JP3065750B2 - Soldering inspection correction device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering inspection and correction device for detecting and correcting a defective portion of a solder portion of a circuit board and performing a re-inspection.

[0002]

2. Description of the Related Art In general, in a printed circuit board used for an electronic device or the like, leads of various components to be mounted are inserted into through holes which have been opened in advance, and a portion of the lead inserted opposite to the component mounting surface is inserted. (Hereinafter, referred to as a solder surface). When soldering by inserting the lead of the component into this through hole,
Occasionally, a connection state (hereinafter, referred to as a bridge) including a short circuit occurs between one solder portion and another solder portion different from the one solder portion, or holes are formed due to insufficient soldering. A state (hereinafter, referred to as a hole) may occur, and it is necessary to inspect each substrate for the presence or absence of such a defective portion.

[0003] Inspection of these bridges and holes can be performed by visual inspection. However, in order to improve inspection accuracy and save labor, inspection systems using image recognition have recently been used. In the inspection by image recognition, the solder surface of the substrate is recognized as an image in advance, and the presence or absence of a bridge or a hole is inspected based on the image. In the case of inspecting a hole by this method, for example, first, the position of a solder portion of a substrate to be inspected or a through-hole of a substrate having the same pattern as the substrate and having no components mounted thereon is designated as a solder surface. It is recognized as an image from.

Next, in the inspection, light is irradiated to the solder surface of the substrate to be inspected, and the reflected light is captured as an image. Then, if a hole is generated in the solder part of the board,
Since light is not reflected at this hole, the hole is recognized as a shadow on the image. Then, the shadow portion can be detected by comparing the previously recognized image with the solder portion of the image obtained from the board to be inspected.

On the other hand, in the bridge inspection, light is radiated to the image pickup device from a predetermined direction, and the reflected light of the portion that has protruded from the substrate surface is captured on an image. If a bridge has occurred in the gap with the solder portion, the lead of each component, the solder portion, and the bridge are recognized as a bright portion on the image.

In the case where a bridge is detected on a board subjected to the inspection in this way, conventionally, to correct the bridge, an operator manually melts the bridge portion with a soldering iron and removes a bamboo pin member or the like. It was modified by beveling and removing it. For the holes, so-called soldering robots have been used, in which soldering is manually performed again to reinforce and correct, or automated. The soldering robot performs re-soldering by moving a soldering iron with an automatic hand having a solder supply function on a substrate on which a defective portion due to insufficient soldering is detected.

[0007]

However, the above-described conventional hole inspection and bridge inspection in the solder portion and correction of these defective portions have the following problems.

(1) In the hole inspection, the hole is recognized as a shadow portion and the substrate surface is recognized as a bright portion. In the bridge inspection, the bridge is recognized as a bright portion and the substrate surface is recognized as a shadow portion. Because the position of the light source is different for each inspection, especially in the bridge inspection, the protruding state of the bridge from the board surface is different individually,
It was difficult to set the position of the light source for reliable detection, and each inspection had to be performed separately.

(2) In particular, in the bridge inspection, in order to surely catch the reflection of light at the outlying portion, the mask which is usually applied to the solder surface and indicates the circuit configuration and the like must be black. In addition, when the produced circuit board is mounted on various devices, the mask display is difficult to identify, which sometimes causes inconvenience in performing maintenance management.

[0010] (3) In the repair work of the bridge, since the form of the generated bridge is individually indefinite and the amount of adhesion is not quantitative, the operator is still skilled in cutting the bridge while watching the molten state of the bridge. In order to automate this as it is, the equipment becomes complicated and the reliability is questioned.

(4) In the solder portion of the board, many of the leads inserted into the through holes are provided with a so-called clinch, which is slightly bent at the tip for the purpose of preventing the components from falling off in the board assembling process. Therefore, a hole is likely to occur on the side opposite to the clinch direction, but in a solder robot that performs hole correction, the soldering iron is always upright based on the input position information, and its tip is positioned directly above the center of the defective part. Since soldering was performed by contacting and heating, more solder was used than necessary to fill the hole, and heating was performed over the entirety of the lead and through-hole conductive material. Not very good.

(5) A soldering iron is brought into contact with the solder portion where a hole is generated from the side opposite to the clinch direction, as in the soldering work by hand with the above solder robot,
If solder is to be welded so as to compensate for the insufficient amount of solder, it takes a great deal of time to input control information to the solder robot in advance for each pattern on the substrate.

