CN110842367A - Device and method for repairing micro LED by laser - Google Patents
Device and method for repairing micro LED by laser Download PDFInfo
- Publication number
- CN110842367A CN110842367A CN201910955622.2A CN201910955622A CN110842367A CN 110842367 A CN110842367 A CN 110842367A CN 201910955622 A CN201910955622 A CN 201910955622A CN 110842367 A CN110842367 A CN 110842367A
- Authority
- CN
- China
- Prior art keywords
- laser
- core particles
- repaired
- sample
- bad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a device and a method for repairing a micro LED by laser, wherein the device comprises: the system comprises a processing platform, a vision system, a first laser, a second laser, a carrying system and a testing system; the processing platform is used for placing a sample to be repaired and adjusting the position of the sample to be repaired by moving the processing platform; the vision system is used for identifying bad core particles in the sample to be repaired; the first laser is used for emitting laser to remove the bad core particles and cleaning the bonding pads on the substrate corresponding to the bad core particles; the carrying system is used for tinning the bonding pad and picking up a new core particle to be placed on the bonding pad; the second laser is used for emitting laser to melt tin at the contact position of the new core particle electrode and the welding pad; the test system is used for detecting the repairing effect of the repaired sample. The device can effectively and accurately replace poor core particles in the miniature LED, realizes the repair of the miniature LED and has high maintenance efficiency.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a device and a method for repairing a micro LED by laser.
Background
The micro LED is a high-density micro-sized LED array integrated on a chip, can reduce the pixel point distance from a millimeter level to a micron level, has the advantages of inheriting the characteristics of high efficiency, high brightness, high reliability, quick response time and the like of an inorganic LED, has the characteristic of self-luminescence without a backlight source, is small in size, light and thin, and can easily realize the effect of energy conservation. The LED chip is divided into a Mini LED and a Micro LED according to the size of the core particle, and the Micro LED realizes the display of pixel particles with the size of 0.05 mm or less; the Mini LED realizes the display of pixel particles of 0.5-1.2 mm, and can be applied to the subdivision fields of backlight sources, small-spacing LED display screens, large-size display, vehicle display and the like.
In the actual production and application process, when the core particles are damaged, the repairing process of the core particles is difficult due to the small size of the micro LED core particles and the small distance between the core particles set for realizing high PPI, and a method for better solving the repairing of the micro LED is not provided in the prior art.
Disclosure of Invention
The invention provides a device and a method for repairing a micro LED by laser, which are used for solving the technical problem that an effective method for repairing the micro LED is unavailable in the prior art.
The invention provides a device for repairing a micro LED by laser, which comprises the following components: the device comprises: the system comprises a processing platform, a vision system, a first laser, a second laser, a carrying system and a testing system;
the processing platform is used for placing a sample to be repaired, and the position of the sample to be repaired is adjusted by moving the processing platform;
the vision system is used for identifying bad core particles in the sample to be repaired;
the first laser is used for emitting laser to remove the bad core particles and cleaning the bonding pads on the substrate corresponding to the bad core particles;
the handling system is used for tinning the bonding pad and picking up a new core particle to be placed on the bonding pad;
the second laser is used for emitting laser to melt tin at the contact position of the new core particle electrode and the welding pad;
the test system is used for detecting the repairing effect of the repaired sample.
Preferably, the apparatus further comprises:
and the adjustable diaphragm is used for adjusting the spot size of the laser emitted by the first laser and the second laser according to the size of the bad core particles.
Preferably, the apparatus further comprises:
the temperature control system is used for detecting the electrode temperature when the second laser melts the tin; when the temperature is lower than a preset temperature value, controlling the second laser to increase the power of the emitted laser beam until the temperature reaches the preset temperature value; and when the temperature is higher than the preset temperature value, controlling the second laser to reduce the power of the emitted laser beam until the temperature reaches the preset temperature value.
Preferably, the temperature control system detects the electrode temperature by using infrared light, and the infrared light is isolated from the laser beams emitted by the first laser and the second laser by a specific reflector.
