JPH05235535A - Electronic parts correction equipment - Google Patents

Abstract

PURPOSE:To realize automating in which a robot is used instead of hand working, by building a process of command and correction in a system, on the basis of imperfect electronic parts and excess and shortage of solder of connection terminals. CONSTITUTION:Electric operation and characteristics of a substrate are inspected, whether an electronic parts is exchanged is determined, and a command is sent out. A bonding part 62 is collectively irradiated with laser light, a vacuum suction unit 51 is operated, and a new parts is transferred onto the position where an imperfect parts is removed. Solder of the bonding part 62 on the substrate 27 is fused again by using laser. By a nozzle elevating motor 46, a parts sucking nozzle 34 is descended, the parts 14 is pressed against the substrate 27, and solder is heated and bonded, thereby completing correction. When the solder is superfluous, a local portion is irradiated with laser, and solder is fused. Said solder is eliminated by a solder suction apparatus, and correction is executed. When solder is insufficient, cream solder is supplied to the part short of solder from a dispenser, said part is locally irradiated with laser, the cream solder is fused, and solder is bonded, thereby correcting imperfection.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention inspects a board, to which a large number of electronic parts have been attached and then soldered, with an inspection device, and automatically corrects the failure if a failure is found in the board after soldering. Related to the device.

[0002]

2. Description of the Related Art Recently, electronic circuits have been assembled on a substrate by an IC,
After mounting a large number of electronic components such as capacitors by a robot, the connection terminals of the electronic components are electrically connected by collective soldering. After that, the board after soldering is inspected by an inspection apparatus, and if a defect is found, it is manually corrected.

FIG. 16 shows a state of manual correction work when the solder amount of the connection terminal 62 of the electronic component 14 is insufficient. As shown in the figure, the rod-shaped solder 101 is melted by the soldering iron 131. And add an appropriate amount. When the amount of solder is excessive, the solder is melted by the soldering iron and the excess solder is sucked by a solder sucker (not shown).

Since the electronic component itself may be defective depending on the content of the defect, in that case, the defective electronic component may be removed and replaced with a normal electronic component. FIG. 17
Shows the work of removing such an electronic component. When the connection terminal of the electronic component is heated at the tip of the soldering iron 131 and the solder melts, the tweezers 132 are used to remove the connection terminal 62b of the electronic component. It is removed from the connection terminal 62a of the board. Since a recent IC or the like has a large number of connection terminals even with one component, the work of removing the connection terminals requires a great deal of skill and effort.

[0005]

The above-described manual correction work is a difficult work that requires a long time for a skilled worker. Even if a relatively simple defect in which solder is added when the amount of solder is insufficient, if the amount of additional solder is too large, it will short-circuit with the adjacent connection terminal and become defective. Further, when the amount of solder is excessive, if the solder is sucked too much, the connection will be weakened and it will also be defective. The above-mentioned work is becoming more and more difficult because recent boards have a high packaging density and the distance between the connection terminals of components is extremely close.

Further, recent electronic parts such as ICs have a large number of connection terminals. When an electronic part having such a large number of connection terminals is to be removed, the connection terminals are soldered one by one. It is necessary to repeat the work of melting and removing the same number of times as the number of connecting terminals, which alone is a troublesome work. Moreover, if the copper foil connection terminal part of the board is damaged during such work, the whole board eventually becomes defective and must be discarded, and the economic loss was very large. ..

The present invention is intended to solve the above problems, and an object thereof is to provide an apparatus for automatically correcting a defect of a substrate.

[0008]

In order to achieve the above object, an electronic component correcting apparatus of the present invention comprises a step of inspecting electrical characteristics including electrical operation of a substrate to which electronic components are connected by soldering, The cause of the defective electrical characteristics including the electrical operation of the substrate, which is composed of a step of three-dimensionally determining the connection terminals of the electronic component and a step of inspecting an electrical short circuit of the connection terminals of the electronic component, is caused in the substrate. Inspection process to classify mounted electronic components, excess solder amount of connection terminals, and insufficient solder amount of connection terminals, and removal and replacement of electronic components mounted on the board based on the classification result of the inspection process Command, a command to add the amount of solder, and a command process that outputs one of the commands to absorb the amount of solder, and based on the output of the command process, removal and replacement work of electronic parts, solder addition work, and It is made more and correction step of performing a blotting work.

