JP4454612B2 - Cream solder printing method and cream solder printing apparatus - Google Patents

Description

  The present invention relates to a printing inspection apparatus, a printing inspection method, a printing apparatus, and a method for inspecting an abnormality in a cream solder printing process in which cream solder is printed / applied on a printed circuit board surface.

  Conventionally, when soldering electronic components such as chip components on a circuit board in the manufacture of an electronic circuit board, cream solder is mainly used, and the cream solder is used to print and apply the cream solder in a desired pattern. A printing device is used. This cream solder printing apparatus, for example, moves a plate-like material called a squeegee on a printing screen by sliding it on a printing screen in which openings corresponding to land shapes on a circuit board are formed. The solder paste is printed and applied onto the circuit board through the opening of the printing screen.

  The circuit board on which the cream solder is printed / applied by the cream solder printing apparatus is subjected to the cream solder printing state by the cream solder printing inspection apparatus 62 arranged at the rear stage of the board conveying direction of the cream solder printing apparatus 61 shown in FIG. inspect. The cream solder printing inspection device 62 captures an image of the pattern of the solder paste printed on the circuit board by taking an image of the circuit board on which the solder paste is printed, and prints the solder paste based on the image data. It is determined whether or not an abnormality (for example, fading, blurring, displacement, bridge, etc.) has occurred. When a printing abnormality occurs, the circuit boards in which the printing abnormality has occurred are sequentially stocked in the NG stocker 63 arranged at the subsequent stage of the cream solder printing inspection apparatus 62, and production by the production line is continued as it is. Moreover, in the cream solder printing apparatus 61 which is a pre-process of the cream solder printing inspection apparatus 62, the printing screen is cleaned in an arbitrarily set cycle.

  However, in the conventional cream solder printing inspection apparatus 62, even if a printing abnormality occurs in the printing process, the production conditions in the printing process are corrected by simply removing the circuit board having the printing abnormality from the production line. Production will continue without any change. For this reason, once an abnormality occurs, a large number of circuit boards with printing abnormalities are produced. In addition, the cream solder printing device cleans the printing screen in a set cycle regardless of the printing result, so cleaning is performed when it is not necessary or when cleaning is necessary. It causes a situation such as not being broken.

  As described above, conventionally, a circuit board that causes a printing abnormality after a printing abnormality occurs is wasted and continuously produced, or the printing screen is wasted and the tact is reduced, or when cleaning is necessary. In this case, there is a problem that the productivity of the production line is lowered by causing the printing abnormality without being cleaned.

  The present invention has been made in view of such a conventional situation, and when an abnormality occurs in the cream solder printing process, the production is prevented from continuing with the abnormal printing, thereby improving the productivity. The present invention provides a solder paste printing inspection method, a printing inspection apparatus, a printing apparatus, and a method for improving the yield of non-defective products.

  In order to achieve the above object, a method for inspecting cream solder printing according to the present invention provides a solder paste on a circuit printed by a cream solder printing apparatus capable of printing cream solder on a predetermined pattern of a circuit board on which electronic components are mounted. In the cream solder printing inspection method for monitoring a printing state, when an abnormality in a printing process by the cream solder printing apparatus is detected, the cream solder printing apparatus is notified of abnormality information, and the circuit board that causes the printing abnormality is printed. It is characterized by being stopped.

  In this cream solder printing inspection method, when an abnormality in the printing process by the cream solder printing apparatus is detected, printing of the circuit board that causes the printing abnormality is stopped by notifying the cream solder printing apparatus of the abnormality information. For this reason, it is possible to prevent the wasteful continuous production of the circuit board that causes the printing abnormality after the printing abnormality occurs, and it is possible to improve the productivity and the yield rate.

  Further, the printing inspection method for cream solder according to the present invention may be such that the detection of an abnormality in the printing process is determined to be abnormal when a circuit board determined to be abnormal in printing occurs a predetermined number of times or more. good.

