CN116021104A - BGA element maintenance device, method and system - Google Patents
BGA element maintenance device, method and system Download PDFInfo
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- CN116021104A CN116021104A CN202310065979.XA CN202310065979A CN116021104A CN 116021104 A CN116021104 A CN 116021104A CN 202310065979 A CN202310065979 A CN 202310065979A CN 116021104 A CN116021104 A CN 116021104A
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000012423 maintenance Methods 0.000 title claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 131
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 106
- 229910000679 solder Inorganic materials 0.000 claims abstract description 92
- 238000005507 spraying Methods 0.000 claims abstract description 72
- 230000008439 repair process Effects 0.000 claims abstract description 71
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 54
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 50
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims description 71
- 230000002950 deficient Effects 0.000 claims description 42
- 239000007788 liquid Substances 0.000 claims description 21
- 230000008018 melting Effects 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 12
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 10
- 230000004048 modification Effects 0.000 claims description 9
- 238000012986 modification Methods 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 description 26
- 238000004140 cleaning Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 230000036760 body temperature Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a BGA element maintenance device, a method and a system, which belong to the technical field of PCBA production, wherein the device comprises an SRT repair table, and a laser tin spraying module and a ball feeding mechanism are arranged on the SRT repair table; the ball feeding mechanism comprises a liftable nozzle, a ball separating disc is arranged around the nozzle, and a solder ball container is arranged at the upper part of the ball separating disc; the bottom of the solder ball container is provided with a ball dropping hole, the ball dropping hole is connected with a ball conveying pipeline, and the ball conveying pipeline penetrates through the ball separating disc and is communicated with the nozzle; the nozzle is provided with a ball outlet hole, a nitrogen inlet hole, a laser hole and a ball inlet hole. According to the BGA component maintenance device, method and system provided by the invention, the laser tin spraying technology is adopted to replace the original technology of poor BGA requiring ball planting, so that the problems of manual ball planting cost and poor yield are reduced, the links of BGA ball planting are reduced in the whole repairing technology process, the repairing time is greatly shortened, and the repairing efficiency and yield are improved.
Description
Technical Field
The invention belongs to the technical field of PCBA production, and particularly relates to a BGA element maintenance device, method and system.
Background
BGA, a short for Bal l Gri d Array, is a ball-point grid array package.
The PCB is a short for Printed Circui t Board, printed circuit board.
PCBA is a short name of Printed Circui t Board As semb ly, printed and assembled circuit board.
In the current high-speed development of the electronic industry, the PCBA is more and more complicated, the working environment is more and more diversified, the integration level of BGA packaging components is higher, the distance is smaller and smaller, and in the PCBA processing process, the BGA components can generate a certain proportion of reject ratio due to the problems of process printing, surface mounting, reflow oven temperature and the like, such as BGA short circuit, empty soldering and the like. The BGA devices are often expensive and, to reduce production costs, the BGA defects are removed and the device is re-ball-mounted for reuse.
The existing BGA maintenance method comprises the following steps:
the industry adopts a repair heating machine to heat and remove bad BGA, after the removal, the BGA needs to be subjected to a commission company or a company with the capability to implant balls, and after the implantation of the balls is finished, the inspection appearance can be reused after passing. However, many defects often need to be successfully planted for many times, and the BGA can not be used in time after being planted, so that the situation is converted into company income and the stock of the BGA is backlogged.
In summary, the existing BGA has low repair efficiency and can be utilized only by re-ball implantation and maintenance, namely, the BGA ball implantation process is complex, the maintenance efficiency is low, and the production cost is increased.
This is a disadvantage of the prior art, and therefore, it is highly desirable to provide a method for repairing BGA components that addresses the above-described deficiencies of the prior art.
Disclosure of Invention
Aiming at the defects of complicated and low efficiency of the BGA ball-mounting and repairing process in the prior art, the invention provides a ball-mounting and repairing method for the BGA ball-mounting and repairing process to solve the technical problems.
