TW200409987A - Optical lighting device, test device for solid-state imaging device and repeater - Google Patents

Optical lighting device, test device for solid-state imaging device and repeater Download PDF

Info

Publication number
TW200409987A
TW200409987A TW92130203A TW92130203A TW200409987A TW 200409987 A TW200409987 A TW 200409987A TW 92130203 A TW92130203 A TW 92130203A TW 92130203 A TW92130203 A TW 92130203A TW 200409987 A TW200409987 A TW 200409987A
Authority
TW
Taiwan
Prior art keywords
light
solid
fiber bundle
optical
state imaging
Prior art date
Application number
TW92130203A
Other languages
Chinese (zh)
Inventor
Shingo Tamai
Original Assignee
Inter Action Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inter Action Corp filed Critical Inter Action Corp
Publication of TW200409987A publication Critical patent/TW200409987A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The invention provides an optical lighting device capable of improving the photoelectric conversion characteristics and the test efficiency of a solid-state imaging element, and easily and accurately regulating the characteristics of a light applied to the solid-state imaging element. The optical lighting device comprises a light source 2 for emitting light; a splitting optical fiber bundle having a plurality of optical fibers bundled into one group at the input end thereof and into a plurality of groups at the output end thereof, and splitting a light entered via the input end from the light source into a plurality of lights at the output end; and an optical system unit 30 incorporating a plurality of independent optical systems for independently regulating light fluxes output from the output end of the splitting optical fiber bundle 20 and introducing them to a solid-state imaging element.

Description

200409987 五、發明說明(1) [發明所屬之技術領域]200409987 V. Description of the invention (1) [Technical field to which the invention belongs]

本發明有關於一種光照射裝置,將用於檢查C C D (Charge Coupled Device)及CMOS (ComplementaryThe invention relates to a light irradiation device, which will be used to inspect C C D (Charge Coupled Device) and CMOS (Complementary

Metal Oxide Semiconductor)等的固體攝影元件之特性 的檢查用光做照射。 [先前技術] 在CCD及CMOS等攝影元件的製造工程中,必須將種種 條件的光照射於攝影元件,並檢查其光電變換特性。Light is used to inspect the characteristics of solid-state imaging elements such as metal oxide semiconductors. [Prior art] In the manufacturing process of photographic elements such as CCDs and CMOS, it is necessary to irradiate light with various conditions to the photographic elements and check their photoelectric conversion characteristics.

CCD及CMOS等的攝影元件具有排列成二維狀的複數個 受光元件。為了檢查該等受光元件的特性是否分別保持於 所要求的範圍’必須以保持均一照度分佈的光照射於各受 光元件。若照射於各受光元件的光的照度不平均,在檢查 上會產生散亂不均’此亦為良率降低的原因。因此,在攝 影元件的檢查中,包持平均照度分佈的光的照射是重要 的0 那麼,為了提鬲攝影元件的檢查效率,必須同時檢查 複數個攝影兀件。在同時測定複數個攝影裝置時,例如, 擴大照射至包含不需來自光源之光線的廣泛區域,將複數 個攝影元件配置於該區域中而進行檢查。Photographic elements such as CCDs and CMOSs have a plurality of light-receiving elements arranged two-dimensionally. In order to check whether the characteristics of these light-receiving elements are maintained within the required ranges', it is necessary to irradiate the light-receiving elements with light having a uniform illumination distribution. If the illuminance of the light irradiated to each light-receiving element is uneven, scattered unevenness occurs during inspection ', which is also the cause of the decrease in yield. Therefore, in the inspection of the imaging element, the irradiation of light that holds the average illuminance distribution is important. Then, in order to improve the inspection efficiency of the imaging element, multiple imaging elements must be inspected at the same time. When measuring a plurality of imaging devices at the same time, for example, the radiation is extended to a wide area including light that does not need to come from a light source, and a plurality of imaging elements are arranged in the area to perform inspection.

在此狀況下’由於必須擴大使來自光源的光用於既定 之光學系而使照度分佈平均,因而使所照射的光的照度降 低,無法使充分照度的光對應於所要求的場所。 又,由於將光一併照射至複數個攝影元件,無法使光In this case, it is necessary to expand the use of light from a light source to a predetermined optical system to equalize the illuminance distribution, so that the illuminance of the irradiated light is reduced, and it is impossible to make the light of sufficient illuminance correspond to a required place. In addition, since the light is irradiated to a plurality of imaging elements together, the light cannot be made.

2197-5965-PF(Nl);Chentf.ptd 第5頁 200409987 五、發明說明(2) 學系的F值對應於複數個攝影元件獨立做調整,並對於複 數個攝影元件以獨立的光圖案進行照射。因此,欲使同時 照射於複數個攝影7L件的光之照度正確而平均是困難的。 [發明内容] 本發明之目的為提供一種光照射裝置,可提升固體攝 影元件的光電變換特性,並可容易而精度良好地調整對於 固體攝影元件所照射之光的特性。 本發明之另一目的為提供一種固體攝影元件的測試裝 置及其中繼裝置,可提升固體攝影元件的光電變換特性, 並可谷易而精度良好地調整對於固體攝影元件所照射之光 的特性。 ' 本毛月之光照射裝置為可將光同時照射體 攝影元件的ΐ照射裝置,具有:射出光的光源;複數個光 纖在輸入端集成一束且在輸出端集成複數束,從上述輸入 端入ί ΐ ΐ述ΐ源的光在上述輸出端分割成複數個光的分 割用技、’计,,兹攸上述分割用光纖束的輸出端輸出的光獨立 做凋:t入上述各攝影元件的複數個獨立光學系。 較佳的是,本發明之光照射裝置係如申請專利範圍第 1項所述之光照射裝詈,1i女u 2 + ώ μ、+、#、/5 π /、更八有共通光學系,共同調整 來自上述光源:入射於上述分割用光纖束的光。 又車=佳的Κ ’更具有光學構件,使 學系配J於以既定轴為中心的位置,並可以上述二為 中〜轉 可併變更上述複數個獨立光學系的構造。2197-5965-PF (Nl); Chentf.ptd Page 5 200409987 V. Description of the Invention (2) The F value of the department corresponds to the independent adjustment of a plurality of photographic elements, and the plurality of photographic elements are performed with independent light patterns. Irradiation. Therefore, it is difficult to make the illuminances of the light irradiated to a plurality of 7L pieces of photography simultaneously correct and average. [Disclosure of the Invention] An object of the present invention is to provide a light irradiation device that can improve the photoelectric conversion characteristics of a solid-state imaging element, and can easily and accurately adjust the characteristics of light irradiated by the solid-state imaging element. Another object of the present invention is to provide a test device and a relay device for a solid-state imaging device, which can improve the photoelectric conversion characteristics of the solid-state imaging device, and can easily and accurately adjust the characteristics of light irradiated by the solid-state imaging device. '' This hair moon light irradiating device is a radon irradiating device that can irradiate light to a body imaging element at the same time. The light from the source is divided into a plurality of light at the output end, and the light output technique is used to separate the light output from the output end of the optical fiber bundle for splitting: Plural independent optical systems. Preferably, the light irradiation device of the present invention is the light irradiation device described in item 1 of the scope of patent application, 1i female u 2 + FREE, +, #, / 5 π /, more common optical system Together adjust the light from the light source: the light incident on the splitting fiber bundle. In addition, the car's KK 'has more optical components, so that the department is equipped with J at a position centered on a predetermined axis, and the above two can be used as center to turn, and the structure of the plurality of independent optical systems can be changed.