  In this cream solder printing inspection method, when a circuit board determined to be printing abnormal occurs more than a preset reference number of times, it is determined that the printing process is abnormal. It is possible to prevent the abnormality from being determined, and it is possible to perform a more accurate and stable abnormality determination in the printing process.

  Further, the printing inspection method for cream solder according to the present invention is such that the detection of an abnormality in the printing process is performed by multiplying the reference number of times by an apparatus abnormality determination magnification that is arbitrarily set, and the value obtained thereby is used as the reference value. It may be used as the number of times.

  In this cream solder printing inspection method, by setting the reference number by multiplying the arbitrarily set device abnormality determination magnification by the reference number, the sudden fatal production abnormality in the previous process of the cream solder printing inspection device can be prevented. Even if it occurs, it is possible to more reliably stop the apparatus and prevent the production of a circuit board having a printing abnormality.

  The cream solder printing inspection method of the present invention may stop monitoring the printing state of the cream solder when an abnormality in the printing process is detected.

  With this cream solder printing inspection method, when an abnormality in the printing process is detected in the cream solder printing apparatus, the circuit board is newly carried into the cream solder printing inspection apparatus by stopping the monitoring of the cream solder printing state. Accordingly, the circuit board is not carried out of the cream solder printing apparatus, and the production process is temporarily stopped.

  Further, the method for inspecting the printing of cream solder according to the present invention is to clean the printing screen of the cream solder printing apparatus when an abnormality of at least one of blurring, blurring and bridge is detected in the printing process. Also good.

  In this cream solder printing inspection method, printing in the cream solder printing apparatus is performed by cleaning the printing screen when an abnormality occurs in the printing process due to at least one of “fading”, “smearing”, and “bridge”. The condition can be returned to a good state. In addition, since cleaning is performed when the printing screen needs to be cleaned, unnecessary cleaning is prevented and tact-up can be achieved.

  Moreover, the printing inspection method of the cream solder according to the present invention may be configured such that the printing screen of the cream solder printing apparatus is aligned again when a deviation abnormality is detected in the printing process.

  In this cream solder printing inspection method, when an abnormality occurs in the printing process due to “deviation”, the target mark of the printing screen is re-recognized, and the printing screen is aligned again, thereby the printing screen. Therefore, the occurrence of printing abnormality can be prevented.

  Moreover, the printing inspection apparatus for cream solder according to the present invention monitors the printing state of the cream solder on the circuit printed by the cream solder printing apparatus capable of printing the cream solder on a predetermined pattern of the circuit board on which the electronic component is mounted. An apparatus for inspecting cream solder printing, comprising: illumination means for irradiating light onto a circuit board printed with cream solder; and imaging means for receiving reflected light from the circuit board to obtain image data on the entire circuit board; , Image processing means for extracting a cream solder area on the circuit board from the imaged image data, image measuring means for measuring the feature quantity of the extracted cream solder area, and measurement by the image measuring means An abnormality determination unit that determines the occurrence of a printing abnormality of cream solder based on the result, and the clearing according to the occurrence state of the printing abnormality by the abnormality determination unit. An abnormality control means for detecting an abnormality in the printing process of the solder printing apparatus and notifying the cream solder printing apparatus of the abnormality information when the abnormality is detected, thereby stopping the printing operation of the circuit board that causes the printing abnormality And the abnormality determining means multiplies the circuit board determined to be printing abnormal by a predetermined reference number or more, or by multiplying the reference number of times by an apparatus abnormality determination magnification that is arbitrarily set. The value obtained in this way is used as the reference number, and it is determined that an abnormality has occurred when a printing abnormality of the reference number has occurred.

