JP4331069B2 - Electronic component repair device - Google Patents

Description

  The present invention relates to a repair device that removes and reattaches an electronic component by heating and melting a solder joint portion of the electronic component mounted on a printed circuit board.

  BGA [Ball Grid Array Package] in which a large number of ball-shaped connection terminals are provided on the lower surface of the package is used as an electronic component that can be mounted on a printed circuit board as a high-density mounting electronic component ( This BGA includes a CSP (Chip Size Package) in which the pitch of connection terminals is minimized.

  In the printed circuit board on which the BGA is mounted, the BGA may need to be replaced due to a failure of the BGA or due to maintenance or recycling of the BGA. Repair technology to attach to is indispensable.

The procedure at the time of reattachment in this BGA repair process is shown in FIG.
In FIG. 9, 1 is a printed circuit board, 2 is a BGA which is an electronic component mounted on the printed circuit board 1, and this BGA 2 has a large number of ball-shaped bumps (solder joints) 3 made of a solder material on the lower surface side of the package. As a connection terminal.

  As shown in FIG. 9A, connection pads 4 are arranged and formed on the surface of the printed circuit board 1 in accordance with the shape and arrangement of the bumps 3 of the BGA 2. Then, flux or solder paste 5 is applied onto the pad 4 (or the tip of the bump 3) as shown in FIG. 5B, and then the BGA 2 is applied onto the printed circuit board 1 as shown in FIG. After mounting, the bumps 3 are heated and melted to join the pads 4 by soldering.

Conventionally, as an apparatus used for repairing an electronic component such as BGA, as described in Patent Documents 1 to 3 below, for example, a central portion of the electronic component is sucked and held by a suction nozzle, and the electronic component is soldered. There has been proposed an apparatus for removing and reattaching an electronic component by blowing hot air to the part to heat and melt the solder.
JP 2003-218512 A JP 2001-119136 A JP 11-29929 A

  However, all of these conventional repair devices have a simple holding structure in which the central part of the electronic component is simply sucked by the suction nozzle, so that the electronic component is warped or tilted by heating when the electronic component is attached. In many cases, connection failure occurs, such as bumps that are solder joints are partially crushed and the bumps are short-circuited, or some of the bumps are not connected to the pads and are not connected. there were. In particular, the above-mentioned BGA has a problem that it is difficult to find out even if a connection failure occurs because the connection part between the bump and the pad cannot be checked from the appearance.

  The present invention has been made in view of such points, and in a repair device that removes and reattaches a solder joint portion of an electronic component by heating and melting, suppressing warping and inclination when the electronic component is reattached, An object of the present invention is to provide a repair device that can stably and reliably mount components.

In order to achieve the above object, the present invention
A repair device having a solder joint on the lower surface side of an electronic component mounted on a printed circuit board, and removing and reattaching the electronic component by heating and melting the solder joint,
Heating means for injecting hot air from the nozzle for melting the solder joint portion;
Component holding means comprising: a holding member that holds the substantially central portion of the electronic component so as to be pressed from the upper surface side; and a plurality of movable arm members that are held from the lower surface side of the end portion of the electronic component ; ,
With
The distal end portion of the movable arm member is sandwiched between the electronic component and the printed board when the electronic component is reinstalled, and prevents the electronic component from sinking more than necessary .

  Moreover, in the repair apparatus of this invention, it is good also as a shape which hold | maintains the front-end | tip part of the said movable arm member on both sides of the said electronic component from the upper and lower sides.

  Furthermore, in the repair apparatus of the present invention, board support means for supporting the printed board from below is provided, and the printed board is sandwiched from above and below by the component holding means and the board support means.

  Furthermore, in the repair apparatus of this invention, it is desirable to have a structure in which the hot air sprayed from the nozzle of the heating means is guided by the component holding means so as to be blown uniformly onto the electronic component.