In a first aspect, the invention provides a BGA component repair device, comprising an SRT repair station, wherein the SRT repair station is provided with a laser tin spraying module and a ball feeding mechanism;
the ball feeding mechanism comprises a liftable nozzle, a ball separating disc is arranged around the nozzle, and a solder ball container is arranged at the upper part of the ball separating disc;
the bottom of the solder ball container is provided with a ball dropping hole, the ball dropping hole is connected with a ball conveying pipeline, and the ball conveying pipeline penetrates through the ball separating disc and is communicated with the nozzle;
the nozzle is provided with a ball outlet hole, a nitrogen inlet hole, a laser hole and a ball inlet hole.
Further, the ball outlet hole is arranged at the bottom of the nozzle;
the aperture of the ball outlet hole is smaller than the outer diameter of the solder ball, and the difference between the aperture of the ball outlet hole and the outer diameter of the solder ball is smaller than a set threshold value;
the ball inlet is arranged on the side surface of the nozzle, and the height of the ball inlet is higher than that of the ball outlet;
the nitrogen inlet hole is arranged at one side of the nozzle opposite to the ball inlet hole;
the laser hole is arranged at the opposite position of the top of the nozzle and the ball outlet, and the laser hole is communicated with the laser tin spraying module.
In a second aspect, the present invention provides a BGA component repair method based on the first aspect, including the steps of:
s1, refitting an original SRT repair table, and adding a laser tin spraying module;
s2, removing the defective BGA element by using the modified SRT repair table;
s3, performing laser solder ball on the BGA packaging position on the surface of the PCBA through the laser solder spraying module;
s4, mounting the removed BGA component and welding according to preset welding parameters.
Further, the specific steps of step S1 are as follows:
s11, adding a laser tin spraying module for an original SRT repair table;
s12, setting a laser tin spraying module to use an original nitrogen pipeline.
Further, the specific steps of step S2 are as follows:
s21, obtaining PCBA with the defective BGA element, and dismantling the defective BGA element by using the modified SRT repair table;
s22, tin removal is carried out on the surface of the defective BGA element and the surface of the PCBA. And the tin removal ensures that the surface of the PCBA and the BGA element is smooth and free of dirt.
Further, the specific steps of step S3 are as follows:
s31, conveying tin ball particles to a nozzle through a ball conveying mechanism;
s32, carrying out laser irradiation on the tin ball through the laser tin spraying module, melting the tin ball, and spraying liquid tin to the corresponding position of the BGA package on the surface of the PCBA through nitrogen to form the tin ball. The nitrogen prevents oxidation of the solder balls during their arrival at the pads from the ejection.
Further, the specific steps of step S31 are as follows:
s311, rotating the ball separating disc to enable the solder balls to reach the ball outlet hole at the tail end of the nozzle from the solder balls through the ball dropping hole, the ball conveying pipeline and the ball inlet hole;
s312, after the ball outlet hole is plugged by the solder ball, nitrogen is infused through the nitrogen inlet hole until the nitrogen pressure in the nozzle reaches a set pressure threshold. The ball separating disc rotates to ensure that the solder balls can drop, and nitrogen prevents the solder balls from being oxidized in the process of reaching the bonding pads from being sprayed out.
Further, the specific steps of step S32 are as follows:
s321, irradiating the solder balls through laser emitted by a laser tin spraying module, and melting the solder balls;
s322, spraying the liquid tin balls to corresponding position bonding pads of the BGA package on the surface of the PCBA under the action of nitrogen;
s323, under the action of self heat and laser, the liquid tin ball and the bonding pad are fused. The laser spraying module emits laser to enable the tin ball to melt, so that the tin ball can drop to a bonding pad of the PCBA from the ball outlet hole, liquid tin can not be splashed after the laser heats and melts the tin ball, and the liquid tin drops to the bonding pad to be full and smooth after solidification. The laser tin spraying does not need to use soldering flux, so that subsequent cleaning or surface treatment of soldering flux residues is saved, and compared with the traditional welding, the laser welding efficiency of the solder balls is higher, the appearance consistency is high, the welding stability is extremely high, and the like, and the thermal influence is minimum.
Further, the specific steps of step S4 are as follows:
s41, aligning the removed BGA element with a corresponding solder ball through coordinate positioning, and mounting the BGA element;
s42, acquiring preset welding temperature parameters and welding duration parameters, and welding the mounted BGA element.