  In this cream solder printing inspection apparatus, light is applied to the circuit board on which the cream solder is printed by the illumination means, and reflected light from the circuit board is received by the imaging means to obtain image data of the entire circuit board, The cream solder area on the circuit board is extracted from the image data by the image processing means, and the cream solder printing abnormality occurs based on the result of measuring the feature amount of the extracted cream solder area by the image measuring means. Is determined by the abnormality determination means. An abnormality in the printing process of the cream solder printing device is detected according to the occurrence state of the printing abnormality by the abnormality determining means, and abnormality information is sent to the cream solder printing apparatus by the abnormal time control means when an abnormality in the printing process is detected. By notifying, the printing operation of the circuit board that causes the printing abnormality is stopped. As a result, it is possible to prevent wasteful continuous production of a circuit board that causes a printing abnormality after a printing abnormality occurs, and it is possible to improve productivity and improve the yield rate. In addition, in this cream solder printing inspection device, by setting the reference number by multiplying the arbitrarily set device abnormality determination magnification by the reference number, sudden fatal production of the previous process of the cream solder printing inspection device Even if an abnormality occurs, the apparatus can be stopped more reliably and the production of a circuit board having a printing abnormality can be prevented.

  Also, the cream solder printing inspection apparatus according to the present invention is suitable for printing to the cream solder printing apparatus when the abnormality control means detects at least one abnormality of blurring, blurring and bridging in the printing process. A cleaning request signal for cleaning the screen may be output.

  In this cream solder printing inspection device, when an abnormality occurs in the printing process due to at least one of “smear”, “smudge”, and “bridge”, the cream solder printing device receives a cleaning request signal and cleans the printing screen. By doing so, the printing conditions of the cream solder printing apparatus can be returned to a good state. In addition, since cleaning is performed when the printing screen needs to be cleaned, unnecessary cleaning is prevented and tact-up can be achieved.

  Further, the cream solder printing inspection apparatus according to the present invention is a position for the abnormality control means to cause the cream solder printing apparatus to correct the position of the printing screen when a deviation abnormality is detected in the printing process. A correction request signal may be output.

  In this cream solder printing inspection apparatus, when an abnormality of the printing process due to “deviation” occurs, the cream solder printing apparatus receives the position correction request signal, re-recognizes the target mark on the printing screen, and then reprints the printing screen. By performing the above alignment, the deviation of the printing position of the printing screen is corrected, and the occurrence of printing abnormality can be prevented.

  The cream solder printing method of the present invention carries a circuit board to be printed into the apparatus, receives the placed circuit board, places it, moves it to the lower surface of the printing screen, and places it on the lower surface of the printing screen. A cream solder printing method in which cream solder is printed on a circuit board by moving a squeegee on the upper surface of the positioned and superposed circuit board and the printing screen, and the solder paste printing of the circuit board in which the cream solder is printed in a predetermined pattern When the state is inspected and the solder printing state is abnormal, the printing may be stopped.

  In this cream solder printing method, when the cream solder printing state of the circuit board on which the cream solder is printed in a predetermined pattern is inspected, and the solder printing state is abnormal, the circuit board that causes the printing abnormality by stopping printing Printing is stopped. For this reason, it is possible to prevent the wasteful continuous production of the circuit board that causes the printing abnormality after the printing abnormality occurs, and it is possible to improve the productivity and the yield rate.

  The cream solder printing method of the present invention may stop monitoring the printing state of the cream solder when an abnormality in the printing state is detected.

  In this cream solder printing method, when an abnormal printing state is detected, the production process is temporarily stopped by stopping the monitoring of the cream solder printing state.

  Further, the cream solder printing apparatus of the present invention includes a circuit board carry-in section for carrying a circuit board to be printed into the apparatus, and a table for receiving and placing the carried circuit board and moving it to the lower surface of the printing screen. A printing part for printing cream solder on the circuit board by moving a squeegee, a cleaning part for cleaning the printing screen, and a printing unit. A cream solder printing apparatus comprising: a circuit board carry-out portion for carrying out a circuit board that has been carried out; and a mark recognition device for recognizing the alignment marks on the circuit board and the printing screen. The circuit board that is printed out from the carry-out section after the cream solder is printed in a predetermined pattern by the solder printer If the solder printing state is abnormal by the cream solder printing inspection apparatus arranged in a direction subsequent stage it may be as to stop the printing operation.

