JP2009164310A - Electronic parts repair equipment and electronic parts repairing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic parts repair equipment and an electronic parts repairing method that can easily repair minute electronic parts that are highly densely mounted using laser heating. <P>SOLUTION: At an tip part of a heating and suction head 35 of the electronic parts repair equipment, there is prepared an optical waveguide 40 for setting an irradiation direction of a laser beam 21 transmitted from within an optical fiber 31 to surely irradiate the laser beam to a target part to be repaired. The optical waveguide 40 is constructed such that the laser beam is emitted from the tip surface 35a that is in contact with the target repaired part at the tip part. Further, there is prepared a suction hole 23 inside the optical waveguide 40 that extends in parallel with the transmission direction of the laser beam, and one opening of the suction hole 23 is prepared at the tip surface 35a. The other opening of the suction hole 23 is in contact with a vacuum suction hose 36, and it is so constructed that the internal cavity of the suction hole 23 becomes vacuum by a vacuum source. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component repair apparatus and an electronic component repair method for repairing an electronic component in which a bonding failure or the like has occurred when an electronic component is mounted on an electronic circuit board using a thermoplastic bonding material such as solder.

  In recent years, miniaturization, thinning, and weight reduction of portable information terminals, mobile devices, and the like have rapidly progressed, and accordingly, a small electronic component (chip component) for surface mounting also has a size of 1005 (1.0 mm × 0.5 mm). From 0603 to 0.603 (0.6 mm × 0.3 mm), further down to 0402 (0.4 mm × 0.2 mm). In addition, the mounting of chip components requires a high-density mounting board design that eliminates wasted space by devising the layout of printed circuit board wiring patterns and electrode pads. For example, a chip component has a mounting interval of 0.2 mm. A degree of implementation has been made.

  The conventional method of soldering chip components to a printed wiring board is to form lands for mounting chip components at mounting positions on the surface of the printed wiring board, and then print and apply solder paste to the entire surface of the lands using a printing mask. Then, after placing the chip component thereon, reflow heating is performed for soldering.

  FIG. 5 is a schematic diagram illustrating an example of a soldering joint failure. FIG. 5 is a plan view of a mounting surface on which chip components are mounted.

  As described above, when high-density mounting is performed on the surface of the printed wiring board 12, part of the solder flows out from the land during reflow heating, and solder balls and solder bridges 13 are generated between the adjacent electronic chip components 11. There is a possibility that defects such as short-circuiting parts occur. Further, due to problems such as mounting accuracy of the component mounting machine, there is a possibility that the component will be brought into contact with the adjacent component or soldered to the land of the adjacent component due to the component misalignment 14 when mounting the component.

  As a repair method when such a bonding failure occurs, replacement of defective mounting parts, correction of misalignment, removal of a solder bridge, and the like are available. This is a process called a repair process in which a chip component once mounted on the surface of the printed wiring board 12 is removed, a solder residue is removed, a solder paste is supplied again, and then a repaired chip component or a new chip component is attached. Needed.

  In the repair process, in general, the repair target component 10 and its surrounding solder joint are heated to a temperature higher than the melting temperature of the solder, the solder is melted, the chip component is removed, and the solder remaining on the land on the surface of the printed wiring board is removed. It is removed by a method such as a solder aspirator, a copper knitted wire coated with a flux-coated wick, and then re-mounted with chip solder by supplying new solder or solder paste onto the land and heating. . As a heating method at this time, a soldering iron, hot air blowing, a halogen lamp, a laser, or the like is used.

  The repair device used in the repair process includes a substrate holding stage and a heating suction head, and heats the repair target component and its periphery for the chip component, thereby melting the solder and removing the repair target component by suction. The remaining amount of solder after the repair target component is removed is measured by a laser displacement system, and an appropriate amount of solder is applied to perform repair (see Patent Document 1).

  Further, in Patent Document 2, the repair target component is held by vacuum chucking directly above the repair target component, and the solder is melted by irradiating laser light obliquely from above the repair target component. A repair device that removes the problem is disclosed.

JP 2004-241574 A JP-A-5-235538

The conventional repair device has the following problems.
When repairing a repair target component that has been bonded poorly on a printed wiring board with chip components mounted at high density, if a heating source such as hot air is used, the area around the repair target component is also heated. Due to damage, oxidation of the peripheral solder joints, and growth of intermetallic compounds in the solder joints, there is a problem that the joint strength of the peripheral solder joints is lowered and reliability is lowered.

