CN116021104A - A BGA component maintenance device, method and system - Google Patents
A BGA component maintenance device, method and system Download PDFInfo
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- 238000012423 maintenance Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 claims abstract description 127
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 108
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 85
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 49
- 238000005507 spraying Methods 0.000 claims abstract description 49
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims description 44
- 238000005476 soldering Methods 0.000 claims description 31
- 239000007921 spray Substances 0.000 claims description 30
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 21
- 230000002950 deficient Effects 0.000 claims description 19
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- 230000009471 action Effects 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 8
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- 230000004048 modification Effects 0.000 claims description 4
- 238000012986 modification Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 12
- 230000008439 repair process Effects 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009466 transformation Effects 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
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Abstract
Description
技术领域technical field
本发明属于PCBA生产技术领域，具体涉及一种BGA元件维修装置、方法及系统。The invention belongs to the technical field of PCBA production, and in particular relates to a BGA component maintenance device, method and system.
背景技术Background technique
BGA，是Bal l Gri d Array的简称，球状引脚栅格阵列封装。BGA, short for Ball Grid Array, ball grid array package.
PCB，是Printed Circui t Board的简称，印制电路板。PCB is the abbreviation of Printed Circuit Board, printed circuit board.
PCBA，是Printed Circui t Board As semb ly的简称，印制组装电路板。PCBA, short for Printed Circuit Board As sembly, prints and assembles circuit boards.
在当今电子行业的高速发展中，PCBA越来越复杂化，工作环境越来越多样化，BGA封装元器件集成度高，间距越来越小，在PCBA加工过程中，BGA元件因为工艺印刷、贴片、回流焊炉温等问题会产生一定比例的不良率，如BGA短路、空焊等。BGA元件往往价格高，为了降低生产成本，BGA不良会进行拆除后重新对元件进行植球再利用。In the rapid development of today's electronics industry, PCBA is becoming more and more complicated, and the working environment is becoming more and more diverse. BGA package components are highly integrated and the spacing is getting smaller and smaller. SMD, reflow oven temperature and other issues will produce a certain proportion of defective rates, such as BGA short circuit, empty soldering, etc. BGA components are often expensive. In order to reduce production costs, BGA defects will be removed and re-balled components will be reused.
现有维修BGA方法流程如下：The existing maintenance BGA method flow is as follows:
业界采用返修加热机台对不良BGA进行加热拆除，拆除后BGA要进行委外公司或者本公司有能力亦可植球，植球完成后检验外观通过才可以再次利用。但往往有很多不良需要BGA植球多次才成功，而且也有植球后不能及时使用，转化为公司收入，导致BGA库存积压。The industry uses rework heating machines to heat and remove defective BGAs. After removal, the BGAs must be reballed by an outsourcing company or our company has the ability. However, there are often many defects that require BGA ball planting many times to succeed, and there are also cases that cannot be used in time after ball planting, which is converted into company income, resulting in a backlog of BGA inventory.
综上，现有BGA不良返修效率慢且需要再次植球再维修才可利用，即BGA植球工艺繁琐复杂，维修效率低，且增加生产成本。To sum up, the efficiency of repairing defective BGAs is slow and requires re-balling and repairing before they can be used. That is, the BGA balling process is cumbersome and complicated, the maintenance efficiency is low, and the production cost is increased.
此为现有技术的不足，因此，针对现有技术中的上述缺陷，提供一种BGA元件维修方法，是非常有必要的。This is the deficiency of the prior art, therefore, it is very necessary to provide a BGA component maintenance method for the above-mentioned defects in the prior art.
发明内容Contents of the invention
针对现有技术的上述BGA植球再维修工艺繁琐复杂，效率慢的缺陷，本发明提供一种，以解决上述技术问题。Aiming at the drawbacks of the above-mentioned BGA ball planting re-maintenance process in the prior art which are complicated and slow in efficiency, the present invention provides a method to solve the above-mentioned technical problems.
第一方面，本发明提供一种BGA元件维修装置，包括SRT返修台，SRT返修台上设置有激光喷锡模组和送球机构；In the first aspect, the present invention provides a BGA component maintenance device, which includes an SRT rework station, and the SRT rework station is provided with a laser spray tin module and a ball feeding mechanism;
送球机构包括可升降的喷嘴，环绕喷嘴设置有分球盘，分球盘上部设置有锡球容器；The ball sending mechanism includes a liftable nozzle, a ball distribution plate is arranged around the nozzle, and a tin ball container is arranged on the upper part of the ball distribution plate;
锡球容器底部设置有掉球孔，掉球孔连接有输球管路，输球管路贯穿分球盘与喷嘴连通；There is a ball drop hole at the bottom of the tin ball container, and the ball drop hole is connected with a ball loss pipeline, and the ball loss pipeline runs through the ball distribution plate and communicates with the nozzle;
喷嘴设有出球孔、氮气进气孔、激光孔以及进球孔。The nozzle is provided with a ball outlet hole, a nitrogen gas inlet hole, a laser hole and a goal hole.
进一步地，出球孔设置在喷嘴底部；Further, the ball outlet hole is set at the bottom of the nozzle;
出球孔的孔径小于锡球的外径，且出球孔的孔径与锡球外径的差小于设定阈值；The hole diameter of the ball outlet hole is smaller than the outer diameter of the solder ball, and the difference between the hole diameter of the ball outlet hole and the outer diameter of the solder ball is smaller than the set threshold;
进球孔设置在喷嘴侧面，且进球孔高度高于出球孔高度；The goal hole is set on the side of the nozzle, and the height of the goal hole is higher than the height of the ball hole;
氮气进气孔设置在喷嘴与进球孔相对的一侧；The nitrogen gas inlet hole is set on the side of the nozzle opposite to the goal hole;
激光孔设置在喷嘴顶部与出球孔相对位置，且激光孔与激光喷锡模组连通。The laser hole is set at the position opposite to the ball outlet hole on the top of the nozzle, and the laser hole communicates with the laser tin spraying module.