2197-5965-PF(Nl);Chentf.ptd2197-5965-PF (Nl); Chentf.ptd

第6頁 200409987 五、發明說明(3) 又,本發明之光照射裝置更星 導引向上述分割用光纖束的導引用、=來自上述光源的光 引用光纖束與分割用光束做光學、纟士ΐ、ί束;以及將上述導 述導引用光纖束相對於上述分割用&纖,合裝置,至少上 本發明之固體攝影元件的測試裝置^為可移動。 於固體攝影元件而測試光電變換特=為將測試用光照射 攝影元件的測試裝置具有:測 將=裝置,該固體 元件與上述測試頭做電性連接,』傳::有測試固體攝影 件之光電變換特性之測試所必要 沾上述固體攝影疋 = 的光源;貫通上述測試頭,將來自光源的 裝置做電性連接的固體攝影元件的導引 光敏ί:月之固體攝影元件之測試襄置具有-導引用 、 ^ 根光纖在輸入端集成一束且在輸出端集成複 =於:上述輪入端入射之來自上述導引用光纖束的光在 輸出端分割成複數道光,並導向與上述中繼裝置做 性連接的固體攝影元件。 又,本發明之固體攝影元件之測試装置具有上述導引 用光纖束與上述分割用光纖束做光學結合的結合裝置;上 述測試頭、光源及導引用光纖束係可相對於上述分割用光 纖束及中繼裝置移動。 、 本發明之中繼裝置為將測試用光照射於固體攝影元件 並將測試光電變換特性之測試裝置的測試頭與上述固體攝 影元件做電性連接,且傳遞於上述固體攝影元件之光電變Page 6 200409987 V. Description of the invention (3) In addition, the light irradiation device of the present invention further guides the guide to the above-mentioned division fiber bundle, = the light from the above-mentioned light source uses the fiber bundle and the division beam to make optical, The optical fiber bundle cited above is movable relative to the above-mentioned splitting & fiber coupling device, at least the test device of the solid-state imaging element of the present invention. Testing photoelectric conversion on solid-state photographic elements = The test device for illuminating the photographic element with test light has: measuring device = device, the solid element is electrically connected to the above-mentioned test head, "Transfer :: There are The test of the photoelectric conversion characteristics is necessary to apply the above-mentioned solid-state imaging light source; to penetrate the above-mentioned test head, and to guide the light-sensing solid-state imaging element that is electrically connected to the device from the light source. -Guide, ^ one optical fiber is integrated at the input end and integrated at the output end = at: the light from the above-mentioned guide fiber bundle incident at the wheel-in end is divided into a plurality of light at the output end, and is directed to the relay The device makes a solid-state imaging element that is sexually connected. In addition, the test device of the solid-state imaging element of the present invention has the above-mentioned combining device for optically combining the lead optical fiber bundle and the split optical fiber bundle; the test head, light source, and lead optical fiber bundle may be The relay device moves. The relay device of the present invention is to irradiate the test light to the solid-state imaging element, and to electrically connect the test head of the test device for testing the photoelectric conversion characteristics to the above-mentioned solid-state imaging element, and transmit the photoelectric change to the above-mentioned solid-state imaging element.

2197-5965-PF(Nl);Chentf.ptd 200409987 試所必要之吼號的 複數個固體攝影元 用光照射向上述各 輸入端集成一束且 射之上述光源的光 述開口部導向上述 五、發明說明(4) 換特性之測 定位置上與 供上述測試 數個光纖在 述輸入端入 光,通過上 纖束。 在本發 端入射,在 光。來自各 整,並照射 有效地被利 均化。又, 以既定軸為 學構件,一 條件的光同 [實施方式] 明中,從光 輸出端對應 輸出端的光 於所對應的 用,照射至 在本發明中 中心的位置 併變更複數 時照射於複 源輸出 於複數 藉由個 攝影元 各固體 ’藉由 並可以 個獨立 數個攝 中繼裝置,具有:定位於既 件做電性連接的連接裝置; 固體攝影元件的開口部;複 在輸出端集成複數束,從上 在上述輪出端分割成複數道 各固體攝影元件的分割用光 的光自分割用光纖束的輸入 個攝影元件而分割成數道 別獨立的光學系獨立做調 件。/藉此’從光源輸出的光 攝影元件的光的照度分佈平 將複數個獨立光學系配置於 亡〒既定轴為中心轉動的光 光學系的構造,將變更種種 影元件。 以下,針對本發明之實施型能 第一實施型態 t心从圖式做詳細說明。 造。第!圖為本發明之-實施型態的光照射裝置的概略構 本實施型態的光照射裝置i,例4 广 ,」」· 、 1幻如,在CCD (charge coupled device )及CMOS等攝影开杜仏2197-5965-PF (Nl); Chentf.ptd 200409987 A plurality of solid-state photons necessary for the test are illuminated with light to each of the above-mentioned input terminals and a beam of light from the light source is directed to the above-mentioned five, Description of the invention (4) At the measurement position of the switching characteristic, a plurality of optical fibers for the above-mentioned test enter the light at the input end and pass through the fiber bundle. Incident at the origin, at light. From the whole, and the irradiation is effectively equalized. In addition, a predetermined axis is used as a learning component, and a conditional light is the same as in the [Embodiment]. The light from the light output end corresponding to the output end is irradiated to the position of the center in the present invention and changed when the plural is changed. The output of the complex source is in the complex number through the solid state of each photographic element, and the number of independent photographic relay devices can be provided with: a connection device positioned at the existing electrical connection; the opening of the solid-state imaging element; the complex output A plurality of beams are integrated at the end, and the light of the splitting light for each solid-state imaging element is divided into a plurality of lanes from the top of the wheel. The light beams from the division optical fiber bundle are divided into a number of independent optical systems to make independent adjustments. / With this, the light output from the light source has a flat illuminance distribution of the light. The arrangement of a plurality of independent optical systems on the optical optical system that rotates around a predetermined axis will change various shadow elements. Hereinafter, the first embodiment of the present invention will be described in detail with reference to the drawings. Made. Number! The figure shows a schematic configuration of the light irradiation device according to an embodiment of the present invention. The light irradiation device i according to this embodiment is widely used in the following examples, such as "CCD", "CCD", and CMOS (charge coupled device) and CMOS. Du Yan

僻〜&件的電氣特性的檢杳Inspection of electrical characteristics

2197-5965-PF(Nl);Chentf.ptd 第8頁 200409987 五、發明說明(5) 中,用光照射攝影元件的受光面。 本實施型態的光照射裝置1具有光源2,聚光鏡1 0,機 械狹縫1 1,ND濾光片轉盤12,彩色濾光片轉盤13,Frier 透鏡1 5,分割用光纖束2 0以及光學系單元3 0。 而且,光源2、聚光鏡1 〇,機械狹縫11 ’ N D濾光片轉 盤12,彩色濾光片轉盤13以及Frier透鏡15係收納於機箱 0B中,此構成本發明之共通光學系之一實施型態。又,光 學系單元3 0,如後所述,内藏有對應於複數個獨立光學系 之光學系。 光源2係使用例如鹵素燈、氙氣燈、金屬光燈等。該 光源2具有將發出的光於既定方向做反射集光之未圖示之 反射鏡。 聚光鏡10使來自光源2的光集中至機械狹縫11。 機械狹縫11,如第1圖所示,由兩片可動板11 A、11B 所構成,藉由可動板11 A、11 B的移動調整,而調整形成於 其間的開口 11 C的面積。藉由調整開口 11的面積,而調整 用集光鏡10所匯聚的光量。2197-5965-PF (Nl); Chentf.ptd page 8 200409987 5. In the description of the invention (5), the light receiving surface of the photographic element is illuminated with light. The light irradiation device 1 of this embodiment mode includes a light source 2, a condenser lens 10, a mechanical slit 11, an ND filter turntable 12, a color filter turntable 13, a Frier lens 15, a splitting fiber bundle 20, and an optical device.系 Unit 30. Furthermore, the light source 2, the condenser lens 10, the mechanical slit 11 ', the ND filter dial 12, the color filter dial 13, and the Frier lens 15 are housed in a cabinet 0B, which constitutes one embodiment of the common optical system of the present invention. state. The optical system unit 30 includes an optical system corresponding to a plurality of independent optical systems, as described later. The light source 2 is, for example, a halogen lamp, a xenon lamp, or a metal light lamp. The light source 2 has a reflector (not shown) which reflects the emitted light in a predetermined direction and collects the light. The condenser lens 10 focuses the light from the light source 2 to the mechanical slit 11. As shown in Fig. 1, the mechanical slit 11 is composed of two movable plates 11A and 11B, and the area of the opening 11C formed therebetween is adjusted by adjusting the movement of the movable plates 11A and 11B. By adjusting the area of the opening 11, the amount of light collected by the light collecting lens 10 is adjusted.

ND濾光片轉盤1 2係以支持軸1 4為中心可旋轉地被支 持。該ND濾光片轉盤12係沿圓周方向保持複數種的ND (Neutral Density)濾光片。ND濾光片將透過機械狹縫 來自光源的光,以不改變其分光組成而以既定之比例做減 光。使ND濾光片轉盤12轉動而推算,選擇所希望的減光 量。而且,ND濾光片轉盤1 2具有單一開口 ,在不做減光的 情況下,照樣通過該開口。The ND filter dial 12 is rotatably supported around a support shaft 14. The ND filter dial 12 holds plural types of ND (Neutral Density) filters in the circumferential direction. The ND filter will pass the light from the light source through the mechanical slit to reduce the light in a predetermined ratio without changing its spectral composition. The ND filter dial 12 is rotated to estimate and select a desired amount of light reduction. Furthermore, the ND filter dial 12 has a single opening, and passes through this opening without dimming.