In a third aspect, the present invention provides a BGA component repair system comprising:
the SRT repair table modification module is used for modifying the original SRT repair table and adding a laser tin spraying module;
the defective BGA dismantling module is used for dismantling the defective BGA element by using the modified SRT repairing table;
the laser tin ball welding module is used for carrying out laser tin ball welding on the BGA packaging position on the surface of the PCBA through the laser tin spraying module;
and the BGA element welding module is used for installing the dismantled BGA element and welding according to preset welding parameters.
Further, the SRT rework station retrofit module comprises:
the laser soldering module adding unit is used for adding a laser soldering module for the original SRT repairing table;
and the nitrogen pipeline sharing unit is used for setting an original nitrogen pipeline used by the laser tin spraying module.
Further, the defective BGA tear down module includes:
the defective BGA component dismantling unit is used for obtaining the PCBA with the defective BGA component and dismantling the defective BGA component by using the modified SRT repair table;
PCBA and BGA cleaning unit for removing tin from the surface of defective BGA element and PCBA.
Further, the laser solder ball welding module includes:
a solder ball conveying unit for conveying solder ball particles to the nozzle through a ball conveying mechanism;
and the tin ball laser irradiation unit is used for carrying out laser irradiation on the tin ball through the laser tin spraying module, melting the tin ball, and spraying liquid tin to the corresponding position of the BGA package on the surface of the PCBA through nitrogen to form the tin ball.
Further, the solder ball conveying unit includes:
the solder ball discharging subunit is used for enabling solder balls to reach the ball discharging hole at the tail end of the nozzle from the solder balls through the ball discharging hole, the ball conveying pipeline and the ball feeding hole by rotating the ball separating disc;
and the nitrogen charging subunit is used for feeding nitrogen through the nitrogen inlet hole after the solder ball blocks the ball outlet hole until the nitrogen pressure in the nozzle reaches a set pressure threshold.
Further, the solder ball laser irradiation unit includes:
the laser ball melting subunit is used for emitting laser through the laser tin spraying module, irradiating the tin balls and melting the tin balls;
the ball spraying subunit is used for enabling the liquid tin balls to be sprayed out under the action of nitrogen and sprayed to corresponding position bonding pads of the BGA package on the surface of the PCBA;
and the tin ball welding disc fusion subunit is used for completing fusion of the tin ball and the welding disc under the action of self heat and laser of the liquid tin ball.
Further, the BGA component soldering module includes:
the BGA mounting unit is used for aligning the removed BGA element with the corresponding solder ball through coordinate positioning and mounting the BGA element;
and the BGA welding unit is used for acquiring preset welding temperature parameters and welding duration parameters and welding the mounted BGA element.
The invention has the beneficial effects that:
according to the BGA component maintenance device, method and system provided by the invention, the laser tin spraying technology is adopted to replace the original technology of poor BGA requiring ball planting, so that the problems of manual ball planting cost and poor yield are reduced, the links of BGA ball planting are reduced in the whole repairing technology process, the repairing time is greatly shortened, and the repairing efficiency and yield are improved.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
It can be seen that the present invention has outstanding substantial features and significant advances over the prior art, as well as the benefits of its implementation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic diagram of the BGA component repair apparatus of the present invention.
Fig. 2 is a flow chart of an embodiment 3 of the BGA device repair method of the present invention.
Fig. 3 is a flow chart of an embodiment 4 of the BGA device repair method of the present invention.
Fig. 4 is a schematic diagram showing the operation of the BGA device repairing apparatus in the BGA device repairing method of the present invention.
Fig. 5 is a schematic diagram of a BGA component repair system of the present invention.
