JP2006140244A

JP2006140244A - Soldering method and apparatus

Info

Publication number: JP2006140244A
Application number: JP2004327229A
Authority: JP
Inventors: Saneyuki Kanao; 実行金尾
Original assignee: Nissan Motor Co Ltd
Current assignee: Nissan Motor Co Ltd
Priority date: 2004-11-11
Filing date: 2004-11-11
Publication date: 2006-06-01

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the remaining of residue of flux in the soldering method and apparatus for conducting soldering process after coating flux on a printed circuit board. <P>SOLUTION: The actual coating region information is compared with the necessary coating region information with a comparison processing means 22. When the actual coating region is different from the necessary coating region, at least one of injection pressure and injection time of a nozzle of a fluxer 1 is changed automatically. Next, the coating distribution image information is compared with the first temperature distribution image information after the preheating with a comparison processing means 23. When temperature of at least a part of the actual coating region is deviated from the first request temperature region, at least one of the preheating temperature and preheating time of a preheating heater 5 is changed automatically, and the coating distribution image information is compared with the second temperature distribution image information after the soldering with a comparison processing means 24. When temperature of at least a part of the actual coating region is deviated from the second request temperature region, at least one of temperature of injected solder of the solder injection nozzles 9, 10 and soldering time is changed automatically. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はプリント基板にフラックスを塗布したのちにハンダ付けするハンダ付け方法および装置に関するものである。 The present invention relates to a soldering method and apparatus for soldering after applying a flux to a printed circuit board.

従来、プリント基板に電子部品を局所的にハンダ付けする技術があるが、このハンダ付けを行なう前に、ハンダ付けがなれる領域に対して、ハンダ表面の酸化膜を除去し、ハンダの濡れ性を化学的に助長させるフラックスを塗布する必要があり、特許文献１に示されるように、プリント基板にフラックスを塗布するフラックス塗布装置が公知である。 Conventionally, there is a technique for locally soldering electronic components on a printed circuit board, but before this soldering is performed, the oxide film on the solder surface is removed from the solderable area to improve the solder wettability. It is necessary to apply a chemically promoting flux, and as disclosed in Patent Document 1, a flux application apparatus that applies a flux to a printed circuit board is known.

特開平１１−１７７２２６号公報JP-A-11-177226

しかし、フラックス塗布装置でプリント基板の所望の位置にフラックスが塗布され、このフラックスが塗布された位置に、局所的にハンダ付けがなされることになるが、局所ハンダ付けにおいては、フラックスが塗布された領域にハンダが必ずしも当たるとは限らず、フラックス残渣が残留する可能性があり、フラックス残渣はプリント基板に対して腐食性を有し、プリント基板に形成された回路間の絶縁性が低下する可能性がある。 However, flux is applied to a desired position on the printed circuit board with a flux application device, and soldering is performed locally at the position where the flux is applied. In local soldering, flux is applied. Solder does not necessarily hit the area, and flux residue may remain. The flux residue is corrosive to the printed circuit board, and the insulation between the circuits formed on the printed circuit board decreases. there is a possibility.

本発明は上述の課題を解決するためになされたもので、フラックス残渣が残留するのを防止することができるハンダ付け方法、ハンダ付け装置を提供することを目的とする。 The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a soldering method and a soldering apparatus capable of preventing flux residue from remaining.

この目的を達成するため、本発明においては、カメラによりプリント基板に塗布されたフラックスの塗布分布を撮影した塗布分布画像情報を取得し、上記塗布分布画像情報に基づいて生成された実際塗布領域情報と予め定められた必要塗布領域情報とを比較する。 In order to achieve this object, in the present invention, the application distribution image information obtained by photographing the distribution of the flux applied to the printed circuit board by the camera is acquired, and the actual application region information generated based on the application distribution image information is obtained. And the necessary application area information determined in advance.

本発明においては、フラックスが塗布された領域にハンダを当てることができるから、フラックス残渣が残留するのを防止することができる。 In the present invention, since solder can be applied to the area where the flux is applied, it is possible to prevent the flux residue from remaining.

（第１の実施の形態）
図１は本発明に係るハンダ付け方法を実施するための装置すなわち本発明に係る局所ハンダ付け装置を示す概略図、図２〜図４は図１に示した局所ハンダ付け装置の一部を示す図である。図に示すように、プリント基板８にフラックスを塗布するためのフラクサ１が設けられ、フラクサ１に隣接して、プリント基板８に塗布されたフラックスの塗布分布を測定する塗布分布測定ゾーン２が設けられ、塗布分布測定ゾーン２にはブラックライト等の紫外線照射装置３および電子式のカメラ４が設けられている。また、塗布分布測定ゾーン２に隣接して予熱用ヒータ５が設けられ、予熱用ヒータ５に隣接して温度センサ設置ゾーン６が設けられ、温度センサ設置ゾーン６に第１の温度センサ７が設けられ、プリント基板８と温度センサ７との位置関係は図４に示すようになっており、温度センサ７はプリント基板８の下面（ハンダ面）の温度分布を測定する。また、温度センサ７としてはプリント基板８の下面全体の温度を１台で測定可能なラインスキャンタイプのものを使用する。また、プリント基板８をフラクサ１、塗布分布測定ゾーン２、予熱用ヒータ５、温度センサ設置ゾーン６間に搬送する基板搬送機１２が設けられている。また、フラクサ１等に隣接してハンダ噴流ノズル９、１０が設けられ、ハンダ噴流ノズル９は１つのハンダ付け箇所に噴流ハンダを接触させ、噴流ノズル１０はプリント基板８の全てのハンダ付け箇所に同時に噴流ハンダを接触させる。また、噴流ノズル９、１０の近傍に第２の温度センサ１１ａ〜１１ｃ（１１）が設けられ、プリント基板８と温度センサ１１ａ〜１１ｃとの位置関係はプリント基板８と温度センサ７との位置関係と同様であり、温度センサ１１ａ〜１１ｃはプリント基板８の下面の温度分布を測定する。また、温度センサ１１ａ〜１１ｃとしてはプリント基板８の下面全体の温度を１台で測定可能なラインスキャンタイプのものを使用する。また、予熱用ヒータ５、ハンダ噴流ノズル９、１０間にプリント基板８を搬送する基板搬送機１３が設けられている。 (First embodiment)
FIG. 1 is a schematic view showing an apparatus for carrying out a soldering method according to the present invention, that is, a local soldering apparatus according to the present invention, and FIGS. 2 to 4 show a part of the local soldering apparatus shown in FIG. FIG. As shown in the figure, a fluxer 1 for applying a flux to a printed circuit board 8 is provided, and an application distribution measuring zone 2 for measuring the application distribution of the flux applied to the printed circuit board 8 is provided adjacent to the fluxer 1. The coating distribution measurement zone 2 is provided with an ultraviolet irradiation device 3 such as a black light and an electronic camera 4. A preheating heater 5 is provided adjacent to the application distribution measurement zone 2, a temperature sensor installation zone 6 is provided adjacent to the preheating heater 5, and a first temperature sensor 7 is provided in the temperature sensor installation zone 6. The positional relationship between the printed circuit board 8 and the temperature sensor 7 is as shown in FIG. 4, and the temperature sensor 7 measures the temperature distribution on the lower surface (solder surface) of the printed circuit board 8. As the temperature sensor 7, a line scan type sensor that can measure the temperature of the entire lower surface of the printed circuit board 8 with one unit is used. Further, a substrate transfer machine 12 for transferring the printed circuit board 8 between the fluxer 1, the application distribution measurement zone 2, the preheating heater 5, and the temperature sensor installation zone 6 is provided. Further, solder jet nozzles 9 and 10 are provided adjacent to the fluxer 1 and the like. The solder jet nozzle 9 brings the jet solder into contact with one soldering place, and the jet nozzle 10 is placed at all the soldering places on the printed circuit board 8. At the same time, the jet solder is brought into contact. Further, second temperature sensors 11 a to 11 c (11) are provided in the vicinity of the jet nozzles 9 and 10, and the positional relationship between the printed circuit board 8 and the temperature sensors 11 a to 11 c is the positional relationship between the printed circuit board 8 and the temperature sensor 7. The temperature sensors 11 a to 11 c measure the temperature distribution on the lower surface of the printed circuit board 8. Further, as the temperature sensors 11a to 11c, a line scan type sensor that can measure the temperature of the entire lower surface of the printed circuit board 8 with one unit is used. Further, a substrate transfer machine 13 for transferring the printed circuit board 8 between the preheating heater 5 and the solder jet nozzles 9 and 10 is provided.