Preferably, the apparatus further comprises:
and the focusing system is used for focusing the laser beams emitted by the first laser and the second laser so as to increase the energy density of the laser beams.
Preferably, the focusing system is a microscope system.
Preferably, the apparatus further comprises:
and the air blowing and dust extraction system is used for removing core particle fragments damaged by laser and particles generated in the processing.
Preferably, the first laser emits a laser beam of green light and infrared light, and the second laser emits an infrared light laser beam.
In a second aspect, the present invention provides a method for laser repairing a micro LED, the method comprising:
fixing a sample to be repaired on a processing platform, lighting the sample to be repaired, identifying bad core particles in the sample to be repaired through a vision system, wherein the non-luminous core particles are the bad core particles;
controlling the processing platform to move the bad core particles to a laser processing area;
controlling a first laser to emit a first laser beam, wherein the first laser beam acts on the poor core particles to crush the poor core particles so as to remove the poor core particles; controlling the first laser beam to clean and polish the bonding pad on the substrate corresponding to the bad core particle;
controlling a carrying system to tin a bonding pad on the substrate corresponding to the bad core particle and monitoring the tin coating effect through a vision system;
controlling a carrying system to pick up new core particles to be placed on the bonding pad, and detecting the placing effect of the core particles through a vision system;
controlling a second laser to emit a second laser beam, so that tin at the contact position of the electrode of the new core particle and the welding pad is uniformly melted;
after the melted tin is cooled and solidified, whether the new core particles are firmly fixed and can emit light is detected through a testing system so as to determine whether the repair is successful.
As can be seen from the foregoing embodiments of the present invention, in the apparatus for repairing a micro LED by using laser provided in the embodiments of the present application, the laser is used to remove the bad core particles in the micro LED to be repaired, clean and polish the bonding pad, then the new core particles are attached to the bonding pad of the original core particles by tin plating, and then the laser is used to melt the tin paste to realize physical and electrical connection between the core particle electrode and the bonding pad, thereby realizing the repair of the micro LED. The device has the advantages of good accuracy, high repair yield and reliability, unlimited size of applicable core particles and wide application.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of an apparatus for laser repairing a micro LED according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another apparatus for laser repairing a micro LED according to an embodiment of the present disclosure;
fig. 3 is a schematic optical path diagram illustrating laser light emitted by a laser device and detection light isolated by using a specific mirror according to an embodiment of the present disclosure;
fig. 4 is a schematic flowchart of a method for laser repairing a micro LED according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a core particle, a pad, and a substrate in a sample to be repaired provided in this embodiment.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, a schematic structural diagram of a device for laser repairing a micro LED provided in an embodiment of the present application is shown, where the device includes: a control system 101, a processing platform 102, a vision system 103, a first laser 104, a handling system 105, a second laser 106, and a testing system 107;
the control system 101 is used for controlling the normal operation of each part;
the processing platform 102 is used for placing a sample to be repaired, and the position of the sample to be repaired is adjusted by moving the processing platform 102;
the vision system 103 is used for identifying bad core particles in the sample to be repaired;
the first laser 104 is used for emitting laser to remove the bad core particles and cleaning the bonding pads on the substrate corresponding to the bad core particles;
the handling system 105 is used for tinning the bonding pads and picking up new core particles to be placed on the bonding pads;
the second laser 106 is used for emitting laser to melt tin at the contact position of the new core particle electrode and the welding pad;
the test system 107 is used to test the repair effect of the repaired sample.