  The repair device of the present invention has a structure in which, in the component holding means provided at the tip portion of the nozzle, the substantially central portion of the electronic component is held by the pressing member, and at the same time, the end portion of the electronic component is held by the plurality of movable arm members. In this state, the electronic components are firmly fixed and held without warping or tilting, and in that state, hot air is sprayed from the nozzle and the electronic components are reattached. Connection failure does not occur, and electronic components can be mounted stably and reliably.

  Furthermore, in the repair device of the present invention, when the electronic component is reinstalled, the tip of the movable arm member sandwiched between the electronic component and the printed board prevents the electronic component from sinking more than necessary. The collapse of the part can be prevented more reliably.

  In the repair device of the present invention, the tip of the movable arm member is shaped so as to hold the electronic component from above and below, so that the electronic component can be fixed more reliably.

  Further, in the repair device of the present invention, the board support means for supporting the printed board from the lower side is provided, and the printed board is sandwiched from above and below by the component holding means and the board support means, thereby suppressing the warpage of the printed board. Therefore, it is possible to more reliably prevent a connection failure when the electronic component is reattached.

  Furthermore, in the repair device of the present invention, the structure is such that the hot air sprayed from the nozzle of the heating means is guided by the component holding means so as to be blown uniformly onto the electronic component, thereby uniformly heating and melting the solder joint portion. Components can be more stably and reliably mounted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a side view showing a configuration of a main part of a repair device according to the present invention. In this repair device, the printed circuit board 1 is placed and fixed on a support base 11 erected on the lower base 10, and the BGA 2 that is an electronic component is removed and attached to the printed circuit board 1.

  This repair device has a built-in heating means (not shown) that generates high-temperature hot air for melting the bumps 3 that are solder joints provided on the lower surface side of the BGA 2, and the hot air generated from the heating means. H is jetted from the upper nozzle 13 protruding from the upper base 12 and the lower nozzle 14 protruding from the lower base 10 disposed above the printed circuit board 1 toward the BGA 2.

  In this repair device, a component holding means 15 for holding the BGA 2 is provided at the tip of the upper nozzle 13. The component holding means 15 includes a pressing member 16 that holds the substantially central portion of the BGA 2 from the upper surface side, a plurality of movable arm members 17 that are engaged with the end portions of the BGA 2 and hold the BGA 2 therebetween, and It is comprised.

  The movable arm member 17 is rotatably provided so as to open and close with the shaft portion 18 as a fulcrum corresponding to the corner portion of the BGA 2, and the distal end portion 17 a is bent in a bowl shape to be attached to the end portion of the BGA 2. The BGA 2 is engaged and held from the lower surface side. Here, it is assumed that the movable arm member 17 can variably adjust the thickness of the tip end portion 17 a that enters between the BGA 2 and the printed circuit board 1 according to the size of the bump 3. The component holding means 15 configured as described above is moved up and down with respect to the printed circuit board 1 integrally with the upper nozzle 13 by an elevating mechanism 21 provided between the upper base 12 and the upper nozzle 13. .

  Further, in this repair device, a substrate support means 19 for supporting the printed circuit board 1 from the lower side is provided at the tip of the lower nozzle 14. The board support means 19 includes a support member 20 that faces the pressing member 16 and the movable arm 17 of the component holding means 15 and supports the lower surface side of the printed circuit board 1. The printed board 1 is sandwiched from above and below by the board support means 19. Similarly to the component holding means 15, the board support means 19 is also moved up and down relative to the printed board 1 integrally with the lower nozzle 14 by an elevating mechanism 22 provided between the lower base 10 and the lower nozzle 14. It has become so.

  In this repair device, the upper and lower nozzles 13, 14, the component holding means 15, and the board support means 19 can be manufactured in a size and shape that match the BGA 2, or can be changed in size and shape according to the BGA 2. It needs to be structured. Further, the component holding means 15 and the board support means 19 are configured so as not to prevent the original heating by hot air, and as the material thereof, a resin material that does not damage the printed board 1 or the BGA 2 and has high heat resistance is used. It is desirable. As this resin material, for example, a tetrafluoroethylene resin known under the trade name of Teflon is suitable.