[0009]

With the above-described structure, the present invention incorporates the inspection process, the command process, and the correction process as a system.
Repairing the soldering of the connection terminals of defective electronic components, replacing defective electronic components with non-defective electronic components, without the need for manual work or operator judgment, minimizing damage to electronic components and boards. It can be carried out.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. As described in the description of the conventional example, after the electronic components are mounted on the board and soldered, the board is inspected by the inspection apparatus, but the defects found at that time are mainly the following three.

A: The electronic component is not a good product B: The electronic component is a good product but the solder amount of the connection terminal is insufficient C: The electronic component is a good product but the solder amount of the connection terminal is excessive Therefore, the present invention The correction method dealt with in A, B, C
It is limited to the defect of.

Next, when the cause of the defect is found to be any of the above A, B, and C, the work for repairing the substrate is performed, and the following four methods are preset as the repair work.

P: Removing the electronic component Q: Replacing the electronic component R: Adding solder S: Absorbing the solder Therefore, in one embodiment of the present invention: Inspect whether it is B or C: Determine whether the correction method is P, Q, R or S in the command process: Order of performing correction work based on the correction method in the correction process Repair the board with.

In the following description, the contents of the correction work of III will be described first, and then the inspection process of I and the command process of II will be described.

In the repairing process, it is assumed that the cause of the defect and the repairing method are already determined.

FIG. 2 shows an electronic component correcting device for correcting an electronic component which has been determined to be defective. The configuration of this device will be described below.

An XY robot 2 is mounted on the body frame 1.
Is installed, and a correction head 3 described later is locked on the XY robot.

The component transfer device 4 transfers the electronic components stored in the component storage 5 to the movable range of the XY robot 2. The board 27 is carried by the board carrying section 6 to the component correction position 8 via the board preheating section 7. The operation of the entire component correction device is performed by the operation panel 9 provided on the entire surface of the device. The present embodiment is an example in which a YAG laser is used as a heating source for melting the solder necessary for correcting electronic parts, and YA
The G laser is a laser power source 10 and a laser optical system 1.
1 and is transmitted to the correction head 3 through the optical fiber 12. Reference numeral 13 is a flux applying section.

Next, the basic operation of removing the electronic component at the component correction position 8 will be described with reference to FIGS. Figure 5
14 is an electronic component determined to be defective, and the electronic component 14 is soldered to the substrate at a large number of connection terminals 62. To remove the electronic component from the substrate, the solder in the connection terminal 62 is melted and pulled up by the component suction nozzle 34 connected to the vacuum source to remove it. In this embodiment, a laser beam is used as a heat source for melting the solder, and the laser beam is transmitted to the component correction position 8 by the optical fiber 12 as described with reference to FIG. As shown in FIG. 7, the tip of the optical fiber 12 has an emitting optical section 59 composed of a condenser lens 65, and collects the laser light to a size that is 2-3 times larger than the core system of the optical fiber. The laser light emitted from the emission optical section 59 is further polarized into an elliptical shape by the cylindrical lens 60 and focused on the substrate. At the component correction position 8, a plurality of emission optical parts and a cylindrical lens are provided to simultaneously heat the connection terminals 62 surrounding the electronic component as shown in FIG. That is, the laser light emitted from the cylindrical lens 60a melts the solder of the connection terminal 62a, and the laser light emitted from the cylindrical lens 60b melts the solder of the connection terminal 62b (the connection terminal 6).
The output optical section and the cylindrical lens corresponding to 2c and 62d are not shown. ).

On the other hand, the tip of the component suction nozzle 34 connected to the vacuum source has an electronic component 14 as shown by ΔH in FIG.
Since it is located slightly apart from the upper surface of the electronic component 14, when the solder is melted by the heating by the laser beam and the bonding force of the solder becomes lower than the vacuum suction force, the electronic component 14 comes into close contact with the component suction nozzle 34 as shown in FIG. Is removed upwards.

