CN107359134A - A kind of method and apparatus for realizing that bga chip reprocesses using laser - Google Patents
A kind of method and apparatus for realizing that bga chip reprocesses using laser Download PDFInfo
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- CN107359134A CN107359134A CN201710631883.XA CN201710631883A CN107359134A CN 107359134 A CN107359134 A CN 107359134A CN 201710631883 A CN201710631883 A CN 201710631883A CN 107359134 A CN107359134 A CN 107359134A
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- bga chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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Abstract
The invention discloses a kind of method and apparatus for realizing that using laser bga chip reprocesses, belong to printed circuit board manufacturing field, it includes laser scanning heating system, coaxial image system, bottom hot blast nozzle, preheating table and pcb board fixture etc., pass through being coaxially disposed for the visible reflectance axis of the laser beam axis to laser scanning heating system and coaxial image system, and make laser beam irradiation area face bottom hot blast nozzle, it is achieved thereby that coaxial image system, laser scanning heating system is correspondingly arranged with bottom hot blast nozzle, only need to adjust field positions of the bga chip on coaxial image system, aligning for bga chip and bottom hot blast nozzle and laser scanning heating head can be realized.The present invention not only effectively reduces the influence in bga chip rework process to other components around it with the method and apparatus of above-mentioned principle, also substantially reduce bga chip in rework process aligns the time, the significant increase application cost reprocessed efficiency, reduce bga chip of bga chip.
Description
Technical field
The invention belongs to printed circuit board manufacturing field, and in particular to a kind of side for realizing that bga chip reprocesses using laser
Method and device.
Background technology
With the continuous development of electronic technology, electronic product more tends to miniaturization, portability and intellectuality, traditional circuit
Also there occurs larger change, the application of printed circuit board (also known as printed circuit board (PCB), abbreviation pcb board) are more next for type of attachment
It is more extensive, correspondingly, quick development is also obtained with all kinds of chips that pcb board is correspondingly arranged, has been had been widely used for various
In electronic product.
With the integrated level more and more higher of chip, I/O pin counts are consequently increased, and are ensureing the basis of chip miniaturization
On, the pin spacing of chip is less and less, and this is in bga chip (Ball Grid Array, ball-bar array packaged chip) and CSP
Particularly evident, the chip such as bga chip and CSP chips embodied in chip (Chip Scale Package, chip size packages)
Appearance and development be greatly promoted the miniaturization and intellectuality of electronic product, still, due to bga chip pin spacing very
It is small, and generally also high-density installation is installed on the pcb board of bga chip has other electronic components, therefore bga chip is reprocessed
Difficulty is larger, it is necessary to be completed by special BGA repair workstations and according to certain Rework Technics.
Field is reprocessed in existing bga chip, and generally use is the BGA Rework stations based on infrared heating, such as patent
A kind of BGA intelligence Rework station disclosed in document CN 201520222667.6, including operating desk, infrared heating device,
Control device and display device, the infrared heating device connect with operating desk, and the control device and display device pass through
Diode connection, heating tip-off is carried out to bga chip with infrared heating device in the program, though it can be more
The accurate maintenance and positioning for realizing bga chip；But the bga chip Rework station of the above-mentioned type is there is also significant limitation,
Such as：1. the heated effluent field of infrared heating device is larger, easily the component around bga chip is impacted, seriously
When can cause around component rosin joint or sealing-off；2. during the contraposition of existing heater and bga chip based on infrared ray
Between it is longer, and aligning accuracy is poor, and significantly reduce bga chip reprocesses efficiency, although being set on existing BGA Rework stations
CCD image systems realize optical registration to lift the precision that aligns of heater and bga chip, but change chi in pcb board
The optical registration of bga chip and image system is realized in after the very little, it is necessary to position of artificial repeatedly adjustment pcb board, greatly drops
The efficiency that low bga chip is reprocessed.Therefore, the presence of drawbacks described above cause existing bga chip reprocess accuracy and efficiency by
To greatly influenceing, this application for bga chip causes with development greatly to be adversely affected, and have impact on electronic product indirectly
Miniaturization, intelligent development, improve application and the cost of overhaul of bga chip.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, bga chip is realized using laser the invention provides one kind
The method and apparatus reprocessed, wherein being heated by using laser to the bga chip to be reprocessed in finite region, not only greatly
The big efficiency of reprocessing for improving bga chip, other electronic components of bga chip side installation are also avoided as far as possible by not
Profit influences, and is greatly promoted the progress of bga chip Rework Technics.