  In this cream solder printing apparatus, the solder printed state is monitored by a cream solder printing inspection apparatus arranged at a later stage in the board conveying direction after the cream solder is printed in a predetermined pattern and carried out from the carry-out section. .

  Further, the cream solder printing apparatus of the present invention may be configured such that the printing screen of the cream solder printing apparatus is cleaned by a cleaning unit when at least one abnormality of blurring, blurring, or bridge is detected.

  In this cream solder printing apparatus, when an abnormality occurs in the printing process due to at least one of “fading”, “bleeding”, and “bridge”, the printing screen is cleaned to return the printing condition to a good state. be able to. In addition, since cleaning is performed when the printing screen needs to be cleaned, unnecessary cleaning is prevented and tact-up can be achieved.

  Moreover, the cream solder printing apparatus of this invention is good also as what aligns the printing screen of the said cream solder printing apparatus again, when abnormality of a shift | offset | difference is detected.

  In this cream solder printing device, when an abnormality occurs in the printing process due to “deviation”, the target mark on the printing screen is re-recognized, and the printing screen is aligned again, thereby printing the printing screen. The misalignment is corrected, and the occurrence of printing abnormality can be prevented.

  According to the cream solder printing inspection method, the printing inspection apparatus, the printing apparatus, and the method of the present invention, when the abnormality of the printing process by the cream solder printing apparatus is detected, the cream solder printing apparatus is notified of the abnormality information, A request to stop the printing process can be made to the cream solder printing device, and when the abnormality is detected, the monitoring of the cream solder printing state is stopped, so that a new circuit board is added to the cream solder printing inspection device. The production process is temporarily stopped without being carried in. For this reason, it is possible to prevent the wasteful continuous production of the circuit board that causes the printing abnormality after the printing abnormality occurs, and it is possible to improve the productivity and the yield rate.

Hereinafter, the solder paste printing method according to the invention and a printing inspection apparatus and a printing apparatus and an embodiment of its way, will be described in detail with reference to the accompanying drawings. In addition, the cream solder in this specification refers to paste solder in which powder solder is mixed with high-viscosity flux.

  First, the configuration of the cream solder printing apparatus will be described. FIG. 1 is a perspective view showing a schematic configuration by cutting out a part of the cream solder printing apparatus 100. In FIG. 1, a cream solder printing apparatus 100 receives a circuit board carry-in part A that carries a circuit board 3 to be printed with cream solder into the apparatus, and receives and places the carried circuit board 3, and a printing screen. A table part B that moves to the lower surface of the printing board 5, a circuit board 3 that is positioned and superimposed on the lower surface of the printing screen 5, and a printing part C that prints cream solder on the circuit board 3 by moving the squeegee. By recognizing the cleaning part D for cleaning the printing screen, the circuit board unloading part (not shown) for carrying out the printed circuit board 3, and the alignment marks for the circuit board 3 and the printing screen 5, respectively. And a mark recognizing device (not shown) for aligning the positions.

  In this cream solder printing apparatus 100, the circuit board carry-in part A receives the circuit board 3 carried in from a stocker or a line, and supplies the circuit board 3 to the table part B arranged inside the printing apparatus. The table part B positions and fixes the supplied circuit board 3 by recognizing a substrate mark for alignment using a mark recognition device. Then, the table part B is moved so that the circuit board 3 is arranged at the printing position on the lower surface of the printing screen 5 of the printing part C. Note that the mark recognition device sets the printing position with high accuracy by recognizing the target mark for alignment of the printing screen in advance. In general, two target marks are provided at diagonal positions on the printing screen 5.

When printing by the printing unit C is completed, the table unit B transports the circuit board 3 from the printing unit C to the position of the circuit board carry-out unit. Thereafter, the circuit board carry-out unit takes out the circuit board 3 from the table part B and carries the circuit board 3 to a transfer outlet (not shown). When cleaning the printing screen 5, the table B is retracted from the lower surface of the printing screen 5, and then the cleaner roll paper 7 of the cleaning unit D is slid while being in sliding contact with the lower surface of the printing screen 5.
The circuit board carry-in part A, the circuit board carry-out part, and the table part B described above can use a loader, an unloader, and a four-axis stage that are generally widely used.