  In this repair device, either a manual type or an electric type may be adopted as a driving means for opening and closing the movable arm member 17. Further, the elevating mechanisms 21 and 22 for moving the upper and lower nozzles 13 and 14 up and down may be either manual type or electric type, but must be capable of controlling the pressure at the time of joining the BGA 2.

  In the repair device of this embodiment configured as described above, the structure in which the substantially central portion of the BGA 2 is held by the pressing member 16 from the upper surface side, and at the same time, the end portion of the BGA 2 is held by the plurality of movable arm members 17 from the lower surface side. As a result, the BGA 2 is firmly fixed and held on the component holding means 15 without warping or tilting.

  In this component holding means 15, even if the bump 3 is heated and melted and the BGA 2 sinks, the BGA 2 and the print are determined by the thickness of the tip 17 a of the movable arm member 17 sandwiched between the BGA 2 and the printed circuit board 1. The space | interval of the board | substrate 1 does not become narrow, and this prevents the BGA2 from sinking more than necessary.

  In this repair device, hot air for melting the bumps 3 is evenly sprayed from the nozzles 13 and 14 arranged above and below the printed circuit board 1, and the printed circuit board 1 is formed by the component holding means 15 and the substrate supporting means 19. The occurrence of warping of the printed circuit board 1 can also be suppressed by adopting a structure in which is sandwiched from above and below.

  Furthermore, in this repair device, the diffusion of the hot air H sprayed from the upper nozzle 13 is suppressed by the component holding means 15, that is, the movable arm member 17 is guided to blow the hot air H uniformly on the BGA 2. As a result, the bump 3 can be uniformly heated and melted. Also, the substrate support means 19 acts in the same manner on the hot air H sprayed from the lower nozzle 14, and the bumps 3 are uniformly heated and melted.

FIG. 2 shows another configuration example of the component holding means.
In other words, the component holding means 15 in this example is formed in a shape in which the distal end portion 17a of the movable arm member 17 is formed in a bifurcated shape so that the BGA 2 is sandwiched from above and below, thereby fixing the BGA 2 more securely. Can do.

FIG. 3 shows still another configuration example of the component holding means.
That is, the component holding means 15 of this example is configured to open and close by sliding the movable arm member 17 along the slide rail 23 in parallel in the inner and outer directions.

Next, with reference to FIGS. 4 to 8, the BGA remounting operation by the repair device of this embodiment will be described.
Prior to this BGA mounting operation, as shown in FIG. 9B, flux or solder paste 5 is applied on the pads 4 of the printed circuit board 1 (or the tips of the bumps 3) in advance. First, as shown in FIG. 4, the BGA 2 to be joined is held by the component holding means 15 above the printed circuit board 1 placed on the support base 11. At this time, as described above, the component holding means 15 holds the substantially central portion of the BGA 2 with the pressing member 16 from the upper surface side, and simultaneously holds the end portions of the BGA 2 with the plurality of movable arm members 17 from the lower surface side. Is securely held without warping or tilting.

  Next, the lifting mechanism 21 is operated from this state, and the component holding means 15 is lowered integrally with the upper nozzle 14 as shown in FIG. 5 to place the BGA 2 on the printed circuit board 1. In this state, the board support means 19 supports the printed board 1 from below, and the printed board 1 is sandwiched from above and below by the component holding means 15 and the board support means 19 as described above. Occurrence is suppressed. In this state, considering that the BGA 2 will sink later when the bump 3 is melted, the lifting mechanism 18 presses the BGA 2 against the printed circuit board 1 with a weak force.