In the figure, a 1-SRT repair table; 2-nozzles; 2.1-ball outlet holes; 2.2-nitrogen inlet holes; 2.3-laser holes; 2.4-ball inlet holes; 3-a ball separating disc; 4-tin ball container; 4.1-ball drop holes; 5-a ball conveying pipeline; 6-tin balls; 7-SRT repair station reconstruction modules; 7.1-adding a unit of a laser soldering module; 7.2-nitrogen piping sharing units; 8-poor BGA removal module; 8.1-bad BGA component removal unit; 8.2-PCBA and BGA cleaning units; 9-a laser solder ball welding module; 9.1-solder ball conveying units; 9.2-tin ball laser irradiation unit; a 10-BGA component soldering module; 10.1-BGA mounting units; a 2-BGA solder unit.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
Example 1:
as shown in FIG. 1, the invention provides a BGA component maintenance device, which comprises an SRT repair table 1, wherein a laser tin spraying module and a ball feeding mechanism are arranged on the SRT repair table 1;
the ball feeding mechanism comprises a liftable nozzle 2, a ball separating disc 3 is arranged around the nozzle 2, and a solder ball container 4 is arranged at the upper part of the ball separating disc 3;
the bottom of the solder ball container 4 is provided with a ball dropping hole 4.1, the ball dropping hole 4.1 is connected with a ball conveying pipeline 5, and the ball conveying pipeline 5 penetrates through the ball separating disc 3 and is communicated with the nozzle 2;
the nozzle 2 is provided with a ball outlet 2.1, a nitrogen inlet 2.2, a laser hole 2.3 and a ball inlet 2.4.
According to the BGA component maintenance device provided by the invention, the laser tin spraying technology is adopted to replace the original poor BGA technology requiring ball planting, so that the problems of manual ball planting cost and poor yield are reduced, the links of ball planting of the BGA are reduced in the whole repairing technology process, the repairing time is greatly shortened, and the repairing efficiency and yield are improved.
Example 2:
as shown in FIG. 1, the invention provides a BGA component maintenance device, which comprises an SRT repair table 1, wherein a laser tin spraying module and a ball feeding mechanism are arranged on the SRT repair table 1;
the ball feeding mechanism comprises a liftable nozzle 2, a ball separating disc 3 is arranged around the nozzle 2, and a solder ball container 4 is arranged at the upper part of the ball separating disc 3;
the bottom of the solder ball container 4 is provided with a ball dropping hole 4.1, the ball dropping hole 4.1 is connected with a ball conveying pipeline 5, and the ball conveying pipeline 5 penetrates through the ball separating disc 3 and is communicated with the nozzle 2;
the nozzle 2 is provided with a ball outlet hole 2.1, a nitrogen inlet hole 2.2, a laser hole 2.3 and a ball inlet hole 2.4;
the ball outlet hole 2.1 is arranged at the bottom of the nozzle 2;
the aperture of the ball outlet hole 2.1 is smaller than the outer diameter of the solder ball 6, and the difference between the aperture of the ball outlet hole 2.1 and the outer diameter 6 of the solder ball is smaller than a set threshold;
the ball inlet 2.4 is arranged on the side surface of the nozzle 2, and the height of the ball inlet 2.4 is higher than that of the ball outlet 2.1;
the nitrogen inlet hole 2.2 is arranged on one side of the nozzle 2 opposite to the ball inlet hole 2.4;
the laser hole 2.3 is arranged at the opposite position of the top of the nozzle 2 and the ball outlet hole 2.1, and the laser hole 2.3 is communicated with the laser tin spraying module.
Example 3:
as shown in fig. 2, the present invention provides a BGA component repair method according to the above embodiment 1 or embodiment 2, comprising the steps of:
s1, refitting an original SRT repair table, and adding a laser tin spraying module;
s2, removing the defective BGA element by using the modified SRT repair table;
s3, performing laser solder ball on the BGA packaging position on the surface of the PCBA through the laser solder spraying module;
s4, mounting the removed BGA component and welding according to preset welding parameters.
According to the BGA element maintenance method provided by the invention, the laser tin spraying technology is adopted to replace the original poor BGA ball-planting technology, so that the problems of low cost and poor yield of artificial ball-planting are reduced, the links of ball-planting BGA are reduced in the whole repairing technology process, the repairing time is greatly shortened, and the repairing efficiency and yield are improved.