図５は図１に示した局所ハンダ付け装置の一部を示すブロック図、図６は図５の一部詳細ブロック図である。図に示すように、温度センサ７で検出した第１の温度分布画像情報を格納する画像情報格納用メモリ１４が設けられ、温度センサ１１ａ〜１１ｃ（１１）で検出した第２の温度分布画像情報を格納する画像情報格納用メモリ１５が設けられ、カメラ４で取得した塗布分布画像情報（説明後述）を格納する画像情報格納用メモリ１６が設けられ、画像情報格納用メモリ１４〜１６により画像情報格納手段１９が構成されている。また、画像情報格納用メモリ１４、１５に格納された第１、第２の温度分布画像情報、画像情報格納用メモリ１６に格納された塗布分布画像情報からプリント基板８に塗布されたフラックスの状態を検出するフラックス状態検査処理手段１７が設けられ、フラックス状態検査処理手段１７の処理結果を表示する表示手段１８が設けられている。また、フラックス状態検査処理手段１７に入力手段２１が設けられ、入力手段２１によりフラックスの必要塗布領域を示す必要塗布領域情報が入力される。また、フラックス状態検査処理手段１７に第１の比較処理手段２２が設けられ、比較処理手段２２には入力手段２１により入力された必要塗布領域情報が記憶され、比較処理手段２２は塗布分布画像情報に基づいて生成された実際塗布領域情報と必要塗布領域情報とを比較し、実際塗布領域情報により示される実際塗布領域と必要塗布領域とが相違する場合には、フラクサ１のノズルの噴射圧力、噴射時間の少なくとも一方を自動変更し、または局所ハンダ付け装置を自動停止する処理を行なう。すなわち、実際塗布領域が必要塗布領域に比べて狭い場合には、比較処理手段２２は該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、次のプリント基板８に対してはフラクサ１のノズルの噴射圧力を高くすること、フラクサ１のノズルの噴射時間を長くすることの少なくとも一方を行なう。また、実際塗布領域が必要塗布領域に比べて広い場合には、比較処理手段２２は該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、次のプリント基板８に対してはフラクサ１のノズルの噴射圧力を低くすること、フラクサ１のノズルの噴射時間を短くすることの少なくとも一方をなう。さらに、実際塗布領域が必要塗布領域に比べて著しく狭い場合には、フラクサ１のノズル詰まりなどが考えられるため、比較処理手段２２は局所ハンダ付け装置を自動停止する。また、フラックス状態検査処理手段１７に第２の比較処理手段２３が設けられ、比較処理手段２３は塗布分布画像情報と第１の温度分布画像情報とを比較し、実際塗布領域の少なくとも一部の温度が第１の要求温度域から外れている場合には、予熱用ヒータ５の予熱温度、予熱時間の少なくとも一方を自動変更する。すなわち、実際塗布領域の少なくとも一部の温度が第１の要求温度域より低い場合には、比較処理手段２３は該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、次のプリント基板８に対しては予熱用ヒータ５の予熱温度を高くすること、予熱用ヒータ５の予熱時間を長くすることの少なくとも一方を行なう。反対に、実際塗布領域の少なくとも一部の温度が第１の要求温度域より高い場合には、比較処理手段２３は該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、次のプリント基板８に対しては予熱用ヒータ５の予熱温度を低くすること、予熱用ヒータ５の予熱時間を短くすることの少なくとも一方を行なう。また、フラックス状態検査処理手段１７に第３の比較処理手段２４が設けられ、比較処理手段２４は塗布分布画像情報と第２の温度分布画像情報とを比較し、実際塗布領域の少なくとも一部の温度が第２の要求温度域から外れている場合には、ハンダ噴流ノズル９、１０の噴流ハンダの温度、ハンダ付け時間の少なくとも一方をプリント基板８の品質に影響を与えない範囲で自動変更する。すなわち、実際塗布領域の少なくとも一部の温度が第２の要求温度域より低い場合には、比較処理手段２４は該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、次のプリント基板８に対してはハンダ噴流ノズル９、１０の噴流ハンダの温度を高くすること、ハンダ付け時間長くすることの少なくとも一方を行なう。反対に、実際塗布領域の少なくとも一部の温度が第２の要求温度域より高い場合には、比較処理手段２４は該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、次のプリント基板８に対してはハンダ噴流ノズル９、１０の噴流ハンダの温度を低くすること、ハンダ付け時間を短くすることの少なくとも一方を行なう。そして、紫外線照射装置３、カメラ４、温度センサ７、１１、画像情報格納手段１９、フラックス状態検査処理手段１７によりフラックス状態検査装置が構成されている。 5 is a block diagram showing a part of the local soldering apparatus shown in FIG. 1, and FIG. 6 is a partial detailed block diagram of FIG. As shown in the figure, an image information storage memory 14 for storing the first temperature distribution image information detected by the temperature sensor 7 is provided, and the second temperature distribution image information detected by the temperature sensors 11a to 11c (11). The image information storage memory 15 for storing image information is provided, and the image information storage memory 16 for storing application distribution image information (described later) acquired by the camera 4 is provided. The image information storage memories 14 to 16 store image information. Storage means 19 is configured. The state of the flux applied to the printed circuit board 8 from the first and second temperature distribution image information stored in the image information storage memories 14 and 15 and the application distribution image information stored in the image information storage memory 16. Flux state inspection processing means 17 is provided, and a display means 18 for displaying the processing result of the flux state inspection processing means 17 is provided. Further, the flux state inspection processing unit 17 is provided with an input unit 21, and necessary application area information indicating a necessary application area of the flux is input by the input unit 21. Further, the first comparison processing means 22 is provided in the flux state inspection processing means 17, the necessary application area information input by the input means 21 is stored in the comparison processing means 22, and the comparison processing means 22 is provided with the application distribution image information. The actual application area information generated based on the required application area information is compared, and if the actual application area and the required application area indicated by the actual application area information are different, the injection pressure of the nozzle of the fluxer 1, A process of automatically changing at least one of the injection times or automatically stopping the local soldering apparatus is performed. That is, when the actual application area is narrower than the necessary application area, the comparison processing means 22 displays the location where the problem of a decrease in the insulation reliability of the corresponding printed board 8 is displayed on the display means 18 and is displayed on the next printed board 8. For this, at least one of increasing the injection pressure of the nozzle of the fluxer 1 and increasing the injection time of the nozzle of the fluxer 1 is performed. When the actual application area is larger than the necessary application area, the comparison processing means 22 displays the location where the problem of deterioration of the insulation reliability of the corresponding printed circuit board 8 occurs on the display means 18, and displays it on the next printed circuit board 8. On the other hand, at least one of reducing the injection pressure of the nozzle of the fluxer 1 and shortening the injection time of the nozzle of the fluxer 1 is performed. Furthermore, when the actual application area is significantly narrower than the required application area, the nozzle of the fluxer 1 may be clogged, so the comparison processing means 22 automatically stops the local soldering apparatus. Further, the flux state inspection processing means 17 is provided with a second comparison processing means 23, which compares the application distribution image information with the first temperature distribution image information, and at least a part of the actual application area. When the temperature is out of the first required temperature range, at least one of the preheating temperature and the preheating time of the preheating heater 5 is automatically changed. That is, when the temperature of at least a part of the actual application region is lower than the first required temperature region, the comparison processing unit 23 displays on the display unit 18 a location where the problem of the insulation reliability degradation of the corresponding printed circuit board 8 occurs. For the next printed circuit board 8, at least one of increasing the preheating temperature of the preheating heater 5 and increasing the preheating time of the preheating heater 5 is performed. On the other hand, when the temperature of at least a part of the actual application region is higher than the first required temperature range, the comparison processing unit 23 displays on the display unit 18 the location where the problem of the insulation reliability degradation of the corresponding printed circuit board 8 occurs. For the next printed circuit board 8, at least one of lowering the preheating temperature of the preheating heater 5 and shortening the preheating time of the preheating heater 5 is performed. Further, the flux state inspection processing unit 17 is provided with a third comparison processing unit 24, which compares the application distribution image information with the second temperature distribution image information, and at least a part of the actual application region. When the temperature is out of the second required temperature range, at least one of the jet solder temperature and the soldering time of the solder jet nozzles 9 and 10 is automatically changed within a range that does not affect the quality of the printed circuit board 8. . In other words, when the temperature of at least a part of the actual application region is lower than the second required temperature region, the comparison processing unit 24 displays on the display unit 18 the location where the problem of the insulation reliability degradation of the corresponding printed circuit board 8 occurs. For the next printed circuit board 8, at least one of increasing the temperature of the jet solder of the solder jet nozzles 9 and 10 and increasing the soldering time is performed. On the other hand, when the temperature of at least a part of the actual application region is higher than the second required temperature region, the comparison processing unit 24 displays on the display unit 18 the location where the problem of the insulation reliability degradation of the corresponding printed circuit board 8 occurs. For the next printed circuit board 8, at least one of lowering the solder temperature of the solder jet nozzles 9 and 10 and shortening the soldering time is performed. The ultraviolet irradiation device 3, the camera 4, the temperature sensors 7 and 11, the image information storage unit 19, and the flux state inspection processing unit 17 constitute a flux state inspection device.