第二方面，本发明提供一种基于上述第一方面的BGA元件维修方法，包括如下步骤：In a second aspect, the present invention provides a BGA component maintenance method based on the above-mentioned first aspect, comprising the following steps:
S 1.对原始SRT返修台进行改装，增加激光喷锡模组；S 1. Refit the original SRT rework station and add a laser spray tin module;
S 2.使用改装后SRT返修台拆除不良BGA元件；S 2. Use the modified SRT rework station to remove bad BGA components;
S 3.通过激光喷锡模组在PCBA表面的BGA封装位置进行激光焊锡球；
S4.安装拆除的BGA元件并按照预设焊接参数进行焊接。S4. Install the removed BGA components and perform welding according to preset welding parameters.
进一步地，步骤S1具体步骤如下：Further, the specific steps of step S1 are as follows:
S 11.为原始SRT返修台增加激光喷锡模组；
S 12.设置激光喷锡模组使用原始氮气管道。S 12. Set the laser spray tin module to use the original nitrogen pipeline.
进一步地，步骤S 2具体步骤如下：Further, the specific steps of step S2 are as follows:
S 21.获取存在不良BGA元件的PCBA，并使用改装后SRT返修台对不良BGA元件进行拆除；S 21. Obtain the PCBA with bad BGA components, and use the modified SRT rework station to remove the bad BGA components;
S 22.对不良BGA元件及PCBA表面进行除锡。除锡保证PCBA及BGA元件表面平整无脏污。S 22. Remove tin from the surface of bad BGA components and PCBA. Remove tin to ensure that the surface of PCBA and BGA components is smooth and free of dirt.
进一步地，步骤S 3具体步骤如下：Further, the specific steps of step S3 are as follows:
S 31.通过送球机构将锡球颗粒输送到喷嘴处；S 31. Transport the tin ball particles to the nozzle through the ball delivery mechanism;
S 32.通过激光喷锡模组对锡球进行激光照射，融化锡球，再通过氮气将液体的锡喷射到PCBA表面BGA封装的对应位置，形成锡球。氮气防止锡球从喷出到达焊盘过程中氧化。S 32. Laser irradiate the solder balls through the laser tin spraying module to melt the solder balls, and then spray the liquid tin to the corresponding position of the BGA package on the PCBA surface through nitrogen to form solder balls. The nitrogen prevents oxidation of the solder balls from ejection to the pad.
进一步地，步骤S 31具体步骤如下：Further, the specific steps of step S31 are as follows:
S 311.分球盘转动，使得锡球从锡球经掉球孔、输球管路、进球孔到达喷嘴末端的出球孔处；S 311. The ball distribution plate is rotated so that the tin ball passes through the ball drop hole, the ball loss pipeline, and the goal hole to the ball outlet hole at the end of the nozzle;
S 312.锡球堵住出球孔后，通过氮气进气孔输氮气，直至喷嘴内氮气气压到达设定气压阈值。分球盘转动，保证锡球可以掉落，而氮气防止锡球从喷出到达焊盘过程中氧化。S 312. After the solder ball blocks the ball hole, feed nitrogen through the nitrogen inlet hole until the nitrogen pressure in the nozzle reaches the set pressure threshold. The ball distribution plate is rotated to ensure that the solder balls can fall, and the nitrogen gas prevents the oxidation of the solder balls from spraying to the pad.
进一步地，步骤S 32具体步骤如下：Further, the specific steps of step S32 are as follows:
S 321.通过激光喷锡模组出激光，对锡球进行照射，锡球融化；S 321. The laser is emitted by the laser tin spraying module, and the tin ball is irradiated, and the tin ball melts;
S 322.液体锡球在氮气作用下喷出，喷射到PCBA表面BGA封装的对应位置焊盘；S 322. The liquid solder ball is sprayed under the action of nitrogen, and sprayed to the corresponding position pad of the BGA package on the surface of the PCBA;
S 323.液体锡球在自身热量与激光的作用下，锡球与焊盘完成融合。激光喷锡模组出激光使得锡球融化，从而从出球孔掉落到PCBA的焊盘处，激光加热熔化锡球后不会引起液态锡飞溅，且液态锡落到焊盘上固化后饱满而光滑。激光喷锡无需使用助焊剂，从而节省后续助焊剂残留的清洗或表面处理，相比于传统焊接，锡球激光焊接效率更高，外观一致性高，焊接稳定性极高等，热影响最小。S 323. Under the action of the liquid solder ball's own heat and laser, the solder ball and the solder pad are fused. The laser tin spraying module emits laser light to melt the solder balls, so that they fall from the ball hole to the solder pad of the PCBA. After the laser heats and melts the solder balls, it will not cause liquid tin to splash, and the liquid tin will fall on the solder pads and become full after solidification. And smooth. Laser spray tin does not require the use of flux, which saves subsequent cleaning or surface treatment of flux residues. Compared with traditional welding, laser welding of solder balls has higher efficiency, high appearance consistency, high welding stability, etc., and minimal thermal impact.
进一步地，步骤S4具体步骤如下：Further, the specific steps of step S4 are as follows:
S41.通过坐标定位将拆除的BGA元件与对应锡球进行对齐，并对BGA元件进行贴装；S41. Align the removed BGA components with the corresponding solder balls through coordinate positioning, and mount the BGA components;
S42.获取预设的焊接温度参数及焊接时长参数，对贴装完成的BGA元件进行焊接。S42. Obtain preset soldering temperature parameters and soldering time parameters, and solder the mounted BGA components.
