JP2007134406A - Printing solder inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To inspect a printing mode of printed cream solder before heating and to perform correction work in the position in a rejected case. <P>SOLUTION: A printing solder inspection apparatus is provided with an inspecting means having an inspection head 20 which is arranged to freely move an upper part of a substrate 12 and detects a position and height of cream solder 13 printed on the substrate 12, a printed solder removing means 24 which is integrally disposed with the inspection head 20, and a cream solder supplementing means 26 which is integrally arranged with the inspection head 20. Cream solder 13 before heating printed on the substrate 12 is inspected and it can be corrected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a printed solder inspection apparatus in which printed solder is inspected, and when a correction is necessary, a defective portion can be directly corrected.

  One method of mounting various electronic components on a circuit board and making electrical connection with solder is a solder paste in a predetermined pattern at the electrical connection position of the board by a printing method (low temperature fusion solder to paste flux) A composition in which particles are mixed and dispersed at a predetermined blending ratio) is formed and disposed, and after connecting terminals of various electronic components are disposed at the disposed locations, the cream solder is heated and melted, whereby the circuit board of the electronic component is formed. There is a method of making an electrical connection simultaneously with fixing to the top.

  In this method, an inspection process is provided between the cream solder printing process and the component mounting process, and the printing position of the solder, the volume of the printed solder, the quality of the height, the bridge (adjacent independent solders are joined together) In other words, it is inspected whether or not there is a printing defect such as generation, and only acceptable products are sent to the component mounting process which is the next process.

By the way, as this kind of solder inspection system, conventionally, a solder inspection correction system shown in the following patent document is known. In this system, out of the boards inspected by the inspection device, the board determined to be defective in solder is sent to the automatic correction device or correction table, corrected automatically or manually at each position, then returned to the inspection device and re-inspected. Is going.
Japanese Unexamined Patent Publication No. 6-1523123

  However, in the inspection system, since inspection and correction are performed at different locations, it takes time to transport the substrate for each inspection correction, and the reason why the reproducibility of the correction position when returning to the inspection position again decreases. It becomes.

  Also, in this inspection system, the position of the solder after mounting the component is already determined, and since the solder is hardened, it cannot be corrected unless the solder is heated and remelted. There was also a risk of thermal effects on

  The present invention solves the above-mentioned problems, and its object is to sequentially perform pass / fail judgment of pre-printed cream solder, and in the case of failure, the printed solder can be directly repaired. An inspection apparatus is provided.

  In order to achieve the above object, the invention of claim 1 is such that the printed solder inspection apparatus 1 for inspecting and correcting the solder 13 printed in advance on the substrate 12 is movable above the substrate 12. And an inspection means provided with an inspection head 20 for detecting the position and height of the solder 13 printed on the substrate 12 and removal of the solder provided so as to be movable above the substrate 12 Means 24 and solder replenishing means 26 provided so as to be movable above the substrate 12 are provided.

  The invention of claim 2 is characterized in that the inspection and correction of the solder 13 are continuously performed for each printed portion of the solder 13.

  The invention of claim 3 is characterized in that re-inspection is continuously performed for each portion where the solder 13 is corrected.

  According to a fourth aspect of the present invention, there is provided an imaging unit for enlarging and imaging the solder 13, and a manual mode in which the necessity of correction is visually determined from an image of the solder 13 by the imaging unit and a correction instruction is issued as necessary. And a control means capable of arbitrarily selecting an automatic mode for automatically correcting when the height of the solder detected by the inspection head deviates by a predetermined amount from a predetermined reference value. It is a feature.

  According to the first aspect of the present invention, it is possible to prevent the troubles caused by the error of the reference position deviation at the time of re-inspection and the trouble of transferring the substrate for each inspection-correction as in the prior art. Further, in the present invention, since the solder is inspected / corrected before the component is mounted before being heated, there is no thermal influence on the component due to heat removal or the like.

  According to the invention of claim 2, the solder position determined to be unacceptable can be repaired immediately.

  According to the invention of claim 3, since the pass / fail determination in the repaired state can be performed, a more reliable inspection result can be obtained.

  According to the invention of claim 4, when the boundary of the pass / fail determination is unclear, the pass / fail determination can be made surely by the visual confirmation of a skilled worker.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the drawings. First, FIG. 1A to FIG. 1D show a problem of printing before correction and adhesion to the substrate after correction in cream solder before heating (hereinafter simply referred to as “solder”) printed on the substrate. An embodiment is shown.