Next, referring to FIG. 3, a detailed structure of the component transfer device 4, the board transfer section 6, and the board preheating section 7 will be described.

The component transfer device 4 has a component regulating section 16 provided with a component regulating claw 15 for regulating the position of the electronic component 14 with high accuracy.
The component regulating section 16 is moved on the rail 17 by a transfer motor 18 to transfer the electronic component 14.

The substrate transfer section 6 includes a pulley 19 and a transfer belt 2.
It is composed of a pair of transport rails 21 having 0, and the substrate 27 is moved by the operation of the transport belt 20.

The substrate preheating section 7 is a substrate preheating box 22.
And a duct hose 23a for supplying the hot air generated by the air dryer 24a to the substrate preheating box 22, and a voltage for adjusting the power supply voltage to a suitable state in order to control the heat quantity of the hot air generated by the air dryer 24a. The regulator 25a is arranged in series.

On the other hand, a board setting cylinder 26 is provided at the component correction position 8 to position the board 27 with high accuracy. At the component correction position 8, the hot air from the air dryers 24b, 24c, 24d is guided by the duct hoses 23b, 23c, 23d in order to prevent the hot air from falling on the substrate 27. In addition, the air dryers 24b, 24c, 24
In order to control the amount of heat of the warm air generated by d, the substrate preheating unit 7
Of the voltage regulators 25b, 25
c and 25d are arranged.

The flux applying section 13 is provided with a hydrometer 28, a dirty sensor 29 and a liquid level sensor 30. After the flux 31 is poured into the concave portion of the flux block 32, it is pumped up by the flux applying cylinder 33, and by the component suction nozzle 34. The flux 31 is applied from below to the joint electrode portion of the electronic component 14 that is being gripped. Also,
Reference numeral 35 is a parts disposal box.

Next, the structure of the correction head unit 3 using vacuum suction as the electronic component removing means will be described with reference to FIG. The correction head 3 is provided on the X-axis mount 36 of the XY robot 2 in FIG. 2 via the LM guide 37 and the head frame 38, slides on the LM guide 37 in the X-axis direction, and its drive is It is performed by a ball screw 39 connected to an X-axis motor (not shown). The spline shaft 40 is locked to the head frame 38 via a bearing 41 and a spline nut 42. Further, the spline shaft 40 can be freely rotated in the θ direction by a rotating means composed of a pulley 43a connected to the spline nut 42, a timing belt 44a, and a nozzle rotation motor 45. Further, as a means for moving the spline shaft 40 up and down, the rotation of the nozzle up / down motor 46 rotates the ball screw 4 via the pulley 43b and the timing belt 44b.
7, and the nozzle up / down block 48 is moved up and down. A cam follower 49 is provided on the nozzle upper / lower block 48, and since the cam follower 49 sandwiches the disc 50 locked by the spline shaft 40, the spline shaft 40 is moved in the vertical direction.

Further, since the spline shaft 40 is splined only on the movable portion of the nozzle and is held by the spline nut 42, it can be operated smoothly in the vertical direction.

The spline shaft 40 has a hollow structure so that the vacuum state generated in the vacuum unit 51 can be controlled by the piping component 52, the hose 53 and the rotatable piping component 5.
4 to the component suction nozzle 34 to suck the electronic component 14. The shaft guide 55 is the spline shaft 4
It is a sliding guide provided to suppress the shake of 0 in the rotation direction, and is installed on a block 56 locked to the head frame 38.

The spring 57 provided between the spline shaft 40 and the component suction nozzle 34 serves to absorb the impact force generated when the spline shaft 40 descends to mount the electronic component 14 on the substrate 27. do.
Reference numeral 58 denotes an air pipe, which blows air for cooling the solder melted by the laser light. 59a, 59b,
Reference numerals 59c and 59d denote laser light emitting optics, and 60a and 6d.
Reference numerals 0b, 60c and 60d denote cylindrical lenses, and 61 denotes a light shielding plate.