つぎに、図１〜図６に示した局所ハンダ付け装置の動作、すなわち本発明に係るハンダ付け方法を説明する。まず、フラクサ１によりプリント基板８の下面にフラックスを塗布したのち、基板搬送機１２によってプリント基板８を塗布分布測定ゾーン２に搬送する。つぎに、塗布分布測定ゾーン２において、紫外線照射装置３によりプリント基板８の下面に紫外線を照射した状態で、プリント基板８の下面をカメラ４で撮影する。すると、フラックスが塗布されている部分は蛍光するので、カメラ４で取得された画像情報はフラックスの塗布分布を示す塗布分布画像情報となる。つぎに、カメラ４で取得された塗布分布画像情報を画像情報格納用メモリ１６に格納する。つぎに、比較処理手段２２により実際塗布領域情報と必要塗布領域情報とを比較し、実際塗布領域と必要塗布領域とが相違する場合には、フラクサ１のノズルの噴射圧力、噴射時間の少なくとも一方を自動変更し、または局所ハンダ付け装置を自動停止する処理を行なう。すなわち、実際塗布領域が必要塗布領域に比べて狭い場合には、比較処理手段２２により該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、問題の表示されたプリント基板８を専用の場所へ搬出するとともに、次のプリント基板８に対してはフラクサ１のノズルの噴射圧力を高くすること、フラクサ１のノズルの噴射時間を長くすることの少なくとも一方を行なう。また、実際塗布領域が必要塗布領域に比べて広い場合には、比較処理手段２２により該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、問題の表示されたプリント基板８を専用の場所へ搬出するとともに、次のプリント基板８に対してはフラクサ１のノズルの噴射圧力を低くすること、フラクサ１のノズルの噴射時間を短くすることの少なくとも一方をなう。さらに、実際塗布領域が必要塗布領域に比べて著しく狭い場合には、比較処理手段２２により局所ハンダ付け装置を自動停止する。つぎに、プリント基板８を予熱用ヒータ５によって予熱する。この時、温度センサ７によりプリント基板８の下面の温度を測定する。すなわち、プリント基板８の予熱終了後、基板搬送機１２によってプリント基板８が進行方向に搬送されはじめてから、温度センサ７によりプリント基板８の下面の温度を測定していく。つぎに、温度センサ７で取得された第１の温度分布画像情報を画像情報格納用メモリ１４に格納する。つぎに、比較処理手段２３により塗布分布画像情報と第１の温度分布画像情報とを比較し、実際塗布領域の少なくとも一部の温度が第１の要求温度域から外れている場合には、予熱用ヒータ５の予熱温度、予熱時間の少なくとも一方を自動変更する。すなわち、実際塗布領域の少なくとも一部の温度が第１の要求温度域より低い場合には、比較処理手段２３により該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、問題の表示されたプリント基板８を専用の場所へ搬出するとともに、次のプリント基板８に対しては予熱用ヒータ５の予熱温度を高くすること、予熱用ヒータ５の予熱時間を長くすることの少なくとも一方を行なう。反対に、実際塗布領域の少なくとも一部の温度が第１の要求温度域より高い場合には、比較処理手段２３により該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、問題の表示されたプリント基板８を専用の場所へ搬出するとともに、次のプリント基板８に対しては予熱用ヒータ５の予熱温度を低くすること、予熱用ヒータ５の予熱時間を短くすることの少なくとも一方を行なう。つぎに、予熱後にプリント基板８を基板搬送機１３によってハンダ噴流ノズル９またはハンダ噴流ノズル１０に搬送し、ハンダ付けを行なう。そして、ハンダ噴流ノズル９によりハンダ付けが行なわれるときには、ハンダ噴流ノズル９に対してＸ方向（第１の方向）、Ｘ方向と直交するＹ方向（第２の方向）にそれぞれ設置された温度センサ１１ａ、１１ｂが噴流ハンダがプリント基板８と接触してから離れるまでのプリント基板８の下面の温度分布を測定する。具体的には、プリント基板８がＸ方向に搬送される場合には、Ｘ方向に配置された温度センサ１１ａが温度分布を測定し、プリント基板８がＹ方向に搬送される場合には、Ｙ方向に設置された温度センサ１１ｂが温度分布を測定し、プリント基板８が斜め方向に搬送される場合には両方の温度センサ１１ａ、１１ｂが温度分布を測定する。一方、ハンダ噴流ノズル１０によりハンダ付けが行なわれるときには、噴流ハンダがプリント基板８と接触している間はプリント基板８の下面の温度を測定することができない。このため、プリント基板８が噴流ハンダから離れたのち、即座にハンダ噴流ノズル１０に対してＹ方向に設置された温度センサ１１ｃに向かってプリント基板８を搬送し、プリント基板８がＹ方向に移動を始めた時点からの温度を測定する。この場合には、プリント基板８の下面の温度が下がることを考慮して、判定時の第２の要求温度域（しきい値）を設定しておく。どちらのハンダ噴流ノズル９、１０についても、測定した第２の温度分布画像情報を画像情報格納用メモリ１５に格納する。つぎに、比較処理手段２４により塗布分布画像情報と第２の温度分布画像情報とを比較し、実際塗布領域の少なくとも一部の温度が第２の要求温度域から外れている場合には、ハンダ噴流ノズル９、１０の噴流ハンダの温度、ハンダ付け時間の少なくとも一方をプリント基板８の品質に影響を与えない範囲で自動変更する。すなわち、実際塗布領域の少なくとも一部の温度が第２の要求温度域より低い場合には、比較処理手段２４により該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、問題の表示されたプリント基板８を専用の場所へ搬出するとともに、次のプリント基板８に対してはハンダ噴流ノズル９、１０の噴流ハンダの温度を高くすること、ハンダ付け時間長くすることの少なくとも一方を行なう。反対に、実際塗布領域の少なくとも一部の温度が第２の要求温度域より高い場合には、比較処理手段２４により該当プリント基板８の絶縁信頼性低下の問題が生じる箇所を表示手段１８で表示し、問題の表示されたプリント基板８を専用の場所へ搬出するとともに、次のプリント基板８に対してはハンダ噴流ノズル９、１０の噴流ハンダの温度を低くすること、ハンダ付け時間を短くすることの少なくとも一方を行なう。 Next, the operation of the local soldering apparatus shown in FIGS. 1 to 6, that is, the soldering method according to the present invention will be described. First, after flux is applied to the lower surface of the printed circuit board 8 by the fluxer 1, the printed circuit board 8 is transported to the coating distribution measurement zone 2 by the substrate transport machine 12. Next, in the coating distribution measurement zone 2, the lower surface of the printed circuit board 8 is photographed by the camera 4 in a state where the ultraviolet light is irradiated on the lower surface of the printed circuit board 8 by the ultraviolet irradiation device 3. Then, since the part to which the flux is applied is fluorescent, the image information acquired by the camera 4 is application distribution image information indicating the application distribution of the flux. Next, the application distribution image information acquired by the camera 4 is stored in the image information storage memory 16. Next, the comparison processing means 22 compares the actual application area information with the required application area information. If the actual application area and the required application area are different, at least one of the nozzle injection pressure and the injection time of the fluxer 1 is used. Is automatically changed or the local soldering apparatus is automatically stopped. In other words, when the actual application area is narrower than the required application area, the comparison processing means 22 displays on the display means 18 the location where the problem of a decrease in the insulation reliability of the corresponding printed circuit board 8 occurs. While the board | substrate 8 is carried out to a special place, at least one of raising the jetting pressure of the nozzle of the fluxer 1 and lengthening the jetting time of the nozzle of the fluxer 1 to the next printed board 8 is performed. If the actual application area is larger than the required application area, the comparison processing means 22 displays the location where the problem of a decrease in the insulation reliability of the corresponding printed circuit board 8 is displayed on the display means 18, and the print in which the problem is displayed. While the board | substrate 8 is carried out to a special place, at least one of lowering the jet pressure of the nozzle of the fluxer 1 and shortening the jet time of the nozzle of the fluxer 1 with respect to the next printed board 8 is achieved. Further, when the actual application area is significantly narrower than the required application area, the local soldering apparatus is automatically stopped by the comparison processing means 22. Next, the printed circuit board 8 is preheated by the preheating heater 5. At this time, the temperature sensor 7 measures the temperature of the lower surface of the printed circuit board 8. That is, after the preheating of the printed circuit board 8 is completed, the temperature of the lower surface of the printed circuit board 8 is measured by the temperature sensor 7 after the printed circuit board 8 starts to be conveyed in the traveling direction by the circuit board conveyance device 12. Next, the first temperature distribution image information acquired by the temperature sensor 7 is stored in the image information storage memory 14. Next, the comparison processing means 23 compares the application distribution image information with the first temperature distribution image information, and if the temperature of at least a part of the actual application region is out of the first required temperature range, preheating is performed. At least one of the preheating temperature and the preheating time of the heater 5 is automatically changed. That is, when the temperature of at least a part of the actual application region is lower than the first required temperature region, the display unit 18 displays the location where the problem of the insulation reliability degradation of the corresponding printed circuit board 8 occurs by the comparison processing unit 23. The printed circuit board 8 displaying the problem is carried out to a dedicated place, the preheating temperature of the preheating heater 5 is increased for the next printed circuit board 8, and the preheating time of the preheating heater 5 is increased. Do at least one of the following. On the other hand, when the temperature of at least a part of the actual application region is higher than the first required temperature range, the display unit 18 displays a location where the problem of the insulation reliability reduction of the corresponding printed circuit board 8 occurs by the comparison processing unit 23. Then, the printed circuit board 8 in which the problem is displayed is carried out to a dedicated place, the preheating temperature of the preheating heater 5 is lowered for the next printed circuit board 8, and the preheating time of the preheating heater 5 is shortened. Do at least one of the things. Next, after preheating, the printed circuit board 8 is transferred to the solder jet nozzle 9 or the solder jet nozzle 10 by the board transfer device 13 and soldered. When soldering is performed by the solder jet nozzle 9, temperature sensors installed in the X direction (first direction) and the Y direction (second direction) orthogonal to the X direction with respect to the solder jet nozzle 9. 11a and 11b measure the temperature distribution on the lower surface of the printed circuit board 8 until the jet solder contacts the printed circuit board 8 and then leaves. Specifically, when the printed circuit board 8 is conveyed in the X direction, the temperature sensor 11a arranged in the X direction measures the temperature distribution, and when the printed circuit board 8 is conveyed in the Y direction, Y The temperature sensor 11b installed in the direction measures the temperature distribution, and when the printed circuit board 8 is conveyed in an oblique direction, both the temperature sensors 11a and 11b measure the temperature distribution. On the other hand, when soldering is performed by the solder jet nozzle 10, the temperature of the lower surface of the printed circuit board 8 cannot be measured while the jet solder is in contact with the printed circuit board 8. For this reason, after the printed circuit board 8 is separated from the jet solder, the printed circuit board 8 is immediately transported toward the temperature sensor 11c installed in the Y direction with respect to the solder jet nozzle 10, and the printed circuit board 8 moves in the Y direction. Measure the temperature from the time you started. In this case, the second required temperature range (threshold value) at the time of determination is set in consideration that the temperature of the lower surface of the printed circuit board 8 decreases. The measured second temperature distribution image information is stored in the image information storage memory 15 for both solder jet nozzles 9 and 10. Next, the comparison processing means 24 compares the application distribution image information and the second temperature distribution image information, and if the temperature of at least a part of the actual application region is out of the second required temperature region, the solder is used. At least one of the temperature and the soldering time of the jet solder of the jet nozzles 9 and 10 is automatically changed within a range that does not affect the quality of the printed circuit board 8. That is, when the temperature of at least a part of the actual application region is lower than the second required temperature region, the display unit 18 displays a location where the problem of the insulation reliability degradation of the corresponding printed circuit board 8 occurs by the comparison processing unit 24. In addition to carrying out the printed circuit board 8 displaying the problem to a dedicated place, the temperature of the jet solder of the solder jet nozzles 9 and 10 for the next printed circuit board 8 is increased, and the soldering time is increased. Do at least one. On the contrary, when the temperature of at least a part of the actual application region is higher than the second required temperature region, the display unit 18 displays a location where the problem of the insulation reliability degradation of the corresponding printed circuit board 8 occurs by the comparison processing unit 24. Then, the printed board 8 in which the problem is displayed is carried out to a dedicated place, and the temperature of the jet solder of the solder jet nozzles 9 and 10 is lowered for the next printed board 8, and the soldering time is shortened. Do at least one of the things.