  In FIG. 1A, when the solder printing center deviates from the setting position (intersection position of the x-axis and y-axis), the printing center is corrected to the setting position. When the amount less than the set amount is increased up to the set amount, (c) Contrary to the above, when the amount of printed solder is reduced to the set amount, (d) FIG. 4 shows a case where adjacent solders are adhered and connected to each other by a bridging phenomenon at a place where a solder printing position is involved. In the present invention, the above-described inspection for a printing defect portion before heating and correction based on the result are performed.

  FIG. 2 shows a printed solder inspection apparatus according to the present embodiment, and the relationship between the printed solder inspection apparatus and peripheral devices. In the figure, a printing machine 2 is provided in the front stage of the printed solder inspection apparatus 1, and after the solder is printed in a predetermined pattern on the surface of the board described later by the printing machine 2, the printed board is inspected via the conveyor 3. It is carried into the apparatus 1 and the printing state is inspected here, and if there is a defective part, it is corrected here. The board after the inspection and correction is introduced into the subsequent chip mounter 5 via the conveyor 4, where mounting of various electronic components, fixing by heating and melting of solder, and electrical connection are performed simultaneously.

  Although not shown, the inspection apparatus 1 is supported by an xy moving table that moves in the x-axis and y-axis directions at a predetermined height above the substrate carried into the inspection apparatus 1 by the conveyor 3. An inspection head (to be described later) for detecting the printing position and shape of the solder while sequentially moving in the xy direction from the origin position of the substrate as a base point, and a solder removal device (solder removal means) and a replenishment device (solder replenishment means) are provided. Yes.

  The printed solder inspection apparatus 1 also includes a control unit (control means) (not shown) that performs operations such as loading and unloading of the substrate, movement control of the inspection head, and the like. The print data representing the solder print pattern printed in step 1 is transferred, the print data is compared with the measurement data detected by the inspection head, and pass / fail judgment is made based on the comparison result, and the inspection apparatus 1 is provided. The contents can be displayed on the displayed display 6. Further, a monitor 7 for displaying a correction-necessary portion imaged by an imaging means such as a CCD camera provided in the inspection head is arranged beside the display 6. Further, reference numeral 8 in the figure is an indicator lamp on the printed solder inspection apparatus 1 for displaying the progress of the inspection-correction step by step.

  Note that FIG. 1 shows a case where the display position of the bridge phenomenon shown in FIG. 1D is graphically displayed on the display 6 and an enlarged image thereof is displayed on the monitor 7.

  FIG. 3 shows a first embodiment of the above-described inspection head, and a removing device and a replenishing device arranged integrally therewith. In the figure, a metal conductive layer 12 surrounded by an insulating layer 11 is formed on the surface of the substrate 10 described above, and a solder layer 13 is printed on the surface of the metal conductive layer 12 at a predetermined height by printing in the previous step. Is formed. In the present embodiment, the case where the height of the solder layer 13 is smaller than a set value will be described as an example.

  In the figure, reference numeral 20 denotes an inspection head which can move in the xy direction while maintaining a predetermined height on the substrate 10. The solder is removed to the side of the inspection head 20 via a horizontal support arm 22. A removing device 24 as a means and a replenishing device 26 as a solder replenishing means are arranged in parallel so that their tips can be moved up and down toward the substrate 10 side.

  The inspection head 20 incorporates measurement means such as laser distance measurement means and a CCD camera for enlarging the inspection position, and as shown in FIG. 3A, the reference of the solder layer 13 is directly above the inspection position. The height from the surface (conductive layer 12) is measured, and the data is sent to the control unit.

  The removal device 24 has a tapered shape with a tip tapered, and a heater 28 is provided on the outer periphery of the tapered tip, and the upper portion is connected to a suction pump (not shown) through a suction tube 30.

  The replenishing device 26 has a tapered shape with a tapered tip as described above, and is connected to a top portion of the refilling device 26 via a supply tube 32 to a solder dispensing pump or the like (not shown).

  In the above, when the measurement result of the inspection head 20 shown in FIG. 3A does not satisfy the set height indicated by the imaginary line and is determined to be rejected, as shown in FIG. The removing device 24 is disposed immediately above the inspection position, and is lowered by an elevating mechanism (not shown) so that the tip of the removing device 24 sticks into the solder layer 13. Next, the solder layer 13 is heated by the heater 28 and melted, and is sucked and removed through the removing device 24 by driving the suction pump.

  After that, as shown in FIG. 3 (c), the removal device 24 is positioned at the upper standby position, and further moved laterally so that the replenishment device 26 is disposed immediately above the inspection position, and is disposed at an appropriate height by lowering. By supplying the solder through the pump, the solder layer 13 is raised again on the conductive layer 12 as shown.