To achieve the above object, a kind of one aspect of the present invention, there is provided side for realizing that bga chip reprocesses using laser
Method, it is heated to disengage it from pcb board using laser caused by laser scanning heating system to bga chip, its step bag
Include：
S1：Corresponding laser scanning heating system is provided for the coaxial image system to pcb board imaging, and make it that this is coaxial
The field range of image system shooting corresponds to the region of laser scanning heating system scanning heating；
S2：According to the bottom hot blast nozzle of the size selection correspondingly-sized of bga chip to be reprocessed on pcb board, and it is arranged at area
Clamping fastening is completed by pcb board fixture to be directed at bga chip, by pcb board to be reprocessed in domain bottom；
S3：Open coaxial image system to be imaged the pcb board in field range, wait to reprocess according to imaging accurate adjustment
The position of bga chip so that bga chip is swept with the laser in the bottom hot blast nozzle and the laser scanning heating system respectively
Retouch heating head accurate contraposition；
S4：Open preheating table and treat and reprocess pcb board bottom surface and uniformly preheated；
S5：The laser scanning heating system and the bottom hot blast nozzle, the laser are opened after closing the preheating table
Scan heating system and produce upper surface progress uniform scanning heating of the laser to bga chip, while lead in the bottom hot blast nozzle
Enter hot blast uniformly to heat the lower surface of bga chip, bga chip to be reprocessed can be made to depart from from pcb board, to be returned
Repair.
As a further improvement on the present invention, the coaxial image system includes being used to reflect bga chip in visual field middle position
The zoom lens and be used for that visible reflectance mirror, the visual field picture for reflecting the visible reflectance mirror put are imaged
Show zoom lens imaging picture and the display screen that bga chip optics aligns is adjusted with this；
The axis of the zoom lens intersects with the laser beam axis projected in the laser scanning heating head and vertical, institute
Laser beam axis angled setting of the visible reflectance mirror with the laser scanning heating head directive bga chip is stated for laser
Beam transmits the visible reflectance mirror to realize that scanning of the laser to bga chip is heated, and the visible reflectance mirror with it is described
The axis of zoom lens is also set for the bga chip in visible reflectance mirror reflection below visual field in same angle
Realize imaging of the zoom lens to bga chip to the zoom lens and show.
As a further improvement on the present invention, the position adjustments of the bga chip to be reprocessed is so that it are in coaxial shadow
As the field of view center position of system.
As a further improvement on the present invention, 45 ° be the angle ranging from.
As a further improvement on the present invention, in the step S5 also using infrared measurement of temperature module in heating process it is right
The surface temperature of bga chip is monitored in real time.
As a further improvement on the present invention, it is described to realize that the method that bga chip is reprocessed also includes using laser：
S6：Maintenance judgement is carried out to the bga chip removed, if unrepairable, the bga chip that more renews, if can repair,
Then carry out bga chip and plant the service works such as ball；
S7：, will after being aligned after the bga chip cleaning after new bga chip or reparation with the correspondence position on pcb board
Bga chip is welded on pcb board, completes reprocessing for bga chip；
S8：Pcb board after reparation is removed from pcb board fixture, corresponding device is closed, completes whole maintenance process.
