JP2010161123A - Device and method for repairing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for repairing an electronic component, capable of enhancing the mounting density of electronic components. <P>SOLUTION: A heating block 21 selectively transmits thermal energy to the electronic component 46 on a printed board 47. Diffusion of the thermal energy around the electronic component 46 is avoided. Other electronic components 52 are protected from the thermal energy around the electronic component 46. The mounting density of the electronic component 46 and the electronic components 52 is enhanced on the printed board 47. Further, the leading end of a stopper 27 attached to the heating block 21 is regulated in a position closer to the printed board 47 from a lower surface 24a of the heating block 21. When the electronic component 46 is displaced toward the printed board 47 based on melt of a bonding material 48, the leading end of the stopper 27 contacts with the surface of the printed board 47. Consequently, a gap can be ensured between the electronic component 46 and the printed board 47, and short-circuit between the bonding materials 48 and leak of the bonding material 48 to the outside from the periphery of the electronic component 46 can be avoided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an apparatus and a method for repairing an electronic component such as removing and attaching the electronic component to a printed circuit board.

  For example, a printed circuit board unit is incorporated in an electronic device. In the printed circuit board unit, a large number of electronic components are mounted on the printed circuit board. For mounting, for example, a ball grid array (BGA) of solder bumps is used. Prior to installation of the printed circuit board unit, the function of the printed circuit board unit is tested. When a defect is found in the electronic component, the electronic component is removed from the printed circuit board.

JP 2003-258026 A Japanese Patent Laid-Open No. 10-41360 JP 2002-353612 A Japanese Patent Laid-Open No. 10-303546

  When removing the electronic components, high-temperature hot air is blown onto the solder bumps of the BGA. In recent years, lead-free solder materials that do not contain lead are used for solder bumps. The melting point of such a solder material is higher than that of a conventional solder material. Therefore, when hot air leaks out toward the electronic components around the electronic component, there is a concern about melting of the solder bumps in the surrounding electronic component. As a result, the distance from surrounding electronic components must be increased. The mounting density of electronic components decreases.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic component repair device and an electronic component repair method capable of increasing the mounting density of electronic components.

  In order to achieve the above-mentioned object, one specific example of the electronic component repair device is that the lower surface is in contact with the surface of the electronic component that is bonded to the surface of the printed circuit board with the bonding material, and the bonding material is used based on heat generation. A heating block for heating, and a stopper connected to the heating block and defining a tip at a position closer to the surface of the printed circuit board than a lower surface of the heating block are provided.

  According to such an electronic component repair device, heat energy is selectively transmitted to the electronic components on the printed circuit board by the action of the heating block. The diffusion of thermal energy around the electronic component is avoided. As a result, other electronic components are sufficiently protected from thermal energy around the electronic components. The mounting density of electronic components and surrounding electronic components on the printed circuit board can be increased. Moreover, a stopper is attached to the heating block. The stopper defines the tip at a position closer to the printed circuit board than the lower surface of the heating block. Therefore, when the electronic component is displaced toward the printed circuit board based on the melting of the bonding material, the tip of the stopper comes into contact with the surface of the printed circuit board. As a result, a gap is reliably ensured between the electronic component and the printed board. A short circuit between the bonding materials and leakage of the bonding material from the contour of the electronic component toward the outside are avoided.

  In order to achieve the above object, one specific example of the electronic component repair method is to bring a heating block into contact with the surface of the electronic component to be bonded to the surface of the printed circuit board with a bonding material sandwiched between the surface of the printed circuit board. A step of bringing a tip of a stopper connected to the heating block closer to the surface of the printed board than the heating block, a step of heating the bonding material based on heat generated by the heating block, and melting the bonding material; And a step of bringing a tip of the stopper into contact with the surface of the printed circuit board when the bonding material is melted to secure a predetermined gap between the surface of the printed circuit board and the electronic component.

  According to such an electronic component repair method, heat energy is selectively transmitted to the electronic components on the printed circuit board by the action of the heating block. The diffusion of thermal energy around the electronic component is avoided. As a result, other electronic components are sufficiently protected from thermal energy around the electronic components. The mounting density of electronic components and surrounding electronic components on the printed circuit board can be increased. Moreover, a stopper is attached to the heating block. The stopper defines the tip approaching the printed circuit board from the lower surface of the heating block. Therefore, when the electronic component is displaced toward the printed circuit board based on the melting of the bonding material, the stopper tip contacts the surface of the printed circuit board. As a result, a gap is reliably ensured between the electronic component and the printed board. A short circuit between the bonding materials and leakage of the bonding material from the outline of the electronic component are avoided.