  FIG. 2 shows a perspective view in which the table portion B and the printing portion C are partially displayed in cross section. The table part B sandwiches and fixes the circuit board 3 by the holding member 9, and the substrate mounting table 10 to which the circuit board 3 is fixed is moved and rotated by motor control in the X, Y, Z, and θ directions shown in the figure. It is possible. According to this configuration, the pair of squeegees 12 a, 12 a on the upper side of the printing screen 5 in a state where the circuit board 3 fixed on the substrate mounting table 10 by the holding member 9 is disposed on the lower side of the printing screen 5. The solder paste is printed on the circuit board 3 by moving 12b in both printing directions a and b indicated by arrows in the drawing. The squeegees 12a and 12b normally stand by at the raised position, and are used by lowering the squeegee 12a when printing in the a direction, and lowering and using the squeegee 12b when printing in the b direction.

  FIG. 3 is a schematic plan view for explaining the operation of the cleaning unit D. The cleaning section D arranged on the lower surface side of the printing screen 5 supports a roll 16 around which the cleaner roll paper 7 is wound and supported on one side, and the cleaner roll paper 7 drawn out from this roll is supported on the other side. It is locked on the side roll 18 and wound up. A cleaning contact portion 20 (see FIG. 1) is formed between the roll 16 and the roll 18 to support the cleaner roll paper 7 by projecting upward with two parallel shafts. The cleaning unit D is slid to the printing screen 5 side when a cleaning command is input to a control device (not shown), and in the direction of arrow c in the figure while bringing the cleaning contact unit 20 into sliding contact with the lower surface of the printing screen 5. Moving. As a result, the excess cream solder on the lower surface of the printing screen 5 is wiped off, the dirt on the surface is removed, and the printing screen 5 with no clogging in the screen opening hole is obtained.

  The circuit board 3 printed in a predetermined pattern by the cream solder printing apparatus 100 having the above-described configuration and carried out from the carry-out portion is subjected to the solder printing state by the cream solder printing inspection apparatus arranged at the rear stage in the board conveying direction. Be monitored.

  The present invention is characterized in that, when an abnormality occurs in the cream solder printing process by the cream solder printing apparatus 100, abnormality information is notified to the previous process. According to this configuration, when a printing abnormality occurs, it is possible to prevent the production from being continued under the production conditions with the previous process as it is.

Next, the cream solder printing inspection apparatus according to the present invention will be described. FIG. 4 shows a conceptual configuration diagram of the cream solder printing inspection apparatus.
The cream solder printing inspection apparatus 200 receives the reflected light from the circuit board 3 and the illumination means 30 composed of, for example, two cathode tubes arranged in parallel to irradiate light onto the circuit board 3 on which the cream solder is printed. An imaging unit 32 composed of a color line sensor, a moving unit 34 such as an XY stage for obtaining image data of the entire surface of the circuit board 3 by moving the imaging unit 32 relative to the circuit board 3 at a predetermined speed, and imaging Based on the measurement results, the image processing means 36 for extracting the cream solder area from the image data, the image measuring means 38 for measuring the area value, the center position, the bridge width, etc. of the extracted cream solder area. An abnormality determination means 40 for determining the occurrence of printing abnormality of the cream solder, and the cream solder printing apparatus 10 according to the state of occurrence of the printing abnormality by the abnormality determination means 40 An abnormality control means 42 for detecting an abnormality in the printing process and notifying the cream solder printing apparatus 100 of the abnormality information when the abnormality is detected, and stopping the printing operation of the circuit board that causes the printing abnormality. It is provided as a component.

