TW201903319A - Illumination assembly with reduced alignment tolerance - Google Patents

Illumination assembly with reduced alignment tolerance Download PDF

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Publication number
TW201903319A
TW201903319A TW107110413A TW107110413A TW201903319A TW 201903319 A TW201903319 A TW 201903319A TW 107110413 A TW107110413 A TW 107110413A TW 107110413 A TW107110413 A TW 107110413A TW 201903319 A TW201903319 A TW 201903319A
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Taiwan
Prior art keywords
light sources
point light
substrate
assembly
temporary holder
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TW107110413A
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Chinese (zh)
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TWI742264B (en
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麥可 戴克斯
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荷蘭商露明控股公司
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Publication of TWI742264B publication Critical patent/TWI742264B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
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    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/29111—Tin [Sn] as principal constituent
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/83815—Reflow soldering
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95001—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
    • H—ELECTRICITY
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2924/151—Die mounting substrate
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
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    • H05K2203/16—Inspection; Monitoring; Aligning
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The invention describes an relates to a method (100) providing a lighting assembly (10) comprising the steps of providing (110) the pre-assembly (1) of an array of point like light sources (2) with a three-dimensional positioning accuracy having position tolerances in the range of 20[mu]m or less between the point-like light sources (2), where each of the point-like light sources (2) having an light emitting side (21) and contacting backside (22) for electrically contacting and being reversibly mounted on a temporary holder (4) with their emitting surfaces (21), providing (120) the substrate (3) comprising an array of electrical substrate contacts (32) being aligned to the position of the point-like light sources (2) on the temporary holder (4) and simultaneously mounting (130) the contacting backsides (22) of the point-like light source (2) on the electrical substrate contacts (32) of the substrate (3) maintaining the positioning accuracy of the pre-assembly (1).

Description

具有減小對位公差之照明總成Lighting assembly with reduced alignment tolerance

本發明係關於一種提供具有高三維位置準確度之一照明總成之方法，係關於一種在此方法中用作一等級1產品之預組裝件及係關於一種具有高三維位置準確度之照明總成。The present invention relates to a method of providing a lighting assembly with high three-dimensional position accuracy, to a pre-assembly used as a level 1 product in this method, and to a lighting assembly with high three-dimensional position accuracy to make.

在汽車外部照明中，功能ADB (自適應頭燈系統(adaptive driving beam))或矩陣燈變得愈來愈流行。包括作為點狀光源之LED之常見發光總成仍需要一主光學件，此係因為發光區域之間之距離受封裝(側塗層之邊緣)限制。對於無主光學件之一直接投影系統，兩個點狀光源之間之距離應為≤100 µm。 具有近間隔LED之一自適應頭燈系統之應用實現無預凖直器光學元件之一直接投影。在緊密間隔發射器之一陣列中待克服的一個技術挑戰係安裝後位置公差(例如當在一等級2板上使用多個單一LED時之表面安裝總成之焊接後位置公差)。用於光束投影之LED像素位置對光束效能具有影響，並需要針對組裝程序之低位置公差。一主光學透鏡之對位可用於在模組組裝期間補償全矩陣陣列之位置，然而在LED陣列之組裝期間，已無法調整個別LED之位置，且LED間位置需要精確控制。取決於設計及焊接程序，在一標準表面安的技術(SMT)組裝之後之一典型LED間公差將在100 µm之範圍中。另外，如同具有兩個底部焊料接點之Luxeon Neo或WLP晶片之小單一發射器在回焊(reflow-soldering)期間趨於旋轉並傾斜。 期望獲得適於提供無需預凖直器光學元件之一自適應頭燈系統之一發光總成，其中個別光源以發射表面彼此間之一更佳三維位置準確度及更佳對位安裝，避免個別光源之不可接受傾斜及旋轉。In automotive exterior lighting, functional ADB (adaptive driving beam system) or matrix lights have become increasingly popular. Common light-emitting assemblies including LEDs as point light sources still require a main optical component because the distance between the light-emitting areas is limited by the package (the edge of the side coating). For a direct projection system without one of the main optics, the distance between two point light sources should be ≤100 µm. The application of an adaptive headlight system with close-spaced LEDs enables direct projection of one of the optical elements without pre-straighteners. One technical challenge to be overcome in an array of closely spaced emitters is post-mount position tolerance (for example, post-weld position tolerance of surface mount assemblies when multiple single LEDs are used on a level 2 board). The position of the LED pixels used for beam projection has an impact on beam performance and requires low position tolerances for the assembly process. The alignment of a main optical lens can be used to compensate the position of the full matrix array during the assembly of the module. However, during the assembly of the LED array, the position of the individual LEDs cannot be adjusted, and the position between the LEDs needs to be precisely controlled. Depending on the design and welding procedure, a typical inter-LED tolerance after assembly in a standard surface mount technology (SMT) will be in the range of 100 µm. In addition, small single emitters like Luxeon Neo or WLP wafers with two bottom solder joints tend to rotate and tilt during reflow-soldering. It is desirable to obtain a light-emitting assembly suitable for providing an adaptive headlight system that does not require pre-straightener optics, in which individual light sources have better three-dimensional position accuracy and better alignment installation with one of the emission surfaces to avoid individual The light source is not acceptable for tilt and rotation.