Next, the operation of correcting the electronic parts will be described. 2 to 6, based on the data of the defective portion and the contents obtained by the board inspection, the correction head 3 locked by the XY robot 2 should be corrected in the case of the positional deviation of the electronic component or the defective electric characteristic. The nozzle vertical motor 45 is driven to rotate the ball screw 47 so as to face the electronic component 14, and the component suction nozzle 34 is lowered to the height of ΔH from the upper surface of the electronic component 14 as shown in FIG. Vacuum suction unit 51 provided on
The electronic component 14 is vacuum-sucked by the suction nozzle 34, and at the same time, the laser light transformed into an elliptical shape by the cylindrical lens 60 is collectively applied to the joint portion 62. When the solder is re-melted by the heating by the laser light and the joining force of the solder becomes lower than the vacuum suction force, the vacuum suction force removes the electronic component 14 upward. (FIG. 5) When the electronic component 14 is sucked by the suction nozzle 34, the degree of vacuum of the vacuum suction unit 51 rises. Therefore, by detecting the degree of vacuum by the pressure detection means 63, it is determined that the removal of the electronic component 14 is completed. .. Electronic component 1 removed
In step 4, the XY robot 2 moves the correction head 3 to the parts discard box 35 and discards it.

Next, the non-defective electronic component 14 stored in the component storage section 5 is transferred to the component control section 16 on the component transfer apparatus 4 shown in FIG. 3 by transfer means (not shown). .. On the component regulating section 16, the component regulating claw 15 is attached to the electronic component 1.
4 is subjected to position regulation, and at the same time, the component regulation section 16 itself moves on the rail 17 by the drive of the transfer motor 18. The electronic components 14 thus stored in the component storage section 5
Are sequentially transferred to the movable range of the XY robot 2 in a state where the position is regulated. The correction head 3 described with reference to FIG. 4 is opposed by the XY robot 2 to a predetermined position above the electronic component 14 thus transferred, and the electronic component 1 is moved.
4 is sucked by the component suction nozzle 32.

Next, the sucked electronic component 14 is positioned above the flux applying section 13 shown in FIG. 3, the flux 31 is applied to the electronic component 14, and the new electronic component 14 is moved to the position of the defective removed electronic component. List. Then, the solder again melts the solder on the joint portion 62 on the substrate 27, the nozzle vertical motor 46 lowers the component suction nozzle 34 to press the electronic component 14 against the substrate 27, and the solder is heated and joined to correct the electronic component. To complete.

At this time, the board 27 has already been preheated by the upstream board preheating section 7 shown in FIG.
Since it is being preheated by the hot air from the air dryers 24b, 24c, 24d even when it is in the component correction position 8, it is possible to mitigate the thermal damage due to the rapid heating by the laser. it can.

Usually, a plurality of electronic components are already soldered on the substrate, and when the internal temperature of the substrate preheating unit 7 on the substrate transfer unit 6 becomes too high, the solder melts and the electronic components are lost. Air dryer 24a
The amount of heat of the warm air generated by is adjusted to a suitable value by the voltage adjuster 25a. Further, the air dryers 24b, 24c, which supply hot air to the component correction position 8,
For the same reason, the voltage regulators 25b, 2
5c and 25d are arranged to maintain the preheating effect.

Since a plurality of electronic components are already connected when the electronic component is repaired, if the elliptical shape remains, the solder of the adjacent electronic components may be melted or the electronic component itself may be damaged by the laser beam. Cause. Therefore, as shown in FIG. 4, by providing a light shielding plate 61 on the optical path of the laser beam, it is possible to prevent the influence on the surroundings and to irradiate only a necessary portion. An infrared temperature measuring device (not shown) is provided near the emitting optical section 59 to measure the temperature of the substrate 27, the electronic component 14, and the connection terminal 62. Figure 8
Shows the temperature change in the vicinity of the connection terminal 62, and at the time T ₀ when the board 27 is carried into the component correction apparatus, the substrate 27 has almost the same temperature as the room temperature S ₁ . The substrate 27 is the substrate preheating unit 7
Is preheated around the preheating temperature S ₂ (about 100 to 120 ° C.), and is transported to the component correction position 8 at time T ₁ . At this time, inside the substrate preheating unit 7, the temperature of the substrate is the preheating temperature S.
_Since the heat quantity of the air dryer 24a is adjusted by the voltage regulator 25a so that the voltage does not rise to more than ₂ , even if the board 27 may stay inside the board preheating part 7 due to an abnormality in the device, soldering There is no possibility that the solder in the bonded portion of the electronic component is melted and the electronic component is out of stock. At time T ₂ , as shown in FIG. 5, when the laser light is irradiated so as to face the upper side of the electronic component 14, the temperature rises rapidly, but the temperature rises temporarily near the melting point S _{3 at} which the solder is remelted. Time T ₃ when the solder stops and the melting of the solder is completed
Then, the temperature rises sharply again.