In the embodiment of the present application, a sample to be repaired is placed on the processing platform 102, and the processing platform 102 has a fixing clamp thereon to fix the sample to be repaired on the processing platform 102. The processing platform 102 is fixed with a detection tool, the detection tool is connected with a sample to be repaired, and the detection tool can supply power to the sample to be repaired to light the sample to be repaired. The movement of the sample to be repaired can be achieved by moving the processing platform 102, and the processing platform can be moved under manual control or under equipment control. When the sample to be repaired is detected, the sample to be repaired is lightened, the defective core particles needing to be repaired in the sample to be repaired are identified through the vision system 103, and the non-luminous core particles are the defective core particles. After the bad core grains are identified, the processing platform control system can calculate the moving direction and the moving distance of the processing platform through the coordinate information of the bad core grains and the coordinate information of the laser action point of the laser, and then control the processing platform to move so that the bad core grains are located at the laser processing position of the laser. When a plurality of bad core grains exist in the sample to be repaired, after one bad core grain is replaced, the next bad core grain is moved to the laser processing position by moving the processing platform.
The first laser 104 emits flat-top light with high peak power, the light beam acts on the bad core grains to break the bad core grains, the laser beam with high peak power generates instantaneous high temperature to remove tin on the bonding pad corresponding to the bad core grains so as to achieve the effect of cleaning and polishing the bonding pad, the processing uniformity of the flat top is good, and the processing quality is improved.
As shown in fig. 5, which is a schematic structural diagram of a core grain, a substrate and a bonding pad in a sample to be repaired according to an embodiment of the present application, two pins of a core grain 501 are physically and electrically connected to a bonding pad 502 through tin, and the bonding pad 502 is attached to the substrate 503. The handling system 105 includes a tin applying device and a pasting device, and can use a steel mesh with adjustable openings to brush tin paste, and use a suction nozzle to suck core particles for pasting. Other ways of tin-coating may also be used, without limitation. The vision system monitors the process and checks the effects of brushing tin and pasting to ensure that new core particles can be effectively welded on the substrate. The second laser 106 emits laser light to act on the tin where the new core particle electrode contacts the pad so that the tin paste is uniformly melted. The test system 107 comprises a probe, and after the tin is cooled, the probe is used for applying different forces to the core grains so as to detect whether the core grains are firm; the sample is lit and the new core particles are inspected for luminescence using a vision system to confirm successful repair. The control system 101 controls the normal operation of each part.
As can be seen from the foregoing embodiments of the present invention, in the apparatus for repairing a micro LED by using laser provided in the embodiments of the present application, the micro core particles to be repaired are removed by using laser, the bonding pad is cleaned and polished by using laser, the new core particles are attached to the bonding pad of the original core particles by tin paste, and the core particle electrodes are physically and electrically connected to the bonding pad by melting the tin paste by using laser, so that the repair of the micro LED is achieved. The device has good accuracy and high repair efficiency in repairing the micro LED.
Preferably, as shown in fig. 2, the apparatus further comprises an adjustable diaphragm 201 for adjusting the spot size of the laser light emitted by the first laser and the second laser according to the size of the defective core particle.
In the embodiment of the present application, the adjustable diaphragm 201 can adjust the beam size of the laser. Because bad core grains may have different sizes, the spacing between core grains is small, and the laser power is large, the spot size of the laser needs to be accurately controlled to realize accurate damage to the bad core grains without damaging other normal core grains. Specifically, the adjustable range of the adjustable diaphragm 201 is 1-5000 um, the passing laser beam is shaped into a rectangular light spot, and the minimum control precision can reach 1um, so that the processing range can be accurately adjusted. The adjustable diaphragm that the device had has realized the control to the laser facula size of laser instrument transmission for laser beam machining scope is controlled and more accurate, has avoided the influence to non-processing region, thereby has guaranteed the restoration quality of product, has avoided restoreing unexpected damage.
Preferably, the apparatus further comprises:
the temperature control system 202 is used for detecting the electrode temperature when the second laser melts the tin; when the temperature is lower than the preset temperature value, controlling the second laser to increase the power of the emitted laser beam until the temperature reaches the preset temperature value; and when the temperature is higher than the preset temperature value, controlling the second laser to reduce the power of the emitted laser beam until the temperature reaches the preset temperature value.
Preferably, the temperature control system 202 detects the electrode temperature using infrared light, which is isolated from the laser beams emitted by the first and second lasers by specific mirrors.