(6) Due to differences in bridge and hole inspection techniques, difficulty in correcting the bridge, and problems due to the trouble of inputting information in the solder robot, a system for performing these inspections and corrections as a series of steps has been developed. There was no equipment.

That is, the present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to perform a bridge inspection and a hole inspection in the same process, and furthermore, based on a result of the detection, have a simple configuration. An object of the present invention is to provide an automated soldering inspection and correction device for performing a repair operation of a bridge and a hole that is more similar to a manual operation.

[0015]

In order to solve the above-mentioned problems, a soldering inspection and correction apparatus according to the present invention is provided with a transfer path for transferring a substrate with a solder surface facing upward, and a transfer path provided above the transfer path. , a test mechanism for bridge inspection and hole inspection from the solder surface for the solder portion of the substrate, provided in the transport direction downstream side of the inspection mechanism above the transport path, which is detected by the inspection mechanism bridge
A correction mechanism for performing a split correction on the holes detected by the inspection mechanism and a correction mechanism for performing a soldering correction on the holes detected by the inspection mechanism, and provided above the transport path on the downstream side in the transport direction of the correction mechanism and corrected by the correction mechanism. A re-inspection mechanism for re-inspection of the solder portion of the substrate, wherein each of the inspection mechanism and the re-inspection mechanism is provided with an imaging unit provided to face the transport path, A first light source that is provided to face and irradiates the solder surface with light from a predetermined direction, and that is provided to face or near the periphery of the transport path,
A second light source for irradiating the solder surface with light from a plurality of directions, and an image of the solder surface captured by the imaging unit.
The light from the first light source is reflected from the shadow portion to diffusely reflect the light.
To detect the shadow part between the solder part and the solder part
Bridge, and detects the bridge by the imaging means.
Do not reflect the light from the second light source based on the image on the
Discriminating means for detecting holes by detecting shadows
The correction mechanism includes an arm suspended above the transport path and formed movably in a predetermined space, and a spatula member protruding from a lower end of the arm and slightly moving in a horizontal direction. And a hot air nozzle provided adjacent to the spatula member and blowing hot air toward the vicinity of the tip of the spatula member, and a soldering iron provided at a lower end of the arm,
And a solder supply nozzle which is provided adjacent to the soldering iron and supplies solder toward the tip of the soldering iron.

[0016]

When a substrate to be inspected is loaded into a transport path with the solder surface facing upward, an inspection mechanism, a correction mechanism, and a re-inspection mechanism are sequentially provided along the transport direction above the transport path. After the bridge inspection and the hole inspection are performed by the inspection mechanism, the board in which the defective portion is detected is corrected by the correction mechanism, and then the inspection is performed again by the re-inspection mechanism.

In the bridge inspection by the inspection mechanism, light is emitted from a first light source provided opposite to the transport path to a solder surface of the substrate from a predetermined direction, and an image of the solder surface is captured by an imaging means. Since the light from the predetermined direction is irregularly reflected by the solder portion and the bridge that protrude from the board surface of the board and these are recognized as shadow portions, when a shadow portion is detected on the flat surface between the solder portion and the solder portion, This is determined as a bridge by the determination means.

In the hole inspection, a soldering surface of the substrate is irradiated with light from a plurality of directions from a second light source provided opposite to or near the transport path, and an image of the soldering surface is captured by an imaging means. On the board surface of the board and on the soldering part that emerges, some of the light from multiple directions is always reflected on the imaging means, so these are recognized as bright parts, and only the immersed holes have no reflection of light and serve as shadow parts. Will be recognized
When a shadow part is detected in the solder part, this is determined as a hole by the determination means.

After the inspection, when the substrate is carried into the correction mechanism, an arm movably formed within a predetermined space is suspended above the transport path, and the arm or bridge which detects the arm is bridged. Move toward. Then, a spatula-shaped member is protrudingly provided at the lower end of the arm, and a hot air nozzle is provided adjacent thereto, so that when a bridge is generated, the spatula-shaped member is brought close to the defective portion, Hot air is blown toward the tip of the spatula-like member to melt the bridge, and then the spatula-like member is slightly moved in the horizontal direction to divide the bridge. When a hole is generated, a soldering iron is provided at the lower end of the arm, and a solder supply nozzle is provided adjacent to the arm. It is heated while being brought into contact, and solder is supplied to correct the solder height.

After repairing the defective portion in which the bridge or the hole has occurred as described above, the same inspection as that initially performed by the inspection mechanism is performed again by the re-inspection mechanism, so that the quality in the soldering process is improved. Improve

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a soldering inspection and correction device (hereinafter, referred to as the present device) according to the present invention will be described with reference to FIGS.