Another aspect of the present invention, there is provided a kind of device for realizing that bga chip reprocesses using laser, including frame, its
It is characterised by,
Laser scanning heating system, coaxial image system, bottom hot blast nozzle, preheating table and PCB are provided with the frame
Board clamp；
Wherein, the laser scanning heating system includes being used to produce the laser generator of laser, for transmitting laser
Laser optical path and for by laser beam deflection be aligned with bga chip with realize laser to bga chip scan heating laser
Scan heating head, the laser scanning heating system be located at the top of the frame and the laser scanning heating head project it is sharp
Light beam aligns with the bottom hot blast nozzle；
The coaxial image system include be used for reflect bga chip in visual field the visible reflectance mirror of position, for pair
The zoom lens of the visual field picture imaging of visible reflectance mirror reflection and for showing the zoom lens imaging picture
And the display screen that bga chip optics aligns is adjusted with this, wherein, the axis of the zoom lens and the laser scanning heating head
The laser beam axis of middle injection are intersecting and vertical, the visible reflectance mirror and the laser scanning heating head directive bga chip
The angled setting of laser beam axis for visible reflectance mirror described in laser beam transmission to realize that laser is swept to bga chip
Heating is retouched, and the axis of the visible reflectance mirror and the zoom lens is also set for the visible ray in same angle
Speculum reflection below the bga chip in visual field to the zoom lens and realize the zoom lens to bga chip into
As display；
The bottom hot blast nozzle is arranged in the frame, itself and the laser beam pair projected in the laser scanning heating head
Just heated for the bga chip bottom surface to be reprocessed after being aligned to regulation；
The pcb board fixture is used to fix pcb board to be reprocessed, and it is arranged at the both sides of the bottom hot blast nozzle and can
Moved in the horizontal direction relative to the bottom hot blast nozzle to realize that bga chip aligns with the laser scanning heating head；
The preheating table is arranged at the lower section of the pcb board fixture for pcb board fixed on the pcb board fixture
Preheated.
As a further improvement on the present invention, the visible reflectance mirror and the laser scanning heating head directive BGA cores
Angle between the laser beam axis of piece is 45 °.
As a further improvement on the present invention, it is described to realize that the device that bga chip is reprocessed also includes being used in fact using laser
When monitor bga chip surface temperature infrared measurement of temperature module.
As a further improvement on the present invention, it is described using laser realize device that bga chip reprocesses also include with it is described
Pcb board fixture is matched for adjusting the X-Y axle governor motions of bga chip horizontal level.
As a further improvement on the present invention, the preheating table is infrared preheating table.
In general, by the contemplated above technical scheme of the present invention compared with prior art, have below beneficial to effect
Fruit：
(1) the of the invention method and/or device for realizing that bga chip reprocesses using laser, by using laser heating
Form realizes reprocessing for bga chip, reduces the influence to other components around it in bga chip rework process, has
Effect avoid because bga chip is reprocessed and to the adverse effect of other normal work components on pcb board；
(2) the of the invention method and/or device for realizing that bga chip reprocesses using laser, by setting coaxial image system
Unite to realize aligning for laser-heated zone and bga chip to be reprocessed, shorten and adjust bga chip horizontal level to cause it
The time for aligning and consuming with laser beam, effectively increase bga chip reprocesses efficiency；
(3) the of the invention method and/or device for realizing that bga chip reprocesses using laser, by being heated to laser scanning
The laser beam axis of system and the visible reflectance axis of coaxial image system are coaxially disposed, and cause laser beam irradiation area
Face bottom hot blast nozzle, it is achieved thereby that coaxial image system, laser scanning heating system are correspondingly arranged with bottom hot blast nozzle,
Only need to adjust field positions of the bga chip on coaxial image system, can realize that bga chip is swept with bottom hot blast nozzle and laser
Retouch aligning for heating head, greatly improve bga chip to forward efficiency, shorten the rework time of bga chip；
(4) the of the invention method and/or device, its structure and/or principle letter for realizing that bga chip reprocesses using laser
It is single, it is easy to accomplish, the efficiency that bga chip is reprocessed can be effectively improved, reduces maintenance, the maintenance cost of bga chip, is promoted indirectly
The development and popularization of bga chip, reduce the application cost of bga chip.
Brief description of the drawings
Fig. 1 is the principle schematic that bga chip repair method is realized using laser of the embodiment of the present invention；
Fig. 2 is the structural representation that bga chip device for repairing is realized using laser of the embodiment of the present invention；
In all of the figs, same reference represents identical technical characteristic, is specially：1. laser scanning heating system
System, 101. laser generators, 102. laser optical paths, 103. laser scanning heating heads, 2. coaxial image systems, 201. varifocal mirrors
Head, 202. visible reflectance mirrors, 203. display screens, 3. bottom hot blast nozzles, 4.PCB board clamps, 5. preheating tables, the regulation of 6.X-Y axles
Mechanism, 7. infrared measurement of temperature modules, 8. frames, 801. bottom plates, 802. side plates, 9. control systems.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
In addition, as long as technical characteristic involved in each embodiment of invention described below is each other not
Conflict can is formed to be mutually combined.