In the embodiment of the present application, the apparatus further comprises a temperature control system 202, and the temperature control system 202 comprises a temperature detection, comparison, and regulation system. The temperature control system 202 employs infrared light for detection, and the detection light is isolated from the laser emitted by the laser by using a specific reflector, as shown in fig. 3, which is a schematic light path diagram for isolating the laser emitted by the laser and the detection light by using a specific reflector according to the embodiment of the present disclosure. The light 301 is laser light emitted by a laser, and it is understood that the light 301 includes laser light emitted by the first laser 104 and also includes laser light emitted by the second laser 106. The light 302 is a detection light. The detection light detects the temperature at the core particle electrode, and when the detected electrode temperature is less than the melting point (230 ℃) of tin, the regulation and control system controls the second laser 106 to increase the emission power of the laser to increase the temperature until the electrode temperature reaches 230 ℃. When the detected electrode temperature is higher than 230 ℃, the regulating and controlling system controls the second laser 105 to reduce the emission power of the laser so as to reduce the temperature until the electrode temperature is reduced to 230 ℃. The temperature regulation and control system of the device detects and regulates and controls the electrode temperature in real time during processing through the infrared optical fiber, so that effective melting of tin is guaranteed, and damage to a bonding pad caused by overlarge laser power is avoided.
Preferably, the apparatus further comprises:
and the focusing system 203 is used for focusing the laser beams emitted by the first laser and the second laser so as to increase the energy density of the laser beams.
Preferably, the focusing system 203 is a microscopic system.
In this embodiment, the apparatus further has a focusing system 203, and the focusing system 203 is a microscope system, and can focus the laser emitted by the laser to improve the energy density of the laser and improve the repair efficiency. In addition, since the focusing system 203 is a microscope system, the microscope system can also be used for monitoring the repairing process by the vision system 103, thereby improving the monitoring accuracy of the vision system.
Preferably, the apparatus further comprises:
and an air blowing and dust extraction system 204 for removing core particle fragments damaged by the laser and particles generated during processing.
In the embodiment of the application, the device is further provided with an air blowing and dust pumping system 204, non-metal particles can be generated when laser emitted by a laser breaks defective core particles and can be sputtered to the periphery, and the impurities are removed by the air blowing and dust pumping system 204, so that the welding quality of subsequent tin brushing and new core particles is ensured.
Preferably, the first laser emits a laser beam of green light or infrared light, and the second laser emits an infrared light laser beam.
Another aspect of the embodiments of the present application further provides a method for laser repairing a micro LED, as shown in fig. 4, which is a schematic flow chart of the method for laser repairing a micro LED provided in the embodiments of the present application, and the method includes:
in the embodiment of the application, whether the tin brushing of the bonding pad is smooth or not, whether the tin is accurately brushed on the bonding pad or not and whether the tin amount is full or not are monitored through a vision system.
in the embodiment of the present application, the position and angle of the core particle placement are detected by the vision system 103, and whether there is an undesirable phenomenon.
As can be seen from the foregoing embodiments of the present invention, in the apparatus for repairing a micro LED by using laser provided in the embodiments of the present application, the laser is used to remove the bad core particles in the micro LED to be repaired, clean and polish the bonding pad, then the new core particles are attached to the bonding pad of the original core particles by tin plating, and then the laser is used to melt the tin paste to realize physical and electrical connection between the core particle electrode and the bonding pad, thereby realizing the repair of the micro LED. The device has the advantages of good accuracy, high repair yield and reliability, unlimited size of applicable core particles and wide application.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In view of the above description of the technical solutions provided by the present invention, those skilled in the art will recognize that there may be variations in the technical solutions and the application ranges according to the concepts of the embodiments of the present invention, and in summary, the content of the present specification should not be construed as limiting the present invention.