FIG. 1 is a plan view showing an outline of the apparatus. According to the apparatus, the apparatus is provided with a transport path 4 on which a soldered substrate 10 is transported, and along the transport path 4. The inspection mechanism 1, the correction mechanism 2, and the re-inspection mechanism 3 are sequentially provided, and an information processing mechanism 5 that analyzes data obtained from each of the mechanisms and controls each mechanism. Hereinafter, these will be described in detail.

First, the information processing mechanism 5, which handles inspection and correction information of a substrate in the present apparatus and operates each mechanism to execute inspection and correction, will be schematically described. As shown in FIG. Storage means 50 corresponding to both the inspection mechanism 1 and the re-inspection mechanism 3 and discriminating means 5 corresponding to the inspection mechanism 1
1, control means 52 and storage means 5 corresponding to correction mechanism 2
4, control means 53, determination means 55 and control means 56 corresponding to the reinspection mechanism 3 are formed.

The storage means 50 includes the inspection mechanism 1
And re-inspection mechanism 3 and accumulates data serving as a reference for a substrate to be inspected.
Corresponding to the inspection mechanism 1, the inspection data is used to determine pass / fail based on the board data stored in the storage means 50, and the control means 52 executes a search based on the board data in the storage means 50, Further, the substrate is transported. Further, the storage means 54 corresponds to the correction mechanism 2 and receives the determination data relating to the defective portion created by the determination means 51. The control means 53 performs processing based on the data input to the storage means 54. The correction mechanism 2 is operated to perform correction on the substrate. Further, the determination means 55
Corresponds to the re-inspection mechanism 3 and determines the quality of the board after the correction based on the reference data initially input to the storage means 50. The control means 56 performs a search based on the reference data in the storage means 50. And transport the substrate. Each of these means will be further described sequentially in the configuration of each mechanism described below.

The transport path 4 is, as shown in FIG.
The board 10 is transported substantially horizontally with the solder surface S facing upward and various mounted electronic components projecting to the lower surface side. The board 10 is disposed along the transport direction, and the board 10 is moved with respect to the transport direction. The guide rails 41 are formed of a pair of parallel guide rails 41 supporting both side edges, and drive chains 42 provided on the inner surface of the guide rails 41. The drive chain 42 substantially contacts the lower surfaces of both side edges of the substrate 10 to prevent a transport problem due to adhesion of residual flux when the substrate 10 is moved. Further, the guide rail 41 is formed so as to be movable in the width direction, and is formed so as to be adjustable according to the width of the substrate 10.

The transport path 4 is divided into portions indicated by reference numerals 4a, 4b and 4c corresponding to the respective mechanisms.
Although not shown, each part is provided with a stopper for locking the substrate 10 at a predetermined position. Further, the transport paths 4a and 4c in the inspection mechanism 1 and the re-inspection mechanism 3 are:
Each of them is mounted on a so-called XY table (not shown), and is formed so as to be able to move back and forth and left and right in accordance with an inspection position on the substrate 10 while holding the substrate 10.

An inspection mechanism 1 for performing a bridge inspection and a hole inspection on the solder portion of the substrate 10 from the solder surface S is provided above the most upstream side of the transport path 4. As shown in FIG. 2, the inspection mechanism 1 includes an imaging unit 11 provided to face the transport path 4 a, a first light source 12, and a second light source 13. In the information processing mechanism 5 of the present apparatus, a discriminating means 51 for discriminating a bridge or a hole generated in the substrate 10 based on an image obtained by the imaging means 11 is formed corresponding to the inspection mechanism 1.

The image pickup means 11 comprises an image pickup device such as a CCD camera, and is housed in a cylindrical outer cover member 14 for shielding external light to some extent. Then, the light source 1
Reference numerals 2 and 13 irradiate a predetermined light to the solder surface S of the substrate 10 from a predetermined direction, and for example, a red LED is used. The first light source 12 is provided at a position adjacent to the imaging means 11 and opposed to the transport path 4a.
And is attached to a cylindrical light source support 15 having a somewhat reduced diameter as it is separated from the solder surface S. This first light source 12 is used for bridge inspection,
It is preferable that the amount of light reflected on the bridge to be detected be reflected to the image pickup means 11 in a small amount.