The cream solder printing inspection apparatus 200 having the above-described configuration is arranged at the rear stage in the board conveying direction of the cream solder printing apparatus 100, as shown in FIG. 5 which shows a production line including the cream solder printing inspection apparatus. The print inspection process of this embodiment by the cream solder print inspection apparatus 200 will be described with reference to the flowchart showing the procedure of the print inspection process in FIG.
The cream solder printing inspection apparatus 200 first receives the circuit board 3 on which the cream solder is carried out from the cream solder printing apparatus 100 and carries it into the inspection apparatus 200 (step 10; hereinafter, abbreviated as S10). The circuit board 3 carried in is illuminated from above by the illumination means 30, and the entire circuit board 3 is imaged while moving the imaging means 32 relative to the circuit board 3 by the moving means 34 (S11). Thereby, color image data on the surface of the circuit board 3 is obtained.

  Next, the obtained color image data is subjected to, for example, an extraction process with respect to a specific color by the image processing unit 36 to reveal the cream solder application area, and further binarize to extract the cream solder application area. And the area value, center position, bridge width, etc. are measured by the image measurement means 38 with respect to the extracted cream solder application area (S12).

  The abnormality determination means 40 compares the obtained image measurement result with a value in a normal printing state or a preset good product limit value to determine whether a cream solder printing abnormality has occurred on the circuit board 3 (S13). . Here, printing abnormalities include “blur” due to insufficient supply of cream solder or clogging of the printing screen 5, “smudge” due to excessive supply of cream solder or contamination of the printing screen 5, and the printing screen 5. Examples include “displacement” due to a decrease in alignment accuracy with the circuit board 3, “bridge” that joins adjacent lands due to excessive supply of cream solder, breakage of the printing screen 5, and the like.

When it is determined that no printing abnormality has occurred, the circuit board 3 is unloaded from the cream solder printing inspection apparatus 200 (S14), passed through the subsequent NG stocker 300, and conveyed to the next process as a non-defective printed board. .
On the other hand, when it is determined that a printing abnormality has occurred, the number of occurrences of the circuit board having the printing abnormality is counted by the abnormality control means 42 (S15), and the counted number of occurrences of the printing abnormality board is preset. When the predetermined reference number N is exceeded, loading of a new circuit board 3 to the cream solder printing inspection apparatus 200 is stopped (S16), and abnormality information notification such as displaying an apparatus abnormality signal is performed. (S17), the apparatus is stopped (S18). Then, the circuit board 3 that has received the abnormality determination is accommodated in the NG stocker 300 (S19). When the number of printed abnormal boards does not reach the reference number N, the circuit board 3 that has been judged to be abnormal is housed in the NG stocker 300 (S16) and the next circuit board 3 is awaited to be loaded.

  Here, the number of occurrences of abnormally printed substrates may be the number of consecutive occurrences of abnormally printed substrates, and is determined from the frequency of occurrence of abnormally printed substrates (including when they occur intermittently). In order to do this, the total number of occurrences of printing abnormal substrates may be used.

  Thus, according to the cream solder printing inspection apparatus 200 of the present embodiment, when the occurrence of printing abnormality is detected, the cream solder printing inspection apparatus 200 is stopped, so that the production is continued under the same conditions as the previous process. Thus, it is possible to prevent the continuous production of circuit boards having abnormal printing. Thereby, it can prevent that the productivity in a production line falls, and can improve the quality rate of a product.

Next, a second embodiment of the cream solder printing inspection apparatus according to the present invention will be described. FIG. 7 shows a production line including the cream solder printing inspection apparatus according to this embodiment.
In the present embodiment, the apparatus configuration is the same as that of the first embodiment described above, and the reference number N to be compared with the number of occurrences of abnormal printing substrates is multiplied by the apparatus abnormality determination magnification G stored in advance in the abnormality determination means 40. Value is set. Thus, by setting the reference number N by multiplying the reference number N by the magnification G, it is more reliable when a sudden fatal production abnormality in the previous process in which printing abnormal substrates occur continuously occurs. It is possible to prevent the production of a circuit board having an abnormal printing by stopping the apparatus. In this case, as the number of occurrences of abnormally printed substrates, the number of consecutively generated abnormally printed substrates is used.