  In addition, in the case of local heating using a laser, if the part to be repaired becomes minute, even if the part suction mechanism attempts to irradiate the laser beam with the part to be repaired sucked and fixed, the optical path is blocked by this suction mechanism. Can not heat the solder.

  Further, when it is attempted to irradiate the solder joint portion with the laser beam obliquely from above the repair target component while avoiding the suction mechanism, the large component 20 adjacent to the repair target component 10 is irradiated with the laser beam as shown in the schematic diagram of FIG. Since it is necessary to simultaneously heat and suck the component 10 to be repaired, the suction hole 23 of the component suction nozzle 22 and the irradiation position 24 of the laser beam 21 radiating from an oblique direction must be performed. There is a problem that high relative position accuracy is required between them.

  An object of the present invention is to provide an electronic component repair apparatus and an electronic component repair method capable of easily repairing minute electronic components mounted with high density by laser heating.

The present invention includes a substrate holding stage for holding a substrate on which an electronic component is mounted with a thermoplastic bonding material,
A laser light source;
The laser beam is transmitted from the laser light source so as to irradiate the electronic component to be removed with the laser beam, and a heating suction head that sucks the electronic component is provided.
An electronic device configured to irradiate the electronic component with a laser beam by a heating suction head to heat the electronic component, melt the thermoplastic bonding member, and suck and remove the electronic component. This is a parts repair device.

In the present invention, the heating adsorption head includes an optical waveguide for transmitting laser light,
The optical waveguide is characterized in that an electronic component in contact with the opening of the hole is vacuum-sucked by making the hole provided therein vacuum.

According to the present invention, the heating adsorption head includes optical means for transmitting laser light through a lens,
The optical means includes a case that covers the periphery of the lens, and vacuum-sucks an electronic component that is in contact with an opening provided in the case by bringing the internal space of the case into a vacuum state.

  In addition, the present invention is directed to an electronic component to be removed, which is mounted on a substrate with a thermoplastic bonding material, by transmitting a laser beam from a laser light source by a heating adsorption head and irradiating the electronic component with the laser beam. An electronic component repair method comprising heating a component to melt a thermoplastic joining member and adsorbing and removing the electronic component.

  According to the present invention, among the electronic components mounted on the substrate held on the substrate holding stage, the heating suction head transmits the laser light from the laser light source so that the electronic component to be removed is irradiated with the laser light. At the same time, the electronic component to be removed is sucked. The electronic component to be removed is heated by being irradiated with the laser beam, and is sucked and removed from the substrate.

  Thereby, only the electronic component used as a removal object can be heated locally, and adsorption | suction of an electronic component can be performed simultaneously with a heating. By transmitting the laser beam directly to the electronic component, there is no problem that the laser beam cannot be heated by the large component or the component suction mechanism being cut off. Furthermore, since the laser light transmission structure and the electronic component suction structure are integrated, high relative positional accuracy between the laser light irradiation position and the component suction position is not required, and repair can be easily performed.

  Further, according to the present invention, the heating adsorption head includes an optical waveguide that transmits laser light, and an electronic component that is in contact with the opening of the hole is formed by evacuating the hole provided inside the optical waveguide. Vacuum adsorption.

  As a result, the repair can be performed more easily, and further, it can be determined whether or not the electronic component has been removed by the change in the degree of vacuum in the hole.

  Further, according to the present invention, the heating / adsorption head includes an optical unit that transmits laser light through a lens, and an electron in contact with an opening provided in the case by bringing the internal space of the case covering the periphery of the lens into a vacuum state. Vacuum adsorption of parts.

  Thereby, the loss of a laser beam can be prevented by disposing the vacuum suction hole outside the laser transmission path.

  According to the present invention, among the electronic components mounted on the substrate with the thermoplastic bonding material, the laser light is transmitted from the laser light source to the electronic component to be removed by the heating suction head, and the laser is transmitted to the electronic component. Light is irradiated, the electronic component is heated to melt the thermoplastic joining member, and the electronic component is adsorbed and removed.

  Thereby, only the electronic component used as a removal object can be heated locally, and adsorption | suction of an electronic component can be performed simultaneously with a heating. By transmitting the laser beam directly to the electronic component, there is no problem that the laser beam cannot be heated by the large component or the component suction mechanism being cut off. Furthermore, since the laser light transmission structure and the electronic component suction structure are integrated, high relative positional accuracy between the laser light irradiation position and the component suction position is not required, and repair can be easily performed.