  As described above, according to the disclosed electronic component repair device and electronic component repair method, the mounting density of electronic components can be increased.

It is sectional drawing which shows roughly the structure of the electronic component repair apparatus which concerns on one Embodiment of this invention. FIG. 2 is a cross-sectional view taken along line 2-2 in FIG. It is a block diagram which shows the control system of the electronic component repair apparatus which concerns on this invention. It is sectional drawing which shows a mode that a printed circuit board unit is mounted | worn by the electronic component repair apparatus which concerns on this invention. It is a flowchart which shows the flow of a process of a control circuit. It is sectional drawing which shows a mode that the heating unit contacted on the electronic component. FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. It is sectional drawing which shows a mode that the joining material fuse | melted schematically. It is sectional drawing which shows a mode that the electronic component was adsorb | sucked with the heating unit. It is sectional drawing which shows a mode that the new electronic component has been arrange | positioned on a printed circuit board. It is a top view which shows the position which measures temperature on a printed circuit board unit at the time of verification. It is a table | surface which shows the temperature of each position on a printed circuit board unit.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 schematically shows the structure of an electronic component repair apparatus 11 according to an embodiment of the present invention. The electronic component repair device 11 includes a support base 12. A horizontal surface 13 is defined on the support base 12. A window hole 14 is cut through the horizontal surface 13. A first heating unit 15 is disposed above the support base 12. The first heating unit 15 faces the window hole 14 from above the support base 12. Similarly, the second heating unit 16 is disposed below the support base 12. The second heating unit 16 faces the window hole 14 from below the support base 12.

  The first heating unit 15 is connected to, for example, a positioning mechanism (not shown). The positioning mechanism can move the first heating unit 15 in the vertical direction orthogonal to the horizontal plane 13. Based on such vertical movement, the first heating unit 15 is positioned in the vertical direction with respect to the support base 12. In realizing the vertical movement, the first heating unit 15 is guided by, for example, a rail extending in the vertical direction. For example, a ball screw mechanism is connected to the first heating unit 15. In the ball screw mechanism, for example, the movement amount of the first heating unit 15 is determined based on the control of the rotation amount of the screw shaft.

  The first heating unit 15 includes a follower mechanism 17. The profile mechanism 17 includes, for example, a rectangular parallelepiped body 18. In the main body, long support plates 19 and 19 extending along the horizontal plane 13 are defined. The support plates 19 and 19 extend in parallel to each other. The support plates 19, 19 receive the projection 21 a of the heating block 21. A connecting wall 22 is integrated with the support plate 19. Thus, the heating block 21 is suspended and supported by the follower mechanism 17. The heating block 21 is detachably supported by the follower mechanism 17 based on, for example, sliding movement. The heating block 21 is replaced with various sizes according to the electronic component to be repaired.

  The heating block 21 includes a rectangular parallelepiped heater 23, for example. The heater 23 is made of a highly heat conductive metal material such as copper. A heating wire (not shown) is embedded in the heater 23. The heating wire generates heat energy based on the current supplied to the heating wire. The heat energy causes the heater 23 to generate heat. The upper surface of the heating head 24 is overlaid on the lower surface of the heater 23. The heating head 24 is made of a highly heat conductive metal material such as copper. In the heating head 24, for example, chromium plating is performed on copper. The lower surface of the heating head 24, that is, the contact surface 24a is formed as a flat surface. The contact surface 24a extends along a horizontal plane. The contour of the contact surface 24a corresponds to the contour of a specific electronic component.

  For example, a rectangular parallelepiped space 25 is defined at the lower end of the heating head 24. The rectangular parallelepiped space 25 is opened downward. For example, a suction path 26 formed in the heating head 24 is connected to the rectangular parallelepiped space 25. For example, a vacuum pump (not shown) is connected to the suction path 26. A negative pressure is generated in the suction passage 26, ie, the rectangular parallelepiped space 25 by the action of the vacuum pump. Due to the negative pressure, a suction force is generated in the heating head 24, that is, the heating block 21. In this way, the heating head 24, that is, the heating block 21, the vacuum pump, and the suction path 26 simultaneously function as the suction mechanism of the present invention.