本發明之一目的係提供一種發光總成，其適於提供無需預準直器光學元件之一自適應頭燈系統，其中個別點狀光源以發射表面彼此間之一更佳三維位置準確度安裝，避免個別點狀光源之不可接受未對位。 本發明係由獨立技術方案定義。附屬技術方案定義有利實施例。 根據一第一態樣，提供一種提供一照明總成之方法，該照明總成包括以高三維位置準確度配置於一基板上之點狀光源之一陣列。該方法包括以下步驟： 以具有在該等點狀光源之間之20 µm或更小之範圍中之位置公差之一三維位置準確度提供點狀光源之一陣列之一預組裝件，其中該等點狀光源之各者具有一發光側及用於電接觸該點狀光源之接觸背側並憑藉其等發射表面可逆地安裝於一臨時固持器上； 提供具有包括電基板接點之一陣列之一接觸表面之該基板，其中該等電基板接點經對位至該臨時固持器上之該等點狀光源之位置；及 同時將仍安裝至該臨時固持器之該點狀光源之該等接觸背側安裝於該基板之該等電基板接點上以能夠操作維持該預組裝件之該位置準確度之該照明總成。 術語「點狀光源」表示具有一小發光面積(或體積)並具有提供一基本上非導向發光之一寬發射錐體之任何光源。此等點狀光源可為LED或半導體雷射(例如量子井或點)。該照明總成可包括點狀光源之一陣列(例如一LED陣列)。點狀光源之陣列可包括多行及多列點狀光源。配置於該等列及/或行中之點狀光源之數目取決於該照明總成之特定應用。該等點狀光源之該背側應經適於接觸至該等基板接點，其中該背側可經結構化以提供用於將該等點狀光源電連接至一電源之分離接觸墊。 術語「三維位置準確度」表示與相對於該等點狀光源之橫向位置、其等垂直位置(垂直於橫向位置)之一期望三維位置之偏離，該等點狀光源之傾斜表示該等點狀光源之該發射表面相對於由一平均發射表面界定之一橫向平面之一對位且該等點狀光源相對於該期望位置之一旋轉表示圍繞垂直於該等點狀光源之該發射表面之一旋轉軸之一旋轉。在無傾斜之一理想情況中，所有發射表面彼此平行。指定的公差表示與該期望位置之偏離，其中在傾斜或旋轉之情況中，該公差表示該發射表面與其預期位置之最大偏離。 該基板可為提供電路以將該基板接點連接至其他組件之一基板。該基板可由適於承載電接點及適於分離該電接點之任何材料(諸如玻璃、塑膠等)製成。該基板可為印刷電路板PCB或隔離金屬基板IMS。該基板亦可用於汲取來自該等光源之熱，以便冷卻該總成。 該臨時固持器可由適於可靠地維持該等固定點狀光源之位置之任何材料製成。由於在操作該照明總成之前移除該臨時固持器，故該臨時固持器無需滿足任何特定電或光學性質。 本發明可用於遠光燈/近光燈及ADB (自適應頭燈系統)或矩陣光束或矩陣燈應用之汽車燈。此可由如LED之點狀光源之近間距矩陣陣列、寬間距矩陣及客製化矩陣解決方案構成。此外，本發明可用於多晶片LED等級1封裝(可單獨定址或不可單獨定址)以改良發光位置之位置公差並減小發光區域(LEA)之間之距離。此不僅限於汽車，而且亦可用於閃光燈、普通照明、投影系統及用於具有其他點狀光源之多晶片LED或配置之任何其他應用。 根據本發明之方法提供一種適於提供無需預準直器光學元件之一自適應頭燈系統之發光總成，其中該等個別點狀光源以在20 µm或更小之範圍中之該等發射表面彼此間之一更佳三維位置準確度安裝，避免該等個別點狀光源之不可接受未對位。根據其中焊料自對位導致＞50 µm之公差之當前技術之情況係典型的，難以達成改良。 該方法可經配置使得藉由一表面安裝技術而執行安裝步驟。表面安裝技術(SMT)係一種用於產生電路之方法，其中組件經安裝或直接放置於基板(例如一印刷電路板(PCB))之表面上。一電子組件被稱為一表面安裝裝置(SMD)。在產業中，電子組件已經大體上替代裝配組件之通孔技術建構方法，其中導線導引至電路板中之孔中。然而，兩種技術可用於相同印刷電路板上，其中通孔技術用於不適於表面安裝之組件，諸如大型變壓器及散熱功率半導體。應用運用SMT之安裝步驟之照明總成小於其通孔對應物。該等點狀光源可具有各種類型之短引腳或引線、平接點、焊球之一矩陣或該點狀光源之背側上之端子。在LED作為點狀光源之情況中，在一標準SMT組裝之後，一典型LED間公差取決於設計及熔接程序將在100 μm之範圍中。另外，如具有兩個底部焊料接點之Luxeon Neo或WLP晶片之小單一發射器在回焊期間趨於旋轉並傾斜。憑藉本發明，LED間公差將由承載該等點狀光源之該預組裝件之準確度界定，從而允許低至10 µm之一放置公差。 該方法可經配置使得該安裝步驟包括將該等點狀光源之該等接觸背側焊接至作為電基板接點之焊點。焊接係一程序，其中兩個或更多個物品(此處接觸背側之接點及基板接點)藉由熔化並將一焊料作為一填充材料放置於該接頭中而接合在一起。該焊料金屬具有低於相關接點之熔點。焊接與熔接之不同在於焊接不涉及將該等接點熔化成焊料。焊料可以許多不同合金獲得用於不同應用。在電子總成中，可使用63%錫及37%鉛(或60/40，熔點幾乎相同)之共晶合金。軟焊料之其他實例係用於一般目的之錫鉛、用於接合鋁之錫鋅、用於在高於室溫下之強度之鉛銀、用於高溫度下之強度之鎘銀、用於鋁及耐腐蝕性之鋅鋁及錫銀及錫鉍。在一較佳實施例中，該焊接程序在一回焊程序中利用基於SAC的焊料。基於SAC的焊料表示錫-銀-銅合金以避免含鉛焊料。回焊係一程序，其中一焊膏(粉末焊料及助焊劑之一粘性混合物)用於將一或若干電接點臨時地附接至其等之相對接點，在此之後，該整個總成經受受控熱，該受控熱熔化該焊料，永久連接該接頭。可藉由使該總成通過一回焊爐或在一紅外線燈或藉由用一熱風槍來焊接個別接頭而完成加熱。在一替代實施例中，可藉由導電膠合或燒結而執行該安裝步驟。 該方法可經配置使得其進一步包括以下步驟：提供具有無點狀光源之一接觸表面之一臨時固持器，並憑藉該等發射表面將該等點狀光源可逆地固定於該臨時固持器之該接觸表面上以便提供預組裝件。至該臨時固持器之該固定確保點狀光源之該陣列內之位置在將該等點狀光源接合至該基板之該等電接點之該安裝步驟期間保持恆定。一可逆的固定使能夠自該等點狀光源之發射側移除該臨時固持器，而不導致對該等點狀光源之任何損害，且不干擾該等點狀光源之任何發光性質。有關傾斜之公差係由該臨時固持器之該接觸表面界定，該接觸表面取決於該臨時固持器之材料(例如玻璃)可為一非常平坦及光滑表面。 該方法可經配置使得使用一適合量規儀器或經由該等點狀光源之一循序組裝來執行該固定步驟，以便以所需準確度控制該等點狀光源之各者之間之相對距離及對位。量規儀器可具備遠低於本發明中指定之公差之公差。量規儀器使該等點狀光源能夠在期望位置處固定於該臨時固持器上。將該等點狀光源循序組裝至該臨時固持器可藉由一所謂晶粒放置機(die-placer machine)而執行，該晶粒放置機提供用於循序地將該等點狀光源循序放置於該臨時固持器上之一足夠準確度。 該方法可經配置使得該臨時固持器包括提供該接觸表面之一黏著層。一適合黏著層可為一聚醯亞胺黏著膠帶。該黏著層簡化該固定步驟並提供該固定之一可逆性(例如，削弱粘著力)。在一較佳實施例中，該臨時固持器係一耐熱塑膠膜，較佳一聚醯亞胺黏著膜或一剛性平坦基板，較佳一金屬、玻璃或陶瓷基板。 該方法可經配置使得其進一步包括在已完成該安裝步驟之後自該等點狀光源移除該可逆地安裝的臨時固持器之步驟。此可藉由在作為一塑膠膜之情況下剝離該臨時固持器或用熱及/或溶劑溶解建立為之一膠層之該黏著層來完成。在回焊之高溫期間，專用膠水喪失或減小黏著性可方便移除該臨時固持器。 該方法可經配置使得點狀光源之該陣列包括多行及多列之點狀光源，其中列及行之數目取決於特定應用。 該方法可經配置使得該基板係一印刷電路板。一印刷電路板已經提供用於將其與接觸背側接合之該等電接點，並因此可容易地用於SMT程序中。此簡化該安裝步驟。該基板亦可為一陶瓷中介基板。 根據一第二態樣，提供一種包括具有一發射側及接觸背側之多個點狀光源及一臨時固持器之預組裝件，其中該等點狀光源憑藉其等發射表面使用適合構件可逆地固定於該臨時固持器上，該適合構件提供具有該等點狀光源之間20 µm之位置公差之一三維位置準確度。此預組裝件係用於根據本發明之方法中之一組件。此預組裝件係可由客戶用作一標準SMD組件、以捲帶式包裝供應並可使用SMT機器及回焊組裝至印刷電路板PCB或隔離金屬基板IMS之一等級1產品。一等級1產品表示產品之核心部分，該核心部分主要著重於該產品帶給客戶之利益，而實際產品(此處該照明總成)係著重於該產品之品質及設計之一有形產品。此處等級1表示無一有線基板之一組件。 該預組裝件可經配置使得該臨時固持器包括一黏著層作為提供用於該等點狀光源的準確固定之一接觸表面之適合構件。該黏著層可由用以臨時地固定該等點狀光源之任何適合材料製成，例如使用一高精度晶粒接合器以達成該等點狀光源之間之低位置公差之聚醯亞胺黏著膠帶。 該預組裝件可經配置使得該臨時固持器係一耐熱塑膠膜，較佳一聚醯亞胺膜或一剛性平坦基板，較佳一金屬、玻璃或陶瓷基板。此等材料使能夠為該臨時固持器提供經界定幾何及表面性質，以便以期望的三維準確度固定該等點狀光源。 根據一第三態樣，提供一種照明總成。該照明總成包括：一基板，其具有電基板接點之一陣列；及點狀光源之一陣列，其等各自具有用以發射光之一發射表面及經安裝於該等基板接點上之一電接點中之一接觸背側並藉由同時將該等點狀光源之該等接觸背側之各者安裝至電基板接點而以20 µm之高位置準確度配置，其中點狀光源之該陣列之該安裝根據根據本發明之方法來執行。 具有點狀光源之該陣列之此一準確對位之照明總成可在無主光學件之情況下操作，此係因為該等點狀光源可非常緊密放置，以便允許無主光學件之矩陣光束應用。使用本發明，可例如以應用SMT組裝及回焊達成該等點狀光源之間10 µm之公差。 該照明總成可經配置使得點狀光源之該陣列包括多行及多列之點狀光源。 該照明總成可經配置使得該基板係一印刷電路板或一陶瓷中介基板。 應瞭解，本發明之一較佳實施例亦可為附屬技術方案與各自獨立技術方案之任何組合。 下文定義進一步有利實施例。An object of the present invention is to provide a light-emitting assembly suitable for providing an adaptive headlight system that does not require pre-collimator optics, in which individual point-shaped light sources are installed with one of the emission surfaces for better three-dimensional position accuracy To avoid unacceptable misalignment of individual point light sources. The present invention is defined by an independent technical solution. The accompanying technical solutions define advantageous embodiments. According to a first aspect, a method of providing an illumination assembly including an array of point light sources arranged on a substrate with high three-dimensional position accuracy is provided. The method includes the steps of: providing a pre-assembly of an array of point light sources with a three-dimensional position accuracy having a position tolerance in a range of 20 µm or less between the point light sources, wherein these Each of the point-shaped light sources has a light-emitting side and a contact back side for electrically contacting the point-shaped light source and is reversibly mounted on a temporary holder by virtue of its equal emission surface; providing an array having an array including electrical substrate contacts A substrate that contacts the surface, wherein the electrical substrate contacts are aligned to the position of the point light sources on the temporary holder; and at the same time the point light sources that are still mounted to the temporary holder The contact backside is mounted on the electrical substrate contacts of the substrate to be able to operate the lighting assembly that maintains the position accuracy of the pre-assembly. The term "point-shaped light source" refers to any light source that has a small light-emitting area (or volume) and has a broad emission cone that provides a substantially unguided light emission. These point light sources can be LEDs or semiconductor lasers (eg quantum wells or dots). The lighting assembly may include an array of point light sources (eg, an LED array). The array of point light sources may include multiple rows and columns of point light sources. The number of point light sources arranged in the columns and / or rows depends on the specific application of the lighting assembly. The back side of the point light sources should be adapted to contact the substrate contacts, wherein the back side can be structured to