Hereinafter, embodiments of the present invention will be described.
FIG. 1 is an external view showing a configuration of a repair device according to an embodiment of the present invention. As shown in FIG. 1, the repair apparatus of the present invention includes a substrate holding stage 32 that holds a printed wiring board (hereinafter simply referred to as “mounting board”) on which microelectronic components to be repaired are mounted, and a substrate holding stage. A heating suction head 35 for removing a repair target component from the mounting substrate held by the stage 32 is provided.

  It is to be noted that an electronic component mounted on the substrate surface by a thermoplastic bonding material is a target of repair by the repair device of the present invention. Thermoplastic bonding materials, for example, alloys such as solder, other metals, resins, conductive adhesives, glass, etc. are softened and melted at a predetermined temperature or higher, so that bonding properties are lost, and electronic components can be easily removed from the board. Any material can be used as long as it is removable. In addition, various electronic components such as chip resistors and chip capacitors can be targeted for repaired electronic components. Since the bonding material is melted by heating the electronic component itself when repairing, the combination of the bonding material that can be repaired and the electronic component can change characteristics even at a temperature higher than the melting temperature of the bonding material. Any electronic component that does not generate any problem may be used.

  The substrate holding stage 32 is further provided on the xy-θ stage 33. The xy-θ stage 33 is configured to be slidable in the x direction and the y direction perpendicular to the x direction in a horizontal plane, and further has a rotation center in the center and is configured to be rotatable about a vertical rotation axis. Is done. As a result, the substrate holding stage 32 can be linearly moved in the x and y directions similarly to the xy-θ stage 33 and further displaced by a predetermined angle θ around the rotation axis. The heat adsorption head 35 is configured to be movable only in the z direction (vertical direction) by being provided on the z stage 34. That is, the heating / adsorption head 35 is configured not to be displaced in the horizontal plane.

  Therefore, the positioning of the heating suction head 35 and the repair target component is performed by adjusting the plane direction with the xy-θ stage 33 and adjusting the height direction with the z stage 34.

  For alignment, a camera capable of photographing the mounting substrate held on the substrate holding stage 32 is provided, and an operator operates the xy-θ stage 33 and the z stage 34 while looking at a monitor on which a photographed image is displayed. You may be comprised so that it may be performed, and it may be comprised so that image processing may be performed with respect to the image image | photographed with the camera, a repair target component may be detected, and a stage may be moved automatically.

  The heating adsorption head 35 is connected to a laser light oscillator 30 that is a laser light source for local heating via an optical fiber 31, and will be described later in detail. Laser light is transmitted to the tip portion that comes into contact. Further, the heating suction head 35 is connected to a vacuum source such as a vacuum pump via a vacuum suction hose 36 in order to vacuum-suck the repair target component at its tip portion.

  In addition, the vacuum source connected to the heating suction head 35 is connected to the substrate holding stage 32 via the vacuum suction hose 36, and a mounting substrate by vacuum suction using a plurality of suction holes provided in the substrate holding stage 32. May be held.

  The heating and suction head 35 can heat the repair target component with laser light at the tip portion and heat the vacuum to be repaired without blocking the laser beam. Since it is not necessary to align the irradiation position and the component suction position, even a minute electronic component mounted with high density can be easily repaired.

  The tip portion of the heating adsorption head 35 is configured such that the area irradiated with the laser beam when heating the repair target component is 50% or more of the component area, and the entire repair target component is heated by the laser beam irradiation. Such a shape is more preferable.

  Further, the output of the laser light can be appropriately changed depending on the size of the repair target component 10 and the type of workpiece. However, since the repair target component is a minute size (1005, 0603, 0402, etc.), it is set to 1 to 40 W. Is preferred. The type of the laser beam is not particularly limited as long as the repair target component can be heated, and may be a YAG laser, a semiconductor laser, or another laser.

FIG. 2 is an enlarged view of the front end portion of the heating suction head 35.
An optical waveguide 40 for determining the irradiation direction of the laser light 21 transmitted through the optical fiber 31 and for reliably irradiating the repair target component with the laser light is provided at the tip portion of the heating adsorption head 35. The optical waveguide 40 is configured such that laser light is emitted from the distal end surface 35a that contacts the repair target component at the distal end portion. Further, the suction hole 23 extending in parallel with the laser light transmission direction is provided in the optical waveguide 40, and one opening of the suction hole 23 is provided in the distal end surface 35a. The other opening of the suction hole 23 is connected to the vacuum suction hose 36 and is configured such that the internal cavity of the suction hole 23 is brought into a vacuum state by a vacuum source.