2197-5965-PF(Nl);Chentf.ptd 第9頁 200409987 五、發明說明(6) 彩色濾光片轉盤1 3係以支掊批, 丁 又符釉1 4為中心可旋轉地被支 持。彩色濾光片轉盤1 3沿圓周方向保姓 七a 1 π 〇 h 1 . 门万句保持複數種的濾光片。 來自光源2的光,藉由通過彩色濾光 遽光片的波長的光。藉由彩色渡光片轉盤^生轉對動應;y算色 選擇;希望的彩色渡光片。而且,彩色渡光片具有單:開 口,在不遠擇波長的狀況下,照樣通過該開口。 F r i e r透鏡1 5為將单-透糕'辟i生丨山、 . ~灯平遂鏡縱^地配置成矩陣狀的光 学兀件。該F r 1 e r透鏡1 5係Α τ佔水& t 乐马了使來自光源2的光的照度分 佈平均化而設置。又,F r丨 类於 rrier逯鏡15具有矩形的外型。2197-5965-PF (Nl); Chentf.ptd Page 9 200409987 V. Description of the Invention (6) The color filter turntable 1 3 is supported by the support, and the Ding Fu glaze 14 is rotatably supported as the center. The color filter dial 1 3 protects the surname along the circumferential direction. Seven a 1 π 〇 h 1. The manta sentence holds plural kinds of filters. The light from the light source 2 passes through a color filter and a light having a wavelength of a calender. With the color dome sheet dial, you can respond to the changes; y calculate the color selection; the desired color dope sheet. In addition, the color doppler sheet has a single opening, through which the opening can still be passed without a long distance being selected. The F r i e r lens 15 is an optical element in which a single-transparent lens is arranged in a matrix shape. The F r 1 e r lens 1 5 series A τ occupant & t Lema is provided by averaging the illuminance distribution of light from the light source 2. F r 丨 is similar to rrier mirror 15 and has a rectangular shape.

上述之共通光學系具有調整來自光源2的光之光量、 照度、照度分佈、波長等的功能。 於此’第2圖表示分割用光纖束2〇的構造圖。第2八圖 為側視圖,第2B圖為第2A圖中A_A線的剖視圖。 分割用光纖束20係由多數個光纖的集束所構成。分割 用先,束20的-端係以支持構件21所支持。該支持構件21 將直徑50 /ΖΠ1的光纖集束成斷面尺寸為2〇mmx 2〇_的矩 形。而且,支持構件2丨係設於機箱〇B上。 分割用光纖束2 0係從中途分出複數(4根)個集束 2〇a,分出之複數條光纖束2〇a的端部 光件The above-mentioned common optical system has a function of adjusting the light amount, illuminance, illuminance distribution, wavelength, and the like of light from the light source 2. Here, 'FIG. 2' shows the structure of a split optical fiber bundle 20. As shown in FIG. Figure 28 is a side view, and Figure 2B is a cross-sectional view taken along line A_A in Figure 2A. The division optical fiber bundle 20 is composed of a bundle of a plurality of optical fibers. Segmentation First, the -end of the bundle 20 is supported by the support member 21. The supporting member 21 bundles optical fibers having a diameter of 50 / ZΠ1 into a rectangular shape having a cross-sectional size of 20 mm × 20 mm. Further, the supporting member 2 is provided on the chassis OB. The optical fiber bundle 20 for division is divided into a plurality of (4) bundles 20a from the middle, and the ends of the multiple optical bundles 20a that have been separated are optical components.

導光件23係連接於後述之光學系單元3m:2出3之 複數個光纖束2〇a之端部輸出的光導引至光學系單元3〇。 又構成各光纖束20A的光纖根數分別相等。 ^刀割用光纖束2 0的輸入端係如上所述其斷面為矩形。 該輸入端的形狀與上述之Frier透鏡15的外型大略相合。The light guide 23 is connected to the optical system unit 3m: 2 to 3 described later, and the light output from the end of the plurality of optical fiber bundles 20a is guided to the optical system unit 30. The number of optical fibers constituting each optical fiber bundle 20A is equal to each other. ^ The input end of the cutting fiber bundle 20 is rectangular as described above. The shape of the input end roughly matches the shape of the Frier lens 15 described above.

200409987 五、發明說明(7) ~ ' 士較分割用光纖束2 〇的輸入端斷面為圓形的狀況下,可提 南與Frier透鏡15的結合效率。 。光學系單元30如第1圖所示,獨立調整來自分割用光 纖束20各輸出端所輸出的光量、照度、照度分佈等的特 性’而輸出複數道獨立光線RL。該等光線RL分別照射至如 後所述配置於光學系單元3〇下方既定位置的應檢查的複數 個固體攝影元件的受光面上。 ^ 。第3人圖表示光學系單元30的内部構造。第3B圖為光學 糸單元3 0的構成元件。 如第3B圖所示’在光學系單元的下方設有平台 1 〇 〇 ’應檢查之攝影元件丨〇 1配置於該平台丨〇 〇上既定之位 置。該等攝影元件1 〇 1係連接於未圖示之測試裝置。 在光學系單元30的内部設有複數個獨立的光學系31。 光學系31係由透鏡32、Frier透鏡33、透鏡34、擴散板 35、中央渡光片36、成像透鏡37、38以及可變光圈轉盤 (iris turret ) 39 所構成。 而且,光學系31係對應於分割用光纖束2〇的四個輸出 端而設置之同時,可變光圈轉盤39係共通地設於四個光學 系中。200409987 V. Description of the invention (7) ~ 'In the case where the cross section of the input end of the fiber bundle 20 for splitting is round, the combining efficiency with the Frier lens 15 can be improved. . As shown in Fig. 1, the optical system unit 30 independently adjusts the characteristics of the amount of light, the illuminance, and the illuminance distribution 'from each output end of the split optical fiber bundle 20 to output a plurality of independent rays RL. These light rays RL are respectively irradiated on the light receiving surfaces of a plurality of solid-state imaging elements to be inspected, which are arranged at predetermined positions below the optical system unit 30 as described later. ^. The third figure shows the internal structure of the optical system unit 30. Fig. 3B shows the constituent elements of the optical chirp unit 30. As shown in FIG. 3B, ‘a platform is provided below the optical system unit’ and the photographic element to be inspected is arranged at a predetermined position on the platform. These photographic elements 101 are connected to a test device (not shown). A plurality of independent optical systems 31 are provided inside the optical system unit 30. The optical system 31 is composed of a lens 32, a frier lens 33, a lens 34, a diffuser 35, a central light sheet 36, imaging lenses 37, 38, and an iris turret 39. Further, while the optical system 31 is provided corresponding to the four output ends of the split optical fiber bundle 20, the variable aperture dial 39 is commonly provided in the four optical systems.

Frier透鏡33、擴散板35以及中央濾光片36係為了使 從分割用光纖束20支各輸出端通過導光件23而入射的光的 照度平均化所設置。而且,中央濾光片36為了防止光的照 度分佈向光斷面的周邊部逐漸降低,且為了斷面全區平均 化,向斷面中央部逐漸提高減光程度的濾光片。The Frier lens 33, the diffusion plate 35, and the center filter 36 are provided to equalize the illuminance of light incident from each of the output ends of the split optical fiber bundle 20 through the light guide 23. In addition, the central filter 36 is a filter that gradually reduces the degree of light reduction to the center of the cross section in order to prevent the illuminance distribution of light from gradually decreasing toward the peripheral portion of the light cross section and to average the entire area of the cross section.

200409987 五、發明說明(8) 又’各擴散板35以及各中水、击, 擇,使最終輪出的四道I央濾光片36係分別獨立做選 度、照度分佈等。例如為二:保持所希望的光量、照 量、照度以及照产八你一,、寺四道光RL彼此相等的光 3 6。 又刀 可選擇擴散板3 5以及中央濾光片 可變光圈轉盤39如第3圓 間隔形成面積相異的福ϋ所不’在圓周方向上沿一定 伟分別對庫於 / 個開σ〇Ρι〜0Ρ3。各開ορι〜〇Ρ3 係刀別對應於四個光學系31而設置。 萨由心達:『係以轉軸40為中心轉動。轉軸40係 措由馬違#驅動裝置而旋轉驅動。 進行可變光圈轉盤39的推算,對於 ===200409987 V. Description of the invention (8) In addition, each of the four diffuser plates 35 and each of the four water-repellent filters 36, which are selected in order to make the final rotation, has independent selection and illumination distribution. For example, two: keep the desired amount of light, irradiance, illuminance, and irreducible light, and the four lights RL of the temple are equal to each other. The knife can also choose the diffuser plate 35 and the central filter variable aperture dial 39, which are different from each other in the area of the third circle. ~ OP3. Each of the opening-type 3 blades is provided corresponding to the four optical systems 31. Sayu Shinta: "It rotates around the shaft 40. The rotating shaft 40 is rotated by a horse driving device. To calculate the variable aperture dial 39, for ===