Specifically, it is illustrated in figure 2 in a preferred embodiment of the invention and realizes dress that bga chip reprocesses using laser
Put structural representation, including laser scanning heating system 1, coaxial image system 2, bottom hot blast nozzle 3, pcb board fixture 4,
Preheating table 5, X-Y axles governor motion 6, infrared measurement of temperature module 7, frame 8 and control system 9 etc., further specifically, laser scanning
Heating system 1 includes laser generator 101, laser optical path 102 and laser scanning heating head 103, and coaxial image system 2 includes becoming
Zoom lens 201, visible reflectance mirror 202 and display screen 203, frame 8 are made up of bottom plate 801 and side plate 802.
Further specifically, the primary structure portion of bga chip device for repairing is realized in a preferred embodiment using laser
Part is arranged in frame 8, and frame 8 is preferably intersected vertically by bottom plate 801 and side plate 802 and forms the L-shaped structure of lateral cross,
Side plate 802 is also preferably designed as planer type structure, i.e., forms closed-in construction, then and bottom by two root posts and a crossbeam
801 are bonded gantry type frame；Further, laser scanning heating system 1 is arranged on the upper surface of side plate 802, wherein,
Laser scanning heating system 1 preferably includes laser generator 101, laser optical path 102 and laser scanning heating head 103, and laser
Generator 101, laser optical path 102 and laser scanning heating head 103 are preferably coaxially arranged, and wherein laser generator 101 is arranged in
The rear end of laser optical path 102, for producing laser and being transmitted via laser optical path 102 to swashing located at the front end of laser optical path 102
Optical scanning heating head 103, axis weight of transmission axes of the laser in laser optical path 102 preferably with laser scanning heating system 1
Merge laterally perpendicular to the upper end of side plate 802, and the transmission direction of laser is passed through in the intrinsic deflection of laser scanning heating head 103
After processing, it is preferable that the bottom plate 801 from the interior laser direction projected of laser scanning heating head 103 perpendicular to frame 8, i.e., from sharp
The transmission direction of the laser direction laser in laser optical path 102 projected in optical scanning heating head 103, laser scanning heating
First 103 laser exit faces the bottom plate 801 of frame 8.
Further, there is coaxial image system 2 the underface of laser scanning heating system 1 is coaxially arranged, i.e., coaxial shadow
As the axis of system 2 and the axis in the vertical direction of laser scanning heating system 1 are parallel to each other, the axle of coaxial image system 2
Also in the vertical direction is parallel to each other line with the laser transmission axes in laser optical path 102.Further specifically, a preferred reality
The coaxial image system 2 applied in example includes zoom lens 201, visible reflectance mirror 202 and display screen 203, wherein, it is seen that light is anti-
Penetrating mirror 202 can transmit to visible reflectance and to laser, and it is arranged on the front of zoom lens 201 and heated in laser scanning
First 103 underface, it is seen that the installation site of light reflection mirror 202 make it that its eyeglass is in not only 45 ° with the axis of zoom lens 201
And image to the zoom lens 201 immediately below reflection laser scanning heating head 103 is imaged, and also its eyeglass is just swept for laser
It is in 45 ° that the laser beam that transmits out in heating head 103, which is retouched, by and with the axis of above-mentioned laser beam, you can sees light reflection mirror 202
The one side for facing laser scanning heating head 103 transmits the part that the lower section of heating head 103 is scanned with heating laser for laser, and visible
Image of component to the zoom lens 201 that the one side that light reflection mirror 202 faces zoom lens 201 can launch below the face is imaged；Enter
One step, the axis of zoom lens 201 intersect with the laser beam axis projected in laser scanning heating head 103 and vertical, its
The blur-free imaging to the lower part of visible reflectance mirror 202 is realized with setting the camera mating reaction in portion behind, and then
It is shown on display screen 203, lower section is adjusted mutually in requisition for imaging section by the picture position on display screen 203 for operating personnel
The position of part.After the completion of coaxial image system 2 and laser scanning heating system 1 are arranged, the position of two system corresponding components is with regard to excellent
Choosing is immobilized without adjusting again, and visible reflectance mirror 202 reflects the light path of lower part with swashing to two systems after setting completed
The light path for the laser beam that optical scanning heating head 103 is sent overlaps.