  A plurality of stoppers 27 are attached to the side surface of the heating head 24. The stopper 27 is formed from a plate piece, for example. The stopper 27 defines the tip closer to the support base 12 than the contact surface 24 a of the heating head 24. The distance from the contact surface 24a of the heating head 24 to the tip of each stopper 27 is set uniformly. Referring also to FIG. 2, each stopper 27 is disposed at the four corners of the heating head 24. The stopper 27 has an L-shaped cross section along the horizontal plane. The stopper 27 is attached to the side surface of the heating head 24 with, for example, a screw (not shown). Here, the stopper 27 may be disposed at least at the three corners of the heating head 24, for example.

  A pressing mechanism 28 is incorporated in the main body 18 of the profile mechanism 17. The pressing mechanism 28 includes a pin 29 that is supported by the main body 18 so as to freely advance and retract in a vertical direction perpendicular to the horizontal plane 13. The pin 29 tapers toward the lower end. The lower end of the pin 29 is received on the upper surface of the heating block 21. An elastic body, that is, a coil spring 31 is connected to the pin 29. The coil spring 31 is sandwiched between the flange 32 formed on the pin 29 and the upper end of the main body 18. Thus, an elastic restoring force is accumulated in the coil spring 31. Based on the elastic restoring force of the coil spring 31, the pin 29 applies a predetermined pressing force to the upper surface of the heating block 21 in the vertical direction. Thus, the protrusion 21 a of the heating block 21 is pressed against the support plate 19.

  A displacement sensor 33 is further incorporated in the body 18 of the profile mechanism 17. The displacement sensor 33 is supported by the main body 18 so as to be movable back and forth in a vertical direction orthogonal to the horizontal plane 13. The lower end of the displacement sensor 33 protrudes from the lower end of the main body 18. Thus, the lower end of the displacement sensor 33 is received on the upper surface of the heating block 21. As is clear from FIG. 1, the heating block 21 can move forward and backward relative to the main body 18 in the vertical direction. The displacement sensor 33 is displaced according to the forward / backward movement of the heating block 21. Thus, the displacement sensor 33 can detect the displacement of the heating block 21.

  On the other hand, the second heating unit 16 includes a back heater 34. The outlet 34 a of the back heater 34 faces the window hole 14 from below the support 12. The spout 34 a blows hot air toward the window hole 14. For example, a heating wire or a fan is incorporated in the back heater 34. The outside air is introduced into the back heater 34 by the function of the fan. During the introduction, the outside air is heated by heating wires. Similarly, the second heating unit 16 includes, for example, a pair of auxiliary heaters 35 and 35 that face the window hole 14. The auxiliary heater 35 is disposed on both sides of the back heater 34, for example. For example, an infrared heater is used as the auxiliary heater 35.

  As shown in FIG. 3, the electronic component repair device 11 includes a control circuit 41. The control circuit 41 includes a positioning mechanism 42 connected to the first heating unit 15, a heater 23, a vacuum pump 43 connected to the suction path 26, a displacement sensor 33, a back heater 34 and an auxiliary heater 35 of the second heating unit 16. Connected to. The control circuit 41 controls the operation of the positioning mechanism 42. Based on the supply of the control signal, the positioning mechanism 42 positions the first heating unit 15 at a predetermined position.

  The control circuit 41 controls the operation of the vacuum pump 43. For example, an electromagnetic valve is incorporated in the vacuum pump 43. The control circuit 41 controls the opening and closing of the solenoid valve according to the supply of the control signal. The generation of the negative pressure in the suction path 26, that is, the rectangular parallelepiped space 25, is controlled according to the opening and closing of the electromagnetic valve. Similarly, the control circuit 41 controls the operations of the heater 23, the back heater 34 and the auxiliary heater 35. On / off of the heater 23, the back heater 34, and the auxiliary heater 35 is controlled according to the supply of the control signal.

  The displacement sensor 33 outputs detection of the displacement of the heating block 21 to the control circuit 41. The control circuit 41 can reset the displacement amount of the displacement sensor 33 to zero based on the output from the displacement sensor 33. On the other hand, a timer 44 is connected to the control circuit 41. Based on the control of the control circuit 41, the timer 44 can measure a predetermined time. The timer 44 outputs the passage of a predetermined time to the control circuit 41. Such an operation of the control circuit 41 is executed based on, for example, a predetermined software program.