擇開口 0Ρ1〜0Ρ3的其中之一光予系31而同針選 值。 併變更四個光學系3 1的F 接著’針對使用上述構造之弁 之檢查的一例做說明。 先照射裝置1的攝影元件 首先,對於光學系單元30將複數個( 配置於既定位置之同時,以光源2的光照射。m 件 光源2的光通過聚光鏡1〇,機械狹缝n,nd濾 盤12,衫色濾光片轉盤13以及卜丨^透鏡丨^並^光量、One of the openings OP1 ~ OP3 is selected as the light 31, and the value is selected by the same needle. Then, the F of the four optical systems 31 is changed. Next, an example of an inspection using the above structure will be described. First, the imaging element of the device 1 is irradiated. First, the optical system unit 30 is irradiated with light from the light source 2 while being arranged at a predetermined position. The light from the m light source 2 passes through the condenser lens 10, and the mechanical slit n, nd filters. Plate 12, shirt color filter turntable 13, and lens

照度、照度分佈、波長等做所希望的調整後,入八 用光纖束20。 』、刀口丨J 在分割用光纖束20中,將自支持構件側入射的光做 數地分割後’從導光件23輸出。此時,由於連接於導 23的分割用光纖束20的各輸出端的光纖根數彼此相 午 2197-5965-PF(Nl);Chentf.ptd 第12頁 200409987 五、發明說明(9) ' · 射於各導光件23的光的光量及照度大略相等。 通過分割用光纖束20而分別入射於複數個光學系3〇的 ’ 各光線,通過Frier透鏡33、擴散板35、中央瀘光片'36、 以及可變光圈轉盤39而獨立調整光量、照度分佈等特性。 藉此,通過複數個光學系30而輸出的各光在光量、明度等 特性彼此相等,該等光線分別入射於配置在平台丨〇 〇上的 複數個攝影元件的受光面。 藉此’由於特性相等且已調整的光入射於複數個固體 攝影元件的受光面,複數個攝影元件可在同一條件下同時 做檢查。 ' 如上所述’本實施型態中,使用分割用光纖束2〇,將<» 單一光源2的光分割成相等的複數道光,該分割後的光分 別用於獨立光學糸3 0做調整’並照射對應的固體攝影元 件。因此’可有效地利用光源2的光。此外,即使入射於 各光學系3 0的光產生照度差,由於在各光學系3 〇可分別獨 立做調整,因此可將同一條件的光同時照射複數個固體攝 影元件。 又,複數個光學系3 0係配置於對稱於轉軸4 〇的位置, 以該轉軸40為中心,例如可變光圈轉盤39等光學構件可旋 轉地設置,藉由該可變光圈轉盤3 9 —併變更複數個光學系 3 0的構造,藉此可同時變更照射於複數個固體攝影元件的 光的條件。 而且,在本實施型態中,雖然使用擴散板3 5及中央濾 光片36而调整入射各光學糸30的光的特性,由各光學夺3〇After making desired adjustments to the illuminance, illuminance distribution, wavelength, etc., the optical fiber bundle 20 is used. ”, Knife edge 丨 J In the splitting optical fiber bundle 20, the light incident from the support member side is divided into several numbers and is outputted from the light guide 23. At this time, since the number of optical fibers connected to the respective output ends of the splitting optical fiber bundle 20 of the guide 23 is at noon 2197-5965-PF (Nl); Chenf.ptd page 12 200409987 V. Description of the invention (9) The light amount and illuminance of the light on each light guide 23 are almost equal. The light rays that have been incident on the plurality of optical systems 30 through the splitting optical fiber bundle 20 are independently adjusted by the Frier lens 33, the diffuser 35, the central mirror sheet 36, and the variable aperture dial 39. And other characteristics. Thereby, each light output through the plurality of optical systems 30 is equal to each other in terms of light quantity, brightness, and the like, and the light rays are incident on the light receiving surfaces of a plurality of photographic elements arranged on the platform 〇〇〇. By this means, since the light having the same characteristics and adjusted are incident on the light-receiving surfaces of the plurality of solid-state imaging elements, the plurality of imaging elements can be inspected simultaneously under the same conditions. 'As described above' In the present embodiment, the splitting fiber bundle 20 is used to divide < »the light from a single light source 2 into equal plural light channels, and the divided light is used for independent optical adjustments of 3 0 for adjustment. 'And illuminate the corresponding solid-state imaging element. Therefore, the light of the light source 2 can be effectively used. In addition, even if the light incident on each optical system 30 has an illuminance difference, since each optical system 30 can be adjusted independently, it is possible to irradiate a plurality of solid-state imaging devices with light under the same conditions simultaneously. In addition, a plurality of optical systems 30 are arranged at positions symmetrical to the rotation axis 40, and with the rotation axis 40 as the center, optical members such as the variable aperture dial 39 are rotatably provided, and the variable aperture dial 3 9 — By changing the structure of the plurality of optical systems 30, the conditions of the light irradiated to the plurality of solid-state imaging elements can be changed at the same time. Furthermore, in this embodiment mode, although the characteristics of the light incident on each optical chirp 30 are adjusted using the diffusion plate 35 and the central filter 36, each of the optical lenses 30 is captured.

2197-5965-PF(Nl);Chentf.ptd 第13頁 2004099872197-5965-PF (Nl); Chentf.ptd p. 13 200409987

光有可肖b產生照度差,有必要在該狀況下進行 所輸出的 調整。 例如 止反射膜 度差的微 光學系30 而且 一條件的 用不同條 可。又, 之光線照 第二實施 ’將在玻璃 的濾光片配 調整。即, 中獨立做調 ,在本實施 光照射於複 件的光分別 除了複數個 射的對象物 型態 板等透明 置於各光 形成防止 整,藉此 型態中, 數個固體 照射於複 固體攝影 亦可適用 微 基板的兩面或單面上形成防 學系3 0的光路中,並進行照 反射膜的渡光片的片數在各 可進行照度差的微調整。 光照射裝置1雖然針對以同 攝影元件的狀況做說明,但 數個固體攝影元件的構造亦 元件以外,需要正確地調整 於光照射裝置1。There is a difference in illuminance due to light, and it is necessary to adjust the output in this situation. For example, the anti-reflection film has a different degree of micro-optical system 30 and different conditions may be used for one condition. In addition, the light is irradiated in the second embodiment, and the filter on the glass is adjusted. In other words, in this embodiment, the light is irradiated to the copy. In this embodiment, the light irradiated to the copy is placed on each light to prevent the formation of light. Solid-state photography can also be applied to the optical path where the defense department 30 is formed on both or one side of the micro-substrate, and the number of light-passing sheets that reflect the reflection film can be fine-tuned for each illuminance difference. Although the light irradiating device 1 will be described in terms of the same imaging element, the structure of several solid-state imaging elements is also required in addition to the element, and the light irradiating device 1 needs to be properly adjusted.

第4圖表示本發明之其他實施型態之適用於光照射 置的固體攝影元件的測試裝置的構造。 、 在第4圖中,測試裝置2〇〇例如檢查形成於晶圓4〇〇的 固體攝影元件(例如CCD )的光電變換特性。該測試裝置 2 0 0由桌面2 0 1、測試頭2 〇 1、探針板2 5 〇、移動平台2 6 〇 構成。 桌面2 0 1係官理測試頭2 0 1,並根據通過測試頭2 〇 1而 形成於晶圓4 0 0的固體攝影元件的訊號,進行固體攝影元 件4 0 1的檢查。 上。該測試頭2 0 1係與設 由驅動臂2 0 2的旋轉,測 頭2 0 1自基台2 0 5移動為例 測試頭2 0 1係設置於基台2 0 5 於基台20 5的驅動臂202連結,藉 試頭2 0 1從基台2 0 5移動。使測試Fig. 4 shows the structure of a test apparatus for a solid-state imaging element suitable for a light irradiation device according to another embodiment of the present invention. In FIG. 4, the test device 200 checks, for example, the photoelectric conversion characteristics of a solid-state imaging element (for example, a CCD) formed on a wafer 400. The test device 200 is composed of a table top 101, a test head 2 01, a probe card 2 5 0, and a mobile platform 2 6 0. The tabletop 201 is an official test head 201, and the solid-state imaging element 401 is inspected based on the signal of the solid-state imaging element formed on the wafer 400 by the test head 001. on. The test head 2 0 1 is set by the rotation of the driving arm 202, and the test head 2 1 is moved from the base 2 5 5 as an example. The test head 2 0 1 is set on the base 2 5 and the base 20 5 The driving arm 202 is connected, and the test head 2 01 is moved from the base 2 05. Make test