provide separate contact pads for electrically connecting the point light sources to a power source. The term "three-dimensional position accuracy" means a deviation from a desired three-dimensional position relative to one of the lateral position of the point light sources and its equivalent vertical position (perpendicular to the horizontal position), and the inclination of the point light sources indicates the point shape The emission surface of the light source is aligned with respect to a transverse plane defined by an average emission surface and rotation of the point light sources relative to one of the desired positions represents around one of the emission surfaces perpendicular to the point light sources One of the rotation axes rotates. In an ideal case without tilting, all emitting surfaces are parallel to each other. The specified tolerance represents the deviation from the desired position, where in the case of tilt or rotation, the tolerance represents the maximum deviation of the emitting surface from its intended position. The substrate may be a substrate that provides circuits to connect the substrate contacts to other components. The substrate may be made of any material (such as glass, plastic, etc.) suitable for carrying electrical contacts and suitable for separating the electrical contacts. The substrate may be a printed circuit board PCB or an isolated metal substrate IMS. The substrate can also be used to draw heat from the light sources in order to cool the assembly. The temporary holder may be made of any material suitable for reliably maintaining the position of the fixed point light sources. Since the temporary holder is removed before operating the lighting assembly, the temporary holder does not need to meet any specific electrical or optical properties. The invention can be used for high-beam / low-beam lamps and ADB (adaptive headlamp system) or automotive lamps for matrix beam or matrix lamp applications. This can be composed of close-pitch matrix arrays such as LED point light sources, wide-pitch matrix and customized matrix solutions. In addition, the present invention can be used in a multi-chip LED level 1 package (which can be individually addressed or not individually addressable) to improve the position tolerance of the light emitting position and reduce the distance between light emitting areas (LEA). This is not limited to automobiles, but can also be used in flashlights, general lighting, projection systems, and any other applications for multi-chip LEDs or configurations with other point light sources. The method according to the present invention provides a light emitting assembly suitable for providing an adaptive headlight system that does not require pre-collimator optics, wherein the individual point light sources emit the light in the range of 20 µm or less One of the surfaces is installed with better three-dimensional position accuracy to avoid unacceptable misalignment of these individual point light sources. The current situation in which the solder self-alignment results in a tolerance of> 50 µm is typical and it is difficult to achieve improvement. The method can be configured so that the installation steps are performed by a surface mounting technique. Surface Mount Technology (SMT) is a method for generating circuits in which components are mounted or placed directly on the surface of a substrate (such as a printed circuit board (PCB)). An electronic component is called a surface mount device (SMD). In the industry, electronic components have largely replaced through-hole technology construction methods for assembling components, where wires are guided into holes in circuit boards. However, both technologies can be used on the same printed circuit board, where through-hole technology is used for components that are not suitable for surface mounting, such as large transformers and heat-dissipating power semiconductors. Application The lighting assembly using the installation steps of SMT is smaller than its through-hole counterpart. The point light sources may have various types of short pins or leads, flat contacts, a matrix of solder balls, or terminals on the back side of the point light source. In the case of LEDs as point light sources, after a standard SMT assembly, a typical inter-LED tolerance will be in the range of 100 μm depending on the design and welding procedure. In addition, small single emitters such as Luxeon Neo or WLP wafers with two bottom solder contacts tend to rotate and tilt during reflow. With the present invention, the tolerance between the LEDs will be defined by the accuracy of the pre-assembled parts carrying the point light sources, thus allowing placement tolerances as low as 10 µm. The method can be configured such that the mounting step includes soldering the contact backsides of the point light sources to solder joints that serve as electrical substrate contacts. Soldering is a process in which two or more objects (here contacting back-side contacts and substrate contacts) are joined together by melting and placing a solder as a filler material in the joint. The solder metal has a melting point lower than that of the relevant junction. The difference between soldering and welding is that soldering does not involve melting these joints into solder. Solder is available in many different alloys for different applications. In the electronic assembly, eutectic alloys of 63% tin and 37% lead (or 60/40, almost the same melting point) can be used. Other examples of soft solders are tin-lead for general purposes, tin-zinc for joining aluminum, lead-silver for strength above room temperature, silver-cadmium for strength at high temperature, for aluminum And corrosion-resistant zinc aluminum and tin silver and tin bismuth. In a preferred embodiment, the soldering process utilizes SAC-based solder in a reflow process. SAC-based solder represents a tin-silver-copper alloy to avoid leaded solder. Reflow is a procedure in which a solder paste (a viscous mixture of powder solder and flux) is used to temporarily attach one or several electrical contacts to their opposite contacts, after which the entire assembly Subject to controlled heat which melts the solder and permanently connects the joint. Heating can be accomplished by passing the assembly through a reflow oven or an infrared lamp or by welding individual joints with a hot air gun. In an alternative embodiment, the mounting step may be performed by conductive bonding or sintering. The method may be configured such that it further includes the steps of: providing a temporary