Example 4:
as shown in fig. 3, the present invention provides a BGA component repair method, comprising the steps of:
s1, refitting an original SRT repair table, and adding a laser tin spraying module; the specific steps of the step S1 are as follows:
s11, adding a laser tin spraying module for an original SRT repair table;
s12, setting a laser tin spraying module to use an original nitrogen pipeline;
s2, removing the defective BGA element by using the modified SRT repair table; the specific steps of the step S2 are as follows:
s21, obtaining PCBA with the defective BGA element, and dismantling the defective BGA element by using the modified SRT repair table;
s22, tin removal is carried out on the surface of the defective BGA element and the surface of the PCBA; tin removal ensures that the surface of the PCBA and the BGA element is smooth and free of dirt;
s3, performing laser solder ball on the BGA packaging position on the surface of the PCBA through the laser solder spraying module; the specific steps of the step S3 are as follows:
s31, conveying tin ball particles to a nozzle through a ball conveying mechanism;
s32, carrying out laser irradiation on the tin ball through a laser tin spraying module, melting the tin ball, and spraying liquid tin to the corresponding position of the BGA package on the surface of the PCBA through nitrogen to form the tin ball; the nitrogen prevents the tin ball from oxidizing in the process of reaching the bonding pad from being sprayed out;
s4, mounting the removed BGA element and welding according to preset welding parameters; the specific steps of the step S4 are as follows:
s41, aligning the removed BGA element with a corresponding solder ball through coordinate positioning, and mounting the BGA element;
s42, acquiring preset welding temperature parameters and welding duration parameters, and welding the mounted BGA element; the BGA is welded on the mounted solder ball, the welding temperature is 10-20 ℃ higher than the conventional WeChat temperature, the welding time is longer than the conventional welding time by 20s, and the body temperature of the BGA element is measured to be 250 ℃.
Example 5:
as shown in fig. 3, the present invention provides a BGA component repair method, comprising the steps of:
s1, refitting an original SRT repair table, and adding a laser tin spraying module; the specific steps of the step S1 are as follows:
s11, adding a laser tin spraying module for an original SRT repair table;
s12, setting a laser tin spraying module to use an original nitrogen pipeline;
s2, removing the defective BGA element by using the modified SRT repair table; the specific steps of the step S2 are as follows:
s21, obtaining PCBA with the defective BGA element, and dismantling the defective BGA element by using the modified SRT repair table;
s22, tin removal is carried out on the surface of the defective BGA element and the surface of the PCBA; tin removal ensures that the surface of the PCBA and the BGA element is smooth and free of dirt;
s3, performing laser solder ball on the BGA packaging position on the surface of the PCBA through the laser solder spraying module; the specific steps of the step S3 are as follows:
s31, conveying tin ball particles to a nozzle through a ball conveying mechanism; as shown in fig. 4, the specific steps of step S31 are as follows:
s311, rotating the ball separating disc to enable the solder balls to reach the ball outlet hole at the tail end of the nozzle from the solder balls through the ball dropping hole, the ball conveying pipeline and the ball inlet hole;
s312, after the ball outlet hole is plugged by the solder ball, nitrogen is infused through the nitrogen inlet hole until the nitrogen pressure in the nozzle reaches a set pressure threshold; the ball separating disc rotates to ensure that the solder balls can drop, and nitrogen prevents the solder balls from being oxidized in the process of being sprayed out to the bonding pads;
s32, carrying out laser irradiation on the tin ball through a laser tin spraying module, melting the tin ball, and spraying liquid tin to the corresponding position of the BGA package on the surface of the PCBA through nitrogen to form the tin ball; the nitrogen prevents the tin ball from oxidizing in the process of reaching the bonding pad from being sprayed out; as shown in fig. 4, the specific steps of step S32 are as follows:
s321, irradiating the solder balls through laser emitted by a laser tin spraying module, and melting the solder balls;
s322, spraying the liquid tin balls to corresponding position bonding pads of the BGA package on the surface of the PCBA under the action of nitrogen;
s323, under the action of self heat and laser, the liquid tin ball is fused with the bonding pad; the laser tin spraying module emits laser to melt the tin ball, so that the tin ball falls to a bonding pad of the PCBA from the ball outlet hole, liquid tin is not splashed after the laser heats and melts the tin ball, and the liquid tin falls to the bonding pad to be solidified and plump and smooth; the laser tin spraying does not need to use soldering flux, so that the subsequent cleaning or surface treatment of the residual soldering flux is saved, and compared with the traditional welding, the laser welding efficiency of the solder balls is higher, the appearance consistency is high, the welding stability is extremely high, and the like, and the thermal influence is minimal;
s4, mounting the removed BGA element and welding according to preset welding parameters; the specific steps of the step S4 are as follows:
s41, aligning the removed BGA element with a corresponding solder ball through coordinate positioning, and mounting the BGA element;
s42, acquiring preset welding temperature parameters and welding duration parameters, and welding the mounted BGA element; the BGA is welded on the mounted solder ball, the welding temperature is 10-20 ℃ higher than the conventional WeChat temperature, the welding time is longer than the conventional welding time by 20s, and the body temperature of the BGA element is measured to be 250 ℃.