  Here, the optical fiber 31 may be one or plural. The optical waveguide 40 is made of quartz, a semiconductor material, a polymer, or the like, and more preferably a quartz-based material that can transmit light with low loss. Moreover, it is preferable to provide a plating layer of metal or the like on the outer surface of the optical waveguide 40 so that the transmitted laser light does not leak to the outside. Here, it is preferable that the diameter of the optical waveguide 40 and the opening diameter of the suction hole 23 can be changed according to the size of the repair target component. For example, when the size of the repair target component is 0402, the diameter of the optical waveguide 40 is 300 μm. When the opening diameter of the suction hole is 100 μm and the size is 0603, the diameter of the optical waveguide 40 is 400 μm and the opening diameter of the suction hole is 150 μm. However, the present invention is not limited to this value. Moreover, it is preferable to provide the thermocouple for measuring the heating temperature of repair object components in the optical waveguide 40 front-end | tip part.

FIG. 3 is an enlarged view of the tip portion of the heating and suction head 35 of another embodiment.
The configuration of the heating adsorption head 35 that determines the irradiation direction of the laser light 21 and reliably irradiates the repair target component with the laser light is the same, but in this embodiment, instead of the optical waveguide 40, the optical lens 41 and By using the optical means comprising the case 42, the repair target component is irradiated with laser light.

  The optical system lens 41 is covered with a case 42 that can be fixedly disposed in the internal space, and the optical fiber 31 so that laser light is incident on the optical system lens 41 from the connection surface with the optical fiber 31 of the case 42. Is inserted into the case 42.

  In the optical system lens 41 in the case 42, the laser light incident on the optical system lens 41 is brought into contact with the repair target component on the opposite side of the connection surface with the optical fiber 31 of the case 42 by one or a plurality of lenses. On the surface, the laser light irradiation area is configured to be 50% or more of the component area. For example, in the case of a component having a size of 0402, the irradiation area can be 50% or more of the component area if the diameter of the laser light irradiation portion is 250 μm or more.

  An opening is provided in the contact surface to the repair target part, and the opening is an opening for communicating the internal space of the case 42 with the outside, and the internal space of the case 42 is brought into a vacuum state by the vacuum suction hose 36. Then, the part to be repaired is sucked.

  It is preferable to adopt such a configuration in which such vacuum suction holes are arranged outside the laser transmission path, since there is no problem of loss occurring when laser light is transmitted from the optical fiber 31 to the tip of the heating suction head.

Below, a repair process is demonstrated.
The mounting substrate 12 is held on the substrate holding stage 32, and the optical waveguide 40 at the tip of the heating suction head 35 and the repair target component 10 are aligned and brought into contact with each other.

  Laser light is oscillated in the contacted state, and the repair target component 10 is irradiated with the laser light from the heating adsorption head 35 and heated to melt the bonded portion. When the repair target component 10 is sucked and held by vacuum suction simultaneously with the laser heating and the bonding force by the bonding material is lower than the vacuum suction force, the repair target component 10 can be detached from the substrate 12.

  At this time, since the degree of vacuum in the suction hole 23 increases, it can be determined that the removal of the repair target component 10 has been completed by detecting the degree of vacuum by the detection means.

  Next, the new electronic component 11 is vacuum-sucked to the tip of the heating suction head 35, and the bonding material is applied to the land after the repair target component 10 is removed. The heating suction head 35 and the land to be mounted are aligned and brought into contact with each other. In the state of contact, the laser beam is oscillated, the new electronic component 11 is heated to melt the bonding material, and the vacuum suction is finished. This completes the repair process.

An embodiment using the repair device according to the present invention will be described below.
FIG. 4 is a schematic diagram illustrating the heating and suction head 35 of the embodiment and a repair method using the same.

  In this example, the electronic component 11 of 0603 size was surface-mounted on the substrate 12 adjacent to the large component 20 with a component mounting interval of 0.2 mm. The solder material used here was Sn-3Ag-0.5Cu, and soldering was performed by reflow.

  The repair target component 10 was an electronic component of 0603 size adjacent to the large component 20. Here, the configuration of the heating and suction head 35 used is that using the optical waveguide 40 shown in FIG. The overall configuration of the repair device is as shown in FIG.