このようなハンダ付け方法、局所ハンダ付け装置においては、実際塗布領域情報と必要塗布領域情報とを比較するから、プリント基板８に塗布されたフラックスの状態を検査することができ、プリント基板８に適正にフラックスが塗布されているか否かを検出することができるので、フラックスが塗布された領域にハンダを当てることができるため、プリント基板にフラックス残渣が残留するのを防止することができる。このため、プリント基板がフラックス残渣によって腐食するのを防止することができ、不良なプリント基板８が発生するのを防止することができる。また、比較処理手段２２により実際塗布領域情報と必要塗布領域情報とを比較し、実際塗布領域と必要塗布領域とが相違する場合には、フラクサ１のノズルの噴射圧力、噴射時間の少なくとも一方を自動変更するから、フラクサ１のノズルつまりや圧力低下によるフラックスの塗布不良を防止することができる。また、比較処理手段２３、２４により塗布分布画像情報と第１、第２の温度分布画像情報とを比較するから、絶縁信頼性低下の問題を引き起こすフラックスの状態すなわち熱が十分にかかっていないために溶剤や活性成分が残っている状態を検出することができるので、不良なプリント基板８が発生するのを防止することができる。また、比較処理手段２３により塗布分布画像情報と第１の温度分布画像情報とを比較し、実際塗布領域の少なくとも一部の温度が第１の要求温度域から外れている場合には、予熱用ヒータ５の予熱温度、予熱時間の少なくとも一方を自動変更するから、予熱不足によるフラックスの溶剤の残留を検出することができ、ハンダ付け時の残留溶剤の突沸によるブローホール（ハンダ内部にできる空洞）やハンダボールの発生を防止することができ、さらに予熱不足によるハンダぬれ性の低下を防止でき、フラックス中の溶剤の残留や活性剤の失活が不十分のためプリント基板８の回路間の絶縁信頼性が低下するのを防止することができる。また、実際塗布領域と必要塗布領域とが相違する場合、実際塗布領域の少なくとも一部の温度が第１、第２の要求温度域から外れている場合には、問題のプリント基板８を専用の場所へ搬出するから、不良なプリント基板８が流出するのを防止することができる。 In such a soldering method and local soldering apparatus, since the actual application area information and the required application area information are compared, the state of the flux applied to the printed circuit board 8 can be inspected. Since it is possible to detect whether or not the flux is properly applied, it is possible to apply solder to the area where the flux is applied, and thus it is possible to prevent the flux residue from remaining on the printed circuit board. For this reason, it can prevent that a printed circuit board corrodes with a flux residue, and can prevent that the bad printed circuit board 8 generate | occur | produces. Further, when the actual application area information and the required application area information are compared by the comparison processing means 22 and the actual application area and the required application area are different, at least one of the injection pressure and the injection time of the nozzle of the fluxer 1 is set. Since the automatic change is performed, it is possible to prevent the flux application failure due to the nozzle of the fluxer 1, that is, the pressure drop. Further, since the application distribution image information and the first and second temperature distribution image information are compared by the comparison processing means 23 and 24, the state of the flux that causes the problem of deterioration in insulation reliability, that is, heat is not sufficiently applied. Since it is possible to detect the state in which the solvent and the active component remain, it is possible to prevent the generation of a defective printed board 8. Further, the comparison processing means 23 compares the application distribution image information and the first temperature distribution image information, and if the temperature of at least a part of the actual application area is out of the first required temperature range, the preheating is performed. Since at least one of the preheating temperature and preheating time of the heater 5 is automatically changed, it is possible to detect residual flux solvent due to insufficient preheating, and blow holes due to bumping of the residual solvent during soldering (cavities formed inside the solder) Generation of solder and solder balls can be prevented, solder wettability can be prevented from being lowered due to insufficient preheating, and insulation between the circuits of the printed circuit board 8 due to insufficient residual solvent and deactivation of the activator. It is possible to prevent a decrease in reliability. When the actual application area is different from the required application area, if the temperature of at least a part of the actual application area is out of the first and second required temperature areas, the printed circuit board 8 in question is dedicated. Since it carries out to a place, it can prevent that the bad printed circuit board 8 flows out.