Claims (9)
1. An apparatus for laser repairing a micro LED, the apparatus comprising:
the system comprises a processing platform, a vision system, a first laser, a second laser, a carrying system and a testing system;
the processing platform is used for placing a sample to be repaired, and the position of the sample to be repaired is adjusted by moving the processing platform;
the vision system is used for identifying bad core particles in the sample to be repaired;
the first laser is used for emitting laser to remove the bad core particles and cleaning the bonding pads on the substrate corresponding to the bad core particles;
the handling system is used for tinning the bonding pad and picking up a new core particle to be placed on the bonding pad;
the second laser is used for emitting laser to melt tin at the contact position of the new core particle electrode and the welding pad;
the test system is used for detecting the repairing effect of the repaired sample.
2. The apparatus for laser repairing micro LED's of claim 1, further comprising:
and the adjustable diaphragm is used for adjusting the spot size of the laser emitted by the first laser and the second laser according to the size of the bad core particles.
3. The apparatus for laser repairing micro LED's of claim 1, further comprising:
the temperature control system is used for detecting the electrode temperature when the second laser melts the tin; when the temperature is lower than a preset temperature value, controlling the second laser to increase the power of the emitted laser beam until the temperature reaches the preset temperature; and when the temperature is higher than the preset temperature value, controlling the second laser to reduce the power of the emitted laser beam until the temperature reaches the preset temperature.
4. The apparatus according to claim 3, wherein the temperature control system detects the temperature of the electrode by using infrared light, and the infrared light is isolated from the laser beams emitted by the first laser and the second laser by a specific reflector.
5. The apparatus for laser repairing micro LED's of claim 1, further comprising:
and the focusing system is used for focusing the laser beams emitted by the first laser and the second laser so as to increase the energy density of the laser beams.
6. The apparatus for laser repairing micro-LEDs as claimed in claim 5, wherein the focusing system is a microscope system.
7. The apparatus for laser repairing micro LED's of claim 1, further comprising:
and the air blowing and dust extraction system is used for removing core particle fragments damaged by laser and particles generated in the processing.
8. The apparatus according to claim 1, wherein the first laser emits a laser beam of green light or infrared light, and the second laser emits a laser beam of infrared light.
9. A method of laser repairing a micro LED, the method comprising:
fixing a sample to be repaired on a processing platform, lighting the sample to be repaired, identifying bad core particles in the sample to be repaired through a vision system, wherein the non-luminous core particles are the bad core particles;
controlling the processing platform to move the bad core particles to a laser processing area;
controlling a first laser to emit a first laser beam, wherein the first laser beam acts on the poor core particles to crush the poor core particles so as to remove the poor core particles; controlling the first laser beam to clean and polish the bonding pad on the substrate corresponding to the bad core particle;
controlling a carrying system to tin a bonding pad on the substrate corresponding to the bad core particle and monitoring the tin coating effect through a vision system;
controlling a carrying system to pick up new core particles to be placed on the bonding pad, and detecting the placing effect of the core particles through a vision system;
controlling a second laser to emit a second laser beam, so that tin at the contact position of the electrode of the new core particle and the welding pad is uniformly melted;