Further, preheating table 5 is additionally provided with the bottom plate 801 of frame 8, for being slowly heated pcb board to be reprocessed, to subtract
Small bga chip heat affected zone to be reprocessed and the thermograde of periphery component, prevent pcb board to be reprocessed from becoming because thermograde is excessive
Shape, in a preferred embodiment the preheating time of preheating table 5 continue 5~10 minutes, maximum temperature is about 100 DEG C or so, is entered
One step, preheating table 5 are arranged on the fixed pedestal on bottom plate 801 and parallel with the bottom plate 801 of frame 8, and its geometric center
It is preferred that facing the laser scanning heating head 103 of top, preheating table 5 can be more preferably infrared preheating table；Further, exist
The geometric center position of preheating table 5 is additionally provided with bottom hot blast nozzle 3, and it, which is used to treat, reprocesses the heating of bga chip bottom surface, to cause
Larger thermograde is not present in bga chip to be reprocessed its upper and lower surface in the heating process of surface, reduces because its upper surface is swashed
In light heating process temperature rise it is too fast and with lower surface existing for thermograde, prevent bga chip to be reprocessed because of excessive temperature
Deformation even rupture failure, lifts the success rate reprocessed, further, in the geometry of bottom hot blast nozzle 3 caused by degree gradient
The heart overlaps with the laser beam axis projected in laser scanning heating head 103, ensures laser scanning heating region without departing from BGA to be reprocessed
The size range of chip, reduce the influence to other components on pcb board；The size of bottom hot blast nozzle 3 is not specifically limited,
Specific replacing can be done according to the size of bga chip to be reprocessed, bottom hot blast nozzle 3 preferably locks it in fixation with movable fastener
On pedestal, it is further preferred that bottom hot blast nozzle 3 uses electric-heating-wire-heating.
Further, the X-Y axles for adjusting pcb board position to be reprocessed are additionally provided with the top of preheating table 5 and adjust machine
Structure 6, to realize aligning for bga chip to be reprocessed and laser scanning heating head 103, X-Y axles governor motion 6 is tower structure,
It includes the fixed frame overlapped with the center of preheating table 5, and the area of fixed frame covering is preferably greater than the face of preheating table 5
Product, be symmetrically arranged with fixed frame can the slide bar that horizontally slips of opposing frame, be symmetrically arranged with for fixing on symmetrical slide bar
The pcb board fixture 4 of pcb board, and pcb board fixture 4 can opposing frame slid back and forth on slide bar, the quantity of pcb board fixture 4 is not
Make specific restriction, it can be carried out preferably according to specific needs, and pcb board fixture 4 in a preferred embodiment is preferably 6,
3 identical pcb board fixtures 4 are provided with each slide bar；After reprocessing pcb board and being fixed on pcb board fixture 4, treat
Pcb board is reprocessed to be in the heating region of preheating table 5, and the image frame that can be fed back according to coaxial image system 2, pass through X-Y
Axle governor motion 6 adjusts the horizontal level of pcb board to be reprocessed, and finally realizes that bga chip to be reprocessed aligns with bottom hot blast nozzle 3,
I.e. now bga chip to be reprocessed and the laser scanning heating region of laser scanning heating head 103 align, what display screen 203 was shown
The position of bga chip to be reprocessed also is located at the centre of the imaging region of zoom lens 201, the coaxial shadow in a preferred embodiment
As system 2 can realize that 10~50 multiples are piled up greatly, operating personnel can be in the high magnification magnified image on observation display screen 203
X-Y axles governor motion 6 is adjusted simultaneously, the optical registration of bga chip to be reprocessed can be quickly completed.