Next, a third embodiment of the cream solder printing inspection apparatus according to the present invention will be described. FIG. 8 shows a diagram for explaining notification of abnormality information to the cream solder printing apparatus according to the present embodiment.
The cream solder printing inspection apparatus 200 according to the present embodiment detects the occurrence of printing abnormality on the circuit board, and when the stop condition of the apparatus described in the first and second embodiments is satisfied, An apparatus stop request signal is transmitted to the printing apparatus 100. When this apparatus stop request signal is input to the cream solder printing apparatus 100, the cream solder printing apparatus 100 stops the printing process by interrupt processing and stops the production of the circuit board that causes the printing abnormality.

In this way, when a printing abnormality occurs, it is possible to stop the production of the previous process instantly by outputting the device stop signal directly to the previous process, and waste the circuit board that causes the printing abnormality. Production is prevented.
The device stop signal can be output together with the abnormality information notification signal from the abnormality determining means 40, and can be easily realized by adding, for example, a 1-bit signal.

Next, a fourth embodiment of the cream solder printing inspection apparatus according to the present invention will be described. FIG. 9 is an explanatory diagram for explaining the notification of abnormality information to the cream solder printing apparatus according to the present embodiment.
The cream solder printing inspection apparatus 200 according to the present embodiment requests a cleaning request to the cream solder printing apparatus 100 when the image measuring unit 38 detects at least one of “sludge”, “smudge”, and “bridge” of cream solder. Send a signal. When this cleaning request signal is input to the cream solder printing apparatus 100, the cream solder printing apparatus 100 stops the printing process by interruption processing, operates the cleaning unit D, and cleans the printing screen 5.

  As described above, the printing process is stopped by the interruption process, and the printing screen 5 is cleaned, so that the stain on the printing screen 5 that causes the printing abnormality is removed and the printing state is improved. The printing device can be returned. Also, as compared with the case where the printing screen is cleaned in an arbitrarily set cycle regardless of the printing result, the cleaning is not performed until the time when cleaning is necessary, so the printing screen is wasted. It is possible to prevent the cleaning or the cleaning from not being performed at a necessary time, thereby improving the tact time and improving the productivity of the production line.

Next, a fifth embodiment of the cream solder printing inspection apparatus according to the present invention will be described. FIG. 10 is an explanatory diagram for explaining notification of abnormality information to the cream solder printing apparatus according to the present embodiment.
The cream solder printing inspection apparatus 200 according to the present embodiment transmits a position correction request signal to the cream solder printing apparatus 100 when the image measuring unit 38 detects “deviation” of the cream solder. When this position correction request signal is input to the cream solder printing apparatus 100, the cream solder printing apparatus 100 stops the printing process by interruption processing and re-executes target mark recognition for alignment of the printing screen 5.

As described above, the printing process is stopped by the interruption process, and the printing screen 5 is aligned again, thereby correcting the deviation of the printing position of the printing screen 5 that causes the printing abnormality, thereby achieving good printing. The printing apparatus can be returned to a state. Thereby, productivity of a production line can be improved.
Note that the present invention is premised on the case of printing / coating, and in the embodiment of the present invention, the description has been given mainly for the case of printing cream solder. The case of application is also included.

  According to the cream solder printing inspection method, the printing inspection apparatus, the printing apparatus, and the method of the present invention, when the abnormality of the printing process by the cream solder printing apparatus is detected, the cream solder printing apparatus is notified of the abnormality information, A request to stop the printing process can be made to the cream solder printing device, and when the abnormality is detected, the monitoring of the cream solder printing state is stopped, so that a new circuit board is added to the cream solder printing inspection device. The production process is temporarily stopped without being carried in. For this reason, it is possible to prevent the wasteful continuous production of the circuit board that causes the printing abnormality after the printing abnormality occurs, and it is possible to improve the productivity and the yield rate.