  Now, for example, as shown in FIG. 4, it is assumed that the electronic component 46 is removed from the printed circuit board unit 45 mounted on both sides. In the printed circuit board unit 45, the electronic component 46 is mounted on the surface of the printed circuit board 47. A bonding material, that is, a solder bump 48 is used for mounting. The solder bumps 48 constitute a ball grid array (BGA). The solder bumps 48 are formed from tin, silver and copper solder, for example. The melting point of the solder bump 48 is set to 217 ° C. The electronic component 46 includes a printed wiring board 49 and an LSI (Large Scale Integrated Circuit) chip package 51 mounted on the printed wiring board 49.

  Another electronic component 52 is mounted around the electronic component 46 on the surface of the printed circuit board 47. The electronic component 52 is disposed adjacent to the electronic component 46. Similarly, an electronic component 53 is mounted on the back surface of the printed circuit board 47. Such a back-side electronic component 53 is disposed, for example, in a projected image area of the front-side electronic component 46. Such electronic components 52 and 53 include electronic components such as a chip capacitor and a chip transistor. When the printed circuit board unit 45 is disposed on the support base 12, the electronic component 53 is disposed in the window hole 14 on the back surface of the printed circuit board 47.

  The printed circuit board unit 45 is fixed to the support base 12. First, the control circuit 41 instructs the heater 23, the auxiliary heater 35, and the back heater 34 to operate in step S1 of FIG. The heater 23, auxiliary heater 35, and back heater 34 operate. Subsequently, the control circuit 41 supplies a control signal to the positioning mechanism 42 in step S2. The first heating unit 15 approaches the printed circuit board unit 45 from above. At this time, the protrusion 21 a of the heating block 21 is pressed against the support plate 19 based on the weight of the heating block 21 and the pressing force of the pin 29 of the pressing mechanism 28. The heating block 21 is disposed at the lowest position. The contour of the contact surface 24 a of the heating head 24 matches the contour of the printed wiring board 49.

  As shown in FIG. 6, the heating head 24 contacts the printed wiring board 49 at the contact surface 24a. The vertical movement of the heating block 21 stops. The LSI chip package 51 is disposed in the rectangular space 25 of the heating head 24. Referring also to FIG. 7, the stopper 27 is disposed along the four corners of the printed wiring board 49. A positional deviation between the stopper 27, that is, the heating head 24 and the printed wiring board 49 is avoided. Thus, the contact surface 24 a of the heating head 24 is received on the surface of the printed wiring board 49. As apparent from FIG. 6, the tip of the stopper 27 is defined at a position closer to the surface of the printed wiring board 49 than the contact surface 24 a of the heating head 24. Here, a predetermined distance is secured between the tip of the stopper 27 and the surface of the printed circuit board 47.

  On the other hand, the tracing mechanism 17 stops after the vertical movement of the heating block 21 stops. As a result, the heating block 21 is displaced relative to the follower mechanism 17 upward from the lowest position. Thus, a predetermined gap is formed between the protrusion 21 a of the heating block 21 and the support plate 19. As a result, the posture change of the heating block 21 is allowed. At this time, the heating block 21 is pressed against the surface of the printed wiring board 49 with a predetermined pressing force by the action of the coil spring 31. For example, even if the surface of the printed wiring board 49 is defined to be inclined with respect to the horizontal plane, the contact surface 24 a is in close contact with the surface of the printed wiring board 49 based on the posture change of the heating block 21. Here, the distance between the protrusion 21 a of the heating block 21 and the support plate 19 is set larger than the distance between the tip of the stopper 27 and the surface of the printed circuit board 47.

  In step S <b> 3, the control circuit 41 receives an output for detecting the relative displacement of the heating block 21 with respect to the main body 18 from the displacement sensor 33. In step S4, the control circuit 41 resets the displacement amount of the displacement sensor 33 to zero. In step S5, the control circuit 41 monitors the output of the displacement sensor 33. Thermal energy is transmitted to the heating head 24 based on the heat generated by the heater 23. Thermal energy is transmitted from the heating head 24 to the solder bumps 48 via the printed wiring board 49. The temperature of the solder bump 48 rises. Here, the solder bump 48 is heated to a temperature of about 230 ° C., for example.