On the other hand, the second light source 13 is used for hole inspection. When the second light source 13 irradiates a hole to be detected, the larger the amount of reflection from a portion other than the hole to the image pickup means 11, the larger the amount of reflection. Holes are easier to detect. Therefore, the light source support 3 is composed of a plurality of light emitters 13a, 13a attached over the entire inner peripheral surface of the light source support 3, and is provided so as to be opposed to the solder surface S or located near the periphery of the solder surface S. Thus, the solder surface S is irradiated with light from multiple directions.

Further, the discriminating means 51 irradiates the image obtained by the imaging means 11 by irradiating the light from the first light source 12 with one solder part and another solder part different from the one solder part. Is detected as a bridge when a shadow portion connecting the two is detected, and when a shadow portion is detected in one of the solder portions of the image obtained by irradiating the light from the second light source 13 with the image pickup means 11, this is determined. Is determined to be a hole.

Next, the bridge detected by the inspection mechanism 1 is divided and corrected above the conveyance path 4b on the downstream side in the conveyance direction from the inspection mechanism 1, and the holes detected by the detection mechanism 1 are corrected by soldering. A correction mechanism 2 for applying is provided.

As shown in FIG. 3, the correction mechanism 2 has an arm 22 suspended above the transport path 4b and formed to be movable in a predetermined space, and provided at a lower end of the arm. A spatula-shaped member 25 and a soldering iron 24 are provided. The above-mentioned spatula-shaped member 25 divides a bridge generated between one solder part and another solder part different therefrom,
The soldering iron 24 corrects a hole generated due to insufficient soldering or the like at one of the solder portions.

The arm 22 is a so-called robot arm suspended from an XY axis 21 provided above the transport path 4b. The XY axis 21 includes an X axis 21a and a Y axis 11b mounted on the X axis 21a. The Y axis 21b is fixed to the X axis 11a by an actuator such as a built-in servomotor.
Are formed so as to be movable along the longitudinal direction.
The arm 22 attached to the Y-axis 21b extends in the vertical direction and is formed to be movable along the longitudinal direction of the Y-axis 21b. ).

The arm 22 has an upper block 22a supported on the Y-axis 21b and an upper block 22a.
Shaft 22c which is a rod of a cylinder device housed inside
And a lower block 22b suspended by the elevating shaft 22c.
The lower block 22b is formed to be able to move up and down with respect to the upper block 22a by the reciprocation of the elevating shaft 22c. Further, an actuator such as a servomotor is provided inside the lower block 22b,
2c so as to be rotatable.

The above-mentioned spatula-shaped member 25 is
Lift block 2 suspended below the lower block 22b
8 and chuck cylinder 25 attached thereto
The lower block 22b is protruded downward through the s and is capable of vertically moving up and down with respect to the lower block 22b and slightly reciprocating in the horizontal direction in an upright state.

The above-mentioned spatula-shaped member 25 is made of a heat-resistant material, and its tip has a substantially V-shaped cross section as viewed from one side, and a cross-section as viewed from another adjacent side. Are formed as flat rectangular shielding members. And, by the chuck cylinder 25s,
It reciprocates finely in the width direction of the flat side surface of the tip. As the material having heat resistance of the spatula-shaped member 5, various metals may be used, but it is preferable that the amount of solder attached is small when the molten solder is divided, for example, a polyimide resin or a silicon resin. Engineering plastics is suitable.

Further, the hot air nozzle 26 provided adjacent to the spatula-shaped member 25 is provided with the elevating block 28, and a hot air generator (not shown) for heating the air separately supplied from a compressor or the like by a heater. And conduit 2
6e. When the bridge generated on the substrate 10 is corrected, hot air of a predetermined temperature is blown toward the vicinity of the tip of the spatula-shaped member 5 for a certain period of time, thereby melting the same. The temperature of the hot air and the blowing time are preset so as to give a sufficient amount of heat to the expected bridge to melt.

On the other hand, the lower block 22 of the arm 22
An elevating block 27 is hung from the lower end of b, and a thin rod-shaped soldering iron 24 into which a heater is inserted is attached to the elevating block 27 via a drive shaft 24c. A free and sharp tip is formed to be swingable. That is, the soldering iron 24
Is formed so as to be movable in the XYZ directions in a predetermined space, and has a tip portion located below the substrate 1.
0 can be brought into contact with a desired position at a desired inclination.

Further, a solder supply nozzle 23 for supplying solder toward the tip of the solder iron 24 is provided adjacent to the solder iron 24. In the solder supply nozzle 23, a winding section for sending out a previously wound yarn solder is provided in the lower block 22b, and is connected to the winding section by a guide tube 13c.