holder having a contact surface without a point light source, and reversibly fixing the point light sources to the temporary holder by virtue of the emitting surfaces On the contact surface to provide a pre-assembly. The fixation to the temporary holder ensures that the position within the array of point light sources remains constant during the mounting step of bonding the point light sources to the electrical contacts of the substrate. A reversible fixation enables the temporary holder to be removed from the emitting side of the point light sources without causing any damage to the point light sources and without disturbing any luminous properties of the point light sources. The tolerance for tilting is defined by the contact surface of the temporary holder, which can be a very flat and smooth surface depending on the material (eg glass) of the temporary holder. The method can be configured such that the fixing step is performed using a suitable gauge instrument or through sequential assembly of one of the point light sources, so as to control the relative distance between each of the point light sources with the required accuracy and Counterpoint. Gauge instruments can have tolerances that are much lower than those specified in the present invention. The gauge instrument enables the point light sources to be fixed on the temporary holder at the desired position. The sequential assembly of the point light sources to the temporary holder can be performed by a so-called die-placer machine, which provides for the sequential placement of the point light sources in the One of the temporary holders is accurate enough. The method may be configured such that the temporary holder includes providing an adhesive layer of the contact surface. A suitable adhesive layer may be a polyimide adhesive tape. The adhesive layer simplifies the fixing step and provides one of the reversibility of the fixing (for example, weakens the adhesive force). In a preferred embodiment, the temporary holder is a heat-resistant plastic film, preferably a polyimide adhesive film or a rigid flat substrate, preferably a metal, glass or ceramic substrate. The method may be configured such that it further includes the step of removing the reversibly mounted temporary holder from the point light sources after the mounting step has been completed. This can be accomplished by peeling off the temporary holder or dissolving the adhesive layer created as a glue layer with heat and / or solvent while acting as a plastic film. During the high temperature period of reflow, the special glue loses or reduces the adhesion to facilitate the removal of the temporary holder. The method may be configured such that the array of point light sources includes multiple rows and columns of point light sources, where the number of columns and rows depends on the particular application. The method can be configured such that the substrate is a printed circuit board. A printed circuit board already provides the electrical contacts for bonding it to the contact back side, and therefore can be easily used in SMT procedures. This simplifies the installation procedure. The substrate can also be a ceramic interposer. According to a second aspect, there is provided a pre-assembly including a plurality of point light sources having an emission side and a contact back side and a temporary holder, wherein the point light sources reversibly use suitable members by virtue of their emission surfaces Fixed on the temporary holder, the suitable member provides a three-dimensional position accuracy with a position tolerance of 20 µm between the point light sources. This pre-assembly is an assembly used in the method according to the invention. This pre-assembled part can be used by customers as a standard SMD component, supplied in tape and reel packaging, and can be assembled to a printed circuit board PCB or isolated metal substrate IMS level 1 product using SMT machines and reflow. A level 1 product represents the core part of the product. The core part mainly focuses on the benefits the product brings to the customer, and the actual product (here the lighting assembly) focuses on the quality and design of the product. Level 1 here means a component without a wired substrate. The pre-assembly can be configured so that the temporary holder includes an adhesive layer as a suitable member to provide a contact surface for accurate fixing of the point light sources. The adhesive layer can be made of any suitable material for temporarily fixing the point light sources, such as a polyimide adhesive tape using a high-precision die bonder to achieve low position tolerance between the point light sources . The pre-assembly can be configured so that the temporary holder is a heat-resistant plastic film, preferably a polyimide film or a rigid flat substrate, preferably a metal, glass or ceramic substrate. These materials enable the temporary holder to be provided with defined geometric and surface properties in order to fix the point light sources with the desired three-dimensional accuracy. According to a third aspect, a lighting assembly is provided. The lighting assembly includes: a substrate having an array of electrical substrate contacts; and an array of point light sources each having an emission surface for emitting light and mounted on the substrate contacts One of the electrical contacts contacts the back side and is arranged with a high position accuracy of 20 µm by mounting each of the contact back sides of the same point light sources to the electrical board contacts at the same time, where the point light sources The installation of the array is performed according to the method according to the invention. The accurately aligned illumination assembly of the array with point light sources can be operated without main optics because the point light sources can be placed very closely to allow matrix beam applications without main optics. Using the present invention, a tolerance of 10 µm between these point light sources can be achieved, for example, by applying SMT assembly and reflow. The illumination assembly may be configured such that the array of point light sources includes multiple rows and columns of point light sources. The lighting assembly can be configured so that the substrate is a printed circuit board or a ceramic interposer. It should be understood that a preferred embodiment of the present invention may also be any combination of subsidiary technical solutions and respective independent technical solutions. The following defines further advantageous embodiments.