Further, control system 9 is additionally provided with frame 8, for sending control to the corresponding component of BGA device for repairing
Instruct to realize the co-ordination between each part；Further, infrared measurement of temperature module 7 is additionally provided with, it is preferably disposed on side
On the upper surface of plate 802, the surface temperature that bga chip is reprocessed for being treated in rework process is monitored in real time, works as temperature
When rising towards alarm temperature, control system 9 by negative-feedback to reduce laser power, slow down rate of rise in temperature until
Stop heating, prevent bga chip to be reprocessed to be damaged；Floor light light source is additionally provided with one preferred embodiment, to show
Clearly image can be presented in display screen 203.
In order to which the embodiment of the present invention is further described, bga chip is realized using laser in a preferred embodiment
The method and step reprocessed is as follows：
S1：Corresponding laser scanning heating system 1 is provided for the coaxial image system 2 to pcb board imaging, sets varifocal mirror
First 201 axis intersects and vertical with the laser beam axis projected in laser scanning heating head 103, it is seen that light reflection mirror 202 with
The laser beam axis of the directive bga chip of laser scanning heating head 103 are set for laser beam transmission visible reflectance in 45° angle
Mirror 202 is to realize that scanning of the laser to bga chip is heated, and the axis of visible reflectance mirror 202 and zoom lens 201 is also in
45° angle sets for the bga chip that the visible reflectance mirror 202 is reflected in visual field below to zoom lens 201 and real
Existing imaging of the zoom lens 201 to bga chip is shown, that is, causes the field range of the coaxial image system 2 shooting corresponds to swash
The region of the scanning heating of optical scanning heating system 1；
S2：According to the bottom hot blast nozzle 3 of the size selection correspondingly-sized of bga chip to be reprocessed and set and coaxial shadow
Fastening is locked in bottom plate after being aligned as the region for field range and/or laser scanning heating system 1 the scanning heating that system 2 is shot
On 801, pcb board to be reprocessed is placed on pcb board fixture 4 and clamping fastening is completed by pcb board fixture 4, with pcb board fixture
It is used for adjusting the X-Y axles governor motion 6 of pcb board horizontal level with setting；
S3：Floor light light source and coaxial image system 2 are opened, adjusts zoom lens 201 to cause pcb board to be reprocessed to exist
Blur-free imaging on display screen 203, determines whether bga chip to be reprocessed aligns with bottom hot blast nozzle 3 from the visual field of display screen 203,
If not aligning, X-Y axles governor motion 6 is controlled to realize bga chip horizontal level on pcb board to be reprocessed by control system 9
Regulation so that bga chip is located at the center of visual field on display screen 203, and now bga chip to be reprocessed heats with laser scanning
First 103 laser beam axis and bottom hot blast nozzle 3 aligns；
S4：Open preheating table 5 and treat and reprocess the bottom surface of pcb board and slowly preheated, preheat to close after 5~10min and preheat
Plate 5, preheating temperature are no more than 100 DEG C；
S5：Laser scanning heating system 1, bottom hot blast nozzle 3 and infrared measurement of temperature module 7 are opened, by laser scanning heating head
Laser beam in 103 treats the upper surface progress uniform scanning heating for reprocessing bga chip, and bottom hot blast nozzle 3, which is treated, reprocesses BGA cores
The lower surface of piece synchronizes uniform heating, and in above-mentioned heating process, bga chip is monitored in real time by infrared measurement of temperature module 7
Surface temperature；
S6：To after reprocessing bga chip and departing from from pcb board, laser scanning heating system 1, the and of bottom hot blast nozzle 3 are closed
Infrared measurement of temperature module 7, bga chip absorption to be reprocessed is removed to be reprocessed by vacuum gun；
S7：The bga chip removed is subjected to Repair, judges whether bga chip can be repaired, if can repair, is planted
The repairs such as ball processing, if unrepairable, the bga chip that more renews；
S8：Correspondence position bga chip after the bga chip repaired or replacing being placed on pcb board, open soldering
Bga chip is welded on the correspondence position by program, completes reprocessing for bga chip on pcb board to be reprocessed；,
S9：Pcb board fixture 4 is unclamped, and the pcb board after reparation is removed from pcb board fixture 4, completes the pcb board
Bga chip rework process；
S10：Circulation step S1~S9, complete reprocessing for bga chip on batch pcb board to be reprocessed.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., all should be included
Within protection scope of the present invention.