The arm 22 of the correction mechanism 2 is moved to a predetermined position on the substrate 10, moved up and down, and the lifting blocks 27 and 28 are moved up and down. And soldering iron 2
A control means 53 is also formed in the information processing mechanism 5 of the present apparatus in order to carry out the solder height correction by means of the information processing device 4.

Subsequently, a reinspection mechanism 3 for inspecting the solder portion of the substrate 10 corrected by the correction mechanism 2 again is provided above the conveyance path 4c on the downstream side of the correction mechanism 2 in the conveyance direction. ing. The re-inspection mechanism 3 is an inspection apparatus having the same configuration as the above-described inspection mechanism 1 except that the corresponding determination means 54 and control means 55 are formed in the information processing mechanism 5, and the description thereof is omitted. I do.

Next, the steps of detecting bridges and holes, correcting them, and performing re-inspection by the present apparatus having the above configuration will be described below with reference to FIGS. 6 and 7.

First, before performing an inspection, a solder portion and a flat plate portion that is not the same are specified in advance on a substrate having the same pattern as the substrate 10 to be inspected.
For this purpose, a board on which various electronic components are already mounted and soldered may be used, or a board having through holes in which no components are mounted may be used.

In this step, the substrate 10 is loaded into the transport path 4a and held at a predetermined position in the same manner as when inspecting later. Then, since the carry-in path 4a is mounted on the XY table, the board 10 is moved along the circuit pattern of the board 10, and each solder portion (or each through-hole) is captured as an image by the imaging means 11, and Each position and its area data, and direction data (direction data specifying a direction opposite to the clinch direction) relating to the lead buried in the solder portion are stored as quantification signals in the storage means 50 formed in the information processing mechanism 5. I do.

Next, the board 10 is subjected to a bridge inspection. After holding the inspection instrument substrate 10 on the transport path 4a4, the solder surface S of the substrate 10 is irradiated with light from the first light source 12. Then, based on the position information of the solder portion previously input to the storage means 50, the control means 52 controls the transport path 4a.
Is operated back and forth and left and right to trace each solder portion of the substrate 10.

At this time, it is assumed that a bridge B has been formed in the gap between the solder portion 63a and the solder portion 63c on the solder surface S as shown in FIG. Then, since the first light source 12 emits light from a position close to the imaging unit 11 facing the solder surface S, the first light source 12 protrudes out of the irradiated light to the flat surface of the solder surface S. Most of the light hitting the solder portions 63a, 63b, 63c,... And the bridge B is reflected to the side in the irradiation direction. Therefore, when this is captured by the imaging unit 11, as shown in FIG. 6B, the light source 12, that is, the plate surface M1 that largely reflects in the direction of the imaging unit 11 protrudes from the plate surface M1 as a bright portion VM1. The solder portions 63a, 63b, 63c,... Are recognized as shadow portions V63a, V63b, V63c,.

Then, the discrimination means 51 compares the recognized image with the image previously recognized and input to the storage means 50.
When a shadow portion VB connecting these portions is detected in a portion excluding a, 63b, 63c,..., in this case, in a gap between the solder portion 63a and the solder portion 63c, it is determined that a bridge is present.

In such a bridge B detection method, the flat plate surface M1 in which the light reflection direction is specified is image-recognized as the bright portion VM1, and the plate surface M on which light from a predetermined direction is irregularly reflected.
Since the image of the bridge B projected from 1 is recognized as the shadow portion VB, the position adjustment of the light source is extremely easy and the reflection is reliably performed as compared with the case where the bridge portions having different projected states are individually recognized as bright portions. What is necessary is just to recognize the shadow part in the difference from the flat part with a large amount, and the detection accuracy can be easily improved.

Next, the step of performing a hole inspection on the substrate 10 will be described. The solder surface S of the substrate 10 held in the same manner as described above is irradiated with light from the second light source 13 and each solder is formed based on the position information. Trace the part. For example, in this case, it is assumed that a hole H has been generated in the solder portion 73e on the solder surface S as shown in FIG.

Then, the second light source 13 is connected to the solder surface S
And a plurality of luminous bodies 13a, 13a provided so as to be opposed to or near the periphery thereof.
Are irradiated from a plurality of directions, that is, from multiple directions, so that the plate surface M2 and the solder portions 73d, 73e, 73g,
In the case of..., Light is reflected in multiple directions irrespective of the degree of flatness, but only the light applied to the hole H, which is a concave portion, is hardly reflected.