  At this time, the control unit determines the solder discharge amount at the position with reference to the print data, and drives the pump accordingly. Therefore, the amount and height of the solder layer 13 after replenishment are substantially the same as the set values.

  FIG. 4 shows a series of procedures from loading to unloading of the board 10 into the printed solder inspection apparatus 1 and is controlled by the control unit. First, the shutter of the apparatus 1 is opened, and the board 10 on which the solder is printed is carried through the conveyor. The board 10 hits the positioning stopper and is fixed to the position by the clamper (steps ST1 and ST2).

  After the substrate 1 is fixed, measurement by the inspection head 20 is started. The inspection head 20 detects the solder position and its height while sequentially moving in the xy-axis direction with the reference position on the substrate 10 as the origin, The data is sent to the control unit. In the control unit, the measurement data and the print data are collated to make a pass / fail decision (step ST3).

  As an inspection / correction procedure, all solder positions are successively detected to identify a reject position, and thereafter, a correction operation is continuously executed for each fail position.

  Therefore, after scanning the inspection head 20 to the end point position, the determination result is displayed on the display 6 and, at the same time, if all the inspection points are determined to pass, a measurement end process is performed, and the clamp on the substrate 10 is released. Then, the entire process is terminated by the discharging operation from the inside of the apparatus 1 (steps ST4, 5, 13-15).

  On the other hand, when it is determined that there is a rejected part (YES in step ST5), it is determined whether or not the part needs to be corrected. The determination in this case is performed in an automatic mode in which the control unit automatically determines from the difference between the set value and the measured value, and the correction described later is also automatically performed.

  However, it is also possible to make a manual mode in which the determination is made by visual observation of the monitoring person via the monitor 7 and the correction scanning is thereby performed. In this case, it is possible to make a manual determination by providing a button for the monitor to select YES or NO on the panel of the apparatus 1. If it is determined from this determination result that correction is not necessary for all locations (NO in step ST6), the process jumps to steps ST13 to ST15 in the same manner as described above, and all the processes are terminated.

  On the other hand, if it is determined that correction is necessary (YES in step ST6), the inspection head 20 moves to the rejected portion, and the solder is removed as shown in FIGS. 3 (b) and 3 (c). Then, after the corrected shape is displayed on the monitor 7, the inspection head 20 performs the measurement operation again, and the control unit receives the data and displays the result on the display 6 (steps ST7, 8, 9). , 10).

  At the same time, the control unit compares the measured data with the print data, and if it is rejected (NO in step ST11), the pass / fail determination is made again in step ST6. , Replenishment and re-inspection.

  If it is acceptable (YES in step ST11), the inspection head 20 moves to the next failure position, and a pass / fail determination, correction, and re-inspection are performed in the same procedure as described above.

  In this way, after correction of all rejected positions and completion of re-examination (YES in step ST12), the process jumps to steps ST13 to ST15 and completes all processes.

  In the above description, all the printed portions of one substrate are inspected in series, and then the determination is made and the correction is made. However, the determination is made every time each printed portion is inspected, and the necessary correction and re-use are immediately performed. It is also possible to take a procedure of inspecting, and then moving to the next printing place and inspecting, correcting, and reinspecting again.

  FIG. 5 shows a second embodiment of the inspection head portion. In the figure, substantially the same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted, and only different parts are described using different reference numerals.

  In FIG. 5, a removal and replenishment device 40, which serves as both solder removal means and replenishment means, is arranged in parallel on the side of the inspection head 20 via a support arm 22. This removal and replenishment device 40 has a dropper shape with a tapered tip as in the above-described embodiment, and is provided with a heater 28 on the outer periphery of the tip, and a suction tube 30 and a supply tube 32 are connected in a bifurcated shape on the top. The end side is connected to a suction pump and a solder discharge pump.

  In this configuration, as shown in FIG. 5 (a), when the result of the measurement of the inspection head 20 does not satisfy the reference height and fails, it is removed by lateral movement as shown in (b). The replenishing device 40 is disposed immediately above the inspection position, and is lowered by an elevating mechanism (not shown) so that the tip of the replenishing device pierces into the solder layer 13. Next, while being heated by the heater 28, the solder layer 13 is melted and sucked and removed through the removing device 24 and the suction tube by driving the suction pump.

  Thereafter, as shown in FIG. 5 (c), the removal and replenishment device 40 is lowered again at that position, and the solder is supplied through the pump while being pulled up immediately after its tip contacts the conductive layer 12, so that Thus, a prescribed amount of solder can be supplied, and the solder layer 13 can be raised on the conductive layer 12 at a predetermined height.