  At this time, the back heater 34 heats the printed circuit board 47 within the projected image area of the contour of the electronic component 46. The back heater 34 ejects hot air of about 180 ° C. to 220 ° C., for example, from the ejection port 34a. In particular, the temperature of the hot air is preferably set in the range of 200 ° C to 220 ° C. Hot air is blown to the back surface of the printed circuit board 47. The amount of hot air is set to about 3 to 20 ml / min, for example. Thus, the temperature of the printed circuit board 47 is controlled to a temperature slightly lower than the melting point of the solder bumps 48, for example. As a result, all the solder bumps 48 are heated uniformly. At the same time, an excessive temperature rise of the electronic component 53 on the back side of the printed circuit board 47 is avoided. Damage to the electronic component 53 is avoided.

  On the other hand, the auxiliary heater 35 heats the printed circuit board 47 outside the projected image area of the contour of the electronic component 46. The auxiliary heater 35 heats the temperature of the printed circuit board 47 to about 150 ° C. with thermal energy radiated based on infrared rays. Thus, in the printed circuit board 47, the temperature difference is reduced as much as possible between the inside and outside of the projected image area of the contour of the electronic component 46. As a result, the printed circuit board 47 can be heated as uniformly as possible as a whole. Local heating on the printed circuit board 47 is avoided. Therefore, a difference in thermal expansion based on an excessive temperature difference is prevented. Warping of the printed circuit board 47 is avoided.

  When the solder bumps 48 start to melt, the printed wiring board 49, that is, the heating block 21 starts to be displaced toward the printed circuit board 47 based on the pressing force of the pins 29. The displacement sensor 33 detects the relative displacement of the heating block 21 with respect to the follower mechanism 17. The displacement sensor 33 outputs detection of the displacement of the heating block 21 to the control circuit 41. At this time, as shown in FIG. 8, the stopper 27 is received on the surface of the printed circuit board 47 based on the relative displacement of the heating block 21. Thus, the displacement of the heating block 21 is stopped. Excessive crushing of the solder bumps 48 is avoided. The short circuit between the solder bumps 48 and the leakage of the solder bumps 48 from the outline of the electronic component 46 are avoided.

  In step S5, when the control circuit 41 detects a displacement based on the output from the displacement sensor 33, the control circuit 41 instructs the operation of the timer 44 in step S6. The timer 44 starts measuring a predetermined time. For example, 10 seconds is set. Here, for example, 10 seconds is set as the time for melting all the solder bumps 48. The control circuit 41 monitors the measurement for 10 seconds in step S7. When 10 seconds have elapsed from the start of measurement, the control circuit 41 opens the electromagnetic valve of the vacuum pump 43 in step S8. As a result, a negative pressure is generated in the rectangular parallelepiped space 25. A suction force acts on the electronic component 46. The printed wiring board 49 is attracted to the contact surface 24 a of the heating head 24. In this way, the electronic component 46 is attracted to the heating block 21.

  In step S9, the positioning mechanism 42 raises the first heating unit 15. The heating block 21 is suspended and supported by the follower mechanism 17. As shown in FIG. 9, the electronic component 46 is pulled away from the printed circuit board 47. The melted solder bump 48 is divided. In this way, the electronic component 46 is removed from the printed circuit board 47. Thereafter, the electronic component 46 is removed from the first heating unit 15. All the solder bumps 48 remaining on the printed circuit board 47 on the support base 12 are removed. Thereafter, as shown in FIG. 10, a new electronic component 46 is arranged on the printed circuit board 47. Solder bumps 48 are sandwiched between the electronic component 46 and the printed circuit board 47 in advance. At this time, a solder paste may be applied to the solder bumps 48.

  The control circuit 41 instructs the heater 23, the auxiliary heater 35, and the back heater 34 to operate as described above. Subsequently, the control circuit 41 supplies a control signal to the positioning mechanism 42. The first heating unit 15 approaches the printed circuit board unit 45 from above. At this time, the lower surface of the heating head 24 contacts the printed wiring board 49 as described above. The vertical movement of the heating block 21 stops. On the other hand, the tracing mechanism 17 stops after the vertical movement of the heating block 21 stops. At this time, the heating block 21 is pressed against the surface of the printed wiring board 49 with a predetermined pressing force by the action of the coil spring 31. For example, even if the surface of the printed wiring board 49 is defined to be inclined with respect to the horizontal plane, the contact surface 24 a is in close contact with the surface of the printed wiring board 49 based on the posture change of the heating block 21. As a result, the contact surface 24 a of the heating head 24 is securely adhered to the surface of the printed wiring board 49.