Therefore, when this is captured by the imaging means 11, as shown in FIG.
2, the solder portions 73d, 73e, 73g,... Appearing outside are respectively recognized as bright portions VM2, V73d, V73e, V73g,. As a result, the recognized image and the previously recognized image are compared by the discriminating means 51, and when the shadow portion VH is detected in a portion that is originally considered as the bright portion V73e with respect to the entire (all area) of the solder portion 73e, the hole is detected. What is necessary is just to determine that there is.

In such a hole inspection, the second light source 1
3 comprises a plurality of luminous bodies 13a provided facing the solder surface S or near the periphery of the solder surface S;
Irradiates light from a plurality of directions, so that, except for the hole H immersed from the plate surface M2 with respect to the imaging means 11, light can be surely reflected at other portions regardless of flatness and recognized as a bright portion. it can. That is, the hole H existing in the solder portion 73e can be reliably detected as the shadow portion VH.

Either of the bridge inspection and the hole inspection may be performed first or separately, but both can be performed simultaneously based on the data of the substrate 10 initially input to the storage means 50. The discrimination information created by the discrimination means 51 in these inspections is
Is input to the storage means 54 corresponding to the correction device 2 and stored therein.

Next, the inspected substrate 10 is sent from the transport path 4a to the transport path 4b, and is held at a predetermined position of the correction mechanism 2 shown in FIG. Since the inspection data previously input is stored in the storage means 54 corresponding to the correction mechanism 2, the control means 53 controls the arm of the correction mechanism 2 provided in the information of the transport path 4b based on the inspection data. Activate 22.

The arm 22 extended in the vertical direction is an XY
Since the lower block 22b is formed so as to be movable up and down (movable in the Z direction) by the elevating shaft 22c, and is hung movably in the horizontal direction (XY directions) by the shaft 21.
The arm 21 is moved to almost right above the bridge B shown in FIG. Further, at this time, the arm 22 itself is formed rotatably, and the spatular member 25 is attached to the lower block 22b via the elevating block 28.
2 and further lowering the elevating block 28 slightly so that the flat side surface of the tip of the spatula-shaped member 25 is in a direction orthogonal to the connecting direction of the bridge B and slightly lateral to the bridge B. 10 to a position slightly separated from the board surface.

Then, since the hot air nozzle 26 is provided adjacent to the spatula member 25, the hot air nozzle 26
The bridge B can be melted by blowing hot air toward the vicinity of the tip of the spatula-shaped member 25 for a preset time. Next, the spatula-shaped member 2
5 is brought into contact with the side surface of the bridge B and the hot air is stopped. At the same time, the chuck cylinder 25s to which the spatula-like member 25 is attached is operated, and the spatula-like member 25
Is slightly reciprocated in the width direction of the flat side surface at the tip end, that is, in the direction substantially intersecting with the connecting direction of the bridge B, the melted bridge B is divided.

At this time, the tip of the spatula-like member 25 is formed flat, and once it reciprocates finely, the bridge B is once divided over the entire width thereof. Is cooled by the cooling, the bridge B is not formed again while the spatula member 25 is reciprocating. Furthermore, if the spatula-shaped member 25 is formed of a material such as a polyimide resin having heat resistance and a small amount of solder adhered thereto, the solder does not adhere to the spatula-shaped member 25 when the bridge B is divided. Bridge B can be more reliably prevented from being reformed. That is, the correction mechanism 2
In the spatula-shaped member 25, the bridge B once melted is divided by reciprocating finely while the spatula-shaped member 25 located on the side thereof is in contact with the board surface, so that the bridge B This can be reliably corrected regardless of the difference in form.

Next, the hole H detected by the inspection mechanism 2
Is corrected, the arm 22 is operated in the same manner as described above, and is moved to a solder portion to be corrected, for example, a solder portion 73e shown in FIG. 7A. An elevating block 27 attached below the lower block 22b of the arm 22 includes:
Since the soldering iron 24 is provided via the drive shaft 24c, the soldering iron 24 is moved to substantially the center of the solder part 73e based on the position data input to the storage means 54.

At this time, since the direction data (direction data for specifying the direction opposite to the clinch direction) related to the lead of the solder portion 13 is input to the storage means 54 in addition to the position data, the lifting block 27 Is further extended, the drive shaft 24c is rotated to slightly incline the soldering iron 24 from the vertical direction, and the lower block 22b of the arm 22 is rotated to solder the solder 73e from the direction opposite to the clinch direction. The iron 24 is brought into contact.