現將藉由圖描述本發明之各種實施例。 圖1展示根據本發明將點狀光源固定至臨時固持器之一主要略圖，其中(a)在固定之前及(b)在固定之後。臨時固持器4包括具有無點狀光源2之一接觸表面41之一黏著層42。一適合量規儀器5或一替代循序放置程序提供待固定點狀光源2，以便以所需準確度控制點狀光源2之各者之間之相對距離DR及對位TR (亦參見圖3)。點狀光源2憑藉發射表面21可逆地固定150在臨時固持器4之接觸表面41上，以便提供預組裝件1，該預組裝件1包括憑藉其等發射表面21使用適合構件42可逆地固定於臨時固持器4上之點狀光源2之陣列，該適合構件42提供具有在點狀光源2之間之20 µm或小於20 µm之範圍中之位置公差之一三維位置準確度。臨時固持器4可為一耐熱塑膠膜，較佳一聚醯亞胺膜或一剛性平坦基板，較佳一金屬、玻璃或陶瓷基板。提供接觸背側22用於電接觸點狀光源2。 圖2展示根據本發明將點狀光源之陣列安裝至稍後達成的照明總成10 (參見圖3)之基板之一主要略圖，其中(a)在安裝之前及(b)在安裝之後。照明總成10包括：一基板3，其具有電基板接點32之一陣列；及點狀光源2之一陣列，其等各自具有用以發射光L之一發射表面21及經安裝於該等基板接點32上之一電接點中之一接觸背側22並藉由同時將點狀光源2之接觸背側22之各者安裝130至電基板接點32而以在20 µm或更小之範圍中之高位置準確度配置，其中點狀光源2之陣列之安裝係根據如圖4中所示之方法100來執行。此處基板3係一印刷電路板。點狀光源之陣列可為一4x2陣列。 圖3展示在已完成安裝步驟130之後根據本發明自點狀光源2移除160臨時固持器4之一主要略圖。此可藉由在作為一塑膠膜之情況下剝離臨時固持器4或用熱及/或溶劑溶解建立為一膠層之黏著層42來完成。在回焊之高溫期間，一專用膠水喪失或減小黏著性可方便移除臨時固持器。所得照明總成10包括經安裝的點狀光源2，其中點狀光源2之各者之間之所維持相對距離DR及對位TR由臨時固持器4以在20 µm或更小之範圍中之所需公差之準確度提供。 圖4展示包括以高位置準確度配置於一基板3上之點狀光源2之一陣列之根據本發明之方法100之一實施例之一主要略圖，該方法100包括以下步驟：提供140具有無點狀光源2之一接觸表面41之一臨時固持器4。臨時固持器4可包括提供接觸表面41之一黏著層42，臨時固持器4可為一耐熱塑膠膜，較佳一聚醯亞胺膜或一剛性平坦基板，較佳一金屬、玻璃或陶瓷基板。方法藉由以下步驟而繼續：憑藉發射表面21將具有一發光側21及用於電接觸點狀光源2之接觸背側22可逆地固定150於臨時固持器4之接觸表面41上，以便以具有在點狀光源2之間之20 µm或更小之範圍中之位置公差之一三維位置準確度提供點狀光源2之一陣列之預組裝件1。可使用一適合量規儀器5或用一晶粒放置機之一循序組裝來執行固定步驟150，以便以所需準確度控制點狀光源2之各者之間之相對距離DR及對位TR。方法藉由以下步驟而繼續：提供120具有包括電基板接點32之一陣列之一接觸表面31之基板3，其中電基板接點32經對位至臨時固持器4上之點狀光源2之位置；同時將點狀光源2之接觸背側22安裝130於基板3之電基板接點32上，以能夠操作維持預組裝件1之位置準確度之照明總成10並在已完成安裝步驟130之後自點狀光源2移除160可逆地安裝的臨時固持器4以提供照明總成10。可藉由一表面安裝技術SMT而執行安裝步驟130。安裝步驟130可包括將點狀光源2之接觸背側22焊接135至作為電基板接點32之焊點32 (例如在一回焊程序中利用基於SAC的焊料)。在一替代實施例中，可藉由導電膠合或燒結而執行安裝步驟130。基板3可為一印刷電路板或一陶瓷中介基板。 雖然已在圖式及前述描述中詳細繪示並描述本發明，但此繪示及描述應被視為闡釋性的或例示性的且非限制性的。 在閱讀本發明之後，熟習此項技術者將明白其他修改。此等修改可涉及此項技術中已知且可作為本文中已描述之特徵的替代或補充而使用之其他特徵。 熟習此項技術者可自對圖式、揭示內容及隨附發明申請專利範圍之一研究而理解且實現所揭示實施例之變動。在發明申請專利範圍中，字詞「包括」不排除其他元件或步驟，且不定冠詞「一(a)」或「一個(an)」不排除複數個元件或步驟。在互異之附屬發明申請專利範圍中列舉特定措施之純粹事實並不指示無法有利使用此等措施之一組合。 發明申請專利範圍中之任何元件符號不應被解釋為限制其之範疇。Various embodiments of the present invention will now be described by the drawings. FIG. 1 shows one main sketch of fixing a point light source to a temporary holder according to the present invention, where (a) before fixing and (b) after fixing. The temporary holder 4 includes an adhesive layer 42 having a contact surface 41 without a point light source 2. A suitable gauge instrument 5 or an alternative sequential placement procedure provides the point light source 2 to be fixed, in order to control the relative distance DR and alignment TR between each of the point light sources 2 with the required accuracy (see also Figure 3) . The point light source 2 is reversibly fixed 150 on the contact surface 41 of the temporary holder 4 by virtue of the emitting surface 21, so as to provide a pre-assembly 1 including the reversible fixation using suitable members 42 by virtue of its emitting surface 21 For an array of point light sources 2 on the temporary holder 4, the suitable member 42 provides a three-dimensional position accuracy with a position tolerance in the range of 20 µm or less between the point light sources 2. The temporary holder 4 may be a heat-resistant plastic film, preferably a polyimide film or a rigid flat substrate, preferably a metal, glass or ceramic substrate. A contact back 22 is provided for electrically contacting the point light source 2. Figure 2 shows a main sketch of one of the substrates for mounting an array of point light sources to a lighting assembly 10 (see Figure 3) to be achieved later according to the present invention, where (a) before installation and (b) after installation. The lighting assembly 10 includes: a substrate 3 having an array of electrical substrate contacts 32; and an array of point light sources 2 each having an emission surface 21 for emitting light L and mounted on these One of the electrical contacts on the substrate contact 32 contacts the back side 22 and by mounting 130 each of the point light sources 2 contacting the back side 22 to the electrical substrate contact 32 at 20 µm or less The high position accuracy configuration within the scope, in which the installation of the array of point light sources 2 is performed according to the method 100 shown in FIG. 4. Here, the substrate 3 is a printed circuit board. The array of point light sources can be a 4x2 array. FIG. 3 shows one main sketch of removing the temporary holder 4 from the point light source 2 according to the present invention after