Claims (10)
1. a kind of method for realizing that bga chip reprocesses using laser, it utilizes laser pair caused by laser scanning heating system (1)
Bga chip is heated to disengage it from pcb board, and its step includes：
S1：Corresponding laser scanning heating system (1) is provided for the coaxial image system (2) to pcb board imaging, and make it that this is same
The field range of axle image system (2) shooting corresponds to the region of the laser scanning heating system (1) scanning heating；
S2：According to the bottom hot blast nozzle (3) of the size selection correspondingly-sized of bga chip to be reprocessed on pcb board, and it is arranged at region
Clamping fastening is completed by pcb board fixture (4) to be directed at bga chip, by pcb board to be reprocessed in bottom；
S3：Open the coaxial image system (2) to be imaged the pcb board in field range, treated according to imaging accurate adjustment
Reprocess the position of bga chip so that bga chip respectively with the bottom hot blast nozzle (3) and the laser scanning heating system (1)
In laser scanning heating head (103) accurate contraposition；
S4：Open preheating table (5) and treat and reprocess pcb board bottom surface and uniformly preheated；
S5：Close the preheating table (5) and open the laser scanning heating system (1) and the bottom hot blast nozzle (3) afterwards, it is described
Laser scanning heating system (1) produces laser and carries out uniform scanning heating, while the bottom hot blast to the upper surface of bga chip
Hot blast is passed through in mouth (3) uniformly to heat the lower surface of bga chip, and bga chip to be reprocessed can be made to depart from from pcb board,
To be reprocessed.
2. the method according to claim 1 for realizing that bga chip reprocesses using laser, wherein, the coaxial image system
(2) include being used to reflect the visible reflectance mirror (202) of bga chip position in visual field, for the visible reflectance mirror
The zoom lens (201) of the visual field picture imaging of reflection and for showing zoom lens imaging picture and being adjusted with this
The display screen (203) that bga chip optics aligns；
The axis of the zoom lens (201) intersects simultaneously with the laser beam axis projected in the laser scanning heating head (103)
Vertically, the visible reflectance mirror (202) and the laser beam axis of laser scanning heating head (103) the directive bga chip are in
Angle is set for visible reflectance mirror (202) described in laser beam transmission to realize that scanning of the laser to bga chip is heated, and
The visible reflectance mirror (202) and the axis of the zoom lens (201) are also set for described visible in same angle
The bga chip that light reflection mirror (202) is reflected in visual field below realizes the zoom lens to the zoom lens (201)
(201) imaging to bga chip is shown.
3. the method according to claim 1 or 2 for realizing that bga chip reprocesses using laser, wherein, the BGA to be reprocessed
The position adjustments of chip is so that it are in the field of view center position of the coaxial image system (2).
4. according to the method according to any one of claims 1 to 3 for realizing that using laser bga chip reprocesses, wherein, the angle
Spend for 45 °.
5. according to the method according to any one of claims 1 to 4 for realizing that using laser bga chip reprocesses, wherein, the step
Also the surface temperature of bga chip is monitored in real time in heating process using infrared measurement of temperature module (7) in rapid S5.
6. according to the method according to any one of claims 1 to 5 for realizing that using laser bga chip reprocesses, in addition to：
S6：Maintenance judgement is carried out to the bga chip removed, if unrepairable, the bga chip that more renews if can repair, enters
Row bga chip plants the service works such as ball；
S7：After being aligned after the bga chip cleaning after new bga chip or reparation with the correspondence position on pcb board, by BGA cores
Piece is welded on pcb board, completes reprocessing for bga chip；
S8：Pcb board after reparation is removed from pcb board fixture (4), corresponding device is closed, completes whole maintenance process.