2197-5965-PF(Nl);Chentf.ptd 第14頁2197-5965-PF (Nl); Chentf.ptd p. 14

如於清潔維護時。 測試頭201係與狳、^ 電氣連接。測試頭士針板25G藉由未圖示之配線做 體攝影元件401的電如通過探針板250而施加於固 種訊號產生部,通過生器 '圖案產生器等的各 元件4〇1的訊號的浐入^ 而取得所測定的固體攝影 ” W Λ现的輸入部等所構成。 W ί Γί250係設置於測試頭201的下方之既定位置上。 25 = 固體攝影元件401護塾的探針 並將^试頭201與固體攝影元件做電性的連接。 ^忒抓針板250上,形成供將光線照射至複數個固體 攝影元件4(Π的開口2心,在該開口2_上設有後述= 子扠組30A。该光學模組3〇A係本發明之模組化的獨立光 系之一實施型態。 移動平台2 6 0夾持晶圓4 〇 0,並相對於探針板2 5 〇對該 晶圓40 0做定位。又,移動平台26〇在檢查終了後,將晶圓 400從探針板250隔離。 本實施型態之光照射裝置係由光源2、共通光學系 210、導引用光纖束220、耦合器221A、221B、分割用光纖 束225以及光學模組30A所構成。 光源2係設於測試頭2 0 2上,與第一實施型態之光源2 有相同的構造。 共通光學系2 1 0係設於測試頭2 〇 2上,與第一實施型態 之共通光學系具有相同的功能。 導引用光纖束2 2 0係設於測試頭2 0 2上,以多數條光纖Such as during cleaning and maintenance. The test head 201 is electrically connected to the 狳 and 狳. The test head needle plate 25G uses the wiring (not shown) as the imaging element 401 to apply electricity to the solid signal generation unit through the probe card 250, and passes the components of the generator 401 pattern generator and the like. The input of the signal is ^ to obtain the measured solid-state photography. ”W Λ is composed of an input unit and the like. W ί Γ 250 is set at a predetermined position below the test head 201. 25 = Probe protected by the solid-state imaging element 401 The ^ test head 201 is electrically connected to the solid-state imaging element. ^ 忒 The needle plate 250 is formed to form light for irradiating light to a plurality of solid-state imaging elements 4 (Π, and the opening 2 is provided on the opening 2_ It is described later = sub-fork group 30A. The optical module 30A is an implementation type of the modular independent optical system of the present invention. The mobile platform 260 holds the wafer 40,000 and is opposite to the probe. The plate 250 positions the wafer 400. The mobile platform 26o isolates the wafer 400 from the probe card 250 after the inspection is completed. The light irradiation device of this embodiment is composed of the light source 2 and the common optics. System 210, guide fiber bundle 220, couplers 221A, 221B, split fiber bundle 225, and optical module Group 30A. The light source 2 is provided on the test head 202, and has the same structure as the light source 2 of the first embodiment. The common optical system 2 10 is provided on the test head 200, and is the same as the first. The common optical system of the implementation type has the same function. The reference fiber bundle 2 2 0 is set on the test head 202, with a large number of optical fibers.

200409987 五、發明說明(12) 束構成’例如將直徑50 //m的光纖集束成斷面尺寸為2〇_ X 2Omm的矩形。 該導引用光纖束220將通過共通光學系21〇而入射的光 源2的光導向分割用光纖束225。 I馬合器2 2 1 A、2 2 1 B係由透鏡等光學元件所構成,結合 導引用光纖束220與分割用光纖束2 25。耦合器221A係設置 於導引用光纖束220側。耦合器221B係設置於分割用光纖 束225側。 柄合器221A、221B為本發明之結合裝置的一種實施形 態。 分割用光纖束2 2 5係設於基台2 0 5側,相對於探針板 250而做定位。該分割用光纖束225與第一實施形態的分割 用光纖束20相同的構造,耦合器22 1B側的端部係匯集成一 束,探針板2 5 0側的端部分割成複數個(四根),而分別 相對於光學模組30A而做定位。 第5圖光學模組3 0 A的構造之剖視圖。 如第5圖所示,光學模組30A具有突緣301、集光鏡 3 0 2、擴散板3 0 3、插銷孔板3 0 4。而且,雖然設置有複數 個光學模組3 0 A,但都具有相同的光學特性。 突緣301係由圓筒狀的元件構成,並固定於探針板25〇 上。突緣3 0 1係以金屬等的光無法穿透的材料形成。 集光鏡3 0 2、擴散板303以及插銷孔板304係保持於突 緣301的圓周内。 ' 集光鏡302將自上述分割用光纖束225導出的光源2的200409987 V. Description of the invention (12) Bundle configuration ′ For example, a bundle of optical fibers with a diameter of 50 // m is bundled into a rectangle with a cross-section size of 20_X 2Omm. The guide fiber bundle 220 guides the light from the light source 2 that has entered through the common optical system 21 to the fiber bundle 225 for division. The I coupler 2 2 1 A and 2 2 1 B are composed of optical elements such as a lens, and the optical fiber bundle 220 and the optical fiber bundle 225 for division are combined and introduced. The coupler 221A is provided on the guide fiber bundle 220 side. The coupler 221B is provided on the division optical fiber bundle 225 side. The handles 221A, 221B are an embodiment of the coupling device of the present invention. The splitting fiber bundle 2 2 5 is provided on the base 2 05 side and positioned relative to the probe card 250. This split optical fiber bundle 225 has the same structure as the split optical fiber bundle 20 of the first embodiment. The ends on the 1B side of the coupler 22 are gathered into a bundle, and the ends on the 2500 side of the probe card are divided into a plurality (four Root), and position the optical module 30A respectively. Fig. 5 is a sectional view of the structure of the optical module 30A. As shown in FIG. 5, the optical module 30A includes a flange 301, a light collecting lens 3 2, a diffusion plate 3 0 3, and a pin hole plate 3 0 4. Moreover, although a plurality of optical modules 30 A are provided, they all have the same optical characteristics. The flange 301 is composed of a cylindrical element and is fixed to the probe card 25. The flange 3 0 1 is formed of a material such as metal that cannot penetrate light. The light collecting mirror 302, the diffusion plate 303, and the pin hole plate 304 are held within the circumference of the flange 301. '' The light collecting mirror 302 extracts the light source 2

2197-5965-PF(Nl);Chentf.ptd 第16頁 2004099872197-5965-PF (Nl); Chentf.ptd Page 16 200409987

光L做集光。 擴散板303使通過集光鏡3〇2的光擴散,而 照度以及照度分佈。 工制先ΐ 插銷孔板304在光軸上形成插銷孔3()4ρ,通 303的光通過插銷孔304ρ而照射。藉此,檢查用的=昭反 於定位在插銷孔304ρ下方的固體攝影元件4〇1。 /^、 孔3 04ρ的直徑限定F值。 田違插领 在上述構造的測試裝置2 〇 〇中,做清潔維護時,如第6 圖所示,藉由使驅動臂旋轉,使測試頭2〇2從基台2〇 5上 動0The light L makes light collection. The diffuser plate 303 diffuses the light that has passed through the light-collecting mirror 302, and illuminance and illuminance are distributed. First, the pin hole plate 304 forms a pin hole 3 () 4ρ on the optical axis, and the light passing through 303 is irradiated through the pin hole 304ρ. Thereby, the inspection value is in contrast to the solid-state imaging element 401 positioned below the pin hole 304ρ. The diameter of the hole 3 04ρ defines the F value. Tian Weizheng In the test device 2000 with the above structure, when performing cleaning and maintenance, as shown in Fig. 6, the test head 200 was moved from the base 250 by rotating the driving arm.

在本實施形態中,從光源2到檢查對象的固體攝影元 件的光路’係以導引用光纖束22〇與分割用光纖束225所構 成’藉由耦合器221Α、221Β使兩者可分離地結合,藉此使 測試頭2 0 2為可移動。如本實施形態,在同時檢查複數個 固體攝影元件40 1的狀況下,從光學特性均一化的觀點,In the present embodiment, the optical path 'from the light source 2 to the solid-state imaging element to be inspected is constituted by a guide fiber bundle 22 and a division fiber bundle 225', and the two are detachably coupled by the couplers 221A and 221B Therefore, the test head 202 can be moved. As in this embodiment, when a plurality of solid-state imaging elements 401 are inspected at the same time, from the viewpoint of uniformizing optical characteristics,

光照射裝置的構成要素的位置關係是重要的。特別是相對 於探針板2 5 0的獨立光學系及分割用光纖束2 2 5的位置是重 要的。在本實施形態中,由於構成本發明之獨立光學系的 集光鏡30 2、擴散板3〇3以及插銷孔板304成一體化,可對 光學模組30Α與探針板250實施精度佳的位置配合。 而且’在本實施形態中,雖然針對使用導引用光纖束 220與分割用光纖束225兩者的場合做說明,例如,非同時 複數個做測試,而是對單一固體攝影元件4 〇 1做測試的場 合中,僅使用導引用光纖束220,亦可將測試用光導入單The positional relationship of the constituent elements of the light irradiation device is important. In particular, the position of the independent optical system and the splitting fiber bundle 2 2 5 with respect to the probe card 250 is important. In this embodiment, since the light collecting mirror 30 2, the diffuser plate 303, and the pin hole plate 304 constituting the independent optical system of the present invention are integrated, the optical module 30A and the probe plate 250 can be implemented with high accuracy. Position fit. Furthermore, in this embodiment, although the case where both the reference fiber bundle 220 and the splitting fiber bundle 225 are used is described, for example, a plurality of solid-state imaging elements 4 〇1 are not tested at the same time. In the case of using only the reference fiber bundle 220, the test light can also be introduced into a single unit.