the installation step 130 has been completed. This can be done by peeling off the temporary holder 4 in the case of being a plastic film or dissolving the adhesive layer 42 which is established as a glue layer with heat and / or solvent. During the high temperature of reflow, a special glue loses or reduces the adhesion to facilitate the removal of the temporary holder. The resulting lighting assembly 10 includes an installed point light source 2 in which the relative distance DR and alignment TR maintained between each of the point light sources 2 is controlled by the temporary holder 4 to be within a range of 20 µm or less The accuracy of the required tolerances is provided. 4 shows a main sketch of an embodiment of a method 100 according to the present invention including an array of point light sources 2 arranged on a substrate 3 with high position accuracy. The method 100 includes the following steps: providing 140 with no One of the point light sources 2 contacts one of the temporary holders 4 of the surface 41. The temporary holder 4 may include an adhesive layer 42 which provides a contact surface 41. The temporary holder 4 may be a heat-resistant plastic film, preferably a polyimide film or a rigid flat substrate, preferably a metal, glass or ceramic substrate . The method continues by the following steps: by means of the emitting surface 21, a contact back side 22 having a light emitting side 21 and a contact light source 2 for electrically contacting the point light source 2 is reversibly fixed 150 on the contact surface 41 of the temporary holder 4 so as to have A three-dimensional position accuracy of the position tolerance in the range of 20 µm or less between the point light sources 2 provides a pre-assembly 1 of an array of point light sources 2. The fixing step 150 may be performed using a suitable gauge instrument 5 or a sequential assembly using a die placement machine to control the relative distance DR and the alignment TR between the point light sources 2 with the required accuracy. The method continues by the following steps: providing 120 a substrate 3 having a contact surface 31 including an array of electrical substrate contacts 32, wherein the electrical substrate contacts 32 are aligned to the point light sources 2 on the temporary holder 4 At the same time, the contact back side 22 of the point light source 2 is mounted 130 on the electrical substrate contact 32 of the substrate 3 to operate the lighting assembly 10 that maintains the position accuracy of the pre-assembly 1 and the installation step 130 is completed The temporary holder 4 reversibly installed is then removed 160 from the point light source 2 to provide the lighting assembly 10. The installation step 130 can be performed by a surface mount technology SMT. The installation step 130 may include soldering 135 the contact back side 22 of the point light source 2 to the solder joint 32 as the electrical substrate contact 32 (for example, using SAC-based solder in a reflow process). In an alternative embodiment, the mounting step 130 may be performed by conductive bonding or sintering. The substrate 3 may be a printed circuit board or a ceramic interposer. Although the invention has been illustrated and described in detail in the drawings and the foregoing description, this illustration and description should be considered illustrative or exemplary and non-limiting. After reading the present invention, those skilled in the art will appreciate other modifications. Such modifications may refer to other features known in the art and which may be used in place of or in addition to the features already described herein. Those skilled in the art can understand and implement changes in the disclosed embodiments from a study of the drawings, the disclosure, and the scope of patent applications accompanying the invention. In the patent application scope of the invention, the word "include" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality of elements or steps. The mere fact that specific measures are listed in the scope of patent applications for mutually dependent subsidiary inventions does not indicate that a combination of these measures cannot be used to advantage. Any component symbol in the patent application scope of the invention shall not be interpreted as limiting its scope.