（第２の実施の形態）
図７は本発明に係る他のハンダ付け方法を実施するための装置すなわち本発明に係る他の局所ハンダ付け装置を示す概略図である。図に示すように、プリント基板８にフラックスを塗布するためのフラクサ３１が設けられ、フラクサ３１に隣接して、フラックスの塗布分布を測定する塗布分布測定ゾーン３２が設けられ、塗布分布測定ゾーン３２には紫外線照射装置３３および電子式のカメラ３４が設けられ、塗布分布測定ゾーン３２に隣接して予熱用ヒータ３５が設けられ、予熱用ヒータ３５に隣接して温度センサ設置ゾーン３６が設けられ、温度センサ設置ゾーン３６に温度センサ３７が設けられ、プリント基板８と温度センサ３７との位置関係はプリント基板８と温度センサ７との位置関係と同様であり、温度センサ３７はプリント基板８の下面の温度分布を測定する。また、温度センサ３７としてはプリント基板８の下面全体の温度を１台で測定可能なラインスキャンタイプのものを使用する。また、温度センサ設置ゾーン３６に隣接してハンダ噴流ノズル３８が設けられ、ハンダ噴流ノズル３８はプリント基板８の全てのハンダ付け箇所に同時に噴流ハンダを接触させる。また、ハンダ噴流ノズル３８に隣接して温度センサ設置ゾーン３９が設けられ、温度センサ設置ゾーン３９に温度センサ４０が設けられ、下降したハンダ噴流ノズル３８の上方、温度センサ設置ゾーン３９間に温度センサ４０をＸ方向に移動する温度センサ移動機構４１が設けられている。また、プリント基板８をフラクサ３１、塗布分布測定ゾーン３２、予熱用ヒータ３５、温度センサ設置ゾーン３６、ハンダ噴流ノズル３８、温度センサ設置ゾーン３９間に搬送する基板搬送機４２が設けられている。また、カメラ３４で取得した塗布分布画像情報、温度センサ３７で検出した第１の温度分布画像情報、温度センサ４０で検出した第２の温度分布画像情報を格納する画像情報格納手段（図示せず）が設けられ、また、画像情報格納手段に格納された塗布分布画像情報、第１、第２の温度分布画像情報からプリント基板８に塗布されたフラックスの状態を検出するフラックス状態検査処理手段（図示せず）が設けられ、このフラックス状態検査処理手段の構成は図６に示したフラックス状態検査処理手段１７の構成と同等である。 (Second Embodiment)
FIG. 7 is a schematic view showing an apparatus for carrying out another soldering method according to the present invention, that is, another local soldering apparatus according to the present invention. As shown in the figure, a fluxer 31 for applying a flux to the printed circuit board 8 is provided, and an application distribution measurement zone 32 for measuring the application distribution of the flux is provided adjacent to the fluxer 31, and the application distribution measurement zone 32. Are provided with an ultraviolet irradiation device 33 and an electronic camera 34, a preheating heater 35 is provided adjacent to the coating distribution measurement zone 32, and a temperature sensor installation zone 36 is provided adjacent to the preheating heater 35, A temperature sensor 37 is provided in the temperature sensor installation zone 36, and the positional relationship between the printed circuit board 8 and the temperature sensor 37 is the same as the positional relationship between the printed circuit board 8 and the temperature sensor 7. Measure the temperature distribution. As the temperature sensor 37, a line scan type sensor that can measure the temperature of the entire lower surface of the printed circuit board 8 with a single unit is used. Further, a solder jet nozzle 38 is provided adjacent to the temperature sensor installation zone 36, and the solder jet nozzle 38 simultaneously brings the jet solder into contact with all the soldering locations of the printed circuit board 8. Further, a temperature sensor installation zone 39 is provided adjacent to the solder jet nozzle 38, a temperature sensor 40 is provided in the temperature sensor installation zone 39, and the temperature sensor is disposed above the lowered solder jet nozzle 38 and between the temperature sensor installation zones 39. A temperature sensor moving mechanism 41 that moves 40 in the X direction is provided. Further, a substrate transfer device 42 is provided for transferring the printed circuit board 8 between the fluxer 31, the application distribution measurement zone 32, the preheating heater 35, the temperature sensor installation zone 36, the solder jet nozzle 38, and the temperature sensor installation zone 39. Further, image information storage means (not shown) for storing the application distribution image information acquired by the camera 34, the first temperature distribution image information detected by the temperature sensor 37, and the second temperature distribution image information detected by the temperature sensor 40. ) And a flux state inspection processing means for detecting the state of the flux applied to the printed circuit board 8 from the application distribution image information and the first and second temperature distribution image information stored in the image information storage means ( (Not shown) is provided, and the configuration of the flux state inspection processing means is the same as that of the flux state inspection processing means 17 shown in FIG.