Here, when the solder melts and the joining force of the solder becomes weaker than the vacuum suction force, the electronic component 14 is removed, the electronic component 14 is sucked by the suction nozzle 34, and the increase in the degree of vacuum is detected by the pressure detection means 63. Then the laser irradiation is stopped.
At that time, the time is T ₄ and the temperature is the temperature S ₄ .

When the electronic component 14 has a plurality of bonding electrode portions as shown in FIGS. 5 and 6, the time until the solder melts differs depending on the respective bonding electrode portions. For example, as shown in FIG. 9, the location as time T _a through T _d until the solder melts, assuming that different, initiates a long laser bonding electrode part early irradiation time, all solder Irradiation of a plurality of lasers is controlled so that the melting time T ₃ is aligned. In this way, when there is a difference in the melting time depending on the pattern of the board 27 or the electronic component 14, the solder is heated from the place where it is difficult to melt, and the heat damage to the board 27 and the electronic component 14 is performed without excessive heating. Can be minimized. Further, since the timing of melting all the solder is controlled to be constant, it is not necessary to continuously perform vacuum suction until the solder melts and the solder bonding force becomes lower than the vacuum pulling force. After the solder is melted, the component suction nozzle 34 can be pressed and removed by vacuum suction.

Thus, by measuring the temperature, the preheating temperature,
Further, it is possible to detect an abnormality in heating when the solder is melted, and prevent the unmelting of the solder and the burning of the substrate. The electronic parts removed by the above work are subjected to shape inspection and electric characteristic inspection, and if they are non-defective, they are reused. If it is defective, discard it in the waste box.

In the above embodiment, a plurality of optical fibers 12 can be provided by branching the laser optical system 11 into a plurality using a half mirror (not shown), and a plurality of joints of electronic parts can be irradiated at the same time. can do. If the substrate is a multi-layer substrate, the joint is an earth land, or the electronic component is a housing, it is necessary to constantly heat the substrate or the electronic component because the heat capacity is large. It is valid.

Further, in the above embodiment, the vacuum suction is used as the means for removing the electronic component, but the vacuum suction may not be used depending on the shape of the electronic component. Therefore, a method for removing electronic components that cannot be vacuum-sucked will be described below.

10 and 11 show the mechanical removing means. Similar to the suction nozzle, the mechanical removal means is provided on the correction head 3 that is locked to the XY robot 2, and is connected to the tip of the spline shaft 40 in FIG. The mechanical chuck 93 has a claw 94 and an opening / closing cylinder 95, and can hold the electronic component 14. A spring 96 is provided above the opening / closing cylinder 95, and the spring 96 constantly pulls the mechanical chuck 93 upward, and the upper limit sensor 97 detects the upper limit.

The operation of the mechanical removing means will be described. The correction head 3 is opposed to above the electronic component 14, and the mechanical chuck 9 is driven by the nozzle vertical motor 46 shown in FIG.
Lower 3 Opening / closing cylinder 9 of the mechanical chuck 93
5, the claw 94 is closed, the electronic component 14 is gripped, the nozzle vertical motor 46 is lifted upward by ΔH, and the laser light is emitted while being constantly pulled upward by the spring 96. When the solder is re-melted and the joining force of the solder becomes weaker than the elastic force of the spring 96, the electronic component 14 is removed, the upper limit sensor 97 detects this, and the completion of removal of the electronic component is detected.

Further, the joining of the electronic components can be corrected by transferring the electronic components by a mechanical chuck as in the case of vacuum suction.