1‧‧‧根據本發明之預組裝件1‧‧‧Pre-assembly according to the invention

2‧‧‧點狀光源2‧‧‧Point light source

3‧‧‧基板，例如，一印刷電路板3‧‧‧ substrate, for example, a printed circuit board

4‧‧‧臨時固持器4‧‧‧Temporary holder

5‧‧‧量規儀器5‧‧‧ gauge instrument

10‧‧‧根據本發明之照明總成10‧‧‧ lighting assembly according to the present invention

21‧‧‧發光側；發射表面21‧‧‧ light emitting side; emitting surface

22‧‧‧接觸背側22‧‧‧Contact back

31‧‧‧接觸表面31‧‧‧Contact surface

32‧‧‧電基板接點，例如，焊點32‧‧‧Electrical substrate contacts, for example, solder joints

41‧‧‧臨時固持器之接觸表面41‧‧‧Contact surface of temporary holder

42‧‧‧用以將點狀光源固定於臨時固持器上之適合構件，例如，一黏著層42‧‧‧A suitable member for fixing the point light source on the temporary holder, for example, an adhesive layer

100‧‧‧根據本發明提供照明總成之方法100‧‧‧ Method for providing lighting assembly according to the present invention

110‧‧‧提供點狀光源之一陣列之一預組裝件110‧‧‧Provide a pre-assembled part of an array of point light sources

120‧‧‧提供具有包括電基板接點之一陣列之一接觸表面之一基板120‧‧‧Provide a substrate with a contact surface including an array of electrical substrate contacts

130‧‧‧同時將點狀光源之接觸背側安裝於電基板接點上130‧‧‧At the same time, the contact back side of the point light source is installed on the contact of the electrical substrate

135‧‧‧在安裝步驟內將接觸背側焊接至電基板接點135‧‧‧ Solder the back side of the contact to the electrical board contact in the installation step

140‧‧‧提供一臨時固持器140‧‧‧Provide a temporary holder

150‧‧‧將點狀光源可逆地固定於臨時固持器上150‧‧‧Reversibly fix the point light source on the temporary holder

160‧‧‧自點狀光源移除可逆地安裝的臨時固持器160‧‧‧Removably installed temporary holder from point light source

DR‧‧‧不同點狀光源之間之相對距離DR‧‧‧Relative distance between different point light sources

SMT‧‧‧表面安裝技術SMT‧‧‧Surface mounting technology

TR‧‧‧不同點狀光源之間之相對對位，例如，相對傾斜及相對旋轉TR‧‧‧ Relative alignment between different point light sources, for example, relative tilt and relative rotation

本發明之此等及其他態樣將自後文描述的實施例而顯而易見且將參考後文描述的實施例闡明。 現將藉由實例基於參考隨附圖式之實施例描述本發明。 在圖式中： 圖1展示根據本發明將點狀光源固定至臨時固持器之一主要略圖，其中(a)在固定之前及(b)在固定之後。 圖2展示根據本發明將點狀光源安裝至照明總成之基板之一主要略圖，其中(a)在安裝之前及(b)在安裝之後。 圖3展示根據本發明自點狀光源移除臨時固持器之一主要略圖。 圖4展示根據本發明之方法之一實施例之一主要略圖。 在圖中，通篇相同元件符號指代相同物件。圖中之物件未必按比例繪製。These and other aspects of the invention will be apparent from the embodiments described later and will be explained with reference to the embodiments described later. The invention will now be described by way of example based on an embodiment with reference to the accompanying drawings. In the drawings: FIG. 1 shows one of the main sketches of fixing a point light source to a temporary holder according to the present invention, where (a) before fixation and (b) after fixation. Fig. 2 shows a main outline of a substrate for mounting a point light source to a lighting assembly according to the present invention, where (a) before installation and (b) after installation. FIG. 3 shows one main sketch of removing the temporary holder from the point light source according to the present invention. Figure 4 shows a main sketch of an embodiment of the method according to the invention. In the figure, the same element symbol refers to the same object throughout. The objects in the picture are not necessarily drawn to scale.

Claims (15)