Then, since the tip of the soldering iron 24 comes into contact with the solder portion 13e from the side opposite to the direction in which the lead is bent, the portion where the holes H are generated due to insufficient soldering can be unnecessarily heated. It can be heated efficiently without any heating. Next, if the solder is supplied from the solder supply nozzle 13 toward the tip of the soldering iron 24, soldering can be accurately applied to a portion where soldering is insufficient.

In the solder embossing correction, the position of the hole H generated by the clinch direction of the lead buried in the solder portion is predicted, and the optimal approach and contact direction of the soldering iron 24 for performing the solder embossing again. Is focused on that it is uniquely determined according to the clinch direction, and thereby a good solder assembling according to the manual operation can be realized.

As described above, the correction of the bridge and the correction of the hole in the correction mechanism 2 are usually executed separately, and each correction operation is performed based on the inspection data in the inspection mechanism 1 inputted to the storage means 54. The process is continued until the correction is completed, and the corrected substrate 10 is moved from the transport path 4b to the transport path 4c.

Subsequently, the inspection of the bridge and the hole is performed again by the reinspection mechanism 3 on the substrate 10 after the correction. In this case, the control unit 52 traces the pattern of the substrate 10 while moving the transport path 4c in the XY directions by the control unit 52 based on the data of the initial substrate 10 serving as a reference previously stored in the storage unit 50. The same inspection is performed. If the defective portion is detected again by the re-inspection mechanism 3, the substrate may be removed from the line using a sorting conveyor or the like (not shown).

As described above, the present apparatus is provided with the inspection device 1, the repair device 2, and the re-inspection device 3 along the transport direction of the transport path 4, and the inspection device 1 includes the bridge inspection and the hole inspection. Can be provided separately and implemented in the same process. In particular, in the detection of the bridge, as shown in FIG. 6, the flat plate surface M1 in which the light reflection direction is specified is image-recognized as the bright portion VM1, and the light from the predetermined direction is diffusely reflected from the plate surface M1. Since the image of the bridge B that has emerged is recognized as the shadow portion VB, the position adjustment of the light source is extremely easy and the amount of reflection can be surely reduced, as compared with the case where bridge portions having different appearances are individually recognized as bright portions. What is necessary is just to recognize a shadow part in the difference with many flat parts, and it becomes possible to improve detection accuracy easily.

Further, since the bridge to be detected is regarded as a shadow portion, the mask for displaying the circuit configuration and the like does not need to be black, and if the mask is formed in a clear color such as white,
When the circuit board is mounted on various devices, identification becomes easy, and maintenance management becomes easy.

In the hole inspection, as shown in FIG. 7, the second light source 13 is composed of a plurality of luminous bodies 13a provided opposite to or near the solder surface S. Since the solder surface S is irradiated with light from a plurality of directions,
Except for the hole H immersed from the plate surface M2 with respect to the imaging means 11, light can be surely reflected at other portions regardless of the flatness and recognized as a bright portion.
The hole H existing in e can be reliably detected as the shadow portion VH.

In the bridge correction in the correction mechanism 2 of the present apparatus, the bridge is divided by slightly reciprocating a spatula-shaped member 25 located on the side of the bridge once the bridge is melted. Therefore, there is no need to cut and separate the bridge while observing the molten state of the bridge, and this can be reliably corrected regardless of the difference in the form of the bridge.

On the other hand, in the solder height correction of the correction mechanism 2,
Since the soldering iron 24 abuts from the side opposite to the bending direction of the lead buried in the solder portion, it is possible to efficiently heat the portion where holes are generated due to insufficient soldering without unnecessary heating. It is possible to avoid unnecessary heating of the mounted electronic components.

In this solder embossing correction, the position of the hole generated by the clinch direction of the lead buried in the solder portion is predicted, and the optimal approach and contact direction of the soldering iron 24 for performing the solder embossing again is determined. It is noted that it is uniquely determined by the clinch direction. Since the board data input in advance to the storage means 50 at the time of inspection is used for the posture control conditions of the soldering iron 24, the work according to the manual operation is performed without inputting the data again to the boards of various patterns. Good soldering can be realized.

In the present apparatus, since the re-inspected board is also re-inspected by the re-inspecting mechanism 3, the quality in the soldering step in the board assembling step can be surely improved, and the inspection and repairs can be performed. Since the re-inspection process is integrated as a series of processes, labor saving can be drastically achieved.

[0071]

According to the present invention as described above, the following effects can be obtained.