  The control circuit 41 resets the displacement amount of the displacement sensor 33 to zero based on the output from the displacement sensor 33. The control circuit 41 monitors the displacement of the displacement sensor 33. Thermal energy is transmitted to the heating head 24 based on the heat generated by the heater 23. Thus, the heating head 24 heats the solder bumps 48 via the printed wiring board 49. The temperature of the solder bump 48 rises to a temperature equal to or higher than the melting point of the solder bump 48. When the solder bumps 48 start to melt, the printed wiring board 49, that is, the heating block 21 starts to be displaced toward the printed circuit board 47 based on the pressing force from the pins 29. The displacement sensor 33 detects the displacement of the heating block 21. Based on the output from the displacement sensor 33, the control circuit 41 detects the displacement.

  The control circuit 41 instructs the timer 44 to operate. The timer 44 starts measurement for 10 seconds. The control circuit 41 monitors the measurement for 10 seconds. When 10 seconds elapse, the positioning mechanism 42 raises the first heating unit 15. At this time, no negative pressure is generated in the suction path 26, that is, the rectangular parallelepiped space 25. The electronic component 46 is not attracted to the heating block 21. Thus, the first heating unit 15 is moved away from the printed circuit board 47. Thereafter, the solder bump 48 melted on the printed circuit board 47 is cooled to room temperature, for example. The solder bump 48 is solidified. As a result, the new electronic component 46 is mounted on the surface of the printed circuit board 47. Thus, the repair of the electronic component 46 is completed.

  In the electronic component repair apparatus 11 as described above, heat energy is selectively transmitted to the electronic component 46 on the printed circuit board 47 by the action of the heating block 21. The diffusion of thermal energy around the electronic component 46 is avoided. As a result, the other electronic components 52 are sufficiently protected from thermal energy around the electronic component 46. The mounting density of the electronic components 46 and the surrounding electronic components 52 on the printed circuit board 47 is increased. Moreover, a stopper 27 is attached to the heating block 21. The displacement of the electronic component 46 toward the printed circuit board 47 based on the melting of the solder bump 48 is regulated by the stopper 27. A gap is reliably ensured between the electronic component 46 and the printed circuit board 47. Short circuit between the solder bumps 48 and leakage of the solder bumps 48 are avoided.

  Generally, the function of the printed circuit board unit 45 is inspected prior to shipment. For example, when a defect is found in the electronic component 46, the electronic component 46 is replaced. The electronic component 46 is removed from the printed circuit board 47 for replacement. At this time, when the electronic component 46 is heated, the thermal energy is transmitted to the electronic component 53 on the back side. The electronic component 53 is exposed to high heat exceeding the heat resistance temperature. The electronic component 53 is destroyed on the back side of the printed circuit board 47. According to the electronic component repair method described above, an excessive temperature rise of the electronic component 53 is avoided by the action of the back heater 34. The destruction of the electronic component 53 is prevented. In addition, the warp of the printed circuit board 47 is avoided by the function of the auxiliary heater 35.

  The inventor verified the effect of the present invention. For verification, a printed circuit board unit 61 was prepared as shown in FIG. The printed circuit board unit 61 includes a printed circuit board 62. An electronic component 63 to be repaired and an electronic component 64 to be non-repaired are mounted on the surface of the printed circuit board 62. The electronic components 63 and 64 include a printed wiring board 65 and an LSI chip package 66, respectively. The printed wiring board 65 is mounted on the surface of the printed circuit board 62 based on a ball grid array (BGA) of solder bumps. For example, tin, silver and copper solder having a melting point of 217 ° C. is used for the solder bump.

  At this time, the printed circuit board unit 61 was mounted on the electronic component repair device according to the specific example and the comparative example. Only the electronic component 63 was removed from the printed circuit board 62 in the electronic component repair device according to the specific example and the comparative example. As a specific example, the above-described electronic component repair device 11 according to the present invention was used. The comparative example used a conventional electronic component repair device. In the comparative example, instead of the heating block 21, a heater that blows hot hot air toward the electronic component 63 was used. The temperature was measured at eight locations on the printed circuit board unit 61 when the electronic component 63 was removed.