Example 6:
as shown in fig. 5, the present invention provides a BGA component repair system including:
the SRT repair table modification module 7 is used for modifying an original SRT repair table and adding a laser tin spraying module;
a defective BGA removal module 8 for removing the defective BGA component using the post-retrofit SRT repair station;
the laser tin ball welding module 9 is used for carrying out laser tin ball welding on the BGA packaging position on the surface of the PCBA through the laser tin spraying module;
and a BGA component soldering module 10 for mounting the removed BGA component and soldering according to preset soldering parameters.
According to the BGA element maintenance system provided by the invention, the laser tin spraying technology is adopted to replace the original poor BGA ball-planting technology, so that the problems of low cost and poor yield of artificial ball-planting are reduced, the links of ball-planting of the BGA are reduced in the whole repairing technology process, the repairing time is greatly shortened, and the repairing efficiency and yield are improved.
Example 7:
as shown in fig. 5, the present invention provides a BGA component repair system including:
the SRT repair table modification module 7 is used for modifying an original SRT repair table and adding a laser tin spraying module; the SRT rework station modification module 7 includes:
a laser soldering module adding unit 7.1 for adding a laser soldering module for the original SRT repairing table;
a nitrogen pipeline sharing unit 7.2 for setting an original nitrogen pipeline used by the laser tin spraying module;
a defective BGA removal module 8 for removing the defective BGA component using the post-retrofit SRT repair station; the defective BGA removal module 8 includes:
a defective BGA component removing unit 8.1 for obtaining PCBA in which a defective BGA component exists, and removing the defective BGA component using the post-retrofit SRT repair station;
a PCBA and BGA cleaning unit 8.2 for removing tin from the surface of the defective BGA element and PCBA;
the laser tin ball welding module 9 is used for carrying out laser tin ball welding on the BGA packaging position on the surface of the PCBA through the laser tin spraying module; the laser solder ball welding module 9 includes:
a solder ball conveying unit 9.1 for conveying solder ball particles to the nozzle through a ball conveying mechanism; the solder ball conveying unit 9.1 includes:
the solder ball discharging subunit is used for enabling solder balls to reach the ball discharging hole at the tail end of the nozzle from the solder balls through the ball discharging hole, the ball conveying pipeline and the ball feeding hole by rotating the ball separating disc;
the nitrogen charging subunit is used for inputting nitrogen through the nitrogen inlet hole after the solder ball blocks the ball outlet hole until the nitrogen pressure in the nozzle reaches a set pressure threshold;
a solder ball laser irradiation unit 9.2 for irradiating the solder ball with laser by the laser tin spraying module to melt the solder ball, and spraying liquid tin to the corresponding position of the BGA package on the PCBA surface by nitrogen to form the solder ball; the solder ball laser irradiation unit 9.2 includes:
the laser ball melting subunit is used for emitting laser through the laser tin spraying module, irradiating the tin balls and melting the tin balls;
the ball spraying subunit is used for enabling the liquid tin balls to be sprayed out under the action of nitrogen and sprayed to corresponding position bonding pads of the BGA package on the surface of the PCBA;
the tin ball welding disc fusion subunit is used for completing fusion of the tin ball and the welding disc under the action of self heat and laser of the liquid tin ball;
a BGA component soldering module 10 for mounting the removed BGA component and soldering according to preset soldering parameters; the BGA component soldering module 10 includes:
the BGA mounting unit 10.1 is configured to align the removed BGA component with a corresponding solder ball through coordinate positioning, and mount the BGA component;
and the BGA welding unit 10.2 is used for acquiring preset welding temperature parameters and welding duration parameters and welding the mounted BGA element.