The correction work when the electronic component is removed has been described above, but as the next embodiment, the electronic component itself is not a defect, and a method of correcting a defect due to excess solder or insufficient solder at the connection terminal portion will be described. To do. Of course, in this case as well, it is needless to say that the preheating effect is exhibited by preheating the substrate as in the above embodiment.

In the case of the excess solder as shown in FIG. 12, the laser is locally irradiated to melt the solder to remove the solder sucker 9
The solder is removed by 8 and the joint failure due to the excess solder is corrected. At this time, since the solder is not removed too much, the inspection pin (not shown) can be used to detect the conduction between the joints, and the correction can be finished when the conduction is lost.

In the case of insufficient solder shown in FIG. 13, the cream solder 100 is supplied to the insufficient solder portion by the dispenser 99, laser is locally irradiated to melt the cream solder 100, and solder joining is performed. Correct the joint failure. Here, the cream solder 10 is used as the bonding medium.
Although 0 was used, the same effect can be obtained by supplying the thread solder 101.

Further, in the above embodiments, the air dryer is used as the heat source of the substrate preheating section 7, but other light irradiating means such as a xenon lamp or an infrared lamp shown in FIG. 14 may be used, or shown in FIG. The heat block 103 having the heater 102 built therein is used as a heat source, and the heater driving means 104 is used.
With the method of preheating the substrate 27, the same effect can be obtained.

The above is the description of the apparatus in charge of the correction process. Next, a system configuration of the inspection process, the command process and the correction process will be described with reference to FIG.

As described in the beginning of the embodiment, after mounting the electronic components on the board and soldering the board, the board is inspected by the inspection apparatus. This step is shown by I in FIG. That is, an electrical operation test and an electrical characteristic test of the substrate are performed in step 102, and if there is no problem, the process proceeds to the next step shown in step 166. If there is a problem in step 102, it is checked in step 104 whether the cause is a defective electronic component. If the electronic component is the cause of the defect, in step 108 the product number and mounting position (X coordinate, Y coordinate) of the defective electronic component are stored in the memory. If the electronic component is a non-defective product, the connection terminal is three-dimensionally determined Step 10
In step 6, it is checked whether or not the solder amount of the connection terminal is insufficient, and if it is insufficient, in step 110 the position of the insufficient solder terminal (X coordinate, Y coordinate)
Memory). If the amount of solder is not insufficient, it is checked in step 112 to check whether the connecting terminals are electrically short-circuited with each other. In step 112, if the amount of solder is excessive, the connecting terminals cause an electrical short-circuit. The position (X coordinate, Y coordinate) of the excessive solder terminal is stored in the memory. If it is not excessive, re-examination is performed in step 114. The above is the contents of the inspection process.

Information of the inspection process I is input to the next command process II. First, when the solder amount of the connection terminal is insufficient, a command to add the solder amount is output. If the amount of solder in the connection terminal is excessive, a command to absorb the amount of solder is output. If the electronic component is defective, it is determined whether or not to replace the electronic component, and a command for replacement or removal is output. When an electronic component is defective, the board will not be completely repaired until the defective electronic component is replaced, but depending on the work efficiency and work plan, the work may only be done for the time being, and then the batch operation may be performed later. In some cases, it is better to replace it with another one, so the above-mentioned decision of replacement or removal is necessary.

Information on the command process II is input to the correction process III. In the correction process III, the above-mentioned device executes the correction work based on the command of the command process. First, in any case, the substrate that needs to be corrected is transferred to the correction position by the substrate transfer unit 6 described in FIG. 2 or FIG. Contents and positions (X coordinate, which require correction of the board positioned at the correction position,
Since the (Y coordinate) is already stored in the memory in the inspection process I, the XY robot of FIG. 2 positions the correction head 3 based on the information. Then, the above-described correction head operates to remove the electronic component, absorb the solder, or add the solder. At that time, the removed electronic component or substrate is subjected to a shape inspection and an electric characteristic inspection, a normal product is reused, and a normal product is discarded. When an instruction to replace the electronic component is given, after the electronic component is removed, the component transfer device 4 of FIG. 3 supplies a non-defective electronic component from the component storage unit 5.