つぎに、図７に示した局所ハンダ付け装置の動作、すなわち本発明に係るハンダ付け方法を説明する。まず、フラクサ３１によりプリント基板８の下面にフラックスを塗布したのち、紫外線照射装置３３によりプリント基板８の下面に紫外線を照射した状態で、プリント基板８の下面をカメラ３４で撮影する。つぎに、カメラ４で取得した塗布分布画像情報が画像情報格納手段に格納されると、フラックス状態検査処理手段の第１の比較処理手段により実際塗布領域情報と必要塗布領域情報とが比較され、実際塗布領域と必要塗布領域とが相違する場合には、フラクサ３１のノズルの噴射圧力、噴射時間の少なくとも一方を自動変更し、または局所ハンダ付け装置を自動停止する処理を行なう。つぎに、プリント基板８を予熱用ヒータ３５によって予熱する。この時、温度センサ３７によりプリント基板８の下面の表面温度を測定する。つぎに、温度センサ３７で取得された第１の温度分布画像情報を画像情報格納用メモリ１４に格納し、フラックス状態検査処理手段の第２の比較処理手段により塗布分布画像情報と第１の温度分布画像情報とを比較し、実際塗布領域の少なくとも一部の温度が第１の要求温度域から外れている場合には、予熱用ヒータ３５の予熱温度、予熱時間の少なくとも一方を自動変更する。つぎに、予熱後にプリント基板８をハンダ噴流ノズル３８の上方に搬送し、ハンダ噴流ノズル３８を上昇して、プリント基板８の全てのハンダ付け箇所に同時に噴流ハンダを接触させる。つぎに、ハンダ噴流ノズル３８が下降した瞬間に、温度センサ移動機構４１により温度センサ４０をプリント基板８の下面の下方に移動し、プリント基板８の下面の温度分布を測定する。つぎに、温度センサ４０で取得された第２の温度分布画像情報を画像情報格納手段に格納し、フラックス状態検査処理手段の第３の比較処理手段により塗布分布画像情報と第２の温度分布画像情報とを比較し、実際塗布領域の少なくとも一部の温度が第２の要求温度域から外れている場合には、ハンダ噴流ノズル３８の噴流ハンダの温度、ハンダ付け時間の少なくとも一方をプリント基板８の品質に影響を与えない範囲で自動変更する。また、実際塗布領域と必要塗布領域とが相違する場合、実際塗布領域の少なくとも一部の温度が第１、第２の要求温度域から外れている場合には、問題のプリント基板８を専用の場所へ搬出する。 Next, the operation of the local soldering apparatus shown in FIG. 7, that is, the soldering method according to the present invention will be described. First, flux is applied to the lower surface of the printed circuit board 8 by the fluxer 31, and then the lower surface of the printed circuit board 8 is photographed by the camera 34 in a state where the ultraviolet light is irradiated to the lower surface of the printed circuit board 8 by the ultraviolet irradiation device 33. Next, when the application distribution image information acquired by the camera 4 is stored in the image information storage means, the actual application area information and the required application area information are compared by the first comparison processing means of the flux state inspection processing means, When the actual application area is different from the required application area, a process of automatically changing at least one of the injection pressure and the injection time of the nozzle of the fluxer 31 or automatically stopping the local soldering apparatus is performed. Next, the printed circuit board 8 is preheated by the preheating heater 35. At this time, the surface temperature of the lower surface of the printed circuit board 8 is measured by the temperature sensor 37. Next, the first temperature distribution image information acquired by the temperature sensor 37 is stored in the image information storage memory 14, and the application distribution image information and the first temperature are detected by the second comparison processing means of the flux state inspection processing means. The distribution image information is compared, and if at least a part of the temperature of the actual application region is out of the first required temperature range, at least one of the preheating temperature and the preheating time of the preheating heater 35 is automatically changed. Next, after preheating, the printed circuit board 8 is conveyed above the solder jet nozzle 38, and the solder jet nozzle 38 is raised so that the jet solder is brought into contact with all the soldering portions of the printed circuit board 8 at the same time. Next, at the moment when the solder jet nozzle 38 is lowered, the temperature sensor moving mechanism 41 moves the temperature sensor 40 below the lower surface of the printed circuit board 8 to measure the temperature distribution on the lower surface of the printed circuit board 8. Next, the second temperature distribution image information acquired by the temperature sensor 40 is stored in the image information storage means, and the application distribution image information and the second temperature distribution image are obtained by the third comparison processing means of the flux state inspection processing means. When the temperature of at least a part of the actual application region deviates from the second required temperature region by comparing with the information, at least one of the jet solder temperature and the soldering time of the solder jet nozzle 38 is set to the printed circuit board 8. Automatically change within a range that does not affect the quality of the product. When the actual application area is different from the required application area, if the temperature of at least a part of the actual application area is out of the first and second required temperature areas, the printed circuit board 8 in question is dedicated. Take it out to the place.