It is the perspective view which showed a schematic structure by notching a part of cream solder printing apparatus. It is the perspective view which displayed the table part and the printing part in the partial cross section. It is a schematic plan view illustrating the operation of the cleaning unit. It is a notional block diagram of a cream solder printing inspection apparatus. It is a figure which shows the production line containing the printing inspection apparatus of the cream solder which concerns on this invention. It is the flowchart which showed the procedure of the printing inspection process in the printing inspection method of the cream solder which concerns on this invention. It is a figure which shows the production line containing the cream solder printing inspection apparatus in 2nd Embodiment. It is a figure explaining the notification of the abnormal information to the cream solder printing apparatus by 3rd Embodiment. It is a figure explaining the notification of the abnormal information to the cream solder printing apparatus by 4th Embodiment. It is a figure explaining the notification of the abnormal information to the cream solder printing apparatus by 5th Embodiment. It is a figure which shows the production line containing the conventional cream solder printing inspection apparatus.

Explanation of symbols

3 Circuit board 5 Printing screen 7 Cleaner roll paper 12a, 12b Squeegee 30 Illuminating means 32 Imaging means 34 Moving means 36 Image processing means 38 Image measuring means 40 Abnormality determining means 42 Abnormality controlling means 100 Cream solder printing apparatus 200 Cream solder printing Inspection device 200 Inspection device 300 NG stocker C Printing unit D Cleaning unit G Device abnormality determination magnification N Reference count

Claims (5)

The circuit board to be printed is carried into the apparatus, the circuit board carried in is received, placed, moved to the lower surface of the printing screen, and the circuit board and the printing screen positioned and superimposed on the lower surface of the printing screen A cream solder printing method for printing cream solder on a circuit board by moving a squeegee on the upper surface of
When the cream solder printing state of the circuit board on which the cream solder is printed in a predetermined pattern is inspected and the solder printing state is abnormal, in the process of stopping printing,
Detection of errors in the printing process, printing in order to stop the apparatus when the abnormality substrate abnormal production of printing process that occurs continuously occurs, the reference number of times a print abnormality determined as the circuit board is set in advance A solder solder printing method characterized in that a value obtained by multiplying an arbitrarily set device abnormality determination magnification with respect to the reference number is used as the reference number, and it is determined that an abnormality has occurred when a printing abnormality of the reference number occurs. .   The cream solder printing method according to claim 1, wherein monitoring of the printing state of the cream solder is stopped when an abnormality in the printing state is detected. A circuit board carry-in section for carrying a circuit board to be printed into the apparatus, a table section for receiving and placing the carried circuit board and moving it to the lower surface of the printing screen, and a positioning and overlapping on the lower surface of the printing screen Printed circuit board and printing screen for printing cream solder on the circuit board by moving the squeegee on the upper surface of the printed circuit board and printing screen, cleaning section for cleaning the printing screen, and circuit board unloading section for carrying out the printed circuit board when the device in the case where the mark recognition device for aligning each by recognizing the alignment mark of the printing screen and the circuit board, production of the printing process the printing abnormal substrate continuously generated abnormality occurs In order to stop the circuit board that has been determined to be printing abnormal, an apparatus error that is arbitrarily set with respect to a preset reference count is further determined. And a cream solder printing inspection apparatus having the abnormality determination means determines an abnormality occurs when the value obtained by multiplying the determined ratio and the reference number printed abnormality of the reference number is generated,
When the solder printing state is abnormal by the cream solder printing inspection device in which the circuit board that is printed in the predetermined pattern by printing the cream solder by the cream solder printing device and is carried out from the carry-out portion is disposed in the subsequent stage in the substrate transport direction, A cream solder printing apparatus characterized by stopping a printing operation.   4. The cream solder printing apparatus according to claim 3, wherein the printing screen of the cream solder printing apparatus is cleaned by a cleaning unit when at least one abnormality of blurring, blurring, or bridge is detected.   4. The cream solder printing apparatus according to claim 3, wherein when a deviation abnormality is detected, the printing screen of the cream solder printing apparatus is aligned again.

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