening 250 a formed in the prop card 250 via the optical module 3 OA. ing.

Note that the probe needles 251, provided corresponding to the respective openings 250a, is one embodiment of the connection means of the present invention.

The relay device 500 is used in place of the probe card 250 and the splitting optical fiber bundle 222 of the test device 200 according to the second embodiment, and the solid-state imaging device is tested.

By positioning and fixing the splitting optical fiber bundle 2 25 to the probe card 250 beforehand, assembly of the test equipment becomes easy, and even during the test, the splitting optical fiber bundle 2 25 and the probe card The position with 250 does not shift. Also, since the propcard 250 and the solid-state imaging device are positioned, the positional relationship between the solid-state imaging device and the splitting optical fiber bundle 225 is stabilized. As a result, it is possible to irradiate the solid-state imaging device with test light having stable characteristics.

In the present embodiment, the output end of the splitting optical fiber bundle 2 25 is fixed to the probe card 250 via the optical module 3 OA. However, the splitting optical fiber bundle 2 25 is used without using the optical module 3 OA. Output end of fiber bundle 2 25 to probe card 250 It is also possible to adopt a configuration of directly fixing.

Fourth embodiment

FIG. 8 is a diagram showing another embodiment of the coupling means in the test apparatus of the present invention. In the second embodiment, as a coupling means for optically coupling the guide optical fiber bundle 220 and the splitting optical fiber bundle 222, a coupler 22 composed of optical components is used.

The case where 1 A and 2 21 B are used has been described.

On the other hand, in order to irradiate the test light under uniform conditions to the solid-state imaging device 401, the optical axis ◦a of the guide optical fiber bundle 220 and the optical axis O b of the splitting optical fiber bundle 25 Must be adjusted precisely.

However, because the test head 202 is movable, it is easy to accurately align the optical axis b of the guide optical fiber bundle 22 Oa with the optical axis b of the splitting optical fiber bundle 25. is not.

For this reason, in the present embodiment, a fly eye lens 22 1 C is used between the optical components 21 A and 22 1 B. Since the fly-eye lens 2 21 C acts to make the light intensity distribution uniform, the optical axis O b of the guide optical fiber bundle 22 O a and the optical fiber bundle 22 5 of the splitting optical fiber bundle 22 5 are slightly shifted. Even so, the effects of this shift can be absorbed. As a result, it is possible to suppress the occurrence of variations in the characteristics of the test light emitted to the solid-state imaging device due to the deviation between the optical fiber bundle for guide 22Oa and the optical axis Ob of the optical fiber bundle for splitting 22. Can be.

Note that the coupling means of the present invention is not limited to these embodiments, and can be variously modified.

The present invention is not limited to the embodiment described above.

In the embodiment described above, the case where the probe force is 250 is described as the relay means and the relay device of the present invention, but the present invention is not limited to this.

For example, those used when inspecting packaged solid-state imaging devices such as socket boards, and the motherboard connected to a probe force socket socket The mode is also included in the relay means and the relay device. Further, a probe card or a socket board connected to a mother board can be used as the relay means and the relay device. By fixing the splitting optical fiber bundle to these boards, the relay device of the present invention can be configured.

If, for example, a socket board is used as a relay device, the connecting means of the present invention is constituted by a socket.

Further, in the above-described embodiment, the case where the splitting optical fiber bundle is fixed to the probe force 250 is described. However, if the object is positioned with respect to the solid-state imaging device to be tested, the probe It is not limited to boards such as cards. For example, the splitting light is placed on the table side that holds the wafer of the proper positioner that positions the probe card and the solid-state imaging device to be tested, or on the handler that is used to inspect the packaged solid-state imaging device. The fiber bundle may be fixed. With this configuration, the positional relationship between the solid-state imaging device and the test-split splitting optical fiber bundle can be accurately maintained, and a more accurate test can be performed. Further, the test head of the present invention includes, in addition to a general test head for testing a semiconductor device, an equivalent having the same or similar function as those test heads. Industrial applicability

The present invention can be used, for example, for testing the photoelectric conversion characteristics of a solid-state imaging device.

Claims

The scope of the claims

1. A light irradiation device capable of simultaneously irradiating a plurality of solid-state imaging devices with light,

A light source for emitting light,

A plurality of optical fibers bundled together at an input end and a plurality of optical fibers bundled at an output end, and a splitting optical fiber for splitting light from the light source incident from the input end into a plurality of lights at the output end A bunch,

A plurality of independent optical systems that independently adjust light output from the output end of the splitting optical fiber bundle and guide the light to each of the imaging elements;

A light irradiation device having:

2. The light irradiation device according to claim 1, further comprising a common optical system that commonly adjusts light incident on the bundle of splitting optical fibers from the light source.

3. The plurality of independent optical systems are arranged at symmetrical positions about a predetermined axis, are provided rotatably about the predetermined axis, and change the configuration of the plurality of independent optical systems collectively. Have more parts

The light irradiation device according to claim 1.

4. A guide optical fiber bundle for guiding light from the light source to the splitting optical fiber bundle;

Coupling means for optically coupling the guide optical fiber bundle and the splitting optical fiber bundle,

At least the guide optical fiber bundle is movable with respect to the division optical fiber bundle.

The light irradiation device according to claim 1.

5. The coupling means has a fly-eye lens

The light irradiation device according to claim 4.

6. The light irradiation device according to claim 1, wherein each of the plurality of independent optical systems is modularized.

7. With a test device that irradiates the solid-state imaging device with test light to test the photoelectric conversion characteristics,

To the test,

Relay means for electrically connecting a solid-state image sensor to be tested and the test head, and transmitting a signal necessary for testing a photoelectric conversion characteristic of the solid-state image sensor;

A light source provided outside the test head;

A guide optical fiber bundle for penetrating the test head and guiding light from the light source to a solid-state imaging device electrically connected to the relay means;

A test apparatus for a solid-state imaging device having the same.

8. A plurality of optical fibers are bundled together at an input end and a plurality of bundled at an output end, and light from the guide optical fiber bundle incident from the input end is split into a plurality of lights at the output end. And a splitting optical fiber bundle for guiding to the plurality of solid-state imaging elements electrically connected to the relay unit.

A test apparatus for a solid-state imaging device according to claim 7.

9. The splitting optical fiber bundle is fixed to one of the objects positioned with respect to the solid-state imaging device to be tested.

9. The test device for a solid-state imaging device according to claim 8.

10. The splitting optical fiber bundle is fixed to the relay means.

A test apparatus for a solid-state imaging device according to claim 9.

11. A coupling means for optically coupling the guide optical fiber bundle and the splitting optical fiber bundle,

The test head, the light source and the guide optical fiber bundle are movable with respect to the splitting optical fiber bundle and the relay unit.

The test device according to claim 8.

1 2. Electrical connection between the test head of the test device that irradiates the solid-state imaging device with test light to test the photoelectric conversion characteristics and the solid-state imaging device, and tests the photoelectric conversion characteristics of the solid-state imaging device A relay device for transmitting necessary signals to

Connection means for electrically connecting to a plurality of solid-state imaging devices positioned at predetermined positions;

An opening for irradiating each of the solid-state imaging devices with the test light; a plurality of optical fibers being bundled together at an input end and being bundled together at an output end; and a light source incident from the input end. Splitting the light into a plurality of lights at the output end, and a splitting optical fiber bundle for guiding each solid-state image sensor through the opening.

A relay device having the same.