7. a kind of device for realizing that bga chip reprocesses using laser, including frame (8), it is characterised in that
Laser scanning heating system (1), coaxial image system (2), bottom hot blast nozzle (3), preheating are provided with the frame (8)
Plate (5) and pcb board fixture (4)；
Wherein, the laser scanning heating system (1) includes being used for the laser generator (101), sharp for transmitting for producing laser
The laser optical path (102) of light and for by laser beam deflection be aligned with bga chip with realize laser to bga chip scan
The laser scanning heating head (103) of heating, the laser scanning heating system (1) are located at the top of the frame (8) and described
The laser beam that laser scanning heating head (103) projects aligns with the bottom hot blast nozzle (3)；
The coaxial image system (2) includes being used for visible reflectance mirror (202), the use for reflecting bga chip position in visual field
In the zoom lens (201) for the visual field picture imaging reflected the visible reflectance mirror (202) and for showing the change
Zoom lens (201) are imaged picture and adjust the display screen (203) that bga chip optics aligns with this, wherein, the zoom lens
(201) laser beam axis projected in axis and the laser scanning heating head (103) intersect and vertical, and the visible ray is anti-
Laser beam axis angled setting of the mirror (202) with laser scanning heating head (103) the directive bga chip is penetrated for laser
Beam transmits the visible reflectance mirror (202) to realize that scanning of the laser to bga chip is heated, and the visible reflectance mirror
(202) also set in same angle with the axis of the zoom lens (201) and reflected for the visible reflectance mirror (202)
Below the bga chip in visual field realized to the zoom lens (201) zoom lens (201) to bga chip into
As display；
The bottom hot blast nozzle (3) is arranged in the frame (8), is projected in itself and the laser scanning heating head (103)
Laser beam aligns to be heated for the bga chip bottom surface to be reprocessed after being aligned to regulation；
The pcb board fixture (4) is used to fix pcb board to be reprocessed, and it is arranged at the both sides of the bottom hot blast nozzle (3) simultaneously
It can be moved in the horizontal direction relative to the bottom hot blast nozzle (3) to realize bga chip and the laser scanning heating head (103)
Align；
The preheating table (5) is arranged at the lower section of the pcb board fixture (4) for PCB fixed on the pcb board fixture
Plate is preheated.
8. the device according to claim 7 for realizing that bga chip reprocesses using laser, wherein, the visible reflectance mirror
(202) angle between the laser beam axis of the laser scanning heating head (103) directive bga chip is 45 °.
9. device that bga chip reprocesses is realized using laser according to claim 7 or 8, wherein, in addition to for real-time
Monitor the infrared measurement of temperature module (7) of bga chip surface temperature.
10. device that bga chip reprocesses is realized using laser according to any one of claim 7~9, wherein, also wrap
Include and matched with the pcb board fixture (4) for adjusting the X-Y axles governor motion (6) of bga chip horizontal level.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710631883.XA CN107359134B (en) | 2017-07-28 | 2017-07-28 | Method and device for realizing BGA chip repair by using laser |
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|---|---|---|---|
| CN201710631883.XA CN107359134B (en) | 2017-07-28 | 2017-07-28 | Method and device for realizing BGA chip repair by using laser |
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| CN107359134B CN107359134B (en) | 2020-09-11 |
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| CN110462807A (en) * | 2018-02-05 | 2019-11-15 | 镭射希股份有限公司 | The reflux of electronic component and device of doing over again |
| CN111526670A (en) * | 2020-04-15 | 2020-08-11 | 武汉博联特科技有限公司 | BGA laser repairing system based on galvanometer |
| CN111962130A (en) * | 2020-07-17 | 2020-11-20 | 苏州浪潮智能科技有限公司 | Electroplating system and method for BGA area in PCB |
| CN113333887A (en) * | 2021-07-11 | 2021-09-03 | 江苏鸿佳电子科技有限公司 | Automatic maintenance system of MINI LED |
| CN113857610A (en) * | 2021-09-27 | 2021-12-31 | 苏州科韵激光科技有限公司 | Laser welding and removing method and device |
| CN116021104A (en) * | 2023-01-16 | 2023-04-28 | 苏州浪潮智能科技有限公司 | BGA element maintenance device, method and system |
| CN118002869A (en) * | 2024-03-11 | 2024-05-10 | 广东金鉴实验室科技有限公司 | Laser heating thermal welding equipment |
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