  The optical waveguide 40 at the tip of the heating adsorption head 35 has an optical waveguide 40 diameter of 400 μm and an adsorption hole opening diameter of 150 μm. The material of the optical waveguide 40 was quartz, and the outer surface was plated with aluminum. With such a structure, an area of about 50% of the upper surface of the repair target component 10 can be irradiated with laser light and heated.

  In the repair process, the substrate 12 is first mounted on the substrate holding stage 32 and held by vacuum suction. Thereafter, the xy-θ stage 33 and the z stage 34 are operated to align and contact the optical waveguide 40 at the tip of the heating suction head 35 and the repair target component 10.

  Laser light is oscillated in contact, and the repair target component 10 is irradiated and heated through the optical fiber 31 and the optical waveguide 40 to melt the solder joint. Here, in this example, a YAG laser was used as the laser beam, and the output was 1.5 W. Then, the repair target component 10 is sucked and held by vacuum suction simultaneously with laser heating, and when the solder bonding force is lower than the vacuum suction force, the repair target component 10 is removed from the substrate 12 by the vacuum suction force and the suction hole 23 is removed. The degree of vacuum increases. By detecting the increase in the degree of vacuum by the pressure detecting means provided at the tip of the vacuum suction hose 36, it is determined that the removal of the repair target component 10 is completed, and thereafter, the z stage 34 is operated to repair from the substrate. The target part 10 was removed. It was about 0.5 seconds from the start of laser heating until the degree of vacuum increased.

  Then, the new 0603 size electronic component 11 was vacuum-sucked to the tip of the heating suction head 35, and the solder paste was applied to the land after the repair target component 10 was removed by a dispenser. As in the case of component removal, the heat adsorption head 35 and the land after removal of the repair target component were aligned and brought into contact while operating the xy-θ stage 33 and the z stage 34. In this state, the laser beam was oscillated, the new electronic component 11 was heated, and about 0.5 seconds later, the vacuum suction was finished in a state where the solder was melted, and the z stage 34 was raised. By doing so, the repair process was completed. In this example, a YAG laser was used at the time of component re-mounting as in the case of component removal, and the laser output was 1.5 W.

  As described above, by using the heating and suction head in the repair device of the present invention, it is possible to easily and efficiently repair a mounting substrate in which small-sized electronic components are densely mounted adjacent to each other.

It is an external view which shows the structure of the repair apparatus which is one Embodiment of this invention. FIG. 4 is an enlarged view of a tip portion of a heating suction head 35. It is an enlarged view of the front-end | tip part of the heating suction head 35 of other embodiment. It is a schematic diagram which shows the heating adsorption head 35 of an Example, and the repair method using this. It is a schematic diagram which shows an example of the joining defect of soldering. It is a schematic diagram which shows the repair method by the conventional repair apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Repair object 11 Electronic component 12 Printed wiring board 13 Bridge 20 Large component 21 Laser light 22 Component adsorption nozzle 23 Adsorption hole 24 Irradiation position 30 Laser light oscillator 31 Optical fiber 32 Substrate holding stage 33 xy-θ stage 34 z stage 35 Heat Suction Head 36 Vacuum Suction Hose 40 Optical Waveguide 41 Optical System Lens

Claims (4)

A substrate holding stage for holding a substrate on which an electronic component is mounted with a thermoplastic bonding material;
A laser light source;
The laser beam is transmitted from the laser light source so as to irradiate the electronic component to be removed with the laser beam, and a heating suction head that sucks the electronic component is provided.
An electronic device configured to irradiate the electronic component with a laser beam by a heating suction head to heat the electronic component, melt the thermoplastic bonding member, and suck and remove the electronic component. Parts repair device. The heat adsorption head includes an optical waveguide that transmits laser light,
2. The electronic component repair device according to claim 1, wherein the optical waveguide vacuum-sucks an electronic component in contact with the opening of the hole by bringing the hole provided therein into a vacuum state. The heating adsorption head includes optical means for transmitting laser light through a lens,
2. The electronic component according to claim 1, wherein the optical means includes a case that covers the periphery of the lens, and vacuum-sucks the electronic component that contacts the opening provided in the case by making the internal space of the case into a vacuum state. Repair device.   With respect to the electronic component to be removed mounted on the substrate with the thermoplastic bonding material, a laser beam is transmitted from the laser light source by the heating adsorption head, and the electronic component is irradiated with the laser beam to heat the electronic component. An electronic component repair method comprising melting a thermoplastic joining member and adsorbing and removing the electronic component.

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