  Here, position (1) center of BGA under electronic component 63, position (2) outer periphery of BGA under electronic component 63, position (3) center of printed wiring board 65 of electronic component 63, position (4) printed circuit board 1 mm from the contour of the electronic component 63 on the position 62, position (5) 3 mm from the contour of the electronic component 63 on the printed circuit board 62, position (6) outer periphery of the BGA under the electronic component 64, position (7) print Temperature was measured at the center of the projected image area of the contour of the electronic component 63 on the back surface of the substrate 62 and at eight positions on the outer periphery of the position (8) of the projected image area. The upper limit value of temperature and the lower limit value of temperature were set at each position (1) to (8). At positions (1) and (2), a lower limit of 230 ° C. was set. At position (3), an upper limit of 245 ° C. was set. At positions (4) to (8), an upper limit value of 215 ° C. was set.

  As a result, as shown in FIG. 12, in the specific example, the upper limit value and the lower limit value of the temperature were within the allowable range at all the positions (1) to (8). On the other hand, in the comparative example, temperatures out of the allowable range were measured at the positions (4), (5), and (7). At any position, the temperature exceeded the melting point of the solder bump. As a result, in the specific example, that is, the present invention, it was confirmed that the heat block 21 prevents the thermal energy from being diffused around the electronic component 63 and the back surface of the printed circuit board 62. On the other hand, in the comparative example, it was confirmed that thermal energy diffuses around the electronic component 63 and the back surface of the printed circuit board 62 based on high-temperature hot air. It has been found that there is a possibility of melting of the solder in the electronic components around the electronic component 63 and the electronic components on the back surface of the printed circuit board 62. Such melting causes problems such as dropping of electronic components.

  DESCRIPTION OF SYMBOLS 11 Electronic component repair apparatus, 18 Main body, 21 Heating block, 24a Lower surface (contact surface), 27 Stopper, 28 Pressing mechanism, 33 Displacement sensor, 34 Auxiliary heater, 35 Back side heater, 46 Electronic component, 47 Printed circuit board, 48 Bonding material (Solder bump).

Claims (10)

A heating block that is in contact with the lower surface of the surface of the electronic component to be bonded to the surface of the printed circuit board with the bonding material and heats the bonding material based on heat generation;
An electronic component repair device comprising: a stopper connected to the heating block and defining a tip at a position closer to the surface of the printed circuit board than a lower surface of the heating block. The electronic component repair device according to claim 1,
A body supporting the heating block;
An electronic component repair apparatus comprising: a pressing mechanism that is incorporated in the main body and presses the heating block toward the electronic component.   The electronic component repair apparatus according to claim 1, further comprising an auxiliary heater that faces the printed board at least around the electronic component and heats the printed board.   4. The electronic component repair device according to claim 3, further comprising a back-side heater that heats the printed circuit board in a projected image area of the electronic component that faces the back surface of the printed circuit board and is projected onto the printed circuit board. An electronic component repair device.   5. The electronic component repair device according to claim 1, further comprising a displacement sensor that detects a displacement of the heating block in a vertical direction perpendicular to the surface of the printed circuit board. 6. Repair device.   The electronic component repair apparatus according to claim 1, further comprising a suction mechanism that sucks the electronic component onto the heating block. A heating block is brought into contact with the surface of an electronic component to be bonded to the surface of the printed circuit board with a bonding material sandwiched between the surface of the printed circuit board, and a tip of a stopper connected to the heating block is moved from the heating block to the surface. The process of bringing it closer to the surface of the printed circuit board;
Heating the bonding material based on the heat generated by the heating block to melt the bonding material;
And a step of bringing a tip of the stopper into contact with the surface of the printed circuit board when the bonding material is melted to secure a predetermined gap between the surface of the printed circuit board and the electronic component. Repair method.   8. The electronic component repair method according to claim 7, further comprising a step of heating the printed circuit board around the electronic component when the bonding material is heated.   9. The electronic component repair method according to claim 7, further comprising a step of heating the printed circuit board from a back surface of the printed circuit board in a projected image area of the electronic component projected onto the printed circuit board. Electronic component repair method.   10. The electronic component repair method according to claim 7, wherein when the bonding material is heated, a displacement of the heating block is detected in a vertical direction orthogonal to the surface of the printed circuit board. An electronic component repair method, further comprising a step of detecting melting.

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