2197-5965-PF(Nl);Chentf.ptd2197-5965-PF (Nl); Chentf.ptd

200409987200409987

一固體攝影元件4〇1。 、又’如本貫施形態,藉由光源2與共通光學系2 1 0設置 於測試頭20 2的外部,測試頭2〇2的體積並無擴大。 又由於成為熱源的光源2配置於測試頭2 〇 2的外部, 測試頭20 2内的各種基板不受熱的影響。 更進步,使導引用光纖束2 2 0貫通測試頭2 〇 2,由於 =源2的光藉由導引用光纖束22()導引至固體攝影元件4〇ι 々附:4η 1可二光的利用效率提升之同時,可使向各固體攝 〜7L件1…、射的光的F值的調整範圍擴 第三實施形態 ΑA solid-state imaging element 401. As in the conventional embodiment, the light source 2 and the common optical system 2 10 are provided outside the test head 202, and the volume of the test head 202 is not enlarged. In addition, since the light source 2 serving as a heat source is disposed outside the test head 202, various substrates in the test head 202 are not affected by heat. Further progress, the guide fiber bundle 2 2 0 penetrates the test head 2 〇2, because the light of the source 2 is guided to the solid-state imaging element 4 by the guide fiber bundle 22 (). Attachment: 4η 1 can be two light At the same time that the utilization efficiency is improved, the adjustment range of the F value of the light emitted from each solid to 7L pieces 1 ..., can be expanded. The third embodiment A

第7圖為本發明之中繼 視圖。而且,在第7圖中, 成部分使用相同的符號。 裝置之一實施形態之構造的剖 對於與第二實施形態相同的構 如第7圖所示之中繼裝置5〇〇, 出踹歸由氺風y z 〜 刀口」用九纖束2 2 5的輸 出鈿a由先學杈組3〇A而固定於形成於掇 部2 5 0 a。 从〜ί木針板2 5 0的各開n 明之:;裝設置的探·為本發 該中繼裝置5 0 0係 棟針板2 5 0及分割用光 的測試。Fig. 7 is a relay view of the present invention. In Fig. 7, the same symbols are used for the parts. The cross-section of the structure of one embodiment of the device. For the relay device 500, which is the same as the second embodiment, as shown in Fig. 7, it is released by the wind yz ~ knife edge. The output 钿 a is fixed to the hip part 250 a by the prior learning group 30A. From each of the wooden needle boards 2 5 0, it is clear that: the installed probe is the test of the relay device 5 0 0 of the building needle board 2 5 0 and the light used for division.

取代第二實施形態之測試裝置20 0之 纖束225使用,@進行固體攝影元件 藉由事先將分割用光纖走2 2 5 置的組厶戀沒〇 束疋位於探針板25〇 試裝置的組合變得容易,又 束225與探針板250不會錯位 …^ ^ υ υ JL., 即使在測試中,分割用3 200409987 五、發明說明(15) 又,由於探針板25〇與固體& 一 影元件與分割用光纖束225的凡件做定位,固體攝 特性安定的測試用光向固體 置-關係穩定。結果,可將 而且,在本每浐犯At 〜元件照射。 貝施形悲中,雖炒 出端經由光學模組3〇A而固定於‘、、、、刀割用光纖束225的輸 30A而採用直接將分割用光纖東$針板250,不用光學模組 250的構造亦可。 ^的輪出端固定於探針板 第四實施型態 第8圖表示本發明之測試 施型態。 、中之尨合裝置之另一實 八到用^"中’針對作為將導引用光纖束220與 ! = = = 故光學結合的結合裝置,並使用由光學 兀件所構成的耦合器221A、22^的狀況做說明。 杜,道^ Ξ i為了將均一條件的測試用光照射固體攝影元 '纖束22()的光軸0a以及分割用光纖束225的光 軸Ob必須做精密的結合。 但疋,由於測试頭2 0 2為可移動,導引用光纖束2 2 〇的 光軸0 a與分割用光纖束2 2 5的光軸〇 b不容易做精密的結 合0 因此’在本實施型態中,在光學元件2 2 1 A、2 2 1 B之間 使用Frier透鏡221C。由於Frier透鏡2 21C有使光的強度分 佈平均化的作用,即使導引用光纖束220的光軸〇a與分割 用光纖束225的光軸Ob有些許的錯位,也可吸收該錯位所 造成的影響。結果,可抑制由導引用光纖束22 0的光軸0aInstead of using the fiber bundle 225 of the test device 200 of the second embodiment, the @progress solid-state imaging element is placed in a group of 2 2 5 fibers in advance. The combination becomes easy, and the beam 225 and the probe card 250 will not be misaligned ... ^ ^ υ υ JL., Even in the test, the division is used 3 200409987 V. Description of the invention (15) Also, because the probe card 25 and the solid & A shadow element is positioned with the ordinary fiber bundle 225 for splitting, and the test light with stable solid-state imaging characteristics is placed in a solid-to-solid relationship. As a result, it is possible to irradiate the element At ~ to the element. In Bei Shi's sadness, although the fried end is fixed at 30A of the optical fiber bundle 225 for cutting through the optical module 30A, the optical fiber of the splitter is directly used for the needle board 250, without using an optical module. The structure of the group 250 is also possible. The outer end of the wheel is fixed to the probe card. Fourth embodiment Fig. 8 shows the test embodiment of the present invention. 2. Another practical application of the Zhongzhi coupling device ^ " Zhong 'is aimed at the optical fiber bundle 220 which is used as a guide and the = = = optical coupling device, and uses a coupler 221A composed of optical elements , 22 ^ 's situation will be explained. Du, Dao ^ Ξ i In order to irradiate the test light with uniform conditions, the optical axis 0a of the fiber bundle 22 () and the optical axis Ob of the splitting fiber bundle 225 must be precisely combined. However, since the test head 202 is movable, the optical axis 0 a of the optical fiber bundle 2 2 0 and the optical axis 0 b of the splitting optical fiber bundle 2 2 5 cannot be easily combined with each other. Therefore, in the present In the embodiment, a Frier lens 221C is used between the optical elements 2 2 1 A and 2 2 1 B. Since the Frier lens 2 21C has the function of averaging the intensity distribution of light, even if the optical axis Oa of the optical fiber bundle 220 and the optical axis Ob of the splitting optical fiber bundle 225 are slightly misaligned, it can absorb the misalignment caused influences. As a result, the optical axis 0a of the fiber bundle 22 0 guided by the guide can be suppressed.

2197-5965-PF(Nl);Chentf.ptd 第19頁 200409987 五、發明說明(16) 與分割用光纖束225的光軸〇b的錯位所造成的照射固體攝 影元件的測試用光之特性的混亂。 而且,本發明之結合裝置並不限定於該等實施型態, 亦可做種種的變更。 本發明並不限定於上述之實施型態。 在上述之實施型態中,作為本發明之中繼器及中繼裝 置’雖然針對探針板2 5 〇的狀況做說明,但本發明並不限 於此。 例如’檢查封裝於插接板(s 〇 c k e t b 〇 a r d )等的固體 攝影tl件之際使用’以及與探針板及插接板連接的主機板 =:於中繼裝置中。又,連接探針板、插接板以及主機板 莖二T作為中繼器及中繼裝置。將分割用光纖束固定於該 可構成本發明之中繼裝置。 而且,例如,以插接板作為中繼裝 中繼器係以插座構成。 明的 置的情況下,本發2197-5965-PF (Nl); Chentf.ptd Page 19,200409987 V. Description of the invention (16) The characteristics of the light used for testing the solid-state imaging element caused by the misalignment with the optical axis 〇b of the splitting fiber bundle 225 confusion. In addition, the coupling device of the present invention is not limited to these implementation modes, and various changes can be made. The invention is not limited to the embodiments described above. In the above-mentioned embodiment, although the repeater and the relay device 'according to the present invention are described with reference to the state of the probe card 250, the present invention is not limited to this. For example, ‘check the use of solid photography tl packaged in a plug-in board (s oc ek e t b 〇 a r d)’ and a motherboard connected to the probe board and plug-in board =: in a relay device. In addition, the probe board, the plug-in board, and the motherboard T are connected as a repeater and a relay device. The split optical fiber bundle is fixed to the repeater device of the present invention. Furthermore, for example, a plug-in board is used as a relay device. The repeater is constituted by a socket. Under the condition of the home