Inspection process I, command process II, correction process described above
The substrate for which III has been completed is again subjected to the substrate inspection of step 164, and if there is no defect, the process proceeds to the next process of step 166.
If there is a defect, the process returns to the inspection of step 104 again.

As described above, according to the electronic component repairing apparatus of the present invention, the inspection process, the commanding process, and the repairing process are incorporated as a system, so that the defective electronic components can be connected without the need for manual work or operator's judgment. The terminal can be modified.

[0055]

As is apparent from the above embodiments, according to the present invention, the inspection process, the command process, and the correction process are incorporated as a system, so that the inspection process, the command process, and the correction process are automatically performed without requiring manual work or operator's judgment. Correction work can be performed. In addition, since the repair work in the repair process incorporates measures to minimize damage to electronic parts and boards due to necessary preheating, temperature measurement, etc., electronic parts and boards that were discarded by the conventional method are discarded. It can be reused without being discarded, which greatly contributes not only to improving productivity and quality but also to resource saving.

[Brief description of drawings]

FIG. 1 shows an inspection process, a command process, and an inspection process according to an embodiment of the present invention.
Block diagram of correction process

FIG. 2 is an external view of an electronic component correction device according to an embodiment of the present invention.

FIG. 3 is a perspective view of a board conveying section, a board preheating section, and a correction position of an electronic component correcting apparatus according to an embodiment of the present invention.

FIG. 4 is a perspective view of a repair head of an electronic component repair device according to an embodiment of the present invention.

FIG. 5 is a perspective view when the heating means is operated while the component suction nozzle is close to the electronic component in the electronic component repairing apparatus according to the embodiment of the present invention.

FIG. 6 is a perspective view when an electronic component is removed by a component suction nozzle in the electronic component correction device according to the embodiment of the present invention.

FIG. 7 is a sectional view of a laser optical system of a heating means of an electronic component repairing device according to an embodiment of the present invention.

FIG. 8 is a diagram showing a temperature change of an object in the electronic component repairing apparatus according to the embodiment of the present invention.

FIG. 9 is an operation timing chart of the heating means of the electronic component correcting apparatus according to the embodiment of the present invention.

FIG. 10 is a perspective view of a mechanical detaching means of the electronic component correcting apparatus according to the embodiment of the present invention.

FIG. 11 is an operation explanatory view of a mechanical detaching means of the electronic component correcting apparatus according to the embodiment of the present invention.

FIG. 12 is an explanatory diagram of a solder sucking operation of the electronic component repairing device according to the embodiment of the present invention.

FIG. 13 is an explanatory diagram of a solder addition operation of the electronic component repairing device according to the embodiment of the present invention.

FIG. 14 is a conceptual diagram of a second embodiment of a substrate preheating method for an electronic component repairing apparatus according to an embodiment of the present invention.

FIG. 15 is a conceptual diagram of a third embodiment of a substrate preheating method for an electronic component repairing apparatus according to an embodiment of the present invention.

FIG. 16 is an explanatory diagram of a manual board correction work in a conventional example.

FIG. 17 is an explanatory view of a conventional manual removal work of electronic components.

[Explanation of symbols]

 I Inspection process II Command process III Correction process 102 Electrical property inspection step including electrical operation of board 104 Electronic component failure detection step 106 Connection terminal solder amount detection step 112 Connection terminal electrical short detection step

Claims (1)

[Claims] 1. A step of inspecting electrical characteristics including electrical operation of a board to which an electronic component is connected by soldering, a step of detecting a defective electrical characteristic of the electronic component, and a connection terminal of the electronic component being three-dimensional. The cause of the electrical characteristics, including the electrical operation of the substrate, which consists of the step of determining, and the step of inspecting an electrical short circuit of the connection terminal of the electronic component,
An electronic component mounted on the board, an excessive amount of solder for the connection terminal, and an inspection step for classifying into insufficient solder amount for the connection terminal,
Based on the classification result of the inspection process, a command process for outputting one of a command for removing and replacing an electronic component mounted on the board, a command for adding a solder amount, and a command for absorbing a solder amount, and the command process Based on the output of the electronic component repairing device, which includes a repairing process of removing and replacing electronic components, adding solder, and removing solder.