第三方面，本发明提供一种BGA元件维修系统，包括：In a third aspect, the present invention provides a BGA component maintenance system, comprising:
SRT返修台改造模块，用于对原始SRT返修台进行改装，增加激光喷锡模组；The SRT rework station transformation module is used to refit the original SRT rework station and add a laser tin spraying module;
不良BGA拆除模块，用于使用改装后SRT返修台拆除不良BGA元件；Bad BGA removal module, used to remove bad BGA components with SRT rework station after modification;
激光锡球焊接模块，用于通过激光喷锡模组在PCBA表面的BGA封装位置进行激光焊锡球；The laser solder ball welding module is used to perform laser solder balls on the BGA packaging position on the surface of the PCBA through the laser tin spraying module;
BGA元件焊接模块，用于安装拆除的BGA元件并按照预设焊接参数进行焊接。The BGA component welding module is used to install the removed BGA components and perform welding according to the preset welding parameters.
进一步地，SRT返修台改造模块包括：Further, the SRT rework station transformation module includes:
激光焊锡模组增加单元，用于为原始SRT返修台增加激光喷锡模组；Laser soldering module addition unit, used to add laser tin spraying module to the original SRT rework station;
氮气管道共用单元，用于设置激光喷锡模组使用原始氮气管道。Nitrogen pipeline shared unit, used to set the original nitrogen pipeline for the laser tin spraying module.
进一步地，不良BGA拆除模块包括：Further, bad BGA removal modules include:
不良BGA元件拆除单元，用于获取存在不良BGA元件的PCBA，并使用改装后SRT返修台对不良BGA元件进行拆除；Bad BGA component removal unit, used to obtain PCBA with bad BGA components, and use the modified SRT rework station to remove bad BGA components;
PCBA及BGA清洁单元，用于对不良BGA元件及PCBA表面进行除锡。PCBA and BGA cleaning unit is used to remove tin from bad BGA components and PCBA surface.
进一步地，激光锡球焊接模块包括：Further, the laser solder ball welding module includes:
锡球输送单元，用于通过送球机构将锡球颗粒输送到喷嘴处；The solder ball conveying unit is used to transport the solder ball particles to the nozzle through the ball feeding mechanism;
锡球激光照射单元，用于通过激光喷锡模组对锡球进行激光照射，融化锡球，再通过氮气将液体的锡喷射到PCBA表面BGA封装的对应位置，形成锡球。The solder ball laser irradiation unit is used to irradiate the solder ball with laser through the laser tin spraying module, melt the solder ball, and then spray the liquid tin to the corresponding position of the BGA package on the PCBA surface through nitrogen gas to form a solder ball.
进一步地，锡球输送单元包括：Further, the solder ball delivery unit includes:
出锡球子单元，用于通过分球盘转动，使得锡球从锡球经掉球孔、输球管路、进球孔到达喷嘴末端的出球孔处；The tin ball sub-unit is used to rotate through the ball distribution plate, so that the tin ball passes through the ball drop hole, the ball loss pipeline, and the ball hole to reach the ball outlet hole at the end of the nozzle;
通氮气子单元，用于在锡球堵住出球孔后，通过氮气进气孔输氮气，直至喷嘴内氮气气压到达设定气压阈值。The nitrogen supply sub-unit is used to feed nitrogen through the nitrogen inlet hole after the solder ball blocks the ball outlet until the nitrogen pressure in the nozzle reaches the set pressure threshold.
进一步地，锡球激光照射单元包括：Further, the tin ball laser irradiation unit includes:
激光融球子单元，用于通过激光喷锡模组出激光，对锡球进行照射，锡球融化；The laser melting ball sub-unit is used to emit laser light through the laser tin spraying module, irradiate the tin ball, and melt the tin ball;
喷球子单元，用于使得液体锡球在氮气作用下喷出，喷射到PCBA表面BGA封装的对应位置焊盘；The ball spraying unit is used to make the liquid solder balls spray out under the action of nitrogen, and spray them to the corresponding position pads of the BGA package on the surface of the PCBA;
锡球焊盘融合子单元，用于液体锡球在自身热量与激光的作用下，锡球与焊盘完成融合。The solder ball pad fusion sub-unit is used for the liquid solder ball to fuse with the solder pad under the action of its own heat and laser.
进一步地，BGA元件焊接模块包括：Further, the BGA component soldering module includes:
BGA贴装单元，用于通过坐标定位将拆除的BGA元件与对应锡球进行对齐，并对BGA元件进行贴装；The BGA placement unit is used to align the removed BGA components with the corresponding solder balls through coordinate positioning, and mount the BGA components;
BGA焊接单元，用于获取预设的焊接温度参数及焊接时长参数，对贴装完成的BGA元件进行焊接。The BGA soldering unit is used to obtain preset soldering temperature parameters and soldering time parameters, and solder the mounted BGA components.
本发明的有益效果在于：The beneficial effects of the present invention are:
本发明提供的BGA元件维修装置、方法及系统，通过激光喷锡技术，替代原始不良BGA需要植球的工艺，降低了人工植球的成本和良率差的问题，整个返修工艺过程中，减少了BGA植球的环节，大大缩短了返修的时间，提高了返修效率和良率。The BGA component maintenance device, method and system provided by the present invention, through the laser tin spraying technology, replaces the process of ball planting required by the original bad BGA, which reduces the cost of artificial ball planting and the problem of poor yield. The link of BGA ball planting greatly shortens the rework time and improves the rework efficiency and yield.