このハンダ付け方法、局所ハンダ付け装置においては、第１の比較処理手段により実際塗布領域情報と必要塗布領域情報とを比較するから、プリント基板８にフラックス残渣が残留するのを防止することができるので、プリント基板がフラックス残渣によって腐食するのを防止することができ、不良なプリント基板８が発生するのを防止することができる。また、第１の比較処理手段により実際塗布領域情報と必要塗布領域情報とを比較し、実際塗布領域と必要塗布領域とが相違する場合には、フラクサ３１のノズルの噴射圧力、噴射時間の少なくとも一方を自動変更するから、フラクサ３１のノズルつまりや圧力低下によるフラックスの塗布不良を防止することができる。また、第２、第３の比較処理手段により塗布分布画像情報と第１、第２の温度分布画像情報とを比較するから、絶縁信頼性低下の問題を引き起こすフラックスの状態すなわち熱が十分にかかっていないために溶剤や活性成分が残っている状態を検出することができるので、不良なプリント基板８が発生するのを防止することができる。また、第２の比較処理手段により塗布分布画像情報と第１の温度分布画像情報とを比較し、実際塗布領域の少なくとも一部の温度が第１の要求温度域から外れている場合には、予熱用ヒータ５の予熱温度、予熱時間の少なくとも一方を自動変更するから、予熱不足によるフラックスの溶剤の残留を検出することができ、ハンダ付け時の残留溶剤の突沸によるブローホールやハンダボールの発生を防止することができ、さらに予熱不足によるハンダぬれ性の低下を防止でき、フラックス中の溶剤の残留や活性剤の失活が不十分のため回路の絶縁信頼性が低下するのを防止することができる。また、実際塗布領域と必要塗布領域とが相違する場合、実際塗布領域の少なくとも一部の温度が第１、第２の要求温度域から外れている場合には、問題のプリント基板８を専用の場所へ搬出するから、不良なプリント基板８が流出するのを防止することができる。 In this soldering method and local soldering apparatus, since the actual application area information and the required application area information are compared by the first comparison processing means, it is possible to prevent the flux residue from remaining on the printed circuit board 8. Therefore, it is possible to prevent the printed circuit board from being corroded by the flux residue, and it is possible to prevent the defective printed circuit board 8 from being generated. Further, when the actual application area information and the required application area information are compared by the first comparison processing means, and the actual application area and the required application area are different, at least the injection pressure and the injection time of the nozzle of the fluxer 31 are different. Since one of them is automatically changed, it is possible to prevent the flux application failure due to the nozzle of the fluxer 31, that is, the pressure drop. Further, since the application distribution image information is compared with the first and second temperature distribution image information by the second and third comparison processing means, the state of the flux that causes the problem of insulation reliability deterioration, that is, heat is sufficiently applied. Therefore, it is possible to detect the state in which the solvent and the active component remain, so that it is possible to prevent the occurrence of a defective printed board 8. In addition, when the second comparison processing unit compares the application distribution image information with the first temperature distribution image information, and at least a part of the temperature of the actual application region is out of the first required temperature range, Since at least one of the preheating temperature and preheating time of the preheating heater 5 is automatically changed, it is possible to detect the residual solvent in the flux due to insufficient preheating and to generate blowholes and solder balls due to bumping of the residual solvent during soldering. In addition, it is possible to prevent solder wettability from decreasing due to insufficient preheating, and to prevent deterioration of circuit insulation reliability due to insufficient solvent residue and activator deactivation. Can do. When the actual application area is different from the required application area, if the temperature of at least a part of the actual application area is out of the first and second required temperature areas, the printed circuit board 8 in question is dedicated. Since it carries out to a place, it can prevent that the bad printed circuit board 8 flows out.

なお、上述実施の形態においては、実際塗布領域の少なくとも一部の温度が第１、第２の要求温度域から外れている場合に、予熱用ヒータ５、３５の予熱温度、予熱時間、ハンダ噴流ノズル９、１０、３８の噴流ハンダの温度、ハンダ付け時間を変更したが、プリント基板の部品や配線パターンのレイアウトにより、プリント基板の場所毎に温まり方が異なる場合には、プリント基板の下面の場所毎に対して第１、第２の要求温度域を設定してもよい。また、上述実施の形態においては、ハンダ付け装置が局所ハンダ付け装置の場合について説明したが、他のハンダ付け装置にも本発明を適用することができる。 In the above-described embodiment, when the temperature of at least a part of the actual application region is out of the first and second required temperature regions, the preheating temperature, the preheating time of the preheating heaters 5 and 35, the solder jet flow The temperature and soldering time of the jet solder of the nozzles 9, 10, and 38 have been changed. However, if the method of heating differs depending on the location of the printed circuit board due to the layout of the printed circuit board components and the wiring pattern, You may set the 1st, 2nd request | requirement temperature range with respect to every place. Moreover, although the case where the soldering apparatus is a local soldering apparatus has been described in the above embodiment, the present invention can be applied to other soldering apparatuses.