一種提供包括以高三維位置準確度配置於一基板(3)上之點狀光源(2)之一陣列之一照明總成(10)之方法(100)，該方法(100)包括以下步驟： 以具有在該等點狀光源(2)之間之20 µm或更小之範圍中之位置公差之一三維位置準確度提供(110)點狀光源(2)之一陣列之一預組裝件(1)，其中該等點狀光源(2)之各者具有一發光側(21)及用於電接觸該點狀光源(2)之接觸背側(22)並憑藉其等發射表面(21)可逆地安裝於一臨時固持器(4)上； 提供(120)具有包括電基板接點(32)之一陣列之一接觸表面(31)之該基板(3)，其中該等電基板接點(32)經對位至該臨時固持器(4)上之該等點狀光源(2)之位置；及 同時將該點狀光源(2)之該等接觸背側(22)安裝(130)於該基板(3)之該等電基板接點(32)上以能夠操作維持該預組裝件(1)之該位置準確度之該照明總成(10)。A method (100) for providing an illumination assembly (10) including an array of point light sources (2) arranged on a substrate (3) with high three-dimensional position accuracy. The method (100) includes the following steps: Provide (110) a pre-assembled part of an array of point light sources (2) with a three-dimensional position accuracy with a position tolerance in the range of 20 µm or less between the point light sources (2) ( 1), wherein each of the point light sources (2) has a light emitting side (21) and a contact back side (22) for electrically contacting the point light source (2) and by virtue of its equal emitting surface (21) Reversibly mounted on a temporary holder (4); providing (120) the substrate (3) having a contact surface (31) including an array of electrical substrate contacts (32), wherein the electrical substrate contacts (32) Positioning the point light sources (2) on the temporary holder (4); and simultaneously installing (130) the contact back sides (22) of the point light source (2) The lighting assembly (10) is operable to maintain the position accuracy of the pre-assembly (1) on the electrical substrate contacts (32) of the substrate (3). 如請求項1之方法(100)，其中藉由一表面安裝技術(SMT)而執行該安裝步驟(130)。The method (100) of claim 1, wherein the installation step (130) is performed by a surface mount technology (SMT). 如請求項2之方法(100)，其中該安裝步驟(130)包括將該等點狀光源(2)之該等接觸背側(22)焊接(135)至作為該等電基板接點(32)之焊點(32)。The method (100) of claim 2, wherein the mounting step (130) includes soldering (135) the contact back sides (22) of the point light sources (2) to serve as the electrical substrate contacts (32) ) Of the solder joint (32). 如請求項3之方法(100)，其中該焊接(135)在一回焊程序中利用基於SAC的焊料。The method (100) of claim 3, wherein the soldering (135) utilizes SAC-based solder in a reflow procedure. 如請求項1至4中任一項之方法(100)，其進一步包括以下步驟： 提供(140)具有無點狀光源(2)之一接觸表面(41)之一臨時固持器(4)；及 憑藉該等發射表面(21)將該等點狀光源(2)可逆地固定(150)於該臨時固持器(4)之該接觸表面(41)上，以便提供該預組裝件(1)。The method (100) according to any one of claims 1 to 4, further comprising the following steps: providing (140) a temporary holder (4) having a contact surface (41) without a point light source (2); And by virtue of the emitting surfaces (21), the point light sources (2) are reversibly fixed (150) on the contact surface (41) of the temporary holder (4), so as to provide the pre-assembly (1) . 如請求項5之方法(100)，其中使用一適合量規儀器(5)或經由該等點狀光源(2)之一循序組裝來執行該固定步驟(150)，以便以所需準確度控制該等點狀光源(2)之各者之間之相對距離(DR)及對位(TR)。The method (100) of claim 5, wherein the fixing step (150) is performed using a suitable gauge instrument (5) or sequentially assembled through one of the point light sources (2) to control with the required accuracy The relative distance (DR) and alignment (TR) between each of these point light sources (2). 如請求項5之方法(100)，其中該臨時固持器(4)包括提供該接觸表面(41)之一黏著層(42)。The method (100) of claim 5, wherein the temporary holder (4) includes providing an adhesive layer (42) of the contact surface (41). 如請求項1至4中任一項之方法(100)，其中該臨時固持器(4)係一耐熱塑膠膜，較佳一聚醯亞胺膜或一剛性平坦基板，較佳一金屬、玻璃或陶瓷基板。The method (100) according to any one of claims 1 to 4, wherein the temporary holder (4) is a heat-resistant plastic film, preferably a polyimide film or a rigid flat substrate, preferably a metal, glass Or ceramic substrate. 如請求項1至4中任一項之方法(100)，其進一步包括在已完成該安裝步驟(150)之後自該等點狀光源(2)移除(160)該可逆地安裝的臨時固持器(4)之步驟。The method (100) of any one of claims 1 to 4, further comprising removing (160) the reversibly installed temporary holding from the point light sources (2) after the installation step (150) has been completed Step (4). 如請求項1至4中任一項之方法(100)，其中該基板(3)係一印刷電路板或一陶瓷中介基板。The method (100) according to any one of claims 1 to 4, wherein the substrate (3) is a printed circuit board or a ceramic interposer. 一種預組裝件(1)，其包括具有一發射側(21)及接觸背側(22)之多個點狀光源(2)及一臨時固持器(4)，其中該等點狀光源(2)憑藉其等發射表面(21)使用適合構件(42)可逆地固定於該臨時固持器(4)上，該適合構件(42)提供具有在該等點狀光源(2)之間之20 µm或更小之範圍中之位置公差之一三維位置準確度。A pre-assembly (1) includes a plurality of point-shaped light sources (2) having a emitting side (21) and a contact back side (22) and a temporary holder (4), wherein the point-shaped light sources (2) ) By virtue of its equal emission surface (21), a suitable member (42) is reversibly fixed to the temporary holder (4), the suitable member (42) is provided with a 20 µm between the point light sources (2) Three-dimensional position accuracy, one of the position tolerances in the range or smaller. 如請求項11之預組裝件(1)，其中該臨時固持器(4)包括一黏著層(42)，作為提供用於準確固定該等點狀光源(2)之一接觸表面(41)之該適合構件。The pre-assembly (1) according to claim 11, wherein the temporary holder (4) includes an adhesive layer (42) as a contact surface (41) for accurately fixing one of the point light sources (2) The fit member. 如請求項11或12之預組裝件(1)，其中該臨時固持器(4)係一耐熱塑膠膜，較佳一聚醯亞胺膜或一剛性平坦基板，較佳一金屬、玻璃或陶瓷基板。The pre-assembly (1) according to claim 11 or 12, wherein the temporary holder (4) is a heat-resistant plastic film, preferably a polyimide film or a rigid flat substrate, preferably a metal, glass or ceramic Substrate. 一種照明總成(10)，其包括：一基板(3)，其具有包括電基板接點(32)之一陣列之一接觸表面(31)；及點狀光源(2)之一陣列，其等各自具有用以發射光(L)之一發射表面(21)及經安裝於該等基板接點(32)上之一電接點中之一接觸背側(22)並藉由同時安裝(130)來自點狀光源(2)之該陣列之一預組裝件(1)之該等點狀光源(2)之該等接觸背側(22)之各者而以在20 µm或更小之範圍中之高位置準確度配置，該預組裝件(1)提供具有在該等點狀光源(2)之間之20 µm或更小之範圍中之位置公差之三維位置準確度，該等點狀光源(2)憑藉其等發射表面(21)可逆地安裝於一臨時固持器(4)上，用於安裝至經對位至該臨時固持器(4)上之該等點狀光源(2)之位置之該等電基板接點(32)，從而維持該預組裝件(1)之該位置準確度。An illumination assembly (10) includes: a substrate (3) having a contact surface (31) including an array of electrical substrate contacts (32); and an array of point light sources (2), which Etc. each has an emitting surface (21) for emitting light (L) and one of the electrical contacts mounted on the substrate contacts (32) contacts the back side (22) and is mounted by simultaneous ( 130) Each of the contact backsides (22) of the point light sources (2) from one of the pre-assembled parts (1) of the array of point light sources (2) is less than 20 µm or less High position accuracy configuration in the range, the pre-assembly (1) provides three-dimensional position accuracy with position tolerance in the range of 20 µm or less between the point light sources (2), these points The shape light source (2) is reversibly mounted on a temporary holder (4) by virtue of its equal emitting surface (21) for mounting to the point light sources (2) aligned to the temporary holder (4) ) Position of the electrical substrate contacts (32), thereby maintaining the accuracy of the position of the pre-assembly (1). 如請求項14之照明總成(10)，其中該基板(3)係一印刷電路板或一陶瓷中介基板。The lighting assembly (10) of claim 14, wherein the substrate (3) is a printed circuit board or a ceramic interposer.
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