此外，本发明设计原理可靠，结构简单，具有非常广泛的应用前景。In addition, the design principle of the present invention is reliable, the structure is simple, and has very wide application prospects.
由此可见，本发明与现有技术相比，具有突出的实质性特点和显著的进步，其实施的有益效果也是显而易见的。It can be seen that, compared with the prior art, the present invention has outstanding substantive features and remarkable progress, and the beneficial effects of its implementation are also obvious.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, In other words, other drawings can also be obtained from these drawings on the premise of not paying creative work.
图1是本发明的BGA元件维修装置结构示意图。FIG. 1 is a schematic structural view of a BGA component maintenance device of the present invention.
图2是本发明的BGA元件维修方法实施例3流程示意图。FIG. 2 is a schematic flow chart of
图3是本发明的BGA元件维修方法实施例4流程示意图。FIG. 3 is a schematic flow chart of Embodiment 4 of the BGA component maintenance method of the present invention.
图4是本发明的BGA元件维修方法中BGA元件维修装置工作过程示意图。Fig. 4 is a schematic diagram of the working process of the BGA component maintenance device in the BGA component maintenance method of the present invention.
图5是本发明的BGA元件维修系统示意图。Fig. 5 is a schematic diagram of the BGA component maintenance system of the present invention.
图中，1-SRT返修台；2-喷嘴；2.1-出球孔；2.2-氮气进气孔；2.3-激光孔；2.4-进球孔；3-分球盘；4-锡球容器；4.1-掉球孔；5-输球管路；6-锡球；7-SRT返修台改造模块；7.1-激光焊锡模组增加单元；7.2-氮气管道共用单元；8-不良BGA拆除模块；8.1-不良BGA元件拆除单元；8.2-PCBA及BGA清洁单元；9-激光锡球焊接模块；9.1-锡球输送单元；9.2-锡球激光照射单元；10-BGA元件焊接模块；10.1-BGA贴装单元；10.2-BGA焊接单元。In the figure, 1-SRT rework station; 2-nozzle; 2.1-ball outlet hole; 2.2-nitrogen gas inlet hole; 2.3-laser hole; 2.4-goal hole; -ball drop hole; 5-ball loss pipeline; 6-solder ball; 7-SRT rework station transformation module; 7.1-laser soldering module addition unit; 7.2-nitrogen pipeline shared unit; 8-bad BGA removal module; 8.1- Defective BGA component removal unit; 8.2-PCBA and BGA cleaning unit; 9-laser solder ball welding module; 9.1-solder ball delivery unit; 9.2-solder ball laser irradiation unit; 10-BGA component welding module; ; 10.2-BGA soldering unit.
具体实施方式Detailed ways
为了使本技术领域的人员更好地理解本发明中的技术方案，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
实施例1：Example 1:
如图1所示，本发明提供一种BGA元件维修装置，包括SRT返修台1，SRT返修台1上设置有激光喷锡模组和送球机构；As shown in Figure 1, the present invention provides a kind of BGA component maintenance device, comprises SRT rework station 1, and SRT rework station 1 is provided with laser spray tin module and ball feeding mechanism;
送球机构包括可升降的喷嘴2，环绕喷嘴2设置有分球盘3，分球盘3上部设置有锡球容器4；The ball sending mechanism includes a liftable nozzle 2, a
锡球容器4底部设置有掉球孔4.1，掉球孔4.1连接有输球管路5，输球管路5贯穿分球盘3与喷嘴2连通；The bottom of the tin ball container 4 is provided with a ball dropping hole 4.1, which is connected with a
喷嘴2设有出球孔2.1、氮气进气孔2.2、激光孔2.3以及进球孔2.4。The nozzle 2 is provided with a ball outlet hole 2.1, a nitrogen gas inlet hole 2.2, a laser hole 2.3 and a goal hole 2.4.
本发明提供的BGA元件维修装置，通过激光喷锡技术，替代原始不良BGA需要植球的工艺，降低了人工植球的成本和良率差的问题，整个返修工艺过程中，减少了BGA植球的环节，大大缩短了返修的时间，提高了返修效率和良率。The BGA component maintenance device provided by the present invention, through the laser tin spraying technology, replaces the original bad BGA ball planting process, reduces the cost of artificial ball planting and the problem of poor yield, and reduces the cost of BGA ball planting during the entire repair process. link, greatly shortening the rework time, improving the rework efficiency and yield.
实施例2：Example 2:
如图1所示，本发明提供一种BGA元件维修装置，包括SRT返修台1，SRT返修台1上设置有激光喷锡模组和送球机构；As shown in Figure 1, the present invention provides a kind of BGA component maintenance device, comprises SRT rework station 1, and SRT rework station 1 is provided with laser spray tin module and ball feeding mechanism;
送球机构包括可升降的喷嘴2，环绕喷嘴2设置有分球盘3，分球盘3上部设置有锡球容器4；The ball sending mechanism includes a liftable nozzle 2, a
锡球容器4底部设置有掉球孔4.1，掉球孔4.1连接有输球管路5，输球管路5贯穿分球盘3与喷嘴2连通；The bottom of the tin ball container 4 is provided with a ball dropping hole 4.1, which is connected with a
喷嘴2设有出球孔2.1、氮气进气孔2.2、激光孔2.3以及进球孔2.4；The nozzle 2 is provided with a ball outlet hole 2.1, a nitrogen gas inlet hole 2.2, a laser hole 2.3 and a goal hole 2.4;
出球孔2.1设置在喷嘴2底部；The ball outlet hole 2.1 is set at the bottom of the nozzle 2;
出球孔2.1的孔径小于锡球6的外径，且出球孔2.1的孔径与锡球外径6的差小于设定阈值；The hole diameter of the ball outlet hole 2.1 is smaller than the outer diameter of the
进球孔2.4设置在喷嘴2侧面，且进球孔2.4高度高于出球孔2.1高度；The goal hole 2.4 is arranged on the side of the nozzle 2, and the height of the goal hole 2.4 is higher than the height of the ball outlet hole 2.1;
氮气进气孔2.2设置在喷嘴2与进球孔2.4相对的一侧；The nitrogen gas inlet hole 2.2 is arranged on the side opposite to the nozzle 2 and the goal hole 2.4;
激光孔2.3设置在喷嘴2顶部与出球孔2.1相对位置，且激光孔2.3与激光喷锡模组连通。The laser hole 2.3 is arranged on the top of the nozzle 2 opposite to the ball outlet hole 2.1, and the laser hole 2.3 communicates with the laser tin spraying module.