  In the present embodiment, the lateral movement for each correction operation may be performed only once, so that the control is simple, and the configuration is also simple because both the suction and the replenishment are used.

  In this embodiment, since the solder removing means and the replenishing means are used as a single device as the removal replenishing device 40, the operation of continuously removing and replenishing each solder layer 13 is not repeated. Instead, it is more efficient to remove all the target solder layers 13 on the substrate first and then replenish them with a series of operations.

  FIG. 6 shows a third embodiment of the inspection head portion. The present embodiment is the same as the first embodiment except that a laser head 50 as a solder removing means is provided instead of the removal device 24 by suction of the first embodiment.

  In this configuration, as shown in FIG. 6A, when the measurement result of the inspection head 20 does not satisfy the set height and fails, the laser head is moved laterally as shown in FIG. By placing 50 directly above the inspection position and irradiating the solder layer 13 with a laser, the solder layer 13 is evaporated by heating and disappears from the conductive layer 12 shape. Thereafter, as shown in (c), the replenishing device 26 is disposed immediately above the inspection position, and a predetermined amount of solder is supplied through the pump while being pulled up immediately after the tip contacts the conductive layer 12 by lowering. Thus, as shown in the figure, a prescribed amount of solder can be supplied, and the solder layer 13 can be raised on the conductive layer 12 at a predetermined height.

  In the present embodiment, unspecified solder can be removed instantaneously, so that the removal processing time is shortened and the entire process time is shortened. In the above description, the inspection head, the removing device, and the replenishing device are integrated. However, the present invention is not limited to this, and each may have a structure having X and Y axis moving means. In this way, it is possible to make a pass / fail judgment while the inspection head is measuring, and to make correction immediately if correction is necessary.

  As another solder removal means, as shown in FIG. 7A, a removal arm 60 is used, and a knife edge-shaped removal plate portion 60a provided at the tip of the removal arm 60 is applied to the solder layer 13 by a swing operation, and solder is applied. It is good also as a structure scraped off and remove | eliminating from on the conductive layer 12, and as shown in FIG.7 (b), the metal heating rod 70 with solder adsorption property is pressed against the solder layer 13, this is melted, and a heating rod A means for adsorbing and removing the outer periphery of the tip of the 70 by surface tension can also be used.

(A)-(d) is explanatory drawing which shows the printing form with respect to the board | substrate before and after correction of a solder. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an external appearance explanatory view showing an inspection apparatus according to the present invention and the relationship between the inspection apparatus and peripheral devices. (A)-(c) is operation | movement explanatory drawing of a test | inspection head, the removal apparatus attached to this, and a replenishment apparatus. It is a flowchart which shows a series of procedures from carrying in of a printed circuit board in an apparatus to carrying out. (A)-(c) is operation | movement explanatory drawing of the inspection head by 2nd Embodiment, and the removal replenishment apparatus attached to this. (A)-(c) is operation | movement explanatory drawing of the test | inspection head by 3rd Embodiment, the removal apparatus attached to this, and a replenishment apparatus. (A), (b) is explanatory drawing which shows the further another example of a removal means.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Print solder inspection apparatus 7 Monitor 10 Board | substrate 13 Solder layer 20 Inspection head 24 Removal apparatus as removal means 50 Laser head as removal means 60 Removal arm as removal means 70 Metal heating rod as removal means 26 Supplementation as replenishment means Device 40 Removal and replenishment device serving as removal means and replenishment means

Claims (4)

In the printed solder inspection apparatus for inspecting and correcting the solder (13) printed on the substrate (12),
Inspection means provided with an inspection head (20) for detecting the position and height of the solder printed on the substrate, which is provided so as to be movable above the substrate, and movable above the substrate And a solder replenishing means (26) provided so as to be movable above the substrate. 1). The printed solder inspection apparatus (1) according to claim 1, wherein the inspection and correction of the solder are continuously performed for each printed portion of the solder. The printed solder inspection apparatus (1) according to claim 1, wherein re-inspection is continuously performed for each portion where the solder is corrected. Imaging means for enlarging and imaging the solder;
A manual mode for visually determining whether or not correction is necessary from the image of the solder by the imaging means and instructing correction as necessary, and the height of the solder detected by the inspection head is predetermined from a predetermined reference value A control means capable of arbitrarily selecting an automatic mode in which correction is automatically performed when the amount deviates by
The printed solder inspection apparatus (1) according to claim 1, further comprising:

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