  Subsequently, from this state, hot air H is sprayed from the upper and lower nozzles 13 and 14 as shown in FIG. 6, and the bumps 3 of the BGA 2 are heated and melted to be joined to the pads 4 of the printed circuit board 1. At this time, as described above, the BGA 2 is firmly fixed and held on the component holding means 15 without warping or tilting, so that connection failure such as crushing of the bumps 3 or no connection does not occur. Bonded stably and reliably to the substrate 1. Further, even when the bump 3 is melted and the BGA 2 sinks, the tip 17a of the movable arm member 17 sandwiched between the BGA 2 and the printed circuit board 1 prevents the BGA 2 from sinking more than necessary. As a result, the bump 3 can be more reliably prevented from being crushed. Furthermore, since the hot air H sprayed from the upper and lower nozzles 13 and 14 is guided to the component holding means 15 and the board support means 19 and is uniformly blown toward the BGA 2, the bump 3 is heated and melted evenly to cause the BGA 2 to melt. It can join more reliably.

  After the BGA 2 is bonded to the printed circuit board 1 in this way, the required cooling time is allowed, and after the bumps 3 are cooled and solidified, the movable arm member 17 of the component holding means 15 is opened to release the holding of the BGA 2 as shown in FIG. To do. Finally, as shown in FIG. 8, the lifting mechanism 21 is operated to raise the component holding means 15 integrally with the upper nozzle 13, thereby completing the BGA attachment process. After the BGA has been attached, there is no problem even if the substrate support means 19 remains in the position shown in FIG. 7, but the substrate support means 19 is lowered together with the lower nozzle 14 by the elevating mechanism 22 as shown in FIG. Thus, when the printed board 1 is removed from the support base 11, it is possible to prevent a component mounted on the lower surface side of the printed board 1 from coming into contact with the board support means 19.

  As described above, according to the repair device of the present embodiment, the BGA remounting operation can be performed stably, and even in a multi-pin, narrow pitch CSP and a BGA having a lead-free composition with a high melting point of the bump. Implementation is possible.

  Although detailed description of the removal of the BGA is omitted, the removal operation of the BGA is performed by the reverse operation of the above-described attachment operations of FIGS.

It is a side view which shows the structure of the principal part of the repair apparatus by this invention. It is another structural example of a component holding means. It is the further another structural example of a component holding means. It is explanatory drawing of the attachment operation | movement of BGA in the repair apparatus by this invention, and is the state which hold | maintained BGA with the component holding means. In the same manner, BGA is placed on the printed circuit board. In the same manner, hot air is jetted from the nozzle. In the same manner, the BGA held by the component holding means is released. In the same manner, the BGA mounting operation has been completed. It is explanatory drawing of the attachment procedure of BGA.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Printed circuit board, 2 ... BGA (electronic component), 3 ... Bump (solder joint part), 13, 14 ... Nozzle, 15 ... Component holding means, 16 ... Holding member, 17 ... Movable arm member, 17a ... Tip part, 19: Substrate support means, H: Hot air

Claims (4)

A repair device having a solder joint on the lower surface side of an electronic component mounted on a printed circuit board, and removing and reattaching the electronic component by heating and melting the solder joint,
Heating means for injecting hot air from the nozzle for melting the solder joint portion;
A pressing member that holds the substantially central portion of the electronic component from the upper surface side, and a plurality of movable arm members that hold the end portion of the electronic component from the lower surface side , and the tip of the nozzle of the heating unit Component holding means for holding the electronic component in the section;
With
The tip of the movable arm member is sandwiched between the electronic component and the printed circuit board when the electronic component is reinstalled to prevent the electronic component from sinking more than necessary. apparatus. The electronic device repair device according to claim 1 ,
An electronic component repair device characterized in that the tip of the movable arm member is shaped to hold the electronic component from above and below. In the repair apparatus of the electronic component of Claim 1 or 2 ,
An electronic component repair device comprising board support means for supporting the printed board from below and sandwiching the printed board from above and below by the component holding means and the board support means. In the repair apparatus of the electronic components of any one of Claims 1-3 ,
An electronic component repair device characterized in that hot air sprayed from a nozzle of the heating unit is guided by the component holding unit so as to be uniformly blown onto the electronic component.

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