—认r 的貫施型態中,雖然針對分割用来_击F—Recognize the implementation type of r, although

疋於棟針板2 5 0的狀況下做說刀口J用先義束C 體攝影元件而做定位的對象,一 f於應做測試的固 ,(該探針實施探針板與應測試之固】^之日:圓的基1 ),以及檢查做封裝後的固攝衫兀件之定位 亦:。藉由此構造,可精確地:二::際所使用的心 之分割用光纖束的位置關 ’、、體攝影元件與應測言 發明之測試頭上,含而正確地做測試。又,在; 有加於測試半導體裝置的-般的疋 In the condition of the needle plate 2 5 0, say that the knife edge J is used as the object for positioning by using the pre-defined beam C-body imaging element, and the f should be tested. (The probe is implemented with a probe plate and should be tested. [Solid] ^ Day: Round base 1), and the positioning of the solid camera shirt components after inspection and packaging :. With this structure, it is possible to accurately: two: the position of the optical fiber bundle used for the division of the heart, the volume photography element, and the test head of the invention, the test can be performed accurately. Again, there are

200409987 五、發明說明(17) 頭上,與該等測試頭具有同樣、類似的功能的均等物。 產業上之利用性 本發明可利用於固體攝影元件之光電變換特性的測 試。 ΪΒ1Ι 2197-5965-PF(Nl);Chentf.ptd 第21頁 200409987 圖式簡單說明 第1圖本發明之一實施型態之光照射裝置的概略構造 圖。 第2A圖至第2B圖表示分割用光纖束的構造。 第3A圖至第3B圖表示光學系單元的内部構造以及光學 系單元的構成元件。 第4圖表示另一實施型態中適用於光照射裝置的固體 攝影元件之測試裝置的構造。 第5圖為光學模組之構造的剖視圖。 第6圖表示使測試裝置之測試頭移動的狀態。 第7圖表示本發明之中繼裝置之一實施型態之構造的 剖視圖。 第8圖表示本發明之測試裝置中之結合裝置的其他實 施型態。 符號說明 1〜光照射裝置; 1 0〜聚光鏡; 11A、11B〜可動板; 12〜ND濾光片轉盤; 1 4〜支持軸; 2 0、2 2 5〜分割用光纖 2 1〜支持構件; 3 0〜光學系單元; 3 1〜光學系; 2〜光源; 11〜機械狹縫; 11 C〜開口; 1 3〜彩色濾光片轉盤 15〜Frier透鏡; 束;2 0 a〜光纖束; 23〜導光件; 30A〜光學模組; 100〜平台;200409987 V. Description of the invention (17) On the head, the equivalent of these test heads has the same and similar functions. Industrial Applicability The present invention can be used for testing the photoelectric conversion characteristics of solid-state imaging elements. ΪΒ1Ι 2197-5965-PF (Nl); Chentf.ptd Page 21 200409987 Brief Description of Drawings Fig. 1 is a schematic diagram of a light irradiation device according to an embodiment of the present invention. Figures 2A to 2B show the structure of a split fiber bundle. 3A to 3B show the internal structure of the optical system unit and the constituent elements of the optical system unit. Fig. 4 shows the structure of a test device for a solid-state imaging element suitable for a light irradiation device in another embodiment. FIG. 5 is a cross-sectional view showing the structure of the optical module. Fig. 6 shows a state where the test head of the test device is moved. Fig. 7 is a sectional view showing the structure of one embodiment of the relay device of the present invention. Fig. 8 shows another embodiment of the combination device in the test device of the present invention. DESCRIPTION OF SYMBOLS 1 ~ light irradiation device; 10 ~ condenser lens; 11A, 11B ~ movable plate; 12 ~ ND filter turntable; 14 ~ support shaft; 20, 2 2 5 ~ division optical fiber 2 1 ~ support member; 3 0 ~ optical system unit; 3 1 ~ optical system; 2 ~ light source; 11 ~ mechanical slit; 11 C ~ opening; 1 ~ 3 ~ color filter turntable 15 ~ Frier lens; beam; 2 0 a ~ fiber bundle; 23 ~ light guide; 30A ~ optical module; 100 ~ platform;

2197-5965-PF(Nl);Chentf.ptd 第22頁 200409987 圖式簡單說明 32〜透鏡; 3 4〜透鏡; 3 6〜中央濾光片; 3 9〜可變光圈轉盤; 1 0 1〜固體攝影元件; 201〜桌面; 2 0 5〜基台; 220〜導引用光纖束; 221C 〜Frier 透鏡; 2 5 0 a〜開口; 2 6 0〜移動平台; 3 0 3〜擴散板; 3 0 4 p〜插銷孔; 4 0 1〜固體攝影元件; OP1至OP3〜開口。 33〜Frier透銳; 3 5〜擴散板; 3 7、3 8〜成像透鏡; 4 0〜轉轴; 2 0 0〜測試裝置; 2 0 2〜測試頭; 2 0 7〜驅動臂; 221 A、221B〜耦合器; 2 5 0〜探針板; 2 5 1〜探針; 3 0 1〜突緣; 3 0 4〜插銷孔板; 4 0 0〜晶圓; 5 0 0〜中繼裝置;2197-5965-PF (Nl); Chentf.ptd Page 22, 200409987 Schematic description of 32 ~ lens; 3 4 ~ lens; 3 6 ~ central filter; 3 9 ~ variable aperture dial; 1 0 1 ~ solid Photographic element; 201 ~ Desktop; 2 05 ~ Abutment; 220 ~ Guide fiber bundle; 221C ~ Frier lens; 2 50 ~ A opening; 2 60 ~ Mobile platform; 3 0 ~ 3 ~ Diffuse plate; 3 0 4 p ~ latch hole; 401 ~ solid imaging element; OP1 to OP3 ~ opening. 33 ~ Frier transparent; 3 5 ~ diffuser plate; 3 7, 3 8 ~ imaging lens; 40 ~ rotating shaft; 2 0 ~ test device; 2 2 ~ test head; 2 7 ~ drive arm; 221 A 221B ~ coupler; 250 ~ probe board; 2 51 ~ probe; 3101 ~ flange; 3304 ~ pin hole plate; 400 ~ wafer; 500 ~ relay device ;

2197-5965-PF(Nl);Chentf.ptd 第23頁2197-5965-PF (Nl); Chentf.ptd p. 23

Claims (1)