实施例3：Example 3:
如图2所示，本发明提供一种基于上述实施例1或实施例2的BGA元件维修方法，包括如下步骤：As shown in Fig. 2, the present invention provides a kind of BGA component maintenance method based on above-mentioned embodiment 1 or embodiment 2, comprises the following steps:
S 1.对原始SRT返修台进行改装，增加激光喷锡模组；S 1. Refit the original SRT rework station and add a laser spray tin module;
S 2.使用改装后SRT返修台拆除不良BGA元件；S 2. Use the modified SRT rework station to remove bad BGA components;
S 3.通过激光喷锡模组在PCBA表面的BGA封装位置进行激光焊锡球；
S4.安装拆除的BGA元件并按照预设焊接参数进行焊接。S4. Install the removed BGA components and perform welding according to preset welding parameters.
本发明提供的BGA元件维修方法，通过激光喷锡技术，替代原始不良BGA需要植球的工艺，降低了人工植球的成本和良率差的问题，整个返修工艺过程中，减少了BGA植球的环节，大大缩短了返修的时间，提高了返修效率和良率。The BGA component repair method provided by the present invention, through the laser tin spraying technology, replaces the process of ball planting required by the original bad BGA, reduces the cost of artificial ball planting and the problem of poor yield, and reduces the cost of BGA ball planting during the entire repair process. link, which greatly shortens the repair time and improves the repair efficiency and yield.
实施例4：Example 4:
如图3所示，本发明提供一种BGA元件维修方法，包括如下步骤：As shown in Figure 3, the present invention provides a kind of BGA element maintenance method, comprises the following steps:
S 1.对原始SRT返修台进行改装，增加激光喷锡模组；步骤S1具体步骤如下：S 1. Refit the original SRT rework station and add a laser spray tin module; the specific steps of step S1 are as follows:
S 11.为原始SRT返修台增加激光喷锡模组；
S 12.设置激光喷锡模组使用原始氮气管道；S 12. Set the laser tin spraying module to use the original nitrogen pipeline;
S 2.使用改装后SRT返修台拆除不良BGA元件；步骤S 2具体步骤如下：S 2. Use the modified SRT rework station to remove bad BGA components; Step S 2 The specific steps are as follows:
S 21.获取存在不良BGA元件的PCBA，并使用改装后SRT返修台对不良BGA元件进行拆除；S 21. Obtain the PCBA with bad BGA components, and use the modified SRT rework station to remove the bad BGA components;
S 22.对不良BGA元件及PCBA表面进行除锡；除锡保证PCBA及BGA元件表面平整无脏污；S 22. Remove tin from the surface of bad BGA components and PCBA; remove tin to ensure that the surface of PCBA and BGA components is smooth and free of dirt;
S 3.通过激光喷锡模组在PCBA表面的BGA封装位置进行激光焊锡球；步骤S 3具体步骤如下：
S 31.通过送球机构将锡球颗粒输送到喷嘴处；S 31. Transport the tin ball particles to the nozzle through the ball delivery mechanism;
S 32.通过激光喷锡模组对锡球进行激光照射，融化锡球，再通过氮气将液体的锡喷射到PCBA表面BGA封装的对应位置，形成锡球；氮气防止锡球从喷出到达焊盘过程中氧化；S 32. Laser irradiate the solder balls through the laser tin spraying module to melt the solder balls, and then spray the liquid tin to the corresponding position of the BGA package on the PCBA surface through nitrogen to form solder balls; nitrogen prevents the solder balls from spraying to the solder Oxidation during the disc process;
S4.安装拆除的BGA元件并按照预设焊接参数进行焊接；步骤S4具体步骤如下：S4. Install the removed BGA components and perform welding according to the preset welding parameters; the specific steps of step S4 are as follows:
S41.通过坐标定位将拆除的BGA元件与对应锡球进行对齐，并对BGA元件进行贴装；S41. Align the removed BGA components with the corresponding solder balls through coordinate positioning, and mount the BGA components;
S42.获取预设的焊接温度参数及焊接时长参数，对贴装完成的BGA元件进行焊接；BGA在贴装的锡球上进行焊接，采用比常规微信温度高10～20℃的焊接温度，焊接时长比常规焊接时长多20s，而测量BGA元件本体温度在250℃。S42. Obtain the preset soldering temperature parameters and soldering time parameters, and solder the mounted BGA components; BGA is soldered on the mounted solder balls, using a soldering temperature that is 10-20°C higher than the conventional Wechat temperature, and soldering The duration is 20s longer than conventional soldering, and the temperature of the BGA component body is measured at 250°C.