Example 8:
as shown in fig. 5, the present invention provides a BGA component repair system including:
the SRT repair table modification module 7 is used for modifying an original SRT repair table and adding a laser tin spraying module; the SRT rework station modification module 7 includes:
a laser soldering module adding unit 7.1 for adding a laser soldering module for the original SRT repairing table;
a nitrogen pipeline sharing unit 7.2 for setting an original nitrogen pipeline used by the laser tin spraying module;
a defective BGA removal module 8 for removing the defective BGA component using the post-retrofit SRT repair station; the defective BGA removal module 8 includes:
a defective BGA element dismantling unit 8.1, configured to obtain a PCBA with a defective BGA element, and dismantle the defective BGA element using the modified SRT repair station;
a PCBA and BGA cleaning unit 8.2 for removing tin from the surface of the defective BGA element and PCBA;
the laser tin ball welding module 9 is used for carrying out laser tin ball welding on the BGA packaging position on the surface of the PCBA through the laser tin spraying module; the laser solder ball welding module 9 includes:
a solder ball conveying unit 9.1 for conveying solder ball particles to the nozzle through a ball conveying mechanism;
a solder ball laser irradiation unit 9.2 for irradiating the solder ball with laser by the laser tin spraying module to melt the solder ball, and spraying liquid tin to the corresponding position of the BGA package on the PCBA surface by nitrogen to form the solder ball;
a BGA component soldering module 10 for mounting the removed BGA component and soldering according to preset soldering parameters; the BGA component soldering module 10 includes:
the BGA mounting unit 10.1 is configured to align the removed BGA component with a corresponding solder ball through coordinate positioning, and mount the BGA component;
and the BGA welding unit 10.2 is used for acquiring preset welding temperature parameters and welding duration parameters and welding the mounted BGA element.
According to the invention, no ball placement is needed for bad BGA, but the solder ball is directly welded on the solder pad corresponding to the PCBA by using a laser soldering mode, and the detached BGA element is placed on the solder ball for heating and welding, so that the ball placement link of the BGA is saved in the whole process.
Although the present invention has been described in detail by way of preferred embodiments with reference to the accompanying drawings, the present invention is not limited thereto. Various equivalent modifications and substitutions may be made in the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and it is intended that all such modifications and substitutions be within the scope of the present invention/be within the scope of the present invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The BGA component maintenance device is characterized by comprising an SRT repair table (1), wherein the SRT repair table (1) is provided with a laser tin spraying module and a ball feeding mechanism;
the ball feeding mechanism comprises a liftable nozzle (2), a ball separating disc (3) is arranged around the nozzle (2), and a solder ball container (4) is arranged at the upper part of the ball separating disc (3);
the bottom of the solder ball container (4) is provided with a ball dropping hole (4.1), the ball dropping hole (4.1) is connected with a ball conveying pipeline (5), and the ball conveying pipeline (5) penetrates through the ball separating disc (3) to be communicated with the nozzle (2);
the nozzle (2) is provided with a ball outlet hole (2.1), a nitrogen inlet hole (2.2), a laser hole (2.3) and a ball inlet hole (2.4).
2. The BGA component repair device according to claim 1, characterized in that the ball outlet hole (2.1) is provided at the bottom of the nozzle (2);
the aperture of the ball outlet hole (2.1) is smaller than the outer diameter of the solder ball (6), and the difference between the aperture of the ball outlet hole (2.1) and the outer diameter (6) of the solder ball is smaller than a set threshold value;
the ball inlet hole (2.4) is arranged on the side surface of the nozzle (2), and the height of the ball inlet hole (2.4) is higher than that of the ball outlet hole (2.1);
the nitrogen inlet hole (2.2) is arranged at one side of the nozzle (2) opposite to the ball inlet hole (2.4);
the laser hole (2.3) is arranged at the opposite position of the top of the nozzle (2) and the ball outlet hole (2.1), and the laser hole (2.3) is communicated with the laser tin spraying module.