(1) In bridge detection, since a bridge that has protruded from a plate surface on which light from a predetermined direction diffusely reflects is image-recognized as a shadow portion, bridge portions having different protruding states are recognized as bright portions. In comparison with the above, it is extremely easy to adjust the position of the light source, and it is only necessary to reliably recognize the shadow part in the difference from the flat part having a large amount of reflection, and it is possible to easily improve the detection accuracy, In the inspection, light is reflected from other parts except the hole that irradiates and immerses from multiple directions, and the hole is recognized as a shadow part, so that the hole can be detected reliably, and bridge inspection and hole inspection can be performed. By providing a separate light source,
It can be performed in the same step.

(2) In the bridge inspection, since the bridge where light is irregularly reflected is regarded as a shadow portion and the board surface of the substrate is regarded as a bright portion, a mask for displaying a circuit configuration or the like does not need to be black, and a clear color such as white can be obtained. When the circuit board is formed on the various devices, the identification becomes easy.

(3) In the bridge correction, the bridge once melted is divided by reciprocating a spatula-shaped member located on the side thereof, so that the bridge is cut off and cut while observing the molten state of the bridge. There is no need to do
This can be reliably corrected regardless of differences in the form of the bridge.

(4) In the solder embossing correction, the soldering iron is inclined from the side opposite to the bending direction of the buried lead and is brought into contact with the soldering portion. On the other hand, it is possible to heat efficiently and to perform soldering with a small amount of solder, so that the mounted electronic components are not unnecessarily heated.

(5) Regarding the attitude control conditions of the soldering iron,
Since the board data input in advance at the time of inspection is used, it is possible to realize good soldering in accordance with a manual operation without re-inputting the data for boards of various patterns.

(6) Since the board after the repair is re-inspected, the quality in the soldering process in the board assembling process can be surely improved. Since the processes are integrated, labor saving can be drastically achieved.

[Brief description of the drawings]

FIG. 1 is a plan view showing an outline of a soldering inspection and correction device.

FIG. 2 is a side sectional view showing an inspection mechanism.

FIG. 3 is a side sectional view showing a correction mechanism.

FIG. 4 is a perspective view showing a transport path.

FIG. 5 is a block diagram of an information processing mechanism for managing data.

FIG. 6 is an explanatory diagram showing detection of a bridge by an inspection mechanism.

FIG. 7 is an explanatory diagram showing detection of a hole by the inspection mechanism.

[Explanation of symbols]

 Reference Signs List 1 inspection mechanism 11 imaging means 12 first light source 13 second light source 2 correction mechanism 21 XY axis 22 arm 23 solder supply nozzle 24 solder iron 25 spatula-shaped member 26 hot air nozzle 3 re-inspection mechanism 4 (4a, 4b, 4c) Conveyance path 5 Information processing mechanism 50, 54 Storage means 51, 55 Determination means 52, 53, 56 Control means 63a to 63h Solder part V63a to V63h Solder part (image) B Bridge H hole 10 Substrate S Solder surface

Claims (1)

(57) [Claims] A transport path for transporting a substrate with a solder surface facing upward, an inspection mechanism provided above the transport path, and performing a bridge inspection and a hole inspection on the solder portion of the substrate from the solder surface; A correction mechanism that is provided above the transport path on the downstream side in the transport direction of the inspection mechanism, performs a divisional correction on the bridge detected by the inspection mechanism, and performs a soldering correction on a hole detected by the inspection mechanism; A re-inspection mechanism provided above the transport path on the downstream side in the transport direction of the repair mechanism and re-inspecting the solder portion of the substrate corrected by the repair mechanism; and Each of the reinspection mechanisms is provided with an image pickup unit provided to face the transport path and a light source irradiating the solder surface from a predetermined direction. A first light source provided opposite to or circumferential beside the conveying path, a second light source for irradiating light from a plurality of directions on the solder surface, the field of the solder surface captured by the image pickup means
A shadow portion for irregularly reflecting light from the first light source based on an image;
Detects shadows between solder parts from inside
To detect the bridge and capture it with the imaging means.
Light from the second light source based on the image of the solder surface
Detect holes by detecting shadows that do not reflect light
The correction mechanism includes an arm suspended above the transport path and formed to be movable in a predetermined space, and protruding from a lower end of the arm and finely moving in a horizontal direction. A spatula-shaped member, a hot-air nozzle provided adjacent to the spatula-shaped member and blowing hot air toward a vicinity of a tip end of the spatula-shaped member, and a c- shape provided at a lower end of the arm.
Nda鏝, and soldering inspection adjustment device also being equipped with a solder supply nozzle for supplying a solder toward the distal end of the solder iron provided adjacent to the solder iron.