实施例5：Example 5:
如图3所示，本发明提供一种BGA元件维修方法，包括如下步骤：As shown in Figure 3, the present invention provides a kind of BGA element maintenance method, comprises the following steps:
S 1.对原始SRT返修台进行改装，增加激光喷锡模组；步骤S1具体步骤如下：S 1. Refit the original SRT rework station and add a laser spray tin module; the specific steps of step S1 are as follows:
S 11.为原始SRT返修台增加激光喷锡模组；
S 12.设置激光喷锡模组使用原始氮气管道；S 12. Set the laser tin spraying module to use the original nitrogen pipeline;
S 2.使用改装后SRT返修台拆除不良BGA元件；步骤S 2具体步骤如下：S 2. Use the modified SRT rework station to remove bad BGA components; Step S 2 The specific steps are as follows:
S 21.获取存在不良BGA元件的PCBA，并使用改装后SRT返修台对不良BGA元件进行拆除；S 21. Obtain the PCBA with bad BGA components, and use the modified SRT rework station to remove the bad BGA components;
S 22.对不良BGA元件及PCBA表面进行除锡；除锡保证PCBA及BGA元件表面平整无脏污；S 22. Remove tin from the surface of bad BGA components and PCBA; remove tin to ensure that the surface of PCBA and BGA components is smooth and free of dirt;
S 3.通过激光喷锡模组在PCBA表面的BGA封装位置进行激光焊锡球；步骤S 3具体步骤如下：
S 31.通过送球机构将锡球颗粒输送到喷嘴处；如图4所示，步骤S31具体步骤如下：S 31. Transport the tin ball particles to the nozzle through the ball delivery mechanism; as shown in Figure 4, the specific steps of step S31 are as follows:
S 311.分球盘转动，使得锡球从锡球经掉球孔、输球管路、进球孔到达喷嘴末端的出球孔处；S 311. The ball distribution plate is rotated so that the tin ball passes through the ball drop hole, the ball loss pipeline, and the goal hole to the ball outlet hole at the end of the nozzle;
S 312.锡球堵住出球孔后，通过氮气进气孔输氮气，直至喷嘴内氮气气压到达设定气压阈值；分球盘转动，保证锡球可以掉落，而氮气防止锡球从喷出到达焊盘过程中氧化；S 312. After the solder ball blocks the ball hole, feed nitrogen through the nitrogen gas inlet until the nitrogen pressure in the nozzle reaches the set air pressure threshold; the ball distribution plate rotates to ensure that the solder ball can fall, and the nitrogen prevents the solder ball from spraying Oxidation during the process of reaching the pad;
S 32.通过激光喷锡模组对锡球进行激光照射，融化锡球，再通过氮气将液体的锡喷射到PCBA表面BGA封装的对应位置，形成锡球；氮气防止锡球从喷出到达焊盘过程中氧化；如图4所示，步骤S32具体步骤如下：S 32. Laser irradiate the solder balls through the laser tin spraying module to melt the solder balls, and then spray the liquid tin to the corresponding position of the BGA package on the PCBA surface through nitrogen to form solder balls; nitrogen prevents the solder balls from spraying to the solder Oxidation in the disc process; As shown in Figure 4, the specific steps of step S32 are as follows:
S 321.通过激光喷锡模组出激光，对锡球进行照射，锡球融化；S 321. The laser is emitted by the laser tin spraying module, and the tin ball is irradiated, and the tin ball melts;
S 322.液体锡球在氮气作用下喷出，喷射到PCBA表面BGA封装的对应位置焊盘；S 322. The liquid solder ball is sprayed under the action of nitrogen, and sprayed to the corresponding position pad of the BGA package on the surface of the PCBA;
S 323.液体锡球在自身热量与激光的作用下，锡球与焊盘完成融合；激光喷锡模组出激光使得锡球融化，从而从出球孔掉落到PCBA的焊盘处，激光加热熔化锡球后不会引起液态锡飞溅，且液态锡落到焊盘上固化后饱满而光滑；激光喷锡无需使用助焊剂，从而节省后续助焊剂残留的清洗或表面处理，相比于传统焊接，锡球激光焊接效率更高，外观一致性高，焊接稳定性极高等，热影响最小；S 323. Under the action of its own heat and laser, the liquid solder ball and the solder ball complete fusion; the laser spraying tin module emits laser light to melt the solder ball, and then falls from the ball hole to the solder pad of the PCBA. After heating and melting the solder balls, it will not cause liquid tin to splash, and the liquid tin will fall on the pad and solidify and be full and smooth; laser spraying tin does not require the use of flux, thereby saving subsequent cleaning or surface treatment of flux residues, compared to traditional Welding, solder ball laser welding has higher efficiency, high appearance consistency, high welding stability, etc., with minimal thermal impact;
S4.安装拆除的BGA元件并按照预设焊接参数进行焊接；步骤S4具体步骤如下：S4. Install the removed BGA components and perform welding according to the preset welding parameters; the specific steps of step S4 are as follows:
S41.通过坐标定位将拆除的BGA元件与对应锡球进行对齐，并对BGA元件进行贴装；S41. Align the removed BGA components with the corresponding solder balls through coordinate positioning, and mount the BGA components;
S42.获取预设的焊接温度参数及焊接时长参数，对贴装完成的BGA元件进行焊接；BGA在贴装的锡球上进行焊接，采用比常规微信温度高10～20℃的焊接温度，焊接时长比常规焊接时长多20s，而测量BGA元件本体温度在250℃。S42. Obtain the preset soldering temperature parameters and soldering time parameters, and solder the mounted BGA components; BGA is soldered on the mounted solder balls, using a soldering temperature that is 10-20°C higher than the conventional Wechat temperature, and soldering The duration is 20s longer than conventional soldering, and the temperature of the BGA component body is measured at 250°C.