3. A BGA component repair method according to any one of claims 1 to 2, comprising the steps of:
s1, refitting an original SRT repair table, and adding a laser tin spraying module;
s2, removing the defective BGA element by using the modified SRT repair table;
s3, performing laser solder ball on the BGA packaging position on the surface of the PCBA through the laser solder spraying module;
s4, mounting the removed BGA component and welding according to preset welding parameters.
4. The BGA component repair method of claim 3, wherein step S1 comprises the specific steps of:
s11, adding a laser tin spraying module for an original SRT repair table;
s12, setting a laser tin spraying module to use an original nitrogen pipeline.
5. The BGA component repair method of claim 3, wherein step S2 comprises the specific steps of:
s21, obtaining PCBA with the defective BGA element, and dismantling the defective BGA element by using the modified SRT repair table;
s22, tin removal is carried out on the surface of the defective BGA element and the surface of the PCBA.
6. The BGA component repair method of claim 3, wherein step S3 comprises the specific steps of:
s31, conveying tin ball particles to a nozzle through a ball conveying mechanism;
s32, carrying out laser irradiation on the tin ball through a laser tin spraying module, melting the tin ball, and spraying liquid tin to the corresponding position of the BGA package on the surface of the PCBA through nitrogen to form the tin ball.
7. The BGA component repair method of claim 6, wherein step S31 comprises the specific steps of:
s311, rotating the ball separating disc to enable the solder balls to reach the ball outlet hole at the tail end of the nozzle from the solder balls through the ball dropping hole, the ball conveying pipeline and the ball inlet hole;
s312, after the ball outlet hole is plugged by the solder ball, nitrogen is infused through the nitrogen inlet hole until the nitrogen pressure in the nozzle reaches a set pressure threshold.
8. The BGA component repair method of claim 7, wherein step S32 is specifically performed as follows:
s321, irradiating the solder balls through laser emitted by a laser tin spraying module, and melting the solder balls;
s322, spraying the liquid tin balls to corresponding position bonding pads of the BGA package on the surface of the PCBA under the action of nitrogen;
s323, under the action of self heat and laser, the liquid tin ball and the bonding pad are fused.
9. The BGA component repair method of claim 3, wherein step S4 comprises the specific steps of:
s41, aligning the removed BGA element with a corresponding solder ball through coordinate positioning, and mounting the BGA element;
s42, acquiring preset welding temperature parameters and welding duration parameters, and welding the mounted BGA element.
10. A BGA component repair system, comprising:
the SRT repair table modification module (7) is used for modifying the original SRT repair table and adding a laser tin spraying module;
a defective BGA removal module (8) for removing the defective BGA component using the post-retrofit SRT repair station;
the laser tin ball welding module (9) is used for carrying out laser tin ball welding on the BGA packaging position on the surface of the PCBA through the laser tin spraying module;
and the BGA component welding module (10) is used for installing the detached BGA component and welding according to preset welding parameters.
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| CN202310065979.XA CN116021104A (en) | 2023-01-16 | 2023-01-16 | BGA element maintenance device, method and system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310065979.XA CN116021104A (en) | 2023-01-16 | 2023-01-16 | BGA element maintenance device, method and system |
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| CN103231138A (en) * | 2013-05-08 | 2013-08-07 | 无锡江南计算技术研究所 | Ball grid array (BGA) balling single-point repair method |
| KR20130120427A (en) * | 2012-04-25 | 2013-11-04 | 임채열 | Rework system for bga |
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| CN110814458A (en) * | 2019-11-14 | 2020-02-21 | 深圳大学 | Tin ball melting injection laser welding device and welding method |
| CN113305388A (en) * | 2021-05-28 | 2021-08-27 | 立讯电子科技（昆山）有限公司 | High-strength laser tin ball welding device |
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| KR20130120427A (en) * | 2012-04-25 | 2013-11-04 | 임채열 | Rework system for bga |
| CN103231138A (en) * | 2013-05-08 | 2013-08-07 | 无锡江南计算技术研究所 | Ball grid array (BGA) balling single-point repair method |
| CN107359134A (en) * | 2017-07-28 | 2017-11-17 | 湖北三江航天红峰控制有限公司 | A kind of method and apparatus for realizing that bga chip reprocesses using laser |
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