after the melted tin is cooled and solidified, whether the new core particles are firmly fixed and can emit light is detected through a testing system so as to determine whether the repair is successful.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910955622.2A CN110842367A (en) | 2019-10-09 | 2019-10-09 | Device and method for repairing micro LED by laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910955622.2A CN110842367A (en) | 2019-10-09 | 2019-10-09 | Device and method for repairing micro LED by laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110842367A true CN110842367A (en) | 2020-02-28 |
Family
ID=69596519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910955622.2A Pending CN110842367A (en) | 2019-10-09 | 2019-10-09 | Device and method for repairing micro LED by laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110842367A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110976428A (en) * | 2019-11-19 | 2020-04-10 | 大族激光科技产业集团股份有限公司 | Cleaning device and cleaning method for micro LED |
| CN111933760A (en) * | 2020-09-28 | 2020-11-13 | 苏州科韵激光科技有限公司 | Miniature LED pixel repairing equipment and miniature LED pixel repairing method |
| CN112025118A (en) * | 2020-09-17 | 2020-12-04 | 广东吉洋视觉技术有限公司 | LED lamp bead bonding wire detection and laser burning material receiving all-in-one machine |
| CN112103214A (en) * | 2020-09-08 | 2020-12-18 | 深圳市联得自动化装备股份有限公司 | Detection and repair system and detection and repair method for light-emitting diode product |
| CN113664314A (en) * | 2021-08-24 | 2021-11-19 | 苏州科韵激光科技有限公司 | Miniature LED laser repair device and method |
| CN113857610A (en) * | 2021-09-27 | 2021-12-31 | 苏州科韵激光科技有限公司 | Laser welding and removing method and device |
| CN114038342A (en) * | 2021-03-09 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | LED display screen repairing method |
| TWI757037B (en) * | 2021-01-06 | 2022-03-01 | 揚朋科技股份有限公司 | How to fix the display panel |
| CN114765196A (en) * | 2021-01-15 | 2022-07-19 | 扬朋科技股份有限公司 | Repairing method of display panel |
| CN114932308A (en) * | 2022-04-11 | 2022-08-23 | 深圳市韵腾激光科技有限公司 | Dynamic Mini display unit repair system |
| CN115156654A (en) * | 2021-11-15 | 2022-10-11 | 武汉帝尔激光科技股份有限公司 | Method and device for repairing MINI LED chip |
| CN116072778A (en) * | 2023-03-27 | 2023-05-05 | 河北光兴半导体技术有限公司 | Direct display module chip replacing device and direct display module production line |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101159304A (en) * | 2007-11-20 | 2008-04-09 | 哈尔滨工业大学 | Single beam laser auxiliary LED chip and heat sink directly brazing method |
| CN101480757A (en) * | 2009-01-16 | 2009-07-15 | 陕西午禾科技有限责任公司 | Micro-fine processing system of femtosecond laser for material surface modification |
| CN101673666A (en) * | 2008-09-12 | 2010-03-17 | 奥林巴斯株式会社 | Laser repair device and a laser repair method |
| CN102023614A (en) * | 2010-10-08 | 2011-04-20 | 深圳市大族激光科技股份有限公司 | Laser welding device |
| WO2019024091A1 (en) * | 2017-08-04 | 2019-02-07 | 深圳市柔宇科技有限公司 | Laser repairing method and device |
| KR101953645B1 (en) * | 2018-12-19 | 2019-03-04 | (주)에스티아이 | Apparatus and method for repairing led substrate |
-
2019
- 2019-10-09 CN CN201910955622.2A patent/CN110842367A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101159304A (en) * | 2007-11-20 | 2008-04-09 | 哈尔滨工业大学 | Single beam laser auxiliary LED chip and heat sink directly brazing method |
| CN101673666A (en) * | 2008-09-12 | 2010-03-17 | 奥林巴斯株式会社 | Laser repair device and a laser repair method |
| CN101480757A (en) * | 2009-01-16 | 2009-07-15 | 陕西午禾科技有限责任公司 | Micro-fine processing system of femtosecond laser for material surface modification |
| CN102023614A (en) * | 2010-10-08 | 2011-04-20 | 深圳市大族激光科技股份有限公司 | Laser welding device |
| WO2019024091A1 (en) * | 2017-08-04 | 2019-02-07 | 深圳市柔宇科技有限公司 | Laser repairing method and device |
| KR101953645B1 (en) * | 2018-12-19 | 2019-03-04 | (주)에스티아이 | Apparatus and method for repairing led substrate |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110976428A (en) * | 2019-11-19 | 2020-04-10 | 大族激光科技产业集团股份有限公司 | Cleaning device and cleaning method for micro LED |
| CN112103214A (en) * | 2020-09-08 | 2020-12-18 | 深圳市联得自动化装备股份有限公司 | Detection and repair system and detection and repair method for light-emitting diode product |