实施例6：Embodiment 6:
如图5所示，本发明提供一种BGA元件维修系统，包括：As shown in Figure 5, the present invention provides a BGA component maintenance system, comprising:
SRT返修台改造模块7，用于对原始SRT返修台进行改装，增加激光喷锡模组；SRT rework station transformation module 7 is used to refit the original SRT rework station and add a laser spray tin module;
不良BGA拆除模块8，用于使用改装后SRT返修台拆除不良BGA元件；Bad BGA removal module 8, used to remove bad BGA components by using the reworked SRT rework station;
激光锡球焊接模块9，用于通过激光喷锡模组在PCBA表面的BGA封装位置进行激光焊锡球；The laser solder ball welding module 9 is used to perform laser solder balls on the BGA packaging position on the surface of the PCBA through the laser tin spraying module;
BGA元件焊接模块10，用于安装拆除的BGA元件并按照预设焊接参数进行焊接。The BGA component welding module 10 is used for installing the removed BGA components and performing welding according to preset welding parameters.
本发明提供的BGA元件维修系统，通过激光喷锡技术，替代原始不良BGA需要植球的工艺，降低了人工植球的成本和良率差的问题，整个返修工艺过程中，减少了BGA植球的环节，大大缩短了返修的时间，提高了返修效率和良率。The BGA component maintenance system provided by the present invention, through the laser tin spraying technology, replaces the original bad BGA ball planting process, reduces the cost of artificial ball planting and the problem of poor yield, and reduces the cost of BGA ball planting during the entire repair process. link, greatly shortening the rework time, improving the rework efficiency and yield.
实施例7：Embodiment 7:
如图5所示，本发明提供一种BGA元件维修系统，包括：As shown in Figure 5, the present invention provides a BGA component maintenance system, comprising:
SRT返修台改造模块7，用于对原始SRT返修台进行改装，增加激光喷锡模组；SRT返修台改造模块7包括：SRT rework station transformation module 7 is used to refit the original SRT rework station and add laser tin spraying module; SRT rework station transformation module 7 includes:
激光焊锡模组增加单元7.1，用于为原始SRT返修台增加激光喷锡模组；Adding unit 7.1 to the laser soldering module is used to add a laser spraying tinning module to the original SRT rework station;
氮气管道共用单元7.2，用于设置激光喷锡模组使用原始氮气管道；Nitrogen pipeline sharing unit 7.2, used to set the original nitrogen pipeline for the laser tin spraying module;
不良BGA拆除模块8，用于使用改装后SRT返修台拆除不良BGA元件；不良BGA拆除模块8包括：Defective BGA removal module 8 is used to remove defective BGA components using the modified SRT rework station; the defective BGA removal module 8 includes:
不良BGA元件拆除单元8.1，用于获取存在不良BGA元件的PCBA，并使用改装后SRT返修台对不良BGA元件进行拆除；Defective BGA component removal unit 8.1 is used to obtain PCBA with defective BGA components, and use the modified SRT rework station to remove the defective BGA components;
PCBA及BGA清洁单元8.2，用于对不良BGA元件及PCBA表面进行除锡；PCBA and BGA cleaning unit 8.2, used to remove tin from bad BGA components and PCBA surface;
激光锡球焊接模块9，用于通过激光喷锡模组在PCBA表面的BGA封装位置进行激光焊锡球；激光锡球焊接模块9包括：The laser solder ball welding module 9 is used to perform laser solder balls on the BGA packaging position on the PCBA surface through the laser tin spraying module; the laser solder ball welding module 9 includes:
锡球输送单元9.1，用于通过送球机构将锡球颗粒输送到喷嘴处；锡球输送单元9.1包括：The solder ball conveying unit 9.1 is used to convey the solder ball particles to the nozzle through the ball feeding mechanism; the solder ball conveying unit 9.1 includes:
出锡球子单元，用于通过分球盘转动，使得锡球从锡球经掉球孔、输球管路、进球孔到达喷嘴末端的出球孔处；The tin ball sub-unit is used to rotate through the ball distribution plate, so that the tin ball passes through the ball drop hole, the ball loss pipeline, and the ball hole to reach the ball outlet hole at the end of the nozzle;
通氮气子单元，用于在锡球堵住出球孔后，通过氮气进气孔输氮气，直至喷嘴内氮气气压到达设定气压阈值；The nitrogen gas sub-unit is used to feed nitrogen gas through the nitrogen gas inlet hole after the solder ball blocks the ball hole until the nitrogen gas pressure in the nozzle reaches the set pressure threshold;
锡球激光照射单元9.2，用于通过激光喷锡模组对锡球进行激光照射，融化锡球，再通过氮气将液体的锡喷射到PCBA表面BGA封装的对应位置，形成锡球；锡球激光照射单元9.2包括：The solder ball laser irradiation unit 9.2 is used to irradiate the solder ball with laser light through the laser spray tin module, melt the solder ball, and then spray the liquid tin to the corresponding position of the BGA package on the surface of the PCBA through nitrogen gas to form a solder ball; the solder ball laser The irradiation unit 9.2 includes:
激光融球子单元，用于通过激光喷锡模组出激光，对锡球进行照射，锡球融化；The laser melting ball sub-unit is used to emit laser light through the laser tin spraying module, irradiate the tin ball, and melt the tin ball;
喷球子单元，用于使得液体锡球在氮气作用下喷出，喷射到PCBA表面BGA封装的对应位置焊盘；The ball spraying unit is used to make the liquid solder balls spray out under the action of nitrogen, and spray them to the corresponding position pads of the BGA package on the surface of the PCBA;
锡球焊盘融合子单元，用于液体锡球在自身热量与激光的作用下，锡球与焊盘完成融合；The solder ball pad fusion subunit is used for the liquid solder ball to fuse with the solder pad under the action of its own heat and laser;
BGA元件焊接模块10，用于安装拆除的BGA元件并按照预设焊接参数进行焊接；BGA元件焊接模块10包括：The BGA component welding module 10 is used to install and remove the BGA component and perform welding according to preset welding parameters; the BGA component welding module 10 includes:
BGA贴装单元10.1，用于通过坐标定位将拆除的BGA元件与对应锡球进行对齐，并对BGA元件进行贴装；The BGA mounting unit 10.1 is used for aligning the removed BGA components with the corresponding solder balls through coordinate positioning, and mounting the BGA components;
BGA焊接单元10.2，用于获取预设的焊接温度参数及焊接时长参数，对贴装完成的BGA元件进行焊接。The BGA soldering unit 10.2 is used to obtain preset soldering temperature parameters and soldering time parameters, and solder the mounted BGA components.