200409987 六、申請專利範圍 1 · 一種光照射裝置,為可將光同時照射於複數個固體 攝影元件的光照射裝置,包括: 一射出光的光源; 一分割用光纖束,複數個光纖在輸入端集成一束且在 輸出端集成複數束,從上述輸入端入射之上述光源的光在 上述輸出端分割成複數道光;以及 複數個獨立光學系,從上述分割用光纖束的輸出端輸 出的光獨立做調整,並導入上述各攝影元件。 2.如申請專利範圍第丨項所述之光照射裝置,其更包 括-共通光學系,纟同調整來自上述光源而人射於上 割用光纖束的光。 3·如申請專利範圍第丨項所述之光照射裝置,其更包 括一光學構件,使上述複數個獨立光學系配置於以既定軸 為中心的位置,並可以上述既定軸為中心轉動,又可一 變更上述複數個獨立光學系的構造。 • 4·如申請專利範圍第丨項所述之光照射裝置,其更包 向上述分 光束做光 一導引用光纖束,將來自上述光源的光導引 割用光纖束;以及 一結合裝置,將上述導引用光纖束與分割用 學結合; 至少上述導弓丨用光纖束相對於上述分割用光纖束為可移 5.如申請專利範圍第1項所述之光照射裝置,其中上200409987 VI. Scope of patent application1. A light irradiation device is a light irradiation device that can simultaneously irradiate light to a plurality of solid-state imaging elements, including: a light source emitting light; a splitting optical fiber bundle, and a plurality of optical fibers at an input end Integrate a beam and a plurality of beams at the output end, and the light from the light source incident from the input end is divided into a plurality of light at the output end; and a plurality of independent optical systems, the light output from the output end of the division fiber bundle is independent Make adjustments and import each of the above photographic elements. 2. The light irradiation device according to item 丨 of the patent application scope, further comprising a common optical system, which adjusts the light from the above-mentioned light source and the light emitted by a person to the optical fiber bundle for up-cutting. 3. The light irradiation device as described in item 丨 of the patent application scope, further comprising an optical component, so that the plurality of independent optical systems are arranged at a position centered on a predetermined axis, and can be rotated around the predetermined axis, and The structure of the plurality of independent optical systems can be changed at one time. • 4. The light irradiation device as described in item 丨 of the scope of the patent application, which further includes the above-mentioned partial beam as a light guide and a reference fiber bundle, and guides and cuts the optical fiber bundle from the light source; and a combination device, which The above-mentioned optical fiber bundle is combined with the science of division; at least the above-mentioned optical fiber bundle for the guide bow is movable relative to the above-mentioned optical fiber bundle for division. 5. The light irradiation device according to item 1 of the scope of patent application, wherein 200409987 六、申請專利範圍 述結合裝置具有Frier透鏡。 如申請專利範圍第】項所述之光照 述複數個獨立光學系係分別模組化。 直,、甲上 於固固體攝影元件的測試裝置’為將測試用光昭射 攝影元件的測試裝置包括: H“置’該固體 一測試頭; 一中繼裝置,將所有測試固體攝影、 做電性連接,廿值、慮^A L + 、 件人上述測試頭 之測試所必要之訊號; 件之先電變換特性 一光源,設於上述測試頭外部;以及 一導引用光纖束,貫通上述測試頭,將 導向與上述中繼裝置做電性連接的固體攝费元件。〜, 利範圍第7項所述之固體攝影元件的測試 2—走日一導引用光纖束,複數根光纖在輸人端集 H在輸出端集成複數束,從上述輪入端入射之來自 引用光纖束的光在上述輸出端分割成複數道光並 ν向與上述中繼裝置做電性連接的固體攝影元件。 # 9·如申請專利範圍第8項所述之固體攝影元件的測試 衣置其中上述为割用光纖束係固定於任何相對於應做測 試之固體攝影元件而做定位的對象物。 1 0 ·如申凊專利範圍第9項所述之固體攝影元件的測試 裝置,其中上述分割用光纖束係固定於上述中繼裝置上。 1 1 ·如申請專利範圍第8項所述之固體攝影元件的測試200409987 6. Scope of patent application The combined device has a Frier lens. The illumination as described in the item [Scope of the patent application], the plurality of independent optical systems are respectively modularized. The test device for direct and solid-state solid-state photographic elements is a test device for testing the photo-reflective photographic element including: H "places" the solid and a test head; a relay device that takes all the solid-state photographs and makes electricity. The signal is necessary for testing the above-mentioned test heads; the first electrical conversion characteristic of the parts is a light source, which is set outside the above-mentioned test heads; and a guide quotes the optical fiber bundle and passes through the above-mentioned test heads. , Will guide the solid-state imaging device electrically connected to the relay device. ~, Test of the solid-state imaging device described in item 7 of the scope of interest 2-The first guide refers to the optical fiber bundle, and multiple optical fibers are on the input side. Set H integrates a plurality of beams at the output end, and the light from the reference fiber bundle incident from the wheel-in end is divided into a plurality of light at the output end and v is a solid-state imaging element electrically connected to the relay device. # 9 · The test clothing of the solid-state imaging device according to item 8 of the scope of the patent application, wherein the above-mentioned cutting optical fiber bundle is fixed to any position relative to the solid-state imaging device to be tested. 1 0 · The solid-state imaging device testing device according to item 9 of the patent application scope, wherein the optical fiber bundle for division is fixed to the relay device. 1 1 · as item 8 of the patent application scope Testing of said solid-state imaging elements 200409987 六、申請專利範圍 裝置’其更包括一結合裝置,將上述 分割用光纖束做光學結合;上述測^ 5丨用光纖束與上述 纖束係可相對於上述分割用光杏=項、光源及導引用光 12. -種中繼裝置,為將测試用光二繼裝置移動。 件並將測試光電變換特性之測$ “、、射於固體攝影元 攝影元件做電性連接,且傳遞;:述與土述固體 括: 現的中繼裝置,該中繼裝置包 件做電性連ί 4 & Μ % &置上與複數個固體攝影元 件;;;Γ部’供上述測試用光照射向上述各固體攝影元 一分割用光纖束,複數個光纖在輪入 輸出端集成複數束,從上述輸端 /、 在 上述輸出端分割成複數道ί輸通:::㈡=光* 固體攝影元件。 1開口 4導向上述各 第26頁 2197-5965-PF(Nl);Chentf.ptd200409987 VI. Applicable patent range device 'It further includes a combination device that optically combines the above-mentioned splitting optical fiber bundles; the above measurement ^ 5 丨 The use of optical fiber bundles and the above-mentioned fiber bundles can be compared with the above-mentioned splitting optical devices = item, light source And guide light 12.-A relay device for moving the optical secondary device for testing. And test the optical-electrical conversion characteristics of the solid-state photo element, and make electrical connections, and pass; the solid state and the solid state include: the current relay device, the relay device package for electricity Sexual connection 4 & Μ% & put on and a plurality of solid-state imaging elements ;; Γ part 'for the above-mentioned test light to irradiate a fiber bundle for splitting each of the solid-state imaging elements, a plurality of optical fibers at the output Integrate a complex beam and split it into multiple channels from the above input / output at the above output: :: ί = 光 * solid-state imaging element. 1 opening 4 leads to each of the above pages 2197-5965-PF (Nl); Chentf.ptd
TW92130203A 2002-10-31 2003-10-30 Optical lighting device, test device for solid-state imaging device and repeater TW200409987A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002317731 2002-10-31

Publications (1)

Publication Number Publication Date
TW200409987A true TW200409987A (en) 2004-06-16

Family

ID=32211733

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92130203A TW200409987A (en) 2002-10-31 2003-10-30 Optical lighting device, test device for solid-state imaging device and repeater

Country Status (3)

Country Link
AU (1) AU2003280637A1 (en)
TW (1) TW200409987A (en)
WO (1) WO2004040266A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399528B (en) * 2007-09-21 2013-06-21 Hon Hai Prec Ind Co Ltd Holding apparatus for spectrum measurement
CN108871570A (en) * 2018-09-21 2018-11-23 苏州华兴源创科技股份有限公司 A kind of optic probe
CN112748558A (en) * 2020-12-31 2021-05-04 中国科学院西安光学精密机械研究所 Wide-spectrum large-dynamic-range optical system and test calibration method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100649011B1 (en) * 2004-12-30 2006-11-27 동부일렉트로닉스 주식회사 Image sensor using the optic fiber
CN107727664B (en) * 2017-11-30 2021-04-13 四川恒匀通科技有限公司 Metal plate visual detection acquisition terminal and method
CN109799235A (en) * 2019-03-12 2019-05-24 中国工程物理研究院激光聚变研究中心 Imaging device and imaging method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000292310A (en) * 1999-04-08 2000-10-20 Sony Corp Inspection device and its method
JP2002008405A (en) * 2000-06-21 2002-01-11 Moritex Corp Lighting equipment and lighting optical system
JP2002214072A (en) * 2001-01-15 2002-07-31 Nikon Corp Light irradiation device and inspection device using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399528B (en) * 2007-09-21 2013-06-21 Hon Hai Prec Ind Co Ltd Holding apparatus for spectrum measurement
CN108871570A (en) * 2018-09-21 2018-11-23 苏州华兴源创科技股份有限公司 A kind of optic probe
CN112748558A (en) * 2020-12-31 2021-05-04 中国科学院西安光学精密机械研究所 Wide-spectrum large-dynamic-range optical system and test calibration method

Also Published As

Publication number Publication date
AU2003280637A1 (en) 2004-05-25
AU2003280637A8 (en) 2004-05-25
WO2004040266A1 (en) 2004-05-13
WO2004040266A8 (en) 2005-03-10

Similar Documents

Publication Publication Date Title
US8403527B2 (en) Light emitting diode projector
CN202008060U (en) Sunlight irradiation simulating device
KR102373287B1 (en) Telecentric bright field and annular dark field seamlessly fused illumination
WO2014209702A1 (en) Light emitting diode linear light with uniform far field
KR20130096233A (en) Lighting system
WO2005010461A1 (en) Position detection device, position detection method, test device, and camera module manufacturing device
KR20110128750A (en) Advanced inspection method utilizing short pulses led illumination
KR20050085408A (en) Instrument for testing solid-state imaging device
US20070206195A1 (en) Apparatus for the determination of surface properties
TW200409987A (en) Optical lighting device, test device for solid-state imaging device and repeater
JP2004266250A (en) Testing apparatus for solid-state imaging device, repeater, and optical module
CN110140071A (en) Light supply apparatus, light source control method and image capturing system
JP2005195348A (en) Illumination optical apparatus
CN113271405B (en) Wafer calibration camera and probe station with same
KR20020093507A (en) Apparatus for inspecting parts
CN114636545A (en) Wide-spectrum objective lens vertical axis chromatic aberration detection system and method and semiconductor device
JP2004172595A (en) Photoirradiation apparatus, test apparatus of solid state imaging device, and relay device
JP2022145349A (en) Optical system and optical test device
JP2003156406A (en) Lighting optical system and lighting system for solid state image sensing device
JP2582733Y2 (en) Lighting auxiliary equipment
JP2002353474A (en) Apparatus and method for measuring internal quantum efficiency of solar battery
CN115289419B (en) Wide-band telecentric illumination imaging system and wafer detection equipment
CN215340525U (en) Observation device for oxidation aperture of chip
KR102361925B1 (en) Optical device
CN1444099A (en) Light source element, illuminating device, exposure device and method