| CN112025118A (en) * | 2020-09-17 | 2020-12-04 | 广东吉洋视觉技术有限公司 | LED lamp bead bonding wire detection and laser burning material receiving all-in-one machine |
| CN111933760A (en) * | 2020-09-28 | 2020-11-13 | 苏州科韵激光科技有限公司 | Miniature LED pixel repairing equipment and miniature LED pixel repairing method |
| CN111933760B (en) * | 2020-09-28 | 2020-12-29 | 苏州科韵激光科技有限公司 | Miniature LED pixel repairing equipment and miniature LED pixel repairing method |
| TWI757037B (en) * | 2021-01-06 | 2022-03-01 | 揚朋科技股份有限公司 | How to fix the display panel |
| CN114765196A (en) * | 2021-01-15 | 2022-07-19 | 扬朋科技股份有限公司 | Repairing method of display panel |
| CN114038342A (en) * | 2021-03-09 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | LED display screen repairing method |
| CN113664314A (en) * | 2021-08-24 | 2021-11-19 | 苏州科韵激光科技有限公司 | Miniature LED laser repair device and method |
| CN113857610A (en) * | 2021-09-27 | 2021-12-31 | 苏州科韵激光科技有限公司 | Laser welding and removing method and device |
| CN115156654A (en) * | 2021-11-15 | 2022-10-11 | 武汉帝尔激光科技股份有限公司 | Method and device for repairing MINI LED chip |
| CN114932308A (en) * | 2022-04-11 | 2022-08-23 | 深圳市韵腾激光科技有限公司 | Dynamic Mini display unit repair system |
| CN114932308B (en) * | 2022-04-11 | 2024-01-30 | 深圳市韵腾激光科技有限公司 | Dynamic Mini display unit repairing system |
| CN116072778A (en) * | 2023-03-27 | 2023-05-05 | 河北光兴半导体技术有限公司 | Direct display module chip replacing device and direct display module production line |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110842367A (en) | Device and method for repairing micro LED by laser | |
| JPH0423453A (en) | Method and apparatus for cutting wiring by laser | |
| JP7062703B2 (en) | Laser welding equipment and methods for semiconductor devices | |
| JPH08227919A (en) | Marking method for integrated circuit using laser and equipment therefor | |
| WO2021117753A1 (en) | Collection lens height adjusting method, chip transfer method, collection lens height adjusting device, and chip transfer device | |
| CN113097363B (en) | Repair equipment and repair method for micro light-emitting diode backboard | |
| KR102361309B1 (en) | Apparatus and method for removing mini led chip, and system and method for repairing mini led display module using the same | |
| US6331348B1 (en) | Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate | |
| JPH10163624A (en) | Manufacture of electronic circuit device, solder residue homogenizing jig, metal solder paste transfer jig, and manufacturing device for electronic circuit device | |
| CN116072775A (en) | Chip die bonding method and chip die bonding device | |
| CN116237611A (en) | Micro LED bonding pad residual tin flattening device, method and repairing device | |
| JP3193678B2 (en) | Semiconductor wafer repair apparatus and method | |
| JP6318568B2 (en) | Method for removing a semiconductor chip from a foil | |
| KR20190085273A (en) | Microchip LED element faulty repair method | |
| CN110976428A (en) | Cleaning device and cleaning method for micro LED | |
| KR102517115B1 (en) | Defective pixel inspection method of mini LED array for backlight unit | |
| CN113333887A (en) | Automatic maintenance system of MINI LED | |
| KR20220122166A (en) | Led repairing system and method | |
| CN116511723A (en) | Method and device for removing mini LED adhesive layer by laser | |
| CN113471346A (en) | Repairing method of micro light-emitting diode | |
| KR102686143B1 (en) | Mini LED package manufacturing process | |
| CN116072794A (en) | Display panel repairing method and system | |
| JPH088514A (en) | Method and device for local feeding of liquid material to electronic part | |
| KR102686142B1 (en) | Laser repair manufacturing process of mini LED chip | |
| KR101496050B1 (en) | Apparatus for inspecting light-emitting devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220801 Address after: 518000 101, building 6, Wanyan Industrial Zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Applicant before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200228 |
|
| RJ01 | Rejection of invention patent application after publication |