实施例8：Embodiment 8:
如图5所示，本发明提供一种BGA元件维修系统，包括：As shown in Figure 5, the present invention provides a BGA component maintenance system, comprising:
SRT返修台改造模块7，用于对原始SRT返修台进行改装，增加激光喷锡模组；SRT返修台改造模块7包括：SRT rework station transformation module 7 is used to refit the original SRT rework station and add laser tin spraying module; SRT rework station transformation module 7 includes:
激光焊锡模组增加单元7.1，用于为原始SRT返修台增加激光喷锡模组；Adding unit 7.1 to the laser soldering module is used to add a laser spraying tinning module to the original SRT rework station;
氮气管道共用单元7.2，用于设置激光喷锡模组使用原始氮气管道；Nitrogen pipeline sharing unit 7.2, used to set the original nitrogen pipeline for the laser tin spraying module;
不良BGA拆除模块8，用于使用改装后SRT返修台拆除不良BGA元件；不良BGA拆除模块8包括：Defective BGA removal module 8 is used to remove defective BGA components using the modified SRT rework station; the defective BGA removal module 8 includes:
不良BGA元件拆除单元8.1，用于获取存在不良BGA元件的PCBA，并使用改装后SRT返修台对不良BGA元进行拆除；Defective BGA component removal unit 8.1 is used to obtain PCBA with defective BGA components, and use the modified SRT rework station to remove the defective BGA components;
PCBA及BGA清洁单元8.2，用于对不良BGA元件及PCBA表面进行除锡；PCBA and BGA cleaning unit 8.2, used to remove tin from bad BGA components and PCBA surface;
激光锡球焊接模块9，用于通过激光喷锡模组在PCBA表面的BGA封装位置进行激光焊锡球；激光锡球焊接模块9包括：The laser solder ball welding module 9 is used to perform laser solder balls on the BGA packaging position on the PCBA surface through the laser tin spraying module; the laser solder ball welding module 9 includes:
锡球输送单元9.1，用于通过送球机构将锡球颗粒输送到喷嘴处；The solder ball conveying unit 9.1 is used to transport the solder ball particles to the nozzle through the ball feeding mechanism;
锡球激光照射单元9.2，用于通过激光喷锡模组对锡球进行激光照射，融化锡球，再通过氮气将液体的锡喷射到PCBA表面BGA封装的对应位置，形成锡球；The solder ball laser irradiation unit 9.2 is used to irradiate the solder balls with laser light through the laser spray tin module, melt the solder balls, and then spray the liquid tin to the corresponding position of the BGA package on the PCBA surface through nitrogen gas to form solder balls;
BGA元件焊接模块10，用于安装拆除的BGA元件并按照预设焊接参数进行焊接；BGA元件焊接模块10包括：The BGA component welding module 10 is used to install and remove the BGA component and perform welding according to preset welding parameters; the BGA component welding module 10 includes:
BGA贴装单元10.1，用于通过坐标定位将拆除的BGA元件与对应锡球进行对齐，并对BGA元件进行贴装；The BGA mounting unit 10.1 is used for aligning the removed BGA components with the corresponding solder balls through coordinate positioning, and mounting the BGA components;
BGA焊接单元10.2，用于获取预设的焊接温度参数及焊接时长参数，对贴装完成的BGA元件进行焊接。The BGA soldering unit 10.2 is used to obtain preset soldering temperature parameters and soldering time parameters, and solder the mounted BGA components.
本发明对不良BGA不再需要植球，而是将锡球直接使用激光焊锡方式在PCBA对应的焊盘上焊上锡球，再将拆下后的BGA元件放在锡球上加热焊接，整个过程节约了BGA植球环节。The present invention no longer needs ball planting for defective BGAs, but solders solder balls directly on the solder pads corresponding to the PCBA by using laser soldering, and then puts the removed BGA components on the solder balls for heating and welding. The process saves the BGA ball planting link.
尽管通过参考附图并结合优选实施例的方式对本发明进行了详细描述，但本发明并不限于此。在不脱离本发明的精神和实质的前提下，本领域普通技术人员可以对本发明的实施例进行各种等效的修改或替换，而这些修改或替换都应在本发明的涵盖范围内/任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。Although the present invention has been described in detail in conjunction with preferred embodiments with reference to the accompanying drawings, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, those skilled in the art can make various equivalent modifications or replacements to the embodiments of the present invention, and these modifications or replacements should be within the scope of the present invention/any Those skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.
Claims (10)
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