また、紫外線照射装置と電子式のカメラとを使用してプリント基板の上面（部品面）のフラックスの塗布分布を撮影して塗布分布画像情報を取得し、塗布分布画像情報に基づいて生成された実際塗布領域情報と予め定められた必要塗布領域情報とを比較し、また温度センサによりフラックスが塗布されかつ予熱用ヒータにより予熱されたプリント基板の上面の温度分布を測定した第１の温度分布画像情報を取得し、塗布分布画像情報と第１の温度分布画像情報とを比較し、また温度センサによりフラックスが塗布されかつハンダ噴流ノズルによりハンダ付けされたプリント基板の温度分布を測定した第２の温度分布画像情報を取得し、塗布分布画像情報と第２の温度分布画像情報とを比較することにより、プリント基板の上面のフラックスの状態を検査することができ、フラックス塗布時にプリント基板のスルーホールを通してプリント基板の上面に付着したフラックスについて、絶縁信頼性低下の問題を引き起こすフラックスの状態（熱が十分にかかっていないために溶剤や活性成分が残っている状態）を検出することができ、不良なプリント基板の発生を防止することができる。また、絶縁信頼性低下の問題が生じる箇所を表示手段に表示してもよい。 Also, the distribution distribution image information is obtained by photographing the distribution distribution of the flux on the upper surface (component surface) of the printed circuit board using an ultraviolet irradiation device and an electronic camera, and generated based on the distribution distribution image information. A first temperature distribution image obtained by comparing actual application region information with predetermined necessary application region information, and measuring the temperature distribution of the upper surface of the printed circuit board on which the flux is applied by the temperature sensor and preheated by the preheating heater. Information obtained, the application distribution image information is compared with the first temperature distribution image information, and the temperature distribution of the printed circuit board on which the flux is applied by the temperature sensor and soldered by the solder jet nozzle is measured. By acquiring the temperature distribution image information and comparing the application distribution image information and the second temperature distribution image information, the flux of the upper surface of the printed circuit board is It is possible to inspect the state of the flux that adheres to the top surface of the printed circuit board through the through-hole of the printed circuit board during flux application. The state in which the active component remains) can be detected, and the generation of defective printed circuit boards can be prevented. Moreover, you may display on the display means the location where the problem of insulation reliability fall occurs.

本発明に係るハンダ付け方法を実施するための局所ハンダ付け装置を示す概略図である。It is the schematic which shows the local soldering apparatus for enforcing the soldering method which concerns on this invention. 図１に示した局所ハンダ付け装置の一部を示す図である。It is a figure which shows a part of local soldering apparatus shown in FIG. 図１に示した局所ハンダ付け装置の一部を示す図である。It is a figure which shows a part of local soldering apparatus shown in FIG. 図１に示した局所ハンダ付け装置の一部を示す図である。It is a figure which shows a part of local soldering apparatus shown in FIG. 図１に示した局所ハンダ付け装置の一部を示すブロック図である。It is a block diagram which shows a part of local soldering apparatus shown in FIG. 図５の一部詳細ブロック図である。FIG. 6 is a partial detailed block diagram of FIG. 5. 本発明に係る他のハンダ付け方法を実施するための局所ハンダ付け装置を示す概略図である。It is the schematic which shows the local soldering apparatus for enforcing the other soldering method which concerns on this invention.

Explanation of symbols

１…フラクサ
４…カメラ
５…予熱用ヒータ
７…第１の温度センサ
８…プリント基板
９…ハンダ噴流ノズル
１０…ハンダ噴流ノズル
１１…第２の温度センサ
１７…フラックス状態検査処理手段
３１…フラクサ
３４…カメラ
３５…予熱用ヒータ
３７…第１の温度センサ
３８…ハンダ噴流ノズル
４０…第２の温度センサ DESCRIPTION OF SYMBOLS 1 ... Fluxer 4 ... Camera 5 ... Preheater 7 ... 1st temperature sensor 8 ... Printed circuit board 9 ... Solder jet nozzle 10 ... Solder jet nozzle 11 ... 2nd temperature sensor 17 ... Flux state test | inspection processing means 31 ... Fluxer 34 ... Camera 35 ... Preheating heater 37 ... First temperature sensor 38 ... Solder jet nozzle 40 ... Second temperature sensor

Claims

In a soldering method of soldering after applying a flux to a printed circuit board, the distribution distribution of the flux applied to the printed circuit board is photographed by a camera to obtain application distribution image information, and based on the application distribution image information A soldering method characterized in that the actual application area information generated in this way is compared with predetermined required application area information.

2. The soldering method according to claim 1, wherein when the actual application area indicated by the actual application area information is narrower than the required application area indicated by the necessary application area information, the flux application area is widened. .

3. The flux application region is widened by increasing a spray pressure of a fluxer nozzle that applies the flux to the printed circuit board or by increasing a spray time of the fluxer nozzle. Soldering method.

In a soldering method in which soldering is performed after applying flux to a printed circuit board, application distribution image information obtained by photographing an application distribution of the flux applied to the printed circuit board is acquired by a camera, and the flux is detected by a first temperature sensor. First temperature distribution image information obtained by measuring the temperature distribution of the printed circuit board that has been applied and preheated by a preheating heater is acquired, and the application distribution image information is compared with the first temperature distribution image information. Soldering method characterized by

When the temperature of at least a part of the actual application region indicated by the actual application region information generated based on the application distribution image information is lower than the first required temperature region, the preheating time of the preheating heater is lengthened, The soldering method according to claim 4, wherein the preheating temperature of the preheating heater is increased.

In a soldering method in which soldering is performed after applying flux to a printed circuit board, application distribution image information obtained by photographing an application distribution of the flux applied to the printed circuit board by a camera is acquired, and the flux is acquired by a second temperature sensor. Is obtained and second temperature distribution image information obtained by measuring a temperature distribution of the printed circuit board soldered by the solder jet nozzle is acquired, and the application distribution image information and the second temperature distribution image information are compared. A soldering method characterized by that.

When the temperature of at least a part of the actual application region indicated by the actual application region information generated based on the application distribution image information is lower than the second required temperature region, the temperature of the jet solder of the solder jet nozzle is increased. The soldering method according to claim 6, wherein the soldering time by the solder jet nozzle is lengthened.

When the printed circuit board is transported in the first direction after being soldered by the solder jet nozzle that brings the jet solder into contact with one soldering point, the second disposed in the first direction. When the temperature distribution of the printed circuit board is measured by a temperature sensor and the printed circuit board is transported in a second direction orthogonal to the first direction, the second temperature arranged in the second direction. When the temperature distribution of the printed circuit board is measured by a sensor and the printed circuit board is conveyed in an oblique direction with respect to the first and second directions, the second circuit disposed in the first direction is used. The soldering method according to claim 6 or 7, wherein a temperature distribution of the printed circuit board is measured by a temperature sensor and the second temperature sensor arranged in the second direction.

The second soldering that is installed in the vicinity of the solder jet nozzle after being soldered by the solder jet nozzle that causes the jet solder to simultaneously contact all the soldering locations of the printed circuit board, and after the printed circuit board is separated from the jet solder. The soldering method according to claim 6 or 7, wherein the printed circuit board is transported toward the temperature sensor, and the temperature distribution of the printed circuit board is measured by the second temperature sensor.

When the solder jet nozzle is brought into contact with all the soldering locations of the printed circuit board at the same time, the second temperature sensor is moved to the printed circuit board by a temperature sensor moving mechanism when the solder jet nozzle is lowered. The soldering method according to claim 6, wherein the temperature distribution of the printed circuit board is measured by the second temperature sensor.

In a soldering apparatus for soldering after applying a flux to a printed circuit board, a camera that acquires application distribution image information that captures an application distribution of the flux applied to the printed circuit board, and based on the application distribution image information A soldering apparatus comprising: flux state inspection processing means for comparing the generated actual application area information and predetermined required application area information.